CN219019121U - Be used for anti-interference circuit board - Google Patents
Be used for anti-interference circuit board Download PDFInfo
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- CN219019121U CN219019121U CN202223227725.3U CN202223227725U CN219019121U CN 219019121 U CN219019121 U CN 219019121U CN 202223227725 U CN202223227725 U CN 202223227725U CN 219019121 U CN219019121 U CN 219019121U
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- circuit board
- heat dissipation
- layer
- interference
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
- Y02B30/00—Energy efficient heating, ventilation or air conditioning [HVAC]
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Abstract
The utility model relates to the technical field of circuit boards, in particular to an anti-interference circuit board, which comprises; the upper surface of the mounting plate is fixedly connected with a protective cover; the first heat dissipation mechanism is fixedly arranged on the inner side of the protective cover; the second heat dissipation mechanism is fixedly arranged at the bottom of the inside of the protective cover; the circuit board is fixedly arranged at the top of the second heat dissipation mechanism; according to the utility model, through the first heat dissipation mechanism and the second heat dissipation mechanism, multidirectional heat dissipation can be performed from the inside and the outside, and the heat dissipation efficiency and the heat dissipation effect are effectively improved.
Description
Technical Field
The utility model relates to the technical field of circuit boards, in particular to an anti-interference circuit board.
Background
The circuit board is also called as a circuit board, and the name of the circuit board is as follows: ceramic circuit boards, alumina ceramic circuit boards, aluminum nitride ceramic circuit boards, PCB boards, aluminum substrates, high frequency boards, thick copper plates, impedance boards, PCB, ultra-thin circuit boards, printed circuit boards, and the like. The utility model of China with the patent number of CN210928293U and named as an anti-interference circuit board structure discloses an anti-interference circuit board structure, which comprises an anti-interference shell, a circuit board body, a sealing plate and an adsorption plate, wherein the anti-interference shell is in a hollow rectangular shape and is provided with an opening at the front end, and a connecting seat is arranged at the top of the anti-interference shell; the anti-interference shell cavity inner side wall is provided with a first limit groove, a second limit groove and a connecting groove, the connecting groove is arranged at the bottom of the anti-interference shell inner side, the second limit groove is provided with a plurality of limit grooves and is positioned between the first limit groove and the connecting groove, and the sealing plate is arranged at the anti-interference shell opening and is connected with the connecting groove and the connecting seat through connecting pieces; the end part of the circuit board body is matched with the second limiting groove, a rubber protection pad is arranged on the inner side wall of the second limiting groove, and the end part of the circuit board body extends into the second limiting groove and is in close contact with the rubber protection pad; the adsorption plate is arranged above the circuit board body, the end of the adsorption plate is matched with the first limiting groove, a limiting structure is arranged on the adsorption plate, and the limiting structure comprises a transverse plate, a limiting rod and a limiting plate. The anti-interference shell through setting carries out the anti-interference to the circuit board, and the interference killing effect is not strong, and the circuit board sets up in the casing, and inside temperature can rise, makes the circuit board short circuit easily.
Disclosure of Invention
The present utility model is directed to an anti-interference circuit board, so as to solve the problems set forth in the background art.
In order to achieve the above purpose, the present utility model provides the following technical solutions: a circuit board for interference rejection, comprising:
the upper surface of the mounting plate is fixedly connected with a protective cover;
the first heat dissipation mechanism is fixedly arranged on the inner side of the protective cover;
the second heat dissipation mechanism is fixedly arranged at the bottom of the inside of the protective cover;
the circuit board is fixedly arranged at the top of the second heat dissipation mechanism.
As a preferred embodiment of the present utility model, the circuit board includes:
the power supply area is arranged on one side of the upper surface of the circuit board;
the power supply is fixedly arranged in the power supply area;
the capacitors are fixedly arranged at two sides of the power supply at equal intervals.
