TWI849674B - Printed circuit board having dummy core and method for producing the same - Google Patents

Abstract

The present disclosure provides a printed circuit board that includes a first circuit structure formed by one-time lamination and a second circuit structure formed by second-time lamination. The first circuit structure has a first board thickness. The second circuit structure includes a dummy core and a high-frequency circuit structure. The first circuit structure and the second circuit structure are laminated with each other through third-time lamination so as to form the printed circuit board. The dummy core is disposed between the first circuit structure and the high-frequency circuit structure. The high-frequency circuit structure has a second board thickness, and the dummy core has a third board thickness. The first board thickness is defined as D1, the second board thickness is defined as D2, and the third board thickness is defined as D3. D1~D3 satisfy the following relationship: 0.8*(D1-D2) ≤ D3 ≤ 1.2*(D1-D2). The present disclosure also provides a method for producing the printed circuit board.

Description

Printed circuit board with auxiliary substrate and manufacturing method thereof

The present invention relates to a circuit board and a manufacturing method thereof, and in particular to a printed circuit board with an auxiliary substrate and a manufacturing method thereof.

As shown in FIG. 3 , in the prior art, a printed circuit board including high-frequency materials can be applied to terminal application products with high-frequency requirements.

Under certain product design requirements, the printed circuit board needs to be designed with a blind hole structure. However, the primary pressed circuit structure 200A and the secondary pressed circuit structure 200B formed by secondary pressing included in the printed circuit board have an asymmetric plate structure. The thickness of the primary pressed circuit structure 200A is significantly greater than the thickness of the secondary pressed circuit structure 200B. Among them, the secondary pressed circuit structure 200B has a high-frequency material.

The printed circuit board with mixed pressing materials has a serious problem of board warping after the pressing operation. The board warping height may reach 40 mm, thus causing troubles to the product application end.

The technical problem to be solved by the present invention is to provide a printed circuit board with an auxiliary substrate and a manufacturing method thereof in view of the shortcomings of the prior art, which can effectively solve the problem of board bending that may occur after the pressing operation of the printed circuit board with mixed pressing materials in the prior art.

In order to solve the above technical problems, one of the technical solutions adopted by the present invention is to provide a printed circuit board with an auxiliary substrate, which includes: a first circuit structure, which is formed by a single press; wherein the first circuit structure has a first plate thickness; and a second circuit structure, which is formed by a second press; wherein the second circuit structure includes an auxiliary substrate (dummy core) and a high-frequency circuit structure; wherein the first circuit structure and the second circuit structure are superimposed on each other by three presses to form the printed circuit board, and the auxiliary substrate is arranged between the first circuit structure and the high-frequency circuit structure.

The high-frequency circuit structure has a second plate thickness, and the auxiliary substrate has a third plate thickness; the first plate thickness is defined as D1, the second plate thickness is defined as D2, and the third plate thickness is defined as D3; D1~D3 satisfy the following relationship: 0.8*(D1-D2) ≤ D3 ≤ 1.2*(D1-D2).

In order to solve the above technical problems, another technical solution adopted by the present invention is to provide a manufacturing method of a printed circuit board with an auxiliary substrate, which includes: performing a first pressing operation to form a first circuit structure after a single pressing; wherein the first circuit structure has a first plate thickness; performing a second pressing operation to form a second circuit structure after a second pressing; wherein the second circuit structure includes an auxiliary substrate (dummy core) and a high-frequency circuit structure; and performing a third pressing operation to overlap the first circuit structure and the second circuit structure with each other through three pressings, thereby forming a printed circuit board; wherein, in the printed circuit board, the auxiliary substrate is arranged between the first circuit structure and the high-frequency circuit structure.

The high-frequency circuit structure has a second plate thickness, and the auxiliary substrate has a third plate thickness; the first plate thickness is defined as D1, the second plate thickness is defined as D2, and the third plate thickness is defined as D3; D1~D3 satisfy the following relationship: 0.8*(D1-D2) ≤ D3 ≤ 1.2*(D1-D2).

