WO2019049745A1

WO2019049745A1 - Electronic device

Info

Publication number: WO2019049745A1
Application number: PCT/JP2018/031927
Authority: WO
Inventors: 和正庄司; 長谷川　亮
Original assignee: Ｎｅｃプラットフォームズ株式会社
Priority date: 2017-09-07
Filing date: 2018-08-29
Publication date: 2019-03-14
Also published as: JP2019050238A; JP7063448B2

Abstract

Provided is an electronic device comprising a first substrate and a second substrate insertably and removably connected to the surface of the first substrate, the second substrate having a connection connector by which an electronic component can connect to both a first surface and a second surface.

Description

Electronics

The present invention relates to an electronic device.

In Patent Document 1, it is assumed that the first substrate on which the first processor is mounted, the second substrate on which the second processor is mounted, and the first substrate and the second substrate are both substantially vertical. And a connector for connecting in such a manner as described above.

Japanese Patent Laid-Open No. 9-269850

With the performance improvement of various electronic devices including the information processing apparatus disclosed in Patent Document 1, the number of electronic components mounted on a substrate tends to increase. In the configuration as disclosed in Patent Document 1, when trying to increase the number of electronic components mounted on a substrate, the first and second substrates are enlarged, and the number of second substrates connected to the first substrate is increased. Cause an increase etc. As a result, it leads to upsizing of the whole electronic device.

The present invention has been made in view of the above-described problems, and provides an electronic device capable of suppressing an increase in the size of the entire device even if the number of mounted electronic components increases.

An electronic device according to an aspect of the present invention includes a first substrate, and a second substrate removably connected to the surface of the first substrate, the second substrate having a first surface A connection connector to which an electronic component can be connected is provided on both sides of the second surface.

In the electronic device according to the present invention, the increase in the size of the entire device can be suppressed even if the number of electronic components mounted is increased.

It is a figure which shows the minimum structure of the electronic device by 1st Embodiment. It is a perspective view showing a schematic structure of a server by a 2nd embodiment. It is a perspective view which shows the internal structure of the server by 2nd Embodiment. It is a side view which shows the internal structure of the server by 2nd Embodiment. It is a top view which shows the internal structure of the server by 2nd Embodiment. It is sectional drawing which shows the structure of the 2nd board | substrate by 2nd Embodiment.

Several embodiments of the present invention will be described below with reference to the drawings. However, the same name is used for the same part as that of the conventional example described above in the present embodiment, and the detailed description is omitted.

First Embodiment
FIG. 1 is a view showing the minimum configuration of the electronic device according to the first embodiment.
As this figure shows, the electronic device 5 should just be equipped with the 1st board | substrate 1, the 2nd board | substrate 2, and the connection connector 3 at least.
The second substrate 2 is detachably connected to the surface of the first substrate 1. The connection connector 3 is provided on both the first surface 2 a and the second surface 2 b of the second substrate 2. The connector 3 can connect the electronic component 4.

The electronic device 5 can mount the electronic component 4 on the first surface 2 a and the second surface 2 b of the second substrate 2. As a result, even if the number of electronic components 4 to be mounted increases, the enlargement of the electronic device 5 can be suppressed.

Second Embodiment
FIG. 2 is a perspective view showing a schematic configuration of a server according to the second embodiment. FIG. 3 is a perspective view showing the internal configuration of the server according to the second embodiment. FIG. 4 is a side view showing the internal configuration of the server according to the second embodiment. FIG. 5 is a plan view showing the internal configuration of the server according to the second embodiment. FIG. 6 is a cross-sectional view showing the configuration of a second substrate according to the second embodiment.
As shown in FIG. 2, the server (electronic device) 10 includes a housing 11, a main board (first board) 12, a CPU module 20, a control module 30, a CPU connection board 50, and a card connection board. 60 and a card module 40.

