CN219514482U - Radar chip heat abstractor and radar - Google Patents
Radar chip heat abstractor and radar Download PDFInfo
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- CN219514482U CN219514482U CN202320112644.4U CN202320112644U CN219514482U CN 219514482 U CN219514482 U CN 219514482U CN 202320112644 U CN202320112644 U CN 202320112644U CN 219514482 U CN219514482 U CN 219514482U
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Abstract
The utility model relates to the technical field of radars, and discloses a radar chip heat dissipation device and a radar. The radar chip heat dissipation device is used for dissipating heat of chips on the circuit board and comprises a shell component and a heat bridge, wherein the shell component surrounds the circuit board and the chips; the radar chip heat dissipating device further includes: the heat bridge is close to the heat transfer between chip one side can and the chip, deviates from the heat transfer between chip one side can and the roof of casing subassembly, and the heat bridge is connected in the lateral wall of casing subassembly. The radar includes a radar chip heat sink. When the chip operates, heat generated by the chip is transferred to the heat bridge, the heat bridge transfers the heat of the chip to the top wall of the shell assembly and the side wall of the shell assembly, the heat dissipation path of the chip is increased, the cooling effect is remarkable, the heat dissipation efficiency of the chip is improved, the volume of the metal heat conduction supporting piece in the prior art is not required to be increased, and the heat dissipation bottleneck problem is solved.
Description
Technical Field
The utility model relates to the technical field of radars, in particular to a radar chip heat dissipation device and a radar.
Background
With the continuous development of electronic technology, the chip integration level is higher and higher, the radar chip has small volume, large heat productivity and large heat flux density, the top surface of the radar chip is a nonmetallic antenna housing, the heat transfer is mainly carried out by surface radiation, and the heat dissipation capacity is limited; in order to increase the distance between radar and range, the power of radar is increased continuously, and the problem of radar heat dissipation is a technical bottleneck in the field.
At present, a metal heat conduction support piece is generally arranged at the bottom of a radar board, heat of a radar chip is transmitted to the metal heat conduction support piece after being transmitted to the radar board, and then the metal heat conduction support piece transmits the heat to a shell for heat dissipation. In order to ensure enough heat dissipation area, the metal heat conduction support piece is large in volume and weight, the heat dissipation mode is large in heat resistance, the volume dependence on the metal heat conduction support piece is high, the volume and the heat dissipation target cannot be considered, the market competitiveness of a product is reduced, and when the loss of a radar chip reaches a certain value, the heat dissipation requirement of a radar cannot be met by increasing the heat dissipation area of the metal heat conduction support piece, and the risk of high-temperature failure exists.
In patent CN111916409a, a power module and a method for manufacturing the same are provided, including a substrate, a power chipset disposed on one side of the substrate, a heat sink disposed on the other side of the substrate, and a heat dissipating bridge disposed on one side of the power chipset facing away from the substrate; the bending structure of the heat conducting layer of the heat radiating bridge is connected with the heat radiator, and heat on the power chip is led out to the heat radiator through the heat radiating bridge, so that heat on the power chip can be led out to the heat radiator from the substrate side and also can be led out to the heat radiator from the heat radiating bridge side, and double-sided heat radiation of the power module is realized by using one heat radiator. However, the heat of the power chip group is transferred to the radiator through the radiating bridge, the heat transfer direction of the radiating bridge is single, and the radiating efficiency is poor.
Based on this, a radar chip heat dissipating device and a radar are needed to solve the above-mentioned problems.
Disclosure of Invention
Based on the above, the utility model aims to provide the radar chip heat dissipation device and the radar, which increase the heat dissipation path of the chip, have obvious cooling effect, improve the heat dissipation efficiency of the chip, and solve the heat dissipation bottleneck problem without increasing the volume of the metal heat conduction supporting piece in the prior art.
In order to achieve the above purpose, the utility model adopts the following technical scheme:
a radar chip heat sink for dissipating heat from a chip on a circuit board, the radar chip heat sink comprising a housing assembly surrounding the circuit board and the chip; the radar chip heat dissipation device further includes:
the heat bridge, heat bridge be close to chip one side can with heat transfer between the chip, deviate from chip one side can with heat transfer between the roof of casing subassembly, just the heat bridge connect in the lateral wall of casing subassembly.
