CN214901428U - Anti-interference high-density multilayer circuit board - Google Patents
Anti-interference high-density multilayer circuit board Download PDFInfo
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- CN214901428U CN214901428U CN202121072965.3U CN202121072965U CN214901428U CN 214901428 U CN214901428 U CN 214901428U CN 202121072965 U CN202121072965 U CN 202121072965U CN 214901428 U CN214901428 U CN 214901428U
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- circuit board
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- density multilayer
- multilayer circuit
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Abstract
The utility model discloses an anti-interference high density multilayer circuit board relates to circuit board technical field, and its technical scheme main points are: the circuit board shielding device comprises a shielding cover, wherein a plurality of unit circuit boards are arranged between the left side wall and the right side wall of the shielding cover; each unit circuit board comprises a circuit layer, a radiating fin and an anti-interference layer, wherein the lower surface of the circuit layer is fixedly connected with the top end of the radiating fin through a heat-conducting adhesive layer, and the anti-interference layer is fixedly connected with the bottom end of the radiating fin; a plurality of grooves are formed in the left side wall and the right side wall of the shielding cover, and a cooling fan is arranged in each groove; the outer wall of the shielding cover is provided with a rubber pad. The radiating speed of the anti-interference high-density multilayer circuit board can be improved, accumulation of a large amount of heat in use is avoided, good anti-interference capacity and anti-seismic effect are achieved, and the service life of the circuit board can be prolonged.
Description
Technical Field
The utility model relates to a circuit board technical field, more specifically say, it relates to an anti-interference high density multilayer circuit board.
Background
The circuit board is also called circuit board, PCB board, impedance board, printed circuit board, etc., the circuit board makes the circuit miniaturized, visualized, play an important role in the batch production of the fixed circuit and optimizing the electric apparatus layout, the circuit board is mainly made up of pad, via hole, mounting hole, wire, component, connector, packing, electric boundary, etc., it is divided into three big classifications of single-panel, double-sided board, and multilayer circuit board according to the number of layers, multilayer circuit board and the product that the electronic information technology develops towards high speed, multi-function, large capacity, small volume, thinness, lightweight, along with the development of the automobile industry, the circuit board on the car is used more and more.
At present, because there are many electronic devices in an automobile, electromagnetic waves generated when the electronic devices operate easily interfere with a circuit board, so that the performances of the circuit board, such as response speed, accuracy and stability, are reduced, and the running of the automobile is damaged.
In the prior art, the anti-interference high-density multilayer circuit board has a thick structure and poor air permeability, so that the adjacent circuit layers cannot be quickly radiated, and the circuit board is easily burnt out after being used for a long time, thereby influencing the service life of the circuit board; meanwhile, the circuit board itself is easily affected by the driving vibration of the automobile.
SUMMERY OF THE UTILITY MODEL
The utility model aims at providing an anti-interference high density multilayer circuit board can improve the radiating rate of anti-interference high density multilayer circuit board, avoids piling up a large amount of heats when using, has good interference killing feature and antidetonation effect simultaneously, can increase the life of circuit board.
The above technical purpose of the present invention can be achieved by the following technical solutions: an anti-interference high-density multilayer circuit board comprises a shielding cover, wherein a plurality of unit circuit boards are arranged between the left side wall and the right side wall of the shielding cover; each unit circuit board comprises a circuit layer, a radiating fin and an anti-interference layer, wherein the lower surface of the circuit layer is fixedly connected with the top end of the radiating fin through a heat-conducting adhesive layer, and the anti-interference layer is fixedly connected with the bottom end of the radiating fin; a plurality of grooves are formed in the left side wall and the right side wall of the shielding cover, and a heat dissipation fan is arranged in each groove; and a rubber pad is arranged on the outer wall of the shielding cover.
By adopting the technical scheme, when the anti-interference high-density multilayer circuit board is used, the heat generated by the circuit layer is conveniently and quickly conducted to the radiating fin through the heat conducting adhesive layer; the heat radiating fins are convenient for quickly releasing heat into the air, so that heat accumulation is avoided; through the anti-interference layer, signal interference among different unit circuit boards is reduced conveniently; the interference of an external electromagnetic field on the high-density multilayer circuit board is reduced conveniently through the shielding cover, so that the anti-interference performance of the high-density multilayer circuit board is improved; through the groove, the heat dissipation fan is convenient to mount; the high-density multilayer circuit board is conveniently cooled by the cooling fan, so that the cooling efficiency of the high-density multilayer circuit board is improved; the shock resistance of the high-density multilayer circuit board is increased conveniently through the rubber pad, so that the influence of shock on the working performance of the high-density multilayer circuit board is reduced; through the anti-interference high density multilayer circuit board of constituteing by the shield cover, can improve the radiating rate of anti-interference high density multilayer circuit board, avoid piling up a large amount of heats when using, have good interference killing feature and antidetonation effect simultaneously, can increase the life of circuit board.
