WO2019054190A1 - Electronic device and module substrate - Google Patents

Electronic device and module substrate Download PDF

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Publication number
WO2019054190A1
WO2019054190A1 PCT/JP2018/032128 JP2018032128W WO2019054190A1 WO 2019054190 A1 WO2019054190 A1 WO 2019054190A1 JP 2018032128 W JP2018032128 W JP 2018032128W WO 2019054190 A1 WO2019054190 A1 WO 2019054190A1
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WO
WIPO (PCT)
Prior art keywords
substrate
module
connection
board
cpu
Prior art date
Application number
PCT/JP2018/032128
Other languages
French (fr)
Japanese (ja)
Inventor
和正 庄司
長谷川　亮
Original Assignee
Ｎｅｃプラットフォームズ株式会社
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Filing date
Publication date
Application filed by Ｎｅｃプラットフォームズ株式会社 filed Critical Ｎｅｃプラットフォームズ株式会社
Publication of WO2019054190A1 publication Critical patent/WO2019054190A1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating

Definitions

  • the present invention relates to an electronic device and a module substrate.
  • Patent Document 1 discloses a structure in which a system bus motherboard and a DRU motherboard are redundantly disposed, and the system motherboard and the DRU motherboard are connected by a control board.
  • the control board is provided with a plug-in terminal portion having a level difference corresponding to a gap between the system bus motherboard and the DRU motherboard.
  • the insertion terminal portion is connected to the DRU motherboard through a through hole formed in the system bus motherboard.
  • Patent Document 1 merely discloses a configuration in which a plurality of motherboards are connected with a control board in order to eliminate a cable for connecting the system bus motherboard and the DRU motherboard. In an apparatus provided with a plurality of substrates, it is desirable to suppress the increase in size of the apparatus.
  • the present invention has been made in view of the above-described problems, and provides an electronic device and a module substrate that can suppress an increase in the size of a device including a plurality of substrates.
  • An electronic device includes: a first substrate; a second substrate provided at a position where at least a part of the surface faces a part of the surface of the first substrate; A module substrate connected to a second substrate and having a processor, wherein the second substrate is connected to the module substrate in a state of being shifted with respect to the first substrate in a direction along the surface of the first substrate ing.
  • a module substrate includes a first substrate connection portion, and a second substrate connection portion provided with a cutout portion on a side provided with the first substrate connection portion, and the cutout portion. And.
  • the increase in size of the device can be suppressed even in a device including a plurality of substrates.
  • FIG. 1 is a view showing the minimum configuration of the electronic device according to the first embodiment.
  • the electronic device 5 only needs to include at least the first substrate 1, the second substrate 2, and the module substrate 3 having the processor 4.
  • the second substrate 2 is provided at a position where at least a part of the surface 2 a faces the part of the surface 1 a of the first substrate 1.
  • the second substrate 2 is connected to the module substrate 3 in a state of being shifted with respect to the first substrate 1 in the direction along the surface 1 a of the first substrate 1.
  • the second substrate 2 is connected to the module substrate 3 at a position different from the first substrate 1 in the direction along the surface 1 a of the first substrate 1.
  • the second substrate 2 is connected to the module substrate 3 in a state of being shifted in the direction along the surface 1 a of the first substrate 1 with respect to the first substrate 1.
  • the module substrate 3 can be connected to the first substrate 1 and the second substrate 2 while arranging the first substrate 1 and the second substrate 2 at mutually offset positions.
  • FIG. 2 is a view showing the minimum configuration of a module board according to the second embodiment.
  • the module substrate 100 in the second embodiment only needs to include at least a first substrate connection portion 101 and a second substrate connection portion 102.
  • the module substrate 100 has a notch 103 on the side 100 s on which the first substrate connection portion 101 is provided.
  • the second substrate connection portion 102 is provided in the cutout portion 103.
  • a second substrate connection portion 102 is formed in the cutout portion 103.
  • the second substrate connection portion 102 is shifted in the insertion / removal direction of the first substrate 111 connected to the first substrate connection portion 101.
  • the position of the second substrate connection portion 102 is different from the position of the first substrate connection portion 101 in the insertion / removal direction of the first substrate 111. Therefore, the second substrate 112 connected to the second substrate connection unit 102 is disposed offset from the first substrate 111 connected to the first substrate connection unit 101 in the insertion / removal direction of the first substrate 111.
  • the module substrate 100 can be connected to the first substrate 111 and the second substrate 112 while the first substrate 111 and the second substrate 112 are disposed at mutually offset positions.
  • the increase in size of the apparatus can be suppressed.
  • FIG. 3 is a perspective view showing a schematic configuration of a server according to the third embodiment.
  • FIG. 4 is a perspective view showing the internal configuration of the server according to the third embodiment.
  • FIG. 5 is a side view showing the internal configuration of the server according to the third embodiment.
  • FIG. 6 is a plan view showing the internal configuration of the server according to the third embodiment.
  • the server (electronic device) 10 includes a housing 11, a main board (first substrate) 12, a CPU module 20, a control module 30, and a CPU connection substrate (third substrate) 50. And a card connection substrate (second substrate) 60 and a card module 40.
  • the housing 11 has a hollow box shape, and accommodates therein the main board 12, the CPU module 20, the control module 30, the CPU connection substrate 50, the card connection substrate 60, and the card module 40.
  • the housing 11 is housed in a server rack (not shown).
  • the housing 11 includes, for example, a fan unit (fan) 18 on the front end 11 f side.
  • the fan unit 18 sends cooling air in the front-rear direction D1 from the front end 11f of the housing 11 toward the rear end 11r.
  • the main board 12 is flat and disposed along the bottom plate 11 c of the housing 11. As shown in FIGS. 4 to 6, the main board 12 includes base connectors 15A and 15B on the top surface thereof.
  • the CPU module 20 is detachably connected to the base connector 15A.
  • the control module 30 is detachably connected to the base connector 15B.
  • a plurality of base connectors 15A and 15B are provided at intervals in the width direction D2 of the housing 11 orthogonal to the front-rear direction D1 connecting the front end 11f and the rear end 11r of the housing 11. (For example, four pieces) are arranged.
  • the CPU module 20 includes a module substrate (third substrate) 21, a CPU (Central Processing Unit: processor) 22, sockets 23 and 24, and memories 25 and 26.
  • a module substrate third substrate
  • CPU Central Processing Unit: processor
  • the module substrate 21 has a substantially rectangular plate shape, has a first surface 21 a on one side, and has a second surface 21 b on the opposite side to the first surface 21 a.
  • the module substrate 21 is disposed on the main board 12 orthogonal to the top surface of the main board 12.
  • the module substrate 21 is disposed along the longitudinal direction D1 along the longitudinal direction and along the vertical direction D3 orthogonal to the top surface of the main board 12 along the short direction.
  • the module substrate 21 has a first connection terminal (first substrate connection portion) 27 to the main board 12 at the outer peripheral portion.
  • the first connection terminal 27 protrudes downward from the lower end of the substrate front end 21 f on the side of the front end 11 f of the housing 11 in the module substrate 21.
  • the first connection terminal 27 is disposed on the module substrate 21 at a position different from the longitudinal center portion where the CPU 22 and the memory 25 described later are provided.
  • the first connection terminal 27 is detachably connected to the base connector 15A on the upper surface of the main board 12.
  • the module substrate 21 is connected to the upper surface (surface) of the main board 12 so as to be insertable and removable along the vertical direction D3.
  • the module substrate 21 With the first connection terminal 27 connected to the base connector 15A, the module substrate 21 is positioned in a plane perpendicular to the top surface of the main board 12. For example, the surfaces 21 a and 21 b of the module substrate 21 are orthogonal to the top surface of the main board 12. The plurality of module substrates 21 are positioned in parallel with each other at an interval in the width direction D2.
  • the module substrate 21 has a step-like notch 21 k at the lower part of the substrate rear end 21 r on the rear end 11 r side of the housing 11.
  • the notch 21 k is formed by, for example, a step of a part of the module substrate 21 so as to be recessed toward the inside of the module substrate 21.
  • the module substrate 21 has a second connection terminal 28 and a third connection terminal 29 in the notch 21 k.
  • the substrate connection portion and the second substrate connection portion are the third connection terminals 29, but may be connection portions other than the third connection terminals 29.
  • the second connection terminal 28 is disposed at an interval in the vertical direction D3 with respect to the upper surface of the main board 12 in a state where the module board 21 is connected to the main board 12.
  • the third connection terminal 29 is disposed closer to the rear end 21 r of the module substrate 21 than the second connection terminal 28.
  • the third connection terminal 29 is arranged at an interval in the vertical direction D3 with respect to the upper surface of the main board 12 in a state in which the module board 21 is connected to the main board 12.
  • the distance between the third connection terminal 29 and the upper surface of the main board 12 is larger than the distance between the second connection terminal 28 and the upper surface of the main board 12.
  • the second connection terminal 28 and the third connection terminal 29 are disposed at different distances from the upper surface of the main board 12 in the vertical direction D3.
  • the distance from the top surface of the main board 12 to the third connection terminal 29 is larger than the distance from the top surface of the main board 12 to the second connection terminal 28.
  • the CPU 22 is disposed at the central portion in the longitudinal direction and the lateral direction of the first surface 21 a of the module substrate 21.
  • the CPU 22 is provided with a heat sink (not shown) on the side opposite to the side facing the module substrate 21.
  • a plurality of sockets 23 are disposed on the first surface 21 a of the module substrate 21.
  • the plurality of sockets 23 are disposed on both sides of the CPU 22 in the vertical direction D3 (the short direction of the module substrate 21).
  • the memory 25 is disposed on the first surface 21 a of the module substrate 21.
  • the memory 25 is inserted into and removed from the socket 23 provided on the first surface 21 a of the module substrate 21 in the direction orthogonal to the first surface 21 a of the module substrate 21.
  • the memory 25 is a substantially rectangular plate, and is disposed with its thickness direction aligned with the vertical direction D3 and its longitudinal direction aligned with the front-rear direction D1.
  • a plurality of sockets 24 are disposed on the second surface 21 b of the module substrate 21.
  • the sockets 24 are respectively disposed on both sides in the vertical direction D3 (the lateral direction of the module substrate 21) at the central portion in the longitudinal direction of the module substrate 21.
  • the socket 24 is disposed to face the socket 23 disposed on the first surface 21 a of the module substrate 21.
  • the socket 24 is disposed to face, for example, the socket 23 and the module substrate 21.
  • the memory 26 is disposed on the second surface 21 b of the module substrate 21.
  • the memory 26 can be inserted into and removed from the socket 24 provided on the second surface 21 b of the module substrate 21 in the direction orthogonal to the second surface 21 b of the module substrate 21.
  • the memory 26 is in the form of a substantially rectangular plate, and the thickness direction thereof is aligned with the vertical direction D3 in the housing 11, and the longitudinal direction thereof is aligned with the front-rear direction D1.
  • the module substrate 21 has a widening portion 21w that is wider at the center in the longitudinal direction and below the longitudinal ends.
  • the CPU 22 and the socket 23 (memory 25) described above are arranged in the area where the wide portion 21w is formed in the longitudinal direction (front-rear direction D1) of the module substrate 21. That is, in the module board 21, in the part where the CPU 22 and the memory 25 are provided, the dimensions of the module board 21 in the insertion / removal direction (vertical direction D3) of the module board 21 with respect to the main board 12 large. For example, in the module substrate 21, the width in the vertical direction D3 of the portion where the CPU 22 and the memory 25 are provided is wider than the width of the other portions. As described above, by arranging the CPU 22 and the socket 23 in the area where the wide part 21 w is formed, the arrangement space for the CPU 22 and the socket 23 is secured while suppressing the height of the module substrate 21.
  • the CPU 22 and the memory 25 are arranged along the insertion / removal direction (vertical direction D3) of the module substrate 21.
  • the plate-like memory 25 is located along the flow of the cooling air generated by the fan unit 18 and does not obstruct the flow of the cooling air that cools the CPU 22.
  • the control module 30 includes a control substrate 31 and various electronic components (not shown) mounted on the control substrate 31.
  • the control substrate 31 has a substantially rectangular plate shape.
  • the control board 31 is disposed on the main board 12 so as to be orthogonal to the upper surface of the main board 12.
  • the control substrate 31 is disposed along the longitudinal direction D1 in the longitudinal direction and along the vertical direction D3 in the lateral direction.
  • the control board 31 has a connection terminal 32 to the main board 12 at the outer peripheral portion.
  • the connection terminal 32 protrudes downward from the lower end of the substrate end 32 f on the front end 11 f side of the housing 11 in the control substrate 31.
  • the connection terminal 32 is detachably connected to the base connector 15 B on the top surface of the main board 12.
  • the control board 31 is connected to the upper surface of the main board 12 so as to be insertable and removable along the vertical direction D3.
  • the connection terminals 32 connected to the base connector 15B With the connection terminals 32 connected to the base connector 15B, the plurality of control boards 31 are spaced in the width direction D2 and positioned in parallel with each other.
  • One control board 31 is provided as a pair for one module board 21.
  • the control substrate 31 is disposed adjacent to the module substrate 21.
  • the CPU connection substrate 50 is disposed in parallel with the main board 12.
  • the CPU connection substrate 50 has a substantially rectangular plate shape.
  • the CPU connection substrate 50 is disposed with the longitudinal direction in the width direction D2 and the short direction in the front-rear direction D1.
  • the CPU connection substrate 50 has smaller length dimensions in the front-rear direction D1 and the width direction D2 than the main board 12. That is, the CPU connection board 50 is smaller than the main board 12.
  • the CPU connection board 50 opposes the main board 12 in the vertical direction D3.
  • the entire surface of the CPU connection substrate 50 faces the main board 12. Further, the CPU connection substrate 50 is offset from the main board 12 and the card connection substrate 60 in the front-rear direction D1 along the surface of the main board 12.
  • the CPU connection substrate 50 is connected to the module substrate 21 at a position behind the position of the CPU 22 of the module substrate 21.
  • the CPU connection board 50 connects a plurality of module boards 21 to each other.
