CN220305494U - Radar apparatus - Google Patents

Abstract

Embodiments of the present application disclose a radar apparatus. The radar device comprises a shell assembly, a first circuit board, an antenna module, a partition board and a first electronic element. The shell component is provided with an accommodating cavity; the first circuit board is accommodated in the accommodating cavity and is provided with a first through hole; the antenna module is accommodated in the accommodating cavity and arranged on the first circuit board and used for transmitting and receiving radio waves; the baffle is accommodated in the accommodating cavity and is arranged at one side of the first circuit board in the thickness direction of the first circuit board; the first electronic element is accommodated in the accommodating cavity and arranged in the partition plate, and the first electronic element penetrates through the first circuit board through the first through hole. According to the embodiment of the application, the utilization rate of the internal space of the radar device is improved, and the overall size of the radar device is reduced.

Description

Radar apparatus

Technical Field

The present application relates to the technical field of radio wave ranging devices, and in particular, to a radar device.

Background

The radar device transmits millimeter waves with the wavelength of 1-10nm and the frequency of 30-300 GHZ outwards through the antenna, receives the reflected signals, processes the reflected signals to quickly and accurately acquire surrounding physical environment information, and then carries out intelligent processing and decision making according to the detected object information.

The radar device comprises a shell, a PCB (printed circuit board) positioned in the shell and an electronic element arranged on the PCB. At present, the utilization rate of the internal space of the radar device is low, and the external dimension is large.

Disclosure of Invention

The embodiment of the application provides a radar device, improves the utilization rate of the internal space of the radar device, and reduces the overall dimension.

In order to solve the technical problems, the embodiment of the application discloses the following technical scheme:

in one aspect, a radar apparatus is provided that includes a housing assembly, a first circuit board, an antenna module, a spacer, and a first electronic component. The shell component is provided with an accommodating cavity; the first circuit board is accommodated in the accommodating cavity and is provided with a first through hole; the antenna module is accommodated in the accommodating cavity and arranged on the first circuit board and used for transmitting and receiving radio waves; the baffle is accommodated in the accommodating cavity and is arranged at one side of the first circuit board in the thickness direction of the first circuit board; the first electronic element is accommodated in the accommodating cavity and arranged in the partition plate, and the first electronic element penetrates through the first circuit board through the first through hole.

The first electronic element is arranged on the partition board and penetrates through the first through hole to be arranged on the first circuit board, so that the space occupied by the first circuit board and the gap between the partition board and the first circuit board are fully utilized, the space occupied by the first electronic element is reduced, the utilization rate of the internal space of the radar device is improved, and the overall dimension of the radar device is further reduced.

In addition to or in lieu of one or more of the features disclosed above, the spacer has a second through-hole disposed opposite the first through-hole, the first electronic component also being disposed through the spacer by the second through-hole.

The space occupied by the partition board is fully utilized, and the space occupied by the first electronic element is further reduced.

In addition to or in lieu of one or more of the features disclosed above, the housing assembly has a transparent region disposed opposite the first through-hole. The first electronic component is an image acquisition module, and the image acquisition module is used for acquiring an image through the transparent area.

In addition to one or more features disclosed above, or alternatively, the separator has a stretching portion that stretches toward one side in a plate thickness direction of the separator, and makes one side surface of the separator form a groove and the other side surface form a protrusion. The radar device further comprises a second electronic element, the second electronic element is electrically connected with the first electronic element, and the second electronic element is arranged in the groove.

The stretching part forms a groove at one side of the partition board, and the second electronic element is arranged in the groove, so that the protruding height of the second electronic element at one side of the partition board, which is opposite to the first circuit board, can be reduced, and the electronic element at one side of the partition board, which is opposite to the first circuit board, is avoided. In addition, the stretching part forms a bulge at the other side of the partition board, so that the bulge can be abutted against the electronic component on the first circuit board, and the stretching part can radiate heat to the electronic component on the first circuit board under the condition of having heat conducting property.

In addition to or in lieu of one or more of the features disclosed above, the separator has third and fourth through-holes spaced apart. The radar apparatus further comprises a bale and a strapping. The material bag is internally provided with materials. The binding belt sequentially passes through the third through hole and the fourth through hole and binds the material bag on the partition plate.

