CN219145719U - Heat dissipation type microwave circuit board - Google Patents

Abstract

The utility model discloses a heat dissipation type microwave circuit board, which comprises a metal substrate; the heat dissipation layers are arranged on two sides of the metal substrate, the reinforcing layer is arranged on the surface of the heat dissipation layer on one side of the metal substrate, the circuit layer is arranged on the surface of the reinforcing layer, the antistatic layer is arranged on the surface of the circuit layer, the reinforcing layer comprises reinforcing sheets, copper-tin layers and a protective frame, the reinforcing sheets are arranged on the surface of the heat dissipation layer on one side of the metal substrate, the copper-tin layers are arranged on the surface of the reinforcing sheets, and the protective frame is arranged on the outer side of the metal substrate; according to the utility model, the reinforcing layer is arranged on the surface of the heat dissipation layer at one side of the metal substrate, and the copper-tin layer enables the metal substrate to have good hardness, strong bending resistance and good welding performance, the reinforcing sheet can strengthen the strength of the metal substrate and avoid the metal substrate from being broken, the protective frame can protect the edge of the metal substrate and avoid the damage of the frame of the metal substrate, and further the use of people is not affected.

Description

Heat dissipation type microwave circuit board

Technical Field

The utility model relates to the technical field of circuit boards, in particular to a heat dissipation type microwave circuit board.

Background

The circuit board mainly plays roles of conducting wires and fixing in a circuit, in the microwave high-frequency circuit board industry, the circuit board with the length exceeding 800mm is called an ultralong microwave high-frequency circuit board, currently manufacturers in the industry have the maximum processing capacity of 1100mm, the problem that bending deformation usually occurs when cooling is performed when exceeding the length, the surface of the board is uneven, the peeling strength of the circuit board is reduced, the high transmission function of microwave high-frequency ultralong circuit board microwave signals of the antenna of the mobile communication base station cannot be met, certain heat can be generated in the circuit board during operation, internal heat dissipation can be accelerated through the heat dissipation type microwave circuit board, and heat accumulation is avoided.

A large number of components are usually arranged on the circuit board, when a large number of structures are excessively heavy, the circuit board can be bent, and the circuit board can be broken when serious, and meanwhile, the edge of the circuit board is easy to damage due to collision, so that the use of people can be influenced;

after the circuit board is used for a long time, a large amount of static electricity can be accumulated on the surface of the circuit board, if the static electricity is not led out, the static electricity can cause damage to an electronic product on the surface of the circuit board, and therefore the service life of the circuit board can be reduced.

Disclosure of Invention

The utility model aims to provide a heat dissipation type microwave circuit board, which solves the problems that the circuit board is bent and the serious situation can be broken in the prior art.

The utility model provides the following technical scheme: a heat dissipation type microwave circuit board comprises a metal substrate; the heat dissipation layers are arranged on two sides of the metal substrate, a reinforcing layer is arranged on the surface of the heat dissipation layer on one side of the metal substrate, a circuit layer is arranged on the surface of the reinforcing layer, and an antistatic layer is arranged on the surface of the circuit layer;

the reinforcing layer comprises a reinforcing sheet, a copper-tin layer and a protective frame, wherein the reinforcing sheet is arranged on the surface of the radiating layer on one side of the metal substrate, the copper-tin layer is arranged on the surface of the reinforcing sheet, and the protective frame is arranged on the outer side of the metal substrate;

the antistatic layer comprises a conducting layer, a pvc layer and a wire, wherein the conducting layer is arranged on the surface of the circuit layer, the wire is arranged on one side of the conducting layer, and the pvc layer is arranged on one side of the conducting layer away from the circuit layer.

Preferably, an insulating layer is arranged at the bottom of the metal substrate, and a heat dissipation layer is connected to one side, far away from the metal substrate, of the insulating layer.

Preferably, the heat dissipation layer comprises a heat conduction sheet and heat dissipation sheets, the heat conduction sheets are arranged on two sides of the metal substrate, and the heat dissipation sheets are arranged on the surfaces of the heat conduction sheets.