  • the CPU connection substrate 50 is provided with a plurality of substrate connectors 51 arranged on the top surface at intervals in the width direction D2.
  • the second connection terminal 28 of each module board 21 is detachably connected in the vertical direction D3.
  • the CPU connection board 50 electrically connects the CPUs 22 mounted on a plurality of module boards 21.
  • the card connection board 60 is disposed in parallel with the main board 12.
  • the card connection substrate 60 is provided at a position where a part of the surface 60 f on the front end 11 f side of the housing 11 faces a part of the main board 12.
  • a surface 60r on the rear end 11r side of the housing 11 extends further rearward than the main board 12. In this manner, the card connection substrate 60 is offset from the main board 12 in the front-rear direction D1 along the surface of the main board 12.
  • the card connection board 60 is connected to the module board 21 behind the position of the CPU 22 of the module board 21.
  • the card connection boards 60 have different positions in the vertical direction D3 (direction of insertion and removal with respect to the module board 21) with respect to the main board 12 and the CPU connection board 50.
  • the distance between the card connection board 60 and the main board 12 in the vertical direction D3 is different from that of the CPU connection board 50.
  • the card connection board 60 is arranged such that the distance between the card connection board 60 and the main board 12 is larger than that of the CPU connection board 50.
  • the card connection board 60 is disposed such that the front end of the card connection board 60 overlaps the rear end of the CPU connection board 50 in plan view as viewed in the vertical direction D3.
  • the card connection substrate 60 includes a plurality of substrate connectors 61 disposed on the top surface of the housing 11 on the front end 11 f side with an interval in the width direction D 2.
  • each board connector 61 the third connection terminal 29 of each module board 21 is detachably connected in the vertical direction D3.
  • the card connection substrate 60 includes a plurality of card slots 62 disposed on the upper surface of the rear end 11r side of the housing 11 at intervals in the width direction D2. Each card slot 62 is connected with a card substrate 41 of a card module 40 described later.
  • the card module 40 includes a card substrate 41 and various electronic components (not shown) mounted on the card substrate 41.
  • the card module 40 configures, for example, an expansion card such as a PCI (Peripheral Component Interconnect) card.
  • PCI Peripheral Component Interconnect
  • the card substrate 41 has a substantially rectangular plate shape.
  • the card substrate 41 is disposed on the card connection substrate 60 orthogonal to the upper surface of the card connection substrate 60.
  • the card substrate 41 is disposed with the longitudinal direction along the longitudinal direction D1 and the short direction along the vertical direction D3.
  • the card substrate 41 has a substrate connection terminal 42 to the card connection substrate 60 at the outer peripheral portion.
  • the substrate connection terminal 42 protrudes downward from the lower end of the substrate end 41 r on the side of the rear end 11 r of the housing 11 in the card substrate 41.
  • the board connection terminal 42 is detachably connected to the card slot 62 on the upper surface of the card connection board 60.
  • the card substrate 41 is connected to the upper surface of the card connection substrate 60 so as to be insertable in and removable from in the vertical direction D3.
  • the plurality of card substrates 41 are positioned in parallel with each other at an interval in the width direction D2.
  • the main board 12 is connected to the module board 21 at the first connection terminal 27 in front of the position of the CPU 22 of the module board 21. Further, the CPU connection substrate 50 and the card connection substrate 60 are connected to the module substrate 21 at the second connection terminals 28 and the third connection terminals 29 behind the position of the CPU 22 of the module substrate 21. Also, the module board 21 is connected to the main board 12 on the upstream side in the flow direction of the cooling air by the fan unit 18. The CPU connection substrate 50 and the card connection substrate 60 are disposed downstream of the position of the CPU 22 in the flow direction of the cooling air by the fan unit 18.
  • the server 10 includes a power supply device (electronic component) 80 behind the main board 12 and below the card connection substrate 60 in the housing 11.
  • the card connection board 60 is disposed to face the main board 12 with a gap equal to or greater than the height of the power supply device 80.
  • the module substrate 21 sets the position of the third connection terminal 29 connected to the substrate connector 61 of the card connection substrate 60 in accordance with the position of the card connection substrate 60. That is, the notch 21 k provided with the third connection terminal 29 is set in accordance with the height of the power supply device 80 disposed between the main board 12 and the card connection substrate 60.
  • the main board 12, the card connection board 60, and the CPU connection board 50 is different in type.
  • the main board 12, the card connection board 60, and the CPU connection board 50 have different board thicknesses and materials.
  • the CPU connection board 50 performs high-speed signal communication between the CPUs 22 of the plurality of module boards 21. Therefore, the CPU connection substrate 50 is formed of a substrate material having a wiring pattern made of a material having the largest thickness and a high electrical conductivity.
  • the card connection substrate 60 and the main board 12 use a substrate material having a wiring pattern made of a material having a smaller plate thickness and a lower electric conductivity than the CPU connection substrate 50.
  • the main board 12 having the largest planar size has the smallest board thickness and uses the least expensive substrate material.
  • the server 10 may normally use two sets of the CPU module 20, the control module 30, and the card module 40 among the four sets.
  • the remaining two sets of the CPU module 20, the control module 30, and the card module 40 among the four sets may be reserved (for backup). That is, the remaining two sets of CPU module 20, control module 30, and card module 40 are used only when one of the two sets of CPU module 20, control module 30, and card module 40 used in normal operation has failed, etc. It may be done.
  • the CPU module 20 the control module 30, and the card module 40
  • all of the CPU module 20 and the card module 40 are normally used, and a part of the control module 30 is normally used. It may be divided into At least one set of the CPU module 20, the control module 30, and the card module 40 to be reserved may be used, and the remaining three sets may be normally used.
  • the card connection board 60 is connected to the module board 21 in a state of being shifted in the direction along the surface of the main board 12 with respect to the main board 12.
  • the direction along the surface of the main board 12 refers to the direction parallel to the surface of the main board 12.
  • the main board 12 and the card connection board 60 can be arranged so as to overlap with each other in plan view. Therefore, the enlargement of the server 10 can be suppressed.
  • the module substrate 21 can be connected to the main board 12 without penetrating the card connection substrate 60.
  • the main board 12 is connected to the module board 21 forward of the position of the CPU 22 of the module board 21, and the card connection board 60 is module module 21 backward of the position of the CPU 22 of the module board 21. It is connected to the.
  • the main board 12 and the card connection board 60 before and after the CPU 22, the line length of the wiring pattern extending from the CPU 22 of the module board 21 is suppressed, and the card connection with the main board 12 to the module board 21 is performed.
  • the substrate 60 can be connected efficiently.
  • the module substrate 21 is connected to the main board 12 on the upstream side in the flow direction of the cooling air by the fan unit 18, and is connected to the card connection substrate 60 on the downstream side in the flow direction of the cooling air.
  • the main board 12, the module board 21, and the CPU connection board 50 can be cooled by arranging the main board 12 and the card connection board 60 on the upstream side and the downstream side in the flow direction of the cooling air. Can be cooled more efficiently.
  • the module substrate 21 having the CPU 22 can be efficiently cooled by the cooling air by providing the card connection substrate 60 that gives a loss to the flow of the cooling air on the downstream side of the cooling air.
  • the main board 12 and the card connection board 60 have different positions in the insertion / removal direction with respect to the module board 21. As a result, the main board 12 and the card connection board 60 can be arranged efficiently.
  • the entire surface of the CPU connection substrate 50 faces the main board 12, and the CPU connection substrate 50 is offset from the main board 12 and the card connection substrate 60 in the direction along the surface of the main board 12.
  • the CPU connection substrate 50 is disposed offset from the card connection substrate 60 in the direction along the surface of the main board 12.
  • types such as board thickness and material are made different between the main board 12, the card connection board 60, and the CPU connection board 50.
  • the server 10 having such a configuration it is possible to suppress the cost as a whole while securing high performance partially as needed.
  • a plurality of module boards 21 are connected to the main board 12, and a CPU connection board 50 connects the plurality of module boards 21 to each other.
  • a CPU connection board 50 connects the plurality of module boards 21 to each other.
  • materials that are high in performance and expensive may be used, but for the other main boards 12 and card connection substrates 60, materials that are cheaper may be used. it can.
  • the server 10 having such a configuration, it is possible to suppress the cost as a whole while securing high performance partially as needed.
  • the module substrate 21 is provided with the second connection terminal 28 to which the CPU connection substrate 50 and the card connection substrate 60 are connected and the third connection terminal 29 in the notch 21k.
  • the CPU connection board 50 and the card connection board 60 can be efficiently arranged at a position close to the main board 12.
  • a space for disposing the card module 40 on the card connection substrate 60 can be secured in the housing 11, and the utilization efficiency of the space is enhanced.
  • a notch 21 k is formed on the side where the first connection terminal 27 and the first connection terminal 27 are provided, and the second connection terminal 28 provided in the notch 21 k, a third And a connection terminal 29.
  • the second connection terminal 28 and the third connection terminal 29 are offset from the first connection terminal 27 in the insertion / removal direction of the main board 12. Therefore, the CPU connection board 50 and the card connection board 60 connected to the second connection terminal 28 and the third connection terminal 29 are offset from the main board 12 connected to the first connection terminal 27 in the insertion and removal direction of the main board 12. Be placed.
  • the server 10 including the plurality of substrates the module substrate 21, the main board 12, the CPU connection substrate 50, and the card connection substrate 60
  • the increase in size of the server 10 can be suppressed.
  • the first connection terminal 27 is removably connected to the main board 12 in front of the position of the CPU 22, and the third connection terminal 29 is in the card connection substrate behind the position of the CPU 22. Pluggable with 60.
  • the main board 12 and the card connection board 60 are connected before and after the CPU 22.
  • the main board 12 and the card connection board 60 can be efficiently connected to the module board 21 while suppressing the line length of the wiring pattern extending from the CPU 22 of the module board 21.
  • the first connection terminal 27 is connected to the main board 12 on the upstream side in the flow direction of the cooling air
  • the third connection terminal 29 is on the card connection board on the downstream side in the flow direction of the cooling air Connected with 60
  • the main board 12 and the card connection substrate 60 can be dispersed and disposed on the upstream side and the downstream side in the flow direction of the cooling air. Therefore, the main board 12, the module substrate 21, and the CPU connection substrate 50 can be efficiently cooled by the cooling air.
  • the notch 21 k is formed in accordance with the height of the power supply device 80 disposed between the main board 12 and the card connection substrate 60. In this manner, it is possible to secure the installation space of the power supply device 80 below the card connection board 60 which is arranged with respect to the main board 12 in the insertion / extraction direction of the main board 12. Thereby, the space in the housing 11 can be effectively used, and the enlargement of the server 10 can be suppressed.
  • the server 10 includes the CPU module 20, the control module 30, and the card module 40 on the main board 12.
  • the server 10 includes the CPU connection board 50 and the card connection board 60.
  • the CPU connection board 50 and the card connection board 60 are not essential components, and the functions of the CPU connection board 50 and the card connection board 60 May be provided on the main board 12. In addition to this, it is possible to select the configuration described in the above-described embodiment or to appropriately change it to another configuration without departing from the gist of the present invention.
  • the first substrate is connected to the module substrate in front of the processor position of the module substrate,
  • the second substrate is connected to the module substrate at a position behind the processor position of the module substrate.
  • the second substrate is disposed downstream of the first substrate in the flow direction of the cooling air.
  • the first substrate and the second substrate have different positions in the insertion and removal direction with respect to the module substrate.
  • the electronic device according to any one of appendices 1 to 4.
  • At least one of the first substrate, the second substrate, and the third substrate is different in type, The electronic device according to appendix 6.
  • a plurality of module substrates are connected to the first substrate, The electronic device according to Appendix 6 or 7, wherein the third substrate connects a plurality of the module substrates.
  • a notch is formed on the side facing the first substrate, and a substrate connection portion to which the second substrate is connected is formed in the notch.
  • the electronic device as described in any one.
  • Module substrate comprising:
  • the first substrate connecting portion is detachably connected to the first substrate at a position forward of the processor.
  • the module board according to appendix 10 wherein the second board connection portion is detachably connected to the second board at a position behind the processor.
  • the first substrate connection portion is connected to the first substrate on the upstream side in the flow direction of the cooling air
  • the second substrate connection portion is connected to the second substrate on the downstream side in the flow direction of the cooling air.
  • the module substrate according to appendix 10 or 11.
  • the notch portion is formed in accordance with the height of the electronic component disposed between the first substrate connected to the first substrate connection portion and the second substrate connected to the second substrate connection portion.
  • the module substrate according to any one of appendices 10 to 12.
  • the increase in size of the device can be suppressed even in a device including a plurality of substrates.
  • first substrate 1 a surface 2 second substrate 2 a surface 3 module substrate 4 processor 5 electronic device 10 server (electronic device) 12 Main board (first board) 18 fan units (fans) 21 Module Board 21k Notch 22 CPU (processor) 27 1st connection terminal (1st board connection part) 28 second connection terminal 29 third connection terminal (substrate connection portion, second substrate connection portion) 50 CPU connection board (third board) 60 card connection board (second board) 80 Power Supply Device (Electronic Component) 100 module substrate 101 first substrate connection portion 102 second substrate connection portion 111 first substrate 112 second substrate

