CN217693819U - High-frequency circuit board embedded with chip - Google Patents
High-frequency circuit board embedded with chip Download PDFInfo
- Publication number
- CN217693819U CN217693819U CN202123280992.2U CN202123280992U CN217693819U CN 217693819 U CN217693819 U CN 217693819U CN 202123280992 U CN202123280992 U CN 202123280992U CN 217693819 U CN217693819 U CN 217693819U
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- China
- Prior art keywords
- circuit board
- chip
- substrate
- layer
- unit circuit
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- 239000010410 layer Substances 0.000 claims abstract description 61
- 239000000758 substrate Substances 0.000 claims abstract description 35
- 230000017525 heat dissipation Effects 0.000 claims abstract description 10
- 239000012790 adhesive layer Substances 0.000 claims abstract description 8
- 238000009434 installation Methods 0.000 claims abstract description 8
- 230000005855 radiation Effects 0.000 claims description 3
- 230000000694 effects Effects 0.000 abstract description 6
- 238000001816 cooling Methods 0.000 description 12
- 238000009825 accumulation Methods 0.000 description 4
- 230000005672 electromagnetic field Effects 0.000 description 4
- 230000035939 shock Effects 0.000 description 4
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
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- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
The utility model discloses a high frequency circuit board that is embedded with chip relates to circuit board technical field, and its technical scheme main points are: the shielding cover comprises a shielding cover, a hollow cover and two unit circuit boards, wherein one end of each unit circuit board is fixedly connected with the inner wall of the left side of the hollow cover, and the other end of each unit circuit board is fixedly connected with the inner wall of the right side of the hollow cover; a high-frequency plate is arranged between the two unit circuit boards, an installation groove is embedded in the high-frequency plate, and a chip is installed in the installation groove; the inner wall of the mounting groove is provided with a shielding layer; the unit circuit board comprises a substrate, an upper circuit layer arranged on the top of the substrate and a lower circuit layer arranged on the bottom of the substrate, wherein heat-conducting adhesive layers are arranged between the upper circuit layer and the substrate, and between the lower circuit layer and the substrate; the shielding cover is sleeved outside the hollow cover; and a plurality of heat dissipation fans are arranged on the inner wall of the shielding cover. Can shield outside electromagnetism, avoid outside electromagnetism to cause the interference to the chip, ensure the normal work of chip, have good radiating effect simultaneously, improve high frequency circuit board's life.
Description
Technical Field
The utility model relates to a circuit board technical field, more specifically says that it relates to a bury high frequency circuit board that has the chip.
Background
The high-frequency circuit board is a special circuit board with higher electromagnetic frequency, generally speaking, the high frequency can be defined as the frequency above 1GHz, the requirements of various physical properties, precision and technical parameters are very high, the high-frequency circuit board is commonly used in the fields of automobile anti-collision systems, satellite systems, radio systems and the like, and the high-frequency circuit board has higher frequency mainly because a high-frequency material layer is pressed between unit circuit boards.
At present, a chip slot is usually disposed on a circuit board for accommodating a chip, and the chip is usually soldered to the circuit board by soldering.
In the prior art, external electromagnetism easily affects a chip, the chip is directly assembled on a circuit board, so that irregular reflection of electromagnetic interference is easily caused, high-frequency stray signals are formed and are not easy to improve and process, the heat dissipation efficiency of the circuit board is low, and the normal use of the circuit board is affected.
SUMMERY OF THE UTILITY MODEL
The utility model aims at providing a bury high frequency circuit board that has chip can shield outside electromagnetism, avoids outside electromagnetism to cause the interference to the chip, ensures the normal work of chip, has good radiating effect simultaneously, improves the life of high frequency circuit board.
