CN104703443A - Heat dissipation plug box - Google Patents
Heat dissipation plug box Download PDFInfo
- Publication number
- CN104703443A CN104703443A CN201510071934.9A CN201510071934A CN104703443A CN 104703443 A CN104703443 A CN 104703443A CN 201510071934 A CN201510071934 A CN 201510071934A CN 104703443 A CN104703443 A CN 104703443A
- Authority
- CN
- China
- Prior art keywords
- heat
- conducting plate
- subrack
- sidepiece
- front card
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000017525 heat dissipation Effects 0.000 title abstract 5
- 239000000758 substrate Substances 0.000 claims abstract description 26
- 238000004891 communication Methods 0.000 claims abstract description 4
- 230000005855 radiation Effects 0.000 claims description 24
- 230000007704 transition Effects 0.000 claims description 10
- 239000000463 material Substances 0.000 claims description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 3
- 241000278713 Theora Species 0.000 claims description 3
- 239000004411 aluminium Substances 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- 230000000052 comparative effect Effects 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 238000007789 sealing Methods 0.000 claims description 3
- 239000000741 silica gel Substances 0.000 claims description 3
- 229910002027 silica gel Inorganic materials 0.000 claims description 3
- 239000000428 dust Substances 0.000 description 6
- 238000007667 floating Methods 0.000 description 3
- 230000007547 defect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 230000008901 benefit Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention relates to the technical field of communication equipment and especially relates to a heat dissipation plug box. The heat dissipation plug box comprises a box, wherein the box comprises a front plug box region, a rear plug box region, and a backboard; the backboard is arranged between the front plug box region and the rear plug box region and the box is sealed. A plug board comprises a front plug board and a rear plug board both which are connected by the backboard, and the rear plug board is used for providing an external connector; the front plug board comprises a front plug board substrate, a top heat-conducting plate and a bottom heat-conducting plate; the top heat-conducting plate is fixedly arranged on the upper surface of the front plug board substrate, and the bottom heat-conducting plate is fixedly arranged on the lower surface of the front plug board substrate; the upper or lower surface of the front plug board substrate is provided with components, a transitive heat-conducting plate is arranged among the component, the top heat-conducting plate and the bottom heat-conducting plate and used for exchanging heat among the component, the top heat-conducting plate and the bottom heat-conducting plate; the heat dissipation plug box further comprises a heat dissipation assembly which is used for dissipating heat conducted to the top heat-conducting plate and the bottom heat-conducting plate outside the plug box.
Description
Technical field
The present invention relates to technical field of communication equipment, particularly relate to a kind of heat radiation subrack.
Background technology
Along with the development that smart city is built, a large amount of demands is created to access and gateway kind equipment.Major part situation, these access devices and gateway device are that dispersion is disposed, be different from the professional machine room with good temperature, humidity, dust-proof control, the place of these place apparatus may in open workshop, the particular surroundings such as wiring channel well, the rainproof distributing cabinet in field.
Plate subrack major part adopts built-in fans heat radiation in the market, forms cold-hot wind interchange channel outward at casing case.This mode is for standard machine room application design, and when in the environment being in high humidity, floating dust, dust can deposit on the circuit board that cabinet is in vent passages, adds wet environment, there will be the fault phenomenons occurred frequently such as electric leakage, short circuit and component damage.
The Chinese utility model patent that publication number is " 202603120U " discloses a kind of heat radiation subrack, the structure of this heat radiation subrack comprises subrack and inserted block, inserted block inserts in subrack by the heat conduction bar at its two ends, U-shaped protection baffle is provided with between subrack and heat conduction bar, the side of this baffle is hollow out dress, another side plate bottom is curved convex, soft chill bar is provided with between the Openworks shape side plate of baffle and heat conduction bar, subrack is provided with locking strip, the bottom of this locking strip and baffle is that the side plate of curved convex is affixed, the subrack of this structure eliminates original contact gap between inserted block and subrack, reduce contact heat resistance, improve the reliability of heat radiation.But also there is lower column defects: 1. the heat-exchange surface between inserted block and chill bar is little, affects the efficiency of heat exchange.2. the process need manual adjustments of whole heat exchange, operation is inconvenience relatively.3. the structure member volume for heat exchange is small, and during use, the performance that causes easy to wear significantly declines, and also difficulty or ease are safeguarded.4. be passed to the heat of devaning not leave very efficiently mode.