Abstract

This electronic device is provided with: a first substrate; a second substrate at least a portion of a surface of which is provided at a position facing a portion of a surface of the first substrate; and a module substrate connected to the first substrate and the second substrate and having a processor, wherein the second substrate is connected to the module substrate in a state of being displaced from the first substrate in the direction along the surface of the first substrate.

Description

電子機器、モジュール基板Electronic equipment, module board
　本発明は、電子機器、モジュール基板に関する。 The present invention relates to an electronic device and a module substrate.
　特許文献１には、システムバスマザーボードと、ＤＲＵマザーボードとを重複して配設し、システムマザーボードとＤＲＵマザーボードとを制御基板によって接続する構造を開示している。この構造において、制御基板は、システムバスマザーボードとＤＲＵマザーボードとの間隙に相当する段差を有する差込み端子部を備えている。この差込端子部は、システムバスマザーボードに形成された貫通孔を通し、ＤＲＵマザーボードに接続される。 Patent Document 1 discloses a structure in which a system bus motherboard and a DRU motherboard are redundantly disposed, and the system motherboard and the DRU motherboard are connected by a control board. In this structure, the control board is provided with a plug-in terminal portion having a level difference corresponding to a gap between the system bus motherboard and the DRU motherboard. The insertion terminal portion is connected to the DRU motherboard through a through hole formed in the system bus motherboard.
特開平６－１２０６３６号公報JP-A-6-120636
　しかしながら、特許文献１は、システムバスマザーボードとＤＲＵマザーボードとを接続するケーブルをなくすため、複数のマザーボード間を制御基板で接続する構成を開示しているにすぎない。
　複数枚の基板を備える機器においては、機器の大型化を抑えることが望まれている。 However, Patent Document 1 merely discloses a configuration in which a plurality of motherboards are connected with a control board in order to eliminate a cable for connecting the system bus motherboard and the DRU motherboard.
In an apparatus provided with a plurality of substrates, it is desirable to suppress the increase in size of the apparatus.
　本発明は上述のような課題に鑑みてなされたものであり、複数枚の基板を備える機器においても、機器の大型化を抑えることができる電子機器、モジュール基板を提供する。 The present invention has been made in view of the above-described problems, and provides an electronic device and a module substrate that can suppress an increase in the size of a device including a plurality of substrates.
　本発明の一態様の電子機器は、第１基板と、少なくとも一部の面が、前記第１基板の一部の面と対向する位置に設けられた第２基板と、前記第１基板および前記第２基板に接続され、プロセッサを有するモジュール基板と、を備え、前記第２基板は、前記第１基板の表面に沿った方向において前記第１基板に対してずれた状態でモジュール基板と接続されている。 An electronic device according to an aspect of the present invention includes: a first substrate; a second substrate provided at a position where at least a part of the surface faces a part of the surface of the first substrate; A module substrate connected to a second substrate and having a processor, wherein the second substrate is connected to the module substrate in a state of being shifted with respect to the first substrate in a direction along the surface of the first substrate ing.
　本発明の一態様のモジュール基板は、第１基板接続部と、前記第１基板接続部が設けられた辺に切り欠け部が形成され、当該切り欠け部に設けられた第２基板接続部と、を備える。 A module substrate according to one aspect of the present invention includes a first substrate connection portion, and a second substrate connection portion provided with a cutout portion on a side provided with the first substrate connection portion, and the cutout portion. And.
　本発明の電子機器、モジュール基板では、複数枚の基板を備える機器においても、機器の大型化を抑えることができる。 In the electronic device and the module substrate of the present invention, the increase in size of the device can be suppressed even in a device including a plurality of substrates.
第１の実施形態による電子機器の最小構成を示す図である。It is a figure which shows the minimum structure of the electronic device by 1st Embodiment. 第２の実施形態によるモジュール基板の最小構成を示す図である。It is a figure which shows the minimum structure of the module board by 2nd Embodiment. 第３の実施形態によるサーバの概略構成を示す斜視図である。It is a perspective view showing a schematic structure of a server by a 3rd embodiment. 第３の実施形態によるサーバの内部構成を示す斜視図である。It is a perspective view which shows the internal structure of the server by 3rd Embodiment. 第３の実施形態によるサーバの内部構成を示す側面図である。It is a side view which shows the internal structure of the server by 3rd Embodiment. 第３の実施形態によるサーバの内部構成を示す平面図である。It is a top view which shows the internal structure of the server by 3rd Embodiment.
　本発明の複数の実施形態に関して図面を参照して以下に説明する。ただし、本実施形態に関して前述した一従来例と同一の部分に関しては、同一の名称を使用して詳細な説明は省略する。 Several embodiments of the present invention will be described below with reference to the drawings. However, the same name is used for the same part as that of the conventional example described above in the present embodiment, and the detailed description is omitted.
［第１の実施形態］
　図１は、第１の実施形態による電子機器の最小構成を示す図である。
　この図が示すように、電子機器５は、第１基板１と、第２基板２と、プロセッサ４を有するモジュール基板３と、を少なくとも備えていればよい。
　第２基板２は、少なくとも一部の面２ａが、第１基板１の一部の面１ａと対向する位置に設けられる。第２基板２は、第１基板１に対し、第１基板１の面１ａに沿った方向にずれた状態でモジュール基板３と接続される。例えば、第２基板２は、第１基板１の面１ａに沿った方向において、第１基板１と異なる位置でモジュール基板３と接続される。 First Embodiment
FIG. 1 is a view showing the minimum configuration of the electronic device according to the first embodiment.
As shown in this figure, the electronic device 5 only needs to include at least the first substrate 1, the second substrate 2, and the module substrate 3 having the processor 4.
The second substrate 2 is provided at a position where at least a part of the surface 2 a faces the part of the surface 1 a of the first substrate 1. The second substrate 2 is connected to the module substrate 3 in a state of being shifted with respect to the first substrate 1 in the direction along the surface 1 a of the first substrate 1. For example, the second substrate 2 is connected to the module substrate 3 at a position different from the first substrate 1 in the direction along the surface 1 a of the first substrate 1.
　この電子機器５では、前述したとおり、第２基板２が、第１基板１に対し、第１基板１の面１ａに沿った方向にずれた状態でモジュール基板３と接続される。これにより、第１基板１と第２基板２とを互いにずれた位置に配置しつつ、第１基板１及び第２基板２にモジュール基板３を接続することができる。その結果、複数枚の基板（モジュール基板３、第１基板１、第２基板２）を備える電子機器５においても、電子機器５の大型化を抑えることができる。 In the electronic device 5, as described above, the second substrate 2 is connected to the module substrate 3 in a state of being shifted in the direction along the surface 1 a of the first substrate 1 with respect to the first substrate 1. Thus, the module substrate 3 can be connected to the first substrate 1 and the second substrate 2 while arranging the first substrate 1 and the second substrate 2 at mutually offset positions. As a result, in the electronic device 5 including the plurality of substrates (the module substrate 3, the first substrate 1, and the second substrate 2), the enlargement of the electronic device 5 can be suppressed.
［第２の実施形態］
　図２は、第２の実施形態によるモジュール基板の最小構成を示す図である。
　この図が示すように、第２の実施形態におけるモジュール基板１００は、第１基板接続部１０１と、第２基板接続部１０２と、を少なくとも備えていればよい。
　モジュール基板１００は、第１基板接続部１０１が設けられた辺１００ｓに切り欠け部１０３を有する。第２基板接続部１０２は、切り欠け部１０３に設けられる。 Second Embodiment
FIG. 2 is a view showing the minimum configuration of a module board according to the second embodiment.
As shown in this figure, the module substrate 100 in the second embodiment only needs to include at least a first substrate connection portion 101 and a second substrate connection portion 102.
The module substrate 100 has a notch 103 on the side 100 s on which the first substrate connection portion 101 is provided. The second substrate connection portion 102 is provided in the cutout portion 103.
　このモジュール基板１００は、第２基板接続部１０２が、切り欠け部１０３に形成されている。これにより、第２基板接続部１０２が、第１基板接続部１０１に接続される第１基板１１１の挿抜方向にずれている。例えば、第１基板１１１の挿抜方向において、第２基板接続部１０２の位置が第１基板接続部１０１の位置と異なる。したがって、第２基板接続部１０２と接続する第２基板１１２は、第１基板接続部１０１と接続した第１基板１１１に対し、第１基板１１１の挿抜方向にずれて配置される。これにより、第１基板１１１と第２基板１１２とを互いにずれた位置に配置しつつ、第１基板１１１及び第２基板１１２にモジュール基板１００を接続することができる。その結果、複数枚の基板（モジュール基板１００、第１基板１１１、第２基板１１２）を備える機器においても、機器の大型化を抑えることができる。 In the module substrate 100, a second substrate connection portion 102 is formed in the cutout portion 103. Thus, the second substrate connection portion 102 is shifted in the insertion / removal direction of the first substrate 111 connected to the first substrate connection portion 101. For example, the position of the second substrate connection portion 102 is different from the position of the first substrate connection portion 101 in the insertion / removal direction of the first substrate 111. Therefore, the second substrate 112 connected to the second substrate connection unit 102 is disposed offset from the first substrate 111 connected to the first substrate connection unit 101 in the insertion / removal direction of the first substrate 111. Thus, the module substrate 100 can be connected to the first substrate 111 and the second substrate 112 while the first substrate 111 and the second substrate 112 are disposed at mutually offset positions. As a result, in the apparatus including the plurality of substrates (module substrate 100, first substrate 111, and second substrate 112), the increase in size of the apparatus can be suppressed.
［第３の実施形態］
　図３は、第３の実施形態によるサーバの概略構成を示す斜視図である。図４は、第３の本実施形態によるサーバの内部構成を示す斜視図である。図５は、第３の実施形態によるサーバの内部構成を示す側面図である。図６は、第３の実施形態によるサーバの内部構成を示す平面図である。
　図３に示すように、サーバ（電子機器）１０は、筐体１１と、メインボード（第１基板）１２と、ＣＰＵモジュール２０と、制御モジュール３０と、ＣＰＵ接続基板（第３基板）５０と、カード接続基板（第２基板）６０と、カードモジュール４０と、を備える。 Third Embodiment
FIG. 3 is a perspective view showing a schematic configuration of a server according to the third embodiment. FIG. 4 is a perspective view showing the internal configuration of the server according to the third embodiment. FIG. 5 is a side view showing the internal configuration of the server according to the third embodiment. FIG. 6 is a plan view showing the internal configuration of the server according to the third embodiment.
As shown in FIG. 3, the server (electronic device) 10 includes a housing 11, a main board (first substrate) 12, a CPU module 20, a control module 30, and a CPU connection substrate (third substrate) 50. And a card connection substrate (second substrate) 60 and a card module 40.
　筐体１１は、中空箱状で、内部に、メインボード１２、ＣＰＵモジュール２０、制御モジュール３０、ＣＰＵ接続基板５０、カード接続基板６０、及びカードモジュール４０を収容する。筐体１１は、図示しないサーバラックに収容される。筐体１１は、例えば前端部１１ｆ側にファンユニット（ファン）１８を備えている。ファンユニット１８は、筐体１１の前端部１１ｆから後端部１１ｒに向かう前後方向Ｄ１に冷却風を送る。 The housing 11 has a hollow box shape, and accommodates therein the main board 12, the CPU module 20, the control module 30, the CPU connection substrate 50, the card connection substrate 60, and the card module 40. The housing 11 is housed in a server rack (not shown). The housing 11 includes, for example, a fan unit (fan) 18 on the front end 11 f side. The fan unit 18 sends cooling air in the front-rear direction D1 from the front end 11f of the housing 11 toward the rear end 11r.
　メインボード１２は、平板状で、筐体１１の底板１１ｃ上に沿って配置される。
　図４～図６に示すように、メインボード１２は、その上面に、ベースコネクタ１５Ａ，１５Ｂを備える。ベースコネクタ１５Ａは、ＣＰＵモジュール２０が着脱可能に接続される。ベースコネクタ１５Ｂは、制御モジュール３０が着脱可能に接続される。本実施形態において、ベースコネクタ１５Ａ，１５Ｂのそれぞれは、筐体１１の前端部１１ｆと後端部１１ｒとを結ぶ前後方向Ｄ１に直交する筐体１１の幅方向Ｄ２に間隔をあけて、複数個（例えば４個）ずつ配置されている。 The main board 12 is flat and disposed along the bottom plate 11 c of the housing 11.
