CN212277180U - Solid state source and cooking device - Google Patents

Abstract

The utility model belongs to the technical field of cooking equipment, concretely relates to solid-state source and have cooking equipment of this solid-state source. The utility model provides a solid-state source is equipped with heating element including printing plate, base plate and radiator on the printing plate, and the base plate is connected with the printing plate, and the base plate laminates mutually and carries out heat-conduction with at least partial heating element, and the surface of radiator is equipped with the installation cavity, and the installation cavity is located to the base plate at least part, and the base plate laminates mutually and carries out heat-conduction with the bottom surface of installation cavity. According to the utility model provides a solid-state source can be effectively with the direct conduction of the heat that heating element during operation produced to the base plate in to with the direct conduction of heat on the base plate to the radiator, the setting of base plate has still increased the heat radiating area between heating element and the radiator simultaneously, has improved the heat dissipation height of radiator, has increased radiator and cooling air flow's area of contact, thereby has improved the whole heat-sinking capability in solid-state source effectively, guarantees the reliability in the solid-state source working process.

Description

Solid state source and cooking device

Technical Field

The utility model belongs to the technical field of cooking equipment, concretely relates to solid-state source and have cooking equipment of this solid-state source.

Background

In the existing microwave heating equipment, a magnetron is mainly used for outputting microwaves, so that the food is cooked. However, the novel solid-state source is not applied to the cooking device in a large scale, and the main reason is that the amplification part of the radio frequency circuit, especially the position of the power chip, generates a large amount of heat during the working process of the solid-state source, and if the heat cannot be dissipated in time, the efficiency and the service life of the chip are affected, and the performance index of the solid-state source is reduced.

Disclosure of Invention

The utility model aims at solving the problem that the solid-state source can not effectively radiate in the working process at least. This object is achieved by:

a first aspect of the present invention provides a solid-state source, comprising:

the printing plate is provided with a heating element;

the substrate is connected with the printing plate, and is attached to at least part of the heating element and conducts heat;

the radiator, the surface of radiator is equipped with the installation cavity, the base plate is at least partly located in the installation cavity, the base plate with the bottom surface of installation cavity is laminated mutually and is carried out heat-conduction.

According to the solid-state source of the utility model, the heating element on the printing plate is jointed with the substrate and heat conduction is carried out, so that the heat generated by the heating element during working can be effectively and directly conducted into the substrate, meanwhile, the substrate is arranged in the mounting cavity on the surface of the radiator and is jointed with the bottom surface of the mounting cavity for heat conduction, thereby effectively transferring the heat on the substrate to the radiator, simultaneously increasing the heat dissipation area between the heating element and the radiator due to the arrangement of the substrate, improving the heat conduction efficiency between the heating element and the radiator, and simultaneously placing at least part of the substrate in the mounting cavity, under the condition of ensuring that the integral height of the solid source is not changed, the heat dissipation height of the radiator is improved, the contact area between the radiator and cooling air flow is increased, therefore, the integral heat dissipation capacity of the solid-state source is effectively improved, and the reliability of the solid-state source in the working process is ensured.

In addition, according to the solid-state source of the present invention, the following additional technical features may be provided:

in some embodiments of the present invention, the heating element includes a radio frequency power chip, and the substrate is attached to the radio frequency power chip for heat conduction.

In some embodiments of the present invention, the rf power chip is welded to the substrate.

In some embodiments of the invention, the substrate is a copper plate, an aluminum plate, or an alloy plate.

In some embodiments of the present invention, the printing plate is attached to the substrate by welding, bonding, or bolting.

In some embodiments of the present invention, the heat sink is an aluminum member or an alloy member, and the heat sink is provided with a plurality of heat dissipation racks arranged at intervals.

In some embodiments of the present invention, the solid-state source further comprises a box body and a cover plate, the box body cover is disposed outside the printing plate, the cover plate cover is disposed outside the box body, the cover plate and the printing plate surround to form an enclosed space for shielding the high-frequency signal of the solid-state source.

In some embodiments of the present invention, the box body is frame-shaped and has a first opening end and a second opening end which are arranged relatively, the cover plate is connected to the first opening end, and the heat sink is connected to the second opening end.

