CN216852505U - Multilayer high-thickness copper plate - Google Patents

Multilayer high-thickness copper plate Download PDF

Info

Publication number
CN216852505U
CN216852505U CN202123066579.6U CN202123066579U CN216852505U CN 216852505 U CN216852505 U CN 216852505U CN 202123066579 U CN202123066579 U CN 202123066579U CN 216852505 U CN216852505 U CN 216852505U
Authority
CN
China
Prior art keywords
copper foil
heat
plate
conducting
board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202123066579.6U
Other languages
Chinese (zh)
Inventor
刘云强
余鑫
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dongguan Changda Circuit Board Co ltd
Original Assignee
Dongguan Changda Circuit Board Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dongguan Changda Circuit Board Co ltd filed Critical Dongguan Changda Circuit Board Co ltd
Priority to CN202123066579.6U priority Critical patent/CN216852505U/en
Application granted granted Critical
Publication of CN216852505U publication Critical patent/CN216852505U/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

The utility model discloses a high thick copper of multilayer, including copper foil board, the prepreg is all installed to copper foil board upper end and lower extreme, two the prepreg is kept away from the one end of copper foil board and is all installed No. two copper foil boards, two No. two the glue injection hole has all been opened to No. two copper foil board upper end front portions and upper end right part, No. one copper foil board, No. two copper foil boards and two prepreg upper end left parts and upper end right part have all opened two screw holes, upper portion No. two copper foil board upper end left parts and upper end right part install protection damping device jointly, heat abstractor is installed jointly to a copper foil board left end and right-hand member. A multilayer high and thick copper, not only improved its life of circuit board through protection damping device to carry out the shock attenuation through the cushion rubber layer, thereby improved its stability, make the circuit board can keep at better operating temperature through heat abstractor, thereby improved its result of use.