As a preferred embodiment of the present utility model, the first heat dissipation mechanism includes:
the heat dissipation copper ring is fixedly connected to the inner side surface of the protective cover;
the through grooves are formed in the cover bodies on two sides of the protective cover at equal intervals;
the radiating fins are fixedly connected to the surfaces of two sides of the radiating copper ring at equal intervals, and penetrate through the grooves;
the copper foil circuit layer inside the circuit board can be radiated through the first radiating mechanism, heat is transferred to the radiating copper ring through the first heat conducting glue layer, the radiating surface of the semiconductor refrigerating plate also transfers heat to the radiating copper ring, and the radiating copper ring further radiates heat through the radiating fins.
As a preferred embodiment of the present utility model, the second heat dissipation mechanism includes:
the semiconductor refrigerating sheets are arranged, the two semiconductor refrigerating sheets are fixedly connected to two sides of the upper surface of the mounting plate, and the radiating surfaces of the semiconductor refrigerating sheets are in contact connection with the inner wall of the radiating copper ring;
the cold guide plate is fixedly connected between the two semiconductor refrigerating sheets;
the second heat conducting adhesive layer is adhered to the upper surface of the cold conducting plate;
the isolation protective layer is adhered to the upper surface of the second heat conducting adhesive layer;
the second heat dissipation mechanism is arranged, the whole circuit board can be cooled through the semiconductor refrigerating sheet, the cooled cold guide plate further cools the circuit board through the second heat conduction adhesive layer and the isolation protective layer, and the isolation protective layer further performs supercooling protection on the circuit board.
As a preferred embodiment of the present utility model, the circuit board includes:
the base plate is fixedly connected to the upper surface of the isolation protective layer;
the copper foil circuit layer is fixedly connected to the upper surface of the substrate, and a circuit is etched on the upper surface of the copper foil circuit layer;
the first heat conduction adhesive layer is fixedly adhered to the upper surface of the copper foil circuit layer, and is adhered to the area, without etching circuits, of the surface of the copper foil circuit layer;
the anti-interference shielding layer is fixedly adhered to the upper surface of the first heat conducting adhesive layer.
As a preferred aspect of the present utility model, the mounting plate includes:
the grounding channels are fixedly arranged on the mounting plate at equal intervals and penetrate through the mounting plate, the second heat conducting adhesive layer, the cold conducting plate and the isolation protective layer;
the grounding wire is fixedly connected and arranged in the grounding channel, and the top of the grounding wire is connected with the circuit board;
the protection casing through setting up can carry out electromagnetic interference protection to the circuit board, can shield the signal interference of adjacent circuit board through the anti-interference shielding layer of setting up, can eliminate the interference signal of power through the condenser of setting up, can prevent electrostatic interference through the earth connection of setting up.
As a preferred aspect of the present utility model, the mounting plate includes:
the mounting hole is formed in the surface of the mounting plate;
the circuit board can be detached and installed through the mounting plate and the mounting holes.
Compared with the prior art, the utility model has the beneficial effects that:
1. according to the utility model, the circuit board can be disassembled and assembled through the first heat dissipation mechanism and the second heat dissipation mechanism, the whole circuit board can be cooled through the second heat dissipation mechanism, the cooled cold guide plate can further cool the circuit board through the second heat conduction adhesive layer and the isolation protective layer, the isolation protective layer further performs supercooling protection on the circuit board, the copper foil circuit layer inside the circuit board can be cooled through the first heat dissipation mechanism, heat is transferred to the heat dissipation copper ring through the first heat conduction adhesive layer, the heat is transferred to the heat dissipation copper ring through the heat dissipation surface of the semiconductor refrigeration plate, the heat dissipation copper ring further performs heat dissipation through the heat dissipation fins, and multi-azimuth heat dissipation can be performed from the inside and the outside, so that the heat dissipation efficiency and the heat dissipation effect are effectively improved.
2. According to the utility model, the circuit board can be protected against electromagnetic interference through the arranged protective cover, the anti-interference shielding layer, the capacitor and the grounding wire, the signal interference of the adjacent circuit board can be shielded through the arranged anti-interference shielding layer, the interference signal of a power supply can be eliminated through the arranged capacitor, the electrostatic interference can be prevented through the arranged grounding wire, the anti-interference can be carried out from multiple angles, and the anti-interference effect is better.
