CN214256734U - Multilayer printed flexible circuit board - Google Patents
Multilayer printed flexible circuit board Download PDFInfo
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- CN214256734U CN214256734U CN202120399214.6U CN202120399214U CN214256734U CN 214256734 U CN214256734 U CN 214256734U CN 202120399214 U CN202120399214 U CN 202120399214U CN 214256734 U CN214256734 U CN 214256734U
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- circuit board
- flexible circuit
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- film
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Abstract
The utility model discloses a multilayer printed flexible circuit board, including flexible circuit board, first flexible circuit board, second flexible circuit board and louvre, flexible circuit board comprises first flexible circuit board and second flexible circuit board, first flexible circuit board both ends all are equipped with epitaxial portion, first flexible circuit board right-hand member is equipped with the connecting hole, first flexible circuit board left end is equipped with the connector, first flexible circuit board top is equipped with the protection film, the protection film bonds fixedly with first flexible circuit board, the protection film comprises waterproof layer, corrosion resistant layer and fire-retardant layer, first flexible circuit board bottom is equipped with electromagnetic shield layer, antistatic backing, base plate film, base plate and fixed plate, all be equipped with the louvre on first flexible circuit board and the second flexible circuit board. The utility model discloses a flexible circuit board adopts the grafting to superpose into multilayer structure, and the heat dissipation space is left at the middle part, has both helped the heat dissipation, the line connection of also being convenient for.
Description
Technical Field
The utility model relates to a circuit board device technical field particularly, relates to a multilayer printed flexible circuit board.
Background
The multilayer flexible printed circuit board with the existing design is often bonded into a whole by multiple layers, a circuit is easy to break in a bending active area, the circuit function is lost, the application of the double-sided or multilayer flexible printed circuit board is limited, and meanwhile, the flexible printed circuit boards bonded together are poor in heat dissipation performance.
An effective solution to the problems in the related art has not been proposed yet.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a multilayer printed flexible circuit board to solve the problem that proposes among the above-mentioned background art.
In order to achieve the above object, the utility model provides a following technical scheme: a multilayer printed flexible circuit board comprises a flexible circuit board, a first flexible circuit board, a second flexible circuit board and heat dissipation holes, wherein the flexible circuit board is provided with multiple layers and comprises a first flexible circuit board and a second flexible circuit board, the two ends of the first flexible circuit board are respectively provided with an extension part, the extension parts can be bent, the right end of the first flexible circuit board is provided with a connecting hole, the connecting hole is welded and fixed with the extension part at the right end, the left end of the first flexible circuit board is provided with a connector, the connector is welded and fixed with the extension part at the left end, the connector can be fixedly inserted into the connecting hole, the top end of the first flexible circuit board is provided with a protective film, the protective film is used for protecting the flexible circuit board, the protective film is fixedly adhered with the first flexible circuit board, and the protective film comprises a waterproof layer, a corrosion-resistant layer and a flame-retardant layer, the waterproof layer is used for preventing water from entering the flexible circuit board, the corrosion-resistant layer has stronger corrosion resistance and blocks external substances from corroding the flexible circuit board, the flame-retardant layer has high temperature resistance and is used for preventing the flexible circuit board from burning circuit elements due to heat generated in the work, the bottom end of the first flexible circuit board is provided with an electromagnetic shielding layer, an anti-static layer, a substrate film, a copper foil substrate and a fixing plate, the electromagnetic shielding layer is used for shielding the interference of electromagnetism on the flexible circuit board, the anti-static layer is used for preventing the flexible circuit board from static electricity and influencing circuits, the substrate film is used for preventing the flexible circuit board from being deformed, softened and folded by heating, the copper foil substrate has strong heat dissipation effect and is used for absorbing the heat generated in the work of the flexible circuit board, the fixing plate is used for fixing and supporting the electromagnetic shielding layer, the anti-static layer, the substrate film and the copper foil substrate, and the first flexible circuit board and the second flexible circuit board are both provided with heat dissipation holes, the heat dissipation holes are used for quickly dissipating heat and penetrate through the first flexible circuit board, the second flexible circuit board, the protection film, the electromagnetic shielding layer, the anti-static layer, the substrate film, the copper foil substrate and the fixing plate.