The housing 11 has a hollow box shape, and accommodates therein the main board 12, the CPU module 20, the control module 30, the CPU connection substrate 50, the card connection substrate 60, and the card module 40. The housing 11 is housed in a server rack (not shown). The housing 11 includes, for example, a fan unit 18 on the front end 11 f side. The fan unit 18 sends cooling air in the front-rear direction D1 from the front end 11f of the housing 11 toward the rear end 11r.

The main board 12 is flat and disposed along the top surface of the bottom plate 11 c of the housing 11.
As shown in FIGS. 3 to 5, the main board 12 is provided with

base connectors

15A and 15B on its upper surface. The CPU module 20 is detachably connected to the base connector 15A. The control module 30 is detachably connected to the base connector 15B. In the present embodiment, a plurality of

base connectors

15A and 15B are provided at intervals in the width direction D2 of the housing 11 orthogonal to the front-rear direction D1 connecting the front end 11f and the rear end 11r of the housing 11 (for example, 4) are arranged.

The CPU module 20 includes a module substrate (second substrate) 21, a CPU (Central Processing Unit: processor) 22, sockets (connection connectors) 23 and 24, and memories (electronic components) 25 and 26.

The module substrate 21 has a substantially rectangular plate shape, has a first surface 21 a on one side, and has a second surface 21 b on the opposite side to the first surface 21 a. The module substrate 21 is disposed on the main board 12 orthogonal to the top surface of the main board 12. The module substrate 21 is disposed along the longitudinal direction D1 along the longitudinal direction and along the vertical direction D3 orthogonal to the top surface of the main board 12 along the short direction.

As shown in FIG. 4, the module substrate 21 has a first connection terminal (connection terminal portion) 27 to the main board 12 at the outer peripheral portion. The first connection terminal 27 protrudes downward from the lower end of the substrate front end 21 f on the side of the front end 11 f of the housing 11 in the module substrate 21. The first connection terminal 27 is disposed on the module substrate 21 at a position different from the longitudinal center portion where the CPU 22 and the memory 25 described later are provided. The first connection terminal 27 is detachably connected to the base connector 15A on the upper surface of the main board 12. Thus, the module substrate 21 is connected to the upper surface (surface) of the main board 12 so as to be insertable and removable along the vertical direction D3. With the first connection terminal 27 connected to the base connector 15A, the module substrate 21 is positioned in a plane perpendicular to the top surface of the main board 12. For example, the

surfaces

21 a and 21 b of the module substrate 21 are orthogonal to the top surface of the main board 12. The plurality of module substrates 21 are positioned in parallel with each other at an interval in the width direction D2.

In addition, the module substrate 21 has a step-like notch 21 k at the lower part of the substrate rear end 21 r on the rear end 11 r side of the housing 11. The module substrate 21 has a second connection terminal 28 and a third connection terminal 29 in the notch 21 k.
The second connection terminal 28 is disposed at an interval in the vertical direction D3 with respect to the upper surface of the main board 12 in a state where the module board 21 is connected to the main board 12.
The third connection terminal 29 is disposed closer to the substrate rear end 21 r of the housing 11 than the second connection terminal 28. The third connection terminal 29 is arranged at an interval in the vertical direction D3 with respect to the upper surface of the main board 12 in a state in which the module board 21 is connected to the main board 12. Furthermore, the distance between the third connection terminal 29 and the upper surface of the main board 12 is larger than the distance between the second connection terminal 28 and the upper surface of the main board 12.

As shown in FIGS. 4 and 6, the CPU 22 is disposed at the central portion in the longitudinal direction and the lateral direction of the first surface 21 a of the module substrate 21. The CPU 22 is provided with a heat sink 19 on the side opposite to the side facing the module substrate 21.

A plurality of sockets 23 are disposed on the first surface 21 a of the module substrate 21. The plurality of sockets 23 are disposed on both sides of the CPU 22 in the vertical direction D3 (the short direction of the module substrate 21).
The memory 25 is disposed on the first surface 21 a of the module substrate 21. The memory 25 is inserted into and removed from the socket 23 provided on the first surface 21 a of the module substrate 21 in the direction orthogonal to the first surface 21 a of the module substrate 21. The memory 25 is a substantially rectangular plate, and is disposed with its thickness direction aligned with the vertical direction D3 and its longitudinal direction aligned with the front-rear direction D1.

