CN111867244A

CN111867244A - Printed circuit board and board card

Info

Publication number: CN111867244A
Application number: CN201910338112.0A
Authority: CN
Inventors: 不公告发明人
Original assignee: Cambricon Technologies Corp Ltd
Current assignee: Cambricon Technologies Corp Ltd
Priority date: 2019-04-25
Filing date: 2019-04-25
Publication date: 2020-10-30

Abstract

A printed circuit board and a board card are provided. A printed circuit board includes a substrate and an electronic device assembled to the substrate, the substrate having a power pad in electrical communication with the electronic device and a power connector. The integrated circuit board comprises the printed circuit board.

Description

Printed circuit board and board card

Technical Field

The invention relates to the technical field of electronic products, in particular to a printed circuit board and a board card.

Background

The standard PCIe (peripheral component interconnect express, high-speed serial computer expansion bus standard) boards are divided into three types according to length, which are a full-length board, an 3/4 long board, and a half-long board. The length of full-length integrated circuit board is 312mm, the length of 3/4 long integrated circuit board is 254mm, and the length of half long integrated circuit board is 167.65 mm.

PCBA (Printed Circuit Board + Assembly) is also divided into three types according to length, which are full-length PCBA, 3/4 long PCBA and half-length PCBA. The full-length PCBA is basically as long as the full-length board and is used for being mounted on the full-length board, the 3/4 long PCBA is basically as long as the 3/4 long board and is used for being mounted on the 3/4 board, and the half-length PCBA is basically as long as the half-length board and is used for being mounted on the half-length board.

Different kinds of integrated circuit boards need to correspond to PCBAs with different lengths one to one, and the installation cost is high.

Disclosure of Invention

The present invention has been made in view of the state of the art described above. The invention aims to provide a printed circuit board and a board card, wherein the printed circuit board can be mounted on the board card with different length or the board card with the same length, and the board card can be provided with a printed circuit board shorter than the board card or a printed circuit board with the same length as the board card.

A printed circuit board is provided that includes a substrate and an electronic device assembled to the substrate, the substrate having a power pad in electrical communication with the electronic device and the power pad being soldered to a pin of a power connector or to a wire leading from a pin of a power connector such that the power pad is in electrical communication with the power connector.

In at least one embodiment, the power pads include stitch pads that are soldered to stitches of the power connector or to wires leading from stitches of the power connector such that the stitch pads are in electrical communication with the power connector.

In at least one embodiment, the power supply pad includes a wire pad that is soldered to a wire leading from a pin of the power connector such that the wire pad is in electrical communication with the power connector.

In at least one embodiment, the power supply pad includes a stitch pad and a wire pad, and the wire pad has a larger bonding area than the stitch pad.

In at least one embodiment, the stitch pad and the wire pad are located at edge portions in a length direction of the substrate, and the stitch pad is located inside the wire pad in the length direction.

In at least one embodiment, there are two wire bonding pads on the substrate, and the two wire bonding pads can be respectively soldered with wires led out from a positive pin and a ground pin of the power connector.

The printed circuit board comprises a printed circuit board and a power connector module, the printed circuit board is the printed circuit board according to any one of the technical schemes, the power connector module comprises a power connector and a wire, the power connector is used for being electrically connected with equipment outside the printed circuit board, the length of the printed circuit board is smaller than that of the printed circuit board, the wire extends in the length direction of the printed circuit board, one end of the wire is welded to the power supply bonding pad, and the other end of the wire is led out from a pin of the power connector.

In at least one embodiment, the power pads include pin pads, the wire further includes a sense line leading from one pin of the power connector, one of the pin pads being soldered to the sense line.

In at least one embodiment, the board is a full length or 3/4 long board and the printed circuit board is a 3/4 long or half long printed circuit board.

The printed circuit board is the printed circuit board according to any one of the above technical solutions, the power pads are directly soldered with pins of the power connectors, and the length of the printed circuit board is substantially the same as that of the board.

The technical scheme at least has the following beneficial effects:

the printed circuit board can be mounted on a board card with the same length as the printed circuit board or a board card with a different length from the printed circuit board.

The power connector of the board card can be electrically connected with the printed circuit board through a wire, so that the board card has the printed circuit board with the length shorter than the length of the board card.

The pins of the power connector of the board card can be directly welded on the printed circuit board, so that the board card is provided with the printed circuit board with the same length as the board card.

Drawings

Fig. 1 is an exploded view of one embodiment of a card provided by the present disclosure.

Fig. 2 is a perspective view of the card of fig. 1 from a perspective with the top shell removed to show internal mechanisms.

Fig. 3A is a perspective view of the card of fig. 1 from another perspective.

Fig. 3B is a perspective view of the board card in fig. 3A with the backplane removed.

Fig. 4 is a perspective view of another embodiment of a card provided by the present disclosure.