Through binding the material package in the baffle, can make full use of the space of baffle side, compare in the material package setting in other regions, can improve space utilization.

In addition to or in lieu of one or more of the features disclosed above, the diaphragm is removably coupled to the housing assembly and the first circuit board is removably coupled to the diaphragm.

Thereby, the assembly of the separator is facilitated.

In addition to or as an alternative to one or more of the features disclosed above, the separator is made of a thermally conductive material. The radar device further comprises a third electronic element, the third electronic element is arranged on the first circuit board and located on one side, facing the partition board, of the first circuit board, and the third electronic element is abutted to the partition board.

In addition to or in lieu of one or more of the features disclosed above, the radar apparatus further includes a second circuit board received in the receiving cavity and disposed on a side of the barrier facing away from the first circuit board.

The second circuit board is arranged, and a part of electronic elements in the radar device can be arranged on the second circuit board, so that the space of the partition board on the side opposite to the first circuit board is fully utilized. The first circuit board, the partition board and the second circuit board are arranged in a stacked mode, and space utilization rate in the radar device is further improved.

In addition to or in lieu of one or more of the features disclosed above, the radar apparatus also includes a first connector and a second connector. The first connector is arranged on the first circuit board and is positioned on one side of the first circuit board facing the partition board; the second connector is arranged on the second circuit board and is positioned on one side of the second circuit board facing the partition board; the partition board is provided with a fifth through hole, the first connector and the second connector are in plug-in fit, and the first connector and/or the second connector are/is arranged on the partition board in a penetrating mode through the fifth through hole.

The fifth through hole is formed in the partition board, so that the first circuit board and the second circuit board pass through the partition board to be electrically connected, and the space outside the partition board is not required to be occupied, and the space utilization rate is improved.

In addition to or in lieu of one or more of the features disclosed above, the first circuit board, the second circuit board, and the spacer are disposed generally parallel.

In addition to or in lieu of one or more of the features disclosed above, the housing assembly includes a bottom shell and a radome. One side of the bottom shell is open; the antenna cover is arranged at the opening of the bottom shell and forms a containing cavity with the bottom shell in a surrounding way; the first circuit board is located on one side of the partition board, which faces the radome, and the partition board is detachably connected to the bottom shell.

When the antenna cover is assembled, the partition board and the first circuit board are assembled to the bottom shell, and then the antenna cover is arranged on the bottom shell. Thereby, the first circuit board and the partition plate are more easily assembled.

In addition to or in lieu of one or more of the features disclosed above, the outer edge of the baffle has a first notch, the gap between the outer edge of the baffle and the inner wall surface of the bottom shell in an area other than the first notch is less than 5mm; or, the outer edge of the first circuit board is provided with a second notch, and a gap between the outer edge of the first circuit board and the inner wall surface of the bottom shell in a region beyond the second notch is smaller than 5mm.

The clearance between the outer edges of the partition plate and the first circuit board and the inner wall surface of the bottom shell is smaller than a preset value, so that the inner space of the shell assembly is more compact. For the convenience of grabbing the partition board and the first circuit board, a first notch and a second notch are arranged, and the first notch and the second notch can be used for accommodating fingers or grabbing tools of operators. In addition, the first notch and the second notch can also be used for accommodating the conductive wire in the radar device, so that the space utilization rate is improved.

One of the above technical solutions has the following advantages or beneficial effects:

the first electronic element is arranged on the partition board and penetrates through the first through hole to be arranged on the first circuit board, so that the space occupied by the first circuit board and the gap between the partition board and the first circuit board are fully utilized, the space occupied by the first electronic element is reduced, the utilization rate of the internal space of the radar device is improved, and the overall dimension of the radar device is further reduced.

Drawings

Technical solutions and other advantageous effects of the present application will be made apparent from the following detailed description of specific embodiments of the present application with reference to the accompanying drawings.

FIG. 1 is a schematic three-dimensional structure of a radar apparatus according to an embodiment of the present application;

FIG. 2 is a cross-sectional view A-A of FIG. 1;

fig. 3 is a three-dimensional exploded view of the radar apparatus shown in fig. 1 from a first perspective (from the top);

fig. 4 is a three-dimensional exploded view of the radar apparatus shown in fig. 1 from a second perspective (from the bottom).

