CN219958135U - Circuit board assembly and host device - Google Patents
Circuit board assembly and host device Download PDFInfo
- Publication number
- CN219958135U CN219958135U CN202320365690.5U CN202320365690U CN219958135U CN 219958135 U CN219958135 U CN 219958135U CN 202320365690 U CN202320365690 U CN 202320365690U CN 219958135 U CN219958135 U CN 219958135U
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- China
- Prior art keywords
- substrate
- circuit board
- board assembly
- processor
- communication interfaces
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- 239000000758 substrate Substances 0.000 claims abstract description 77
- 230000017525 heat dissipation Effects 0.000 claims description 8
- 230000008054 signal transmission Effects 0.000 abstract description 6
- 238000010586 diagram Methods 0.000 description 4
- 238000009423 ventilation Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000006467 substitution reaction Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Landscapes
- Combinations Of Printed Boards (AREA)
Abstract
The utility model provides a circuit board assembly and host equipment. The first substrate is provided with a first side edge and a second side edge, and the first side edge is adjacent to the second side edge; the processor is arranged on the first substrate. The communication interfaces are arranged close to the first side edge and are sequentially distributed along the direction of the first side edge; the processor and the plurality of communication interfaces are sequentially arranged along the direction of the second side edge; a plurality of communication interfaces are for electrically connecting with the processor. According to the utility model, the plurality of communication interfaces are arranged on the first side edge, the first substrate does not need to extend outwards, the size of the first substrate is reduced, the shape of the first substrate is more regular, and the design of an external casing is easy. The processor and the plurality of communication interfaces are sequentially arranged along the direction of the second side edge, so that the distance of wires between the processor and the plurality of communication interfaces is reduced, the distance of wires is shortened, and the wire cost and the signal transmission loss are reduced.
Description
Technical Field
The present utility model relates to the field of computers, and in particular, to a circuit board assembly and a host device.
Background
The existing circuit board assembly including the connector generally needs to additionally extend a part of the circuit board for placing the connector, which results in the increase of the size of the circuit board assembly, and the increase of the size of the PCB and the length of the wiring, which is unfavorable for reducing the cost and the volume of the product, and the increase of the length of the wiring also results in the increase of the signal transmission loss.
Disclosure of Invention
In order to solve the problems in the prior art, the utility model provides a circuit board assembly and a host device, which can shorten the wiring distance between a processor and a plurality of communication interfaces.
The utility model provides a circuit board assembly, comprising a processor, the circuit board assembly further comprising:
a first substrate having a first side and a second side, the first side being adjacent to the second side; the processor is arranged on the first substrate;
the communication interfaces are arranged close to the first side edge and are sequentially distributed along the direction of the first side edge; the processor and the plurality of communication interfaces are sequentially arranged along the direction of the second side edge; the plurality of communication interfaces are for electrically connecting with the processor.
In one embodiment, the circuit board assembly further comprises:
a first memory device electrically connected to the processor; a portion of the first storage device is fixed on the first substrate, and another portion of the first storage device extends out of the first substrate.
In an embodiment, a portion of the first storage device extending out of the first substrate is provided with a fixing hole, and the fixing hole is used for fixing the first storage device.
In one embodiment, the circuit board assembly further comprises:
the second substrate is arranged at an included angle with the first substrate, and is provided with a heat dissipation assembly for dissipating heat of the processor.
In an embodiment, the second substrate and the first substrate are disposed at an angle of 90 °.
The utility model also provides host equipment, which comprises the circuit board assembly.
In an embodiment, the host device further comprises:
the shell is provided with a containing cavity, and the circuit board assembly is arranged in the containing cavity.
In one embodiment, the housing has a first vent;
the second substrate of the circuit board assembly is disposed proximate the first vent.
In one embodiment, the housing is provided with mounting holes for securing the first storage device of the circuit board assembly.
In one embodiment, the first side of the circuit board assembly is disposed toward the first vent.
According to the utility model, the plurality of communication interfaces are arranged on the first side edge, the first substrate does not need to extend outwards, the size of the first substrate is reduced, the shape of the first substrate is more regular, and the design of an external casing is easy. The processor and the plurality of communication interfaces are sequentially arranged along the direction of the second side edge, so that the distance between the processor and the plurality of communication interfaces is reduced, the wiring distance is shortened, and the wiring cost and the signal transmission loss are reduced.
