CN214627475U

CN214627475U - PCB multiply wood of high-efficient heat dissipation

Info

Publication number: CN214627475U
Application number: CN202120631644.6U
Authority: CN
Inventors: 彭国安
Original assignee: Shenzhen Lidia Electronics Co ltd
Current assignee: Shenzhen Lidia Electronics Co ltd
Priority date: 2021-03-29
Filing date: 2021-03-29
Publication date: 2021-11-05
Anticipated expiration: 2031-03-29

Abstract

The utility model discloses a high-efficient radiating PCB multiply wood, including the multiply wood main part, the inside fixed welding of multiply wood main part installs radiator unit, four side fixed welding of radiator unit installs heat conduction structure, the multiply wood main part includes main part mainboard, main part subplate, main part three-plate, main part bottom plate, electronic component and heat dissipation space, radiator unit includes heating panel mounting groove, heat dissipation buckled plate, expands face heat absorption groove and connecting rod, heat conduction structure includes heat conduction pole and heat dissipation contact piece, heat dissipation buckled plate quantity is four, through connecting rod interconnect between the heat dissipation buckled plate, the total four groups of connecting rod, and respectively fixed mounting inside four sides of multiply wood main part, the heating panel mounting groove is seted up respectively inside main part mainboard, main part subplate, main part three-plate and main part bottom plate. A high-efficient radiating PCB multiply wood, possess powerful efficient heat dispersion to a support chassis is provided, increase strength.

Description

PCB multiply wood of high-efficient heat dissipation

Technical Field

The utility model relates to a PCB multiply wood field, in particular to high-efficient radiating PCB multiply wood.

Background

The printed circuit board, also known as the printed circuit board, is the provider of the electrical connection of electronic components, the main advantage that adopts the circuit board is that the mistake of greatly reducing the wiring and assembling, has improved automation level and production labor rate, can divide into single-sided board, double-sided board, four-layer board, six-layer board and other multilayer circuit boards according to the circuit board number of piles, the utility model introduces a PCB multiply wood; there is certain drawback current PCB multiply wood when using, because multilayer board bonds together, electronic component arranges more densely, leads to producing the heat too much to be difficult to the scattered, simultaneously because the reason of panel self material, toughness is lower, easily by external force damage, thereby destroys the circuit, for this reason, we provide a high-efficient radiating PCB multiply wood.

SUMMERY OF THE UTILITY MODEL

The utility model discloses a main aim at provides a high-efficient radiating PCB multiply wood can effectively solve the problem in the background art.

In order to achieve the above purpose, the utility model adopts the following technical scheme:

the PCB multilayer board capable of efficiently radiating heat comprises a multilayer board main body, wherein a heat radiating assembly is fixedly welded in the multilayer board main body, and heat conducting structures are fixedly welded on four sides of the heat radiating assembly.

Preferably, the multilayer board main body comprises a main body main board, a main body secondary board, a main body three board, a main body bottom board, electronic elements and a heat dissipation gap, the main body secondary board is fixedly installed at the rear side of the main body main board, the main body three board is fixedly installed at the rear side of the main body secondary board, the main body bottom board is fixedly installed at the rear side of the main body three board, various electronic elements are fixedly installed on the front side surfaces of the main body main board, the main body secondary board, the main body three board and the main body bottom board, and the heat dissipation gap is formed at the adjacent position of the main body main board, the main body secondary board, the main body three board and the main body bottom board.

Preferably, radiator unit includes heating panel mounting groove, heat dissipation buckled plate, expands a heat absorption groove and connecting rod, fixed mounting has heat dissipation buckled plate in the heating panel mounting groove, heat dissipation buckled plate both sides surface has been seted up and has been expanded a heat absorption groove, heat dissipation buckled plate fixed surface welded mounting has the connecting rod.

Preferably, the heat conducting structure comprises a heat conducting rod and a heat radiating contact piece, and the heat radiating contact piece is fixedly welded to one end of the heat conducting rod.

Preferably, heat dissipation buckled plate quantity is four, through connecting rod interconnect between the heat dissipation buckled plate, the connecting rod is total four groups, and respectively fixed mounting is inside four sides of multiply wood main part.

Preferably, the heat dissipation plate mounting grooves are respectively formed in the main body main plate, the main body secondary plate, the main body three plates and the main body bottom plate, and the other end of the heat conduction rod is fixedly welded and mounted on one side of the connecting rod.