In some embodiments of the present invention, the surface of the heat sink is further provided with a mounting groove, and a portion of the printing plate is disposed inside the mounting groove.

The utility model discloses an on the other hand has still provided a cooking equipment, cooking equipment includes:

a wind scooper;

the solid state source is arranged in the wind scooper;

and the air outlet of the fan is communicated with the inside of the air guide cover.

Drawings

Various other advantages and benefits will become apparent to those of ordinary skill in the art upon reading the following detailed description of the preferred embodiments. The drawings are only for purposes of illustrating the preferred embodiments and are not to be construed as limiting the invention. Also, like parts are designated by like reference numerals throughout the drawings. Wherein:

fig. 1 is a schematic diagram of a partial structure of a solid-state source according to an embodiment of the present invention;

FIG. 2 is an exploded view of the solid state source of FIG. 1;

FIG. 3 is a schematic view of a portion of the substrate assembly of FIG. 1;

FIG. 4 is a schematic cross-sectional view of the solid-state source of FIG. 1;

fig. 5 is an exploded view of the cross-sectional structure of the solid-state source of fig. 4.

The reference numerals in the drawings denote the following:

100: a solid state source;

10: printing plate, 11: a radio frequency power chip;

20: a substrate;

30: heat sink, 31: mounting cavity, 32: a heat dissipation rack;

40: a box body, 41: first open end, 42: a second open end;

50: and (7) a cover plate.

Detailed Description

Exemplary embodiments of the present invention will be described in more detail below with reference to the accompanying drawings. While exemplary embodiments of the present invention are shown in the drawings, it should be understood that the present invention may be embodied in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art.

It is to be understood that the terminology used herein is for the purpose of describing particular example embodiments only, and is not intended to be limiting. As used herein, the singular forms "a", "an" and "the" may be intended to include the plural forms as well, unless the context clearly indicates otherwise. The terms "comprises," "comprising," "including," and "having" are inclusive and therefore specify the presence of stated features, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, steps, operations, elements, components, and/or groups thereof. The method steps, processes, and operations described herein are not to be construed as necessarily requiring their performance in the particular order described or illustrated, unless specifically identified as an order of performance. It should also be understood that additional or alternative steps may be used.

Although the terms first, second, third, etc. may be used herein to describe various elements, components, regions, layers and/or sections, these elements, components, regions, layers and/or sections should not be limited by these terms. These terms may be only used to distinguish one element, component, region, layer or section from another region, layer or section. Terms such as "first," "second," and other numerical terms when used herein do not imply a sequence or order unless clearly indicated by the context. Thus, a first element, component, region, layer or section discussed below could be termed a second element, component, region, layer or section without departing from the teachings of the example embodiments.

For convenience of description, spatially relative terms, such as "inner", "outer", "lower", "below", "upper", "above", and the like, may be used herein to describe one element or feature's relationship to another element or feature as illustrated in the figures. Such spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, elements described as "below" or "beneath" other elements or features would then be oriented "above" or "over" the other elements or features. Thus, the example term "below … …" can include both an orientation of above and below. The device may be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.

Referring to fig. 1 to 5, a solid-state source 100 in this embodiment includes a printed board 10, a substrate 20, and a heat sink 30, a heating element is disposed on the printed board 10, the substrate 20 is connected to the printed board 10, the substrate 20 is attached to at least a portion of the heating element and conducts heat, a mounting cavity 31 is disposed on a surface of the heat sink 30, the substrate 20 is at least partially disposed in the mounting cavity 31, and the substrate 20 is attached to a bottom surface of the mounting cavity 31 and conducts heat.