Drawings
Fig. 1 is a schematic structural diagram of a circuit board assembly in the prior art.
Fig. 2 is a schematic structural diagram of an embodiment of a circuit board assembly according to the present utility model.
Fig. 3 is a schematic structural diagram of an embodiment of a circuit board assembly according to the present utility model.
Fig. 4 is a schematic structural diagram of an embodiment of a circuit board assembly according to the present utility model.
Description of the main reference signs
Processor 110 of circuit board assembly 100
The first substrate 120 is a communication interface 130
The first storage device 140 has a fixing hole 141
Second substrate 150 housing 200
First vent 220 of receiving cavity 210
Mounting hole 230 heat sink assembly 160
Second storage device 170
The utility model will be further described in the following detailed description in conjunction with the above-described figures.
Detailed Description
The following description will make reference to the accompanying drawings to more fully describe the utility model. Exemplary embodiments of the present utility model are illustrated in the accompanying drawings. This utility model may, however, be embodied in many different forms and should not be construed as limited to the exemplary embodiments set forth herein. These exemplary embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the utility model to those skilled in the art. Like reference numerals designate identical or similar components.
The terminology used herein is for the purpose of describing particular example embodiments only and is not intended to be limiting of the utility model. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. Furthermore, as used herein, "comprises" and/or "comprising" and/or "having," integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, regions, integers, steps, operations, elements, and/or groups thereof.
Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this utility model belongs. Furthermore, unless the context clearly defines otherwise, terms such as those defined in a general dictionary should be construed to have meanings consistent with their meanings in the relevant art and the present disclosure, and should not be construed as idealized or overly formal meanings.
The following description of exemplary embodiments will be provided with reference to the accompanying drawings. It is noted that the components depicted in the referenced figures are not necessarily shown to scale; and the same or similar components will be given the same or similar reference numerals or similar technical terms.
Referring to fig. 1, the conventional circuit board assembly generally requires an additional portion to be extended on the PCB board for placing the connector, resulting in a portion of the side edge of the PCB board protruding and a portion being left free. And the placement position of the connector is limited, so that the size of the PCB and the wiring length are increased. The increase in the wiring length not only increases the cost but also causes an increase in the signal transmission loss. Designing the external housing according to the shape and position of the connector also increases time and labor costs.
Referring to fig. 2-4, the present utility model proposes a circuit board assembly 100, the circuit board assembly 100 comprising a processor 110, a first substrate 120 and a plurality of communication interfaces 130.
The first substrate 120 has a first side and a second side, the first side being adjacent to the second side; the processor 110 is disposed on the first substrate 120. The plurality of communication interfaces 130 are arranged close to the first side edge and are sequentially arranged along the direction X of the first side edge; the processor 110 and the plurality of communication interfaces 130 are sequentially arranged Y along the direction of the second side; the plurality of communication interfaces 130 are for electrically connecting with the processor 110.
In this embodiment, the first substrate 120 includes a trace layer, and the electrical connection between the processor 110 and the plurality of communication interfaces 130 is achieved by plating copper traces on the trace layer. The first side and the second side are both straight lines, and the plurality of communication interfaces 130 are sequentially disposed near the first side along the direction X of the first side. For example, the protruding portion of the PCB board in fig. 1 is subtracted and the remaining portion of the PCB board is complemented, forming the first side of the first substrate 120 in fig. 2. Thus, the plurality of communication interfaces 130 can be arranged at the vacant positions of the original PCB, and the placement of the original electronic devices is not affected. And the shape of the first substrate 120 is more regular, which facilitates the design of the external casing. The processor 110 and the plurality of communication interfaces 130 are sequentially arranged along the direction Y of the second side, so that the distance between the processor 110 and the plurality of communication interfaces 130 is reduced, the routing distance is further shortened, and the routing cost and the signal transmission loss are reduced.
In some embodiments, the plurality of communication interfaces 130 may include a circular electrical connector, a rectangular electrical connector, or the like. The processor 110 may be a microprocessor, FPGA chip, or the like.
