CN217655285U - Radar structure - Google Patents
Radar structure Download PDFInfo
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- CN217655285U CN217655285U CN202221105401.XU CN202221105401U CN217655285U CN 217655285 U CN217655285 U CN 217655285U CN 202221105401 U CN202221105401 U CN 202221105401U CN 217655285 U CN217655285 U CN 217655285U
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Abstract
The application discloses a radar structure. The radar structure comprises a housing and a first circuit board located in the housing; the shell comprises a bottom plate, a cover plate and a shell body, wherein the bottom plate and the cover plate are arranged oppositely, the shell body is positioned between the bottom plate and the cover plate, and the shell body is fixedly connected with the bottom plate and the cover plate; the first circuit board is fixedly connected with one side of the shell close to the cover plate; and heat dissipation structures are arranged on two sides of the first circuit board. The technical scheme that this application discloses sets up heat radiation structure through the both sides at first circuit board, makes first circuit board can two sides simultaneously heat dissipation cooling to the problem that current on-vehicle millimeter wave radar radiating effect is not good has been solved.
Description
Technical Field
The application relates to the technical field of radars, in particular to a radar structure.
Background
The vehicle-mounted millimeter wave radar is one of core sensors of an automatic driving function. The vehicle-mounted millimeter wave radar emits millimeter waves with the wavelength of 1-10nm and the frequency of 30-300 GHz outwards through the antenna, receives reflected signals, processes the reflected signals, quickly and accurately acquires physical environment information around an automobile body, and then carries out intelligent processing and decision making according to the ascertained object information.
On-vehicle millimeter wave radar includes the casing and is located the PCB board of casing, is provided with a plurality of electronic component on the PCB, can produce a large amount of heats at the operation in-process, but current on-vehicle millimeter wave radar radiating effect is poor, can't go out the produced heat exchange of electronic component operation on the PCB board for the temperature of whole on-vehicle millimeter wave radar risees rapidly, and then influences the stability of whole on-vehicle millimeter wave radar work.
SUMMERY OF THE UTILITY MODEL
The embodiment of the application provides a radar structure to effectively solve the current not good problem of on-vehicle millimeter wave radar radiating effect.
According to one aspect of the present application, there is provided a radar structure comprising a housing and a first circuit board located within the housing;
the shell comprises a bottom plate, a cover plate and a shell body, wherein the bottom plate and the cover plate are arranged oppositely, the shell body is positioned between the bottom plate and the cover plate, and the shell body is fixedly connected with the bottom plate and the cover plate;
the first circuit board is fixedly connected with one side, close to the cover plate, of the shell;
and heat dissipation structures are arranged on two sides of the first circuit board.
Further, the heat dissipation structure comprises a heat dissipation seat and a heat dissipation bridge, wherein the heat dissipation seat is located on one side, close to the shell, of the first circuit board and is fixedly connected with the shell, the heat dissipation bridge is located on one side, close to the cover plate, of the first circuit board and is in heat conduction connection with the heat dissipation seat, one side of the heat dissipation bridge is abutted to the cover plate, a first preset gap is formed between the other side of the heat dissipation bridge and the first circuit board, and a heat conductor is filled in the first preset gap.
Further, the heat dissipation bridge is in heat conduction connection with the heat dissipation base through a first boss structure, and the first boss structure penetrates through the first circuit board.
Further, the heat dissipating bridge is a metal bridge.
Furthermore, at least one second boss structure is further arranged on the heat dissipation seat, a second preset gap is formed between the second boss structure and the first circuit board, and the heat conductor is filled in the second preset gap.
Further, the radar structure further comprises a second circuit board located in the shell, the second circuit board is fixedly connected with one side, close to the bottom plate, of the shell, and the second circuit board is electrically connected with the first circuit board through a connector.
Furthermore, at least one third boss structure is arranged on the bottom plate, a third preset gap is formed between the third boss structure and the second circuit board, and the heat conductor is also filled in the third preset gap.
Further, the heat conductor is heat-conducting silica gel.
Furthermore, a plurality of heat dissipation teeth are arranged on one side of the bottom plate, which is far away from the shell, and the heat dissipation teeth are arranged in an array mode at least comprising one row or one column.
Furthermore, a data interface used for being electrically connected with an external circuit is arranged on the shell, and the data interface is electrically connected with the second circuit board.
Further, at least one shielding plate is arranged on one side, close to the first circuit board, of the cover plate, and a preset distance is reserved between the shielding plate and the first circuit board.
