CN218006597U - Anti-interference multilayer circuit board - Google Patents

Anti-interference multilayer circuit board Download PDF

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Publication number
CN218006597U
CN218006597U CN202221570553.7U CN202221570553U CN218006597U CN 218006597 U CN218006597 U CN 218006597U CN 202221570553 U CN202221570553 U CN 202221570553U CN 218006597 U CN218006597 U CN 218006597U
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China
Prior art keywords
circuit board
multilayer circuit
board main
main part
corners
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CN202221570553.7U
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Chinese (zh)
Inventor
廖新喜
马圆
张绍深
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Qianyou Huizhou Electronics Co ltd
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Qianyou Huizhou Electronics Co ltd
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Abstract

The utility model discloses a multilayer circuit board of jam-proof, including the protecting frame, the backing plate is all installed in protecting frame lower extreme four corners, the metal dust screen is installed to the protecting frame lower extreme, two draw-in grooves have all been opened in protecting frame upper end four corners, four the backing plate upper end is provided with multilayer circuit board main part jointly, the protecting frame upper end is provided with the protection casing, two plastics buckles are all installed in protecting frame lower extreme four corners, plastics buckle and draw-in groove activity joint, protection casing left end and right-hand member have all opened the louvre, dustproof sponge is installed to the louvre inner wall. The utility model discloses a set up protective frame, protection casing and metal dust screen and constitute the shield cover, thereby surround the space coupling passageway that cuts off or weaken the interference field with multilayer circuit board main part, prevent its transmission of electromagnetic energy, prevent the interference of the electromagnetic wave among the external environment to multilayer circuit board main part, improved the anti-interference effect of multilayer circuit board main part, simple structure, long service life.