According to the utility model, the plurality of communication interfaces 130 are arranged on the first side, the first substrate 120 does not need to extend outwards, the size of the first substrate 120 is reduced, the shape of the first substrate 120 is more regular, and the design of an external machine shell is easy. By arranging the processor 110 and the plurality of communication interfaces 130 in sequence along the direction of the second side edge, the distance between the processor 110 and the plurality of communication interfaces 130 is reduced, so that the routing distance is shortened, and the routing cost and the signal transmission loss are reduced.
In one embodiment, the circuit board assembly 100 further includes a first memory device 140.
The first storage device 140 is electrically connected to the processor 110; a portion of the first storage device 140 is fixed on the first substrate 120, and another portion of the first storage device 140 extends out of the first substrate 120.
In this embodiment, the first storage device 140 may be a hard disk. One end of the hard disk is welded and fixed on the first substrate 120, and the other end is generally fixed on the first substrate 120 through a fixing stud, which requires punching holes on the first substrate 120, and occupies valuable wiring space on the first substrate 120. In this embodiment, a part of the first storage device 140 is fixedly connected to the first substrate 120 by welding, etc., and another part extends out of the first substrate 120 and is fixed to the housing or the mounting apparatus by a fixing stud. In this way, the fixing stud is moved out of the first substrate 120, so that no hole needs to be punched in the first substrate 120, and the routing space of the first substrate 120 is released.
In an embodiment, a portion of the first storage device 140 extending out of the first substrate 120 is provided with a fixing hole 141, and the fixing hole 141 is used for fixing the first storage device 140.
In this embodiment, the fixing stud may fix the first storage device 140 to the housing 200 or the mounting apparatus through the fixing hole 141. The number of the first storage devices 140 may be plural.
In one embodiment, the circuit board assembly 100 further includes a second substrate 150.
The second substrate 150 and the first substrate 120 are disposed at an included angle, a heat dissipation assembly 160 is disposed on the second substrate 150, and the heat dissipation assembly 160 is configured to dissipate heat from the processor 110.
In this embodiment, a slot may be disposed on the first substrate, and the second substrate is provided with a golden finger portion, so that the golden finger portion is inserted into the slot, thereby realizing the insertion and electrical connection between the first substrate and the second substrate. The second substrate 150 and the first substrate 120 are disposed at an included angle, and electronic devices such as a chip, a resistor, a capacitor, etc. may be disposed on the second substrate 150, and the space of the first substrate 120 may not be occupied. In this way, the placement space of the electronic device is increased without changing the size of the first substrate 120. In one embodiment, the second substrate 150 is disposed at an angle of 90 ° to the first substrate 120. Such that the distance between the electronic devices on the first substrate 120 and the electronic devices on the second substrate 150 is maximized and the impact is minimized.
Further, the circuit board assembly 100 also includes a second storage device 170. The second storage 170 may be a memory bank. The second storage device 170 is disposed on the second substrate 150.
The utility model also proposes a host device comprising the above-mentioned circuit board assembly 100.
The detailed structure of the circuit board assembly 100 can refer to the above embodiments, and will not be described herein again; it can be understood that, since the above-mentioned circuit board assembly 100 is used in the host device of the present utility model, the embodiments of the host device of the present utility model include all the technical solutions of all the embodiments of the above-mentioned circuit board assembly 100, and the achieved technical effects are identical, and are not described herein again.
In one embodiment, the host device further includes a housing 200, the housing 200 has a receiving cavity 210, and the circuit board assembly 100 is disposed in the receiving cavity 210.
In this embodiment, the housing 200 is provided to protect the circuit board assembly 100 from impact or particulate dust. Through holes are provided in the housing 200 at positions corresponding to each of the communication interfaces 130 to be matched with the communication interfaces 130, so that the communication interfaces 130 are conveniently electrically connected with external devices. Since the first substrate 120 of the circuit board assembly 100 does not extend outwardly, the first side of the first substrate 120 may be disposed in a straight line, and the shape of the case 200 may be a conventional rectangular parallelepiped shape without additional design.
In one embodiment, the housing 200 has a first vent 220;
the second substrate 150 of the circuit board assembly 100 is disposed proximate to the first vent 220.