A plurality of sockets 24 are disposed on the second surface 21 b of the module substrate 21. The sockets 24 are respectively disposed on both sides in the vertical direction D3 (the lateral direction of the module substrate 21) at the central portion in the longitudinal direction of the module substrate 21. The socket 24 is disposed to face the socket 23 disposed on the first surface 21 a of the module substrate 21.
The memory 26 is disposed on the second surface 21 b of the module substrate 21. The memory 26 can be inserted into and removed from the socket 24 provided on the second surface 21 b of the module substrate 21 in the direction orthogonal to the second surface 21 b of the module substrate 21. The memory 26 is in the form of a substantially rectangular plate, and the thickness direction thereof is aligned with the vertical direction D3 in the housing 11, and the longitudinal direction thereof is aligned with the front-rear direction D1.

The socket 23 provided on the first surface 21 a of the module substrate 21 and the socket 24 provided on the second surface 21 b of the module substrate 21 are provided at positions mutually offset in the vertical direction D3 with respect to the module substrate 21. . Specifically, the sockets 24 provided on the second surface 21 b of the module substrate 21 are provided between the sockets 23 adjacent to each other on the first surface 21 a of the module substrate 21.

As shown in FIG. 4, the module substrate 21 has a widening portion 21 w wider at both ends in the longitudinal direction at the central portion in the longitudinal direction. The CPU 22 and the socket 23 (memory 25) described above are arranged in the area where the wide portion 21w is formed in the longitudinal direction (front-rear direction D1) of the module substrate 21. That is, in the module board 21, in the part where the CPU 22 and the memory 25 are provided, the dimensions of the module board 21 in the insertion / removal direction (vertical direction D3) of the module board 21 with respect to the main board 12 large. For example, in the module substrate 21, the width in the vertical direction D3 of the portion where the CPU 22 and the memory 25 are provided is wider than the width of the other portions. As described above, by arranging the CPU 22 and the socket 23 in the area where the wide part 21 w is formed, the arrangement space for the CPU 22 and the socket 23 is secured while suppressing the height of the module substrate 21.

The CPU 22 and the memory 25 are arranged along the insertion / removal direction (vertical direction D3) of the module substrate 21. Thus, the plate-like memory 25 is located along the flow of the cooling air generated by the fan unit 18 and does not obstruct the flow of the cooling air that cools the CPU 22.

As shown in FIG. 3, the control module 30 includes a control substrate 31 and various electronic components (not shown) mounted on the control substrate 31.
The control substrate 31 has a substantially rectangular plate shape. The control board 31 is disposed on the main board 12 so as to be orthogonal to the upper surface of the main board 12. The control substrate 31 is disposed along the longitudinal direction D1 in the longitudinal direction and along the vertical direction D3 in the lateral direction.

The control board 31 has a connection terminal 32 to the main board 12 at the outer peripheral portion. The connection terminal 32 protrudes downward from the lower end of the substrate end 32 f on the front end 11 f side of the housing 11 in the control substrate 31. The connection terminal 32 is detachably connected to the base connector 15 B on the top surface of the main board 12. Thus, the control board 31 is connected to the upper surface of the main board 12 so as to be insertable and removable along the vertical direction D3. With the connection terminals 32 connected to the base connector 15 B, the control board 31 is located in a plane orthogonal to the top surface of the main board 12. For example, the surface of the control board 31 is orthogonal to the top surface of the main board 12. The plurality of control boards 31 are positioned in parallel with each other at an interval in the width direction D2. One control board 31 is provided as a pair for one module board 21. The control substrate 31 is disposed adjacent to the module substrate 21.