As shown in FIGS. 4 to 6, the main board 12 includes base connectors 15A and 15B on the top surface thereof. The CPU module 20 is detachably connected to the base connector 15A. The control module 30 is detachably connected to the base connector 15B. In the present embodiment, a plurality of base connectors 15A and 15B are provided at intervals in the width direction D2 of the housing 11 orthogonal to the front-rear direction D1 connecting the front end 11f and the rear end 11r of the housing 11. (For example, four pieces) are arranged.
　ＣＰＵモジュール２０は、モジュール基板（第３基板）２１と、ＣＰＵ（Ｃｅｎｔｒａｌ　Ｐｒｏｃｅｓｓｉｎｇ　Ｕｎｉｔ：プロセッサ）２２と、ソケット２３，２４と、メモリ２５，２６と、を備える。 The CPU module 20 includes a module substrate (third substrate) 21, a CPU (Central Processing Unit: processor) 22, sockets 23 and 24, and memories 25 and 26.
　モジュール基板２１は、略長方形状の板状をなし、一方の側に第１面２１ａを有し、第１面２１ａとは反対側に第２面２１ｂを有している。モジュール基板２１は、メインボード１２上に、メインボード１２の上面に直交して配置される。モジュール基板２１は、長手方向を前後方向Ｄ１に沿わせ、短手方向をメインボード１２の上面に直交する上下方向Ｄ３に沿わせて配置される。 The module substrate 21 has a substantially rectangular plate shape, has a first surface 21 a on one side, and has a second surface 21 b on the opposite side to the first surface 21 a. The module substrate 21 is disposed on the main board 12 orthogonal to the top surface of the main board 12. The module substrate 21 is disposed along the longitudinal direction D1 along the longitudinal direction and along the vertical direction D3 orthogonal to the top surface of the main board 12 along the short direction.
　図５に示すように、モジュール基板２１は、外周部に、メインボード１２への第一接続端子（第１基板接続部）２７を有している。この第一接続端子２７は、モジュール基板２１において、筐体１１の前端部１１ｆ側の基板前端部２１ｆの下端から下方に向かって突出する。第一接続端子２７は、モジュール基板２１において、後述するＣＰＵ２２とメモリ２５とが設けられる長手方向中央部とは異なる位置に配置される。第一接続端子２７は、メインボード１２の上面のベースコネクタ１５Ａに着脱可能に接続される。これにより、モジュール基板２１は、メインボード１２の上面（表面）に対し、上下方向Ｄ３に沿って挿抜可能に接続される。第一接続端子２７をベースコネクタ１５Ａに接続させた状態で、モジュール基板２１は、メインボード１２の上面に直交する面内に位置する。例えば、モジュール基板２１の面２１ａ、２１ｂは、メインボード１２の上面と直交する。複数枚のモジュール基板２１は、幅方向Ｄ２に間隔をあけて、互いに平行に位置する。 As shown in FIG. 5, the module substrate 21 has a first connection terminal (first substrate connection portion) 27 to the main board 12 at the outer peripheral portion. The first connection terminal 27 protrudes downward from the lower end of the substrate front end 21 f on the side of the front end 11 f of the housing 11 in the module substrate 21. The first connection terminal 27 is disposed on the module substrate 21 at a position different from the longitudinal center portion where the CPU 22 and the memory 25 described later are provided. The first connection terminal 27 is detachably connected to the base connector 15A on the upper surface of the main board 12. Thus, the module substrate 21 is connected to the upper surface (surface) of the main board 12 so as to be insertable and removable along the vertical direction D3. With the first connection terminal 27 connected to the base connector 15A, the module substrate 21 is positioned in a plane perpendicular to the top surface of the main board 12. For example, the surfaces 21 a and 21 b of the module substrate 21 are orthogonal to the top surface of the main board 12. The plurality of module substrates 21 are positioned in parallel with each other at an interval in the width direction D2.
　また、モジュール基板２１は、筐体１１の後端部１１ｒ側の基板後端部２１ｒの下部に、階段状の切り欠き部２１ｋを有する。切り欠き部２１ｋは、例えば、モジュール基板２１の一部を、モジュール基板２１の内側に向かって窪むように段付きに形成したものである。モジュール基板２１は、切り欠き部２１ｋに、第二接続端子２８と、第三接続端子２９と、を有する。本実施形態において、基板接続部、第２基板接続部は、第三接続端子２９であるが、第三接続端子２９以外の接続部であってもよい。
　第二接続端子２８は、モジュール基板２１をメインボード１２に接続した状態で、メインボード１２の上面に対して上下方向Ｄ３に間隔をあけて配置される。
　第三接続端子２９は、第二接続端子２８よりもモジュール基板２１の基板後端部２１ｒ側に配置される。第三接続端子２９は、モジュール基板２１をメインボード１２に接続した状態で、メインボード１２の上面に対して上下方向Ｄ３に間隔をあけて配置される。さらに、第三接続端子２９は、メインボード１２の上面との間隔が、第二接続端子２８におけるメインボード１２の上面との間隔よりも大きい。例えば、第二接続端子２８および第三接続端子２９は、上下方向Ｄ３において、メインボード１２の上面から異なる距離の位置に配置される。例えば、メインボード１２の上面から第三接続端子２９までの距離は、メインボード１２の上面から第二接続端子２８までの距離より大きい。 In addition, the module substrate 21 has a step-like notch 21 k at the lower part of the substrate rear end 21 r on the rear end 11 r side of the housing 11. The notch 21 k is formed by, for example, a step of a part of the module substrate 21 so as to be recessed toward the inside of the module substrate 21. The module substrate 21 has a second connection terminal 28 and a third connection terminal 29 in the notch 21 k. In the present embodiment, the substrate connection portion and the second substrate connection portion are the third connection terminals 29, but may be connection portions other than the third connection terminals 29.
The second connection terminal 28 is disposed at an interval in the vertical direction D3 with respect to the upper surface of the main board 12 in a state where the module board 21 is connected to the main board 12.
The third connection terminal 29 is disposed closer to the rear end 21 r of the module substrate 21 than the second connection terminal 28. The third connection terminal 29 is arranged at an interval in the vertical direction D3 with respect to the upper surface of the main board 12 in a state in which the module board 21 is connected to the main board 12. Furthermore, the distance between the third connection terminal 29 and the upper surface of the main board 12 is larger than the distance between the second connection terminal 28 and the upper surface of the main board 12. For example, the second connection terminal 28 and the third connection terminal 29 are disposed at different distances from the upper surface of the main board 12 in the vertical direction D3. For example, the distance from the top surface of the main board 12 to the third connection terminal 29 is larger than the distance from the top surface of the main board 12 to the second connection terminal 28.
　ＣＰＵ２２は、モジュール基板２１の第１面２１ａの長手方向及び短手方向の中央部に配置される。ＣＰＵ２２は、モジュール基板２１と対面する側の反対側に、図示しないヒートシンクを備えている。 The CPU 22 is disposed at the central portion in the longitudinal direction and the lateral direction of the first surface 21 a of the module substrate 21. The CPU 22 is provided with a heat sink (not shown) on the side opposite to the side facing the module substrate 21.
　ソケット２３は、モジュール基板２１の第１面２１ａに複数が配置される。複数のソケット２３は、ＣＰＵ２２の上下方向Ｄ３（モジュール基板２１の短手方向）両側にそれぞれ配置される。
　メモリ２５は、モジュール基板２１の第１面２１ａに配置される。メモリ２５は、モジュール基板２１の第１面２１ａに設けられたソケット２３に対し、モジュール基板２１の第１面２１ａに直交する方向に挿抜される。メモリ２５は、略長方形の板状で、その厚み方向を上下方向Ｄ３に一致させ、その長手方向を前後方向Ｄ１に一致させて配置される。 A plurality of sockets 23 are disposed on the first surface 21 a of the module substrate 21. The plurality of sockets 23 are disposed on both sides of the CPU 22 in the vertical direction D3 (the short direction of the module substrate 21).
The memory 25 is disposed on the first surface 21 a of the module substrate 21. The memory 25 is inserted into and removed from the socket 23 provided on the first surface 21 a of the module substrate 21 in the direction orthogonal to the first surface 21 a of the module substrate 21. The memory 25 is a substantially rectangular plate, and is disposed with its thickness direction aligned with the vertical direction D3 and its longitudinal direction aligned with the front-rear direction D1.
　ソケット２４は、モジュール基板２１の第２面２１ｂに複数が配置される。ソケット２４は、モジュール基板２１の長手方向中央部において、上下方向Ｄ３（モジュール基板２１の短手方向）両側にそれぞれ配置される。ソケット２４は、モジュール基板２１の第１面２１ａに配置されたソケット２３と対向して配置される。ソケット２４は、例えば、ソケット２３とモジュール基板２１を挟んで対向するように配置される。
　メモリ２６は、モジュール基板２１の第２面２１ｂに配置される。メモリ２６は、モジュール基板２１の第２面２１ｂに設けられたソケット２４に対し、モジュール基板２１の第２面２１ｂに直交する方向に挿抜可能である。メモリ２６は、略長方形の板状で、その厚み方向を筐体１１内で上下方向Ｄ３に一致させ、その長手方向を前後方向Ｄ１に一致させて配置される。 A plurality of sockets 24 are disposed on the second surface 21 b of the module substrate 21. The sockets 24 are respectively disposed on both sides in the vertical direction D3 (the lateral direction of the module substrate 21) at the central portion in the longitudinal direction of the module substrate 21. The socket 24 is disposed to face the socket 23 disposed on the first surface 21 a of the module substrate 21. The socket 24 is disposed to face, for example, the socket 23 and the module substrate 21.
The memory 26 is disposed on the second surface 21 b of the module substrate 21. The memory 26 can be inserted into and removed from the socket 24 provided on the second surface 21 b of the module substrate 21 in the direction orthogonal to the second surface 21 b of the module substrate 21. The memory 26 is in the form of a substantially rectangular plate, and the thickness direction thereof is aligned with the vertical direction D3 in the housing 11, and the longitudinal direction thereof is aligned with the front-rear direction D1.
　モジュール基板２１は、長手方向の中央部に、長手方向両端部よりも下方に幅広の拡幅部２１ｗを有している。上記のＣＰＵ２２及びソケット２３（メモリ２５）は、モジュール基板２１の長手方向（前後方向Ｄ１）において、拡幅部２１ｗが形成された領域に配置される。すなわち、モジュール基板２１において、ＣＰＵ２２とメモリ２５とが設けられる部分は、モジュール基板２１の他の部分よりも、モジュール基板２１のメインボード１２に対する挿抜方向（上下方向Ｄ３）におけるモジュール基板２１の寸法が大きい。例えば、モジュール基板２１において、ＣＰＵ２２とメモリ２５とが設けられる部分の上下方向Ｄ３の幅は、他の部分の幅に対して広い。このように、拡幅部２１ｗが形成された領域にＣＰＵ２２及びソケット２３を配置することで、モジュール基板２１の高さを抑えつつ、ＣＰＵ２２及びソケット２３の配置スペースが確保される。 The module substrate 21 has a widening portion 21w that is wider at the center in the longitudinal direction and below the longitudinal ends. The CPU 22 and the socket 23 (memory 25) described above are arranged in the area where the wide portion 21w is formed in the longitudinal direction (front-rear direction D1) of the module substrate 21. That is, in the module board 21, in the part where the CPU 22 and the memory 25 are provided, the dimensions of the module board 21 in the insertion / removal direction (vertical direction D3) of the module board 21 with respect to the main board 12 large. For example, in the module substrate 21, the width in the vertical direction D3 of the portion where the CPU 22 and the memory 25 are provided is wider than the width of the other portions. As described above, by arranging the CPU 22 and the socket 23 in the area where the wide part 21 w is formed, the arrangement space for the CPU 22 and the socket 23 is secured while suppressing the height of the module substrate 21.
　また、上記ＣＰＵ２２とメモリ２５とは、モジュール基板２１の挿抜方向（上下方向Ｄ３）に沿って配列される。これにより、板状のメモリ２５は、ファンユニット１８によって発生される冷却風の流れに沿って位置し、ＣＰＵ２２を冷却する冷却風の流れを阻害しない。 The CPU 22 and the memory 25 are arranged along the insertion / removal direction (vertical direction D3) of the module substrate 21. Thus, the plate-like memory 25 is located along the flow of the cooling air generated by the fan unit 18 and does not obstruct the flow of the cooling air that cools the CPU 22.
　図４に示すように、制御モジュール３０は、制御基板３１と、制御基板３１に実装された各種の電子部品（図示無し）と、を備える。
　制御基板３１は、略長方形状の板状をなしている。制御基板３１は、メインボード１２上に、メインボード１２の上面に直交して配置される。制御基板３１は、長手方向を前後方向Ｄ１に沿わせ、短手方向を上下方向Ｄ３に沿わせて配置される。 As shown in FIG. 4, the control module 30 includes a control substrate 31 and various electronic components (not shown) mounted on the control substrate 31.
The control substrate 31 has a substantially rectangular plate shape. The control board 31 is disposed on the main board 12 so as to be orthogonal to the upper surface of the main board 12. The control substrate 31 is disposed along the longitudinal direction D1 in the longitudinal direction and along the vertical direction D3 in the lateral direction.