The utility model discloses further set up to: the heat radiation fan and the circuit layer are positioned on the same horizontal plane.
Through adopting above-mentioned technical scheme, be located same horizontal plane through cooling fan and circuit layer, be convenient for cool down the line layer dispels the heat.
The utility model discloses further set up to: the opening of the groove faces the circuit layer.
Through adopting above-mentioned technical scheme, opening part through the recess is towards the circuit layer, is convenient for communicate with each other between messenger's cooling fan and the circuit layer.
The utility model discloses further set up to: and shockproof layers are arranged between the top inner wall and the bottom inner wall of the shielding cover and the unit circuit board.
By adopting the technical scheme, the shock resistance of the high-density multilayer circuit board is further improved conveniently through the shock-proof layer.
To sum up, the utility model discloses following beneficial effect has: the heat generated by the circuit layer is conveniently and quickly conducted to the radiating fin through the heat conducting adhesive layer; the heat radiating fins are convenient for quickly releasing heat into the air, so that heat accumulation is avoided; through the anti-interference layer, signal interference among different unit circuit boards is reduced conveniently; the interference of an external electromagnetic field on the high-density multilayer circuit board is reduced conveniently through the shielding cover, so that the anti-interference performance of the high-density multilayer circuit board is improved; through the groove, the heat dissipation fan is convenient to mount; the high-density multilayer circuit board is conveniently cooled by the cooling fan, so that the cooling efficiency of the high-density multilayer circuit board is improved; the shock resistance of the high-density multilayer circuit board is increased conveniently through the rubber pad, so that the influence of shock on the working performance of the high-density multilayer circuit board is reduced; through the anti-interference high density multilayer circuit board of constituteing by the shield cover, can improve the radiating rate of anti-interference high density multilayer circuit board, avoid piling up a large amount of heats when using, have good interference killing feature and antidetonation effect simultaneously, can increase the life of circuit board.
Drawings
Fig. 1 is a schematic structural diagram in an embodiment of the present invention.
In the figure: 1. a unit circuit board; 2. a circuit layer; 3. a heat-conducting adhesive layer; 4. a heat sink; 5. an anti-interference layer; 6. a shield case; 7. a groove; 8. a heat radiation fan; 9. a rubber pad; 10. and (5) a shockproof layer.
Detailed Description
The present invention will be described in further detail with reference to fig. 1.
Example (b): an anti-interference high-density multilayer circuit board, as shown in fig. 1, comprises a shielding case 6, a plurality of unit circuit boards 1 are arranged between the left side wall and the right side wall of the shielding case 6; each unit circuit board 1 comprises a circuit layer 2, a radiating fin 4 and an anti-interference layer 5, the lower surface of the circuit layer 2 is welded with the top end of the radiating fin 4 through a heat-conducting adhesive layer 3, and the anti-interference layer 5 is welded with the bottom end of the radiating fin 4; a plurality of grooves 7 are formed in the left side wall and the right side wall of the shielding case 6, and a heat dissipation fan 8 is arranged inside each groove 7; the outer wall of the shield cover 6 is provided with a rubber pad 9.
In the embodiment, when the anti-interference high-density multilayer circuit board is used, the heat generated by the circuit layer 2 is conveniently and quickly conducted to the heat sink 4 through the heat-conducting adhesive layer 3; the heat radiating fins 4 are convenient for quickly releasing heat into the air, so that heat accumulation is avoided; the anti-interference layer 5 is convenient for reducing the signal interference among different unit circuit boards 1; the interference of an external electromagnetic field on the high-density multilayer circuit board is reduced conveniently through the shielding cover 6, so that the anti-interference performance of the high-density multilayer circuit board is improved; through the groove 7, the heat radiation fan 8 is convenient to mount; the cooling fan 8 is used for conveniently cooling the high-density multilayer circuit board, so that the heat dissipation efficiency of the high-density multilayer circuit board is improved; the rubber pad 9 is convenient for increasing the shock resistance of the high-density multilayer circuit board, so that the influence of shock on the working performance of the high-density multilayer circuit board is reduced; through the anti-interference high density multilayer circuit board of constituteing by shield cover 6, can improve the radiating rate of anti-interference high density multilayer circuit board, avoid piling up a large amount of heats when using, have good interference killing feature and antidetonation effect simultaneously, can increase the life of circuit board.