As shown in FIGS. 3 to 5, the CPU connection substrate 50 is disposed in parallel to the main board 12. The CPU connection substrate 50 has a substantially rectangular plate shape. The CPU connection substrate 50 is disposed with the longitudinal direction in the width direction D2 and the short direction in the front-rear direction D1. The CPU connection substrate 50 has smaller length dimensions in the front-rear direction D1 and the width direction D2 than the main board 12. That is, the CPU connection board 50 is smaller than the main board 12.
The CPU connection board 50 opposes the main board 12 in the vertical direction D3. The entire surface of the CPU connection substrate 50 faces the main board 12. Further, the CPU connection substrate 50 is offset from the main board 12 and the card connection substrate 60 in the front-rear direction D1 along the surface of the main board 12.
The CPU connection board 50 connects a plurality of module boards 21 to each other. For this reason, the CPU connection substrate 50 is provided with a plurality of substrate connectors 51 arranged on the top surface at intervals in the width direction D2. In each board connector 51, the second connection terminal 28 of each module board 21 is detachably connected in the vertical direction D3. The CPU connection board 50 electrically connects the CPUs 22 mounted on a plurality of module boards 21.

The card connection board 60 is disposed in parallel with the main board 12. The card connection substrate 60 is provided at a position where a part of the surface 60 f on the front end 11 f side of the housing 11 faces a part of the main board 12. In the card connection substrate 60, a surface 60r on the rear end 11r side of the housing 11 extends further rearward than the main board 12. In this manner, the card connection substrate 60 is offset from the main board 12 in the front-rear direction D1 along the surface of the main board 12.
The card connection board 60 is connected to the module board 21 behind the position of the CPU 22 of the module board 21. The card connection boards 60 have different positions in the vertical direction D3 (direction of insertion and removal with respect to the module board 21) with respect to the main board 12 and the CPU connection board 50. Specifically, the distance between the card connection board 60 and the main board 12 is larger than that of the CPU connection board 50.
The card connection substrate 60 includes a plurality of substrate connectors 61 disposed on the top surface of the housing 11 on the front end 11 f side with an interval in the width direction D 2. In each board connector 61, the third connection terminal 29 of each module board 21 is detachably connected in the vertical direction D3.
In addition, the card connection substrate 60 includes a plurality of card slots 62 disposed on the upper surface of the rear end 11r side of the housing 11 at intervals in the width direction D2. Each card slot 62 is connected with a card substrate 41 of a card module 40 described later.

Thus, the main board 12 is connected to the module substrate 21 at the first connection terminal 27 in front of the position of the CPU 22 of the module substrate 21. Further, the CPU connection substrate 50 and the card connection substrate 60 are connected to the module substrate 21 at the second connection terminals 28 and the third connection terminals 29 behind the position of the CPU 22 of the module substrate 21.
Also, the module board 21 is connected to the main board 12 on the upstream side in the flow direction of the cooling air by the fan unit 18. The CPU connection substrate 50 and the card connection substrate 60 are disposed downstream of the position of the CPU 22 in the flow direction of the cooling air by the fan unit 18.

The card module 40 includes a card substrate 41 and various electronic components (not shown) mounted on the card substrate 41. The card module 40 configures, for example, an expansion card such as a PCI (Peripheral Component Interconnect) card.

The card substrate 41 has a substantially rectangular plate shape. The card substrate 41 is disposed on the card connection substrate 60 orthogonal to the upper surface of the card connection substrate 60. The card substrate 41 is disposed with the longitudinal direction along the longitudinal direction D1 and the short direction along the vertical direction D3.

The card substrate 41 has a substrate connection terminal 42 to the card connection substrate 60 at the outer peripheral portion. The substrate connection terminal 42 protrudes downward from the lower end of the substrate end 41 r on the side of the rear end 11 r of the housing 11 in the card substrate 41. The board connection terminal 42 is detachably connected to the card slot 62 on the upper surface of the card connection board 60. Thereby, the card substrate 41 is connected to the upper surface of the card connection substrate 60 so as to be insertable in and removable from in the vertical direction D3. With the substrate connection terminal 42 connected to the card slot 62, the card substrate 41 is positioned in a plane orthogonal to the upper surface of the main board 12. For example, the surface of the card substrate 41 is orthogonal to the upper surface of the main board 12. The plurality of card substrates 41 are positioned in parallel with each other at an interval in the width direction D2.

