CN217389110U

CN217389110U - 5G multilayer circuit board with mounting assembly

Info

Publication number: CN217389110U
Application number: CN202220251783.0U
Authority: CN
Inventors: 唐瑞芳; 周国云; 方蕾
Original assignee: Putian Hanjiang Yd Pcb Co ltd
Current assignee: Putian Hanjiang Yd Pcb Co ltd
Priority date: 2022-02-07
Filing date: 2022-02-07
Publication date: 2022-09-06
Anticipated expiration: 2032-02-07

Abstract

The utility model discloses a take 5G multilayer circuit board of installation component, including the multiply wood main part, the front surface of multiply wood main part has installed a plurality of electronic component, and the multiply wood built-up member has been installed to front surface one side of multiply wood main part, front surface one side fixed mounting of multiply wood main part has a fixed frame, the multiply wood built-up member is installed in the inboard of fixed frame, and the front surface of multiply wood built-up member has installed spacing subassembly; through setting up the installation component between this assembled circuit board, multiply wood main part carries on spacing fixedly with multiply wood built-up member through spacing subassembly, and it is protruding to be provided with the heat dissipation of integral type simultaneously on spacing subassembly, can improve the radiating efficiency through the heat dissipation arch, and in this circuit board installation use, the edge of circuit board is damaged by colliding with easily, has avoided the multiply wood main part to be collided with and damaged through having installed the guard edge in the edge of multiply wood main part to the practicality and the security of this circuit board have been improved.

Description

5G multilayer circuit board with mounting assembly

Technical Field

The utility model belongs to the technical field of the multilayer circuit board, concretely relates to take installation component's 5G multilayer circuit board.

Background

The double-sided board is a medium layer in the middle, and the two sides are wiring layers. The multilayer board is a multilayer wiring layer, and a dielectric layer is arranged between every two layers and can be made to be very thin. The multilayer circuit board has at least three conductive layers, two of which are on the outer surface and the remaining one is incorporated in an insulating board. The electrical connections between them are usually made through plated-through holes in the cross-section of the circuit board.

The 5G multilayer circuit board that can use in the 5G technique usually of current 5G multilayer circuit board, and the circuit board commonly used can set up the multiplate body structure through the equipment, when the multiplate body circuit board equipment of commonly using, the equipment is comparatively difficult between the circuit board, and simultaneously when the circuit board equipment back, the circuit board during operation can produce certain heat, and the heat is difficult to distribute, influences the problem of the practicality and the convenience of this circuit board, we propose a 5G multilayer circuit board of taking installation component for this reason.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a take 5G multilayer circuit board of installation component, with the current 5G multilayer circuit board who proposes in solving above-mentioned background art, can use 5G multilayer circuit board usually in 5G technique, and the circuit board commonly used can set up the multiplate body structure through the equipment, when the equipment of the multiplate body circuit board commonly used is used, it is comparatively difficult to assemble between the circuit board, and simultaneously when the circuit board equipment back, the circuit board during operation can produce certain heat, the heat is difficult to give off, the problem of the practicality and the convenience of this circuit board is being influenced.

In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a take 5G multilayer circuit board of installation component, includes the multiply wood main part, a plurality of electronic component have been installed to the front surface of multiply wood main part, just multiply wood built-up member has been installed to the front surface one side of multiply wood main part, fixed mounting has fixed frame on one side of the front surface of multiply wood main part, multiply wood built-up member is installed the inboard of fixed frame, just spacing component has been installed to the front surface of multiply wood built-up member, the surface of spacing component is provided with the heat dissipation arch of integral type, the fixed orifices has been seted up to the center department of spacing component, multiply wood built-up member is fixed through spacing component in the fixed frame.

Preferably, the edge corner of the multilayer board main body is connected and installed with a protection edge, the joint of the multilayer board main body and the protection edge is installed with a spring plate, and the multilayer board main body and the protection edge are connected and installed through the spring plate.

Preferably, the four protection edges are arranged at the corners of the multilayer board main body.

Preferably, the limiting component is attached to the surface of the multi-layer board assembly, and a plurality of heat dissipation protrusions are arranged on the surface of the limiting component in an array mode.

Preferably, the limiting component is of a cross-shaped structure.

Preferably, the edge of the fixed frame is provided with a limiting groove, and the limiting component is arranged in the limiting groove.

Compared with the prior art, the beneficial effects of the utility model are that:

(1) when a commonly used multi-board circuit board is assembled and used, the circuit board is difficult to assemble, and after the circuit board is assembled, a certain amount of heat is generated during the working of the circuit board, the heat is difficult to dissipate, the use of the circuit board is influenced;

(2) and in this circuit board installation use, the edge of circuit board is damaged by colliding with easily, has installed the guard edge through the edge at the multiply wood main part, receives when colliding with the striking when the multiply wood main part, can play certain cushioning effect, avoids the multiply wood main part to be collided with and damaged to the practicality and the security of this circuit board have been improved.

Drawings

Fig. 1 is a schematic structural view of the present invention;

fig. 2 is a schematic structural view of the limiting assembly of the present invention;

FIG. 3 is a schematic view of the structure of FIG. 1 at A according to the present invention;

in the figure: 1. a multi-layer board main body; 2. a protective edge; 3. a multi-layer board assembly; 4. a fixing frame; 5. a limiting component; 6. a spring plate; 7. a fixing hole; 8. and (4) radiating bulges.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts all belong to the protection scope of the present invention.

Referring to fig. 1, fig. 2 and fig. 3, the present invention provides a technical solution: A5G multilayer circuit board with a mounting component comprises a multilayer board main body 1, wherein a plurality of electronic elements are arranged on the front surface of the multilayer board main body 1, a multilayer board assembly part 3 is arranged on one side of the front surface of the multilayer board main body 1, a fixing frame 4 is fixedly arranged on one side of the front surface of the multilayer board main body 1, the multilayer board assembly part 3 is arranged on the inner side of the fixing frame 4, a limiting component 5 is arranged on the front surface of the multilayer board assembly part 3, an integrated heat dissipation bulge 8 is arranged on the surface of the limiting component 5, a fixing hole 7 is formed in the center of the limiting component 5, the multilayer board assembly part 3 is limited and fixed in the fixing frame 4 through the limiting component 5, the mounting component is arranged between the assembled circuit boards, the multilayer board main body 1 and the multilayer board assembly part 3 are limited and fixed through the limiting component 5, and the integrated heat dissipation bulge 8 is arranged on the limiting component 5, the heat dissipation efficiency can be improved through the heat dissipation protrusion 8, and the heat dissipation after the assembly is ensured.

For better assembly, in this embodiment, preferably, the protection edge 2 is connected and installed at a corner of an edge of the multi-layer board main body 1, the elastic sheet 6 is installed at a joint of the multi-layer board main body 1 and the protection edge 2, the multi-layer board main body 1 and the protection edge 2 are connected and installed through the elastic sheet 6 to protect the multi-layer board main body 1, and for better protection, in this embodiment, preferably, four protection edges 2 are installed at a corner of the multi-layer board main body 1 in total, so as to improve the protection effect, and for better heat dissipation, in this embodiment, preferably, the limiting component 5 is attached to the surface of the multi-layer board assembly 3, and meanwhile, the surface array of the limiting component 5 is provided with a plurality of heat dissipation protrusions 8, so as to facilitate heat conduction and improve the heat dissipation efficiency, and for more stable limiting installation, in this embodiment, preferably, the limiting component 5 is in a cross-shaped structure, so as to improve the installation stability of the multi-layer board assembly 3, for more stable setting of spacing subassembly 5, in this embodiment, preferred, the edge of fixed frame 4 has seted up spacing recess, and spacing subassembly 5 is installed in spacing recess, prevents the skew of spacing subassembly 5.

The utility model discloses a theory of operation and use flow: when a commonly used multi-board circuit board is assembled and used, the circuit board is difficult to assemble, and after the circuit board is assembled, a certain amount of heat is generated during the working of the circuit board, the heat is difficult to radiate, and the use of the circuit board is influenced, the assembling components are arranged between the assembled circuit boards, the multi-board main body 1 and the multi-board assembling components 3 are limited and fixed through the limiting components 5, the multi-board assembling components 3 are oppositely arranged in the surface of the multi-board main body 1 and fixedly arranged in the fixing frame 4 during the installation, the limiting components 5 are taken out and arranged in the limiting grooves formed in the surface of the fixing frame 4, bolts are screwed in the fixing holes 7 for fixing, the integral heat radiation bulges 8 are arranged on the limiting components 5, the heat radiation efficiency can be improved through the heat radiation bulges 8, the heat radiation efficiency after the assembly is ensured, and in the installation and the use of the circuit board, the edge of multiply wood main part 1 is damaged by colliding with easily, through the edge dress at multiply wood main part 1 establish the protection along 2, the protection is along 2 and is connected the installation through shell fragment 6, receives when colliding with the striking when multiply wood main part 1, and the protection is along 2 extrusion shell fragments 6, and shell fragment 6 warp and can play certain cushioning effect, avoids multiply wood main part 1 to be collided with the damage to the practicality and the security of this circuit board have been improved.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. A5G multilayer circuit board with a mounting component comprises a multilayer board main body (1), wherein a plurality of electronic elements are arranged on the front surface of the multilayer board main body (1), and a multilayer board assembly part (3) is arranged on one side of the front surface of the multilayer board main body (1), and is characterized in that: fixed frame (4) are installed to the front surface one side fixed mounting of multiply wood main part (1), multiply wood built-up member (3) are installed the inboard of fixed frame (4), just spacing subassembly (5) have been installed to the front surface of multiply wood built-up member (3), the surface of spacing subassembly (5) is provided with the heat dissipation arch (8) of integral type, fixed orifices (7) have been seted up in the center department of spacing subassembly (5), multiply wood built-up member (3) are fixed through spacing subassembly (5) in fixed frame (4).

2. A 5G multilayer circuit board with a mounting assembly according to claim 1, wherein: the edge corner of multiply wood main part (1) is connected and has been installed protection edge (2), shell fragment (6) have been installed along the junction of (2) in multiply wood main part (1) and protection, multiply wood main part (1) is connected the installation through shell fragment (6) along (2) with the protection.

3. A 5G multilayer circuit board with a mounting assembly according to claim 2, wherein: the four protection edges (2) are arranged at the corners of the multilayer board main body (1).

4. A 5G multilayer circuit board with a mounting assembly according to claim 1, wherein: the limiting component (5) is attached to the surface of the multilayer board assembly part (3), and meanwhile a plurality of heat dissipation protrusions (8) are arranged on the surface of the limiting component (5) in an array mode.

5. A 5G multilayer circuit board with a mounting assembly according to claim 1, wherein: the limiting component (5) is of a cross structure.

6. A 5G multilayer circuit board with a mounting assembly according to claim 1, wherein: the edge of the fixing frame (4) is provided with a limiting groove, and the limiting component (5) is arranged in the limiting groove.