CN218998363U - Anticreep high heat conduction Printed Circuit Board (PCB) - Google Patents
Anticreep high heat conduction Printed Circuit Board (PCB) Download PDFInfo
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- CN218998363U CN218998363U CN202222923978.8U CN202222923978U CN218998363U CN 218998363 U CN218998363 U CN 218998363U CN 202222923978 U CN202222923978 U CN 202222923978U CN 218998363 U CN218998363 U CN 218998363U
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- circuit board
- heat conduction
- mounting
- frame body
- heat
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/10—Energy storage using batteries
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Abstract
The utility model discloses an anti-creeping high-heat-conductivity printed PCB circuit board, which comprises a circuit board, wherein heat-conducting devices are arranged at the lower end of the circuit board, mounting plates are arranged at the left end and the right end of the circuit board, mounting screws are arranged at the front part and the rear part of the upper end of the two mounting plates, mounting seats are arranged at the lower ends of the two mounting plates, a protection frame body is jointly arranged at the lower ends of the two mounting seats, heat-conducting devices are jointly arranged at the middle part and the right part of the rear end of the protection frame body, and protection devices are jointly arranged at the left part and the right part of the upper end of the protection frame body. According to the anti-creeping high-heat-conductivity printed PCB circuit board, the circuit board is protected through the protection device, so that the circuit board is prevented from being scratched by the outside, and meanwhile, water drops outside are prevented from being sputtered on the circuit board, the using effect of the circuit board is improved, the circuit board is radiated through the heat conduction device and the heat radiation device, and the radiating effect of the circuit board is effectively improved.
Description
Technical Field
The utility model relates to the technical field of circuit boards, in particular to an anti-creeping high-heat-conductivity printed PCB circuit board.
Background
The circuit board is also called a circuit board, a ceramic circuit board, a PCB board, an aluminum substrate, a high-frequency board, a thick copper plate, an impedance board, etc. The circuit board enables the circuit to be miniaturized and visualized, and plays an important role in mass production of fixed circuits and optimization of the layout of electrical appliances.
The prior art (application number 202021696590.3) discloses an anticreep high heat conduction printed circuit board, wherein proposes that the welding has various electronic components on the PCB circuit board generally, and these electronic components can produce a large amount of heat when simultaneous working, and current PCB board radiating effect is not good, works for a long time, because the accumulative heat can influence the performance of circuit board, will lead to the life of PCB board to reduce, and leakage protection function is not good, falls in some collisions, does not possess better protect function to electronic components. In summary, the existing PCB circuit board has the following problems:
1. the circuit board is not well protected before and after installation, the circuit board is easily scratched by the outside, and once water drops are sputtered on the circuit board from the outside, the circuit board is easily leaked, so that the using effect of the circuit board is affected; 2. when the circuit board works for a long time, heat in the circuit board can continuously accumulate, so that the circuit board is overheated and the service life of the circuit board is influenced.
Disclosure of Invention
The utility model mainly aims to provide an anti-creeping high-heat-conductivity printed PCB circuit board, which can effectively solve the problems that the circuit board is not well protected before and after installation, is easily scratched by the outside, and can easily cause electric leakage of the circuit board once water drops are sputtered on the circuit board from the outside, thereby influencing the use effect of the circuit board; when the circuit board works for a long time, heat in the circuit board can continuously accumulate, so that the circuit board is overheated and the service life of the circuit board is influenced.
In order to achieve the above purpose, the technical scheme adopted by the utility model is as follows:
the utility model provides an anticreep high heat conduction printed PCB circuit board, includes the circuit board, heat abstractor is installed to the circuit board lower extreme, the mounting panel is all installed to circuit board left end and right-hand member, two the mounting screw is all installed to mounting panel upper end front portion and upper end rear portion, two the mount pad is all installed to the mounting panel lower extreme, two the protection support body is installed jointly to the mount pad lower extreme, heat abstractor is installed jointly in protection support body rear end middle part and rear end right part, protector is installed jointly to protection support body upper end left part and upper end right part.
Preferably, the protection device comprises an upper cover plate, two fixing screws are respectively arranged at the left part of the upper end of the upper cover plate and the right part of the upper end of the upper cover plate, clamping plates are respectively arranged at the left part of the lower end of the upper cover plate and the right part of the lower end of the upper cover plate, a vent is formed in the lower end of the protection frame body, two screw holes are respectively formed in the front part of the upper end of the protection frame body and the rear part of the upper end of the protection frame body, clamping grooves are respectively formed in the left part of the upper end of the protection frame body and the right part of the upper end of the upper cover plate, and the upper cover plate is arranged at the upper end of the protection frame body through the fixing screws. The upper cover plate on the protection device is initially placed at the upper end of the protection frame body by the clamping plate, at the moment, the fixing screw is screwed into the screw hole, and then the upper cover plate is fixed at the upper end of the protection frame body, and the upper cover plate and the protection frame body are connected together, so that a protection whole is formed on the circuit board, the circuit board is prevented from being scratched by the outside, and meanwhile, water drops outside the circuit board are prevented from being sputtered on the circuit board, and the use effect of the circuit board is improved.