The beneficial effect of the present invention is that the printed circuit board with an auxiliary substrate and the manufacturing method thereof provided by the present invention can be formed by "a first circuit structure, the first circuit structure is formed by a single press; wherein the first circuit structure has a first plate thickness; and a second circuit structure, the second circuit structure is formed by a secondary press; wherein the second circuit structure includes an auxiliary substrate (dummy core) and a high-frequency circuit structure; wherein the first circuit structure and the second circuit structure are laminated to each other by three times of pressing to form the printed circuit board, and the auxiliary substrate is arranged between the first circuit structure and the high-frequency circuit structure; wherein the high-frequency circuit structure has a second plate thickness, and the auxiliary substrate has a third plate thickness" and "the first plate thickness is defined as D1, the second plate thickness is defined as D2, and the third plate thickness is defined as D3; wherein D1~D3 satisfy the following relationship: 0.8*(D1-D2) ≤ D3 ≤ 1.2*(D1-D2)” technical solution makes it easy for printed circuit boards with high-frequency mixed pressing materials to not have board bending problems after the pressing operation, and can meet the requirements of printed circuit boards with blind hole structures under special specifications.

To further understand the features and technical contents of the present invention, please refer to the following detailed description and drawings of the present invention. However, the drawings provided are only used for reference and description and are not used to limit the present invention.

The following is a specific embodiment to illustrate the implementation method disclosed by the present invention. The technical personnel in this field can understand the advantages and effects of the present invention from the content disclosed in this specification. The present invention can be implemented or applied through other different specific embodiments. The details in this specification can also be modified and changed in various ways based on different viewpoints and applications without deviating from the concept of the present invention. In addition, the drawings of the present invention are only for simple schematic illustration and are not depicted according to actual size. Please note in advance. The following implementation method will further explain the relevant technical content of the present invention in detail, but the disclosed content is not used to limit the scope of protection of the present invention.

It should be understood that, although the terms "first", "second", "third", etc. may be used in this document to describe various components or signals, these components or signals should not be limited by these terms. These terms are mainly used to distinguish one component from another component, or one signal from another signal. In addition, the term "or" used in this document may include any one or more combinations of the related listed items depending on the actual situation.

[Printed circuit board with auxiliary substrate]

Referring to FIG. 1 , the embodiment of the present invention provides a printed circuit board 100 with an auxiliary substrate, which includes a first circuit structure 1 and a second circuit structure 2 stacked on each other. The printed circuit board of the embodiment of the present invention can meet the customer's demand for products with high-frequency mixed-pressure materials and need to have a blind hole structure, and can further solve the problem of board bending. The specific structural features of the first circuit structure 1 and the second circuit structure 2 and the connection relationship between them will be specifically described below.

The first circuit structure 1 is formed by one pressing. The first circuit structure 1 has a first board thickness D1. More specifically, the first circuit structure 1 includes a plurality of core boards 11 stacked on each other, and a first circuit pattern 12 is formed on both side surfaces of each core board 11. In other words, both side surfaces of each core board 11 are paved with two first circuit patterns 12 respectively. Therefore, the first circuit structure 1 has multiple layers of first circuit patterns 12 corresponding to the number of core boards 11. The number of layers of the first circuit pattern 12 is usually twice the number of core boards 11, but the present invention is not limited thereto. Furthermore, any two adjacent core boards 11 (including first circuit patterns 12 facing each other) are bonded to each other through a first adhesive layer 13. That is to say, the first circuit structure 1 also has multiple first adhesive layers 13 corresponding to the number of core boards 11.

More specifically, the first circuit structure 1 is formed by laminating the plurality of core boards 11, the plurality of first circuit patterns 12, and the plurality of first adhesive layers 13 together through the one-time lamination.

The core board 11 may also be referred to as a core. The material of the core board 11 may be, for example, a glass fiber cloth (such as FR-4), which is a non-high-frequency material, but the present invention is not limited thereto. In addition, the first adhesive layer 13 is used to adhere two adjacent core boards 11, and the material of the first adhesive layer 13 may be, for example, a semi-cured adhesive sheet (such as Prepreg, PP glue). In addition, the two first circuit patterns 12 respectively formed on the two side surfaces of the core board 11 may be, for example, formed by metal copper foil through circuit etching, but are not limited thereto.

Specifically, the first circuit structure 1 has a drill hole 14, an inner wall of the drill hole 14 is formed with an electroplated conductive layer 15 that can electrically connect multiple layers of the first circuit patterns 12, and an inner space surrounded by the electroplated conductive layer 15 is filled with a resin material 17.

