CN219437214U - High-precision multilayer circuit board - Google Patents
High-precision multilayer circuit board Download PDFInfo
- Publication number
- CN219437214U CN219437214U CN202223121672.7U CN202223121672U CN219437214U CN 219437214 U CN219437214 U CN 219437214U CN 202223121672 U CN202223121672 U CN 202223121672U CN 219437214 U CN219437214 U CN 219437214U
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- circuit board
- mounting
- multilayer circuit
- box body
- fixing frame
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Abstract
The utility model discloses a high-precision multilayer circuit board which comprises an installation box body, wherein a multilayer circuit board is jointly installed between the left inner wall and the right inner wall of the installation box body, an installation device is jointly installed at the left end and the right end of the installation box body, two fixing screws are installed at the left part and the right part of the upper end of the installation device, a heat radiating device is jointly installed at the left part and the right part of the rear end of the installation box body, installation screw holes are formed in the left part and the right part of the upper end of the installation box body, and a protection device is installed at the upper end of the installation box body. According to the high-precision multilayer circuit board, the side face of the multilayer circuit board is protected through the mounting box body, and the upper surface of the multilayer circuit board is protected through the protection plate on the protection device, so that scratch on the multilayer circuit board is effectively reduced, the service life of the multilayer circuit board is prolonged, the heat dissipation performance of the multilayer circuit board is improved through the heat dissipation device, and shaking on the multilayer circuit board is reduced through the mounting device.
Description
Technical Field
The utility model relates to the technical field of circuit boards, in particular to a high-precision multilayer circuit board.
Background
The circuit board is also called a circuit board, a PCB board, an aluminum substrate, a high-frequency board, a thick copper plate, an impedance board and the like, and the circuit board enables a circuit to be miniaturized and visualized, and plays an important role in mass production of fixed circuits and optimization of electric appliance layout. Compared with the single-layer circuit board, the performance of the multi-layer circuit board is greatly improved, particularly, the requirements on the circuit board are higher and higher at present due to the rapid development of electronic equipment, and therefore, the multi-layer circuit board is widely used.
The prior patent (application number 202121373953.4) discloses a high-precision multilayer PCB circuit board, wherein a structure that most two sides and the top of the traditional high-precision multilayer PCB circuit board are not provided with protection is proposed, so that the PCB circuit board is easy to damage due to collision when in use and storage, the protection effect of the PCB circuit board is reduced, and the use requirement of the prior user is not met; in addition, when the circuit board receives external impact, the circuit board also receives certain vibration, and then the stability of the circuit board is influenced. In summary, the conventional high-precision multilayer circuit board has the following problems:
1. most of the two sides and the top of the circuit board are not provided with protective structures, so that the circuit board is easy to be damaged due to collision when in use and storage; 2. when the circuit board is impacted externally, the circuit board can be vibrated to a certain extent, and the stability of the circuit board is further affected.
Disclosure of Invention
The utility model mainly aims to provide a high-precision multilayer circuit board, which can effectively solve the problem that the circuit board is easy to damage due to collision when being used and stored due to the fact that most of two sides and the top of the circuit board are not provided with protective structures; when the circuit board is impacted externally, the circuit board can also be vibrated to a certain extent, so that the stability of the circuit board is affected.
In order to achieve the above purpose, the technical scheme adopted by the utility model is as follows:
the utility model provides a high-accuracy multilayer circuit board, includes the installation box body, install the multilayer circuit board jointly between installation box body left side inner wall and the right inner wall, installation device is installed jointly to installation box body left end and right-hand member, two fixed screws are all installed to installation device upper end left part and upper end right part, installation box body rear end left part and rear end right part install the heat abstractor jointly, installation screw has all been opened to installation box body upper end left part and upper end right part, protector is installed to installation box body upper end.