Reference numerals illustrate:

100-radar apparatus; a 101-housing assembly; 103 accommodating cavities; 105-transparent areas; 107-a first circuit board; 109-a first through hole; 111-a second circuit board; 113-a separator; 115-an antenna module; 117-a first electronic component; 119-a second through hole; 121-a stretching part; 123-grooves; 125-bump; 127-a second electronic component; 129-third through hole; 131-fourth through holes; 133-material package; 135-strapping; 137-a third electronic component; 139-a fifth through hole; 141-a first connector; 143-a second connector; 145-bottom case; 147-radome; 149-first gap; 151-a second gap; 153-third gap.

Detailed Description

In order to make the objects, technical solutions and advantageous effects of the present application more clear, the present application is further described in detail below with reference to the accompanying drawings and detailed description. It should be understood that the detailed description is presented herein for purposes of illustration only and is not intended to limit the application.

In the description of the present application, it should be understood that the terms "center," "longitudinal," "transverse," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," etc. indicate or are based on the orientation or positional relationship shown in the drawings, merely for convenience of description and to simplify the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present application. Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more of the described features. In the description of the present application, the meaning of "a plurality" means two or more, unless specifically defined otherwise.

In the description of the present application, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; the connection may be mechanical connection, direct connection or indirect connection through an intermediate medium, and may be internal connection of two elements or interaction relationship of two elements. The specific meaning of the terms in this application will be understood by those of ordinary skill in the art as the case may be.

In this application, unless expressly stated or limited otherwise, a first feature "above" or "below" a second feature may include both the first and second features being in direct contact, and may also include the first and second features not being in direct contact but being in contact with each other by way of additional features therebetween. Moreover, a first feature being "above," "over" and "on" a second feature includes the first feature being directly above and obliquely above the second feature, or simply indicating that the first feature is higher in level than the second feature. The first feature being "under", "below" and "beneath" the second feature includes the first feature being directly above and obliquely above the second feature, or simply indicating that the first feature is less level than the second feature.

In the following embodiments, a radar apparatus (traffic radar) applied to road monitoring is exemplified, but the radar apparatus of the present application is not limited thereto, and the radar apparatus may also be applied to the fields of vehicles, ships, unmanned aerial vehicles, aerospace equipment, and the like. The radar apparatus of the following embodiments may be millimeter wave radar, microwave radar, centimeter wave radar, or the like.

Please refer to fig. 1 and 2. Fig. 1 is a schematic three-dimensional structure of a radar apparatus 100 according to an embodiment of the present application. Fig. 2 is a sectional view A-A in fig. 1.

The radar apparatus 100 includes a housing assembly 101, a first circuit board 107, an antenna module 115, a spacer 113, and a second circuit board 111.

The housing assembly 101 has a receiving cavity 103. The remaining components of the radar apparatus 100 are accommodated in the accommodation chamber 103 to be isolated from the outside. Specifically, the housing assembly 101 includes a bottom case 145 and a radome 147.

The bottom chassis 145 may be made of a heat conductive material (e.g., aluminum alloy) to improve the heat dissipation effect of the housing assembly 101. One side of the bottom chassis 145 is open.

The antenna housing 147 is covered at the opening of the bottom shell 145, and forms a containing cavity 103 with the bottom shell 145. The radome 147 is made of a material capable of transmitting radio waves, for example, injection-molded from PBT (polybutylene terephthalate). Radio waves are emitted from inside to outside through the radome 147 or radio waves are reflected from outside to inside through the radome 147 back into the receiving cavity 103.

In order to make the junction of the radome 147 and the bottom case 145 have a good sealing effect, a labyrinth seal structure may be formed at the junction, or a sealing ring may be provided at the junction. The radome 147 and the bottom chassis 145 may be connected at the joint surface by laser welding.

The first circuit board 107 is accommodated in the accommodating cavity 103. The first circuit board 107 is detachably connected to the partition 113. Specifically, the first circuit board 107 is fastened to the spacer 113 by screws.