As a preferred technical scheme of the radar chip heat dissipation device, the end part of the heat bridge is provided with a flanging which is connected with the side wall of the shell component through screws or welding.
As an preferable technical scheme of the radar chip heat dissipating device, the heat dissipating device further comprises a heat conducting support member, the heat conducting support member supports one side of the circuit board, which is away from the heat bridge, and heat of the circuit board can be transferred to the bottom wall of the shell component through the heat conducting support member.
As an optimized technical scheme of the radar chip heat dissipation device, the heat conduction supporting piece is provided with a heat conduction boss, and the heat conduction boss is attached to one side, away from the chip, of the circuit board.
As an optimized technical scheme of the radar chip heat dissipation device, the chip is arranged on a chip mounting position of the circuit board, a heat conduction hole capable of being covered by the chip is arranged in the chip mounting position, and the heat conduction hole is positioned between the heat conduction boss and the chip.
As a preferred technical scheme of the radar chip heat dissipation device, the side wall of the heat conduction hole is provided with a heat conduction layer.
As an optimized technical scheme of the radar chip heat dissipation device, a heat conduction piece is welded on one side of the chip installation position, which is far away from the chip, the heat conduction piece is positioned between the heat conduction boss and the circuit board, and a heat conduction medium is arranged between the heat conduction piece and the heat conduction boss.
As an optimized technical scheme of the radar chip heat dissipation device, the radar chip heat dissipation device further comprises a wave absorbing piece, wherein the wave absorbing piece is covered on the chip, and the wave absorbing piece is arranged between the heat bridge and the top wall of the shell assembly.
As an optimized technical scheme of the radar chip heat dissipation device, heat conducting media are arranged between the wave absorbing piece and the shell assembly and between the wave absorbing piece and the heat bridge.
The utility model further aims to provide the radar, so that the radiating efficiency of the radar is improved, the radiating requirement of the radar is met, and the working reliability of the radar is improved.
In order to achieve the above purpose, the utility model adopts the following technical scheme:
the radar comprises a circuit board, a chip and the radar chip heat dissipation device according to any scheme, wherein the chip is mounted on the circuit board, the circuit board is arranged in the radar chip heat dissipation device, and the radar chip heat dissipation device is used for dissipating heat of the chip on the circuit board.
The beneficial effects of the utility model are as follows:
the utility model provides a radar chip heat dissipation device, a heat bridge is arranged between a chip and the top wall of a shell component, when the chip runs, heat generated by the chip is transferred to the heat bridge, the heat bridge transfers the heat of the chip to the top wall of the shell component and the side wall of the shell component, multi-directional heat transfer is realized through the heat bridge to dissipate heat, a heat dissipation path of the chip is increased, a cooling effect is obvious, the heat dissipation efficiency of the chip is improved, the volume of a metal heat conduction support piece in the prior art is not required to be increased, and the heat dissipation bottleneck problem is solved.
The utility model provides a radar, which comprises the radar chip heat dissipation device, so that the heat dissipation efficiency of the radar is improved, the heat dissipation requirement of the radar is met, and the working reliability of the radar is improved.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the following description will briefly explain the drawings needed in the description of the embodiments of the present utility model, and it is obvious that the drawings in the following description are only some embodiments of the present utility model, and other drawings may be obtained according to the contents of the embodiments of the present utility model and these drawings without inventive effort for those skilled in the art.
Fig. 1 is a schematic structural diagram of a heat dissipating device for a radar chip according to an embodiment of the present utility model;
fig. 2 is a schematic diagram of a part of a heat dissipating device for a radar chip according to an embodiment of the present utility model.
The figures are labeled as follows:
1. a circuit board; 11. a chip mounting position;
2. a chip;
3. a housing assembly; 31. an antenna housing; 32. a base;
4. a thermal bridge; 41. flanging;
5. a thermally conductive support; 51. a thermally conductive boss;
6. a heat conductive member; 7. a wave absorbing member.
Detailed Description
The utility model is described in further detail below with reference to the drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the utility model and are not limiting thereof. It should be further noted that, for convenience of description, only some, but not all of the structures related to the present utility model are shown in the drawings.
In the description of the present utility model, unless explicitly stated and limited otherwise, the terms "connected," "connected," and "fixed" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communicated with the inside of two elements or the interaction relationship of the two elements. The specific meaning of the above terms in the present utility model will be understood in specific cases by those of ordinary skill in the art.