Description

Anti-interference multilayer circuit board
Technical Field
The utility model relates to a circuit board technical field, in particular to multilayer circuit board of jam-proof.
Background
Circuit boards are supports for circuit components and devices in electronic products that provide electrical connections between the circuit components and devices. The circuit board comprises a single-sided board, a double-sided board and a multilayer board. With the rapid development of electronic technology, the density of circuit boards is higher and higher, the application development of multilayer boards is rapid, and the anti-interference design of the multilayer circuit board is also rapidly developed.
The current patent (application number 202122772543.3) discloses a multilayer circuit board that jam-proof performance is strong, relates to circuit board technical field, including the inlayer circuit board, the four corners internal fixation of inlayer circuit board has the bolt pad, the lower extreme that the bolt pad has the bottom circuit board through first bolt fixed mounting, there is the roof upper end that the bolt pad through second bolt fixed mounting, the upper surface of inlayer circuit board and bottom circuit board is all fixed and is provided with the insulating layer, the upper surface of insulating layer still is fixed and is equipped with the copper foil layer, the both ends upper surface of roof all is provided with even board subassembly, even board subassembly includes the third bolt and links the board, the third bolt supports tightly with even board. The utility model can protect the two ends of the circuit board through the bracket, and reduce the collision phenomenon of normal installation; in the use process, the copper foil layer is made of the metal foil conductive material and has an electromagnetic shielding effect, so that electromagnetic signals can be shielded, and the anti-interference effect of the inner layer circuit board and the bottom layer circuit board is improved.
Above-mentioned patent plays electromagnetic shield's effect through setting up the copper foil layer, nevertheless only to the mutual crosstalk between inlayer circuit board and bottom circuit board, and whole multiply wood does not have the anti-electromagnetic interference ability among the external environment and is showing the promotion, and above-mentioned patent need use the bolt for installing first support and circuit board, has not only increased the installation cost of circuit board, has still reduced the installation effectiveness of circuit board, so, we provide a multilayer circuit board of jam-proof.
SUMMERY OF THE UTILITY MODEL
A primary object of the present invention is to provide a multi-layer circuit board with interference prevention, which can effectively solve the problems of the background art.
In order to achieve the above purpose, the utility model adopts the technical proposal that:
the utility model provides a multilayer circuit board of jam-proof, includes the protecting frame, the backing plate is all installed in protecting frame lower extreme four corners, the metal dust screen is installed to the protecting frame lower extreme, two draw-in grooves have all been opened in protecting frame upper end four corners, four the backing plate upper end is provided with multilayer circuit board main part jointly, the protecting frame upper end is provided with the protection casing, two plastics buckles are all installed in protection casing lower extreme four corners, plastics buckle and draw-in groove activity joint, the louvre has all been opened to protection casing left end and right-hand member, dustproof sponge is installed to the louvre inner wall.
During the use, directly place multilayer circuit board main part on the backing plate, then add heat conduction silica gel between multilayer circuit board main part and protective frame inner wall, fix the protection casing in the protective frame top through plastics buckle and draw-in groove at last, the reservation opening of multilayer circuit board main part and external communication pencil is seted up to the protection casing rear end.
Preferably, protective frame front end middle part and rear end middle part all are provided with the bellying, the bellying is isosceles trapezoid structure, is convenient for place multilayer circuit board main part through setting up the bellying.
Preferably, the blotter is all installed in protection frame inner wall four corners, blotter and multilayer circuit board main part in close contact with, be provided with the clearance between multilayer circuit board main part surface and the protection frame inner wall, through setting up the four corners of blotter protection multilayer circuit board main part.
Preferably, a gap between the inner wall of the protective frame and the outer surface of the multilayer circuit board main body is filled with heat-conducting silica gel.
Preferably, a gap exists between the lower end face of the multilayer circuit board main body and the upper end face of the metal dustproof net, the metal dustproof net is made of copper fibers, and copper metal has an electromagnetic shielding function.
Preferably, the protective frame, the backing plate and the protective cover are all made of aluminum-iron alloy containing 15-16% of aluminum, have an electromagnetic shielding function, and are cheaper and widely available compared with copper.
Compared with the prior art, the utility model discloses following beneficial effect has:
1. the shielding cover is formed by arranging the protective frame, the protective cover and the metal dust screen, so that the multilayer circuit board main body is surrounded, a space coupling channel of an interference field is cut off or weakened, the transmission of electromagnetic energy is prevented, the interference of electromagnetic waves in the external environment on the multilayer circuit board main body is prevented, the anti-interference effect of the multilayer circuit board main body is improved, meanwhile, the protective cover and the protective frame also play a role in protecting the multilayer circuit board main body, other objects are effectively prevented from colliding with the multilayer circuit board main body in the transportation and storage processes, and the service life of the multilayer circuit board main body is prolonged;
2. the plastic buckle and the clamping groove are arranged to realize the connection between the protective frame and the protective cover, when in use, the plastic buckle is only required to be aligned to the clamping groove and then pressed downwards with force, so that the plastic buckle is completely positioned in the clamping groove, the operation is simple and convenient, and compared with a bolt fixing mode, the plastic buckle has higher efficiency and lower installation cost, and is beneficial to popularization and use;
3. the heat that produces when being convenient for discharge multilayer circuit board main part operation through setting up the louvre, and multilayer circuit board main part below adopts built on stilts setting, further accelerates heat and outside air's heat transfer speed, has improved the radiating effect, and the rethread sets up heat conduction silica gel and conducts the heat that multilayer circuit board main part produced to the protective frame, and the protective frame is the aluminium iron alloy material, and heat conduction efficiency is high.
Drawings
Fig. 1 is a schematic view of the overall structure of a tamper-proof multilayer circuit board according to the present invention;
fig. 2 is an explosion diagram of the overall structure of the interference-proof multilayer circuit board of the present invention;
fig. 3 is a schematic view of the overall structure of a protection frame of a tamper-proof multilayer circuit board according to the present invention;
fig. 4 is a schematic view of the overall structure of the plastic buckle of the anti-interference multilayer circuit board of the present invention;
fig. 5 is a schematic diagram of the overall structure of the card slot of the interference-proof multilayer circuit board of the present invention.
In the figure: 1. a protective frame; 2. a backing plate; 3. a metal dust screen; 4. a card slot; 5. a multilayer wiring board main body; 6. a protective cover; 7. a plastic buckle; 8. heat dissipation holes; 9. a dust-proof sponge; 21. a boss portion; 31. a cushion pad.
Detailed Description
In order to make the utility model realize, the technical means, the creation characteristics, the achievement purpose and the efficacy are easy to understand and understand, the utility model is further explained by combining the specific implementation mode.
In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "front end", "rear end", "both ends", "one end", "the other end" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element to which the reference is made must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "provided," "connected," and the like are to be construed broadly, such as "connected," which may be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.
As shown in fig. 1-5, an anti-interference multilayer circuit board comprises a protective frame 1, backing plates 2 are mounted at four corners of the lower end of the protective frame 1, a metal dust screen 3 is mounted at the lower end of the protective frame 1, two clamping grooves 4 are formed in four corners of the upper end of the protective frame 1, a multilayer circuit board main body 5 is jointly arranged at the upper ends of the four backing plates 2, a protective cover 6 is arranged at the upper end of the protective frame 1, two plastic buckles 7 are mounted at four corners of the lower end of the protective cover 6, the plastic buckles 7 are movably clamped with the clamping grooves 4, heat dissipation holes 8 are formed in the left end and the right end of the protective cover 6, and dustproof sponge 9 is mounted on the inner wall of each heat dissipation hole 8.
During the use, directly place multilayer circuit board main part 5 on backing plate 2, then add heat conduction silica gel between multilayer circuit board main part 5 and 1 inner wall of protection frame, fix protection casing 6 in protection frame 1 top through plastics buckle 7 and draw-in groove 4 at last, the reservation opening of multilayer circuit board main part 5 and external communication pencil is seted up to 6 rear ends of protection casing.
Guard frame 1 front end middle part and rear end middle part all are provided with bellying 21, and bellying 21 is isosceles trapezoid structure, is convenient for place multilayer circuit board main part 5 through setting up bellying 21.
Cushion 31 is all installed in 1 inner wall four corners of protective frame, and cushion 31 and 5 in close contact with of multilayer circuit board main part are provided with the clearance between 5 surfaces of multilayer circuit board main part and 1 inner wall of protective frame, through setting up the four corners of 31 protection multilayer circuit board main parts of cushion 5.
And heat-conducting silica gel is filled in a gap between the inner wall of the protective frame 1 and the outer surface of the multilayer circuit board main body 5.
A gap exists between the lower end face of the multilayer circuit board main body 5 and the upper end face of the metal dust screen 3, the metal dust screen 3 is made of copper fibers, and copper metal has an electromagnetic shielding function.
The protective frame 1, the backing plate 2 and the protective cover 6 are all made of aluminum-iron alloy containing 15-16% of aluminum, have an electromagnetic shielding function, and are cheaper and widely available compared with copper.
It should be noted that the utility model relates to an anti-interference multilayer circuit board, through setting up the shield cover that protective frame 1, protection casing 6 and metal dust screen 3 constitute, surround multilayer circuit board main part 5 and thus cut off or weaken the space coupling passageway of interference field, prevent its transmission of electromagnetic energy, prevent the interference of electromagnetic wave in the external environment to multilayer circuit board main part 5, the anti-interference effect of multilayer circuit board main part 5 has been improved, meanwhile, protection casing 6 and protective frame 1 still play the effect of protecting multilayer circuit board main part 5, prevent effectively that other article from colliding multilayer circuit board main part 5 in the transportation, the storage process, the life of multilayer circuit board main part 5 has been prolonged; the plastic buckle 7 and the clamping groove 4 are arranged to realize the connection between the protective frame 1 and the protective cover 6, when the protective frame is used, the plastic buckle 7 is only required to be aligned to the clamping groove 4 and then pressed downwards with force, so that the plastic buckle 7 is completely positioned in the clamping groove 4, the operation is simple and convenient, compared with a bolt fixing mode, the efficiency is higher, the installation cost is lower, and the popularization and the use are facilitated; the heat that 5 operation produced of multilayer circuit board main part produced is convenient for discharge through setting up louvre 8, and 5 below adoption aerial settings of multilayer circuit board main part, further accelerates heat and outside air's heat transfer speed, has improved the radiating effect, and the rethread sets up heat conduction silica gel with the heat conduction of 5 production of multilayer circuit board main part to protection frame 1, and protection frame 1 is the aluminium ferroalloy material, and heat conduction efficiency is high.
The basic principles and the main features of the invention and the advantages of the invention have been shown and described above. It will be understood by those skilled in the art that the present invention is not limited to the above embodiments, and that the foregoing embodiments and descriptions are provided only to illustrate the principles of the present invention without departing from the spirit and scope of the present invention. The scope of the invention is defined by the appended claims and equivalents thereof.