The heat capacity generated by the operation of the processor 110 is large, and the heat dissipation assembly 160 cannot be directly placed at the first ventilation opening 220 due to the limitation of the size and placement position of the circuit board assembly 100 in the prior art, so that at least two heat dissipation assemblies 160 are required to suck external cold air into the housing 200 to normally dissipate heat of the processor 110.
In this embodiment, the heat dissipation assembly 160 disposed on the second substrate 150 can directly suck the external cold air into the housing 200 through the first ventilation opening 220, so that the external cold air flows along the second side direction to dissipate heat of the processor 110. Further, the housing 200 further includes a second vent disposed opposite the first vent 220. The cool air flows in from the first ventilation openings 220, and the cool air subjected to heat exchange flows out from the second ventilation openings, so that a better heat dissipation effect is achieved.
In one embodiment, the housing 200 is provided with a mounting hole 230, and the mounting hole 230 is used to fix the first storage device 140 of the circuit board assembly 100.
In this embodiment, the fixing stud may be used to pass through the mounting hole 230 on the housing 200 and the fixing hole 141 on the first storage device 140, so as to fix the portion of the first storage device 140 extending out of the first substrate 120 to the housing 200. The space of the first substrate 120 is saved.
In one embodiment, the first side of the circuit board assembly 100 is disposed toward the first vent 220.
In this embodiment, since the first substrate 120 of the circuit board assembly 100 does not extend and protrude outward, the first side of the first substrate 120 may be disposed in a straight line and along the vent. The connector disposed near the first side may be electrically connected to an external device through the vent without additional provision of a through hole.
Hereinabove, the specific embodiments of the present utility model are described with reference to the accompanying drawings. However, those of ordinary skill in the art will appreciate that various modifications and substitutions can be made to the specific embodiments of the utility model without departing from the spirit and scope thereof. Such modifications and substitutions are intended to be included within the scope of the present utility model.
Claims (10)
1. A circuit board assembly comprising a processor, the circuit board assembly further comprising:
a first substrate having a first side and a second side, the first side being adjacent to the second side; the processor is arranged on the first substrate;
the communication interfaces are arranged close to the first side edge and are sequentially distributed along the direction of the first side edge; the processor and the plurality of communication interfaces are sequentially arranged along the direction of the second side edge; the plurality of communication interfaces are for electrically connecting with the processor.
2. The circuit board assembly of claim 1, wherein the circuit board assembly further comprises:
a first memory device electrically connected to the processor; a portion of the first storage device is fixed on the first substrate, and another portion of the first storage device extends out of the first substrate.
3. The circuit board assembly of claim 2, wherein a portion of the first storage device extending out of the first substrate is provided with a fixing hole for fixing the first storage device.
4. The circuit board assembly of claim 1, wherein the circuit board assembly further comprises:
the second substrate is arranged at an included angle with the first substrate, and is provided with a heat dissipation assembly for dissipating heat of the processor.
5. The circuit board assembly of claim 4, wherein the second substrate is disposed at a 90 ° angle to the first substrate.
6. A host device comprising the circuit board assembly of any one of claims 1-5.
7. The host device of claim 6, wherein the host device further comprises:
the shell is provided with a containing cavity, and the circuit board assembly is arranged in the containing cavity.
8. The host device of claim 7, wherein the housing has a first vent;
the second substrate of the circuit board assembly is disposed proximate the first vent.
9. The host device of claim 7, wherein the housing is provided with mounting holes for securing the first memory device of the circuit board assembly.
10. The host device of claim 8, wherein the first side of the circuit board assembly is disposed toward the first vent.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320365690.5U CN219958135U (en) | 2023-03-01 | 2023-03-01 | Circuit board assembly and host device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320365690.5U CN219958135U (en) | 2023-03-01 | 2023-03-01 | Circuit board assembly and host device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219958135U true CN219958135U (en) | 2023-11-03 |
Family
ID=88539928
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202320365690.5U Active CN219958135U (en) | 2023-03-01 | 2023-03-01 | Circuit board assembly and host device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219958135U (en) |
-
2023
- 2023-03-01 CN CN202320365690.5U patent/CN219958135U/en active Active
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| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |