CN213783695U

CN213783695U - PCB circuit board

Info

Publication number: CN213783695U
Application number: CN202023283237.5U
Authority: CN
Inventors: 李战华; 熊军军; 李纳; 让玲娟
Original assignee: Tian Xun Electronics Yantai Co ltd
Current assignee: Tian Xun Electronics Yantai Co ltd
Priority date: 2020-12-30
Filing date: 2020-12-30
Publication date: 2021-07-23
Anticipated expiration: 2030-12-30

Abstract

The utility model relates to a PCB circuit board belongs to circuit board technical field, and it includes the circuit board body, the circuit board body includes plate body one and plate body two, the tip of plate body one and plate body two is equipped with the coupling mechanism that can link together plate body one and plate body two, a plurality of mounting groove one have been seted up to one side that plate body one is close to plate body two, plate body two is close to one side of plate body one and has been seted up a plurality of mounting grooves two that are linked together with mounting groove one, be equipped with hollow heat absorption pipe in mounting groove one and the mounting groove two, the intraductal heat absorption liquid that is equipped with of heat absorption. The application has the effect of reducing damage to the electronic element.

Description

PCB circuit board

Technical Field

The application relates to the technical field of circuit boards, in particular to a PCB (printed circuit board).

Background

At present, most of circuit boards are made of PCB materials, the circuit boards made of the PCB materials are also called PCB circuit boards, the existence of the PCB circuit boards can be almost kept away in electronic equipment which can be seen by people, the circuit boards are as small as electronic components such as electronic watches, calculators, general computers and as large as computer communication electronic equipment, and the circuit boards have the main advantages of greatly reducing errors of wiring and assembly and improving the automation level and the production labor rate.

The related chinese patent publication No. CN204721704U discloses a circuit board, comprising: the circuit board body, the waterproof board that bonds on the circuit board body, arrange the water receiving tank that is used for catchmenting in the waterproof board in, paste the drier piece on the water receiving tank.

In view of the above-mentioned related art, the inventor believes that the above-mentioned circuit board has a certain waterproof performance, but for electronic equipment, the during operation can produce certain heat to easily cause the inside temperature of equipment to rise rapidly, if not in time distribute away this heat, the equipment will be continuous to rise temperature, and then can cause certain damage to the electronic component who installs on the circuit board.

SUMMERY OF THE UTILITY MODEL

In order to reduce damage to electronic components, the present application provides a PCB circuit board.

The application provides a PCB circuit board adopts following technical scheme:

the PCB comprises a circuit board body, wherein the circuit board body comprises a first plate body and a second plate body, a connecting mechanism capable of connecting the first plate body and the second plate body together is arranged at the end parts of the first plate body and the second plate body, a plurality of first mounting grooves are formed in one side, close to the second plate body, of the first plate body, a plurality of second mounting grooves communicated with the first mounting grooves are formed in one side, close to the first plate body, of the second plate body, hollow heat absorption pipes are arranged in the first mounting grooves and the second mounting grooves, and heat absorption liquid is arranged in the heat absorption pipes.

Through adopting above-mentioned technical scheme, coupling mechanism can link together plate body one and plate body two, when installing electronic component work on the circuit board and giving out a large amount of heats, the heat absorption liquid in the heat absorption pipe can absorb the heat, has reduced the overheated problem of local temperature, and the heat absorption pipe sets up in mounting groove one and mounting groove two, has improved the homogeneity to thermal recovery effect and recovery, and then has reduced the problem of electronic component damage on the circuit board because of the high temperature leads to.

Optionally, the first plate body is provided with a heat dissipation groove perpendicular to the first mounting groove, the heat dissipation groove is communicated with the first mounting groove, a heat conduction rod is arranged in the heat dissipation groove, and the heat conduction rod is abutted to the heat absorption pipe.

By adopting the technical scheme, the heat conducting rod is connected with the heat absorbing pipe, and the heat conducting rod can further conduct out the heat in the heat absorbing pipe and the heat absorbing liquid in the heat absorbing pipe, so that the problem of overhigh local temperature is reduced.