The application has the advantages that the heat dissipation structures are arranged on the two sides of the first circuit board, so that the first circuit board can dissipate heat on two sides simultaneously, the heat dissipation speed of the first circuit board is improved, heat exchange generated by operation of electronic elements on the first circuit board can be rapidly conducted out, and the problem that the existing vehicle-mounted millimeter wave radar is poor in heat dissipation effect is solved. Exemplarily, a heat dissipation bridge is arranged on one side of the first circuit board close to the cover plate, a second boss structure is arranged on one side of the first circuit board close to the shell, and heat generated by the operation of the electronic element on the first circuit board is transferred to the heat dissipation bridge, the second boss structure and the heat dissipation seat through the heat conductor, so that heat dissipation and temperature reduction are realized. Simultaneously, as the heat conductor through heat conduction silica gel, heat conductor and first circuit board flexible contact when guaranteeing the radiating effect, avoid causing the damage to first circuit board.
Drawings
The technical solutions and other advantages of the present application will become apparent from the following detailed description of specific embodiments of the present application when taken in conjunction with the accompanying drawings.
Fig. 1 is an exploded view of a vehicle millimeter wave radar provided in some embodiments of the present application;
FIG. 2 is a top view of the in-vehicle millimeter wave radar provided in the embodiment of FIG. 1;
FIG. 3 isbase:Sub>A cross-sectional view taken along A-A of FIG. 2;
FIG. 4 is a cross-sectional view taken along line B-B of FIG. 2;
fig. 5 is a perspective view of the vehicle-mounted millimeter wave radar provided in the embodiment of fig. 1.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. It is to be understood that the embodiments described are only a few embodiments of the present application and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
In the description of the present application, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; may be mechanically connected, may be electrically connected or may be in communication with each other; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.
At least one embodiment of the present application provides a radar structure comprising a housing and a first circuit board located within the housing;
the shell comprises a bottom plate, a cover plate and a shell body, wherein the bottom plate and the cover plate are oppositely arranged, the shell body is positioned between the bottom plate and the cover plate, and the shell body is fixedly connected with the bottom plate and the cover plate;
the first circuit board is fixedly connected with one side of the shell close to the cover plate;
and heat dissipation structures are arranged on two sides of the first circuit board.
It is from top to bottom, set up heat radiation structure through the both sides at first circuit board, make first circuit board can the both sides simultaneously dispel the heat to improve the radiating rate of first circuit board, can go out the produced heat exchange of electronic component operation on the first circuit board fast, solved the poor problem of current on-vehicle millimeter wave radar radiating effect.
Fig. 1 is an exploded view ofbase:Sub>A vehicle-mounted millimeter wave radar provided in an embodiment of the present application, fig. 2 isbase:Sub>A top view of the vehicle-mounted millimeter wave radar provided in the embodiment of fig. 1, fig. 3 isbase:Sub>A sectional view of fig. 2 taken alongbase:Sub>A directionbase:Sub>A-base:Sub>A, fig. 4 isbase:Sub>A sectional view of fig. 2 taken alongbase:Sub>A direction B-B, and fig. 5 isbase:Sub>A perspective view of the vehicle-mounted millimeter wave radar provided in the embodiment of fig. 1.
As shown in fig. 1, the radar structure includes a housing 10 and a first circuit board 20 located inside the housing 10;
the housing 10 includes a bottom plate 110 and a cover plate 120 oppositely disposed, and a shell 130 located between the bottom plate 110 and the cover plate 120, the shell 130 is fixedly connected with the bottom plate 110 and the cover plate 120;
the first circuit board 20 is fixedly connected with one side of the shell 130 close to the cover plate 120;
wherein, the two sides of the first circuit board 20 are provided with heat dissipation structures 30.
As shown in fig. 2-4, in the present embodiment, the heat dissipation structure 30 includes a heat dissipation seat 330 located on one side of the first circuit board 20 close to the housing 130 and fixedly connected to the housing 130, and a heat dissipation bridge 310 located on one side of the first circuit board 20 close to the cover plate 120 and thermally connected to the heat dissipation seat 330, wherein one side of the heat dissipation bridge 310 abuts against the cover plate 120, a first predetermined gap is formed between the other side of the heat dissipation bridge 310 and the first circuit board 20, and the first predetermined gap is filled with a heat conductor 320. It should be noted that the height of the first predetermined gap is smaller than the height of the heat conductor 320, and the heat conductor 320 is in interference with the first predetermined gap, so that two ends of the heat conductor 320 are respectively abutted against the heat dissipation bridge 310 and the first circuit board 20, thereby ensuring heat dissipation, for example, the height of the first predetermined gap is 0.7mm, and the height of the heat conductor 320 is 1mm.