　制御基板３１は、外周部に、メインボード１２への接続端子３２を有している。この接続端子３２は、制御基板３１において、筐体１１の前端部１１ｆ側の基板端部３２ｆの下端から下方に向かって突出する。接続端子３２は、メインボード１２の上面のベースコネクタ１５Ｂに着脱可能に接続される。これにより、制御基板３１は、メインボード１２の上面に対し、上下方向Ｄ３に沿って挿抜可能に接続される。接続端子３２をベースコネクタ１５Ｂに接続させた状態で、複数枚の制御基板３１は、幅方向Ｄ２に間隔をあけて、互いに平行に位置する。制御基板３１は、一つのモジュール基板２１に対して一枚が対となって設けられる。制御基板３１は、モジュール基板２１に隣り合って配置される。 The control board 31 has a connection terminal 32 to the main board 12 at the outer peripheral portion. The connection terminal 32 protrudes downward from the lower end of the substrate end 32 f on the front end 11 f side of the housing 11 in the control substrate 31. The connection terminal 32 is detachably connected to the base connector 15 B on the top surface of the main board 12. Thus, the control board 31 is connected to the upper surface of the main board 12 so as to be insertable and removable along the vertical direction D3. With the connection terminals 32 connected to the base connector 15B, the plurality of control boards 31 are spaced in the width direction D2 and positioned in parallel with each other. One control board 31 is provided as a pair for one module board 21. The control substrate 31 is disposed adjacent to the module substrate 21.
　図４～図６に示すように、ＣＰＵ接続基板５０は、メインボード１２と平行に配置される。ＣＰＵ接続基板５０は、略長方形状の板状をなしている。ＣＰＵ接続基板５０は、幅方向Ｄ２に長手方向を沿わせ、前後方向Ｄ１に短手方向を沿わせて配置される。ＣＰＵ接続基板５０は、メインボード１２よりも前後方向Ｄ１及び幅方向Ｄ２の長さ寸法が小さい。すなわち、ＣＰＵ接続基板５０は、メインボード１２よりも小さい。
　ＣＰＵ接続基板５０は、メインボード１２に対し、上下方向Ｄ３で対向する。ＣＰＵ接続基板５０は、全面がメインボード１２と対向している。また、ＣＰＵ接続基板５０は、メインボード１２及びカード接続基板６０に対し、メインボード１２の表面に沿った前後方向Ｄ１にずれている。ＣＰＵ接続基板５０は、モジュール基板２１のＣＰＵ２２の位置よりも後方においてモジュール基板２１に接続される。
　ＣＰＵ接続基板５０は、複数枚のモジュール基板２１どうしを接続する。このため、ＣＰＵ接続基板５０は、上面に、幅方向Ｄ２に間隔をあけて配置された、複数の基板コネクタ５１を備える。各基板コネクタ５１は、各モジュール基板２１の第二接続端子２８が上下方向Ｄ３に着脱可能に接続される。ＣＰＵ接続基板５０は、複数枚のモジュール基板２１に搭載されたＣＰＵ２２同士を、電気的に接続する。 As shown in FIGS. 4 to 6, the CPU connection substrate 50 is disposed in parallel with the main board 12. The CPU connection substrate 50 has a substantially rectangular plate shape. The CPU connection substrate 50 is disposed with the longitudinal direction in the width direction D2 and the short direction in the front-rear direction D1. The CPU connection substrate 50 has smaller length dimensions in the front-rear direction D1 and the width direction D2 than the main board 12. That is, the CPU connection board 50 is smaller than the main board 12.
The CPU connection board 50 opposes the main board 12 in the vertical direction D3. The entire surface of the CPU connection substrate 50 faces the main board 12. Further, the CPU connection substrate 50 is offset from the main board 12 and the card connection substrate 60 in the front-rear direction D1 along the surface of the main board 12. The CPU connection substrate 50 is connected to the module substrate 21 at a position behind the position of the CPU 22 of the module substrate 21.
The CPU connection board 50 connects a plurality of module boards 21 to each other. For this reason, the CPU connection substrate 50 is provided with a plurality of substrate connectors 51 arranged on the top surface at intervals in the width direction D2. In each board connector 51, the second connection terminal 28 of each module board 21 is detachably connected in the vertical direction D3. The CPU connection board 50 electrically connects the CPUs 22 mounted on a plurality of module boards 21.
　カード接続基板６０は、メインボード１２と平行に配置される。カード接続基板６０は、筐体１１の前端部１１ｆ側の一部の面６０ｆが、メインボード１２の一部の面と対向する位置に設けられる。カード接続基板６０は、筐体１１の後端部１１ｒ側の面６０ｒが、メインボード１２よりも後方に延びている。このようにして、カード接続基板６０は、メインボード１２に対し、メインボード１２の表面に沿った前後方向Ｄ１にずれている。
　カード接続基板６０は、モジュール基板２１のＣＰＵ２２の位置よりも後方においてモジュール基板２１に接続される。カード接続基板６０は、メインボード１２及びＣＰＵ接続基板５０に対し、上下方向Ｄ３（モジュール基板２１に対する挿抜方向）において互いに位置が異なる。例えば、カード接続基板６０は、上下方向Ｄ３におけるメインボード１２との距離が、ＣＰＵ接続基板５０と異なる。具体的には、カード接続基板６０は、ＣＰＵ接続基板５０よりも、メインボード１２との間隔が大きくなるように配置される。
　また、カード接続基板６０は、上下方向Ｄ３から見た平面視において、カード接続基板６０の前端部が、ＣＰＵ接続基板５０の後端部と重なって配置されている。これにより、カード接続基板６０とＣＰＵ接続基板５０とを設けるための前後方向Ｄ１のスペースを抑えることができる。
　カード接続基板６０は、筐体１１の前端部１１ｆ側の上面に、幅方向Ｄ２に間隔をあけて配置された、複数の基板コネクタ６１を備える。各基板コネクタ６１は、各モジュール基板２１の第三接続端子２９が上下方向Ｄ３に着脱可能に接続される。
　また、カード接続基板６０は、筐体１１の後端部１１ｒ側の上面に、幅方向Ｄ２に間隔をあけて配置された、複数のカードスロット６２を備える。各カードスロット６２は、後述するカードモジュール４０のカード基板４１が接続される。 The card connection board 60 is disposed in parallel with the main board 12. The card connection substrate 60 is provided at a position where a part of the surface 60 f on the front end 11 f side of the housing 11 faces a part of the main board 12. In the card connection substrate 60, a surface 60r on the rear end 11r side of the housing 11 extends further rearward than the main board 12. In this manner, the card connection substrate 60 is offset from the main board 12 in the front-rear direction D1 along the surface of the main board 12.
The card connection board 60 is connected to the module board 21 behind the position of the CPU 22 of the module board 21. The card connection boards 60 have different positions in the vertical direction D3 (direction of insertion and removal with respect to the module board 21) with respect to the main board 12 and the CPU connection board 50. For example, the distance between the card connection board 60 and the main board 12 in the vertical direction D3 is different from that of the CPU connection board 50. Specifically, the card connection board 60 is arranged such that the distance between the card connection board 60 and the main board 12 is larger than that of the CPU connection board 50.
Further, the card connection board 60 is disposed such that the front end of the card connection board 60 overlaps the rear end of the CPU connection board 50 in plan view as viewed in the vertical direction D3. Thus, the space in the front-rear direction D1 for providing the card connection board 60 and the CPU connection board 50 can be suppressed.
The card connection substrate 60 includes a plurality of substrate connectors 61 disposed on the top surface of the housing 11 on the front end 11 f side with an interval in the width direction D 2. In each board connector 61, the third connection terminal 29 of each module board 21 is detachably connected in the vertical direction D3.
In addition, the card connection substrate 60 includes a plurality of card slots 62 disposed on the upper surface of the rear end 11r side of the housing 11 at intervals in the width direction D2. Each card slot 62 is connected with a card substrate 41 of a card module 40 described later.
　カードモジュール４０は、カード基板４１と、カード基板４１に実装された各種の電子部品（図示無し）と、を備える。カードモジュール４０は、例えば、ＰＣＩ（Ｐｅｒｉｐｈｅｒａｌ　Ｃｏｍｐｏｎｅｎｔ　Ｉｎｔｅｒｃｏｎｎｅｃｔ）カード等の拡張カードを構成する。 The card module 40 includes a card substrate 41 and various electronic components (not shown) mounted on the card substrate 41. The card module 40 configures, for example, an expansion card such as a PCI (Peripheral Component Interconnect) card.
　カード基板４１は、略長方形状の板状をなしている。カード基板４１は、カード接続基板６０上に、カード接続基板６０の上面に直交して配置される。カード基板４１は、長手方向を前後方向Ｄ１に沿わせ、短手方向を上下方向Ｄ３に沿わせて配置される。 The card substrate 41 has a substantially rectangular plate shape. The card substrate 41 is disposed on the card connection substrate 60 orthogonal to the upper surface of the card connection substrate 60. The card substrate 41 is disposed with the longitudinal direction along the longitudinal direction D1 and the short direction along the vertical direction D3.
　カード基板４１は、外周部に、カード接続基板６０への基板接続端子４２を有している。この基板接続端子４２は、カード基板４１において、筐体１１の後端部１１ｒ側の基板端部４１ｒの下端から下方に向かって突出する。基板接続端子４２は、カード接続基板６０の上面のカードスロット６２に着脱可能に接続される。これにより、カード基板４１は、カード接続基板６０の上面に対し、上下方向Ｄ３に沿って挿抜可能に接続される。複数枚のカード基板４１は、幅方向Ｄ２に間隔をあけて、互いに平行に位置する。 The card substrate 41 has a substrate connection terminal 42 to the card connection substrate 60 at the outer peripheral portion. The substrate connection terminal 42 protrudes downward from the lower end of the substrate end 41 r on the side of the rear end 11 r of the housing 11 in the card substrate 41. The board connection terminal 42 is detachably connected to the card slot 62 on the upper surface of the card connection board 60. Thereby, the card substrate 41 is connected to the upper surface of the card connection substrate 60 so as to be insertable in and removable from in the vertical direction D3. The plurality of card substrates 41 are positioned in parallel with each other at an interval in the width direction D2.
　上記したようなサーバ１０において、メインボード１２は、モジュール基板２１のＣＰＵ２２の位置よりも前方の第一接続端子２７においてモジュール基板２１に接続される。
　また、ＣＰＵ接続基板５０及びカード接続基板６０は、モジュール基板２１のＣＰＵ２２の位置よりも後方の第二接続端子２８、第三接続端子２９において、モジュール基板２１に接続される。
　また、モジュール基板２１は、ファンユニット１８による冷却風の流れ方向の上流側で、メインボード１２と接続される。ＣＰＵ接続基板５０及びカード接続基板６０は、ＣＰＵ２２の位置よりも、ファンユニット１８による冷却風の流れ方向の下流側に配置される。 In the server 10 as described above, the main board 12 is connected to the module board 21 at the first connection terminal 27 in front of the position of the CPU 22 of the module board 21.
Further, the CPU connection substrate 50 and the card connection substrate 60 are connected to the module substrate 21 at the second connection terminals 28 and the third connection terminals 29 behind the position of the CPU 22 of the module substrate 21.
Also, the module board 21 is connected to the main board 12 on the upstream side in the flow direction of the cooling air by the fan unit 18. The CPU connection substrate 50 and the card connection substrate 60 are disposed downstream of the position of the CPU 22 in the flow direction of the cooling air by the fan unit 18.
　また、サーバ１０は、筐体１１内において、メインボード１２の後方、かつカード接続基板６０の下方に、電源供給装置（電子部品）８０を備える。換言すると、カード接続基板６０は、メインボード１２に対し、電源供給装置８０の高さ以上の隙間を隔てて対向するよう配置している。これに応じ、モジュール基板２１は、カード接続基板６０の基板コネクタ６１に接続される第三接続端子２９の位置を、カード接続基板６０の位置に応じて設定している。すなわち、第三接続端子２９が設けられた切り欠き部２１ｋは、メインボード１２とカード接続基板６０との間に配置される電源供給装置８０の高さに応じて設定されている。 Further, the server 10 includes a power supply device (electronic component) 80 behind the main board 12 and below the card connection substrate 60 in the housing 11. In other words, the card connection board 60 is disposed to face the main board 12 with a gap equal to or greater than the height of the power supply device 80. In response to this, the module substrate 21 sets the position of the third connection terminal 29 connected to the substrate connector 61 of the card connection substrate 60 in accordance with the position of the card connection substrate 60. That is, the notch 21 k provided with the third connection terminal 29 is set in accordance with the height of the power supply device 80 disposed between the main board 12 and the card connection substrate 60.
　また、メインボード１２、カード接続基板６０、及びＣＰＵ接続基板５０のうちの少なくとも一つは、種類が異なる。本実施形態において、メインボード１２、カード接続基板６０、及びＣＰＵ接続基板５０は、板厚及び材質が互いに異なる。