Drawings
FIG. 1 is a schematic overall perspective view of the present utility model;
FIG. 2 is a schematic top view of the present utility model;
FIG. 3 is a schematic illustration of a front cross-sectional structure of the present utility model;
fig. 4 is a schematic side sectional structure of the present utility model.
In the figure: 1. a mounting plate; 2. a heat radiation fin; 3. a mounting hole; 4. a protective cover; 5. a heat dissipation copper ring; 6. a circuit board; 7. a through groove; 8. a first heat dissipation mechanism; 9. a second heat dissipation mechanism; 10. a power supply region; 11. a capacitor; 12. a power supply; 13. an anti-interference shielding layer; 14. a first heat conducting adhesive layer; 15. a copper foil circuit layer; 16. a substrate; 17. an isolation protective layer; 18. a ground wire; 19. a second heat conducting adhesive layer; 20. a cold guide plate; 21. a ground path; 22. semiconductor refrigerating sheet.
Detailed Description
In order to facilitate understanding of the technical means, objects and effects of the present utility model, embodiments of the present utility model will be described in detail with reference to the accompanying drawings.
It is to be noted that all terms used for directional and positional indication in the present utility model, such as: "upper", "lower", "left", "right", "front", "rear", "vertical", "horizontal", "inner", "outer", "top", "low", "lateral", "longitudinal", "center", etc. are merely used to explain the relative positional relationship, connection, etc. between the components in a particular state (as shown in the drawings), and are merely for convenience of description of the present utility model, and do not require that the present utility model must be constructed and operated in a particular orientation, and thus should not be construed as limiting the present utility model. Furthermore, the description of "first," "second," etc. in this disclosure is for descriptive purposes only and is not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated.
In the description of the present utility model, unless explicitly stated and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; may be a mechanical connection; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present utility model will be understood in specific cases by those of ordinary skill in the art.
In the description of the present specification, reference to the terms "one embodiment," "some embodiments," "illustrative embodiments," "examples," "specific examples," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the utility model. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiments or examples. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
Referring to fig. 1-4, the present utility model provides a technical solution:
a circuit board for interference rejection, comprising:
the mounting plate 1, the upper surface of the mounting plate 1 is fixedly connected with the protective cover 4;
the first heat dissipation mechanism 8 is fixedly arranged on the inner side of the protective cover 4;
the second heat dissipation mechanism 9 is fixedly arranged at the bottom inside the protective cover 4;
the circuit board 6, the circuit board 6 is fixed to be set up at the second cooling mechanism 9 top.
As an example of the present utility model, the wiring board 6 includes:
the power supply area 10, the power supply area 10 is set up on one side of upper surface of the circuit board 6;
a power supply 12, the power supply 12 being fixedly installed inside the power supply region 10;
the capacitors 11, the capacitors 11 are fixedly arranged at equal distances on both sides of the power supply 12.
As an example of the present utility model, the first heat dissipation mechanism 8 includes:
the heat dissipation copper ring 5 is fixedly connected to the inner side surface of the protective cover 4;
the through grooves 7 are formed in the cover bodies on two sides of the protective cover 4 at equal distance;
the radiating fins 2 are fixedly connected to the surfaces of the two sides of the radiating copper ring 5 at equal distance, and the radiating fins 2 penetrate through the grooves 7.
As an example of the present utility model, the second heat dissipation mechanism 9 includes:
the semiconductor refrigerating sheets 22 are arranged, two semiconductor refrigerating sheets 22 are fixedly connected to two sides of the upper surface of the mounting plate 1, and the radiating surfaces of the semiconductor refrigerating sheets 22 are in contact connection with the inner wall of the radiating copper ring 5;
the cold guide plate 20, the cold guide plate 20 is fixedly connected between two semiconductor refrigerating sheets 22;
the second heat conducting adhesive layer 19, the second heat conducting adhesive layer 19 is adhered to the upper surface of the cold conducting plate 20;
the isolation protective layer 17 is adhered to the upper surface of the second heat conducting adhesive layer 19;
the second heat dissipation mechanism 9 is arranged, the whole circuit board 6 can be cooled through the semiconductor refrigerating sheet 22, the cooled cold guide plate 20 further cools the circuit board 6 through the second heat conduction adhesive layer 19 and the isolation protective layer 17, and the isolation protective layer 17 further performs supercooling protection on the circuit board 6.