The cooling fan 8 and the circuit layer 2 are located on the same horizontal plane.
In this embodiment, be located same horizontal plane through cooling fan 8 and circuit layer 2, be convenient for dispel the heat the cooling to circuit layer 2.
The opening of the groove 7 faces the wiring layer 2.
In this embodiment, the opening of the groove 7 faces the circuit layer 2, so that the heat dissipation fan 8 is communicated with the circuit layer 2.
In the present embodiment, the shock resistance of the high-density multilayer circuit board is further increased by the shock-resistant layer 10.
The working principle is as follows: when the anti-interference high-density multilayer circuit board is used, the heat generated by the circuit layer 2 is conveniently and quickly conducted to the radiating fins 4 through the heat conducting adhesive layer 3; the heat radiating fins 4 are convenient for quickly releasing heat into the air, so that heat accumulation is avoided; the anti-interference layer 5 is convenient for reducing the signal interference among different unit circuit boards 1; the interference of an external electromagnetic field on the high-density multilayer circuit board is reduced conveniently through the shielding cover 6, so that the anti-interference performance of the high-density multilayer circuit board is improved; through the groove 7, the heat radiation fan 8 is convenient to mount; the cooling fan 8 is used for conveniently cooling the high-density multilayer circuit board, so that the heat dissipation efficiency of the high-density multilayer circuit board is improved; the rubber pad 9 is convenient for increasing the shock resistance of the high-density multilayer circuit board, so that the influence of shock on the working performance of the high-density multilayer circuit board is reduced; through the anti-interference high density multilayer circuit board of constituteing by shield cover 6, can improve the radiating rate of anti-interference high density multilayer circuit board, avoid piling up a large amount of heats when using, have good interference killing feature and antidetonation effect simultaneously, can increase the life of circuit board.
The present embodiment is only for explaining the present invention, and it is not limited to the present invention, and those skilled in the art can make modifications to the present embodiment without inventive contribution as required after reading the present specification, but all of them are protected by patent laws within the scope of the claims of the present invention.
Claims (4)
1. An anti-interference high-density multilayer circuit board is characterized in that: the circuit board shielding device comprises a shielding cover (6), wherein a plurality of unit circuit boards (1) are arranged between the left side wall and the right side wall of the shielding cover (6); each unit circuit board (1) comprises a circuit layer (2), a radiating fin (4) and an anti-interference layer (5), the lower surface of the circuit layer (2) is fixedly connected with the top end of the radiating fin (4) through a heat-conducting adhesive layer (3), and the anti-interference layer (5) is fixedly connected with the bottom end of the radiating fin (4); a plurality of grooves (7) are formed in the left side wall and the right side wall of the shielding case (6), and a heat radiation fan (8) is arranged in each groove (7); and a rubber pad (9) is arranged on the outer wall of the shielding cover (6).
2. The tamper resistant high density multilayer circuit board of claim 1, further comprising: the heat radiation fan (8) and the circuit layer (2) are positioned on the same horizontal plane.
3. The tamper resistant high density multilayer circuit board of claim 1, further comprising: the opening of the groove (7) faces the circuit layer (2).
4. The tamper resistant high density multilayer circuit board of claim 1, further comprising: and shockproof layers (10) are arranged between the top inner wall and the bottom inner wall of the shielding cover (6) and the unit circuit board (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121072965.3U CN214901428U (en) | 2021-05-19 | 2021-05-19 | Anti-interference high-density multilayer circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121072965.3U CN214901428U (en) | 2021-05-19 | 2021-05-19 | Anti-interference high-density multilayer circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214901428U true CN214901428U (en) | 2021-11-26 |
Family
ID=78945034
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202121072965.3U Active CN214901428U (en) | 2021-05-19 | 2021-05-19 | Anti-interference high-density multilayer circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN214901428U (en) |
-
2021
- 2021-05-19 CN CN202121072965.3U patent/CN214901428U/en active Active
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