Compared with the prior art, the utility model discloses following beneficial effect has:

in the utility model, the multi-layer board main body is electrified to lead the electronic element group to start working, after long-time operation, heat is inevitably generated and absorbed and transferred by the radiating corrugated plate installed in the internal radiating plate installation groove, at the same time, the connecting rod is used to guide the heat to the heat conducting rod, one part is radiated from the heat radiating gap, and the other part is guided to the heat radiating contact sheet through the heat conducting rod, the heat dissipation contact sheet can be connected with the heat dissipation device to enhance the heat dissipation effect, and can contact with the device shell to guide the heat to the outside, and has the functions of supporting and protecting the main body of the multilayer board, improving the protection performance, increasing the heat absorption surface area of the heat dissipation corrugated board by the surface-expanding heat absorption grooves, a temperature difference is formed in the main body main board, the main body secondary board, the main body three boards and the main body bottom board, heat dissipation is accelerated, and the heat dissipation effect is further improved.

Drawings

Fig. 1 is a schematic view of an overall structure of a PCB multi-layer board with high heat dissipation efficiency according to the present invention;

fig. 2 is a sectional view of a main body of a PCB multi-layer board with high heat dissipation efficiency according to the present invention;

fig. 3 is a sectional view of a multi-layer board main body of the PCB multi-layer board with high heat dissipation efficiency of the present invention;

fig. 4 is a schematic view of the heat conducting structure of the PCB multi-layer board with high heat dissipation efficiency of the present invention.

In the figure: 1. a multi-layer board main body; 101. a main body main board; 102. a main body secondary plate; 103. a main body three plate; 104. a main body bottom plate; 105. an electronic component; 106. a heat dissipation void; 2. a heat dissipating component; 201. a heat dissipation plate mounting groove; 202. a heat dissipating corrugated plate; 203. a surface-expanding heat absorption groove; 204. a connecting rod; 3. a heat conducting structure; 301. a heat conducting rod; 302. and a heat dissipating contact piece.

Detailed Description

In order to make the technical means, creation features, achievement purposes and functions of the present invention easy to understand, the present invention is further described below with reference to the following embodiments.

As shown in fig. 1 to 4, a PCB multi-layer board with high heat dissipation efficiency comprises a multi-layer board main body 1, wherein a heat dissipation assembly 2 is fixedly welded inside the multi-layer board main body 1, and heat conduction structures 3 are fixedly welded on four sides of the heat dissipation assembly 2;

the multilayer board main body 1 comprises a main body main board 101, a main body secondary board 102, a main body three board 103, a main body bottom board 104, electronic elements 105 and a heat dissipation gap 106, wherein the main body secondary board 102 is fixedly installed on the rear side of the main body main board 101, the main body three board 103 is fixedly installed on the rear side of the main body secondary board 102, the main body bottom board 104 is fixedly installed on the rear side of the main body three board 103, various electronic elements 105 are fixedly installed on the front side surfaces of the main body main board 101, the main body secondary board 102, the main body three board 103 and the main body bottom board 104, and the heat dissipation gap 106 is formed at the adjacent position of the main body main board 101, the main body secondary board 102, the main body three board 103 and the main body bottom board 104; the heat dissipation assembly 2 comprises a heat dissipation plate installation groove 201, a heat dissipation corrugated plate 202, an expanded surface heat absorption groove 203 and a connecting rod 204, wherein the heat dissipation corrugated plate 202 is fixedly installed in the heat dissipation plate installation groove 201, the expanded surface heat absorption grooves 203 are formed in the surfaces of the two sides of the heat dissipation corrugated plate 202, and the connecting rod 204 is fixedly welded on the surface of the heat dissipation corrugated plate 202; the heat conducting structure 3 comprises a heat conducting rod 301 and a heat radiating contact piece 302, wherein the heat radiating contact piece 302 is fixedly welded at one end of the heat conducting rod 301; the number of the heat dissipation corrugated plates 202 is four, the heat dissipation corrugated plates 202 are connected with each other through connecting rods 204, and the connecting rods 204 are four groups in total and are respectively and fixedly installed inside four sides of the multilayer plate main body 1; the heat radiation plate mounting grooves 201 are respectively opened in the main body main plate 101, the main body sub plate 102, the main body three plate 103, and the main body bottom plate 104, and the other end of the heat conduction rod 301 is fixedly welded to one side of the connection rod 204.