The drill hole 14 is formed by penetrating the plurality of core plates 11, the plurality of first circuit patterns 12, and the plurality of first adhesive layers 13 of the first circuit structure 1, and the drill hole 14 is formed by penetrating the top and bottom surfaces of the first circuit structure 1. The drill hole 14 can be formed, for example, by mechanical drilling, but the present invention is not limited thereto.

The material of the electroplated conductive layer 15 can be, for example, copper metal, and the electroplated conductive layer 15 can be, for example, formed by electroplating, but the present invention is not limited thereto. In addition, the electroplated conductive layer 15 is not only formed on the inner wall of the drill hole 14, but also extends to the outer surface of the first circuit structure 1 to form a circuit pattern on the surface. Furthermore, the resin material 17 can be, for example, epoxy resin, but the present invention is not limited thereto.

Please continue to refer to FIG. 1 , the second circuit structure 2 is formed by secondary pressing. The second circuit structure 2 includes an auxiliary substrate 21 (dummy core) and a high-frequency circuit structure 22. In other words, the second circuit structure 2 is formed by secondary pressing the auxiliary substrate 21 and the high-frequency circuit structure 22.

More specifically, in the second circuit structure 2, the auxiliary substrate 21 and the high-frequency circuit structure 22 are stacked together through the secondary lamination. The high-frequency circuit structure 22 is bonded to the auxiliary substrate 21 through its second adhesive layer 223. The auxiliary substrate 21 is a blank substrate, which does not have any circuit pattern formed by a photolithography process.

Furthermore, in the second circuit structure 2, the high-frequency circuit structure 22 includes at least one high-frequency core substrate 221, and a second circuit pattern 222 is formed on each of the two side surfaces of the high-frequency core substrate 221, and the high-frequency core substrate 221 and the second circuit pattern 222 are attached to the auxiliary substrate 21 through the second adhesive layer 223. In other words, two second circuit patterns 222 are formed on the two side surfaces of the high-frequency core substrate 221. This embodiment is illustrated by the number of high-frequency core substrates 221 being one and the number of second circuit patterns 222 being two layers, but the present invention is not limited thereto. The number of the high-frequency core substrates 221 and the number of the second circuit patterns 222 can vary according to design requirements, and the present invention is not limited thereto.

It is worth mentioning that the auxiliary substrate 21 has a third adhesive layer 21a on one side of the surface facing the first circuit structure 1, and the auxiliary substrate 21 can be attached to the first circuit structure 1 through the third adhesive layer 21a. In other words, the first circuit structure 1 and the second circuit structure 2 are attached to each other through the third adhesive layer 21a and three times of lamination.

In the second circuit structure 2, the main material constituting the high-frequency core substrate 221 includes at least one of Teflon (PTFE) and polyphenylene oxide (PPO), but the present invention is not limited thereto. Teflon and polyphenylene oxide have good material stability and reliability in a high-frequency environment. Furthermore, the material constituting the auxiliary substrate 21 can be, for example, glass fiber cloth (such as FR-4). In addition, the material of the second adhesive layer 223 and the third adhesive layer 21a can also be, for example, a semi-cured bonding sheet (such as Prepreg, PP glue), but the present invention is not limited thereto.

In addition, no circuit pattern is provided on the two side surfaces of the auxiliary substrate 21. No circuit pattern is provided inside the auxiliary substrate 21, no circuit pattern is provided on the portion where the auxiliary substrate 21 is bonded to the third adhesive layer 21a, and no circuit pattern is provided on the portion where the auxiliary substrate 21 is bonded to the second adhesive layer 223. That is, the auxiliary substrate 21 does not provide any relay transmission function possessed by any electronic circuit, but the present invention is not limited thereto.

Please continue to refer to FIG. 1 , the first circuit structure 1 and the second circuit structure 2 are laminated to form the printed circuit board 100 through three times of lamination, and the auxiliary substrate 21 is disposed between the first circuit structure 1 and the high-frequency circuit structure 22. The high-frequency circuit structure 22 has a second plate thickness D2, and the auxiliary substrate 21 has a third plate thickness D3.

