CN211152573U - Pump-driven two-phase fluid loop device for heat dissipation of electronic product - Google Patents
Pump-driven two-phase fluid loop device for heat dissipation of electronic product Download PDFInfo
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- CN211152573U CN211152573U CN201922229059.9U CN201922229059U CN211152573U CN 211152573 U CN211152573 U CN 211152573U CN 201922229059 U CN201922229059 U CN 201922229059U CN 211152573 U CN211152573 U CN 211152573U
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Abstract
The utility model belongs to the technical field of the electronic equipment cooling, especially, be a be used for radiating pump of electronic product to drive two-phase fluid return circuit device, which comprises an outer shell, fan housing is installed on the top of shell, fan housing's side is provided with the bolt hole, fan housing's inside is provided with the fan net, the bottom of fan net is provided with the fan, the bottom of fan is provided with the second fixed plate, the inside of shell is provided with the dust screen. Through the fixed mounting of thermal-insulated pipe and heat absorption container to and the parallel arrangement of two thermal-insulated pipes, convey to the effective comprehensive absorption heat of messenger's thermal-insulated pipe in the heat absorption container through the absorptive heat of heat absorption copper sheet, make the heat get into the coolant liquid container through the water pump and carry out thermal cooling for the first step, make the liquid entering evaporimeter of cooling through the water pump, make liquid evaporation become gaseous, make gaseous entering back flow through the connector, furtherly, the operation through the fan dispels the heat once more.
Description
Technical Field
The utility model belongs to the technical field of the electronic equipment cooling, concretely relates to be used for radiating pump of electronic product to drive two-phase fluid return circuit device.
Background
The electronic product is a related product based on electric energy, and mainly comprises: watches, smart phones, telephones, televisions, video disc players (VCD, SVCD, DVD), video recorders, camcorders, radios, radio cassettes, combination speakers, compact disc players (CD), computers, mobile communication products, etc., are known as electronic products since early products were primarily electronic tube based. In addition to the basic body functions of electronic products, new products are emerging with the rapid development of society, such as various ultrathin, ultralight, energy-saving and environment-friendly electronic products, but the maintenance problem of electronic product parts comes with the main problem of heat dissipation. Because the processor work operation in the electronic product and the heat effect of electric current all can produce a large amount of heats, if can not distribute away the heat fast in the short time, can lead to the electronic product system to break down, reduce the life of part.
However, since the conventional electronic products do not seek ultra-thin, ultra-light and durable properties like the current customers, the requirements for heat dissipation conditions are not so strict, but the requirements for heat dissipation of the current electronic products are extremely high, and the conventional heat dissipation system for electronic products cannot effectively and comprehensively dissipate heat of the products and efficiently utilize energy.
SUMMERY OF THE UTILITY MODEL
To solve the problems set forth in the background art described above. The utility model provides a be used for radiating pump of electronic product to drive two-phase fluid return circuit device has solved the problem that the electronic product heat dissipation is not comprehensive and extravagant energy.
In order to achieve the above object, the utility model provides a following technical scheme: a pump-driven two-phase fluid loop device for heat dissipation of electronic products comprises a shell, wherein a fan shell is installed at the top end of the shell, bolt holes are formed in the side face of the fan shell, a fan net is arranged inside the fan shell, a fan is arranged at the bottom end of the fan net, a second fixing plate is arranged at the bottom end of the fan, a dustproof net is arranged inside the shell, a return pipe is arranged inside the shell, a bolt pipe is installed on the side face of the shell, a nut is connected to the top end of the bolt pipe, a connecting pipe is installed at the top end of the nut, an evaporator is fixedly installed at one end of the connecting pipe, a water pump is installed at one side of the evaporator, a cooling liquid container is installed at the top end of the water pump, a container cover is arranged at the top end of the cooling liquid container, a heat insulation pipe is fixedly, the side surface of the heat absorption container is provided with a first fixing plate, and the side surface of the first fixing plate is provided with a heat absorption copper sheet in a penetrating way.
Preferably, the dust screen is arranged inside the fan and the return pipe, and the dust screen is tightly attached to the inner wall of the shell.
Preferably, the return pipe is annularly arranged inside the shell, and the connecting pipe penetrates through the shell.
Preferably, the heat absorbing copper sheet penetrates through the second fixing plate, and the heat absorbing copper sheet is connected with the heat absorbing container.
Preferably, the bottom end of the cooling liquid container is communicated with the top end of the water pump, and the container cover can be tightly buckled with the cooling liquid container.