According to the solid-state source 100 of the present invention, the heating element on the printing plate 10 is attached to the substrate 20 and conducts heat, so that the heat generated by the heating element during operation can be conducted to the substrate 20 quickly and efficiently, and the substrate 20 is disposed in the mounting cavity 31 on the surface of the heat sink 30 and attached to the bottom surface of the mounting cavity 31 and conducts heat, so that the heat on the substrate 20 is conducted to the heat sink 31 quickly and efficiently, and the substrate 20 increases the heat dissipation area between the heating element and the heat sink 30, thereby improving the heat conduction efficiency between the heating element and the heat sink 30, and at least part of the substrate 20 is disposed in the mounting cavity 31, so as to improve the heat dissipation height of the heat sink 30 and the contact area between the heat sink 30 and the cooling air flow, while ensuring that the overall height of the solid-state source 100 is not changed, thereby effectively improving the overall heat dissipation capability of the solid-state source 100, ensuring reliability in the operation of the solid state source 100.

In the present embodiment, the substrate 20 is made of copper plate, aluminum plate or alloy plate with high thermal conductivity, preferably copper plate, and is disposed in the mounting cavity 31, so that heat generated by the heating element during operation can be quickly and effectively conducted to the heat sink 30, and the heat sink 30 can effectively dissipate heat, thereby preventing the operating performance of the solid-state source 100 from being lowered due to the fact that the temperature inside the solid-state source is too high and the heat cannot be effectively dissipated.

The heat sink 30 in the present embodiment is an aluminum member or an alloy member, and can conduct heat rapidly and efficiently with the substrate 20. And the radiator 30 is provided with a plurality of heat dissipation racks 32 arranged at intervals, and heat dissipation tooth grooves are formed among the plurality of heat dissipation racks 32, so that the contact area between the radiator 30 and cooling air flow is further increased, and the purpose of quickly and effectively dissipating heat is achieved.

The heating element in this embodiment includes the rf power chip 11 and other heating elements, wherein the heat release of the rf power chip 11 is much greater than that of other heating elements, so as to ensure effective heat dissipation of the solid-state source 100, the substrate 20 in this embodiment is at least attached to the rf power chip 11 for heat conduction, so that the heat of the rf power chip 11 with the maximum heat release on the printed board 10 is quickly conducted to the heat sink 30 through the substrate 20, and is dissipated through the heat sink 30, thereby quickly and effectively dissipating heat of the solid-state source 100. Because the cost of copper is high and the heat dissipation of the rf power chip 11 is the largest, it is the simplest and most economical heat dissipation structure to attach the substrate 20 to the rf power chip 11. Of course, in other embodiments of the present application, the substrate 20 may be covered on the surface of the printed board 10, so that the rf power chip 11, the supply circuit of the rf power chip 11, and other heating elements are simultaneously attached to the substrate 20 for heat conduction, and further the solid-state source 100 is rapidly and effectively dissipated.

In this embodiment, the rf power chip 11 is soldered on the substrate, so as to ensure that the rf power chip 11 is completely attached to the substrate 20, and prevent the rf power chip 11 from being separated from the substrate 20 due to heat deformation, thereby reducing the heat conduction efficiency between the rf power chip 11 and the substrate 20 and affecting the heat dissipation effect of the solid-state source 100.

In the present embodiment, the printed board 10 is bonded to the board 20 by soldering, bonding, or bolting, and forms a board assembly with the board 20, and the board assembly thus produced is assembled with the heat sink 30 as shown in fig. 3. Wherein, clearance fit is adopted between the mounting cavity 31 and the substrate 20. Before assembly, the substrate 20 may be coated with a heat conductive silicone grease and then placed in the mounting cavity 31, so that the substrate 20 may be mounted conveniently, and the periphery of the substrate 20 may be in contact with the inner wall of the mounting cavity 31 to conduct heat.

In this embodiment, the top of the heat sink 30 is further provided with a plurality of baffles protruding along the edge, the plurality of baffles surround to form a mounting groove for mounting the printing plate 10, when the substrate assembly is assembled with the heat sink 30, the printing plate 10 is disposed in the mounting groove, the periphery of the printing plate 10 contacts with the inner wall of the mounting groove and conducts heat, and thus the heat dissipation effect of the solid-state source 100 is further improved.

The solid-state source 100 in this embodiment further includes a box 40 and a cover 50, the box 40 is sleeved outside the printing plate 10, the cover 50 is covered outside the box 40, and the box 40, the cover 50 and the printing plate 10 enclose a closed space to shield the high-frequency signal of the solid-state source 100, so as to prevent the high-frequency signal from affecting the normal use of other components.