The antenna module 115 is accommodated in the accommodating cavity 103 and disposed on the first circuit board 107 for transmitting and receiving radio waves. Specifically, the antenna module 115 is disposed on the side of the first circuit board 107 facing the radome 147. The antenna module 115 is electrically connected to the first circuit board 107.

The first circuit board 107 is further provided with a feeder structure (not visible in the figures) and a radio frequency chip (hereinafter third electronic element 137). The radio frequency chip is responsible for modulating signals, the radio frequency chip transmitting port transmits radio waves to the antenna module 115 through the feeder line structure, the returned radio waves return to the radio frequency chip receiving port after passing through the antenna module 115 and the feeder line structure, and the conversion from analog signals to digital signals is completed.

The partition 113 is accommodated in the accommodation chamber 103. The spacer 113 is provided on one side of the first circuit board 107 in the board thickness direction of the first circuit board 107. Specifically, the spacer 113 is disposed on the side of the first circuit board 107 facing away from the radome 147.

The diaphragm 113 is detachably connected to the housing assembly 101. Specifically, the partition 113 is detachably connected with the bottom chassis 145. More specifically, the partition 113 is fastened to the bottom chassis 145 by screws.

The partition 113 is made of a heat conductive material. The material of the separator 113 is, for example, aluminum alloy. In the case where the separator 113 is metal, the separator 113 can also realize an electromagnetic shielding function.

The second circuit board 111 is accommodated in the accommodating cavity 103, and is disposed on a side of the partition 113 facing away from the first circuit board 107. The second circuit board 111 is detachably connected to the housing assembly 101. Specifically, the second circuit board 111 is detachably connected to the bottom chassis 145. More specifically, the second circuit board 111 is fastened to the bottom chassis 145 by screws.

The second circuit board 111 is also provided with a high-speed signal processor (not visible in the figure), DDR (not visible in the figure), power module (not visible in the figure), ethernet controller (not visible in the figure), and the like. The data of the rf chip on the first circuit board 107 is transferred to the second circuit board 111. The electronic components on the second circuit board 111 perform fast fourier transform (Fast Fourier Transform, FFT) to obtain distance, angle and speed information of the target, and convert the information into ethernet signals for external transmission.

Wherein the first circuit board 107, the second circuit board 111 and the spacer 113 are disposed substantially in parallel. The areas of the first circuit board 107 and the second circuit board 111 are substantially equal.

Please refer to fig. 3. Fig. 3 is a three-dimensional exploded view of the radar apparatus 100 shown in fig. 1 from a first perspective (from the top).

During assembly, the second circuit board 111 is locked to the bottom case 145, the partition 113 is locked to the bottom case 145, the first circuit board 107 is locked to the partition 113, and the radome 147 is covered on the bottom case 145.

The first circuit board 107 and the second circuit board 111 adopt a stacked design, so that the external size of the radar apparatus 100 is effectively reduced.

The radar apparatus 100 further comprises a first electronic component 117. The first electronic component 117 is an image capturing module. The image acquisition module is, for example, a camera or a video camera.

Correspondingly, the housing assembly 101 has a transparent region 105. The first circuit board 107 has a first through hole 109. The partition 113 has a second through hole 119. The transparent region 105 is disposed opposite to the first through hole 109. The second through hole 119 is disposed opposite to the first through hole 109.

The first electronic component 117 is accommodated in the accommodating cavity 103 and is disposed on the partition 113. The first electronic component 117 is disposed through the first through hole 109 and penetrates the first circuit board 107. The first electronic component is further disposed through the second through hole 119 and penetrates the partition 113.

The first electronic component 117 is used to acquire an image through the transparent region 105.

So set up, make full use of the space that first circuit board 107 and baffle 113 occupy and the clearance between baffle 113 and the first circuit board 107, reduced the space that first electronic component 117 occupy, improved radar unit 100's interior space utilization, and then reduced radar unit 100's overall dimension.

Please refer to fig. 4. Fig. 4 is a three-dimensional exploded view of the radar apparatus 100 shown in fig. 1 from a second perspective (from the bottom).

The radar apparatus 100 further includes a second electronic component 127, where the second electronic component 127 is electrically connected to the first electronic component 117. The second electronic component 127 is an image processor for processing an image obtained in correspondence with the first electronic component 117. The electronic components on the second circuit board 111 fuse the image data with the radar data.

