CN221283403U

CN221283403U - Multistage ladder high frequency PCB board

Info

Publication number: CN221283403U
Application number: CN202323060730.4U
Authority: CN
Inventors: 周克彬
Original assignee: Shenzhen United Multilayer Circuit Board Co Ltd
Current assignee: Shenzhen United Multilayer Circuit Board Co Ltd
Priority date: 2023-11-13
Filing date: 2023-11-13
Publication date: 2024-07-05
Anticipated expiration: 2033-11-13

Abstract

The utility model discloses a multistage ladder high-frequency PCB (printed circuit board) which comprises an upper PCB, wherein a lower PCB is arranged at the lower end of the upper PCB, mounting devices are jointly arranged at the left end and the right end of the upper PCB and the lower PCB, fixing seats are arranged at the lower part of the left end and the lower part of the right end of the mounting devices, two first screws are arranged at the upper ends of the two fixing seats, and a heat radiating device is arranged at the upper end of the mounting device. According to the multistage ladder high-frequency PCB, the mounting frame is clamped at the upper end of the mounting seat through the clamping groove, at the moment, the second screw on the mounting seat is screwed into the screw hole, the mounting frame is further mounted on the upper portion of the PCB, the PCB is further protected, impact and scratch on the PCB are reduced, wind is blown to the upper-layer PCB through the cooling fan, meanwhile, the graphite cooling fin arranged on the lower portion of the lower-layer PCB can conduct out heat of the PCB, and the cooling effect of the PCB is further effectively improved through cooperation of the cooling fan.

Description

Multistage ladder high frequency PCB board

Technical Field

The utility model relates to the technical field of PCB boards, in particular to a multi-stage ladder high-frequency PCB board.

Background

The multi-stage stepped high frequency PCB is a special type of printed circuit board commonly used in high frequency circuit design, which generally comprises metal layers of different levels, which are separated by insulating material layers, and the metal layers of different levels are connected by via holes to form a circuit path while avoiding signal interference. They are mainly used in the high frequency and microwave fields, such as communication equipment, radar systems, satellite communications, etc., where stability and transmission efficiency of signals are required to be maintained in a high frequency range.

However, the existing multi-stage ladder high-frequency PCB is formed by laminating a plurality of PCBs, and after long-time operation, heat is accumulated in the multi-stage ladder high-frequency PCB, so that the temperature in the multi-stage ladder high-frequency PCB is higher, and the use effect of the multi-stage ladder high-frequency PCB is further affected; in addition, multistage ladder high frequency PCB board also receives the scratch of outside impact easily, especially when receiving buckling, leads to the damage of multistage ladder high frequency PCB board easily, and then influences its life.

Disclosure of utility model

The utility model mainly aims to provide a multi-stage ladder high-frequency PCB which can effectively solve the problems that the multi-stage ladder high-frequency PCB is easy to overheat and is easy to be impacted and scratched by the outside.

In order to achieve the above purpose, the technical scheme adopted by the utility model is as follows:

The utility model provides a multistage ladder high frequency PCB board, includes upper PCB board, lower floor PCB board is installed to upper PCB board lower extreme, installation device is installed jointly to upper PCB board and lower floor PCB board left end and right-hand member, the fixing base is all installed to installation device left end lower part and right-hand member lower part, two the fixing base upper end is all installed two screw, heat abstractor is installed to the installation device upper end.

Preferably, the heat dissipating device comprises a mounting frame, mounting grooves are formed in the left part of the upper end of the mounting frame and the right part of the upper end of the mounting frame, two heat dissipating fans are mounted in the mounting grooves, a set of screw holes are formed in the left end and the right end of the mounting frame, and the mounting frame is mounted at the upper end of the mounting device. The mounting bracket is by draw-in groove joint in the upper end of mount pad, in the screw hole is screwed in to the screw No. two screw on the mount pad this moment, and then installs the mounting bracket on the upper portion of PCB board, not only can dispel the heat it, and mounting bracket cooperation mount pad also can protect the PCB board moreover, reduces its impact that receives and cuts and scratch.

Preferably, the mounting device comprises a mounting seat, a through hole is formed in the middle of the upper end of the mounting seat, clamping grooves are formed in the left part of the upper end of the mounting seat and the right part of the upper end of the mounting seat, a group of screws No. two are mounted at the left end and the right end of the mounting seat, and the mounting seat is mounted at the lower end of a lower-layer PCB. The mounting frame can be taken down through loosening the second screw, so that the cooling fan on the mounting frame can be cleaned conveniently.