In this embodiment, the first plate thickness D1 of the first circuit structure 1 refers to the thickness of multiple core plates 11, multiple layers of first circuit patterns 12, and multiple layers of first adhesive layers 13 stacked together. The second plate thickness D2 of the high-frequency circuit structure 22 refers to the thickness of the high-frequency core substrate 221, the second circuit pattern 222, and the second adhesive layer 223 stacked together. In addition, the third plate thickness D3 of the auxiliary substrate 21 is the total thickness of the auxiliary substrate 21 and the third adhesive layer 21a, but the present invention is not limited thereto. For example, in an actual application, the thickness of the auxiliary substrate 21 may be much thicker than the thickness of the third adhesive layer 21a. Therefore, the third plate thickness D3 may be approximately close to the thickness of the auxiliary substrate 21 body.

In order to prevent the final printed circuit board 100 from having a serious board warping problem, the first board thickness D1, the second board thickness D2, and the third board thickness D3 satisfy the following relationship: 0.8*(D1-D2) ≤ D3 ≤ 1.2*(D1-D2). Preferably, in a preferred embodiment of the present invention, the first board thickness D1, the second board thickness D2, and the third board thickness D3 satisfy the following relationship: 0.9*(D1-D2) ≤ D3 ≤ 1.1*(D1-D2).

According to the above configuration, the second circuit structure 2 after the second pressing can be introduced by the auxiliary substrate 21 and the thickness D3 of the third board material is designed so that the thickness of the second circuit structure 2 after the second pressing is close to the thickness of the first circuit structure 1 after the first pressing. In this way, when the first circuit structure 1 and the second circuit structure 2 are pressed three times, the problem of board bending of the printed circuit board 100 can be effectively avoided.

Please continue to refer to FIG. 1 , the printed circuit board 100 further includes: at least one plated through hole (PTH), and the plated through hole PTH vertically penetrates the first circuit structure 1 and the second circuit structure 2 and electrically connects the first circuit pattern 12 and the second circuit pattern 222 of each layer.

Furthermore, the printed circuit board 100 further includes: at least one laser blind hole 18 or 24. The laser blind hole 18 is formed by being recessed from a first outer surface of the first circuit structure 1 (such as the upper surface of the printed circuit board 100 shown in FIG. 1 ). Alternatively, the laser blind hole 24 is formed by being recessed from a second outer surface of the second circuit structure 2 (such as the lower surface of the printed circuit board 100 shown in FIG. 1 ). In addition, the printed circuit board 100 further includes a plated conductive layer 23 formed on the second outer surface of the second circuit structure 2 and electrically connected to the laser blind hole 24, which can be, for example, formed simultaneously with the plated through hole PTH, but the present invention is not limited thereto.

[Manufacturing method of printed circuit board having auxiliary substrate]

The above is a description of the structural features and material features of the printed circuit board with an auxiliary substrate according to an embodiment of the present invention, and the following will describe a method for manufacturing the printed circuit board with an auxiliary substrate according to an embodiment of the present invention.

2A to 2J, the present embodiment provides a method for manufacturing a printed circuit board with an auxiliary substrate, which includes steps S101 to S110. It should be noted that the sequence and actual operation method of each step in this embodiment can be adjusted according to needs and are not limited to those in this embodiment.

As shown in FIG. 2A , step S101 includes: performing a first pressing operation to form a first circuit structure 1 after one pressing. The first circuit structure 1 has a first plate thickness D1. Specifically, the first circuit structure 1 includes a plurality of core plates 11 stacked on each other, and a first circuit pattern 12 is formed on both side surfaces of each core plate 11. In addition, any two adjacent core plates 11 (including first circuit patterns 12 facing each other) are bonded to each other through a first adhesive layer 13. In other words, the first circuit structure 1 has multiple layers of first circuit patterns 12 and multiple layers of first adhesive layers 13 corresponding to the number of core plates 11.

As shown in FIG2B , the step S102 includes: performing a drilling operation to form a drill hole 14 penetrating the top and bottom surfaces of the first circuit structure 1. The drilling operation may be performed by mechanical drilling, for example, but the present invention is not limited thereto.

As shown in FIG. 2C , step S103 includes: performing an electroplating operation to form an electroplated conductive layer 15 on an inner wall of the drill hole 14, and the electroplated conductive layer 15 is not only formed on the inner wall of the drill hole 14, but also extends to form on the top and bottom surfaces of the first circuit structure 1. The electroplated conductive layer 15 located on the inner wall of the drill hole 14 can electrically connect the multiple layers of the first circuit patterns 12 of the first circuit structure 1 to each other.

