CN114051314A

CN114051314A - Multilayer heat conduction type flexible circuit board

Info

Publication number: CN114051314A
Application number: CN202111387139.2A
Authority: CN
Inventors: 罗建业; 段晓静
Original assignee: Shenzhen Xinxiangtai Electronics Co ltd
Current assignee: Shenzhen Xinxiangtai Electronics Co ltd
Priority date: 2021-11-22
Filing date: 2021-11-22
Publication date: 2022-02-15
Anticipated expiration: 2041-11-22
Also published as: CN114051314B

Abstract

The invention discloses a multilayer heat-conducting flexible circuit board, which comprises a bottom plate and a connector, wherein two sides of the bottom plate are fixedly connected with a conducting layer, the outer walls of the two conducting layers are fixedly connected with a flexible substrate, the outer walls of two ends of the bottom plate are fixedly connected with a heat-conducting block, the two heat-conducting blocks are connected with the corresponding conducting layer and the flexible substrate, the outer walls of the two flexible substrates are fixedly sleeved with a protective layer, a heat-radiating block is pulled outwards, the heat-radiating block drives a connected sliding block and a limiting elastic sheet to move outwards in a sliding groove until the limiting elastic sheet moves into a fixing hole formed in the sliding groove, the limiting elastic sheet and the heat-radiating block are fixed by the fixing hole, the heat-radiating block pulls out a heat-radiating plate through a flexible connecting sheet, the heat-radiating plate drives a connecting block on one side to move outwards in the sliding groove, the contact area between the heat-radiating block and air is increased, the radiating area is enlarged, and when the radiator is not used, the radiating block and the radiating plate can be retracted to adjust the heat radiation of the device.

Description

Multilayer heat conduction type flexible circuit board

Technical Field

The invention relates to the technical field of flexible circuit boards, in particular to a multilayer heat-conducting flexible circuit board.

Background

Flexible circuit boards, also known as "flexible boards," are printed circuits made from flexible dielectric substrates that provide excellent electrical performance, meet design requirements for smaller and higher density mounting, and also help reduce assembly processes and enhance reliability.

When the flexible circuit board is used, large current needs to be carried, so that the surface of the flexible circuit board and the joint part can generate heat, after the flexible circuit board is used for a long time, the surface temperature of the flexible circuit board and the joint part gradually rises, the temperature can influence electronic elements connected with the flexible circuit board, the service life of the electronic elements is reduced, and therefore the multilayer heat-conducting flexible circuit board needs to be provided.

Disclosure of Invention

The present invention is directed to a multilayer heat conductive flexible printed circuit board, which solves the above problems.

In order to achieve the purpose, the invention provides the following technical scheme: the multilayer heat conduction type flexible circuit board comprises a bottom plate and joints, wherein two sides of the bottom plate are fixedly connected with a conductive layer, the outer walls of the two conductive layers are fixedly connected with a flexible substrate, the outer walls of the two ends of the bottom plate are fixedly connected with a heat conduction block, the two heat conduction blocks are connected with the corresponding conductive layer and the flexible substrate, the outer walls of the two flexible substrates are fixedly sleeved with a protective layer, the outer walls of the two sides of the two heat conduction blocks are provided with a plurality of sliding cavities at equal intervals in a penetrating manner, the inner walls of the sliding cavities are connected with a connecting block in a sliding manner, the outer walls of the connecting blocks are fixedly connected with a heat dissipation plate, the heat dissipation plates extend to the outside of the corresponding protective layer in a penetrating manner, the two ends of the bottom plate are provided with the two joints, and the two protective layers extend to the outside of the joints, two the both sides outer wall of joint all runs through and has seted up a spout, four the spout all runs through and extends to outside the corresponding protection layer, two the equal sliding connection of inner wall of spout has a slider, and two the equal fixedly connected with radiating block of outer wall of slider, and two the radiating block all extends to outside the corresponding spout, and two spacing shell fragment of the equal fixedly connected with of both ends outer wall of slider, with one side spacing shell fragment all is the symmetry form setting with the radiating block that corresponds, two the inner wall homogeneous phase of spout all runs through to the position of spacing shell fragment and has seted up a fixed orifices.

Preferably, the two heat dissipation blocks at the same upper end and the lower end are fixedly connected with a flexible connecting sheet together with the corresponding heat dissipation plate.

Preferably, the outer walls of the two ends of the two protection layers are provided with a plurality of heat dissipation holes in a penetrating mode.

Preferably, the heat dissipation blocks at the upper end and the lower end of the heat dissipation plate are arranged in parallel with the corresponding heat dissipation plates.