In the server 10 as described above, a total of four sets of the CPU module 20, the control module 30, and the card module 40 are arranged. A total of four sets of CPU modules 20, control modules 30, and card modules 40 are arranged symmetrically in two in the width direction D2.
Also, for example, the server 10 may normally use two sets of the CPU module 20, the control module 30, and the card module 40 among the four sets. In this case, in the server 10, the remaining two sets of the CPU module 20, the control module 30, and the card module 40 among the four sets may be reserved (for backup). That is, the remaining two sets of CPU module 20, control module 30, and card module 40 are used only when one of the two sets of CPU module 20, control module 30, and card module 40 used in normal operation has failed, etc. It may be done. Further, for example, among the CPU module 20, the control module 30, and the card module 40, all of the CPU module 20 and the card module 40 are normally used, and a part of the control module 30 is normally used. It may be divided into
At least one set of the CPU module 20, the control module 30, and the card module 40 to be reserved may be used, and the remaining three sets may be normally used.

In such a server 10, the module substrate 21 has

sockets

23 and 24 to which the

memories

25 and 26 can be connected on both the first surface 21a and the second surface 21b. As described above, by making it possible to mount the

memories

25 and 26 on both sides of the module substrate 21, it is possible to suppress the enlargement of the module substrate 21 even if the number of the

memories

25 and 26 to be mounted increases. As a result, the increase in size of the server 10 can be suppressed.

In such a server 10, the socket 23 provided on the first surface 21a of the module substrate 21 and the socket 24 provided on the second surface 21b of the module substrate 21 are provided at mutually offset positions with respect to the module substrate 21. It is done. The socket 23 and the socket 24 are provided, for example, at mutually offset positions in the vertical direction (height direction) D3 of the surface of the module substrate 21. As described above, in the case where a plurality of module boards 21 are provided by shifting the

sockets

23 and 24 on both sides of the module board 21, one module board 21 is provided in a portion where two adjacent module boards 21 face each other. Interference between the memory 25 mounted on the first surface 21 a and the memory 26 mounted on the second surface 21 b of the other module substrate 21 can be suppressed. As a result, the distance between the module substrates 21 can be narrowed, and the enlargement of the server 10 can be suppressed.

In such a server 10, a plurality of

sockets

23 and 24 are provided on the first surface 21a and the second surface 21b of the module substrate 21, respectively. As a result, the number of

memories

25 and 26 mounted on both sides of the module substrate 21 can be increased.

In such a server 10, the module substrate 21 includes a CPU 22 and memories 25 disposed on both sides of the CPU 22, respectively. Thereby, in each module substrate 21, the line length of the wiring pattern connecting the CPU 22 and the memory 25 can be suppressed.
Furthermore, the module substrate 21 includes the memory 26 on the second surface 21 b opposite to the first surface 21 a on which the CPU 22 is mounted. Thereby, in each module substrate 21, the line length of the wiring pattern connecting the CPU and the memory 26 can be suppressed.
Further, if the CPU module 20 is attached to and detached from the main board 12, the CPU 22 and the

memories

25 and 26 can be replaced simultaneously, thereby enhancing maintainability.

In such a server 10, at least one of the plurality of module substrates 21 is reserved. Thereby, the redundancy of the server 10 can be enhanced. Further, by providing a plurality of module substrates 21, each module substrate 21 can be functioned independently.

In such a server 10, the CPU 22 and the memory 25 are arranged along the insertion / removal direction (vertical direction D3) of the module substrate 21. For example, the CPU 22 and the memory 25 are arranged at different heights in the vertical direction D3. Thereby, it is possible to prevent the memory 25 from blocking the cooling air generated in the direction along the surface of the main board 12 and generated by the fan unit 18. As a result, the cooling performance of the CPU 22 is enhanced.