The above technical object of the present invention can be achieved by the following technical solutions: a high-frequency circuit board embedded with chips comprises a shielding cover, a hollow cover and two unit circuit boards, wherein one end of each unit circuit board is fixedly connected with the inner wall of the left side of the hollow cover, and the other end of each unit circuit board is fixedly connected with the inner wall of the right side of the hollow cover; a high-frequency plate is arranged between the two unit circuit boards, an installation groove is embedded in the high-frequency plate, and a chip is installed in the installation groove; a shielding layer is arranged on the inner wall of the mounting groove; the unit circuit board comprises a substrate, an upper circuit layer arranged on the top of the substrate and a lower circuit layer arranged on the bottom of the substrate, wherein heat-conducting adhesive layers are arranged between the upper circuit layer and the substrate, and between the lower circuit layer and the substrate; the shielding cover is sleeved outside the hollow cover; and a plurality of heat dissipation fans are arranged on the inner wall of the shielding cover.
By adopting the technical scheme, when the high-frequency circuit board with the embedded chip is used, the interference of an external electromagnetic field to the chip and the unit circuit board is reduced conveniently through the shielding case, and the normal operation of a circuit on the chip and the unit circuit board is ensured; through the mounting groove, the chip is convenient to embed; the shielding layer is convenient for further shielding external electromagnetism, so that the normal work of the chip is ensured; the heat generated by the upper circuit layer and the lower circuit layer is conveniently and quickly conducted to the substrate through the heat conducting adhesive layer, and the phenomenon that the upper circuit layer and the lower circuit layer cannot work normally due to heat accumulation is avoided; the substrate is conveniently cooled through the cooling fan, so that the cooling efficiency of the high-frequency circuit board is improved; through the hollow-out layer, the heat of the unit circuit board is conveniently released to the air, and meanwhile, the wind of the heat dissipation fan is conveniently blown to the unit circuit board; through the high frequency circuit board that is embedded with the chip that comprises shield cover, fretwork cover and two unit circuit boards, can shield outside electromagnetism, avoid outside electromagnetism to cause the interference to the chip, ensure the normal work of chip, have good radiating effect simultaneously, improve high frequency circuit board's life.
The utility model discloses further set up to: the heat dissipation fans are respectively located at two ends of the substrate.
By adopting the technical scheme, the heat dissipation fans are respectively arranged at the two ends of the substrate, so that better heat dissipation of the auxiliary substrate is facilitated.
The utility model discloses further set up to: and the top inner wall and the bottom inner wall of the shielding cover are both provided with shockproof layers.
By adopting the technical scheme, the shock resistance of the high-frequency circuit board is increased conveniently through the shock-proof layer, so that the influence of shock on the work of the chip is avoided.
The utility model discloses further set up to: and an anti-interference layer is arranged between the unit circuit board and the high-frequency board.
By adopting the technical scheme, the signal interference between the two unit circuit boards is convenient to reduce through the anti-interference layer.
To sum up, the utility model discloses following beneficial effect has: through the shielding cover, the interference of an external electromagnetic field to the chip and the unit circuit board is reduced conveniently, and the normal operation of a circuit on the chip and the unit circuit board is ensured; through the mounting groove, the chip is convenient to embed; the shielding layer is convenient for further shielding external electromagnetism, so that the normal work of the chip is ensured; the heat generated by the upper circuit layer and the lower circuit layer is conveniently and quickly conducted to the substrate through the heat conducting adhesive layer, and the phenomenon that the upper circuit layer and the lower circuit layer cannot work normally due to heat accumulation is avoided; the substrate is conveniently cooled through the cooling fan, so that the cooling efficiency of the high-frequency circuit board is improved; through the hollow layer, the heat of the unit circuit board is conveniently released into the air, and meanwhile, the wind of the cooling fan is conveniently blown to the unit circuit board; through the high frequency circuit board that is embedded with the chip that comprises shield cover, fretwork cover and two unit circuit boards, can shield outside electromagnetism, avoid outside electromagnetism to cause the interference to the chip, ensure the normal work of chip, have good radiating effect simultaneously, improve high frequency circuit board's life.
Drawings
Fig. 1 is a schematic structural diagram in an embodiment of the present invention.