Specifically, the box body 40 in this embodiment is frame-shaped and has a first opening end 41 and a second opening end 42 that are oppositely arranged, the cover plate 50 is disposed at the first opening end 41 and connected to the first opening end 41 through a bolt, the heat sink 30 is disposed at the second opening end 42 and connected to a side surface of the heat sink 30 and a side surface of the second opening end 42 through a bolt, so that the printed board 10 with the rf power chip 11 is completely located in the containing space of the box body 40, and further, the high-frequency signal is effectively shielded.

In the assembly process, the rf power chip 11 and other heating elements are first soldered to the printed board 10 to form the printed board 10 with heating elements, and then the printed board 10 with heating elements is soldered to the substrate 20, so that the printed board 10, the rf power chip 11 and the substrate 20 are closely attached to form the substrate assembly. The substrate assembly is closely attached to the heat sink 30 by means of bolt connection, and the substrate 20 just falls into the mounting cavity 31 of the heat sink 30, and then the box body 40 and the cover plate 50 are added to form the solid state source 100.

Another aspect of the present invention also provides a cooking apparatus having the solid state source 100 of any of the above embodiments.

According to the cooking device in the present application, the heating element on the printed board 10 of the solid-state source 100 is attached to the substrate 20 and conducts heat, so that heat generated by the heating element during operation can be quickly and effectively conducted to the substrate 20, the substrate 20 is disposed in the mounting cavity 31 on the surface of the heat sink 30 and attached to the bottom surface of the mounting cavity 31 and conducts heat, so that heat on the substrate 20 is quickly and effectively conducted to the heat sink 31, the arrangement of the substrate 20 increases the heat dissipation area between the heating element and the heat sink 30, improves the heat conduction efficiency between the heating element and the heat sink 30, and places at least a part of the substrate 20 in the mounting cavity 31, so as to improve the heat dissipation height of the heat sink 30 and increase the contact area between the heat sink 30 and the cooling airflow without changing the overall height of the solid-state source 100, therefore, the overall heat dissipation capability of the solid-state source 100 is effectively improved, and the reliability of the solid-state source 100 in the working process is ensured.

The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope of the present invention should be covered by the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.

Claims (10)

1. A solid state source, comprising:

the printing plate is provided with a heating element;

the substrate is connected with the printing plate, and is attached to at least part of the heating element and conducts heat;

the radiator, the surface of radiator is equipped with the installation cavity, the base plate is at least partly located in the installation cavity, the base plate with the bottom surface of installation cavity is laminated mutually and is carried out heat-conduction.

2. The solid state source of claim 1, wherein the heating element comprises a radio frequency power chip, and the substrate is in thermal communication with the radio frequency power chip.

3. The solid state source of claim 2, wherein the rf power chip is soldered to the substrate.

4. The solid state source of claim 1, wherein the substrate is a copper, aluminum or alloy plate.

5. The solid state source of claim 1, wherein the printing plate is attached snugly to the substrate by welding, gluing or bolting.

6. The solid state source of claim 1, wherein the heat sink is an aluminum or alloy member, the heat sink being provided with a plurality of spaced apart heat sink splines.

7. The solid state source of claim 1, further comprising a casing and a cover, wherein the casing is disposed outside the printing plate, the cover is disposed outside the casing, and the casing, the cover and the printing plate enclose an enclosed space to shield a high frequency signal of the solid state source.

8. The solid state source of claim 7, wherein the enclosure is frame-shaped and has a first open end and a second open end disposed opposite one another, the cover plate being coupled to the first open end, and the heat sink being coupled to the second open end.

9. The solid state source of claim 1, wherein the surface of the heat sink is further provided with a mounting slot, a portion of the printed board being disposed inside the mounting slot.

10. A cooking apparatus, characterized by comprising:

a wind scooper;

the solid state source of any one of claims 1 to 9, disposed inside the wind scooper;

and the air outlet of the fan is communicated with the inside of the air guide cover.

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