CN217546600U - Heat dissipation shielding device - Google Patents
Heat dissipation shielding device Download PDFInfo
- Publication number
- CN217546600U CN217546600U CN202221330393.9U CN202221330393U CN217546600U CN 217546600 U CN217546600 U CN 217546600U CN 202221330393 U CN202221330393 U CN 202221330393U CN 217546600 U CN217546600 U CN 217546600U
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- CN
- China
- Prior art keywords
- heat
- heat dissipation
- circuit board
- heat conducting
- shielding cover
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Abstract
The utility model relates to a heat radiation shielding device, which comprises a first circuit board, wherein a first heating chip is arranged on the first circuit board, a second circuit board is arranged on the first circuit board, a second heating chip is arranged on the second circuit board, and a heat conducting block is arranged on the first heating chip; the second heating chip is provided with a first heat conducting sheet; the heat dissipation shield cover is arranged on the first circuit board, the second circuit board is located in the heat dissipation shield cover, a top cover of the heat dissipation shield cover is in contact with the first heat conducting fins, the first heat conducting fins are located below the heat dissipation shield cover, the heat dissipation shield cover is adjacent to the heat conducting blocks, the second heat conducting fins are arranged on the heat dissipation shield cover, and the second heat conducting fins are in contact with the heat conducting blocks. The utility model discloses a can dispel the heat to two heat sources of position and high difference.
Description
Technical Field
The utility model relates to a heat dissipation technical field, especially a heat dissipation shielding ware.
Background
Along with the continuous increase of functions and the continuous improvement of performance of electronic products in the current society, the power consumption of the electronic products is continuously increased, along with the temperature increase of electronic elements, the performance of the electronic products is reduced, and in order to maintain the performance of the electronic elements at a higher level, the heat dissipation problem is urgently needed to be solved. In addition, as components such as a CPU and a DDR operate, energy may be radiated outwards, and the energy may easily interfere with radio frequency components operating on the same electronic product motherboard, so shielding protection thereof needs to be done.
When having two heat sources not in same position and highly also inconsistent on the circuit board, if use the harder heating panel of same piece material to two chips that generate heat to dispel the heat, can lead to the chip that generates heat of low department can't contact with the heating panel and can't get the heat dissipation, if make the heat source and the heating panel contact of low department by force, just need press the heat source of eminence, because the circuit board only has the support in four corners, there is not the support bottom the chip that generates heat, thereby it causes the damage to make the circuit board sunken easily.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a heat dissipation shielding device can dispel the heat to two heat sources of position and high difference simultaneously.
In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a heat dissipation shielding device, includes first circuit board, be provided with the first chip that generates heat on the first circuit board, be provided with the second circuit board on the first circuit board, the second circuit board is located one side of the first chip that generates heat, be provided with the second chip that generates heat on the second circuit board, its characterized in that: the first heating chip is provided with a heat conducting block; the second heating chip is provided with a first heat conducting sheet; the heat dissipation shielding cover is arranged on the first circuit board, the second circuit board is located in the heat dissipation shielding cover, the top cover of the heat dissipation shielding cover is in contact with the first heat conducting fins, the first heat conducting fins are located below the heat dissipation shielding cover, the heat dissipation shielding cover is adjacent to the heat conducting blocks, second heat conducting fins capable of covering the heat conducting blocks are arranged on the heat dissipation shielding cover, and the second heat conducting fins are in contact with the heat conducting blocks.
Furthermore, one side of the heat dissipation shielding cover adjacent to the heat conducting block is provided with a notch matched with the heat conducting block.
Furthermore, a groove is formed in the heat dissipation shielding cover, the heat dissipation shielding cover is divided into a second circuit board cover matched with the second circuit board through the groove, and a plurality of fixing holes are formed in the groove.
The utility model has the advantages that: the utility model discloses join the first chip that generates heat and the heat that generates heat the chip with the second to follow-up only needs a heating panel to place and has realized promptly can dispel the heat to two heat sources of position and high difference on the second heat conduction piece. The heat conducting block is added in the device, so that heat can be conducted on the first heating chip; the first heat-conducting fin is added in the device, so that heat can be conducted on the second heating chip; the heat dissipation shielding cover is added in the device, so that the second heating chip can be dissipated, and meanwhile, the heat of the heat conducting block can be conducted to the heat dissipation shielding cover, so that the heat is gathered together, and the heat dissipation is accelerated; the second heat-conducting fin is added in the device and can be in contact with the heat-radiating shielding cover and the heat-conducting block to further radiate heat.
Drawings
Fig. 1 is a schematic structural view of the present invention;
fig. 2 is an exploded view of the present invention.
Detailed Description
The present invention will be further explained with reference to the accompanying drawings.