Summary of the invention
In order to overcome above-mentioned defect, the technical problem to be solved in the present invention is to provide a kind of heat radiation subrack.
For solving the problems of the technologies described above, heat radiation subrack of the present invention comprises casing, and described casing comprises front subrack district, rear subrack district and backboard, and described backboard is arranged between described front subrack district and rear subrack district; Described box sealing is arranged; In housing interior volume, transverse direction is evenly spaced is provided with some plates, described each plate comprises front card and back card/back board, described front card is arranged on front subrack district, described back card/back board is arranged on rear subrack district, described front card is connected by backboard with back card/back board, and described back card/back board is for providing external connector;
Described front card comprises front card substrate, top heat-conducting plate and bottom heat-conducting plate, described top heat-conducting plate is fixedly installed on the upper surface of front card substrate, described bottom heat-conducting plate is fixedly installed on the lower surface of front card substrate, the upper surface of described front card substrate or lower surface are provided with components and parts, between described components and parts and top heat-conducting plate, bottom heat-conducting plate, be provided with transition heat-conducting block, described transition heat-conducting block is for exchanging the heat between components and parts and top heat-conducting plate, bottom heat-conducting plate;
Also comprise radiating subassembly, described radiating subassembly is used for the heat conducting to top heat-conducting plate and bottom heat-conducting plate to be dissipated to subrack outside.
Further, described radiating subassembly comprises the heat conduction contiguous block be arranged on relative to backboard side on described front card substrate, described heat conduction contiguous block takes the shape of the letter U, comprise bottom and be arranged on the first sidepiece and second sidepiece of two bottom sides, described front card substrate is arranged in the U-lag that described first sidepiece, the second sidepiece and bottom formed; Described first sidepiece and the second sidepiece contact with described top heat-conducting plate and bottom heat-conducting plate respectively;
Described radiating subassembly also comprises panel, described panel is arranged on the opposite side of described heat conduction contiguous block sidepiece, described panel and described heat conduction contiguous block bottom connection touch, and the opposite side of described panel is provided with radiator, and described panel is for exchanging the heat between heat conduction contiguous block and radiator.
Further, aid-pulling device is provided with relative to the ora terminalis place of backboard side at described front card, described aid-pulling device comprises the power arm being arranged on resistance arm on panel and comparative resistance arm and arranging, be provided with rotating fulcrum at power arm and between resistance arm, described power arm length is greater than resistance arm.
Further, described radiator is also provided with radiator fan.
Further, described radiator is that pectination radiator comprises the some heat radiation hinges arranging spreader surface.
Further, close on backboard side be provided with front connector at described front card, plate closes on backboard side and is provided with rear connector in the rear, and described front connector is connected with described rear connector with after backplane communication, power taking.
Further, the first sidepiece of described heat conduction contiguous block and the second sidepiece are provided with screwed hole, and described heat conduction contiguous block is fixed between described top heat-conducting plate and bottom heat-conducting plate by the screw rod that screwed hole is suitable.
Further, described top heat-conducting plate and bottom heat-conducting plate are fixed on described front card substrate by screw rod.
Further, described transition heat-conducting block material can for copper, aluminium or other can carry out the material of heat exchange.
Further, the material of described top heat-conducting plate, bottom heat-conducting plate and panel is heat conductive silica gel.
The heat radiation subrack of structure of the present invention can when subrack seals, the heat that inside produces is left, thus when avoiding in the environment of high humidity, floating dust, dust can plate deposit, add wet environment, there will be the fault phenomenons occurred frequently such as electric leakage, short circuit and component damage.