Description

Multilayer high-thickness copper plate
Technical Field
The utility model relates to a circuit board technical field, in particular to high thick copper of multilayer.
Background
The circuit board can be called as a printed circuit board or a printed circuit board, and the circuit board enables the circuit to be miniaturized and visualized, and plays an important role in the batch production of fixed circuits and the optimization of the layout of electrical appliances. Especially, with the rapid development of electronic products, the demand for circuit boards is increasing. 1. The existing circuit board is not provided with a good protection and shock absorption device, when the existing circuit board is impacted by the outside, the existing circuit board is easily scratched, the service life of the circuit board is influenced, and the circuit board can shake along with the existing circuit board, so that the stability of the existing circuit board is reduced; 2. the current circuit board often can adopt a plurality of thicker copper foil boards to splice in order to can last stable work and form, though the work efficiency of circuit board has been improved, the heat that self gived off when the circuit board lasts the work is just more, and especially during the concatenation of multilayer copper foil board, the heat dissipation of circuit board is just more difficult to influence the inside precision part of circuit board, reduce its result of use.
SUMMERY OF THE UTILITY MODEL
The utility model discloses a main aim at provides a multilayer high and thick copper can effectively solve the problem in the background art.
In order to achieve the above purpose, the utility model adopts the following technical scheme:
the utility model provides a high thick copper of multilayer, includes copper foil plate, the prepreg is all installed to copper foil plate upper end and lower extreme, two the prepreg is kept away from the one end of a copper foil plate and is all installed No. two copper foil plates, two No. two the rubber injection hole has all been opened to copper foil plate upper end front portion and upper end right part, No. one copper foil plate, No. two copper foil plates and two prepreg upper end left parts and upper end right parts have all been opened No. two screw holes, upper portion No. two copper foil plate upper end left parts and upper end right parts install protection damping device jointly, a copper foil plate left end and right-hand member install heat abstractor jointly, installation device is installed jointly to copper foil plate front end and rear end.
Preferably, protection damping device is including the protection support body, two support L templates, four are all installed to protection support body lower extreme left part and lower extreme right part support L template upper end and all install the fixed screw, the cushion rubber layer is installed to protection support body upper end, the anticollision layer is installed to cushion rubber layer upper end, the protection support body is installed on No. two copper foil plates in upper portion through four fixed screws.
Preferably, heat abstractor includes a heat-conducting plate and No. two heat-conducting plates, a plurality of conducting strip is all installed to the one end that a heat-conducting plate and No. two heat-conducting plates correspond, a plurality of radiating fin is all installed to a heat-conducting plate left end and No. two heat-conducting plate right-hand members, a heat-conducting plate and No. two heat-conducting plates are installed respectively at a copper foil left end and right-hand member.
Preferably, the mounting device comprises a mounting frame and a mounting frame, a plurality of screw holes are formed in the upper ends of the mounting frame and the mounting frame, clamping screws are mounted on the upper end left portion and the upper end right portion of the mounting frame and the mounting frame, and the front end and the rear end of the copper foil plate are mounted on the mounting frame and the mounting frame respectively.
Preferably, the fixed screw corresponds to the first screw hole up and down.
Preferably, the heat conducting fins on the first heat conducting plate are arranged at the upper end of the first copper foil plate, and the heat conducting fins on the second heat conducting plate are arranged at the lower end of the first copper foil plate.
Compared with the prior art, the utility model discloses following beneficial effect has:
1. the utility model relates to a protection support body of multilayer high and thick copper on through protection damping device is connected with a screw hole on the copper foil board by four fixed screws that support on the L template, thereby make the protection support body fix in copper foil board upper end, when the copper foil board receives the impact, avoid the copper foil board to receive the scratch through the anticollision layer, thereby its life has been improved, and carry out certain shock attenuation through the cushion rubber layer and handle, reduce rocking of copper foil board, thereby its stability has been improved, and fill the injecting glue into through the injecting glue hole, thereby make two No. two copper foil boards can fix lower extreme on a copper foil board better.
2. The utility model relates to a high thick copper of multilayer passes through the conducting strip on the heat-conducting plate on the heat abstractor and installs in copper foil board upper end, the lower extreme at copper foil board is installed to the conducting strip on the heat-conducting plate No. two, thereby carry out the during operation at copper foil board and two copper foil boards No. two, with the heat in it through the quick transmission of conducting strip to the radiating fin on, rethread radiating fin dispels the heat, thereby make the circuit board can keep at better operating temperature, thereby improved its result of use.
Drawings
Fig. 1 is a schematic view of the overall structure of a multilayer high-thickness copper plate of the present invention;
fig. 2 is a schematic view of the whole structure of the protective and damping device for multiple layers of high and thick copper plates according to the present invention;
fig. 3 is a schematic view of the overall structure of a heat dissipation device for multiple layers of high-thickness copper plates according to the present invention;
fig. 4 is the overall structure schematic diagram of the installation device of the multilayer high-thickness copper plate of the present invention.
In the figure: 1. a first copper foil plate; 2. a protective shock absorbing device; 3. a heat sink; 4. mounting means; 5. A prepreg; 6. a second copper foil plate; 7. a first screw hole; 8. injecting glue holes; 20. a protective frame body; 21. Supporting the L-shaped plate; 22. fixing screws; 23. a cushion rubber layer; 24. an anti-collision layer; 30. a first heat conducting plate; 31. a second heat conducting plate; 32. a heat conductive sheet; 33. a heat dissipating fin; 40. a first mounting frame; 41. A second mounting rack; 42. a second screw hole; 43. and (5) clamping the screw.
Detailed Description