Furthermore, first flexible circuit board and second flexible circuit board electric connection, first circuit board and second circuit board structure are the same completely, first flexible circuit board extension bending connector inserts in the second flexible circuit board connecting hole, second flexible circuit board extension bending connector inserts in the first flexible circuit board connecting hole.
Furthermore, the waterproof layer is located on the uppermost layer in the protective film, the flame-retardant layer is located on the lowermost layer in the protective film, the corrosion-resistant layer is located between the waterproof layer and the flame-retardant layer, and the waterproof layer, the corrosion-resistant layer and the flame-retardant layer are fixedly bonded.
Furthermore, the electromagnetic shielding layer is located on the outer surface of the bottom end of the first flexible circuit board, the electromagnetic shielding layer is fixedly bonded with the first flexible circuit board, the anti-static layer is located on the outer surface of the bottom end of the electromagnetic shielding layer, the anti-static layer is fixedly bonded with the electromagnetic shielding layer, the substrate film is located on the outer surface of the bottom end of the anti-static layer, the substrate film is fixedly bonded with the anti-static layer, the copper foil substrate is located on the outer surface of the bottom end of the substrate film, the copper foil substrate is fixedly bonded with the substrate film, the fixing plate is located on the outer surface of the bottom end of the copper foil substrate, and the fixing plate is fixedly bonded with the copper foil substrate.
Furthermore, the electromagnetic shielding layer is a beryllium copper elastic sheet.
Further, the fixing plate is an epoxy resin plate.
Compared with the prior art, the utility model discloses following beneficial effect has: the utility model discloses a flexible circuit board adopts the grafting to superpose into multilayer structure, and the heat dissipation space is left at the middle part, has both helped the heat dissipation, the line connection of also being convenient for, and flexible circuit board is equipped with a plurality of protective layers simultaneously, has strengthened its life greatly.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
Fig. 1 is a schematic structural diagram of a multilayer printed flexible circuit board according to an embodiment of the present invention.
Fig. 2 is a front view of a first flexible circuit board of a multi-layer printed flexible circuit board according to an embodiment of the present invention.
Fig. 3 is a cross-sectional view of a protective film of a multi-layer printed flexible circuit board according to an embodiment of the present invention.
Reference numerals
1. A flexible circuit board; 2. a first flexible circuit board; 3. a second flexible circuit board; 4. an extension portion; 5. connecting holes; 6. a connector; 7. a protective film; 8. an electromagnetic shielding layer; 9. an antistatic layer; 10. a substrate film; 11. a copper foil substrate; 12. a fixing plate; 13. a waterproof layer; 14. a corrosion-resistant layer; 15. a flame retardant layer; 16. and (4) heat dissipation holes.
Detailed Description
The following, with reference to the drawings and the detailed description, further description of the present invention is made:
in the description of the present invention, it should be noted that the terms "top", "bottom", "one side", "the other side", "front", "back", "middle part", "inside", "top", "bottom", etc. indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, which is only for the convenience of description and simplification of the description, but does not indicate or imply that the device or element referred to must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention; the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance; furthermore, unless expressly stated or limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, as they may be fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.