It should be noted that, the utility model relates to a high-efficient radiating PCB multiply wood, when using, to multiply wood main part 1 circular telegram, make electronic component 105 group begin work, after long-time operation work, can't avoid producing the heat, the heat that produces is absorbed and is transmitted by the heat dissipation buckled plate 202 of installation in inside heating panel mounting groove 201, utilize connecting rod 204 simultaneously, lead heat conduction pole 301 with the heat, a part distributes away from heat dissipation space 106, a part leads heat dissipation contact piece 302 through heat conduction pole 301, and heat dissipation contact piece 302 can be interconnected with the radiating equipment, strengthen the radiating effect, can contact with the equipment shell simultaneously, lead the heat to the external world, and play the effect of supporting protection multiply wood to main part 1, improve protectiveness, expand face heat absorption groove 203 when increasing heat dissipation buckled plate 202 heat absorption surface area, at main part mainboard 101, main part subplate 102, A temperature difference is formed between the three main body plates 103 and the bottom main body plate 104, so that heat dissipation is accelerated, and the heat dissipation effect is further improved.

The basic principles and the main features of the invention and the advantages of the invention have been shown and described above. It will be understood by those skilled in the art that the present invention is not limited to the above embodiments, and that the foregoing embodiments and descriptions are provided only to illustrate the principles of the present invention without departing from the spirit and scope of the present invention. The scope of the invention is defined by the appended claims and equivalents thereof.

Claims

1. The utility model provides a high-efficient radiating PCB multiply wood which characterized in that: the heat dissipation structure comprises a multilayer board main body (1), wherein a heat dissipation assembly (2) is fixedly welded inside the multilayer board main body (1), and heat conduction structures (3) are fixedly welded on four sides of the heat dissipation assembly (2).

2. A PCB multi-layer board with high heat dissipation efficiency as recited in claim 1, wherein: the multilayer board main body (1) comprises a main body main board (101), a main body secondary board (102), a main body three board (103), a main body bottom board (104), electronic elements (105) and a heat dissipation gap (106), wherein the main body secondary board (102) is fixedly installed on the rear side of the main body main board (101), the main body three board (103) is fixedly installed on the rear side of the main body secondary board (102), the main body bottom board (104) is fixedly installed on the rear side of the main body three board (103), various electronic elements (105) are fixedly installed on the front side surfaces of the main body main board (101), the main body secondary board (102), the main body three board (103) and the main body bottom board (104), and the heat dissipation gap (106) is formed in the adjacent positions of the main body main board (101), the main body secondary board (102), the main body three board (103) and the main body bottom board (104).

3. A PCB multi-layer board with high heat dissipation efficiency as recited in claim 2, wherein: radiating component (2) include heating panel mounting groove (201), heat dissipation buckled plate (202), expand face heat absorption groove (203) and connecting rod (204), fixed mounting has heat dissipation buckled plate (202) in heating panel mounting groove (201), heat dissipation buckled plate (202) both sides surface has been seted up and has been expanded face heat absorption groove (203), heat dissipation buckled plate (202) fixed surface welded mounting has connecting rod (204).

4. A PCB multi-layer board with high heat dissipation efficiency as defined in claim 3, wherein: the heat conduction structure (3) comprises a heat conduction rod (301) and a heat dissipation contact piece (302), wherein the heat dissipation contact piece (302) is fixedly welded to one end of the heat conduction rod (301).

5. A PCB multi-layer board with high heat dissipation efficiency as recited in claim 4, wherein: the number of the heat dissipation corrugated plates (202) is four, the heat dissipation corrugated plates (202) are connected with each other through connecting rods (204), the connecting rods (204) are four groups in total, and the connecting rods are fixedly arranged inside four sides of the multilayer plate main body (1) respectively.

6. A PCB multi-layer board with high heat dissipation efficiency as recited in claim 5, wherein: the heat dissipation plate mounting grooves (201) are respectively formed in the main body main plate (101), the main body secondary plate (102), the main body three plate (103) and the main body bottom plate (104), and the other end of the heat conduction rod (301) is fixedly welded and mounted on one side of the connecting rod (204).