As shown in FIG. 2D , the step S104 includes: performing a circuit operation so that the plated conductive layer 15 formed on the top and bottom surfaces of the first circuit structure 1 can be formed into circuit patterns respectively through a photolithography and etching process, but the present invention is not limited thereto.

As shown in FIG. 2E , step S105 includes: performing a browning operation to form a browning treatment layer 16 on the electroplated conductive layer 15 on the top and bottom surfaces of the first circuit structure 1. The browning treatment layer 16 can be used to enhance the bonding strength between the second circuit structure 2 and the first circuit structure 1.

As shown in FIG. 2F , step S106 includes: performing a plugging operation to fill an inner space surrounded by the electroplated conductive layer 15 on the inner wall of the drill hole 14 with a resin material 17. In addition, the resin material 17 can be, for example, subjected to a resin grinding operation to grind the resin material 17 overflowing from the drill hole 14. The resin grinding operation is performed using an eight-axis grinder, but the present invention is not limited thereto.

As shown in FIG. 2G , the step S107 includes: performing a second pressing operation to form a second circuit structure 2 after secondary pressing; wherein the second circuit structure 2 includes: an auxiliary substrate 21 (dummy core) and a high-frequency circuit structure 22 .

Specifically, in the second circuit structure 2, the auxiliary substrate 21 and the high-frequency circuit structure 22 are stacked together through the secondary lamination. The auxiliary substrate 21 is a blank substrate, which does not have any circuit pattern produced by the photolithography process. The high-frequency circuit structure 22 includes at least one high-frequency core substrate 221, and a second circuit pattern 222 is formed on each of the two side surfaces of the high-frequency core substrate 221, and the high-frequency core substrate 221 and the second circuit pattern 222 are attached to the auxiliary substrate 21 through a second adhesive layer 223.

As shown in FIG. 2H , the step S108 includes: performing a third pressing operation to laminate the first circuit structure 1 and the second circuit structure 2 three times to form a printed circuit board 100. The high-frequency circuit structure 22 has a second plate thickness D2, and the auxiliary substrate 21 (including the third adhesive layer 21a) has a third plate thickness D3.

In order to prevent the final printed circuit board 100 from having a serious board warping problem, the first board thickness D1, the second board thickness D2, and the third board thickness D3 satisfy the following relationship: 0.8*(D1-D2) ≤ D3 ≤ 1.2*(D1-D2). Preferably, in a more preferred embodiment of the present invention, the first board thickness D1, the second board thickness D2, and the third board thickness D3 satisfy the following relationship: 0.9*(D1-D2) ≤ D3 ≤ 1.1*(D1-D2).

According to the above configuration, the second circuit structure 2 after the second pressing can be introduced by the auxiliary substrate 21 and the thickness D3 of the third board material is designed so that the thickness of the second circuit structure 2 after the second pressing is close to the thickness of the first circuit structure 1 after the first pressing. In this way, when the first circuit structure 1 and the second circuit structure 2 are pressed three times, the problem of board bending of the printed circuit board 100 can be effectively avoided.

As shown in FIG. 2I , the step S109 includes: performing a hole forming operation to form laser holes h1 , h3 and a vertical via h2 on the printed circuit board 100 .

As shown in FIG. 2J , the step S110 includes: performing an outer layer operation to form an outer layer circuit on the printed circuit board 100. Through the outer layer operation, the printed circuit board 100 further includes: at least one plated through hole PTH (Plated through hole), and the plated through hole PTH vertically penetrates the first circuit structure 1 and the second circuit structure 2, and electrically connects the first circuit pattern 12 and the second circuit pattern 222 of each layer.

Furthermore, the printed circuit board 100 further comprises: at least one laser blind hole 18 or 24. The laser blind hole 18 is formed by being recessed from a first outer surface of the first circuit structure 1 (such as the upper surface of the printed circuit board 100 shown in FIG. 2J ). Alternatively, the laser blind hole 24 is formed by being recessed from a second outer surface of the second circuit structure 2 (such as the lower surface of the printed circuit board 100 shown in FIG. 2J ).