Optionally, a clamping piece is arranged at a position where the heat conducting rod abuts against the heat absorbing pipe, the clamping piece comprises a first clamping ring and a second clamping ring, the first clamping ring is clamped on the heat absorbing pipe, and the second clamping ring is clamped on the heat conducting rod.

Through adopting above-mentioned technical scheme, set up snap ring one and snap ring two, improved the area of contact of heat conduction pole and heat-absorbing pipe, and then improved the heat exchange efficiency between heat conduction pole and the heat-absorbing pipe.

Optionally, a heat conducting fin is arranged between the first clamping ring and the second clamping ring, one end of the heat conducting fin is fixedly connected with the first clamping ring, and the other end of the heat conducting fin is fixedly connected with the second clamping ring.

Through adopting above-mentioned technical scheme, be equipped with the conducting strip between snap ring one and the snap ring two, set up the conducting strip and further improved the heat exchange efficiency between heat conduction pole and the heat absorption pipe.

Optionally, mounting holes are respectively formed in four corners of the first plate body and the second plate body, and connecting bolts penetrate through the mounting holes.

Through adopting above-mentioned technical scheme, be convenient for install or dismantle this circuit board through setting up connecting bolt, improved the steadiness of this circuit board installation.

Optionally, the end of the heat conducting rod is connected with a heat conducting column, the heat conducting column and the heat conducting rod are vertically arranged, and the end of the heat conducting column is abutted to the connecting bolt.

Through adopting above-mentioned technical scheme, set up the heat conduction post to make heat conduction post inconsistent with connecting bolt, the heat conduction post can lead to connecting bolt with the heat of heat conduction pole, and then connecting bolt can derive the heat of this circuit board, thereby realized deriving this circuit board thoroughly with the heat.

Optionally, a connecting rod with a rectangular cross section is arranged at the position where the heat conduction column abuts against the connecting bolt, the connecting rod is arranged in the mounting hole, and the connecting bolt is in threaded connection with the connecting rod.

Through adopting above-mentioned technical scheme, set up the connecting rod in the mounting hole, and connecting rod and connecting bolt threaded connection set up the connecting rod and increased the area of contact of heat conduction post and connecting bolt, and then improved heat conduction efficiency.

Optionally, the connecting mechanism comprises a plurality of connecting pieces, the connecting pieces are arranged on the side faces of the first plate body and the second plate body, a first mounting bolt penetrates through the upper end of each connecting piece and the first plate body, and a second mounting bolt penetrates through the lower end of each connecting piece and the second plate body.

By adopting the technical scheme, when the first plate body and the second plate body need to be connected and installed together, the connecting piece is placed on the first plate body and the second plate body, and then the first mounting bolt and the second mounting bolt are respectively installed on the first plate body and the second plate body.

In summary, the present application includes at least one of the following beneficial technical effects:

1. by arranging the heat absorbing pipe, the heat absorbing liquid, the heat conducting rod and the heat conducting column, heat generated by the electronic element on the circuit board can be led out, and the problem that the electronic element is easily damaged due to overhigh temperature of the circuit board is solved;

2. the circuit board is convenient to mount or dismount by arranging the connecting bolt.

Drawings

FIG. 1 is a schematic structural diagram of a PCB circuit board according to the present application;

FIG. 2 is a schematic view showing the structure of a heat absorption tube according to an embodiment of the present application;

FIG. 3 is a schematic view showing the structure of a heat conduction rod according to an embodiment of the present application;

fig. 4 is an enlarged schematic view of the structure a in fig. 3.

Description of reference numerals: 1. a circuit board body; 11. a first plate body; 12. a first mounting groove; 13. a second plate body; 14. a second mounting groove; 2. a heat absorbing tube; 22. a heat conducting rod; 3. a clamping piece; 31. a first snap ring; 32. a snap ring II; 33. a heat conductive sheet; 4. mounting holes; 41. a heat-conducting column; 42. a connecting rod; 43. a connecting bolt; 5. a connecting mechanism; 54. connecting sheets; 55. mounting a first bolt; 56. and mounting a second bolt.