In the present utility model, unless expressly stated or limited otherwise, a first feature "above" or "below" a second feature may include both the first and second features being in direct contact, as well as the first and second features not being in direct contact but being in contact with each other through additional features therebetween. Moreover, a first feature being "above," "over" and "on" a second feature includes the first feature being directly above and obliquely above the second feature, or simply indicating that the first feature is higher in level than the second feature. The first feature being "under", "below" and "beneath" the second feature includes the first feature being directly under and obliquely below the second feature, or simply means that the first feature is less level than the second feature.
In the description of the present embodiment, the terms "upper", "lower", "left", "right", and the like are orientation or positional relationships based on those shown in the drawings, merely for convenience of description and simplicity of operation, and do not indicate or imply that the apparatus or elements referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the utility model. Furthermore, the terms "first," "second," and the like, are used merely for distinguishing between descriptions and not for distinguishing between them.
In the prior art, the radar chip only depends on the metal heat conduction support piece at the bottom of the radar board to dissipate heat, when the heat dissipation requirement of the chip is large, the heat dissipation target can be achieved only by increasing the volume of the metal heat conduction support piece, so that the market competitiveness of a product is reduced, and the heat dissipation optimization effect is not obvious.
In order to solve the above problems, as shown in fig. 1 and 2, the present embodiment provides a radar, which includes a circuit board 1, a chip 2 and a radar chip heat dissipation device, the chip 2 is mounted on a chip mounting position 11 of the circuit board 1, the fixing manner may be welded fixing, the circuit board 1 is disposed inside the radar chip heat dissipation device, the radar chip heat dissipation device is used for dissipating heat of the chip 2 on the circuit board 1, so as to improve the heat dissipation efficiency of the radar, satisfy the heat dissipation requirement of the radar, and improve the working reliability of the radar. The radar chip heat dissipation device comprises a shell component 3 and a thermal bridge 4, wherein the shell component 3 surrounds the circuit board 1 and the chip 2; the heat bridge 4 is located the chip 2 and deviates from circuit board 1 one side, and heat transfer between chip 2 can be close to chip 2 one side to heat bridge 4, deviates from heat transfer between chip 2 one side can and the roof of casing subassembly 3, and heat bridge 4 connects in the lateral wall of casing subassembly 3. When the chip 2 operates, heat generated by the chip 2 is transferred to the thermal bridge 4, the thermal bridge 4 transfers the heat of the chip 2 to the top wall of the shell component 3 to form a first heat dissipation path, the thermal bridge 4 can also transfer the heat of the chip 2 to the side wall of the shell component 3 to form a second heat dissipation path, and compared with the prior art in which the radar chip only dissipates heat by means of the metal heat conduction support piece at the bottom of the radar plate, the heat dissipation path of the chip 2 is increased, and the heat dissipation efficiency of the chip 2 is improved.
In this embodiment, the end of the thermal bridge 4 is provided with a flange 41, the flange 41 is connected to the side wall of the housing assembly 3 through screw connection or welding, and the flange 41 is provided to increase the contact area between the thermal bridge 4 and the side wall of the housing assembly 3, so as to increase or decrease the heat transfer efficiency, and improve the heat dissipation efficiency of the chip 2; furthermore, the flange 41 has a large contact area with the side wall of the housing assembly 3, which facilitates connection and increases the connection strength. In this embodiment, the thermal bridge 4 is a metal conductor, and is made of copper or aluminum, so as to improve the heat dissipation efficiency of the top of the chip 2.
It should be noted that, this radar chip heat abstractor still includes heat conduction support piece 5, heat conduction support piece 5 supports circuit board 1 and deviates from heat bridge 4 one side, the mode that circuit board 1 was fixed in heat conduction support piece 5 can be the fixed mode of screw fixation or joint, and the heat of circuit board 1 can be through heat conduction support piece 5 transfer in the diapire of casing subassembly 3, on the one hand, realized the fixed of circuit board 1, on the other hand, the heat of chip 2 is through circuit board 1 transfer to heat conduction support piece 5, the heat of circuit board 1 can be through heat conduction support piece 5 transfer in the diapire of casing subassembly 3, in order to form the third radiating path, the radiating effect of chip 2 has been improved. In this embodiment, the heat-conducting support member 5 is made of a heat-conducting metal material.