Accompanying drawing explanation
Below in conjunction with specification drawings and specific embodiments, the present invention is described in further detail;
Fig. 1 is that the present invention is dispelled the heat the perspective view of subrack in subrack embodiment;
Fig. 2 is that the present invention is dispelled the heat the front schematic view of subrack in subrack embodiment;
Fig. 3 is that the present invention is dispelled the heat the structural representation of subrack embodiment centerboard;
Fig. 4 is that the present invention is dispelled the heat the structural representation of front card in subrack embodiment;
Fig. 5 is that the present invention is dispelled the heat the structural representation of heat conduction contiguous block in subrack embodiment;
Fig. 6 is that the present invention is dispelled the heat front card and aid-pulling device syndeton schematic diagram in subrack embodiment;
Description of reference numerals
Subrack district before 1-; 2-backboard; Subrack district after 3-; 4-aid-pulling device; 5-plate; 6-front card; 7-back card/back board; 8-front connector; Connector after 9-; 10-front card substrate; Heat-conducting plate bottom 11-; 12-top heat-conducting plate; 13-components and parts; 14-transition heat-conducting block; 15-heat conduction contiguous block; 16-panel; 17-radiator; 18-screw rod; 19-first sidepiece; 20-second sidepiece; Bottom 21-; 22-screwed hole; 23-power arm; 24-resistance arm; 25-rotating fulcrum.
Embodiment
Figure 1 shows that the present invention is dispelled the heat the perspective view of subrack in subrack embodiment, comprise casing, casing is shape spatially, and comprise four sidewalls and the top board, the base plate that are connected sidewall, the casing of this structure is closed.Box house comprises front subrack district 1, rear subrack district 3 and backboard 2, backboard 2 is arranged between front subrack district 1 and rear subrack district 3, subrack front schematic view in embodiment shown in composition graphs 2, in housing interior volume, transverse direction is evenly spaced is provided with some plates 5, and sidewall is provided with the radiator 17 be connected with front card 6.
Figure 3 shows that the present invention is dispelled the heat the structural representation of subrack embodiment centerboard, each plate 5 comprises front card 6 and back card/back board 7, front card 6 is arranged on front subrack district 1, back card/back board 7 is arranged on rear subrack district 3, front card 6 is connected by backboard 2 with back card/back board 7, the upper and lower surface of front card 6 is provided with components and parts 13, back card/back board 7 is for providing external connector, close on backboard 2 side at front card 6 and be provided with front connector 8, back card/back board 7 close on backboard 2 side be provided with after connector 9, front connector 8 communicates with backboard 2, be connected with rear connector 9 after power taking.In addition, aid-pulling device 4 is provided with at front card relative to the ora terminalis place of the side of backboard.
Figure 4 shows that the present invention is dispelled the heat the structural representation of front card in subrack embodiment, front card 6 comprises front card substrate 10, top heat-conducting plate 12 and bottom heat-conducting plate 11, top heat-conducting plate 12 is fixedly installed on the upper surface of front card substrate 10 by screw rod 18, bottom heat-conducting plate 11 is fixedly installed on the lower surface of front card substrate 10 by screw rod 18, the upper surface of front card substrate 10 and lower surface are provided with components and parts 13, at components and parts 13 and top heat-conducting plate 12, transition heat-conducting block 14 is provided with between the heat-conducting plate 11 of bottom, transition heat conduction 14 pieces is for exchanging components and parts 13 and top heat-conducting plate 12, heat between the heat-conducting plate 11 of bottom, wherein transition heat-conducting block 14 material can be copper, aluminium or other can carry out the material of heat exchange.
Front card 6 also comprises radiating subassembly, radiating subassembly comprises the heat conduction contiguous block 15 be arranged on relative to backboard 2 side on front card substrate 10, heat conduction contiguous block 15 takes the shape of the letter U, comprise bottom 21 and be arranged on the first sidepiece 19 and the second sidepiece 20 of 21 both sides, bottom, front card substrate 10 is arranged in the U-lag that the first sidepiece 19, second sidepiece 20 and bottom 21 formed; First sidepiece 19 contacts with top heat-conducting plate 12 and bottom heat-conducting plate 11 respectively with the second sidepiece 20.Also comprise panel 16, panel 16 is arranged on the opposite side of heat conduction contiguous block sidepiece, panel 16 21 to contact with bottom heat conduction contiguous block, the opposite side of panel 16 is provided with radiator 17, panel 16 is for exchanging the heat between heat conduction contiguous block 15 and radiator 17, wherein, the material of top heat-conducting plate 12, bottom heat-conducting plate 11 and panel 16 is heat conductive silica gel.In order to accelerate the speed of dispelling the heat, the present invention adopts pectination radiator, and pectination spreader surface is provided with some blades increases area of dissipation greatly, all can bring great convenience to the conduction of heat, convection current and radiation.Further, in order to accelerate heat radiation, also radiator fan is provided with on a heat sink.