As an example of the present utility model, the wiring board 6 includes:
the base plate 16, the base plate 16 is fixedly connected to the upper surface of the isolation protective layer 17;
the copper foil circuit layer 15, the copper foil circuit layer 15 is fixedly connected to the upper surface of the substrate 16, and the upper surface of the copper foil circuit layer 15 is etched with a circuit;
the first heat conducting adhesive layer 14 is fixedly adhered to the upper surface of the copper foil circuit layer 15, and the first heat conducting adhesive layer 14 is adhered to the area, which is not etched with the circuit, of the surface of the copper foil circuit layer;
the anti-interference shielding layer 13 is fixedly adhered to the upper surface of the first heat conducting glue layer 14;
the copper foil circuit layer 15 inside the circuit board 6 can be radiated through the first radiating mechanism 8, heat is transferred to the radiating copper ring 5 through the first heat conducting glue layer 14, the radiating surface of the semiconductor refrigerating sheet 22 also transfers heat to the radiating copper ring 5, and the radiating copper ring 5 further radiates heat through the radiating fins 2.
As an example of the present utility model, the mounting plate 1 includes:
the grounding channels 21 are fixedly arranged on the mounting plate 1 at equal intervals, and the grounding channels 21 penetrate through the mounting plate 1, the second heat conducting glue layer 19, the cold conducting plate 20 and the isolation protective layer 17;
the grounding wire 18 is fixedly connected and arranged in the grounding channel 21, and the top of the grounding wire 18 is connected with the circuit board 6;
the circuit board 6 can be protected from electromagnetic interference by the arranged protective cover 4, the adjacent circuit board can be shielded from signal interference by the arranged anti-interference shielding layer 13, the interference signal of the power supply 12 can be eliminated by the arranged capacitor 11, and the electrostatic interference can be prevented by the arranged grounding wire 18.
As an example of the present utility model, the mounting plate 1 includes:
the mounting hole 3 is formed in the surface of the mounting plate 1;
the circuit board 6 can be detached and installed through the mounting plate 1 and the mounting holes 3.
Working principle: can realize the dismantlement and the installation of circuit board 6 through mounting panel 1 and mounting hole 3, can cool down to whole circuit board 6 through setting up second heat dissipation mechanism 9, can cool down to leading cold plate 20 through semiconductor refrigeration piece 22, the leading cold plate 20 after the cooling further cools down to circuit board 6 through second heat conduction glue film 19 and isolation inoxidizing coating 17, isolation inoxidizing coating 17 further carries out supercooling protection to circuit board 6, can dispel the heat to the inside copper foil circuit layer 15 of circuit board 6 through the first heat dissipation mechanism 8 that sets up, give heat dissipation copper ring 5 through first heat conduction glue film 14 with heat transfer, the heat dissipation copper ring 5 also gives heat dissipation copper ring 5 with the heat dissipation face of semiconductor refrigeration piece 22, heat dissipation copper ring 5 further dispels the heat through radiating fin 2, can carry out electromagnetic interference protection to circuit board 6 through the protection that sets up, can shield the signal interference of adjacent circuit board through the anti-interference shielding layer 13 that sets up, can eliminate the interference signal of power 12 through the condenser 11 that sets up, can prevent electrostatic interference through the earth wire 18 that sets up.
Although embodiments of the present utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.