In order to avoid the electronic component on the side of the spacer 113 facing away from the first circuit board 107, the spacer 113 has a tensile portion 121. The stretching portion 121 stretches toward one side (toward the radome 147 side) in the plate thickness direction of the separator 113, and forms a groove 123 on one side surface of the separator 113 and a protrusion 125 on the other side surface. In the case where the separator 113 is made of a metal material, the stretching portion 121 may be formed by press molding.

Wherein the second electronic component 127 is disposed in the recess 123. Thereby, the protruding height of the second electronic component 127 on the side of the spacer 113 facing away from the first circuit board 107 is reduced.

The radar apparatus 100 further includes a third electronic component 137, where the third electronic component 137 is disposed on the first circuit board 107 and located on a side of the first circuit board 107 facing the partition 113, and the third electronic component 137 abuts against the partition 113. The third electronic component 137 may be in direct contact or indirect contact with the separator 113. Indirect contact is for example: a heat conductive adhesive or a heat conductive pad is interposed between the third electronic component 137 and the separator 113. Specifically, the third electronic component 137 may abut the protrusion 125. The third electronic component 137 heats up during operation and the heat is dissipated through the separator 113.

Radar apparatus 100 also includes a bale 133 and a strap 135. The pack 133 contains material. Specifically, the material is a desiccant. The separator 113 has a third through hole 129 and a fourth through hole 131 provided at a distance. In the figure, the number of the third through holes 129 and the fourth through holes 131 is two. The tie 135 passes through the third through hole 129 and the fourth through hole 131 in order, and ties the pack 133 to the separator 113. By binding the bag 133 to the separator 113, the space on the side surface of the separator 113 can be fully utilized, and the space utilization rate can be improved.

The radar apparatus 100 further includes a first connector 141 and a second connector 143. The first connector 141 is disposed on the first circuit board 107 and located on a side of the first circuit board 107 facing the partition 113. The second connector 143 is disposed on the second circuit board 111 and located on a side of the second circuit board 111 facing the partition 113. The partition 113 has a fifth through hole 139, and the first connector 141 and the second connector 143 are inserted and coupled, and the first connector 141 and/or the second connector 143 are/is inserted into the partition 113 through the fifth through hole 139. "and/or" means in particular: the first connector 141 is disposed through the partition 113, or the second connector 143 is disposed through the partition 113, or both the first connector 141 and the second connector 143 are disposed through the partition 113.

During assembly, the first circuit board 107 is pressed against the side of the partition 113, so that the first connector 141 and the second connector 143 are plugged, and the first circuit board 107 is locked to the partition 113.

The fifth through hole 139 is provided on the partition 113, so that the first circuit board 107 and the second circuit board 111 pass through the partition 113 to be electrically connected, and the first connector 141 and the second connector 143 do not occupy the space outside the partition 113, thereby improving the space utilization rate in the housing assembly 101.

To further improve the space utilization efficiency inside the housing assembly 101, the shape and the size of the outer edges of the partition plate 113, the first circuit board 107, and the second circuit board 111 are matched with the shape and the size of the inner wall surface of the housing assembly 101 (bottom case 145), so that the gaps between the outer edges of the partition plate 113, the first circuit board 107, and the second circuit board 111 and the housing assembly 101, respectively, are smaller than a predetermined value. The predetermined value may be 5mm below, or other reasonable dimensions. For easy gripping, the outer edges of the spacer 113, the first circuit board 107 and the second circuit board 111 are also provided with notches.

Specifically, the outer edge of the partition 113 has a first notch 149, and a gap between an area of the outer edge of the partition 113 outside the first notch 149 and the inner wall surface of the bottom chassis 145 is less than 5mm.

The outer edge of the first circuit board 107 has a second notch 151, and a gap between the outer edge of the first circuit board 107 and the inner wall surface of the bottom chassis 145 in a region other than the second notch 151 is less than 5mm.

The outer edge of the second circuit board 111 has a third notch 153, and a gap between the outer edge of the second circuit board 111 and the inner wall surface of the bottom chassis 145 in an area other than the third notch 153 is less than 5mm.