　ＣＰＵ接続基板５０は、複数枚のモジュール基板２１のＣＰＵ２２間での高速での信号通信を行う。このため、ＣＰＵ接続基板５０は、板厚が最も大きく、電気伝導度の高い材質からなる配線パターンを有した基板材料で形成されている。カード接続基板６０及びメインボード１２は、ＣＰＵ接続基板５０に比較すると、板厚が小さく、電気伝導度が低い材質からなる配線パターンを有した基板材料を用いている。最も平面サイズが大きいメインボード１２は、板厚が最も小さく、最も安価な材質の基板材料を用いている。 Also, at least one of the main board 12, the card connection board 60, and the CPU connection board 50 is different in type. In the present embodiment, the main board 12, the card connection board 60, and the CPU connection board 50 have different board thicknesses and materials.
The CPU connection board 50 performs high-speed signal communication between the CPUs 22 of the plurality of module boards 21. Therefore, the CPU connection substrate 50 is formed of a substrate material having a wiring pattern made of a material having the largest thickness and a high electrical conductivity. The card connection substrate 60 and the main board 12 use a substrate material having a wiring pattern made of a material having a smaller plate thickness and a lower electric conductivity than the CPU connection substrate 50. The main board 12 having the largest planar size has the smallest board thickness and uses the least expensive substrate material.
　上記したようなサーバ１０において、ＣＰＵモジュール２０、制御モジュール３０及びカードモジュール４０は、合計４組が配置されている。合計４組のＣＰＵモジュール２０、制御モジュール３０及びカードモジュール４０は、幅方向Ｄ２において、２組ずつが左右対称に配置されている。
　また、例えば、サーバ１０は、４組のうちの２組のＣＰＵモジュール２０、制御モジュール３０及びカードモジュール４０を、通常使用するようにしてもよい。この場合、サーバ１０は、４組のうち、残る２組のＣＰＵモジュール２０、制御モジュール３０及びカードモジュール４０は、予備用（バックアップ用）としてもよい。すなわち、残る２組のＣＰＵモジュール２０、制御モジュール３０及びカードモジュール４０は、通常時に使用している２組のＣＰＵモジュール２０、制御モジュール３０及びカードモジュール４０のいずれかが故障したとき等にのみ使用されてもよい。また、例えば、ＣＰＵモジュール２０、制御モジュール３０及びカードモジュール４０のうち、ＣＰＵモジュール２０、及びカードモジュール４０は、全てが通常使用され、制御モジュール３０の一部が通常使用されるものと予備用とに区分けされてもよい。
　なお、予備用とするＣＰＵモジュール２０、制御モジュール３０及びカードモジュール４０は、少なくとも１組あればよく、残りの３組が通常使用されてもよい。 In the server 10 as described above, a total of four sets of the CPU module 20, the control module 30, and the card module 40 are arranged. A total of four sets of CPU modules 20, control modules 30, and card modules 40 are arranged symmetrically in two in the width direction D2.
Also, for example, the server 10 may normally use two sets of the CPU module 20, the control module 30, and the card module 40 among the four sets. In this case, in the server 10, the remaining two sets of the CPU module 20, the control module 30, and the card module 40 among the four sets may be reserved (for backup). That is, the remaining two sets of CPU module 20, control module 30, and card module 40 are used only when one of the two sets of CPU module 20, control module 30, and card module 40 used in normal operation has failed, etc. It may be done. Further, for example, among the CPU module 20, the control module 30, and the card module 40, all of the CPU module 20 and the card module 40 are normally used, and a part of the control module 30 is normally used. It may be divided into
At least one set of the CPU module 20, the control module 30, and the card module 40 to be reserved may be used, and the remaining three sets may be normally used.
　このようなサーバ１０では、カード接続基板６０は、メインボード１２に対し、メインボード１２の表面に沿った方向にずれた状態でモジュール基板２１と接続されている。ここで、メインボード１２の表面に沿った方向とは、メインボード１２の表面に平行な方向を指している。これにより、メインボード１２とカード接続基板６０とを、平面視において一部を重ねて配置することができる。したがって、サーバ１０の大型化を抑えることができる。また、カード接続基板６０をメインボード１２にずらして配置することで、モジュール基板２１を、カード接続基板６０に貫通させることなくメインボード１２に接続することができる。 In such a server 10, the card connection board 60 is connected to the module board 21 in a state of being shifted in the direction along the surface of the main board 12 with respect to the main board 12. Here, the direction along the surface of the main board 12 refers to the direction parallel to the surface of the main board 12. Thereby, the main board 12 and the card connection board 60 can be arranged so as to overlap with each other in plan view. Therefore, the enlargement of the server 10 can be suppressed. Further, by displacing the card connection substrate 60 to the main board 12, the module substrate 21 can be connected to the main board 12 without penetrating the card connection substrate 60.
　このようなサーバ１０では、メインボード１２は、モジュール基板２１のＣＰＵ２２の位置よりも前方においてモジュール基板２１に接続され、カード接続基板６０は、モジュール基板２１のＣＰＵ２２の位置よりも後方においてモジュール基板２１に接続されている。このように、ＣＰＵ２２の前後でメインボード１２、カード接続基板６０を接続することで、モジュール基板２１のＣＰＵ２２から延びる配線パターンの線長を抑えつつ、モジュール基板２１に対してメインボード１２とカード接続基板６０とを効率良く接続できる。 In such a server 10, the main board 12 is connected to the module board 21 forward of the position of the CPU 22 of the module board 21, and the card connection board 60 is module module 21 backward of the position of the CPU 22 of the module board 21. It is connected to the. As described above, by connecting the main board 12 and the card connection board 60 before and after the CPU 22, the line length of the wiring pattern extending from the CPU 22 of the module board 21 is suppressed, and the card connection with the main board 12 to the module board 21 is performed. The substrate 60 can be connected efficiently.
　このようなサーバ１０では、モジュール基板２１は、ファンユニット１８による冷却風の流れ方向の上流側でメインボード１２と接続され、冷却風の流れ方向の下流側でカード接続基板６０と接続される。このように、メインボード１２とカード接続基板６０とを冷却風の流れ方向の上流側と下流側に分散して配置することで、メインボード１２、モジュール基板２１、ＣＰＵ接続基板５０を、冷却風により効率良く冷却できる。 In such a server 10, the module substrate 21 is connected to the main board 12 on the upstream side in the flow direction of the cooling air by the fan unit 18, and is connected to the card connection substrate 60 on the downstream side in the flow direction of the cooling air. Thus, the main board 12, the module board 21, and the CPU connection board 50 can be cooled by arranging the main board 12 and the card connection board 60 on the upstream side and the downstream side in the flow direction of the cooling air. Can be cooled more efficiently.
　このようなサーバ１０では、冷却風の流れに損失を与えるカード接続基板６０を、冷却風の下流側に設けることで、ＣＰＵ２２を有したモジュール基板２１を、冷却風により効率良く冷却することができる。 In such a server 10, the module substrate 21 having the CPU 22 can be efficiently cooled by the cooling air by providing the card connection substrate 60 that gives a loss to the flow of the cooling air on the downstream side of the cooling air. .
　このようなサーバ１０では、メインボード１２とカード接続基板６０とは、モジュール基板２１に対する挿抜方向において互いに位置が異なる。これにより、メインボード１２とカード接続基板６０とを、効率良く配置することができる。 In such a server 10, the main board 12 and the card connection board 60 have different positions in the insertion / removal direction with respect to the module board 21. As a result, the main board 12 and the card connection board 60 can be arranged efficiently.
　このようなサーバ１０では、ＣＰＵ接続基板５０は、全面がメインボード１２と対向し、かつメインボード１２及びカード接続基板６０に対し、メインボード１２の表面に沿った方向にずれている。例えば、ＣＰＵ接続基板５０は、メインボード１２の表面に沿った方向において、カード接続基板６０とずらして配置されている。このようにして、ＣＰＵ接続基板５０についても、平面視した状態でメインボード１２と重ねて配置することで、省スペース化を図ることができる。その結果、サーバ１０の大型化を抑えることができる。
　さらに、ＣＰＵ接続基板５０をカード接続基板６０に対して段違いに配置し、モジュール基板２１のＣＰＵ２２に近づけることで、ＣＰＵ２２から延びる配線パターンの線長を抑えつつ、複数のモジュール基板２１のＣＰＵ２２同士を電気的に接続することが可能となる。 In such a server 10, the entire surface of the CPU connection substrate 50 faces the main board 12, and the CPU connection substrate 50 is offset from the main board 12 and the card connection substrate 60 in the direction along the surface of the main board 12. For example, the CPU connection substrate 50 is disposed offset from the card connection substrate 60 in the direction along the surface of the main board 12. Thus, space saving can be achieved by arranging the CPU connection substrate 50 so as to overlap the main board 12 in plan view. As a result, the increase in size of the server 10 can be suppressed.
Furthermore, by arranging the CPU connection board 50 in a step-wise manner with respect to the card connection board 60 and bringing the CPU connection board closer to the CPU 22 of the module board 21, the CPUs 22 of the plurality of module boards 21 can be combined. It becomes possible to connect electrically.
　このようなサーバ１０では、メインボード１２、カード接続基板６０、及びＣＰＵ接続基板５０の間で、板厚や材質などの種類を異ならせる。これにより、メインボード１２、カード接続基板６０、及びＣＰＵ接続基板５０のそれぞれに要求される性能に応じて最適な板厚や材質を選定することができる。このような構成のサーバ１０によれば、必要に応じて部分的に高い性能を確保しつつ、全体としてはコストを抑えることが可能となる。 In such a server 10, types such as board thickness and material are made different between the main board 12, the card connection board 60, and the CPU connection board 50. As a result, it is possible to select the optimum board thickness and material according to the performance required for each of the main board 12, the card connection board 60, and the CPU connection board 50. According to the server 10 having such a configuration, it is possible to suppress the cost as a whole while securing high performance partially as needed.
　このようなサーバ１０では、モジュール基板２１は、メインボード１２に複数枚が接続され、ＣＰＵ接続基板５０は、複数枚のモジュール基板２１どうしを接続する。このように、高い信号伝送性能が必要なＣＰＵ接続基板５０には、性能が高く、高価な材料を用いつつ、それ以外のメインボード１２及びカード接続基板６０は、より安価な材料を用いることができる。このような構成のサーバ１０によれば、必要に応じて部分的に高い性能を確保しつつ、全体としてはコストを抑えることが可能となる。 In such a server 10, a plurality of module boards 21 are connected to the main board 12, and a CPU connection board 50 connects the plurality of module boards 21 to each other. As described above, for the CPU connection substrate 50 that requires high signal transmission performance, materials that are high in performance and expensive may be used, but for the other main boards 12 and card connection substrates 60, materials that are cheaper may be used. it can. According to the server 10 having such a configuration, it is possible to suppress the cost as a whole while securing high performance partially as needed.
　このようなサーバ１０では、モジュール基板２１は、切り欠き部２１ｋに、ＣＰＵ接続基板５０、カード接続基板６０が接続される第二接続端子２８、第三接続端子２９が形成されている。このようにして、ＣＰＵ接続基板５０、カード接続基板６０を、メインボード１２に近い位置で効率良く配置できる。これにより、筐体１１内において、カード接続基板６０上にカードモジュール４０を配置するスペースを確保でき、スペースの利用効率が高まる。 In such a server 10, the module substrate 21 is provided with the second connection terminal 28 to which the CPU connection substrate 50 and the card connection substrate 60 are connected and the third connection terminal 29 in the notch 21k. In this manner, the CPU connection board 50 and the card connection board 60 can be efficiently arranged at a position close to the main board 12. Thus, a space for disposing the card module 40 on the card connection substrate 60 can be secured in the housing 11, and the utilization efficiency of the space is enhanced.
　このようなモジュール基板２１では、第一接続端子２７と、第一接続端子２７が設けられた辺に切り欠き部２１ｋが形成され、切り欠き部２１ｋに設けられた第二接続端子２８，第三接続端子２９と、を備える。これにより、第二接続端子２８，第三接続端子２９が、第一接続端子２７に対し、メインボード１２の挿抜方向にずれている。したがって、第二接続端子２８，第三接続端子２９に接続したＣＰＵ接続基板５０，カード接続基板６０は、第一接続端子２７に接続したメインボード１２に対し、メインボード１２の挿抜方向にずれて配置される。これにより、複数枚の基板（モジュール基板２１、メインボード１２、ＣＰＵ接続基板５０，カード接続基板６０）を備えるサーバ１０においても、サーバ１０の大型化を抑えることができる。 In such a module substrate 21, a notch 21 k is formed on the side where the first connection terminal 27 and the first connection terminal 27 are provided, and the second connection terminal 28 provided in the notch 21 k, a third And a connection terminal 29. As a result, the second connection terminal 28 and the third connection terminal 29 are offset from the first connection terminal 27 in the insertion / removal direction of the main board 12. Therefore, the CPU connection board 50 and the card connection board 60 connected to the second connection terminal 28 and the third connection terminal 29 are offset from the main board 12 connected to the first connection terminal 27 in the insertion and removal direction of the main board 12. Be placed. As a result, even in the server 10 including the plurality of substrates (the module substrate 21, the main board 12, the CPU connection substrate 50, and the card connection substrate 60), the increase in size of the server 10 can be suppressed.