Referring to fig. 1-3, a multilayer printed flexible circuit board according to an embodiment of the present invention includes a flexible circuit board 1, a first flexible circuit board 2, a second flexible circuit board 3 and heat dissipation holes 16, wherein the flexible circuit board 1 is provided with a plurality of layers, the flexible circuit board 1 is composed of the first flexible circuit board 2 and the second flexible circuit board 3, two ends of the first flexible circuit board 2 are respectively provided with an extension portion 4, the extension portions 4 can be bent, the right end of the first flexible circuit board 2 is provided with a connection hole 5, the connection hole 5 is welded to the right end extension portion 4, the left end of the first flexible circuit board 2 is provided with a connector 6, the connector 6 is welded to the left end extension portion 4, the connector 6 can be fixed to the connection hole 5 by plugging, the top end of the first flexible circuit board 2 is provided with a protection film 7, the protection film 7 is used for protecting the flexible circuit board 1, the protective film 7 is fixedly bonded with the first flexible circuit board 2, the protective film 7 is composed of a waterproof layer 13, an anti-corrosion layer 14 and a flame-retardant layer 15, the waterproof layer 13 is used for preventing water from entering the flexible circuit board 1, the anti-corrosion layer 14 has strong corrosion resistance and prevents external substances from corroding the flexible circuit board 1, the flame-retardant layer 15 has high temperature resistance and is used for preventing the flexible circuit board 1 from burning circuit elements due to heat generated during working, an electromagnetic shielding layer 8, an anti-static layer 9, a substrate film 10, a copper foil substrate 11 and a fixing plate 12 are arranged at the bottom end of the first flexible circuit board 2, the electromagnetic shielding layer 8 is used for shielding the interference of electromagnetism on the flexible circuit board 1, the anti-static layer 9 is used for preventing the flexible circuit board 1 from static electricity and influencing circuits, the substrate film 10 is used for preventing the flexible circuit board 1 from being heated to deform, soften and wrinkle, and the heat dissipation effect of the copper foil substrate 11 is strong, the heat dissipation device is used for absorbing heat generated by the work of the flexible circuit board 1, the fixing plate 12 is used for fixing and supporting the electromagnetic shielding layer 8, the anti-static layer 9, the substrate film 10 and the copper foil substrate 11, the heat dissipation holes 16 are formed in the first flexible circuit board 2 and the second flexible circuit board 3 and used for dissipating heat quickly, and the heat dissipation holes 16 penetrate through the first flexible circuit board 2, the second flexible circuit board 3, the protection film 7, the electromagnetic shielding layer 8, the anti-static layer 9, the substrate film 10, the copper foil substrate 11 and the fixing plate 12.
Through the above technical scheme of the utility model, first flexible circuit board 2 and 3 electric connection of second flexible circuit board, first circuit board and second circuit board structure are identical, 2 outer departments of first flexible circuit board are bent 4 and are buckled connector 6 and insert in 3 connecting holes 5 of second flexible circuit board, 3 outer departments of second flexible circuit board are bent 4 and are buckled connector 6 and insert in 2 connecting holes 5 of first flexible circuit board.
Through the above technical scheme of the utility model, waterproof layer 13 is located the inside superiors of protection film 7, fire-retardant layer 15 is located the inside lowest floor of protection film 7, corrosion-resistant layer 14 is located between waterproof layer 13 and the fire-retardant layer 15, waterproof layer 13, corrosion-resistant layer 14 and fire-retardant layer 15 all bond fixedly.
Through the above technical scheme of the utility model, electromagnetic shield layer 8 is located 2 bottom surfaces of first flexible circuit board, electromagnetic shield layer 8 bonds fixedly with first flexible circuit board 2, antistatic backing 9 is located 8 bottom surfaces of electromagnetic shield layer, antistatic backing 9 bonds fixedly with electromagnetic shield layer 8, base plate film 10 is located 9 bottom surfaces of antistatic backing, base plate film 10 bonds fixedly with antistatic backing 9, copper foil base plate 11 is located 10 bottom surfaces of base plate film, copper foil base plate 11 bonds fixedly with base plate film 10, fixed plate 12 is located 11 bottom surfaces of copper foil base plate, fixed plate 12 bonds fixedly with copper foil base plate 11.
Through the above technical scheme of the utility model, electromagnetic shield layer 8 sets up to beryllium copper shell fragment.
Through the above technical scheme of the utility model, fixed plate 12 sets up to the epoxy board.
In specific application, the outer extension part 4 of the first flexible circuit board 2 is bent, the connector 6 of the first flexible circuit board 2 is inserted into the connecting hole 5 of the second flexible circuit board 3, the outer extension part 4 of the second flexible circuit board 3 is bent, and the connector 6 of the second flexible circuit board 3 is inserted into the connecting hole 5 of the first flexible circuit board 2; wherein waterproof layer 13 is used for preventing water from getting into flexible circuit board 1 in the protection film 7, corrosion-resistant layer 14 has stronger corrosion resistance, block that foreign matter corrodes flexible circuit board 1, fire-retardant layer 15 has high temperature resistance, be used for preventing that flexible circuit board 1 work from producing heat and leading to burning out circuit element, electromagnetic shield layer 8 is used for shielding electromagnetism to flexible circuit board 1's interference, antistatic backing 9 is used for preventing flexible circuit board 1 static, influence the circuit, base plate film 10 is used for preventing flexible circuit board 1 thermal deformation, it is soft, the fold, copper foil substrate 11's radiating effect is strong, be used for absorbing the heat that flexible circuit board 1 work produced, fixed plate 12 is used for fixing and supporting electromagnetic shield layer 8, antistatic backing 9, base plate film 10 and copper foil substrate 11, 16 louvres are used for quick heat dissipation.
Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments described in the foregoing embodiments, or equivalents may be substituted for elements thereof. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (6)
1. A multi-layer printed flexible circuit board is characterized by comprising a flexible circuit board (1), a first flexible circuit board (2), a second flexible circuit board (3) and heat dissipation holes (16), wherein the flexible circuit board (1) is provided with multiple layers, the flexible circuit board (1) is composed of the first flexible circuit board (2) and the second flexible circuit board (3), two ends of the first flexible circuit board (2) are respectively provided with an extension part (4), the right end of the first flexible circuit board (2) is provided with a connecting hole (5), the connecting hole (5) is fixedly welded with the extension part (4) at the right end, the left end of the first flexible circuit board (2) is provided with a connector (6), the connector (6) is fixedly welded with the extension part (4) at the left end, the top end of the first flexible circuit board (2) is provided with a protective film (7), and the protective film (7) is fixedly bonded with the first flexible circuit board (2), protection film (7) comprise waterproof layer (13), corrosion resistant layer (14) and fire-retardant layer (15), first flexible circuit board (2) bottom is equipped with electromagnetic shield layer (8), antistatic backing (9), base plate film (10), copper foil base plate (11) and fixed plate (12), all be equipped with louvre (16) on first flexible circuit board (2) and second flexible circuit board (3), louvre (16) run through first flexible circuit board (2), second flexible circuit board (3), protection film (7), electromagnetic shield layer (8), antistatic backing (9), base plate film (10), copper foil base plate (11) and fixed plate (12).
2. A multilayer printed flexible circuit board according to claim 1, characterized in that the first flexible circuit board (2) is electrically connected to the second flexible circuit board (3).
3. The multilayer printed flexible circuit board according to claim 1, wherein the waterproof layer (13) is located at the uppermost layer inside the protective film (7), the flame retardant layer (15) is located at the lowermost layer inside the protective film (7), the corrosion-resistant layer (14) is located between the waterproof layer (13) and the flame retardant layer (15), and the waterproof layer (13), the corrosion-resistant layer (14) and the flame retardant layer (15) are all adhesively fixed.
4. A multilayer printed flexible circuit board according to claim 1, wherein the electromagnetic shield layer (8) is provided on the outer surface of the bottom end of the first flexible circuit board (2), the electromagnetic shielding layer (8) is fixedly adhered with the first flexible circuit board (2), the antistatic layer (9) is positioned on the outer surface of the bottom end of the electromagnetic shielding layer (8), the antistatic layer (9) is fixedly bonded with the electromagnetic shielding layer (8), the substrate film (10) is positioned on the outer surface of the bottom end of the antistatic layer (9), the base plate film (10) is fixedly bonded with the antistatic layer (9), the copper foil base plate (11) is positioned on the outer surface of the bottom end of the base plate film (10), the copper foil substrate (11) is fixedly bonded with the substrate film (10), the fixing plate (12) is located on the outer surface of the bottom end of the copper foil substrate (11), and the fixing plate (12) is fixedly bonded with the copper foil substrate (11).
5. A multilayer printed flexible circuit board according to claim 1, characterized in that the electromagnetic shielding layer (8) is provided as beryllium copper spring.
6. A multilayer printed flexible circuit board according to claim 1, characterized in that the fixing plate (12) is provided as an epoxy plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120399214.6U CN214256734U (en) | 2021-02-23 | 2021-02-23 | Multilayer printed flexible circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120399214.6U CN214256734U (en) | 2021-02-23 | 2021-02-23 | Multilayer printed flexible circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214256734U true CN214256734U (en) | 2021-09-21 |
Family
ID=77727077
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202120399214.6U Active CN214256734U (en) | 2021-02-23 | 2021-02-23 | Multilayer printed flexible circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN214256734U (en) |
-
2021
- 2021-02-23 CN CN202120399214.6U patent/CN214256734U/en active Active
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