Preferably, the two heat conducting blocks, the heat dissipation plate and the heat dissipation block are all made of aluminum.

Compared with the prior art, the invention has the beneficial effects that: pulling the radiating block to the outside, the slider and the spacing shell fragment of radiating block drive connection in the spout move to the outside, move to the fixed orifices that the spout was seted up until spacing shell fragment, the fixed orifices is fixed spacing shell fragment and radiating block, the radiating block outwards pulls out the heating panel through flexonics piece simultaneously, the heating panel drives the connecting block of one side and moves to the outside in the sliding cavity, heating panel and radiating block and air area of contact increase, increase heat radiating area, when not using, can withdraw radiating block and heating panel, adjusting device's heat dissipation.

Drawings

FIG. 1 is a schematic front view of the present invention;

FIG. 2 is a side view of the base plate of the present invention;

FIG. 3 is a schematic top view of the passivation layer of the present invention;

FIG. 4 is an enlarged view of portion A of FIG. 1 according to the present invention;

fig. 5 is an enlarged schematic structural view of part B in fig. 1 according to the present invention.

In the figure: 1. a base plate; 2. a joint; 3. a conductive layer; 4. a flexible substrate; 5. a heat conducting block; 6. a protective layer; 7. a sliding cavity; 8. connecting blocks; 9. a heat dissipation plate; 10. a chute; 11. a slider; 12. a heat dissipating block; 13. a limiting elastic sheet; 14. a fixing hole; 15. a flexible connecting sheet; 16. and (4) heat dissipation holes.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Referring to fig. 1-5, the present invention provides a technical solution: a multilayer heat conduction type flexible circuit board comprises a bottom plate 1 and joints 2, wherein two sides of the bottom plate 1 are fixedly connected with a conductive layer 3, the outer walls of the two conductive layers 3 are fixedly connected with a flexible substrate 4, the outer walls of two ends of the bottom plate 1 are fixedly connected with a heat conduction block 5, the two heat conduction blocks 5 are connected with the corresponding conductive layer 3 and the flexible substrate 4, the outer walls of the two flexible substrates 4 are fixedly sleeved with a protective layer 6, the outer walls of two sides of the two heat conduction blocks 5 are equidistantly provided with a plurality of sliding cavities 7 in a penetrating manner, the inner walls of the sliding cavities 7 are respectively connected with a connecting block 8 in a sliding manner, the outer walls of the connecting blocks 8 are respectively fixedly connected with a heat dissipation plate 9, the plurality of heat dissipation plates 9 are respectively extended out of the corresponding protective layer 6, two joints 2 are arranged at two ends of the bottom plate 1, and the two protective layers 6 are extended out of the joints 2, two both sides outer walls that connect 2 all run through and have seted up a spout 10, and the equal sliding connection of inner wall of two spouts 10 has a slider 11, four spouts 10 all run through and extend to outside the protective layer 6 that corresponds, radiating block 12 of the equal fixedly connected with of outer wall of two sliders 11, and two radiating blocks 12 all extend to outside the spout 10 that corresponds, and spacing shell fragment 13 of the equal fixedly connected with of both ends outer wall of two sliders 11, it all is the symmetry form setting with the radiating block 12 that corresponds with spacing shell fragment 13, the inner wall homogeneous phase of two spouts 10 all runs through and has seted up a fixed orifices 14 to the position of spacing shell fragment 13.

Wherein, two radiating blocks 12 at the same upper and lower both ends all have a flexible connection piece 15 with the common fixedly connected with of heating panel 9 that corresponds, and the radiating block 12 of being convenient for drives heating panel 9 through flexible connection piece 15 and removes.

Wherein, the outer walls of the two ends of the two protection layers 6 are all penetrated and provided with a plurality of heat dissipation holes 16, which is convenient for the device to increase heat dissipation.

Wherein, a plurality of radiating block 12 at same upper and lower both ends all is the paralleling arrangement with corresponding heating panel 9, prevents that radiating block 12 can not be spacing with heating panel 9.

The two heat conducting blocks 5, the heat dissipation plate 9 and the heat dissipation block 12 are made of aluminum, so that the device can dissipate heat through the heat dissipation plate 9 and the heat dissipation block 12.