Description of reference numerals:

1 upper shell, 2 backplane, 21 front of backplane, 22 back of backplane, 3 baffle, 4PCBA, 41 pin pads, 42 wire pads, 43 wire relief port, 5 first heat sink module, 51 heat sink base first part, 52 heat sink, 6 second heat sink module, 61 heat sink base second part, 62 fan, 7 power connector module, 71 power connector, 72 wire, 72a wire receiving slot, 10 board card;

the L-length direction and the W-width direction.

Detailed Description

Exemplary embodiments of the present invention are described below with reference to the accompanying drawings. It should be understood that the detailed description is intended only to teach one skilled in the art how to practice the invention, and is not intended to be exhaustive or to limit the scope of the invention.

As shown in fig. 1 to 4, the present disclosure provides a printed circuit board (hereinafter referred to as PCBA)4 and a board card 10. The board 10 includes a top case 1, a backplane 2, a bezel 3, a PCBA 4, a first heat sink module 5, a second heat sink module 6, and a power connector module 7. The power connector module 7 includes a power connector 71 electrically connectable with an external power line, so that the power connector 71 supplies power to the PCBA 4.

It should be understood that the PCBA 4 has the same length direction L and width direction W as the board 10.

By definition, the "inner" side of the PCBA 4 in the length direction L is the side closer to the center of the PCBA 4, and the "outer" side of the PCBA 4 in the width direction L is the side further from the center of the PCBA 4. The "front" side of the board 10 is the side where the upper case 1 is located, the "back" side is the side where the back plate 2 is located, the "front" side is the side where the power connector module 7 is located, and the "rear" side is the side where the baffle plate 3 is located.

The PCBA 4 includes a substrate and an electronic device assembled to the substrate. The substrate includes power pads that are in electrical communication with the electronic device, such that the power pads are the power interface for the PCBA 4 to connect with the power connectors 71.

The power connector module 7 may further include wires 72, the wires 72 being led out from pins of the power connector 71. The power connector 71 may be an 8-pin power connector, i.e., having 8 pins, the 8 pin pads being arranged in a pattern forming two rows along the length direction L of the board 10 and four columns along the width direction W of the board 10.

The electric wire 72 may include a positive wire that may be led from a positive pin of the power connector 71, a ground wire that may be led from a ground pin of the power connector 71, and a detection wire that may be connected to one pin. The positive line may be drawn from, for example, 3 positive pins and the ground line may be drawn from, for example, 4 ground pins.

The power pads include a stitch pad 41 and a wire pad 42, the stitch pad 41 may be used to be soldered to a wire 72 drawn from a stitch of the power connector or directly to a stitch of the power connector, the wire pad 42 has a larger soldering area than the stitch pad 41, and one wire pad 42 may be used to be soldered to a wire 72 drawn from a plurality of stitches.

The power pads may include two wire pads 42, and the wire pads 42 are located at an edge portion of the substrate in the length direction L of the substrate, which is beneficial for layout of electronic devices, thereby saving substrate space and shortening the path length between the wire pads 42 and the power connector 71 as much as possible.

The wire pads 42 and the stitch pads 41 are arranged in the length direction L of the PCBA 4, and specifically, the stitch pads 41 may be located inside the wire pads 42 in the length direction L.

The positive wire and the ground wire may be respectively soldered to one of the two wire pads 42, thereby enabling energization of the PCBA 4. The detection line can be welded on one pin pad 41, so that whether the power connector 71 has input is detected, and the detection line is multiplexed with one pin pad 41, so that the cost and the installation space are saved.

The wire bonding pad 42 may be soldered to a plurality of wires 72 drawn from pins of the power connector 71, and the PCBA 4 may be connected to the positive electrode line of the power connector 71 by one soldering, so that the PCBA 4 is connected to VDD (power supply terminal) of the board, and the PCBA 4 may be connected to the ground line of the power connector 71 by one soldering, so that the PCBA 4 is connected to GND (ground terminal) of the board. When the integrated circuit board 10 is mounted, the number of welding operation man-hours is small, and the assembly efficiency can be remarkably improved when the integrated circuit board 10 is assembled in batches.

The PCBA 4 having both the stitch pad 41 and the wire pad 42 can be mounted on the board 10 having the same length as or longer than itself through the stitch pad 41, and can also be mounted on the board 10 having the longer length than itself through the wire pad 42.

The PCBA 4 having only the pin pads 41 can also be soldered directly to the pins of the power connector 71 or to the wires 72 led out from the pins of the power connector 71 via the pin pads 41, so that the PCBA 4 can also be mounted on the board 10 having the same length as itself and the board 10 having a length longer than itself.

The PCBA 4 having only the wire pads 42 can be mounted to the card 10 longer than its own length.