In order to make the technical means, creation features, achievement purposes and functions of the present invention easy to understand, the present invention is further described below with reference to the following embodiments.
In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "front end", "rear end", "both ends", "one end", "the other end" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element to which the reference is made must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "disposed," "connected," and the like are to be construed broadly, and for example, "connected" may be either fixedly connected or detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.
As shown in fig. 1-4, a multilayer high-thickness copper plate, including copper foil plate 1, prepreg 5 is all installed to copper foil plate 1 upper end and lower extreme, No. two prepregs 5 keep away from the one end of copper foil plate 1 and all install No. two copper foil plates 6, No. two copper foil plate 6 upper end front portions and upper end right part have all opened glue injection hole 8, No. one copper foil plate 1, No. two copper foil plates 6 and two prepregs 5 upper end left parts and upper end right part have all opened two screw holes 7, No. two copper foil plate 6 upper end left parts and upper end right part install protection damping device 2 jointly, No. one copper foil plate 1 left end and right-hand member install heat abstractor 3 jointly, No. one copper foil plate 1 front end and rear end install installation device 4 jointly.
The protection damping device 2 comprises a protection frame body 20, two support L-shaped plates 21 are respectively arranged at the left part and the right part of the lower end of the protection frame body 20, fixing screws 22 are respectively arranged at the upper ends of the four support L-shaped plates 21, a buffer rubber layer 23 is arranged at the upper end of the protection frame body 20, an anti-collision layer 24 is arranged at the upper end of the buffer rubber layer 23, the protection frame body 20 is arranged at the upper end of a second copper foil plate 6 at the upper part through the four fixing screws 22, the protective frame body 20 is connected with a first screw hole 7 on the copper foil plate through fixing screws 22 on four supporting L-shaped plates 21, thereby fixing the protective frame body 20 on the upper end of the copper foil plate, when the copper foil plate is impacted, the anti-collision layer 24 prevents the copper foil plate from being scratched, thereby prolonging the service life of the copper foil plate, reducing the shaking of the copper foil plate by carrying out certain shock absorption treatment on the buffer rubber layer 23, and improving the stability of the copper foil plate.
Heat abstractor 3 includes heat-conducting plate 30 and No. two heat-conducting plates 31, a plurality of conducting strip 32 is all installed to the one end that heat-conducting plate 30 and No. two heat-conducting plates 31 correspond, a plurality of radiating fin 33 is all installed to a heat-conducting plate 30 left end and No. two heat-conducting plates 31, a heat-conducting plate 30 and No. two heat-conducting plates 31 are installed respectively at copper foil plate 1 left end and right-hand member, install in copper foil plate 1 upper end through conducting strip 32 on a heat-conducting plate 30, the lower extreme at copper foil plate 1 is installed to conducting strip 32 on No. two heat-conducting plates 31, thereby when carrying out the work at copper foil plate 1 and No. two copper foil plates 6, with the heat in it through conducting strip 32 fast transfer to radiating fin 33, the rethread radiating fin 33 dispels the heat, thereby make the circuit board can keep at better operating temperature, thereby its result of use has been improved.
Installation device 4 includes mounting bracket 40 and No. two mounting brackets 41, No. two screw holes 42 of a plurality of have all been opened to mounting bracket 40 and No. two mounting brackets 41 upper ends, chucking screw 43 is all installed to mounting bracket 40 and No. two mounting brackets 41 upper end left parts and upper end right parts, front end and the rear end at a copper foil board 1 are installed respectively to mounting bracket 40 and No. two mounting brackets 41, fix through chucking screw 43 on mounting bracket 40 and No. two mounting brackets 41, thereby fix the copper foil board thereupon also, and can increase and decrease chucking screw 43 as required through No. two screw holes 42 of a plurality of on mounting bracket 40 and No. two mounting brackets 41, make the copper foil board fix better.
The fixing screw 22 is vertically corresponding to the first screw hole 7.
The heat conducting fins 32 on the first heat conducting plate 30 are arranged at the upper end of the first copper foil plate 1, and the heat conducting fins 32 on the second heat conducting plate 31 are arranged at the lower end of the first copper foil plate 1.
It should be noted that the utility model relates to a multilayer high-thickness copper plate, firstly, the copper foil plate is fixed by the clamping screws 43 on the first mounting rack 40 and the second mounting rack 41 of the mounting device 4, thereby the copper foil plate is also fixed, and the clamping screws 43 can be increased or decreased according to the need through the plurality of second screw holes 42 on the first mounting rack 40 and the second mounting rack 41, so that the copper foil plate can be better fixed, then, the protective frame body 20 on the protective damping device 2 is connected with the first screw hole 7 on the copper foil plate by the four fixing screws 22 on the supporting L-shaped plate 21, thereby the protective frame body 20 is fixed on the upper end of the copper foil plate, when the copper foil plate is impacted, the copper foil plate is prevented from being scratched by the anti-collision layer 24, thereby the service life of the copper foil plate is prolonged, and certain damping treatment is carried out through the buffer rubber layer 23, the shaking of the copper foil plate is reduced, thereby its stability has been improved, install in copper foil board 1 upper end through conducting strip 32 on the heat-conducting plate 30 on the heat abstractor 3 simultaneously, the lower extreme at copper foil board 1 is installed to conducting strip 32 on the heat-conducting plate 31 No. two, thereby when copper foil board 1 and two copper foil boards 6 carry out the during operation, pass through conducting strip 32 fast transfer to radiating fin 33 with the heat in it on, rethread radiating fin 33 dispels the heat, thereby make the circuit board can keep at better operating temperature, thereby its result of use has been improved.
The foregoing shows and describes the basic principles and principal features of the invention, together with the advantages thereof. It will be understood by those skilled in the art that the present invention is not limited to the above embodiments, and that the foregoing embodiments and descriptions are provided only to illustrate the principles of the present invention without departing from the spirit and scope of the present invention. The scope of the invention is defined by the appended claims and equivalents thereof.