The upper and lower surface of front card substrate 10 is provided with components and parts 13, when components and parts 13 are energized operation, components and parts 13 surface can produce heat, the transition heat-conducting block 14 being arranged on component surface serves components and parts 13 and the heat exchange between top heat-conducting plate 12 and bottom heat-conducting plate 11, by the delivered heat of generation to top heat-conducting plate 12 and bottom heat-conducting plate 11, the contiguous block of heat conduction simultaneously 15 contacts with top heat-conducting plate 12 and bottom heat-conducting plate 11 again, heat conduction contiguous block 15 one end contacts with top heat-conducting plate 12 and bottom heat-conducting plate 11, the other end is provided with radiator 17, radiator 17 is arranged at subrack outside, the heat produced by components and parts 13 is passed to the external world by heat exchange and heat transfer, thus reach the requirement of heat radiation.In the process, subrack is sealing, the inner convection current almost not having air, also plate 5 is not exposed in the air be connected with the external world, thus when avoiding in the environment of high humidity, floating dust, dust can plate deposit, and adds wet environment, there will be the fault phenomenons occurred frequently such as electric leakage, short circuit and component damage.
Figure 5 shows that the present invention is dispelled the heat the structural representation of heat conduction contiguous block in subrack embodiment, first sidepiece 19 of heat conduction contiguous block and the second sidepiece 20 are provided with screwed hole 22, and heat conduction contiguous block 15 is fixed between top heat-conducting plate 12 and bottom heat-conducting plate 11 by the screw rod that screwed hole 22 is suitable.
Figure 6 shows that the present invention is dispelled the heat front card and aid-pulling device syndeton schematic diagram in subrack embodiment, aid-pulling device 4 is fixedly installed on the edge of panel 16, this aid-pulling device 4 comprises the power arm 23 arranged from resistance arm 24 and comparative resistance arm be arranged on panel 16, rotating fulcrum 25 is provided with at power arm 23 and between resistance arm 24, power arm 23 length is greater than resistance arm 24, on power arm 23, apply the reciprocal active force that casing direction extracted out by plate, can easily plate be detached in subrack.
More than show and describe general principle of the present invention, principal character and advantage of the present invention.The technical staff of the industry should understand; the present invention is not restricted to the described embodiments; what describe in above-described embodiment and specification just illustrates principle of the present invention; the present invention also has various changes and modifications without departing from the spirit and scope of the present invention, and these changes and improvements all fall in the claimed scope of the invention.Application claims protection range is defined by appending claims and equivalent thereof.
Claims (10)
1. a heat radiation subrack, comprise casing, described casing comprises front subrack district (1), rear subrack district (3) and backboard (2), and described backboard (2) is arranged between described front subrack district (1) and rear subrack district (3); It is characterized in that:
Described box sealing is arranged;
In housing interior volume, transverse direction is evenly spaced is provided with some plates (5), described each plate (5) comprises front card (6) and back card/back board (7), described front card (6) is arranged on front subrack district (1), described back card/back board (7) is arranged on rear subrack district (3), described front card (6) is connected by backboard (2) with back card/back board (7), and described back card/back board (7) is for providing external connector;
Described front card (6) comprises front card substrate (10), top heat-conducting plate (12) and bottom heat-conducting plate (11), described top heat-conducting plate (12) is fixedly installed on the upper surface of front card substrate (10), described bottom heat-conducting plate (11) is fixedly installed on the lower surface of front card substrate (10), the upper surface of described front card substrate (10) or lower surface are provided with components and parts (13), at described components and parts (13) and top heat-conducting plate (12), transition heat-conducting block (14) is provided with between bottom heat-conducting plate (11), described transition heat-conducting block (14) is for exchanging components and parts (13) and top heat-conducting plate (12), heat between bottom heat-conducting plate (11),
Also comprise radiating subassembly, described radiating subassembly is used for the heat conducting to top heat-conducting plate (12) and bottom heat-conducting plate (11) to be dissipated to subrack outside.