Compared with the prior art, the beneficial effects of the utility model are that:
through the fixed mounting of thermal-insulated pipe and heat absorption container, and the parallel arrangement of two thermal-insulated pipes, the heat absorption of the thermal-insulated effect cooperation heat absorption container of accessible thermal-insulated pipe, reduce the heat gathering around the electronic product, furthermore, the heat that absorbs through the heat absorption copper sheet conveys and makes the effective comprehensive absorption heat of thermal-insulated pipe in the heat absorption container, make the heat get into the coolant liquid container through the water pump and carry out thermal cooling for the first step, make the liquid entering evaporimeter that has cooled down through the water pump, make liquid evaporation become gaseous, make gaseous entering back flow through the connector, furtherly, the operation through the fan dispels the heat once more.
Drawings
The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention, and together with the description serve to explain the invention and not to limit the invention. In the drawings:
fig. 1 is a complete structural schematic diagram of the present invention;
FIG. 2 is a rear view structure diagram of the present invention;
fig. 3 is a front view structure diagram of the present invention.
In the figure: 1, a shell; 2 a fan housing; 3, bolt holes; 4, a fan net; 5, connecting the pipes; 6, an evaporator; 7, a water pump; 8 a heat absorbing container; 9 a first fixing plate; 10 a heat absorbing copper sheet; 11 a heat insulation pipe; 12 a coolant container; 13 a nut; 14 a return pipe; 15, a dust screen; 16 fans; 17 a second fixing plate; 18 bolt tubes; 19 container lid.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1-3, the present invention provides the following technical solutions: a pump-driven two-phase fluid loop device for heat dissipation of electronic products comprises a shell 1, a fan shell 2 is installed at the top end of the shell 1, bolt holes 3 are formed in the side face of the fan shell 2, a fan net 4 is arranged inside the fan shell 2, a fan 16 is arranged at the bottom end of the fan net 4, a second fixing plate 17 is arranged at the bottom end of the fan 16, a dustproof net 15 is arranged inside the shell 1, a return pipe 14 is arranged inside the shell 1, a bolt pipe 18 is installed on the side face of the shell 1, a nut 13 is connected to the top end of the bolt pipe 18, a connecting pipe 5 is installed at the top end of the nut 13, an evaporator 6 is fixedly installed at one end of the connecting pipe 5, a water pump 7 is installed at one side of the evaporator 6, a cooling liquid container 12 is installed at the top end of the water pump 7, a container cover 19 is arranged at the top end of the cooling, the side surface of the heat absorption container 8 is provided with a first fixing plate 9, and the side surface of the first fixing plate 9 is provided with a heat absorption copper sheet 10 in a penetrating way.
In this embodiment, the return pipe 14 can be isolated from the outside of the housing 1 by providing a dust screen 15, and further, the return pipe 14 is made less prone to adsorb a large amount of dust by the dust screen 15, and by the bolt holes 3 provided in the fan housing 2, the fan 16 can be detached to easily clean the dust on the surface of the fan blades and the dust-proof net 15, and by the fixed installation of the heat-insulating pipe 11 and the heat-absorbing container 8 and the parallel arrangement of the two heat-insulating pipes 11, further, the heat absorbed by the heat absorbing copper sheet 10 is transferred to the heat absorbing container 8 to make the heat insulating pipe 11 effectively and completely absorb the heat, the heat is cooled in the first step by the water pump 7 entering the cooling liquid container 12, the cooled liquid enters the evaporator 6 by the water pump 7, the liquid is evaporated into gas, the gas is introduced into the return pipe 14 through the connection pipe 5, and further, heat is radiated again by the operation of the fan 16.
Specifically, the dust screen 15 is arranged inside the fan 16 and the return pipe 14, the dust screen 15 is tightly attached to the inner wall of the housing 1, the return pipe 14 can be separated from the outside of the housing 1 by arranging the dust screen 15, furthermore, the return pipe 14 is not easy to adsorb a large amount of dust through the dust screen 15, the fan 16 can be detached through the bolt holes 3 arranged in the fan housing 2, and the dust on the surfaces of the fan blades and the dust screen 15 can be easily cleaned.
Specifically, the return pipe 14 is annularly disposed inside the housing 1, the connecting pipe 5 penetrates through the housing 1, and the return pipe 14 and the connecting pipe 5 can be connected by the bolt pipe 18 and the nut 13 by disposing the connecting pipe 5 through the housing 1.
Specifically, the heat absorbing copper sheet 10 penetrates through the second fixing plate 17, the heat absorbing copper sheet 10 is connected with the heat absorbing container 8, and the heat absorbing copper sheet 10 is connected with the heat absorbing container 8, so that the absorbed heat can be transmitted to the heat insulation pipe 11, and the heat can be effectively absorbed.
Specifically, the bottom of coolant liquid container 12 communicates with each other with the top of water pump 7, and container lid 19 can with the inseparable lock of coolant liquid container 12, and the heat through water pump 7 gets into coolant liquid container 12 and cools off, through the setting of the inseparable lock of container lid 19 and coolant liquid container 12, can keep apart with the air after adding the coolant liquid, improves the high-efficient utilization of energy.