Specifically, when the invention is used, in work, the connector 2 is inserted into a joint, the device is opened to work and emit heat, the heat conducting block 5 absorbs the heat generated by the bottom plate 1, the conductive layer 3 and the flexible substrate 4, the heat is transmitted into the heat radiating plate 9 through the heat conducting block 5, the heat radiating plate 9 transmits the heat into the air to radiate the heat, at the moment, the heat radiating block 12 radiates the heat generated by the connector 2 to the outside in the sliding groove 10, when the heat radiation needs to be increased, the heat radiating block 12 is pulled to the outside, the heat radiating block 12 drives the connected sliding block 11 and the limiting elastic sheet 13 to move to the outside in the sliding groove 10 until the limiting elastic sheet 13 moves to the fixing hole 14 formed in the sliding groove 10, the fixing hole 14 fixes the limiting elastic sheet 13 and the heat radiating block 12, the heat radiating block 12 pulls the heat radiating plate 9 outwards through the flexible connecting sheet 15, the heat radiating plate 9 drives the connecting block 8 on one side to move to the outside in the sliding cavity 7, the contact area between the heat dissipation plate 9 and the heat dissipation block 12 and the air is increased, the heat dissipation area is enlarged, when the heat dissipation plate is not used, the limiting elastic sheet 13 outside the sliding groove 10 is pressed, the limiting elastic sheet 13 is moved out of the fixing hole 14, then the heat dissipation block 12 and the heat dissipation plate 9 are pressed, and the heat dissipation block 12 and the heat dissipation plate 9 are respectively moved into the corresponding sliding groove 10 and the corresponding sliding cavity 7.

In the description of the present invention, it is to be understood that the terms "coaxial", "bottom", "one end", "top", "middle", "other end", "upper", "one side", "top", "inner", "front", "center", "both ends", and the like, indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and thus, are not to be construed as limiting the present invention.

Furthermore, the terms "first", "second", "third", "fourth" are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated, whereby the features defined as "first", "second", "third", "fourth" may explicitly or implicitly include at least one such feature.

In the present invention, unless otherwise expressly specified or limited, the terms "mounted," "disposed," "connected," "secured," "screwed" and the like are to be construed broadly, e.g., as meaning fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; the terms may be directly connected or indirectly connected through an intermediate, and may be communication between two elements or interaction relationship between two elements, unless otherwise specifically limited, and the specific meaning of the terms in the present invention will be understood by those skilled in the art according to specific situations.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The multilayer heat-conducting flexible circuit board comprises a bottom plate (1) and a connector (2), and is characterized in that two sides of the bottom plate (1) are fixedly connected with a conducting layer (3), and the outer walls of the two conducting layers (3) are fixedly connected with a flexible substrate (4);

the outer walls of two ends of the bottom plate (1) are fixedly connected with a heat conduction block (5), the two heat conduction blocks (5) are connected with corresponding conductive layers (3) and flexible substrates (4), the outer walls of the two flexible substrates (4) are fixedly sleeved with a protective layer (6), the outer walls of two sides of the two heat conduction blocks (5) are equidistantly provided with a plurality of sliding cavities (7) in a penetrating manner, the inner walls of the sliding cavities (7) are slidably connected with a connecting block (8), the outer walls of the connecting blocks (8) are fixedly connected with a heat dissipation plate (9), the heat dissipation plates (9) are respectively extended out of the corresponding protective layers (6), two joints (2) are arranged at two ends of the bottom plate (1), the two protective layers (6) are extended out of the joints (2), and a sliding groove (10) is arranged on the outer walls of two sides of the joints (2) in a penetrating manner, four outside spout (10) all run through and extend to corresponding protective layer (6), two the equal sliding connection of inner wall of spout (10) has a slider (11), and two outside the equal fixedly connected with radiating block (12) of the outer wall of slider (11), and two radiating block (12) all extend to corresponding spout (10), and two spacing shell fragment (13) of the equal fixedly connected with of both ends outer wall of slider (11), with one side spacing shell fragment (13) all are the symmetry form setting with the radiating block (12) that corresponds, two the inner wall homogeneous phase of spout (10) all runs through for the position of spacing shell fragment (13) and has seted up a fixed orifices (14).

2. The multilayer thermally conductive flexible wiring board of claim 1, wherein: the two heat dissipation blocks (12) at the same upper end and the lower end are fixedly connected with a flexible connecting sheet (15) together with the corresponding heat dissipation plate (9).

3. The multilayer thermally conductive flexible wiring board of claim 1, wherein: and a plurality of heat dissipation holes (16) are formed in the outer walls of the two ends of the two protection layers (6) in a penetrating manner.

4. The multilayer thermally conductive flexible wiring board of claim 1, wherein: the heat dissipation blocks (12) at the upper end and the lower end are arranged in parallel with the corresponding heat dissipation plates (9).

5. The multilayer thermally conductive flexible wiring board of claim 1, wherein: the two heat conducting blocks (5), the heat dissipation plate (9) and the heat dissipation block (12) are all made of aluminum.