Detailed Description

The present application is described in further detail below with reference to figures 1-4.

The embodiment of the application discloses a PCB circuit board.

Referring to fig. 1, a PCB includes a circuit board body 1, and the circuit board body 1 includes a first board body 11, a second board body 13, a heat dissipation mechanism, an installation mechanism, and a connection mechanism 5. The first plate body 11 is arranged at the upper end of the second plate body 13, the first plate body 11 and the second plate body 13 can be installed together through the connecting mechanism 5, the heat dissipation mechanism is arranged between the first plate body 11 and the second plate body 13, heat generated by the circuit board can be dissipated through the heat dissipation mechanism, and the problem that electronic elements are prone to damage due to overhigh temperature of the circuit board is solved. The installation mechanisms are arranged at four corners of the circuit board, and the circuit board is convenient to install through the installation mechanisms.

Referring to fig. 1, the connecting mechanism 5 includes a plurality of connecting pieces 54, a first mounting bolt 55 and a second mounting bolt 56, the connecting pieces 54 are uniformly arranged on the side surfaces of the first plate body 11 and the second plate body 13, the first mounting bolt 55 is arranged at the upper end of the connecting pieces 54 in a penetrating manner, the first mounting bolt 55 is in threaded connection with the first plate body 11, the second mounting bolt 56 is arranged at the lower end of the connecting pieces 54 in a penetrating manner, and the second mounting bolt 56 is in threaded connection with the second plate body 13. When the first plate body 11 and the second plate body 13 are mounted together, the first mounting bolt 55 and the second mounting bolt 56 are mounted on the first plate body 11 and the second plate body 13 respectively.

Referring to fig. 2 and 3, heat dissipation mechanism includes a plurality of hollow heat absorption pipes 2, a heat conduction pole 22 and two heat conduction posts 41, mounting groove one 12 has been seted up to plate body one 11, mounting groove two 14 that is linked together with mounting groove one 12 has been seted up to plate body two 13, heat absorption pipe 2 sets up in mounting groove one 12 and mounting groove two 14, be equipped with heat absorption liquid in the heat absorption pipe 2, set up the radiating groove with mounting groove one 12 looks vertically in plate body one 11, heat conduction pole 22 is located the radiating groove, heat conduction pole 22 offsets with heat absorption pipe 2. The heat conduction post 41 is arranged at the end part of the heat conduction rod 22, when electronic elements mounted on a circuit board generate more heat, the heat absorption liquid, the heat absorption pipe 2, the heat conduction rod 22 and the heat conduction post 41 are matched to lead out and absorb the heat, and the problem that the temperature of the circuit board is too high can be greatly reduced.

Referring to fig. 3 and 4, the heat-conducting rod 22 is provided with a clamping member 3 in contact with the heat-absorbing pipe 2. The clamping piece 3 comprises a first clamping ring 31, a second clamping ring 32 and a heat conducting fin 33, the first clamping ring 31 is clamped on the heat absorbing pipe 2, the second clamping ring 32 is clamped on the heat conducting rod 22, and two ends of the heat conducting fin 33 are respectively connected with the first clamping ring 31 and the second clamping ring 32. The first snap ring 31, the second snap ring 32 and the heat conducting fins 33 cooperate to connect the heat conducting rod 22 and the heat absorbing pipe 2 together, and improve the heat conducting effect between the heat conducting rod 22 and the heat absorbing pipe 2.

Referring to fig. 2 and 3, the mounting mechanism includes a connecting rod 42 and a connecting bolt 43, the cross section of the connecting rod 42 is rectangular, rectangular mounting holes 4 are respectively formed in four corners of the first plate body 11 and the second plate body 13, the connecting rod 42 is arranged in the mounting holes 4, the connecting bolt 43 is in threaded connection with the connecting rod 42, and the circuit board is conveniently mounted through the connecting bolt 43.

