CN210694677U - Receiver mainboard of plastic envelope structure - Google Patents

Receiver mainboard of plastic envelope structure Download PDF

Info

Publication number
CN210694677U
CN210694677U CN201921702266.5U CN201921702266U CN210694677U CN 210694677 U CN210694677 U CN 210694677U CN 201921702266 U CN201921702266 U CN 201921702266U CN 210694677 U CN210694677 U CN 210694677U
Authority
CN
China
Prior art keywords
mainboard
bottom plate
frame
sides
receiver
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201921702266.5U
Other languages
Chinese (zh)
Inventor
毋振宇
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shenzhen Kelvin Electronics Co Ltd
Original Assignee
Shenzhen Kelvin Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shenzhen Kelvin Electronics Co Ltd filed Critical Shenzhen Kelvin Electronics Co Ltd
Priority to CN201921702266.5U priority Critical patent/CN210694677U/en
Application granted granted Critical
Publication of CN210694677U publication Critical patent/CN210694677U/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

The utility model discloses a receiver mainboard with plastic package structure, which comprises a bottom plate, wherein two cooling fans are fixedly arranged at the bottom in the bottom plate, the top ends of a plurality of buffer springs are fixedly connected with the bottom end of a mainboard frame, limiting holes penetrating through the mainboard frame are arranged at the side edges of the mainboard frame, air guide grooves are arranged at the two ends of the mainboard frame, a plurality of air guide plates are fixedly arranged in the air guide grooves, a frame body is fixedly arranged at the top end of the bottom plate, clamping plates are fixedly arranged at the two sides of the frame body, one end of each clamping plate is connected with the mainboard through clamping grooves arranged at the two sides of the mainboard, and a limiting rod is fixedly arranged at the side edge at the bottom end of the mainboard. The air deflector of installation is gone up to the cooperation mainboard frame, effectively dispels the heat to the mainboard, reduces mainboard temperature.