　このようなモジュール基板２１では、第一接続端子２７は、ＣＰＵ２２の位置よりも前方においてメインボード１２と挿抜可能に接続され、第三接続端子２９は、ＣＰＵ２２の位置よりも後方において、カード接続基板６０と挿抜可能に接続される。このように、ＣＰＵ２２の前後でメインボード１２、カード接続基板６０を接続する。これにより、モジュール基板２１のＣＰＵ２２から延びる配線パターンの線長を抑えつつ、モジュール基板２１に対してメインボード１２とカード接続基板６０とを効率良く接続できる。 In such a module substrate 21, the first connection terminal 27 is removably connected to the main board 12 in front of the position of the CPU 22, and the third connection terminal 29 is in the card connection substrate behind the position of the CPU 22. Pluggable with 60. Thus, the main board 12 and the card connection board 60 are connected before and after the CPU 22. Thus, the main board 12 and the card connection board 60 can be efficiently connected to the module board 21 while suppressing the line length of the wiring pattern extending from the CPU 22 of the module board 21.
　このようなモジュール基板２１では、第一接続端子２７は、冷却風の流れ方向の上流側でメインボード１２と接続され、第三接続端子２９は、冷却風の流れ方向の下流側でカード接続基板６０と接続される。これにより、メインボード１２とカード接続基板６０とを冷却風の流れ方向の上流側と下流側に分散して配置することができる。したがって、メインボード１２、モジュール基板２１、ＣＰＵ接続基板５０を、冷却風により効率良く冷却できる。 In such a module substrate 21, the first connection terminal 27 is connected to the main board 12 on the upstream side in the flow direction of the cooling air, and the third connection terminal 29 is on the card connection board on the downstream side in the flow direction of the cooling air Connected with 60 Thereby, the main board 12 and the card connection substrate 60 can be dispersed and disposed on the upstream side and the downstream side in the flow direction of the cooling air. Therefore, the main board 12, the module substrate 21, and the CPU connection substrate 50 can be efficiently cooled by the cooling air.
　このようなモジュール基板２１では、切り欠き部２１ｋは、メインボード１２とカード接続基板６０との間に配置される電源供給装置８０の高さに応じて形成される。このようにして、メインボード１２に対してメインボード１２の挿抜方向にずらして配置したカード接続基板６０の下側に、電源供給装置８０の設置スペースを確保することが可能となる。これにより、筐体１１内におけるスペースの有効利用を図り、サーバ１０の大型化を抑えることができる。 In such a module substrate 21, the notch 21 k is formed in accordance with the height of the power supply device 80 disposed between the main board 12 and the card connection substrate 60. In this manner, it is possible to secure the installation space of the power supply device 80 below the card connection board 60 which is arranged with respect to the main board 12 in the insertion / extraction direction of the main board 12. Thereby, the space in the housing 11 can be effectively used, and the enlargement of the server 10 can be suppressed.
　なお、上記実施形態では、サーバ１０は、メインボード１２上に、ＣＰＵモジュール２０、制御モジュール３０、及びカードモジュール４０を備えるようにしたが、その用途、部品構成、装備数等については、何ら限定するものではない。
　また、サーバ１０は、ＣＰＵ接続基板５０、カード接続基板６０を備えるようにしたが、これらＣＰＵ接続基板５０、カード接続基板６０については必須構成ではなく、ＣＰＵ接続基板５０、カード接続基板６０の機能を、メインボード１２上に備えるようにしてもよい。
　これ以外にも、本発明の主旨を逸脱しない限り、上記実施の形態で挙げた構成を取捨選択したり、他の構成に適宜変更することが可能である。 In the above embodiment, the server 10 includes the CPU module 20, the control module 30, and the card module 40 on the main board 12. However, the application, the component configuration, the number of equipment, etc. are not limited. It is not something to do.
The server 10 includes the CPU connection board 50 and the card connection board 60. However, the CPU connection board 50 and the card connection board 60 are not essential components, and the functions of the CPU connection board 50 and the card connection board 60 May be provided on the main board 12.
In addition to this, it is possible to select the configuration described in the above-described embodiment or to appropriately change it to another configuration without departing from the gist of the present invention.
　上記の実施形態の一部又は全部は、以下の付記のようにも記載されうるが、以下には限られない。
（付記１）
　第１基板と、
　少なくとも一部の面が、前記第１基板の一部の面と対向する位置に設けられた第２基板と、
　前記第１基板および前記第２基板に接続され、プロセッサを有するモジュール基板と、を備え、
　前記第２基板は、前記第１基板の表面に沿った方向において前記第１基板に対してずれた状態でモジュール基板と接続されている電子機器。 Some or all of the above embodiments may be described as in the following appendices, but is not limited to the following.
(Supplementary Note 1)
A first substrate,
A second substrate provided at a position where at least a portion of the surface faces a portion of the surface of the first substrate;
A module substrate connected to the first substrate and the second substrate and having a processor,
The electronic device according to claim 1, wherein the second substrate is connected to the module substrate in a state of being shifted with respect to the first substrate in a direction along the surface of the first substrate.
（付記２）
　前記第１基板は、前記モジュール基板の前記プロセッサの位置よりも前方において前記モジュール基板に接続され、
　前記第２基板は、前記モジュール基板の前記プロセッサの位置よりも後方において前記モジュール基板に接続されている、
付記１に記載の電子機器。 (Supplementary Note 2)
The first substrate is connected to the module substrate in front of the processor position of the module substrate,
The second substrate is connected to the module substrate at a position behind the processor position of the module substrate.
The electronic device according to Appendix 1.
（付記３）
　少なくとも前記モジュール基板に冷却風を送るファンと、を備え、
　前記モジュール基板は、前記冷却風の流れ方向の上流側で前記第１基板と接続され、前記冷却風の流れ方向の下流側で前記第２基板と接続される
付記１または２に記載の電子機器。 (Supplementary Note 3)
And at least a fan for sending a cooling air to the module substrate,
The electronic device according to Appendix 1 or 2, wherein the module substrate is connected to the first substrate on the upstream side in the flow direction of the cooling air, and connected to the second substrate on the downstream side in the flow direction of the cooling air. .
（付記４）
　前記第２基板は、前記第１基板に対して、前記冷却風の前記流れ方向の前記下流側に配置されている、
付記３に記載の電子機器。 (Supplementary Note 4)
The second substrate is disposed downstream of the first substrate in the flow direction of the cooling air.
The electronic device according to appendix 3.
（付記５）
　前記第１基板と前記第２基板とは、前記モジュール基板に対する挿抜方向において互いに位置が異なる、
付記１から４のいずれか一項に記載の電子機器。 (Supplementary Note 5)
The first substrate and the second substrate have different positions in the insertion and removal direction with respect to the module substrate.
The electronic device according to any one of appendices 1 to 4.
（付記６）
　全面が前記第１基板と対向し、かつ前記第１基板の表面に沿った方向において前記第１基板及び前記第２基板に対してずれている第３基板を備える、
付記１から５のいずれか一項に記載の電子機器。 (Supplementary Note 6)
And a third substrate whose entire surface faces the first substrate and which is offset with respect to the first substrate and the second substrate in a direction along the surface of the first substrate.
The electronic device according to any one of appendices 1 to 5.
（付記７）
　前記第１基板、前記第２基板、及び前記第３基板のうちの少なくとも一つは、種類が異なる、
付記６に記載の電子機器。 (Appendix 7)
At least one of the first substrate, the second substrate, and the third substrate is different in type,
The electronic device according to appendix 6.
（付記８）
　前記モジュール基板は、前記第１基板に複数枚が接続され、
　前記第３基板は、複数枚の前記モジュール基板どうしを接続する、付記６または７に記載の電子機器。 (Supplementary Note 8)
A plurality of module substrates are connected to the first substrate,
The electronic device according to Appendix 6 or 7, wherein the third substrate connects a plurality of the module substrates.
（付記９）
　前記モジュール基板は、前記第１基板に対向する側に、切り欠き部が形成され、前記切り欠き部に、前記第２基板が接続される基板接続部が形成されている、付記１から８のいずれか一項に記載の電子機器。 (Appendix 9)
In the module substrate, a notch is formed on the side facing the first substrate, and a substrate connection portion to which the second substrate is connected is formed in the notch. The electronic device as described in any one.
（付記１０）
　第１基板接続部と、
　前記第１基板接続部が設けられた辺に切り欠け部が形成され、当該切り欠け部に設けられた第２基板接続部と、
を備えるモジュール基板。 (Supplementary Note 10)
A first substrate connection,
A notch formed on a side provided with the first substrate connecting portion, and a second substrate connecting portion provided in the notch;
Module substrate comprising:
（付記１１）
　プロセッサをさらに有し、
　前記第１基板接続部は、前記プロセッサの位置よりも前方において第１基板と挿抜可能に接続され、
　前記第２基板接続部は、前記プロセッサの位置よりも後方において、第２基板と挿抜可能に接続される
付記１０に記載のモジュール基板。 (Supplementary Note 11)
Further comprising a processor,
The first substrate connecting portion is detachably connected to the first substrate at a position forward of the processor.
11. The module board according to appendix 10, wherein the second board connection portion is detachably connected to the second board at a position behind the processor.
（付記１２）
　ファンによる冷却風の流路上に設けられ、
　前記第１基板接続部は、前記冷却風の流れ方向の上流側で第１基板と接続され、前記第２基板接続部は、前記冷却風の前記流れ方向の下流側で第２基板と接続される
　付記１０または１１に記載のモジュール基板。 (Supplementary Note 12)
Provided on the cooling air flow path by the fan,
The first substrate connection portion is connected to the first substrate on the upstream side in the flow direction of the cooling air, and the second substrate connection portion is connected to the second substrate on the downstream side in the flow direction of the cooling air. The module substrate according to appendix 10 or 11.
（付記１３）
　前記切り欠き部は、前記第１基板接続部に接続される第１基板と前記第２基板接続部に接続される第２基板との間に配置される電子部品の高さに応じて形成される、付記１０から１２のいずれか一項に記載のモジュール基板。 (Supplementary Note 13)
The notch portion is formed in accordance with the height of the electronic component disposed between the first substrate connected to the first substrate connection portion and the second substrate connected to the second substrate connection portion. The module substrate according to any one of appendices 10 to 12.
　この出願は、２０１７年９月１２日に日本出願された特願２０１７－１７４９０３号を基礎とする優先権を主張し、その開示の全てをここに取り込む。 This application claims priority based on Japanese Patent Application No. 2017-174903 filed in Japan on September 12, 2017, the entire disclosure of which is incorporated herein.
　本発明の電子機器、モジュール基板では、複数枚の基板を備える機器においても、機器の大型化を抑えることができる。 In the electronic device and the module substrate of the present invention, the increase in size of the device can be suppressed even in a device including a plurality of substrates.
１　第１基板
１ａ　面
２　第２基板
２ａ　面
３　モジュール基板
４　プロセッサ
５　電子機器
１０　サーバ（電子機器）
１２　メインボード（第１基板）
１８　ファンユニット（ファン）
２１　モジュール基板
２１ｋ　切り欠き部
２２　ＣＰＵ（プロセッサ）
２７　第一接続端子（第１基板接続部）
２８　第二接続端子
２９　第三接続端子（基板接続部、第２基板接続部）
５０　ＣＰＵ接続基板（第３基板）
６０　カード接続基板（第２基板）
８０　電源供給装置（電子部品）
１００　モジュール基板
１０１　第１基板接続部
１０２　第２基板接続部
１１１　第１基板
１１２　第２基板 1 first substrate 1 a surface 2 second substrate 2 a surface 3 module substrate 4 processor 5 electronic device 10 server (electronic device)
12 Main board (first board)
18 fan units (fans)
21 Module Board 21k Notch 22 CPU (processor)
27 1st connection terminal (1st board connection part)
28 second connection terminal 29 third connection terminal (substrate connection portion, second substrate connection portion)
50 CPU connection board (third board)
60 card connection board (second board)
80 Power Supply Device (Electronic Component)
100 module substrate 101 first substrate connection portion 102 second substrate connection portion 111 first substrate 112 second substrate