2. heat radiation subrack according to claim 1, it is characterized in that: described radiating subassembly comprises the heat conduction contiguous block (15) be arranged on relative to backboard (2) side on described front card substrate (10), described heat conduction contiguous block (15) takes the shape of the letter U, comprise bottom (21) and be arranged on the first sidepiece (19) and second sidepiece (20) of two bottom sides, described front card substrate (10) is arranged in the U-lag that described first sidepiece (19), the second sidepiece (20) and bottom (21) formed; Described first sidepiece (19) and the second sidepiece (20) contact with described top heat-conducting plate (12) and bottom heat-conducting plate (11) respectively;
Described radiating subassembly also comprises panel (16), described panel (16) is arranged on the opposite side of described heat conduction contiguous block (15) sidepiece, described panel (16) touches with described heat conduction contiguous block (15) bottom connection, the opposite side of described panel (16) is provided with radiator (17), and described panel (16) is for exchanging the heat between heat conduction contiguous block (15) and radiator (17).
3. heat radiation subrack according to claim 2, it is characterized in that: be provided with aid-pulling device (4) at described front card (6) relative to the ora terminalis place of backboard (2) side, described aid-pulling device comprises the power arm (23) being arranged on resistance arm (24) on panel (16) and comparative resistance arm and arranging, be provided with rotating fulcrum at power arm (23) and between resistance arm (24), described power arm (23) length is greater than resistance arm (24).
4. heat radiation subrack according to claim 3, is characterized in that: on described radiator (17), be also provided with radiator fan.
5. heat radiation subrack according to claim 4, is characterized in that: described radiator (17) arranges some heat radiation hinges of spreader surface for pectination radiator comprises.
6. heat radiation subrack according to claim 5, it is characterized in that: close on backboard (2) side at described front card (6) and be provided with front connector (8), plate (7) closes on backboard (2) side and is provided with rear connector (9) in the rear, and described front connector (8) is connected with described rear connector (9) with after backplane communication, power taking.
7. the heat radiation subrack according to any one of claim 1-6, it is characterized in that: first sidepiece (19) of described heat conduction contiguous block (15) and the second sidepiece (20) are provided with screwed hole (22), and described heat conduction contiguous block (15) is fixed between described top heat-conducting plate (12) and bottom heat-conducting plate (11) by the screw rod that screwed hole (22) is suitable.
8. the heat radiation subrack according to any one of claim 1-6, is characterized in that: described top heat-conducting plate (12) and bottom heat-conducting plate (11) are fixed on described front card substrate (10) by screw rod (18).
9. the heat radiation subrack according to any one of claim 1-6, is characterized in that: described transition heat-conducting block (14) material can for copper, aluminium or other can carry out the material of heat exchange.
10. the heat radiation subrack according to any one of claim 1-6, is characterized in that: the material of described top heat-conducting plate (12), bottom heat-conducting plate (11) and panel (16) is heat conductive silica gel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510071934.9A CN104703443B (en) | 2015-02-06 | 2015-02-06 | Heat dissipation plug box |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510071934.9A CN104703443B (en) | 2015-02-06 | 2015-02-06 | Heat dissipation plug box |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104703443A true CN104703443A (en) | 2015-06-10 |
| CN104703443B CN104703443B (en) | 2017-03-22 |
Family
ID=53350086
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510071934.9A Active CN104703443B (en) | 2015-02-06 | 2015-02-06 | Heat dissipation plug box |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104703443B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105934141A (en) * | 2016-06-28 | 2016-09-07 | 北京无线电测量研究所 | Modular airtight cold guide case |
| WO2017215372A1 (en) * | 2016-06-16 | 2017-12-21 | 中兴通讯股份有限公司 | Printed circuit board structure and fan case |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201118641Y (en) * | 2007-11-05 | 2008-09-17 | 华为技术有限公司 | A blade server rear board, blade server and subrack equipment |
| CN102566710A (en) * | 2011-11-12 | 2012-07-11 | 孔繁忠 | Novel silent case |