Description

Receiver mainboard of plastic envelope structure
Technical Field
The utility model relates to a receiver mainboard, in particular to receiver mainboard of plastic envelope structure belongs to mainboard technical field.
Background
The circuit board has the name: ceramic circuit board, alumina ceramic circuit board, aluminum nitride ceramic circuit board, PCB board, aluminum substrate, high frequency board, thick copper board, impedance board, PCB, ultra-thin circuit board, printed (copper etching technology) circuit board, etc. The circuit board enables the circuit to be miniaturized and visualized, and plays an important role in batch production of fixed circuits and optimization of electric appliance layout. The circuit board can be called as a printed circuit board or a printed circuit board, and the English name is FPC circuit board (FPC circuit board is also called as a flexible circuit board, and the flexible circuit board is made of polyimide or polyester film as a base material, has the characteristics of high reliability and excellent flexibility, and has high wiring density, light weight, thin thickness and good bending property), and the birth and development of a rigid-flexible combined board and a PCB, and has promoted a new product of the rigid-flexible combined board.
The existing main board is simple in structure, poor in heat dissipation performance, free of buffering capacity, easy to damage in use and incapable of playing the performance of the main board.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a receiver mainboard of plastic envelope structure to current mainboard simple structure who proposes in solving above-mentioned background art, heat dispersion is poor, does not possess the buffer capacity simultaneously, uses easy damage, and the performance of mainboard can not be brought into play the problem.
In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a receiver mainboard of plastic envelope structure, includes the bottom plate, bottom fixed mounting in the bottom plate has two radiator fan, the inside fixed mounting of bottom plate has a plurality of buffer spring, and is a plurality of buffer spring's top all is connected with the bottom fixed connection of mainboard frame, the spacing hole that runs through the mainboard frame is all seted up to the avris of mainboard frame, the wind-guiding groove has all been seted up at the both ends of mainboard frame, two the equal fixed mounting in inside in wind-guiding groove has a plurality of aviation baffles, the top fixed mounting of bottom plate has the framework, the equal fixed mounting in both sides of framework has the cardboard, two the draw-in groove that the one end of cardboard was all seted up through the mainboard both sides is connected with the mainboard block, the avris fixed mounting.
As a preferred technical scheme of the utility model, the louvre that runs through the bottom plate is all seted up to the both sides of bottom plate inner wall.
As an optimal technical scheme of the utility model, the gag lever post is mutually supported with spacing hole.
As a preferred technical scheme of the utility model, one side fixed mounting of mainboard has external plug, the jack of mutually supporting with external plug is seted up to one side of framework.
Compared with the prior art, the beneficial effects of the utility model are that: the utility model relates to a receiver mainboard of plastic envelope structure, the inside mainboard frame that is equipped with and buffer spring is connected of bottom plate can provide the cushion force for the mainboard is not fragile when receiving vibrations, and the bottom sets up radiator fan simultaneously, cooperates the aviation baffle of mainboard shelf location, effectively dispels the heat to the mainboard, reduces the mainboard temperature.
Drawings
FIG. 1 is a schematic front view of the present invention;
FIG. 2 is a schematic structural view of the main board of the present invention;
fig. 3 is a schematic structural diagram of the bottom plate of the present invention.
In the figure: 1. a base plate; 2. a frame body; 3. a jack; 4. a main board; 5. heat dissipation holes; 6. clamping a plate; 7. a buffer spring; 8. a limiting hole; 9. a motherboard frame; 10. a heat radiation fan; 11. a wind guide groove; 12. a limiting rod; 13. a card slot; 14. an external plug; 15. an air deflector.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Please refer to fig. 1-3, the utility model provides a receiver mainboard of plastic envelope structure, comprising a base plate 1, bottom fixed mounting in the bottom plate 1 has two radiator fan 10, bottom plate 1's inside fixed mounting has a plurality of buffer spring 7, the top of a plurality of buffer spring 7 all with mainboard frame 9's bottom fixed connection, mainboard frame 9's avris has all been seted up the spacing hole 8 that runs through mainboard frame 9, wind-guiding groove 11 has all been seted up at mainboard frame 9's both ends, the equal fixed mounting in inside of two wind-guiding grooves 11 has a plurality of aviation baffles 15, bottom plate 1's top fixed mounting has framework 2, the equal fixed mounting in both sides of framework 2 has cardboard 6, the draw-in groove 13 that two one end of cardboard 6 were all seted up through mainboard 4 both sides is connected with mainboard 4 block, the avris fixed mounting of mainboard 4 bottom has.
Preferably, heat dissipation holes 5 penetrating through the bottom plate 1 are formed in both sides of the inner wall of the bottom plate 1; the limiting rod 12 is matched with the limiting hole 8; one side fixed mounting of mainboard 4 has external plug 14, jack 3 with external plug 14 mutually supporting is seted up to one side of framework 2, place mainboard 4 inside bottom plate 1, gag lever post 12 of 4 bottoms of mainboard inserts spacing hole 8 insidely and carries on spacingly to mainboard 4, mainboard 9 bottom is equipped with buffer spring 7 simultaneously, mainboard 4 on the mainboard frame 9 provides the buffer power, prevent that mainboard 4 from receiving vibrations and damaging, simultaneously draw-in groove 13 and the 6 block of cardboard of mainboard 4 both sides are connected, fix mainboard 4, when heat on mainboard 4 does not give off, start radiator fan 10, radiator fan 10 blows off the wind-guiding, wind direction both sides are passed through aviation baffle 15, discharge via louvre 5, thereby take away the heat on mainboard 4.
When specifically using, the utility model relates to a receiver mainboard of plastic envelope structure, place mainboard 4 inside bottom plate 1, gag lever post 12 of mainboard 4 bottom inserts spacing hole 8 inside and carries on spacingly to mainboard 4, mainboard 9 bottom is equipped with buffer spring 7 simultaneously, mainboard 4 on the mainboard frame 9 provides the buffer power, prevent that mainboard 4 from receiving vibrations and damaging, simultaneously draw-in groove 13 and the 6 blocks of cardboard of mainboard 4 both sides are connected, fix mainboard 4, when heat on mainboard 4 does not give off, start radiator fan 10, radiator fan 10 blows off wind-guiding, lead the both sides through aviation baffle 15, discharge via louvre 5, thereby take away the heat on mainboard 4.
In the description of the present invention, it should be understood that the indicated orientation or positional relationship is based on the orientation or positional relationship shown in the drawings, and is only for convenience of description and simplification of description, and does not indicate or imply that the indicated device or element must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be construed as limiting the present invention.
In the present invention, unless otherwise explicitly specified or limited, for example, it may be fixedly connected, detachably connected, or integrated; can be mechanically or electrically connected; they may be directly connected or indirectly connected through an intermediate medium, and may be connected through the inside of two elements or in an interaction relationship between two elements, unless otherwise specifically defined, and the specific meaning of the above terms in the present invention will be understood by those skilled in the art according to specific situations.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims (4)