Preferably, the heat conduction device comprises a heat conduction copper foil, insulating heat conduction glue is arranged at the upper end of the heat conduction copper foil, a plurality of heat conduction columns are jointly arranged at the upper ends of the heat conduction copper foil and the insulating heat conduction glue, and the heat conduction copper foil is arranged at the lower end of the circuit board. Heat inside and the lower extreme of circuit board is transmitted to the heat conduction copper foil through heat conduction post and insulating heat conduction glue on the heat conduction device, and finally the heat is dissipated through the heat conduction copper foil.
Preferably, the heat dissipating device comprises two mounting cylinders, the two mounting cylinders are provided with fans at the rear ends of the mounting cylinders, and the middle part of the rear end of the protective frame body and the right part of the rear end are provided with mounting grooves, and the two mounting cylinders are respectively arranged in the two mounting grooves. The two fans on the heat dissipation device blow wind into the protection frame body to further blow and dissipate heat of the circuit board, so that the heat dissipation effect of the circuit board is effectively improved.
Preferably, the clamping plate is consistent with the clamping groove in size and corresponds to the clamping groove in position up and down.
Preferably, the fan is located in the mounting cylinder, and a gap exists between the fan and the circuit board.
Compared with the prior art, the utility model has the following beneficial effects:
1. the mounting screws on the mounting plates on two sides of the circuit board are fixed on the two mounting seats, so that the circuit board is fixed in the protective frame body, the upper cover plate on the protective device is initially placed at the upper end of the protective frame body through the clamping plate, the fixing screws are screwed into the screw holes, the upper cover plate is further fixed at the upper end of the protective frame body, the upper cover plate and the protective frame body are connected together, the circuit board is protected integrally, the circuit board is prevented from being scratched and rubbed outside, and meanwhile water drops outside the circuit board are prevented from being sputtered on the circuit board, so that the use effect of the circuit board is improved.
2. When the circuit board works for a long time and is overheated, firstly, heat of the inner part and the lower end of the circuit board is transferred to the heat conducting copper foil through the heat conducting column and the insulating heat conducting glue on the heat conducting device, and finally, the heat is dissipated through the heat conducting copper foil, meanwhile, wind is blown into the protective frame body through two fans on the heat dissipating device, and the circuit board is further blown to dissipate heat, so that the heat dissipating effect of the circuit board is effectively improved.
Drawings
Fig. 1 is a schematic diagram of the overall structure of an anti-creeping high-thermal-conductivity printed PCB circuit board according to the present utility model;
fig. 2 is a schematic diagram of the whole structure of a protection device of an anti-creeping high-thermal-conductivity printed PCB circuit board according to the present utility model;
fig. 3 is a schematic diagram of the overall structure of a heat conduction device of an anti-creeping high-heat conduction printed PCB circuit board according to the present utility model;
fig. 4 is a schematic diagram of the overall structure of a heat dissipating device of an anti-leakage high-thermal-conductivity printed PCB circuit board according to the present utility model.
In the figure: 1. a circuit board; 2. a protective device; 3. a heat conduction device; 4. a heat sink; 5. a mounting plate; 6. installing a screw; 7. a mounting base; 8. a protective frame body; 20. an upper cover plate; 21. a clamping plate; 22. a set screw; 23. screw holes; 24. a clamping groove; 25. a vent; 30. a thermally conductive copper foil; 31. insulating heat-conducting glue; 32. a heat conducting column; 40. a mounting cylinder; 41. a fan; 42. and a mounting groove.
Detailed Description
The utility model is further described in connection with the following detailed description, in order to make the technical means, the creation characteristics, the achievement of the purpose and the effect of the utility model easy to understand.
In the description of the present utility model, it should be noted that the directions or positional relationships indicated by the terms "upper", "lower", "inner", "outer", "front", "rear", "both ends", "one end", "the other end", etc. are based on the directions or positional relationships shown in the drawings, are merely for convenience of describing the present utility model and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific direction, be configured and operated in the specific direction, and thus should not be construed as limiting the present utility model. Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present utility model, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "provided," "connected," and the like are to be construed broadly, and may be fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present utility model will be understood in specific cases by those of ordinary skill in the art.