Preferably, the upper PCB and the lower PCB are provided with circuit layers at the upper ends, and the lower PCB is provided with graphite cooling fins at the lower end. The cooling fan blows wind to the upper PCB, so that the air circulation speed of the outer surface of the cooling fan is accelerated to cool the PCB, and meanwhile, the graphite cooling fins arranged on the lower portion of the lower PCB can conduct out heat of the PCB, and the cooling fan is matched to effectively improve the cooling effect of the PCB.

Preferably, the mounting seat is U-shaped.

Preferably, the graphite radiating fins are consistent with the through holes in size and correspond to the through holes in position up and down.

Compared with the prior art, the utility model has the following beneficial effects:

1. After the multistage ladder high-frequency PCB operates for a long time, heat is accumulated, when the internal temperature is higher, the two radiating fans on the radiating device are used for rotating and blowing air, so that the air is blown to the upper PCB, the air circulation speed of the external surface of the upper PCB is accelerated, the PCB is radiated, meanwhile, graphite radiating fins arranged at the lower part of the lower PCB are brand-new heat conducting and radiating materials, have unique grain orientations, conduct heat uniformly along two directions, and the lamellar structure can be well suitable for any surface, so that the heat of the PCB can be led out, and the radiating effect of the PCB is effectively improved by matching with the radiating fans.

2. The mounting rack is connected to the upper end of the mounting seat by the clamping groove in a clamping mode, the second screw on the mounting seat is screwed into the screw hole, the mounting rack is mounted on the upper portion of the PCB, heat dissipation can be achieved, the mounting rack can be matched with the mounting seat to protect the PCB, impact and scratch of the mounting rack are reduced, in addition, the mounting rack can be taken down by loosening the second screw, and the cooling fan on the mounting rack is convenient to clean.

Drawings

Fig. 1 is a schematic diagram of the overall structure of a multi-stage stepped high frequency PCB board according to the present utility model;

fig. 2 is a schematic diagram of the overall structure of a heat dissipating device of a multi-stage stepped high frequency PCB board according to the present utility model;

Fig. 3 is a schematic diagram of the overall structure of a mounting device for a multi-stage stepped high frequency PCB board according to the present utility model;

fig. 4 is a schematic diagram of the overall structure of an upper layer PCB and a lower layer PCB of a multi-stage stepped high frequency PCB according to the present utility model.

In the figure: 1. an upper layer PCB board; 2. a heat sink; 3. a mounting device; 4. a lower layer PCB board; 5. a fixing seat; 6. a first screw; 20. a mounting frame; 21. a mounting groove; 22. a heat radiation fan; 23. screw holes; 30. a mounting base; 31. a clamping groove; 32. a second screw; 33. a through port; 40. graphite heat sink; 41. and a circuit layer.

Detailed Description

The utility model is further described in connection with the following detailed description, in order to make the technical means, the creation characteristics, the achievement of the purpose and the effect of the utility model easy to understand.

In the description of the present utility model, it should be noted that the directions or positional relationships indicated by the terms "upper", "lower", "inner", "outer", "front", "rear", "both ends", "one end", "the other end", etc. are based on the directions or positional relationships shown in the drawings, are merely for convenience of describing the present utility model and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific direction, be configured and operated in the specific direction, and thus should not be construed as limiting the present utility model. Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

In the description of the present utility model, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "provided," "connected," and the like are to be construed broadly, and may be fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present utility model will be understood in specific cases by those of ordinary skill in the art.

As shown in fig. 1-4, a multistage ladder high-frequency PCB board comprises an upper layer PCB board 1, a lower layer PCB board 4 is installed at the lower end of the upper layer PCB board 1, a mounting device 3 is installed at the left end and the right end of the upper layer PCB board 1 and the lower layer PCB board 4 together, fixing seats 5 are installed at the lower part of the left end and the lower part of the right end of the mounting device 3, two first screws 6 are installed at the upper ends of the two fixing seats 5, and a heat dissipation device 2 is installed at the upper end of the mounting device 3.

The heat dissipating device 2 comprises a mounting frame 20, mounting grooves 21 are formed in the left part of the upper end of the mounting frame 20 and the right part of the upper end of the mounting frame 20, heat dissipating fans 22 are mounted in the two mounting grooves 21, a set of screw holes 23 are formed in the left end and the right end of the mounting frame 20, and the mounting frame 20 is mounted at the upper end of the mounting device 3. The mounting bracket 20 is by draw-in groove 31 joint in the upper end of mount pad 30, in screw hole 23 is screwed in the screw 32 on with the mount pad 30 this moment, and then installs the mounting bracket 20 on the upper portion of PCB board, not only can dispel the heat it, and mounting bracket 20 cooperation mount pad 30 also can protect the PCB board moreover, reduces the impact and the scratch that receive it.