Referring to fig. 1 to 2, the present invention provides an embodiment: a heat dissipation shield comprises a first circuit board 1, wherein a first heating chip 2 is arranged on the first circuit board 1, a second circuit board 3 is arranged on the first circuit board 1, the second circuit board 3 is positioned on one side of the first heating chip 2, a second heating chip 4 is arranged on the second circuit board 3, and a heat conduction block 5 is arranged on the first heating chip 2; the second heating chip 4 is provided with a first heat conducting fin 6; the heat dissipation shielding cover 7 is arranged on the first circuit board 1, the second circuit board 3 is located in the heat dissipation shielding cover 7, a top cover of the heat dissipation shielding cover 7 is in contact with the first heat conducting fins 6, the first heat conducting fins 6 are located below the heat dissipation shielding cover 7, the heat dissipation shielding cover 7 is adjacent to the heat conducting blocks 5, second heat conducting fins 8 capable of covering the heat conducting blocks 5 are arranged on the heat dissipation shielding cover 7, and the second heat conducting fins 8 are in contact with the heat conducting blocks 5. The first heat conducting strip 6, the second heat conducting strip 8 and the heat conducting block 5 are made of heat conducting silica gel, the first heating chip 2 conducts heat to the heat conducting block 5, the second heating chip 4 conducts heat to the first heat conducting strip 6, the first heat conducting strip 6 and the heat conducting block 5 conduct heat to the heat dissipation shielding cover 7, the heat dissipation shielding cover 7 conducts heat to the second heat conducting strip 8, and the heat conducting block 5 has two heat conducting paths, namely, the first heat conducting strip is conducted to the heat dissipation shielding cover 7, and the second heat conducting strip is conducted to the second heat conducting strip 8; the heat conducting block 5 is used on the first heating chip 2 because the heat conducting block 5 has a certain height, so that the height difference between the heat conducting block 5 and the second heating chip 4 can be made up, but errors always exist due to process reasons, so that the height of the first heat conducting sheet 6 and the height of the heat conducting block 5 cannot be aligned; the heat dissipation shield 7 receives the heat conducted by the heat conduction block 5, accelerate the heat dissipation of the heat conduction block 5, the heat dissipation shield 7 is made of aluminum alloy, because the power consumption of the second heating chip 4 is larger than that of the first heating chip 2, the heating degree of the second heating chip 4 is higher than that of the first heating chip 2, therefore, the heat dissipation shield 7 with larger area and better heat dissipation effect is arranged on the second heating chip 4, the second heat conduction sheet 8 dissipates the heat of the heat conduction block 5 and the heat dissipation shield 7, because the area is large, the heat dissipation acceleration is facilitated, the material of the second heat conduction sheet 8 is heat conduction silica gel, because the heat conduction silica gel block is softer, even if the heat dissipation shield 7 is not flush with the heat conduction block 5, the second heat conduction sheet 8 can also contact with the heat dissipation shield 7 and the heat conduction block 5, and the heat of the heat dissipation shield 7 and the heat conduction block 5 is absorbed.
Referring to fig. 1 to 2, in an embodiment of the present invention, a notch 9 matched with the heat conducting block 5 is formed on one side of the heat dissipation shielding cover 7 adjacent to the heat conducting block 5. The notches 9 are intended to allow the heat-dissipating shield 7 to come into contact with the heat-conducting block 5, and on the other hand, to save material.
Referring to fig. 1 to fig. 2, in an embodiment of the present invention, a groove 10 is formed on the heat dissipation shielding cover 7, the heat dissipation shielding cover 7 is divided into a second circuit board cover 11 matched with the second circuit board 3 by the groove 10, and a plurality of fixing holes 12 are formed in the groove 10. The groove 10 is used for dividing a second circuit board cover 11 which specially belongs to the second circuit board 3, so that the influence of heat emitted by the first heating chip 2 on the first heating chip 2 is reduced, and the fixing hole 12 is used for being matched with a buckle of the second circuit board 3, so that the heat dissipation shielding cover 7 is fixed on the second circuit board 3.
The above description is only for the preferred embodiment of the present invention, and should not be interpreted as limiting the scope of the present invention, which is intended to cover all the equivalent changes and modifications made in accordance with the claims of the present invention.
Claims (3)
1. The utility model provides a heat dissipation shielding device, includes first circuit board, be provided with first chip that generates heat on the first circuit board, be provided with the second circuit board on the first circuit board, the second circuit board is located one side of first chip that generates heat, be provided with the second chip that generates heat on the second circuit board, its characterized in that: the first heating chip is provided with a heat conducting block; the second heating chip is provided with a first heat conducting sheet; the heat dissipation shielding cover is arranged on the first circuit board, the second circuit board is located in the heat dissipation shielding cover, the top cover of the heat dissipation shielding cover is in contact with the first heat conducting fins, the first heat conducting fins are located below the heat dissipation shielding cover, the heat dissipation shielding cover is adjacent to the heat conducting blocks, second heat conducting fins capable of covering the heat conducting blocks are arranged on the heat dissipation shielding cover, and the second heat conducting fins are in contact with the heat conducting blocks.
2. The heat dissipation shield of claim 1, wherein: and one side of the heat dissipation shielding cover adjacent to the heat conducting block is provided with a notch matched with the heat conducting block.
3. The heat dissipation shield of claim 2, wherein: the heat dissipation shielding cover is provided with a groove, the heat dissipation shielding cover is divided into a second circuit board cover matched with the second circuit board through the groove, and a plurality of fixing holes are formed in the groove.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221330393.9U CN217546600U (en) | 2022-05-30 | 2022-05-30 | Heat dissipation shielding device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221330393.9U CN217546600U (en) | 2022-05-30 | 2022-05-30 | Heat dissipation shielding device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217546600U true CN217546600U (en) | 2022-10-04 |
Family
ID=83440736
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202221330393.9U Active CN217546600U (en) | 2022-05-30 | 2022-05-30 | Heat dissipation shielding device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217546600U (en) |
-
2022
- 2022-05-30 CN CN202221330393.9U patent/CN217546600U/en active Active
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| Date | Code | Title | Description |
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| GR01 | Patent grant | ||
| GR01 | Patent grant |