As shown in fig. 1-4, an anti-leakage high-heat-conductivity printed PCB circuit board comprises a circuit board 1, wherein a heat conducting device 3 is installed at the lower end of the circuit board 1, mounting plates 5 are installed at the left end and the right end of the circuit board 1, mounting screws 6 are installed at the front parts and the rear parts of the upper ends of the two mounting plates 5, mounting seats 7 are installed at the lower ends of the two mounting plates 5, a protection frame body 8 is jointly installed at the lower ends of the two mounting seats 7, a heat radiating device 4 is jointly installed at the middle part and the right part of the rear end of the protection frame body 8, and a protection device 2 is jointly installed at the left part and the right part of the upper end of the protection frame body 8.
The protection device 2 comprises an upper cover plate 20, and two fixing screws 22 are arranged at the left part of the upper end and the right part of the upper end of the upper cover plate 20; in one embodiment, the upper cover 20 is mounted on the upper end of the protection frame 8 by means of screw fixation. The left part and the right part of the lower end of the upper cover plate 20 are respectively provided with a clamping plate 21, the lower end of the protection frame body 8 is provided with a ventilation opening 25, the front part and the rear part of the upper end of the protection frame body 8 are respectively provided with two screw holes 23, the left part and the right part of the upper end of the protection frame body 8 are respectively provided with a clamping groove 24, and the upper cover plate 20 is arranged at the upper end of the protection frame body 8 through fixing screws 22; the clamping plate 21 and the clamping groove 24 are consistent in size and correspond to each other in position. As a specific implementation manner, in this embodiment, the upper cover plate 20 is initially placed at the upper end of the protection frame body 8 by the clamping plate 21, and then the fixing screw 22 is screwed into the screw hole 23, so that the upper cover plate 20 is fixed at the upper end of the protection frame body 8, and the upper cover plate 20 and the protection frame body 8 are connected together, so that a protection whole is formed for the circuit board 1, the circuit board 1 is prevented from being scratched by the outside, and meanwhile, water drops outside the circuit board 1 are prevented from being sputtered on the circuit board 1, so that the use effect of the circuit board 1 is improved.
The heat conduction device 3 comprises a heat conduction copper foil 30, an insulating heat conduction adhesive 31 is arranged at the upper end of the heat conduction copper foil 30, a plurality of heat conduction columns 32 are jointly arranged at the upper ends of the heat conduction copper foil 30 and the insulating heat conduction adhesive 31, and the heat conduction copper foil 30 is arranged at the lower end of the circuit board 1. As a specific embodiment, in this embodiment, the heat in the circuit board 1 and at the lower end is transferred to the heat conductive copper foil 30 through the heat conductive posts 32 and the insulating heat conductive adhesive 31, and finally the heat is dissipated through the heat conductive copper foil 30.
The heat dissipating device 4 comprises two mounting cylinders 40, wherein fans 41 are mounted at the rear ends of the two mounting cylinders 40, mounting grooves 42 are formed in the middle part and the right part of the rear end of the protective frame body 8, and the two mounting cylinders 40 are respectively mounted in the two mounting grooves 42; the fan 41 is located in the mounting cylinder 40 with a gap between the fan 41 and the wiring board 1. As a specific implementation manner, in this embodiment, the two fans 41 blow air into the protection frame body 8, and further blow air to and dissipate heat of the circuit board 1, so that the heat dissipation effect of the circuit board 1 is effectively improved.
It should be noted that, the utility model is an anti-leakage high heat conduction printed PCB circuit board, the circuit board 1 is firstly fixed on two mounting seats 7 through mounting screws 6 on mounting plates 5 at two sides, so that the circuit board 1 is fixed in the protective frame 8, at this time, the upper cover plate 20 on the protective device 2 is firstly initially placed at the upper end of the protective frame 8 by the clamping plate 21, at this time, the fixing screws 22 are screwed into screw holes 23, so that the upper cover plate 20 is fixed at the upper end of the protective frame 8, and the upper cover plate 20 and the protective frame 8 are connected together, so that a protective whole is formed for the circuit board 1, not only is the circuit board 1 prevented from being scratched by the outside, but also the outside water drops are prevented from being sputtered on the circuit board 1, so that the use effect of the circuit board 1 is improved, but also the heat inside the circuit board 1 and the lower end of the circuit board is transferred to the heat conducting 30 through the heat conducting columns 32 and the insulating heat conducting glue 31 on the heat conducting device 3, and finally the heat is discharged through the heat conducting 30, and the two fans 41 on the heat conducting device 4 are used for blowing the copper foil 8 into the protective frame 1, so that the heat dissipation effect is further improved.