Preferably, the protection device comprises a protection plate, mounting frames are all installed at the left end and the right end of the protection plate, mounting screws are all installed at the front portion of the upper end and the rear portion of the upper end of the mounting frames, clamping plates are all installed at the left end and the right end of the multilayer circuit board, the multilayer circuit board is installed between the left inner wall and the right inner wall of the mounting box body through the clamping plates, through holes are all formed in the left portion of the rear end and the right portion of the rear end of the mounting box body, and the protection plate is installed at the upper end of the mounting box body through the two mounting frames. The side face of the multilayer circuit board is protected through the mounting box body, the protection plate protects the upper surface of the multilayer circuit board, and then the scratch to which the multilayer circuit board is subjected is effectively reduced, so that the service life of the multilayer circuit board is prolonged.
Preferably, the heat dissipating device comprises two mounting seats, the two mounting seats are provided with mounting openings at the front ends of the two mounting seats, fans are mounted in the two mounting openings, and the two mounting seats are mounted at the left part and the right part of the rear end of the mounting box body respectively. The two fans rotate to blow, and the wind blows to the multi-layer circuit board through the mounting opening and the through opening, so that the heat dissipation performance of the multi-layer circuit board is improved.
Preferably, the mounting device comprises a first fixing frame and a second fixing frame, one ends of the first fixing frame and the second fixing frame are respectively provided with a group of spring dampers, two groups of spring dampers are respectively provided with a mounting plate at one ends of the first fixing frame and the second fixing frame, and the first fixing frame and the second fixing frame are respectively arranged at the right end and the left end of the mounting box body. When the first fixing frame and the second fixing frame are subjected to shaking, shaking suffered by the mounting box body can be effectively reduced through the spring damper on the first fixing frame and the second fixing frame, and then the fixing effect of the multilayer circuit board in the mounting box is improved.
Preferably, a gap exists between the protection plate and the multilayer circuit board, and a gap exists between the multilayer circuit board and the through hole.
Preferably, the size of the mounting opening is consistent with that of the through opening, and the mounting opening and the through opening correspond to each other in front and back.
Compared with the prior art, the utility model has the following beneficial effects:
1. the mounting box body is gone into to multilayer circuit board card through the cardboard card of its both sides, then in the mounting box body was gone into to the mounting bracket of guard plate both sides also card thereupon, and then carry out spacing fixedly to the cardboard, the installation screw on the rethread mounting bracket to fix the mounting bracket, protect multilayer circuit board side through the mounting box body, the guard plate protects multilayer circuit board upper surface, and then effectively reduces the multilayer circuit board and receive and cut and scratch, thereby improved multilayer circuit board's life.
2. The fan is used for rotating and blowing through the two fans on the heat radiating device, the air is blown onto the multi-layer circuit board through the mounting opening and the through opening, a gap exists between the rear end face of the multi-layer circuit board and the rear inner wall of the mounting box body, and the air can further comprehensively radiate the multi-layer circuit board.
3. After the multilayer circuit board is fixed through the first fixing frame and the second fixing frame on the mounting device, when the first fixing frame and the second fixing frame are subjected to shaking, shaking suffered by the mounting box body can be effectively reduced through the spring damper on the first fixing frame and the second fixing frame, and then the fixing effect of the multilayer circuit board in the mounting box body is improved.
Drawings
FIG. 1 is a schematic diagram of the overall structure of a high-precision multilayer circuit board according to the present utility model;
FIG. 2 is a schematic diagram of the whole structure of a protection device of a high-precision multilayer circuit board according to the present utility model;
FIG. 3 is a schematic diagram of the overall structure of a heat dissipating device of a high-precision multilayer circuit board according to the present utility model;
fig. 4 is a schematic diagram of the overall structure of a mounting device for a high-precision multilayer circuit board according to the present utility model.
In the figure: 1. installing a box body; 2. a protective device; 3. a heat sink; 4. a mounting device; 5. a multilayer wiring board; 6. installing a screw hole; 7. a set screw; 20. a protection plate; 21. a mounting frame; 22. installing a screw; 23. a clamping plate; 24. a through port; 30. a mounting base; 31. a mounting port; 32. a fan; 40. a first fixing frame; 41. a second fixing frame; 42. a spring damper; 43. and (3) mounting a plate.
Detailed Description
The utility model is further described in connection with the following detailed description, in order to make the technical means, the creation characteristics, the achievement of the purpose and the effect of the utility model easy to understand.