In the present embodiment, the heat sink bridge 310 is thermally connected to the heat sink 330 through the first bump structure 1301, and the first bump structure 1301 passes through the first circuit board 20. It is noted that the heat dissipating bridge 310 may be mounted on the first boss structure 1301 by fasteners. Exemplarily, in the present embodiment, the heat dissipation bridge 310 is a metal bridge. The material of the heat dissipating bridge 310 may be aluminum. By arranging the heat dissipating bridge 310 on the side of the first circuit board 20 close to the cover plate 120, the heat generated by the operation of the electronic components on the first circuit board 20 is transferred to the heat dissipating bridge 310 by the heat conductor 320, thereby achieving heat dissipation and temperature reduction.
In this embodiment, at least one second bump structure 1302 is further disposed on the heat sink 330, a second predetermined gap is formed between the second bump structure 1302 and the first circuit board 20, and the second predetermined gap is also filled with the heat conductor 320. It should be noted that the height of the second predetermined gap is smaller than the height of the heat conductor 320, and the heat conductor 320 is in interference with the second predetermined gap, so that two ends of the heat conductor 320 are respectively abutted against the second boss structure 1302 and the first circuit board 20, thereby ensuring heat dissipation, for example, the height of the second predetermined gap is 0.7mm, and the height of the heat conductor 320 is 1mm. By disposing the second boss structure 1302 on the side of the first circuit board 20 close to the housing 130, the heat generated by the operation of the electronic component on the first circuit board 20 is transferred to the second boss structure 1302 and the heat sink 330 by the heat conductor 320, so as to further achieve heat dissipation and cooling.
In the present embodiment, the radar structure further includes a second circuit board 40 located inside the casing 10, the second circuit board 40 is fixedly connected to a side of the casing 130 close to the bottom plate 110, and the second circuit board 40 is electrically connected to the first circuit board 20 through the connector 50.
In this embodiment, at least one third bump structure 1101 is disposed on the bottom plate 110, a third predetermined gap is formed between the third bump structure 1101 and the second circuit board 40, and the heat conductor 320 is also filled in the third predetermined gap. It should be noted that the height of the third predetermined gap is smaller than the height of the heat conductor 320, and the heat conductor 320 is in interference with the third predetermined gap, so that two ends of the heat conductor 320 are respectively abutted against the third boss structure 1101 and the second circuit board 40, thereby ensuring heat dissipation, for example, the height of the third predetermined gap is 0.7mm, and the height of the heat conductor 320 is 1mm. By arranging the third boss structure 1101 on the bottom plate 110, the heat conductor 320 is utilized to transfer the heat generated by the operation of the electronic components on the second circuit board 40 to the third boss structure 1101 and the bottom plate 110, thereby achieving heat dissipation and temperature reduction.
In the present embodiment, the heat conductor 320 is a heat conductive silicone. Through heat conduction silica gel as heat conductor 320, heat conductor 320 and first circuit board 20, second circuit board 40 flexonics are when guaranteeing the radiating effect, are avoided causing the damage to first circuit board 20 and second circuit board 40.
As shown in fig. 5, in the present embodiment, a side of the bottom plate away from the housing 130 is provided with a plurality of heat dissipation teeth 1102, and the plurality of heat dissipation teeth 1102 are arranged in an array manner including at least one row or one column. The heat dissipation area is increased through the heat dissipation teeth 1102, the heat dissipation and cooling are fast, the temperature of the radar is further reduced, and normal and long-term work of the radar is guaranteed.
In the present embodiment, the housing 130 is provided with a data interface 60 for electrical connection with an external circuit, and the data interface 60 is electrically connected with the second circuit board 40.
In the present embodiment, at least one shielding plate 70 is disposed on a side of the cover plate 120 close to the first circuit board 20, and the shielding plate 70 has a preset distance from the first circuit board 20.
It is from top to bottom visible, set up heat radiation structure through the both sides at first circuit board, make first circuit board can the both sides dispel the heat simultaneously to improve the radiating rate of first circuit board, can go out the produced heat exchange because of electronic component operation on the first circuit board fast, solved the poor problem of current on-vehicle millimeter wave radar radiating effect. Exemplarily, a heat dissipation bridge is arranged on one side of the first circuit board close to the cover plate, a second boss structure is arranged on one side of the first circuit board close to the shell, and heat generated by the operation of the electronic element on the first circuit board is transferred to the heat dissipation bridge, the second boss structure and the heat dissipation seat through the heat conductor, so that heat dissipation and temperature reduction are realized. Simultaneously, regard as the heat conductor through heat conduction silica gel, heat conductor and first circuit board flexonics are when guaranteeing the radiating effect, avoid causing the damage to first circuit board.