The mounting device 3 comprises a mounting seat 30, a through hole 33 is formed in the middle of the upper end of the mounting seat 30, clamping grooves 31 are formed in the left part of the upper end of the mounting seat 30 and the right part of the upper end of the mounting seat 30, a group of screws No. two 32 are mounted at the left end and the right end of the mounting seat 30, and the mounting seat 30 is mounted at the lower end of the lower-layer PCB 4; the mounting base 30 is U-shaped. The mounting frame 20 can be removed by loosening the second screw 32, so that the cooling fan 22 on the mounting frame can be cleaned conveniently.

The upper ends of the upper PCB 1 and the lower PCB 4 are respectively provided with a circuit layer 41, and the lower end of the lower PCB 4 is provided with a graphite radiating fin 40; the graphite fins 40 are identical in size and position to the through-holes 33. The air is blown to the upper layer PCB 1 through the cooling fan 22, so that the air circulation speed of the outer surface of the upper layer PCB is accelerated to cool the PCB, and meanwhile, the graphite cooling fins 40 arranged at the lower part of the lower layer PCB 4 can lead out the heat of the PCB, and the cooling effect of the PCB is effectively improved by matching with the cooling fan 22.

It should be noted that, the present utility model is a multi-stage ladder high frequency PCB board, the mounting frame 20 is clamped at the upper end of the mounting seat 30 by the clamping groove 31, at this time, the second screw 32 on the mounting seat 30 is screwed into the screw hole 23, and then the mounting frame 20 is mounted at the upper portion of the PCB board, which not only can radiate the PCB board, but also the mounting frame 20 is matched with the mounting seat 30 to protect the PCB board, reducing the impact and scratch received by the mounting frame 20, in addition, the mounting frame 20 can be removed by loosening the second screw 32, so as to clean the cooling fan 22 on the mounting frame, when the multi-stage ladder high frequency PCB board runs for a long time, the heat is accumulated, and when the internal temperature is higher, the two cooling fans 22 on the cooling device 2 are rotated to blow air to the upper layer PCB board 1, so that the air circulation speed of the external surface of the cooling device is accelerated, and meanwhile, the graphite sheet 40 arranged at the lower portion of the lower layer PCB board 4 is a brand-new material, which has unique orientation, and can uniformly guide the heat to the heat conducting sheet to the surface of the PCB board, thereby the heat conducting effect of the heat conducting sheet can be well matched with the heat conducting sheet 22, and the heat conducting effect of the heat conducting sheet can be improved.

The foregoing has shown and described the basic principles and main features of the present utility model and the advantages of the present utility model. It will be understood by those skilled in the art that the present utility model is not limited to the embodiments described above, and that the above embodiments and descriptions are merely illustrative of the principles of the present utility model, and various changes and modifications may be made without departing from the spirit and scope of the utility model, which is defined in the appended claims. The scope of the utility model is defined by the appended claims and equivalents thereof.

Claims

1. The utility model provides a multistage ladder high frequency PCB board, includes upper PCB board (1), its characterized in that: the lower-layer PCB (4) is arranged at the lower end of the upper-layer PCB (1), the mounting device (3) is jointly arranged at the left end and the right end of the upper-layer PCB (1) and the lower-layer PCB (4), the fixing seats (5) are arranged at the lower part of the left end and the lower part of the right end of the mounting device (3), two first screws (6) are arranged at the upper ends of the two fixing seats (5), and the heat dissipation device (2) is arranged at the upper end of the mounting device (3); the heat dissipation device (2) comprises a mounting frame (20), wherein the left part of the upper end and the right part of the upper end of the mounting frame (20) are respectively provided with a mounting groove (21), the two mounting grooves (21) are respectively internally provided with a heat dissipation fan (22), the left end and the right end of the mounting frame (20) are respectively provided with a group of screw holes (23), and the mounting frame (20) is arranged at the upper end of the mounting device (3); the mounting device (3) comprises a mounting seat (30), a through hole (33) is formed in the middle of the upper end of the mounting seat (30), clamping grooves (31) are formed in the left part of the upper end of the mounting seat (30) and the right part of the upper end of the mounting seat, a group of second screws (32) are arranged at the left end and the right end of the mounting seat (30), and the mounting seat (30) is arranged at the lower end of a lower-layer PCB (4); the upper PCB (1) and the lower PCB (4) are provided with circuit layers (41), and the lower PCB (4) is provided with graphite cooling fins (40).

2. The multi-stage stepped high frequency PCB of claim 1 wherein: the mounting seat (30) is U-shaped.

3. The multi-stage stepped high frequency PCB of claim 1 wherein: the graphite cooling fins (40) are consistent in size with the through holes (33) and correspond to the through holes in position up and down.