[Beneficial Effects of Embodiments]

The beneficial effect of the present invention is that the printed circuit board with an auxiliary substrate and the manufacturing method thereof provided by the present invention can be formed by "a first circuit structure, the first circuit structure is formed by a single press; wherein the first circuit structure has a first plate thickness; and a second circuit structure, the second circuit structure is formed by a secondary press; wherein the second circuit structure includes an auxiliary substrate (dummy core) and a high-frequency circuit structure; wherein the first circuit structure and the second circuit structure are laminated to each other by three times of pressing to form the printed circuit board, and the auxiliary substrate is arranged between the first circuit structure and the high-frequency circuit structure; wherein the high-frequency circuit structure has a second plate thickness, and the auxiliary substrate has a third plate thickness" and "the first plate thickness is defined as D1, the second plate thickness is defined as D2, and the third plate thickness is defined as D3; wherein D1~D3 satisfy the following relationship: 0.8*(D1-D2) ≤ D3 ≤ 1.2*(D1-D2)” technical solution makes it easy for printed circuit boards with high-frequency mixed pressing materials to not have board bending problems after the pressing operation, and can meet the requirements of printed circuit boards with blind hole structures under special specifications.

The contents disclosed above are only preferred feasible embodiments of the present invention and are not intended to limit the scope of the patent application of the present invention. Therefore, all equivalent technical changes made using the contents of the specification and drawings of the present invention are included in the scope of the patent application of the present invention.

[Prior art] 200A: Primary pressing circuit structure 200B: Secondary pressing circuit structure [Present invention] 100: Printed circuit board 1: First circuit structure 11: Core board 12: First circuit pattern 13: First adhesive layer 14: Drilling hole 15: Electroplating conductive layer 16: Browning treatment layer 17: Resin material 18: Laser blind hole 2: Second circuit structure 21: Auxiliary substrate 21a: Third adhesive layer 22: High-frequency circuit structure 221: High-frequency core substrate 222: Second circuit pattern 223: Second adhesive layer 23: Electroplated conductive layer 24: Laser blind hole D1: First plate thickness D2: Second plate thickness D3: Third plate thickness h1, h3: Laser hole h2: Vertical via PTH: Electroplated through hole

FIG. 1 is a schematic cross-sectional view of a printed circuit board according to an embodiment of the present invention.

FIG. 2A is a schematic diagram of step S101 of the method for manufacturing a printed circuit board according to an embodiment of the present invention.

FIG. 2B is a schematic diagram of step S102 of the method for manufacturing a printed circuit board according to an embodiment of the present invention.

FIG. 2C is a schematic diagram of step S103 of the method for manufacturing a printed circuit board according to an embodiment of the present invention.

FIG. 2D is a schematic diagram of step S104 of the method for manufacturing a printed circuit board according to an embodiment of the present invention.

FIG. 2E is a schematic diagram of step S105 of the method for manufacturing a printed circuit board according to an embodiment of the present invention.

FIG. 2F is a schematic diagram of step S106 of the method for manufacturing a printed circuit board according to an embodiment of the present invention.

FIG. 2G is a schematic diagram of step S107 of the method for manufacturing a printed circuit board according to an embodiment of the present invention.

FIG. 2H is a schematic diagram of step S108 of the method for manufacturing a printed circuit board according to an embodiment of the present invention.

FIG. 2I is a schematic diagram of step S109 of the method for manufacturing a printed circuit board according to an embodiment of the present invention.

FIG. 2J is a schematic diagram of step S110 of the method for manufacturing a printed circuit board according to an embodiment of the present invention.

FIG. 3 is a cross-sectional view of a printed circuit board in the prior art.