| CN203984804U (en) * | 2014-07-18 | 2014-12-03 | 杭州叙简科技有限公司 | A kind of 3U small size high-density installation subrack |
-
2015
- 2015-02-06 CN CN201510071934.9A patent/CN104703443B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201118641Y (en) * | 2007-11-05 | 2008-09-17 | 华为技术有限公司 | A blade server rear board, blade server and subrack equipment |
| CN102566710A (en) * | 2011-11-12 | 2012-07-11 | 孔繁忠 | Novel silent case |
| CN203984804U (en) * | 2014-07-18 | 2014-12-03 | 杭州叙简科技有限公司 | A kind of 3U small size high-density installation subrack |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2017215372A1 (en) * | 2016-06-16 | 2017-12-21 | 中兴通讯股份有限公司 | Printed circuit board structure and fan case |
| CN105934141A (en) * | 2016-06-28 | 2016-09-07 | 北京无线电测量研究所 | Modular airtight cold guide case |
| CN105934141B (en) * | 2016-06-28 | 2018-02-13 | 北京无线电测量研究所 | A kind of closed conduction cooling cabinet of modularization |
Also Published As
| Publication number | Publication date |
|---|---|
| CN104703443B (en) | 2017-03-22 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| WO2017202254A1 (en) | Apparatus for mounting and fixing computer cpu heat sink and dedicated cpu heat sink | |
| CN102736706A (en) | server rack system | |
| TW201143590A (en) | Heat dissipation device | |
| WO2017202247A1 (en) | Computer system unit power supply unit | |
| CN108089680A (en) | A kind of heat dissipating method and device | |
| CN202941082U (en) | Heat radiation plug-in of heat pipe | |
| CN104703443A (en) | Heat dissipation plug box | |
| CN106789105A (en) | A kind of industrial switch for being provided with graphite heat radiation fin | |
| CN204189121U (en) | The adjustable multifunctional notebook computer heat sink of position of fan | |
| CN203773448U (en) | 6U CPCI (compact peripheral component interconnect) module applicable to CPCI standard cases and reinforced cases | |
| CN209746507U (en) | A server heat dissipation and air guide device for agricultural Internet | |
| CN201766604U (en) | Module group type fan-less core exchange | |
| CN210106211U (en) | Special intelligent temperature control radiator fan of notebook computer | |
| CN205912410U (en) | An air cooling system for electronic communication equipment | |
| CN218886543U (en) | A cooling mechanism for a server | |
| CN206273032U (en) | Circuit board cooling structure for switch | |
| CN217008116U (en) | Big data server heat dissipation equipment of computer | |
| CN2514400Y (en) | computer cooling device | |
| CN205750686U (en) | A computer main chassis assembly for preventing dust accumulation | |
| CN108681373A (en) | A kind of small casing structure of external heat radiation piece | |
| CN109491470B (en) | Computer storage device | |
| CN207529926U (en) | A kind of semiconductor heat-dissipating system | |
| CN201654666U (en) | Terminal, radiating module thereof and radiator | |
| CN100391324C (en) | Electronic device cooling mechanism | |
| CN210005968U (en) | kinds of computer storage device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| CB02 | Change of applicant information |
Address after: Hangzhou City, Zhejiang province Yuhang District 310000 West Street Wuchang No. 998 Building 5 room 706, room 707 Applicant after: HANGZHOU XUJIAN SCIENCE AND TECHNOLOGY Co.,Ltd. Address before: Yuhang District, Hangzhou City, Zhejiang Province, 310000 West No. 1500 Building 1 room 512 Applicant before: HANGZHOU SCOOPER TECHNOLOGY Co.,Ltd. |
|
| COR | Change of bibliographic data | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: A heat dissipation plug-in box Effective date of registration: 20211202 Granted publication date: 20170322 Pledgee: Hangzhou High-tech Financing Guarantee Co.,Ltd. Pledgor: HANGZHOU XUJIAN SCIENCE AND TECHNOLOGY Co.,Ltd. Registration number: Y2021980013922 |
|
| PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
| PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20220322 Granted publication date: 20170322 Pledgee: Hangzhou High-tech Financing Guarantee Co.,Ltd. Pledgor: HANGZHOU XUJIAN SCIENCE AND TECHNOLOGY Co.,Ltd. Registration number: Y2021980013922 |
|
| PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: A heat dissipation plug-in box Effective date of registration: 20220322 Granted publication date: 20170322 Pledgee: Shanghai Guotai Junan Securities Asset Management Co.,Ltd. Pledgor: HANGZHOU XUJIAN SCIENCE AND TECHNOLOGY Co.,Ltd. Registration number: Y2022990000162 |
|
| PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
| PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20230131 Granted publication date: 20170322 Pledgee: Shanghai Guotai Junan Securities Asset Management Co.,Ltd. Pledgor: HANGZHOU XUJIAN SCIENCE AND TECHNOLOGY Co.,Ltd. Registration number: Y2022990000162 |
|
| PC01 | Cancellation of the registration of the contract for pledge of patent right |