Claims (7)
1. A circuit board for interference protection, comprising:
the device comprises a mounting plate (1), wherein the upper surface of the mounting plate (1) is fixedly connected with a protective cover (4);
the first heat dissipation mechanism (8) is fixedly arranged on the inner side of the protective cover (4);
the second heat dissipation mechanism (9) is fixedly arranged at the bottom of the inside of the protective cover (4);
the circuit board (6), circuit board (6) is fixed to be set up at second cooling mechanism (9) top.
2. The circuit board for interference rejection according to claim 1, wherein: the wiring board (6) includes:
the power supply area (10) is arranged on one side of the upper surface of the circuit board (6);
a power supply (12), the power supply (12) being fixedly mounted inside the power supply area (10);
the capacitors (11) are fixedly arranged at two sides of the power supply (12) at equal distances.
3. The circuit board for interference rejection according to claim 1, wherein: the first heat dissipation mechanism (8) includes:
the heat dissipation copper ring (5), the heat dissipation copper ring (5) is fixedly connected to the inner side surface of the protective cover (4);
the through grooves (7) are formed in the cover bodies at two sides of the protective cover (4) at equal intervals;
the radiating fins (2) are fixedly connected to the surfaces of two sides of the radiating copper ring (5) at equal intervals, and the radiating fins (2) penetrate through the grooves (7).
4. The circuit board for interference rejection according to claim 1, wherein: the second heat dissipation mechanism (9) includes:
the semiconductor refrigerating sheets (22) are arranged, the two semiconductor refrigerating sheets (22) are fixedly connected to two sides of the upper surface of the mounting plate (1), and the radiating surfaces of the semiconductor refrigerating sheets (22) are in contact connection with the inner wall of the radiating copper ring (5);
the cold guide plate (20), the said cold guide plate (20) is fixedly connected between two semiconductor refrigerating sheets (22);
the second heat conduction adhesive layer (19), the second heat conduction adhesive layer (19) is adhered to the upper surface of the cold conduction plate (20);
the isolation protective layer (17), isolation protective layer (17) adhesion is at second heat conduction glue film (19) upper surface.
5. The circuit board for interference rejection according to claim 1, wherein: the wiring board (6) includes:
the base plate (16), the said base plate (16) is fixedly connected to isolating the upper surface of the protective layer (17);
the copper foil circuit layer (15), the copper foil circuit layer (15) is fixedly connected to the upper surface of the substrate (16), and a circuit is etched on the upper surface of the copper foil circuit layer (15);
the first heat conduction adhesive layer (14), the first heat conduction adhesive layer (14) is fixedly adhered to the upper surface of the copper foil circuit layer (15), and the first heat conduction adhesive layer (14) is adhered to the area of the surface of the copper foil circuit layer, which is not etched with a circuit;
the anti-interference shielding layer (13), the fixed adhesion of anti-interference shielding layer (13) is in first heat conduction glue film (14) upper surface.
6. The circuit board for interference rejection according to claim 1, wherein: the mounting plate (1) comprises:
the grounding channels (21) are fixedly arranged on the mounting plate (1) at equal intervals, and the grounding channels (21) penetrate through the mounting plate (1), the second heat conducting adhesive layer (19), the cold conducting plate (20) and the isolation protective layer (17);
the grounding wire (18), grounding wire (18) fixed connection sets up in ground connection passageway (21), grounding wire (18) top is connected with circuit board (6).
7. The circuit board for interference rejection according to claim 1, wherein: the mounting plate (1) comprises:
the mounting hole (3), the mounting hole (3) is offered on mounting panel (1) surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223227725.3U CN219019121U (en) | 2022-12-02 | 2022-12-02 | Be used for anti-interference circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223227725.3U CN219019121U (en) | 2022-12-02 | 2022-12-02 | Be used for anti-interference circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219019121U true CN219019121U (en) | 2023-05-12 |
Family
ID=86269436
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202223227725.3U Active CN219019121U (en) | 2022-12-02 | 2022-12-02 | Be used for anti-interference circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219019121U (en) |
-
2022
- 2022-12-02 CN CN202223227725.3U patent/CN219019121U/en active Active
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| GR01 | Patent grant | ||
| GR01 | Patent grant |