Referring to fig. 2 and 3, the end of the heat-conducting pillar 41 is fixedly connected to the connecting rod 42, heat can be conducted to the connecting rod 42 through the heat-conducting pillar 41, and then conducted to the connecting bolt 43, and the heat can be conducted out of the circuit board through the connecting bolt 43, so that further heat dissipation and cooling of the circuit board are achieved.

The implementation principle of the PCB circuit board in the embodiment of the application is as follows: when the circuit board is used, the first board body 11 and the second board body 13 are connected together by the connecting sheet 54, the first mounting bolt 55 and the second mounting bolt 56, and then the circuit board is mounted by the connecting bolt 43. The above embodiments are preferred embodiments of the present application, and the protection scope of the present application is not limited by the above embodiments, so: all equivalent changes made according to the structure, shape and principle of the present application shall be covered by the protection scope of the present application.

Claims

1. A PCB circuit board, includes circuit board body (1), its characterized in that: the circuit board body (1) comprises a first board body (11) and a second board body (13), wherein the end portions of the first board body (11) and the second board body (13) are provided with connecting mechanisms (5) capable of connecting the first board body (11) and the second board body (13) together, one side, close to the second board body (13), of the first board body (11) is provided with a plurality of first mounting grooves (12), one side, close to the first board body (11), of the second board body (13) is provided with a plurality of second mounting grooves (14) communicated with the first mounting grooves (12), hollow heat absorbing pipes (2) are arranged in the first mounting grooves (12) and the second mounting grooves (14), and heat absorbing liquid is arranged in the heat absorbing pipes (2).

2. A PCB circuit board according to claim 1, wherein: the heat dissipation structure is characterized in that a first plate body (11) is provided with a heat dissipation groove perpendicular to the first mounting groove (12), the heat dissipation groove is communicated with the first mounting groove (12), a heat conduction rod (22) is arranged in the heat dissipation groove, and the heat conduction rod (22) is abutted to the heat absorption pipe (2).

3. A PCB circuit board according to claim 2, wherein: the heat conducting rod (22) is provided with a clamping piece (3) at the position where the heat absorbing pipe (2) is abutted, the clamping piece (3) comprises a first clamping ring (31) and a second clamping ring (32), the first clamping ring (31) is clamped on the heat absorbing pipe (2), and the second clamping ring (32) is clamped on the heat conducting rod (22).

4. A PCB circuit board according to claim 3, wherein: and a heat-conducting fin (33) is arranged between the first clamping ring (31) and the second clamping ring (32), one end of the heat-conducting fin (33) is fixedly connected with the first clamping ring (31), and the other end of the heat-conducting fin is fixedly connected with the second clamping ring (32).

5. A PCB circuit board according to claim 2, wherein: mounting holes (4) are respectively formed in four corners of the first plate body (11) and the second plate body (13), and connecting bolts (43) penetrate through the mounting holes (4).

6. The PCB circuit board of claim 5, wherein: the end part of the heat conducting rod (22) is connected with a heat conducting column (41), the heat conducting column (41) and the heat conducting rod (22) are vertically arranged, and the end part of the heat conducting column (41) is abutted to a connecting bolt (43).

7. The PCB circuit board of claim 6, wherein: the heat conduction column (41) is provided with a connecting rod (42) with a rectangular cross section at the contact position with the connecting bolt (43), the connecting rod (42) is arranged in the mounting hole (4), and the connecting bolt (43) is in threaded connection with the connecting rod (42).

8. A PCB circuit board according to claim 1, wherein: the connecting mechanism (5) comprises a plurality of connecting pieces (54), the connecting pieces (54) are arranged on the side faces of the first plate body (11) and the second plate body (13), a first mounting bolt (55) penetrates through the upper end of each connecting piece (54) and the first plate body (11), and a second mounting bolt (56) penetrates through the lower end of each connecting piece (54) and the second plate body (13).