The first notch 149, the second notch 151, and the third notch 153 may be used to receive a finger or a grasping tool of an operator. In addition, the first notch 149, the second notch 151 and the third notch 153 may be used to accommodate conductive wires in the radar apparatus 100, thereby improving space utilization.

In summary, the embodiment of the application improves the internal space utilization rate of the radar device, and further reduces the external dimension of the radar device.

The above steps are presented merely to aid in understanding the method, structure, and core ideas of the present application. It will be apparent to those skilled in the art that various changes and modifications can be made herein without departing from the principles of the application, which are also intended to be within the scope of the appended claims.

Claims (12)

1. A radar apparatus, comprising:

a housing assembly having a receiving cavity;

the first circuit board is accommodated in the accommodating cavity and is provided with a first through hole;

the antenna module is accommodated in the accommodating cavity and arranged on the first circuit board and used for transmitting and receiving radio waves;

the partition board is accommodated in the accommodating cavity and is arranged on one side of the first circuit board in the board thickness direction of the first circuit board;

the first electronic element is accommodated in the accommodating cavity and arranged on the partition board, and the first electronic element penetrates through the first through hole and is arranged on the first circuit board.

2. The radar apparatus of claim 1, wherein,

the partition plate is provided with a second through hole, the second through hole is opposite to the first through hole, and the first electronic element is also arranged on the partition plate in a penetrating way through the second through hole.

3. The radar apparatus according to claim 2, wherein,

the shell component is provided with a transparent area, and the transparent area is arranged opposite to the first through hole;

the first electronic component is an image acquisition module, and the image acquisition module is used for acquiring an image through the transparent area.

4. The radar apparatus of claim 1, wherein,

the separator has a stretching portion that stretches toward one side in a plate thickness direction of the separator and forms a groove on one side surface and a protrusion on the other side surface of the separator;

the radar device further comprises a second electronic element, wherein the second electronic element is electrically connected with the first electronic element, and the second electronic element is arranged in the groove.

5. The radar apparatus of claim 1, wherein,

the partition plate is provided with a third through hole and a fourth through hole which are arranged at intervals;

the radar apparatus further includes:

the material bag is internally provided with materials;

the ribbon passes through the third through hole and the fourth through hole in sequence, and binds the material bag to the partition plate.

6. The radar apparatus of claim 1, wherein,

the partition board is detachably connected with the shell assembly, and the first circuit board is detachably connected with the partition board.

7. The radar apparatus of claim 1, wherein,

the partition board is made of a heat-conducting material;

the radar device further comprises a third electronic element, wherein the third electronic element is arranged on the first circuit board and located on one side, facing the partition board, of the first circuit board, and the third electronic element is abutted to the partition board.

8. The radar apparatus of claim 1, further comprising:

the second circuit board is accommodated in the accommodating cavity and is arranged on one side, opposite to the first circuit board, of the partition plate.

9. The radar apparatus of claim 8, further comprising:

the first connector is arranged on the first circuit board and is positioned on one side of the first circuit board facing the partition board;

the second connector is arranged on the second circuit board and is positioned on one side of the second circuit board facing the partition board;

the partition board is provided with a fifth through hole, the first connector and the second connector are in plug-in fit, and the first connector and/or the second connector are/is arranged on the partition board in a penetrating mode through the fifth through hole.

10. The radar apparatus of claim 8, wherein,

the first circuit board, the second circuit board and the partition board are arranged in parallel.

11. The radar apparatus of claim 1, wherein the housing assembly comprises:

a bottom case having one side opened;

the antenna cover is arranged at the opening of the bottom shell and surrounds the accommodating cavity with the bottom shell;

the first circuit board is located on one side, facing the radome, of the partition board, and the partition board is detachably connected to the bottom shell.

12. The radar apparatus of claim 11, wherein,

the outer edge of the partition plate is provided with a first notch, and a gap between the outer edge of the partition plate and the inner wall surface of the bottom shell in the area beyond the first notch is smaller than 5mm; or,

the outer edge of the first circuit board is provided with a second notch, and a gap between the outer edge of the first circuit board and the inner wall surface of the bottom shell in the area beyond the second notch is smaller than 5mm.