The substrate may further have a wire escape opening 43 (described in detail later), and the wire escape opening 43 is located at an edge portion of the substrate in the length direction L. When a device outside the board 10 is connected to the power connection module 7 of the board 10 by a wire, the wire connected to the external device generally has a hook for fixing with the power connector 71, and the wire escape opening 43 is used to escape the hook. The two wire pads 42 are located on both sides of the wire escape opening 43 in the width direction W of the PCBA 4.

A portion of the substrate that is outside the wire pads 42 in the width direction W of the PCBA 4 may mount a software debug interface, which may be located approximately at the corners of the PCBA 4. After the PCBA 4 is installed on the board 10, the board 10 may be debugged via the software debug port.

When the PCBA 4 is mounted to the board 10, the PCBA 4 may be spaced from the power connector 71 (which is required to be mounted at an edge of the board 10 to facilitate connection to external wires) and connected to the power connector 71 by wires 72, and then mounted to a board 10 of a different length than the PCBA 4 itself, such as a board 10 (shown in fig. 1-3) that is longer than the PCBA 4.

As shown in fig. 1 and 2, the top housing 1, backplane 2, and bezel 3 of the card 10 interface to generally form a mounting space that houses the PCBA4, first heat sink module 5, second heat sink module 6, and power connector module 7.

The first heat sink module 5 comprises a heat sink base first part 51 and a first heat sink, such as fins 52 or the like, mounted to the heat sink base first part 51. The first heat sink module 5 is located on the positive side of the PCBA4 in the thickness direction of the board 10, so as to dissipate most of the heat generated by the PCBA4 when the board 10 is in operation.

The second heat sink module 6 comprises a heat sink base second part 61 and a second heat sink, such as a fan 62 or the like, mounted to the heat sink base second part 61. The second heat sink module 6 is located on the front side of the PCBA4 in the length direction L of the board 10 to assist the first heat sink module 5 in dissipating heat generated by the PCBA4 when the board 10 is in operation.

The heat sink base first portion 51 and the heat sink base second portion 61 may be integrally formed as a heat sink base.

As shown in fig. 3A, the PCBA4 and the heat sink base second portion 61 are supported on different parts of the backplane 2 in the length direction L of the card 10, i.e., the PCBA4 is supported on the rear portion 22 of the backplane and the heat sink base second portion 61 is supported on the front portion 21 of the backplane. The PCBA4 is supported by the heat sink base second portion 61 in the longitudinal direction L of the board 10, that is, a front end portion of the PCBA4 is supported by a rear end portion of the heat sink base second portion 61.

As shown in fig. 3B, the power connector 71 is located at the front end of the board 10 and has an outlet toward the PCBA 4 from which the wires 72 extend.

Of course, the power connector 71 may be located at other positions of the board 10 as long as it can be connected to an external wire.

The heat sink base second part 61 may have a power connector mounting groove and a wire receiving groove 72 a. A power connector mounting groove may be provided at a front end portion of the heat sink base second part 61, and the power connector 71 is mounted to the power connector mounting groove.

The wire receiving groove 72a may extend from the power connector mounting groove to the rear end portion of the heat sink base second part 61, i.e., from the front end (the other end) to the rear end (one end) of the heat sink base second part 61 in the length direction L of the board card 10. The electric wire 72 is accommodated in the electric wire accommodation groove 72a, one end of the electric wire 72 is connected to the outlet of the power connector 71, and the other end of the electric wire 72 is soldered to the electric wire land 42.

The heat sink base second portion 61 also has a second heat sink mounting location for mounting a second heat sink, which is mounted to the second heat sink mounting location on the front side of the board 10. The wire receiving groove 72a has an opening toward the back side of the card 10, and the electric wire 72 can enter the wire receiving groove 72a through the opening of the wire receiving groove 72 a. The wire receiving groove 72a can receive both the positive and negative electric wires at the same time.

The wire receiving groove 72a may be provided adjacent to the second heat sink mounting location, thereby miniaturizing the card 10.

The present disclosure provides embodiments of the PCBA4 in which the board 10 is mounted at a shorter length than itself, in which the power connector 71 of the board 10 is connected to the PCBA4 by wires 72.

As shown in fig. 1 and 2, the half-length PCBA4 is mounted to the full-length board 10: the length a of the half-length PCBA4 is approximately 167.65mm, the length B of the full-length card 10 is 312mm, and the wires 72 extend from the power connector 71 and are soldered to the wire pads 42 of the PCBA4 across the space of the card 10 in front of the PCBA 4.

In other embodiments, the half-length PCBA4 may be mounted to the 3/4 long card 10: the length a of the half-length PCBA4 is approximately 167.65mm, the length of the 3/4 long card 10 is 254mm, and the wires 72 extend from the power connectors 71 and are soldered to the wire pads 42 of the PCBA4 across the space of the card 10 in front of the PCBA 4.