In the figure: 1. a shield case; 2. a hollow cover; 3. a unit circuit board; 4. high-frequency plates; 5. mounting grooves; 6. a chip; 7. a shielding layer; 8. a substrate; 9. an upper circuit layer; 10. a lower circuit layer; 11. a heat-conducting adhesive layer; 12. a heat radiation fan; 13. a shock-resistant layer; 14. and an anti-interference layer.
Detailed Description
The present invention will be described in further detail with reference to fig. 1.
The embodiment is as follows: a high-frequency circuit board embedded with chips is shown in figure 1 and comprises a shielding cover 1, a hollow cover 2 and two unit circuit boards 3, wherein one end of each unit circuit board 3 is welded with the inner wall of the left side of the hollow cover 2, and the other end of each unit circuit board 3 is welded with the inner wall of the right side of the hollow cover 2; a high-frequency plate 4 is arranged between the two unit circuit boards 3, an installation groove 5 is embedded in the high-frequency plate 4, and a chip 6 is installed in the installation groove 5; a shielding layer 7 is bonded on the inner wall of the mounting groove 5; the unit circuit board 3 comprises a substrate 8, an upper circuit layer 9 arranged on the top of the substrate 8 and a lower circuit layer 10 arranged on the bottom of the substrate 8, wherein heat-conducting glue layers 11 are bonded between the upper circuit layer 9 and the substrate 8, and between the lower circuit layer 10 and the substrate 8; the shielding cover 1 is sleeved outside the hollow cover 2; the inner wall of the shielding case 1 is provided with a plurality of cooling fans 12.
In the embodiment, when the high-frequency circuit board with the embedded chip is used, the interference of an external electromagnetic field on the chip 6 and the unit circuit board 3 is reduced conveniently through the shielding case 1, and the normal operation of the circuit on the chip 6 and the unit circuit board 3 is ensured; the chip 6 is conveniently embedded through the mounting groove 5; the shielding layer 7 is convenient for further shielding external electromagnetism, so that the normal work of the chip 6 is ensured; the heat generated by the upper circuit layer 9 and the lower circuit layer 10 can be conveniently and rapidly conducted to the substrate 8 through the heat conducting adhesive layer 11, and the phenomenon that the upper circuit layer 9 and the lower circuit layer 10 cannot work normally due to heat accumulation is avoided; the substrate 8 is conveniently cooled through the cooling fan 12, so that the cooling efficiency of the high-frequency circuit board is improved; through the hollow-out layer, the heat of the unit circuit board 3 is conveniently released to the air, and meanwhile, the wind of the cooling fan 12 is conveniently blown to the unit circuit board 3; through the high frequency circuit board that is embedded with the chip that comprises shield cover 1, fretwork cover 2 and two unit circuit boards 3, can shield outside electromagnetism, avoid outside electromagnetism to cause the interference to the chip, ensure the normal work of chip, have good radiating effect simultaneously, improve high frequency circuit board's life.
The heat radiation fans 12 are respectively located at both ends of the substrate 8.
In this embodiment, the heat dissipation fans 12 are respectively located at two ends of the substrate 8, so as to facilitate better heat dissipation of the auxiliary substrate 8.
The inner walls of the top and the bottom of the shielding case 1 are provided with shockproof layers 13.
In this embodiment, the shock-proof layer 13 is used to increase the shock-proof capability of the high-frequency circuit board, so as to prevent the shock from affecting the operation of the chip 6.
An anti-interference layer 14 is arranged between the unit circuit board 3 and the high-frequency board 4.
In the present embodiment, signal interference between the two unit circuit boards 3 is facilitated to be reduced by the interference prevention layer 14.