Claims (13)

  1. 　第１基板と、
    　少なくとも一部の面が、前記第１基板の一部の面と対向する位置に設けられた第２基板と、
    　前記第１基板および前記第２基板に接続され、プロセッサを有するモジュール基板と、を備え、
    　前記第２基板は、前記第１基板の表面に沿った方向において前記第１基板に対してずれた状態でモジュール基板と接続されている電子機器。     A first substrate,
    A second substrate provided at a position where at least a portion of the surface faces a portion of the surface of the first substrate;
    A module substrate connected to the first substrate and the second substrate and having a processor,
    The electronic device according to claim 1, wherein the second substrate is connected to the module substrate in a state of being shifted with respect to the first substrate in a direction along the surface of the first substrate.
  2. 　前記第１基板は、前記モジュール基板の前記プロセッサの位置よりも前方において前記モジュール基板に接続され、
    　前記第２基板は、前記モジュール基板の前記プロセッサの位置よりも後方において前記モジュール基板に接続されている、
    請求項１に記載の電子機器。     The first substrate is connected to the module substrate in front of the processor position of the module substrate,
    The second substrate is connected to the module substrate at a position behind the processor position of the module substrate.
    The electronic device according to claim 1.
  3. 　少なくとも前記モジュール基板に冷却風を送るファンと、を備え、
    　前記モジュール基板は、前記冷却風の流れ方向の上流側で前記第１基板と接続され、前記冷却風の流れ方向の下流側で前記第２基板と接続される
    請求項１または２に記載の電子機器。     And at least a fan for sending a cooling air to the module substrate,
    3. The electronic device according to claim 1, wherein the module substrate is connected to the first substrate on the upstream side in the flow direction of the cooling air, and connected to the second substrate on the downstream side in the flow direction of the cooling air. machine.
  4. 　前記第２基板は、前記第１基板に対して、前記冷却風の前記流れ方向の前記下流側に配置されている、
    請求項３に記載の電子機器。     The second substrate is disposed downstream of the first substrate in the flow direction of the cooling air.
    The electronic device according to claim 3.
  5. 　前記第１基板と前記第２基板とは、前記モジュール基板に対する挿抜方向において互いに位置が異なる、
    請求項１から４のいずれか一項に記載の電子機器。     The first substrate and the second substrate have different positions in the insertion and removal direction with respect to the module substrate.
    The electronic device according to any one of claims 1 to 4.
  6. 　全面が前記第１基板と対向し、かつ前記第１基板の表面に沿った方向において前記第１基板及び前記第２基板に対してずれている第３基板を備える、
    請求項１から５のいずれか一項に記載の電子機器。     And a third substrate whose entire surface faces the first substrate and which is offset with respect to the first substrate and the second substrate in a direction along the surface of the first substrate.
    The electronic device as described in any one of Claims 1-5.
  7. 　前記第１基板、前記第２基板、及び前記第３基板のうちの少なくとも一つは、種類が異なる、
    請求項６に記載の電子機器。     At least one of the first substrate, the second substrate, and the third substrate is different in type,
    The electronic device according to claim 6.
  8. 　前記モジュール基板は、前記第１基板に複数枚が接続され、
    　前記第３基板は、複数枚の前記モジュール基板どうしを接続する、請求項６または７に記載の電子機器。     A plurality of module substrates are connected to the first substrate,
    The electronic device according to claim 6, wherein the third substrate connects a plurality of the module substrates.
  9. 　前記モジュール基板は、前記第１基板に対向する側に、切り欠き部が形成され、前記切り欠き部に、前記第２基板が接続される基板接続部が形成されている、請求項１から８のいずれか一項に記載の電子機器。 9. The module substrate according to claim 1, wherein a notch is formed on the side facing the first substrate, and a substrate connection portion to which the second substrate is connected is formed in the notch. The electronic device according to any one of the above.
  10. 　第１基板接続部と、
    　前記第１基板接続部が設けられた辺に切り欠け部が形成され、当該切り欠け部に設けられた第２基板接続部と、
    を備えるモジュール基板。     A first substrate connection,
    A notch formed on a side provided with the first substrate connecting portion, and a second substrate connecting portion provided in the notch;
    Module substrate comprising:
  11. 　プロセッサをさらに有し、
    　前記第１基板接続部は、前記プロセッサの位置よりも前方において第１基板と挿抜可能に接続され、
    　前記第２基板接続部は、前記プロセッサの位置よりも後方において、第２基板と挿抜可能に接続される
    請求項１０に記載のモジュール基板。     Further comprising a processor,
    The first substrate connecting portion is detachably connected to the first substrate at a position forward of the processor.
    The module substrate according to claim 10, wherein the second substrate connection portion is detachably connected to the second substrate at a position behind the processor.
  12. 　ファンによる冷却風の流路上に設けられ、
    　前記第１基板接続部は、前記冷却風の流れ方向の上流側で第１基板と接続され、前記第２基板接続部は、前記冷却風の前記流れ方向の下流側で第２基板と接続される
    　請求項１０または１１に記載のモジュール基板。     Provided on the cooling air flow path by the fan,
    The first substrate connection portion is connected to the first substrate on the upstream side in the flow direction of the cooling air, and the second substrate connection portion is connected to the second substrate on the downstream side in the flow direction of the cooling air. The module board according to claim 10.
  13. 　前記切り欠き部は、前記第１基板接続部に接続される第１基板と前記第２基板接続部に接続される第２基板との間に配置される電子部品の高さに応じて形成される、請求項１０から１２のいずれか一項に記載のモジュール基板。 The notch portion is formed in accordance with the height of the electronic component disposed between the first substrate connected to the first substrate connection portion and the second substrate connected to the second substrate connection portion. The module board according to any one of claims 10 to 12.
PCT/JP2018/032128 2017-09-12 2018-08-30 Electronic device and module substrate WO2019054190A1 (en)

Applications Claiming Priority (2)

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JP2017-174903 2017-09-12
JP2017174903A JP7007012B2 (en) 2017-09-12 2017-09-12 Electronic equipment, module board

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US10653040B1 (en) * 2019-05-21 2020-05-12 Quanta Computer Inc. Apparatus for changing airflow in a server
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JPS6399559A (en) * 1986-10-15 1988-04-30 Mitsubishi Electric Corp Semiconductor device
JPH0617293U (en) * 1992-08-04 1994-03-04 株式会社リコー Electronic device
JPH06120636A (en) * 1992-10-06 1994-04-28 Oki Electric Ind Co Ltd Interconnection structure for board

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Publication number Priority date Publication date Assignee Title
JPS6399559A (en) * 1986-10-15 1988-04-30 Mitsubishi Electric Corp Semiconductor device
JPH0617293U (en) * 1992-08-04 1994-03-04 株式会社リコー Electronic device
JPH06120636A (en) * 1992-10-06 1994-04-28 Oki Electric Ind Co Ltd Interconnection structure for board

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