Preferably, the bottom of the heat dissipation layer on one side of the metal substrate far away from the reinforcing layer is provided with a bottom plate, and fixing holes are formed in the metal substrate, the insulating layer, the heat dissipation layer, the bottom plate, the reinforcing layer, the circuit layer and the four corners of the antistatic layer in a penetrating manner.

Preferably, the circuit layer and the antistatic layer are provided with heat dissipation holes at equal intervals, and the heat dissipation holes are distributed at equal intervals.

Preferably, the circuit layer and the antistatic layer are provided with connecting holes at equal intervals, and the inner walls of the radiating holes and the connecting holes are provided with metal foil layers.

Compared with the prior art, the utility model has the beneficial effects that:

1. according to the utility model, the reinforcing layer is arranged on the surface of the heat dissipation layer at one side of the metal substrate, and the copper-tin layer enables the metal substrate to have good hardness, strong bending resistance and good welding performance, the reinforcing sheet can strengthen the strength of the metal substrate and avoid the metal substrate from being broken, the protective frame can protect the edge of the metal substrate and avoid the damage of the frame of the metal substrate, and further the use of people is not affected.

2. According to the utility model, the antistatic layer is arranged on the surface of the circuit layer, the conductive layer transmits static electricity in the metal substrate to the lead, then the static electricity is transmitted out through the lead, and the antistatic effect can be achieved on the surface of the circuit layer through the pvc layer, so that the damage of the static electricity to electronic products on the surface of the circuit board is avoided, and the service life of the circuit board is prolonged.

Drawings

FIG. 1 is a schematic side view of the internal structure of the present utility model;

FIG. 2 is a schematic top view of the present utility model;

FIG. 3 is a schematic view of a partial enlarged structure of the A in FIG. 1 according to the present utility model;

fig. 4 is a schematic view of a partial enlarged structure of the B in fig. 2 according to the present utility model.

In the figure: 1. a metal substrate; 2. an insulating layer; 3. a heat dissipation layer; 301. a heat conductive sheet; 302. a heat sink; 4. a bottom plate; 5. a reinforcing layer; 501. a reinforcing sheet; 502. a copper tin layer; 503. a protective frame; 6. a circuit layer; 601. a heat radiation hole; 602. a connection hole; 603. a metal foil layer; 604. a fixing hole; 7. an antistatic layer; 701. a conductive layer; 702. a pvc layer; 703. and (5) conducting wires.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

In the description of the present utility model, it should be noted that the directions or positional relationships indicated by the terms "upper", "lower", "inner", "outer", "front", "rear", "both ends", "one end", "the other end", etc. are based on the directions or positional relationships shown in the drawings, are merely for convenience of describing the present utility model and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific direction, be configured and operated in the specific direction, and thus should not be construed as limiting the present utility model. Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

In the description of the present utility model, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "provided," "connected," and the like are to be construed broadly, and may be fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present utility model will be understood in specific cases by those of ordinary skill in the art.

The technical scheme of the utility model is further elaborated by the following description and the accompanying drawings and specific embodiments;

embodiment one:

the heat dissipation type microwave circuit board comprises a metal substrate 1; the two sides of the metal substrate 1 are provided with heat dissipation layers 3, the surface of the heat dissipation layer 3 on one side of the metal substrate 1 is provided with a reinforcing layer 5, the surface of the reinforcing layer 5 is provided with a circuit layer 6, and the surface of the circuit layer 6 is provided with an antistatic layer 7;

the reinforcing layer 5 comprises a reinforcing sheet 501, a copper-tin layer 502 and a protective frame 503, wherein the reinforcing sheet 501 is arranged on the surface of the heat dissipation layer 3 on one side of the metal substrate 1, the copper-tin layer 502 is arranged on the surface of the reinforcing sheet 501, and the protective frame 503 is arranged on the outer side of the metal substrate 1;

specifically, as shown in fig. 1, fig. 2, fig. 3 and fig. 4, the heat dissipation layer 3 can accelerate to dissipate heat on the metal substrate 1, the circuit layer 6 can be connected with external electronic components, the copper-tin layer 502 is made of copper-tin alloy materials, the copper-tin layer 502 enables the metal substrate 1 to have better hardness and strong bending resistance, meanwhile, the reinforcing sheet 501 is made of polyimide materials, the reinforcing sheet 501 can strengthen the strength of the metal substrate 1, the metal substrate 1 is prevented from being broken, the edge of the metal substrate 1 can be protected by the protective frame 503, damage to the edge of the metal substrate 1 is avoided, and further the use of people is not affected.