In other embodiments, 3/4 long PCBA4 may be mounted to the full length card 10: 3/4 the length of the long PCBA4 is approximately 254mm, the length B of the full length card 10 is 312mm, and the wires 72 extend from the power connector 71 and are soldered to the wire pads 42 of the PCBA4 across the space of the card 10 in front of the PCBA 4.

The present disclosure provides embodiments of the PCBA4 where the board 10 is mounted with the same length as itself, in such embodiments the pin pads 41 are soldered directly to the pins of the power connector 71 of the board.

As shown in fig. 4, when the PCBA4 is mounted on a board 10 having the same length as itself, for example, when the half-length PCBA4 is mounted on the half-length board 10, the pin pads 41 are soldered directly to the pins of the power connector 71 of the board.

In other embodiments, 3/4 long PCBA4 may also be mounted to 3/4 long paddle 10 and full length PCBA4 may also be mounted to full length paddle 10.

It should be understood that the above embodiments are only exemplary and are not intended to limit the present invention. Various modifications and alterations of the above-described embodiments may be made by those skilled in the art in light of the teachings of the present invention without departing from the scope thereof.

(1) In the above embodiment, the positive wire soldered to the wire pad 42 includes wires drawn from three pins, and the ground wire soldered to the wire pad 42 includes wires drawn from four pins, and in other embodiments, the positive wire and the ground wire may also include wires drawn from other numbers of pins, which may be appropriately adjusted according to the voltage required by the PCBA4 and the function of the pins of the power connector 71.

(2) The positive electrode wire and the ground wire are not limited to being connected to the two wire pads 42, and when the PCBA 4 has only the stitch pad 41, the wires drawn from each stitch corresponding to the positive electrode wire and the ground wire may also be connected to each stitch pad 41 one-to-one; alternatively, the positive line is connected to two or more (including two) of the wire pads 42, and the negative line is connected to two or more (including two) of the wire pads 42.

(3) The power connector 71 may also be other types of power sources, such as a 24-pin power connector, a 6-pin power connector, etc., and accordingly, the corresponding pin pad 41 or wire pad 42 may be selected.

(4) The wire pad 41 may also be soldered to one wire 72.

Claims

1. A printed circuit board comprising a substrate and an electronic device assembled to the substrate, characterized in that the substrate has a power supply pad in electrical communication with the electronic device and soldered to a pin of a power connector (71) or to a wire leading from a pin of a power connector (71) so that the power supply pad is in electrical communication with the power connector (71).

2. The printed circuit board of claim 1, wherein the power pads comprise stitch pads (41), the stitch pads (41) being soldered to a stitch of the power connector (71) or to a wire leading from a stitch of the power connector (71), whereby the stitch pads (41) are in electrical communication with the power connector (71).

3. The printed circuit board of claim 1, wherein the power supply pad comprises a wire pad (42), the wire pad (42) being soldered to a wire leading from a pin of the power connector (71) such that the wire pad (42) is in electrical communication with the power connector (71).

4. The printed circuit board according to claim 1, wherein the power supply pad includes a stitch pad (41) and a wire pad (42), and a bonding area of the wire pad (42) is larger than the stitch pad (41).

5. A printed circuit board according to claim 4, characterized in that the stitch pad (41) and the wire pad (42) are located at edge portions in a length direction (L) of the substrate, the stitch pad (41) being located inside the wire pad (42) in the length direction (L).

6. A printed circuit board according to claim 4 or 5, wherein there are two wire pads (42) on the substrate, and the two wire pads (42) can be soldered to wires led out from the positive pin and the ground pin of the power connector (71), respectively.

7. A board card comprising a printed circuit board (4) and a power connector module (7), wherein the printed circuit board (4) is the printed circuit board (4) according to any one of claims 1 to 6, the power connector module (7) comprises a power connector (71) and an electric wire (72), the power connector (71) is used for electrically connecting with a device outside the board card (10), the length of the printed circuit board (4) is smaller than that of the board card (10), the electric wire (72) extends in the length direction (L) of the board card (10), one end of the electric wire (72) is soldered to the power supply pad, and the other end of the electric wire (72) is led out from a pin of the power connector (71).

8. The board card of claim 7, wherein the power pads include pin pads (41), the wires (72) further include a sense line leading from one pin of the power connector (71), one of the pin pads (41) being soldered to the sense line.

9. The board card of claim 7, characterized in that the board card (10) is a full length or 3/4 long board card (10) and the printed circuit board (4) is a 3/4 long or half long printed circuit board (4).

10. A card comprising a printed circuit board (4) and a power supply connector (71), the printed circuit board (4) being a printed circuit board (4) according to any one of claims 1 to 6, the power supply pads being soldered directly to the pins of the power supply connector (71), the length of the printed circuit board (4) being substantially the same as the length of the card (10).