In various embodiments of the present application, unless otherwise specified or conflicting, terms or descriptions between different embodiments have consistency and may be mutually referenced, and technical features in different embodiments may be combined to form a new embodiment according to their inherent logical relationships. In this application, "at least one" means one or more, "a plurality" means two or more.
It is to be understood that the various numerical references referred to in the embodiments of the present application are merely for convenience of description and distinction and are not intended to limit the scope of the embodiments of the present application. The sequence numbers of the above processes do not mean the execution sequence, and the execution sequence of the processes should be determined by the functions and the inherent logic.
The radar structure provided by the embodiment of the present application is introduced in detail, and a specific example is applied to explain the principle and the implementation manner of the present application, and the description of the embodiment is only used to help understanding the method and the core idea of the present application; meanwhile, for a person skilled in the art, according to the idea of the present application, the specific implementation manner and the application scope may be changed, and in summary, the content of the present specification should not be construed as a limitation to the present application.
Claims (11)
1. A radar structure, comprising a housing and a first circuit board located within the housing;
the shell comprises a bottom plate, a cover plate and a shell body, wherein the bottom plate and the cover plate are oppositely arranged, the shell body is positioned between the bottom plate and the cover plate, and the shell body is fixedly connected with the bottom plate and the cover plate;
the first circuit board is fixedly connected with one side, close to the cover plate, of the shell;
and heat dissipation structures are arranged on two sides of the first circuit board.
2. The radar structure according to claim 1, wherein the heat dissipation structure includes a heat dissipation seat located on one side of the first circuit board close to the housing and fixedly connected to the housing, and a heat dissipation bridge located on one side of the first circuit board close to the cover plate and thermally connected to the heat dissipation seat, wherein one side of the heat dissipation bridge abuts against the cover plate, a first predetermined gap is formed between the other side of the heat dissipation bridge and the first circuit board, and a heat conductor is filled in the first predetermined gap.
3. The radar structure of claim 2, wherein the heat dissipating bridge is in thermally conductive connection with the heat sink via a first boss structure, and the first boss structure passes through the first circuit board.
4. The radar structure of claim 3, wherein the heat dissipating bridge is a metal bridge.
5. The radar structure of claim 3, wherein at least one second bump structure is further disposed on the heat sink, a second predetermined gap is formed between the second bump structure and the first circuit board, and the second predetermined gap is filled with the thermal conductor.
6. The radar structure of claim 5, further comprising a second circuit board located within the enclosure, the second circuit board being fixedly connected to a side of the housing proximate the backplane, and the second circuit board being electrically connected to the first circuit board via a connector.
7. The radar structure of claim 6, wherein at least one third bump structure is disposed on the bottom plate, and a third predetermined gap is formed between the third bump structure and the second circuit board, and the heat conductor is filled in the third predetermined gap.
8. Radar structure according to any one of claims 2 to 7, characterised in that the heat conductor is a thermally conductive silica gel.
9. The radar structure of claim 8, wherein a side of the base plate remote from the housing is provided with a plurality of heat dissipating teeth arranged in an array including at least one row or column.
10. The radar structure of claim 6, wherein the housing is provided with a data interface for electrical connection with an external circuit, the data interface being electrically connected with the second circuit board.
11. The radar structure of claim 10, wherein at least one shielding plate is disposed on a side of the cover plate close to the first circuit board, and the shielding plate has a predetermined distance from the first circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221105401.XU CN217655285U (en) | 2022-05-09 | 2022-05-09 | Radar structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221105401.XU CN217655285U (en) | 2022-05-09 | 2022-05-09 | Radar structure |
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| Publication Number | Publication Date |
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| CN217655285U true CN217655285U (en) | 2022-10-25 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202221105401.XU Active CN217655285U (en) | 2022-05-09 | 2022-05-09 | Radar structure |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115988857A (en) * | 2023-03-22 | 2023-04-18 | 中兴通讯股份有限公司 | Radar assembly |
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2022
- 2022-05-09 CN CN202221105401.XU patent/CN217655285U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115988857A (en) * | 2023-03-22 | 2023-04-18 | 中兴通讯股份有限公司 | Radar assembly |
| CN115988857B (en) * | 2023-03-22 | 2023-06-20 | 中兴通讯股份有限公司 | Radar assembly |
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