The utility model discloses a theory of operation and use flow: the utility model discloses after installing, when using, through the heat absorption copper sheet 10 with absorb heat container 8 be connected, can make absorptive heat transfer to thermal-insulated pipe 11, furtherly, through the communicating cavity setting of water pump 7 and coolant liquid container 12, make the heat absorb the inflow evaporimeter 6 through the solidification of coolant liquid, evaporate into gas through connecting pipe 5 entering back flow 14 to the heat that gets into evaporimeter 6, furtherly, dispels the heat through the operation of fan 16 once more.
Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments described in the foregoing embodiments, or equivalents may be substituted for elements thereof. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (5)
1. A pump-driven two-phase fluid loop device for heat dissipation of electronic products comprises a shell (1), wherein a fan shell (2) is installed at the top end of the shell (1), and the pump-driven two-phase fluid loop device is characterized in that: the fan is characterized in that bolt holes (3) are formed in the side face of the fan shell (2), a fan net (4) is arranged inside the fan shell (2), a fan (16) is arranged at the bottom end of the fan net (4), a second fixing plate (17) is arranged at the bottom end of the fan (16), a dust screen (15) is arranged inside the shell (1), a return pipe (14) is arranged inside the shell (1), a bolt pipe (18) is installed on the side face of the shell (1), a nut (13) is connected to the top end of the bolt pipe (18), a connecting pipe (5) is installed at the top end of the nut (13), an evaporator (6) is fixedly installed at one end of the connecting pipe (5), a water pump (7) is installed at one side of the evaporator (6), a cooling liquid container (12) is installed at the top end of the water pump (7), and a container cover (19) is arranged at the top, the side fixedly connected with heat insulating tube (11) of water pump (7), heat absorption container (8) are installed to the one end of heat insulating tube (11), the side-mounting of heat absorption container (8) has first fixed plate (9), the side of first fixed plate (9) is run through and is installed heat absorption copper sheet (10).
2. A pump-driven two-phase fluid circuit device for dissipating heat from an electronic product according to claim 1, wherein: the dustproof net (15) is arranged inside the fan (16) and the return pipe (14), and the dustproof net (15) is tightly attached to the inner wall of the shell (1).
3. A pump-driven two-phase fluid circuit device for dissipating heat from an electronic product according to claim 1, wherein: the return pipe (14) is annularly arranged inside the shell (1), and the connecting pipe (5) penetrates through the shell (1).
4. A pump-driven two-phase fluid circuit device for dissipating heat from an electronic product according to claim 1, wherein: the heat absorption copper sheet (10) penetrates through the second fixing plate (17), and the heat absorption copper sheet (10) is connected with the heat absorption container (8).
5. A pump-driven two-phase fluid circuit device for dissipating heat from an electronic product according to claim 1, wherein: the bottom end of the cooling liquid container (12) is communicated with the top end of the water pump (7), and the container cover (19) can be tightly buckled with the cooling liquid container (12).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922229059.9U CN211152573U (en) | 2019-12-13 | 2019-12-13 | Pump-driven two-phase fluid loop device for heat dissipation of electronic product |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922229059.9U CN211152573U (en) | 2019-12-13 | 2019-12-13 | Pump-driven two-phase fluid loop device for heat dissipation of electronic product |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211152573U true CN211152573U (en) | 2020-07-31 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201922229059.9U Active CN211152573U (en) | 2019-12-13 | 2019-12-13 | Pump-driven two-phase fluid loop device for heat dissipation of electronic product |
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| Country | Link |
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| CN (1) | CN211152573U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113190101A (en) * | 2021-06-09 | 2021-07-30 | 楚岳(惠州)热传科技有限公司 | Circulating two-phase flow industrial computer radiator |
-
2019
- 2019-12-13 CN CN201922229059.9U patent/CN211152573U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113190101A (en) * | 2021-06-09 | 2021-07-30 | 楚岳(惠州)热传科技有限公司 | Circulating two-phase flow industrial computer radiator |
| CN113190101B (en) * | 2021-06-09 | 2022-05-10 | 楚岳(惠州)热传科技有限公司 | Circulating two-phase flow industrial computer radiator |
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Effective date of registration: 20230530 Address after: Room 03, Building 1, No. 55 Erquan East Road, Dongting Street, Xishan District, Wuxi City, Jiangsu Province, 214101 Patentee after: Wuxi Zhengyan Technology Co.,Ltd. Address before: Room 300, Building 2, East Xiaolizhuang Village, Shahe Town, Changping District, Beijing 102200 Patentee before: Beijing alphazhi Technology Co.,Ltd. |