In the description of the present utility model, it should be noted that the directions or positional relationships indicated by the terms "upper", "lower", "inner", "outer", "front", "rear", "both ends", "one end", "the other end", etc. are based on the directions or positional relationships shown in the drawings, are merely for convenience of describing the present utility model and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific direction, be configured and operated in the specific direction, and thus should not be construed as limiting the present utility model. Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present utility model, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "provided," "connected," and the like are to be construed broadly, and may be fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present utility model will be understood in specific cases by those of ordinary skill in the art.
As shown in fig. 1-4, a high-precision multilayer circuit board comprises a mounting box body 1, wherein a multilayer circuit board 5 is jointly mounted between the left inner wall and the right inner wall of the mounting box body 1, a mounting device 4 is jointly mounted at the left end and the right end of the mounting box body 1, two fixing screws 7 are respectively mounted at the left part and the right part of the upper end of the mounting device 4, a heat dissipation device 3 is jointly mounted at the left part and the right part of the rear end of the mounting box body 1, mounting screw holes 6 are respectively formed at the left part and the right part of the upper end of the mounting box body 1, and a protection device 2 is mounted at the upper end of the mounting box body 1.
The protection device 2 comprises a protection plate 20, mounting frames 21 are mounted at the left end and the right end of the protection plate 20, and mounting screws 22 are mounted at the front part and the rear part of the upper ends of the two mounting frames 21; in a specific embodiment, the mounting frame 21 is mounted on the upper end of the mounting box 1 by means of screw fixation. The left end and the right end of the multilayer circuit board 5 are respectively provided with a clamping plate 23, the multilayer circuit board 5 is arranged between the left inner wall and the right inner wall of the mounting box body 1 through the clamping plates 23, the left part and the right part of the rear end of the mounting box body 1 are respectively provided with a through hole 24, and the protection plate 20 is arranged at the upper end of the mounting box body 1 through two mounting frames 21; a gap exists between the protection plate 20 and the multilayer circuit board 5, and a gap exists between the multilayer circuit board 5 and the through hole 24. As a specific implementation manner, in this embodiment, the side surface of the multilayer circuit board 5 is protected by the mounting box body 1, and the protection plate 20 protects the upper surface of the multilayer circuit board 5, so that the scratch on the multilayer circuit board 5 is effectively reduced, and the service life of the multilayer circuit board 5 is prolonged.
The heat dissipation device 3 comprises two mounting seats 30, wherein the front ends of the two mounting seats 30 are provided with mounting openings 31, fans 32 are arranged in the two mounting openings 31, and the two mounting seats 30 are respectively arranged at the left part and the right part of the rear end of the mounting box body 1; the mounting opening 31 corresponds in size and position to the opening 24. As a specific embodiment, in this embodiment, the two fans 32 perform rotary blowing, and the air is blown onto the multilayer circuit board 5 through the mounting opening 31 and the through opening 24, so that the heat dissipation performance of the multilayer circuit board 5 is improved.
The mounting device 4 comprises a first fixing frame 40 and a second fixing frame 41, wherein one ends of the first fixing frame 40 and the second fixing frame 41, which correspond to each other, are provided with a group of spring dampers 42, one ends of the two groups of spring dampers 42, which correspond to each other, are provided with mounting plates 43, and the first fixing frame 40 and the second fixing frame 41 are respectively arranged at the right end and the left end of the mounting box body 1. As a specific embodiment, when the first fixing frame 40 and the second fixing frame 41 in this embodiment are rocked, the spring damper 42 thereon can effectively reduce the rocked mounting box 1, so as to improve the fixing effect of the multilayer circuit board 5 therein.