Further, the heat conduction support piece 5 is provided with the heat conduction boss 51, and heat conduction boss 51 and heat conduction support piece 5 integrated into one piece, and heat conduction boss 51 and chip 2 correspond to set up in circuit board 1 both sides, and heat conduction boss 51 laminating circuit board 1 deviates from chip 2 one side, and chip 2 passes through circuit board 1 with the heat transfer to the heat conduction boss 51 of heat conduction support piece 5, improves heat transfer efficiency. The chip 2 is arranged corresponding to the heat conduction boss 51, so that the weight of the heat conduction supporting piece 5 is reduced, and the product competitiveness is improved.
Further, a heat conducting hole capable of being covered by the chip 2 is formed in the chip mounting position 11, the heat conducting hole is located between the heat conducting boss 51 and the chip 2, and heat of the chip 2 can be transferred to the heat conducting boss 51 through the heat conducting hole. Furthermore, the side wall of the heat conduction hole is provided with a heat conduction layer. In this embodiment, the heat conducting layer is made of copper sheet, so that the heat conducting efficiency between the chip 2 and the heat conducting support piece 5 is increased.
Furthermore, the side of the chip mounting position 11, which is far away from the chip 2, is welded with the heat conducting member 6, the heat conducting member 6 is located between the heat conducting boss 51 and the circuit board 1, a heat conducting medium is arranged between the heat conducting member 6 and the heat conducting boss 51, the heat conducting member 6 increases the heat conducting efficiency of the heat conducting holes and the heat conducting boss 51, the heat conducting medium fills the gap between the heat conducting member 6 and the heat conducting boss 51, the heat resistance is reduced, and the heat conducting efficiency between the heat conducting member 6 and the heat conducting boss 51 is improved. In this embodiment, the heat conducting member 6 is copper foil, and the heat conducting medium is a heat conducting pad or a heat conducting gel.
It should be noted that, in the present embodiment, the housing assembly 3 includes a base 32 and a radome 31, the radome 31 is mounted on the top of the base 32, the thermal bridge 4 is fixed on the side wall of the base 32 by screws, the radome 31 is used for protecting the circuit board 1, and the radome 31 can be penetrated by radar microwaves. The radome 31 is a cover body formed by injection molding polybutylene terephthalate plus 30% glass fiber. The wall thickness of the radome 31 is a specific value designed according to the propagation characteristics of the wavelength, so that the influence and interference on the microwave can be reduced, the transmission and the reception of the radar microwave are truest, the accuracy of data is improved, and the reliability of the radar is ensured.
The radar chip heat dissipation device further comprises a wave absorbing member 7, the wave absorbing member 7 is covered on the chip 2, the wave absorbing member 7 is arranged between the heat bridge 4 and the top wall of the shell assembly 3, and the wave absorbing member 7 is fixed below the antenna housing 31 and is in pressure connection with the heat bridge 4 in the embodiment. On the one hand, the wave absorbing piece 7 can absorb electromagnetic wave energy emitted by the radar chip, interference of electromagnetic waves to the antenna is reduced, and on the other hand, heat of the thermal bridge 4 can be transferred to the top wall of the shell assembly 3 through the wave absorbing piece 7, and the heat dissipation effect on the chip 2 is improved. The heat bridge 4 and the wave absorbing member 7 should avoid the antenna in the housing assembly 3, so as to prevent the radiation effect of the antenna from being affected.
Further, heat conducting media are arranged between the wave absorbing piece 7 and the shell assembly 3 and between the wave absorbing piece 7 and the thermal bridge 4, so that heat resistance between the wave absorbing piece 7 and the shell assembly 3 and heat resistance between the wave absorbing piece 7 and the thermal bridge 4 are reduced, and heat transfer efficiency of the first heat dissipation path is improved.
It should be noted that, heat generated during operation of the chip 2 is mainly transferred to the external environment through three paths. The first heat dissipation path is transmitted to the thermal bridge 4 through the top of the chip 2, and is transmitted to the wave absorbing piece 7 and the radome 31 by the thermal bridge 4; a second heat dissipation path is transmitted to the thermal bridge 4 through the top of the chip 2, and is transmitted to the side wall of the shell component 3 by the thermal bridge 4; the third heat dissipation path is transferred to the circuit board 1 through the bottom of the chip 2 and then to the thermally conductive support 5 and the housing assembly 3. Compared with the prior art, the embodiment increases two heat dissipation paths, greatly improves heat dissipation efficiency, reduces the junction temperature of the chip 2 by more than 10 ℃ under specific use conditions, ensures the temperature reliability of the chip 2, solves the heat dissipation bottleneck problem of the chip 2, and achieves the purposes of small volume and reliable heat dissipation.