Claims (6)

1. A multilayer wiring board of jam-proof, includes protective frame (1), its characterized in that: backing plates (2) are all installed in protection frame (1) lower extreme four corners, metal dust screen (3) are installed to protection frame (1) lower extreme, two draw-in grooves (4), four have all been opened in protection frame (1) upper end four corners backing plate (2) upper end is provided with multilayer circuit board main part (5) jointly, protection frame (1) upper end is provided with protection casing (6), two plastics buckle (7) are all installed in protection casing (6) lower extreme four corners, plastics buckle (7) and draw-in groove (4) activity joint, protection casing (6) left end and right-hand member have all opened louvre (8), dustproof sponge (9) are installed to louvre (8) inner wall.
2. The tamper-proof multilayer circuit board of claim 1, wherein: protection frame (1) front end middle part and rear end middle part all are provided with bellying (21), bellying (21) are isosceles trapezoid structure.
3. A tamper-proof multilayer wiring board according to claim 2, wherein: all install blotter (31) in protecting frame (1) inner wall four corners, blotter (31) and multilayer circuit board main part (5) in close contact with, be provided with the clearance between multilayer circuit board main part (5) surface and protecting frame (1) inner wall.
4. A tamper-proof multilayer circuit board in accordance with claim 3, wherein: and a gap between the inner wall of the protective frame (1) and the outer surface of the multilayer circuit board main body (5) is filled with heat-conducting silica gel.
5. The tamper-proof multilayer wiring board of claim 4, wherein: a gap exists between the lower end face of the multilayer circuit board main body (5) and the upper end face of the metal dust screen (3), and the metal dust screen (3) is made of copper fibers.
6. The tamper-proof multilayer wiring board of claim 5, wherein: the protective frame (1), the backing plate (2) and the protective cover (6) are all made of aluminum-iron alloy containing 15-16% of aluminum.
CN202221570553.7U 2022-06-22 2022-06-22 Anti-interference multilayer circuit board Active CN218006597U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202221570553.7U CN218006597U (en) 2022-06-22 2022-06-22 Anti-interference multilayer circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202221570553.7U CN218006597U (en) 2022-06-22 2022-06-22 Anti-interference multilayer circuit board

Publications (1)

Publication Number Publication Date
CN218006597U true CN218006597U (en) 2022-12-09

Family

ID=84300622

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202221570553.7U Active CN218006597U (en) 2022-06-22 2022-06-22 Anti-interference multilayer circuit board

Country Status (1)

Country Link
CN (1) CN218006597U (en)

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