It should be noted that, the present utility model is a high-precision multilayer circuit board, after the multilayer circuit board 5 is fixed by the first fixing frame 40 and the second fixing frame 41 on the mounting device 4, when the first fixing frame 40 and the second fixing frame 41 are rocked, the rocked of the mounting box 1 can be effectively reduced by the spring damper 42 on the mounting box, and the fixing effect of the multilayer circuit board 5 in the mounting box is further improved, the multilayer circuit board 5 is clamped into the mounting box 1 by the clamping plates 23 on two sides of the mounting box, then the mounting frames 21 on two sides of the protection plate 20 are also clamped into the mounting box 1, and further the clamping plates 23 are limited and fixed, at this time, the mounting screws 22 on the mounting frames 21 are rotated again, so that the mounting frames 21 are fixed, the side surface of the multilayer circuit board 5 is protected by the mounting box 1, the protection plate 20 is protected against the upper surface of the multilayer circuit board 5, and further the service life of the multilayer circuit board 5 is effectively reduced, meanwhile, the two fans 32 on the heat dissipation device 3 are rotated, and the heat dissipation performance of the multilayer circuit board 5 is further improved by the two fans 32 on the heat dissipation device 3.
The foregoing has shown and described the basic principles and main features of the present utility model and the advantages of the present utility model. It will be understood by those skilled in the art that the present utility model is not limited to the embodiments described above, and that the above embodiments and descriptions are merely illustrative of the principles of the present utility model, and various changes and modifications may be made without departing from the spirit and scope of the utility model, which is defined in the appended claims. The scope of the utility model is defined by the appended claims and equivalents thereof.
Claims (6)
1. The utility model provides a high-accuracy multilayer circuit board, includes mounting box body (1), its characterized in that: install multilayer circuit board (5) jointly between inner wall and the right inner wall about installation box body (1), installation device (4) are installed jointly to installation box body (1) left end and right-hand member, two fixed screws (7) are all installed on installation device (4) upper end left part and upper end right part, heat abstractor (3) are installed jointly to installation box body (1) rear end left part and rear end right part, installation screw (6) are all opened on installation box body (1) upper end left part and upper end right part, protector (2) are installed to installation box body (1) upper end.
2. The high-precision multilayer circuit board according to claim 1, wherein: protection device (2) are including guard plate (20), mounting bracket (21) are all installed to guard plate (20) left end and right-hand member, two mounting bracket (21) upper end front portion and upper end rear portion all install mounting screw (22), cardboard (23) are all installed to multilayer circuit board (5) left end and right-hand member, multilayer circuit board (5) are installed between mounting box body (1) left inner wall and right inner wall through cardboard (23), opening (24) are all opened on mounting box body (1) rear end left portion and rear end right-hand member, guard plate (20) are installed in mounting box body (1) upper end through two mounting brackets (21).
3. The high-precision multilayer circuit board according to claim 2, wherein: the heat dissipation device (3) comprises two mounting seats (30), wherein the two mounting seats (30) are arranged, the front ends of the two mounting seats (30) are provided with mounting openings (31), the two mounting openings (31) are internally provided with fans (32), and the two mounting seats (30) are respectively arranged at the left part and the right part of the rear end of the mounting box body (1).
4. The high-precision multilayer circuit board according to claim 1, wherein: the mounting device (4) comprises a first fixing frame (40) and a second fixing frame (41), one group of spring dampers (42) are mounted at one ends corresponding to the first fixing frame (40) and the second fixing frame (41), mounting plates (43) are mounted at one ends corresponding to the spring dampers (42), and the first fixing frame (40) and the second fixing frame (41) are mounted at the right end and the left end of the mounting box body (1) respectively.
5. The high-precision multilayer circuit board according to claim 2, wherein: a gap exists between the protection plate (20) and the multilayer circuit board (5), and a gap exists between the multilayer circuit board (5) and the through hole (24).
6. A high-precision multilayer wiring board according to claim 3, wherein: the mounting opening (31) and the through opening (24) are consistent in size and correspond to each other in front and back positions.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223121672.7U CN219437214U (en) | 2022-11-23 | 2022-11-23 | High-precision multilayer circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223121672.7U CN219437214U (en) | 2022-11-23 | 2022-11-23 | High-precision multilayer circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219437214U true CN219437214U (en) | 2023-07-28 |
Family
ID=87342787
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202223121672.7U Active CN219437214U (en) | 2022-11-23 | 2022-11-23 | High-precision multilayer circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219437214U (en) |
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2022
- 2022-11-23 CN CN202223121672.7U patent/CN219437214U/en active Active
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