The foregoing has shown and described the basic principles and main features of the present utility model and the advantages of the present utility model. It will be understood by those skilled in the art that the present utility model is not limited to the embodiments described above, and that the above embodiments and descriptions are merely illustrative of the principles of the present utility model, and various changes and modifications may be made without departing from the spirit and scope of the utility model, which is defined in the appended claims. The scope of the utility model is defined by the appended claims and equivalents thereof.
Claims (6)
1. The utility model provides an anticreep high heat conduction printed PCB circuit board, includes circuit board (1), its characterized in that: the utility model discloses a circuit board, including circuit board (1), mounting panel (5) are installed to circuit board (1) lower extreme, mounting panel (5) left end and right-hand member, two mounting screw (6) are all installed to mounting panel (5) upper end front portion and upper end rear portion, two mount pad (7) are all installed to mounting panel (5) lower extreme, two protection support body (8) are installed jointly to mount pad (7) lower extreme, heat abstractor (4) are installed jointly in protection support body (8) rear end middle part and rear end right-hand member, protector (2) are installed jointly in protection support body (8) upper end left part and upper end right-hand member.
2. The anti-creeping high heat conduction printed PCB wiring board according to claim 1, wherein: the protection device (2) comprises an upper cover plate (20), two fixing screws (22) are respectively arranged at the left part of the upper end and the right part of the upper end of the upper cover plate (20), clamping plates (21) are respectively arranged at the left part of the lower end and the right part of the lower end of the upper cover plate (20), ventilation openings (25) are respectively arranged at the lower end of the protection frame body (8), two screw holes (23) are respectively arranged at the front part of the upper end and the rear part of the upper end of the protection frame body (8), clamping grooves (24) are respectively arranged at the left part of the upper end and the right part of the upper end of the protection frame body (8), and the upper cover plate (20) is arranged at the upper end of the protection frame body (8) through the fixing screws (22).
3. The anti-creeping high heat conduction printed PCB wiring board according to claim 1, wherein: the heat conduction device (3) comprises a heat conduction copper foil (30), wherein insulating heat conduction glue (31) is arranged at the upper end of the heat conduction copper foil (30), a plurality of heat conduction columns (32) are jointly arranged at the upper ends of the heat conduction copper foil (30) and the insulating heat conduction glue (31), and the heat conduction copper foil (30) is arranged at the lower end of the circuit board (1).
4. The anti-creeping high heat conduction printed PCB wiring board according to claim 1, wherein: the heat dissipation device (4) comprises two mounting cylinders (40), the two mounting cylinders (40) are arranged, fans (41) are mounted at the rear ends of the mounting cylinders (40), mounting grooves (42) are formed in the middle of the rear end of the protection frame body (8) and in the right of the rear end of the protection frame body, and the two mounting cylinders (40) are mounted in the two mounting grooves (42) respectively.
5. The anti-creeping high heat conduction printed PCB wiring board according to claim 2, wherein: the clamping plate (21) and the clamping groove (24) are identical in size and vertically correspond to each other in position.
6. The anti-creeping high heat conduction printed PCB wiring board according to claim 4, wherein: the fan (41) is positioned in the mounting cylinder (40), and a gap exists between the fan (41) and the circuit board (1).
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202222923978.8U CN218998363U (en) | 2022-11-03 | 2022-11-03 | Anticreep high heat conduction Printed Circuit Board (PCB) |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202222923978.8U CN218998363U (en) | 2022-11-03 | 2022-11-03 | Anticreep high heat conduction Printed Circuit Board (PCB) |
Publications (1)
Publication Number | Publication Date |
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CN218998363U true CN218998363U (en) | 2023-05-09 |
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ID=86219084
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN202222923978.8U Active CN218998363U (en) | 2022-11-03 | 2022-11-03 | Anticreep high heat conduction Printed Circuit Board (PCB) |
Country Status (1)
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CN (1) | CN218998363U (en) |
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2022
- 2022-11-03 CN CN202222923978.8U patent/CN218998363U/en active Active
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GR01 | Patent grant | ||
GR01 | Patent grant | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: A leakage proof and high thermal conductivity printed PCB circuit board Effective date of registration: 20230908 Granted publication date: 20230509 Pledgee: Bank of China Limited by Share Ltd. Guilin branch Pledgor: Lipu Xinhongxing Multilayer Electronic Technology Co.,Ltd. Registration number: Y2023450000121 |