The working principle is as follows: when the high-frequency circuit board embedded with the chip is used, the interference of an external electromagnetic field to the chip 6 and the unit circuit board 3 is reduced conveniently through the shielding cover 1, and the normal operation of a circuit on the chip 6 and the unit circuit board 3 is ensured; the chip 6 is conveniently embedded through the mounting groove 5; the shielding layer 7 is convenient for further shielding external electromagnetism, so that the normal work of the chip 6 is ensured; the heat generated by the upper circuit layer 9 and the lower circuit layer 10 can be conveniently and rapidly conducted to the substrate 8 through the heat conducting adhesive layer 11, and the phenomenon that the upper circuit layer 9 and the lower circuit layer 10 cannot work normally due to heat accumulation is avoided; the substrate 8 is conveniently cooled through the cooling fan 12, so that the cooling efficiency of the high-frequency circuit board is improved; through the hollow layer, the heat of the unit circuit board 3 is conveniently released to the air, and meanwhile, the wind of the cooling fan 12 is conveniently blown to the unit circuit board 3; through the high frequency circuit board that is embedded with the chip that comprises shield cover 1, fretwork cover 2 and two unit circuit boards 3, can shield outside electromagnetism, avoid outside electromagnetism to cause the interference to the chip, ensure the normal work of chip, have good radiating effect simultaneously, improve high frequency circuit board's life.
The present embodiment is only for explaining the present invention, and it is not limited to the present invention, and those skilled in the art can make modifications to the present embodiment without inventive contribution as required after reading the present specification, but all of them are protected by patent laws within the scope of the claims of the present invention.
Claims (4)
1. A high-frequency circuit board with embedded chips is characterized in that: the shielding device comprises a shielding cover (1), a hollow cover (2) and two unit circuit boards (3), wherein one end of each unit circuit board (3) is fixedly connected with the inner wall of the left side of the hollow cover (2), and the other end of each unit circuit board (3) is fixedly connected with the inner wall of the right side of the hollow cover (2); a high-frequency plate (4) is arranged between the two unit circuit boards (3), an installation groove (5) is embedded in the high-frequency plate (4), and a chip (6) is installed in the installation groove (5); a shielding layer (7) is arranged on the inner wall of the mounting groove (5); the unit circuit board (3) comprises a substrate (8), an upper circuit layer (9) arranged on the top of the substrate (8) and a lower circuit layer (10) arranged on the bottom of the substrate (8), wherein heat-conducting adhesive layers (11) are arranged between the substrate (8) and the upper circuit layer (9) and the lower circuit layer (10); the shielding cover (1) is sleeved outside the hollow cover (2); and a plurality of heat dissipation fans (12) are arranged on the inner wall of the shielding case (1).
2. The chip-embedded high-frequency circuit board as claimed in claim 1, wherein: the heat radiation fans (12) are respectively positioned at two ends of the substrate (8).
3. The chip-embedded high-frequency circuit board as claimed in claim 1, wherein: and the inner walls of the top and the bottom of the shielding cover (1) are respectively provided with a shockproof layer (13).
4. The chip-embedded high-frequency circuit board as claimed in claim 1, wherein: an anti-interference layer (14) is arranged between the unit circuit board (3) and the high-frequency plate (4).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123280992.2U CN217693819U (en) | 2021-12-24 | 2021-12-24 | High-frequency circuit board embedded with chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123280992.2U CN217693819U (en) | 2021-12-24 | 2021-12-24 | High-frequency circuit board embedded with chip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217693819U true CN217693819U (en) | 2022-10-28 |
Family
ID=83726605
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202123280992.2U Expired - Fee Related CN217693819U (en) | 2021-12-24 | 2021-12-24 | High-frequency circuit board embedded with chip |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217693819U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI849674B (en) * | 2023-01-05 | 2024-07-21 | 健鼎科技股份有限公司 | Printed circuit board having dummy core and method for producing the same |
-
2021
- 2021-12-24 CN CN202123280992.2U patent/CN217693819U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI849674B (en) * | 2023-01-05 | 2024-07-21 | 健鼎科技股份有限公司 | Printed circuit board having dummy core and method for producing the same |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20221028 |