In such a server 10, in the module substrate 21, the portion where the CPU 22 and the memory 25 are provided has a larger dimension of the module substrate 21 in the insertion and removal direction of the module substrate 21 than the other portions of the module substrate 21. Thus, the CPU 22 and the memory 25 can be disposed while suppressing the height of the module substrate 21 by increasing the width of the module substrate 21 in the portion where the CPU 22 and the memory 25 are provided.

In such a server 10, the module substrate 21 has the first connection terminal 27 to the main board 12 at the outer peripheral portion of the module substrate 21. For example, the module board 21 has a first connection terminal 27 to the main board 12 at a portion facing the main board 12 of the outer peripheral portion of the module board 21. Thus, the module board 21 can be easily attached to and detached from the main board 12.

In such a server 10, the first connection terminal 27 is provided on the module substrate 21 at a position different from that of the wide portion 21w in which the CPU 22 and the memory 25 are provided. For example, the first connection terminal 27 is provided at a position different from the position where the widened portion 21 w is provided in the front-rear direction D1 of the module substrate 21. As a result, the portion where the CPU 22 and the memory 25 are provided can be prevented from becoming smaller because the first connection terminal 27 is provided.

In the above embodiment, the server 10 includes the CPU module 20, the control module 30, and the card module 40 on the main board 12. However, the application, the component configuration, the number of equipment, etc. are not limited. It is not something to do.
The server 10 includes the CPU connection board 50 and the card connection board 60. However, the CPU connection board 50 and the card connection board 60 are not essential components, and the functions of the CPU connection board 50 and the card connection board 60 May be provided on the main board 12.
In addition to this, it is possible to select the configuration described in the above-described embodiment or to appropriately change it to another configuration without departing from the gist of the present invention.

This application claims priority based on Japanese Patent Application No. 2017-172383 filed in Japan on September 7, 2017, the entire disclosure of which is incorporated herein.

DESCRIPTION OF SYMBOLS 1 1st board | substrate 2 2nd board | substrate 2a 1st surface 2b 2nd surface 3 connector 4 electronic component 5 electronic device 10 server (electronic device)
12 Main board (first board)
21 Module board (second board)
21a first surface 21b second surface 22 CPU (processor)
23, 24 socket (connector)
25, 26 Memory (electronic parts)
27 First connection terminal (connection terminal section)

Claims

A first substrate,
A second substrate removably connected to the surface of the first substrate;
The electronic apparatus according to the present invention, wherein the second substrate has a connection connector to which an electronic component can be connected to both the first surface and the second surface.
The first connection connector provided on the first surface of the second substrate and the second connection connector provided on the second surface of the second substrate are different from the second substrate with respect to the second substrate The electronic device according to claim 1, wherein the electronic device is provided at positions mutually offset.
A plurality of the connection connectors are provided on the first surface and the second surface of the second substrate, respectively.
The electronic device according to claim 2.
The second substrate is
A processor mounted on the second substrate;
A memory as the electronic component which is respectively disposed on both sides of the processor and detachably connected to the connection connector;
The electronic device according to any one of claims 1 to 3, comprising:
A plurality of the second substrates are connected to the first substrate;
The electronic device according to claim 4, wherein at least one of the plurality of second substrates is reserved.
The electronic device according to claim 4, wherein the processor and the memory are arranged along the insertion / removal direction of the second substrate.
In the second substrate, a portion provided with the processor and the memory has a dimension of the second substrate larger in the insertion and removal direction of the second substrate than the other portion of the second substrate. Item 7. The electronic device according to any one of items 4 to 6.
The electronic device according to any one of claims 5 to 7, wherein the second substrate has a connection terminal portion to the first substrate at an outer peripheral portion of the second substrate.
The electronic device according to claim 8, wherein the connection terminal portion is provided at a position different from a portion where the processor and the memory are provided on the second substrate.