1. A receiver mainboard with a plastic package structure comprises a bottom plate (1) and is characterized in that two cooling fans (10) are fixedly mounted at the bottom in the bottom plate (1), a plurality of buffer springs (7) are fixedly mounted in the bottom plate (1), the top ends of the buffer springs (7) are fixedly connected with the bottom end of a mainboard frame (9), limit holes (8) penetrating through the mainboard frame (9) are formed in the side of the mainboard frame (9), air guide grooves (11) are formed in the two ends of the mainboard frame (9), a plurality of air guide plates (15) are fixedly mounted in the two air guide grooves (11), a frame body (2) is fixedly mounted at the top end of the bottom plate (1), clamping plates (6) are fixedly mounted on the two sides of the frame body (2), and one ends of the two clamping plates (6) are connected with the mainboard (4) in a clamping manner through clamping grooves (13) formed in the two sides of the mainboard (4), and the side of the bottom end of the main board (4) is fixedly provided with a limiting rod (12).
2. The receiver motherboard with plastic package structure according to claim 1, wherein: the heat dissipation holes (5) penetrating through the bottom plate (1) are formed in the two sides of the inner wall of the bottom plate (1).
3. The receiver motherboard with plastic package structure according to claim 1, wherein: the limiting rod (12) is matched with the limiting hole (8).
4. The receiver motherboard with plastic package structure according to claim 1, wherein: one side fixed mounting of mainboard (4) has external plug (14), jack (3) of mutually supporting with external plug (14) are seted up to one side of framework (2).
CN201921702266.5U 2019-10-11 2019-10-11 Receiver mainboard of plastic envelope structure Active CN210694677U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201921702266.5U CN210694677U (en) 2019-10-11 2019-10-11 Receiver mainboard of plastic envelope structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201921702266.5U CN210694677U (en) 2019-10-11 2019-10-11 Receiver mainboard of plastic envelope structure

Publications (1)

Publication Number Publication Date
CN210694677U true CN210694677U (en) 2020-06-05

Family

ID=70884031

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201921702266.5U Active CN210694677U (en) 2019-10-11 2019-10-11 Receiver mainboard of plastic envelope structure

Country Status (1)

Country Link
CN (1) CN210694677U (en)

Similar Documents

Publication Publication Date Title
US6411511B1 (en) Motherboard heat sink passage and support board
US20120099269A1 (en) Motherboard and electronic device employing the same
CN210694677U (en) Receiver mainboard of plastic envelope structure
CN219437215U (en) Intelligent heat dissipation multilayer circuit board
CN213662054U (en) Take self-cleaning function's circuit board
CN215871957U (en) Fine circuit flexible circuit board combining thick gold, immersion gold and OSP
CN215420939U (en) Mixed-compression stepped high-frequency multilayer blind hole circuit board
CN213028671U (en) Flexible line way board that can splice
CN111341359B (en) Board splitting device for high-density hard disk backboard of server
CN210671155U (en) Circuit board convenient to heat dissipation
CN219351979U (en) PCB board of thick copper HDI
CN220139790U (en) PCB board paster packaging structure
CN219124529U (en) High-frequency high-speed circuit board for 5G communication
CN219437378U (en) High-frequency microwave printing high-density HDI circuit board
CN104703443A (en) Heat dissipation plug box
CN219019125U (en) PCB (printed circuit board)
CN216852505U (en) Multilayer high-thickness copper plate
CN219352223U (en) Integrated circuit board heat abstractor
CN217985523U (en) Circuit board with heat dissipation protection assembly
CN212696263U (en) Double-sided embedded fine flexible circuit board
CN215773702U (en) High heat dissipating double-deck circuit board
CN213094729U (en) Circuit board with heat dissipation mechanism
CN219981142U (en) Double-layer overlapped circuit board
CN214046141U (en) Quick radiating multilayer HDI circuit board
CN211982354U (en) Environment-friendly HDI circuit board

Legal Events

Date Code Title Description
GR01 Patent grant
GR01 Patent grant