Claims (6)

1. A multilayer high and thick copper plate comprises a copper foil plate (1), and is characterized in that: prepreg (5), two are all installed to copper foil board (1) upper end and lower extreme prepreg (5) the one end that a copper foil board (1) was kept away from in prepreg (5) all installs No. two copper foil boards (6), two No. two screw hole (7), upper portion have all been opened to No. two copper foil board (6) upper end front portions and upper end right part, protection damping device (2) are installed jointly to No. two copper foil board (6) upper end left parts and upper end right part, heat abstractor (3) are installed jointly to a copper foil board (1) left end and right-hand member, installation device (4) are installed jointly to a copper foil board (1) front end and rear end.
2. A multilayer high-thickness copper plate according to claim 1, characterized in that: protection damping device (2) are including protection support body (20), two support L templates (21), four are all installed to protection support body (20) lower extreme left part and lower extreme right part support L template (21) upper end and all install fixed screw (22), buffer rubber layer (23) are installed to protection support body (20) upper end, buffer rubber layer (23) upper end is installed and is crashproof layer (24), protection support body (20) are installed in No. two copper foil plates in upper portion (6) upper end through four fixed screw (22).
3. A multilayer high-thickness copper plate according to claim 1, characterized in that: heat abstractor (3) are including a heat-conducting plate (30) and No. two heat-conducting plates (31), a plurality of conducting strip (32) are all installed to the one end that a heat-conducting plate (30) and No. two heat-conducting plates (31) correspond, a plurality of radiating fin (33) are all installed to a heat-conducting plate (30) left end and No. two heat-conducting plates (31) right-hand member, a heat-conducting plate (30) and No. two heat-conducting plates (31) are installed respectively at a copper foil board (1) left end and right-hand member.
4. A multilayer high-thickness copper plate according to claim 1, characterized in that: installation device (4) are including mounting bracket (40) and No. two mounting bracket (41), No. two screw holes of a plurality of (42) have all been opened on mounting bracket (40) and No. two mounting bracket (41), chucking screw (43) are all installed to mounting bracket (40) and No. two mounting bracket (41) upper end left part and upper end right part, front end and the rear end at a copper foil board (1) are installed respectively to mounting bracket (40) and No. two mounting bracket (41).
5. A multilayer high-thickness copper plate according to claim 2, characterized in that: the fixing screw (22) corresponds to the first screw hole (7) up and down.
6. A multilayer high-thickness copper plate according to claim 3, characterized in that: the heat conducting fins (32) on the first heat conducting plate (30) are arranged at the upper end of the first copper foil plate (1), and the heat conducting fins (32) on the second heat conducting plate (31) are arranged at the lower end of the first copper foil plate (1).
CN202123066579.6U 2021-12-08 2021-12-08 Multilayer high-thickness copper plate Active CN216852505U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202123066579.6U CN216852505U (en) 2021-12-08 2021-12-08 Multilayer high-thickness copper plate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202123066579.6U CN216852505U (en) 2021-12-08 2021-12-08 Multilayer high-thickness copper plate

Publications (1)

Publication Number Publication Date
CN216852505U true CN216852505U (en) 2022-06-28

Family

ID=82106893

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202123066579.6U Active CN216852505U (en) 2021-12-08 2021-12-08 Multilayer high-thickness copper plate

Country Status (1)

Country Link
CN (1) CN216852505U (en)

Similar Documents

Publication Publication Date Title
CN216852505U (en) Multilayer high-thickness copper plate
CN216491237U (en) Prevent accurate circuit board of PCB multilayer that layer is inclined to one side
CN216357477U (en) Multilayer metal PCB board
CN216600202U (en) HDI circuit board of high performance high density
CN214046159U (en) PCB circuit board with penetrating type via hole bonding pad
CN211860654U (en) High-efficient radiating ceramic PCB board
CN219351979U (en) PCB board of thick copper HDI
CN219437378U (en) High-frequency microwave printing high-density HDI circuit board
CN219019125U (en) PCB (printed circuit board)
CN220342514U (en) Multilayer printed PCB circuit board capable of rapidly radiating heat
CN218183617U (en) Slot type PCB multilayer circuit board
CN218998358U (en) Multilayer printed circuit board
CN219437374U (en) Multilayer HDI circuit board with inner layers interconnected
CN218998363U (en) Anticreep high heat conduction Printed Circuit Board (PCB)
CN217283539U (en) Rigid circuit board with good heat dissipation effect
CN214177641U (en) PCB with multi-layer board structure
CN219499811U (en) Waterproof type PCB circuit board
CN219351993U (en) High-precision multilayer PCB circuit board
CN219124529U (en) High-frequency high-speed circuit board for 5G communication
CN219437373U (en) Portable emergency power source PCBA subassembly
CN218183592U (en) Anti-bending double-sided circuit board
CN220307518U (en) Antistatic PCBA mainboard
CN210694677U (en) Receiver mainboard of plastic envelope structure
CN218183764U (en) Composite PCB
CN218941568U (en) High-temperature-resistant multilayer printed circuit board

Legal Events

Date Code Title Description
GR01 Patent grant
GR01 Patent grant