Further, an insulating layer 2 is arranged at the bottom of the metal substrate 1, one side, far away from the metal substrate 1, of the insulating layer 2 is connected with a heat dissipation layer 3, the heat dissipation layer 3 comprises heat conducting fins 301 and heat dissipation fins 302, the heat conducting fins 301 are arranged on two sides of the metal substrate 1, and the heat dissipation fins 302 are arranged on the surface of the heat conducting fins 301;

specifically, as shown in fig. 1 and 3, the insulating layer 2 is insulating glass cement, the insulating layer 2 can increase strength and toughness of the circuit board, is not bent, is not deformed when baked and cooled down, does not affect the peeling strength of the circuit layer 6, has stable dielectric constant, and the heat conducting fin 301 and the heat radiating fin 302 are both made of aluminum materials, and transfer heat to the heat radiating fin 302 through the heat conducting fin 301, and the heat radiating fin 302 radiates heat into air, so that the heat on the metal substrate 1 can be radiated in an accelerated manner.

Further, the bottom of the heat dissipation layer 3 on one side of the metal substrate 1 far away from the reinforcing layer 5 is provided with a bottom plate 4, and fixing holes 604 are formed in the four corners of the metal substrate 1, the insulating layer 2, the heat dissipation layer 3, the bottom plate 4, the reinforcing layer 5, the circuit layer 6 and the antistatic layer 7 in a penetrating manner;

specifically, as shown in fig. 1, 2 and 3, the bottom plate 4 is a copper plate, the bottom plate 4 is beneficial to improving the quality factor of the circuit system and increasing the flexibility of circuit design, and when in use, a person can use bolts to pass through the inside of the fixing holes 604, and then can fixedly install and use the circuit board through the bolts.

Further, heat dissipation holes 601 are formed in the circuit layer 6 and the antistatic layer 7 at equal intervals, the heat dissipation holes 601 are distributed at equal intervals, connecting holes 602 are formed in the circuit layer 6 and the antistatic layer 7 at equal intervals, and metal foil layers 603 are arranged on the inner walls of the heat dissipation holes 601 and the connecting holes 602;

specifically, as shown in fig. 1, fig. 2, fig. 3 and fig. 4, part of heat on the metal substrate 1 can be dissipated through the heat dissipation holes 601, and the connection holes 602 can connect the circuit board with external electronic components, and the heat dissipation holes 601 and the metal foil layer 603 on the inner wall of the connection holes 602 can well shield high-frequency microwaves in the circuit board, so that interference between the high-frequency microwaves and the electronic components connected to the circuit layer 6 is avoided, and the anti-interference performance of the circuit board is improved.

Unlike the first embodiment, the present utility model also provides a second embodiment, which is used for solving the problem that after the circuit board is used for a long time, a large amount of static electricity is accumulated on the surface of the circuit board, if the static electricity is not led out, the static electricity can damage an electronic product on the surface of the circuit board, so that the service life of the circuit board can be reduced, the application discloses a heat dissipation type microwave circuit board, wherein the anti-static layer 7 comprises a conductive layer 701, a pvc layer 702 and a conductive wire 703, the conductive layer 701 is arranged on the surface of the circuit layer 6, the conductive wire 703 is arranged on one side of the conductive layer 701, and the pvc layer 702 is arranged on one side of the conductive layer 701 far away from the circuit layer 6;

specifically, as shown in fig. 3, the conductive layer 701 is a conductive sheet, the conductive layer 701 transmits static electricity inside the metal substrate 1 to the conductive wire 703, then the static electricity is transmitted out through the conductive wire 703, and the pvc layer 702 is made of pvc material, and the pvc layer 702 can play an antistatic effect on the surface of the circuit layer 6, thereby avoiding damage of static electricity to electronic products on the surface of the circuit board, and further prolonging the service life of the circuit board.