Note that the above is only a preferred embodiment of the present utility model and the technical principle applied. It will be understood by those skilled in the art that the present utility model is not limited to the particular embodiments described herein, but is capable of various obvious changes, rearrangements and substitutions as will now become apparent to those skilled in the art without departing from the scope of the utility model. Therefore, while the utility model has been described in connection with the above embodiments, the utility model is not limited to the embodiments, but may be embodied in many other equivalent forms without departing from the spirit or scope of the utility model, which is set forth in the following claims.
Claims (10)
1. A radar chip heat dissipating device for dissipating heat from a chip (2) on a circuit board (1), the radar chip heat dissipating device comprising a housing assembly (3), the housing assembly (3) surrounding the circuit board (1) and the chip (2); the radar chip heat dissipation device is characterized by further comprising:
the heat bridge (4), heat bridge (4) be close to chip (2) one side can with heat transfer between chip (2), deviate from chip (2) one side can with heat transfer between the roof of casing subassembly (3), just heat bridge (4) connect in the lateral wall of casing subassembly (3).
2. The radar chip heat sink according to claim 1, characterized in that the end of the thermal bridge (4) is provided with a flange (41), the flange (41) being connected to the side wall of the housing assembly (3) by means of screw connections or welding.
3. The radar chip heat sink according to claim 1, further comprising a thermally conductive support (5), the thermally conductive support (5) supporting a side of the circuit board (1) facing away from the thermal bridge (4), and heat of the circuit board (1) being transferable to a bottom wall of the housing assembly (3) via the thermally conductive support (5).
4. A radar chip heat sink according to claim 3, characterised in that the thermally conductive support (5) is provided with a thermally conductive boss (51), the thermally conductive boss (51) being attached to a side of the circuit board (1) facing away from the chip (2).
5. The radar chip heat dissipating device according to claim 4, wherein the chip (2) is mounted on a chip mounting location (11) of the circuit board (1), and a heat conduction hole capable of being covered by the chip (2) is provided in the chip mounting location (11), and the heat conduction hole is located between the heat conduction boss (51) and the chip (2).
6. The radar chip heat dissipating device of claim 5, wherein a side wall of the heat conducting hole is provided with a heat conducting layer.
7. The radar chip heat dissipating device according to claim 5, wherein a heat conducting member (6) is welded on a side of the chip mounting position (11) away from the chip (2), the heat conducting member (6) is located between the heat conducting boss (51) and the circuit board (1), and a heat conducting medium is provided between the heat conducting member (6) and the heat conducting boss (51).
8. The radar chip heat dissipating device according to claim 1, further comprising a wave absorbing member (7), wherein the wave absorbing member (7) is covered on the chip (2), and wherein the wave absorbing member (7) is arranged between the thermal bridge (4) and a top wall of the housing assembly (3).
9. The radar chip heat sink according to claim 8, characterized in that a heat conducting medium is arranged between the wave absorbing member (7) and the housing assembly (3) and between the wave absorbing member (7) and the thermal bridge (4).
10. A radar, characterized by comprising a circuit board (1), a chip (2) and a radar chip heat dissipating device according to any one of claims 1-9, wherein the chip (2) is mounted on the circuit board (1), the circuit board (1) is arranged inside the radar chip heat dissipating device, and the radar chip heat dissipating device is used for dissipating heat of the chip (2) on the circuit board (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320112644.4U CN219514482U (en) | 2023-01-19 | 2023-01-19 | Radar chip heat abstractor and radar |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320112644.4U CN219514482U (en) | 2023-01-19 | 2023-01-19 | Radar chip heat abstractor and radar |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219514482U true CN219514482U (en) | 2023-08-11 |
Family
ID=87523249
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202320112644.4U Active CN219514482U (en) | 2023-01-19 | 2023-01-19 | Radar chip heat abstractor and radar |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219514482U (en) |
-
2023
- 2023-01-19 CN CN202320112644.4U patent/CN219514482U/en active Active
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