100: PCB 1: First circuit structure 11: Core board 12: First circuit pattern 13: First adhesive layer 14: Drilling 15: Electroplated conductive layer 17: Resin material 18: Laser blind hole 2: Second circuit structure 21: Auxiliary substrate 21a: Third adhesive layer 22: High-frequency circuit structure 221: High-frequency core substrate 222: Second circuit pattern 223: Second adhesive layer 23: Electroplated conductive layer 24: Laser blind hole D1: First board thickness D2: Second board thickness D3: Third board thickness PTH: Electroplated through hole

Claims (11)

A printed circuit board with an auxiliary substrate comprises: a first circuit structure, the first circuit structure is formed by a single press; wherein the first circuit structure has a first plate thickness; and a second circuit structure, the second circuit structure is formed by a secondary press; wherein the second circuit structure comprises an auxiliary substrate (dummy core) and a high-frequency circuit structure; wherein the first circuit structure and the second circuit structure are laminated to each other by three times of pressing to form the printed circuit board, and the auxiliary substrate is arranged between the first circuit structure and the high-frequency circuit structure; wherein the high-frequency circuit structure has a second plate thickness, and the auxiliary substrate has a third plate thickness; wherein the first plate thickness is defined as D1, the second plate thickness is defined as D2, and the third plate thickness is defined as D3; wherein the first plate thickness D1>the second plate thickness D2, and D1~D3 satisfy the following relationship: 0.8*(D1-D2)

D3

1.2*(D1-D2). A printed circuit board with an auxiliary substrate as described in claim 1, wherein the first circuit structure comprises a plurality of core boards stacked on each other, a first circuit pattern is formed on both side surfaces of each core board, and any two adjacent core boards are bonded to each other via a first adhesive layer. A printed circuit board with an auxiliary substrate as described in claim 2, wherein the first circuit structure has a drill hole, an inner wall of the drill hole is formed with an electroplated conductive layer electrically connecting each layer of the first circuit pattern, and an inner space surrounded by the electroplated conductive layer is filled with a resin material. A printed circuit board with an auxiliary substrate as described in claim 1, wherein in the second circuit structure, the auxiliary substrate and the high-frequency circuit structure are superimposed on each other through the secondary lamination, and the high-frequency circuit structure is bonded to the auxiliary substrate through its second adhesive layer. A printed circuit board with an auxiliary substrate as described in claim 4, wherein in the second circuit structure, the auxiliary substrate is a blank substrate, both sides of the auxiliary substrate do not have any circuit patterns generated by the photolithography process, and the interior of the auxiliary substrate does not have any circuit patterns generated by the photolithography process. A printed circuit board with an auxiliary substrate as described in claim 4, wherein in the second circuit structure, the high-frequency circuit structure includes at least one high-frequency core substrate, and a second circuit pattern is formed on each of the two side surfaces of the high-frequency core substrate, and the high-frequency core substrate and the second circuit pattern are attached to the auxiliary substrate through a second adhesive layer. A printed circuit board with an auxiliary substrate as described in claim 6, wherein the first circuit structure and the second circuit structure are bonded together via a third adhesive layer disposed on one side of the auxiliary substrate. A printed circuit board with an auxiliary substrate as described in claim 6, wherein in the second circuit structure, the material constituting the high-frequency core substrate includes at least one of Teflon (PTFE) and polyphenylene oxide (PPO). A printed circuit board with an auxiliary substrate as described in claim 1, wherein the printed circuit board further comprises: at least one electroplated via hole, and the electroplated via hole vertically penetrates the first circuit structure and the second circuit structure and electrically connects each layer of circuit patterns. A printed circuit board with an auxiliary substrate as described in claim 1, wherein the printed circuit board further comprises: at least one laser blind hole, and the laser blind hole is formed by a first outer surface depression of the first circuit structure and/or a second outer surface depression of the second circuit structure. A method for manufacturing a printed circuit board with an auxiliary substrate comprises: performing a first pressing operation to form a first circuit structure after a primary pressing; wherein the first circuit structure has a first plate thickness; performing a second pressing operation to form a second circuit structure after a secondary pressing; wherein the second circuit structure comprises an auxiliary substrate (dummy substrate); core) and a high-frequency circuit structure; and performing a third pressing operation to laminate the first circuit structure and the second circuit structure to each other through three pressings, thereby forming a printed circuit board; wherein, in the printed circuit board, the auxiliary substrate is arranged between the first circuit structure and the high-frequency circuit structure; wherein the high-frequency circuit structure has a second plate thickness, and the auxiliary substrate has a third plate thickness; wherein the first plate thickness is defined as D1, the second plate thickness is defined as D2, and the third plate thickness is defined as D3; wherein the first plate thickness D1>the second plate thickness D2, and D1~D3 satisfy the following relationship: 0.8*(D1-D2)

D3

1.2*(D1-D2).

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