Working principle: the insulating layer 2 is connected with the metal base plate 1 bottom, the both sides of metal base plate 1 and insulating layer 2 are connected with heat dissipation layer 3, the surface connection of metal base plate 1 bottom heat dissipation layer 3 has bottom plate 4, the surface connection of metal base plate 1 top heat dissipation layer 3 has enhancement layer 5, the surface connection of enhancement layer 5 has circuit layer 6, the surface connection of circuit layer 6 has antistatic backing 7, during the use, personnel use the inside that the bolt passed fixed orifices 604, then can carry out fixed mounting with this circuit board through the bolt and use, then use connecting hole 602 connection outside electronic components.

Finally, what is to be described is: the above embodiments are only for illustrating the technical solution of the present utility model and not for limiting the same, and although the present utility model has been described in detail with reference to the examples, it should be understood by those skilled in the art that modifications and equivalents may be made thereto without departing from the spirit and scope of the technical solution of the present utility model, which is intended to be covered by the scope of the claims of the present utility model.

Claims (6)

1. A heat dissipation type microwave circuit board comprises a metal substrate (1); the method is characterized in that: the anti-static metal substrate comprises a metal substrate body, wherein heat dissipation layers (3) are arranged on two sides of the metal substrate body (1), a reinforcing layer (5) is arranged on the surface of the heat dissipation layer (3) on one side of the metal substrate body (1), a circuit layer (6) is arranged on the surface of the reinforcing layer (5), and an anti-static layer (7) is arranged on the surface of the circuit layer (6);

the reinforcing layer (5) comprises a reinforcing sheet (501), a copper-tin layer (502) and a protective frame (503), wherein the reinforcing sheet (501) is arranged on the surface of the radiating layer (3) on one side of the metal substrate (1), the copper-tin layer (502) is arranged on the surface of the reinforcing sheet (501), and the protective frame (503) is arranged on the outer side of the metal substrate (1);

antistatic backing (7) are including conducting layer (701), pvc layer (702) and wire (703), the surface of circuit layer (6) is equipped with conducting layer (701), wire (703) are installed to one side of conducting layer (701), one side that circuit layer (6) were kept away from to conducting layer (701) is equipped with pvc layer (702).

2. The heat dissipation type microwave circuit board according to claim 1, wherein: the bottom of the metal substrate (1) is provided with an insulating layer (2), and one side, far away from the metal substrate (1), of the insulating layer (2) is connected with a heat dissipation layer (3).

3. The heat dissipation type microwave circuit board according to claim 1, wherein: the heat dissipation layer (3) comprises a heat conduction sheet (301) and heat dissipation sheets (302), wherein the heat conduction sheet (301) is arranged on two sides of the metal substrate (1), and the heat dissipation sheets (302) are arranged on the surface of the heat conduction sheet (301).

4. The heat dissipation type microwave circuit board according to claim 1, wherein: the bottom of the radiating layer (3) on one side of the metal substrate (1) far away from the reinforcing layer (5) is provided with a bottom plate (4), and fixing holes (604) are formed in the metal substrate (1), the insulating layer (2), the radiating layer (3), the bottom plate (4), the reinforcing layer (5), the circuit layer (6) and the antistatic layer (7) in a penetrating mode.

5. The heat dissipation type microwave circuit board according to claim 1, wherein: the circuit layer (6) and the antistatic layer (7) are internally provided with radiating holes (601) at equal intervals, and the radiating holes (601) are distributed at equal intervals.

6. The heat dissipation type microwave circuit board according to claim 1, wherein: the circuit layer (6) and the antistatic layer (7) are provided with connecting holes (602) at equal intervals, and metal foil layers (603) are arranged on the inner walls of the radiating holes (601) and the connecting holes (602).

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