CN220325901U

CN220325901U - Flexible circuit board with buffer structure

Info

Publication number: CN220325901U
Application number: CN202321806193.0U
Authority: CN
Inventors: 彭雄祥; 乔鹏程; 赵宏静
Original assignee: Tongyuan Technology Huizhou Co ltd; Guangdong Tongyuan Precision Circuit Co ltd
Current assignee: Tongyuan Technology Huizhou Co ltd; Guangdong Tongyuan Precision Circuit Co ltd
Priority date: 2023-07-11
Filing date: 2023-07-11
Publication date: 2024-01-09
Anticipated expiration: 2033-07-11

Abstract

The utility model relates to a flexible circuit board with a buffer structure, comprising: the flexible substrate is provided with a plurality of buffer grooves on two sides along the first direction, and each buffer groove is of a hollowed-out structure along the thickness direction of the flexible substrate; the connector is arranged on the upper surface of the flexible substrate and is electrically connected with the circuit layer on the flexible substrate; nickel flakes; the bonding pad is arranged on one side of the circuit layer facing the connector, the nickel sheet is connected to the bonding pad, and the buffer groove surrounds the periphery of the bonding pad; at least one connecting piece, the connecting piece sets up in the dashpot. The scheme provided by the utility model can meet the buffer performance after assembly; because the connecting piece is arranged in each buffer groove, the connecting piece can connect the buffer grooves with the flexible substrate together, so that the buffer grooves are not disconnected with the flexible substrate, the problem of turnover in the production process is avoided, the organization of the whole product is facilitated, and the operation efficiency is improved.

Description

Flexible circuit board with buffer structure

Technical Field

The utility model relates to the technical field of printed circuit board manufacturing, in particular to a flexible circuit board with a buffer structure.

Background

The circuit boards are classified according to characteristics and can be classified into Flexible Printed Circuits (FPCs), rigid Printed Circuits (PCBs), and flexible-rigid printed circuit boards (FPCBs); the flexible board is also called flexible circuit board or flexible circuit board, which has the characteristics of high flexibility, free bending, torsion, folding, three-dimensional wiring, small volume, light weight, arbitrary arrangement according to the space layout requirement, shape change and the like, thus providing great convenience for circuit design, greatly reducing the assembly workload, easily ensuring the performance of the circuit, and being widely applied to the electric power and sensing system of new energy automobiles.

The existing structure of the new energy FPC board can absorb the expansion of the battery core and buffer the battery core after being assembled, so that the FPC is designed into a hollow structure along the appearance of the long side direction.

However, the design of hollow out construction extremely easily takes place to turn over the fold scattered and fold (scrapping) of product in the production process, and production efficiency is low, and leads to product disorder and scattered board easily in the in-process of installation, causes serious influence to the assembly of follow-up components and parts.

Disclosure of Invention

Based on this, it is necessary to provide a flexible circuit board with a buffer structure to solve the problem that the hollowed-out structure on the existing FPC board is very easy to be folded and scattered and the wrinkles of the product occur in the production process.

The utility model provides a flexible circuit board with a buffer structure, comprising:

the flexible substrate is provided with a plurality of buffer grooves on two sides along a first direction, and each buffer groove is of a hollowed-out structure along the thickness direction of the flexible substrate;

a connector disposed on an upper surface of the flexible substrate, the connector being electrically connected to a circuit layer on the flexible substrate;

nickel flakes;

the bonding pad is arranged on one side of the circuit layer, facing the connector, the nickel sheet is connected to the bonding pad, and the buffer groove surrounds the periphery of the bonding pad;

and the connecting piece is arranged in the buffer groove and is used for connecting the buffer groove and the flexible substrate together.

In one embodiment, the width of the connecting piece is 0.6-1.0mm, and a plurality of connecting pieces are arranged in the buffer groove and are uniformly distributed.

In one embodiment, the connecting piece is located in the buffer groove, and the periphery of the connecting piece is clung to the inner wall of the buffer groove.

In one embodiment, the buffer tank has an L-shaped structure.

In one embodiment, the plurality of buffer grooves on one side in the first direction are in a symmetrical structure along a preset central line.

In one embodiment, the flexible substrate includes a board body, a glue layer, and a protective film, wherein the circuit layer is adhered to the front surface of the board body through the glue layer, and the protective film is disposed on a side of the circuit layer facing the connector.

In one embodiment, the protective film has a thickness of 25-60 μm.

In one embodiment, the flexible substrate further includes a support member disposed on a side of the board body facing away from the circuit layer, and the support member and the connector are located at a same end of the board body.

In one embodiment, the support includes a plurality of reinforcing sheets, and a plurality of the reinforcing sheets are detachably connected together.

In one embodiment, the support further comprises a stiffener disposed on the stiffener.

The beneficial effects of the utility model include:

according to the flexible circuit board with the buffer structure, the hollow buffer groove is formed in the thickness direction of the flexible substrate, so that the buffer performance after assembly can be met; because the connecting piece is arranged in each buffer groove, the connecting piece can connect the buffer grooves with the flexible substrate together, so that the buffer grooves are not disconnected with the flexible substrate, the problem of turnover in the production process is avoided, the organization of the whole product is facilitated, and the operation efficiency is improved.

Drawings

Fig. 1 is a schematic diagram of a flexible circuit board with a buffer structure according to an embodiment of the utility model;

FIG. 2 is another schematic view of FIG. 1;

FIG. 3 is a partial schematic view of FIG. 2;

fig. 4 is a further schematic illustration of fig. 1.

Wherein, 10, flexible base plate; 101. a plate body; 102. a glue layer; 103. a circuit layer; 104. a protective film; 105. a reinforcing sheet; 106. a buffer tank; 20. a connector; 30. nickel flakes; 40. a connecting piece; 50. UV glue.

Detailed Description

In order that the above objects, features and advantages of the utility model will be readily understood, a more particular description of the utility model will be rendered by reference to the appended drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present utility model. The present utility model may be embodied in many other forms than described herein and similarly modified by those skilled in the art without departing from the spirit of the utility model, whereby the utility model is not limited to the specific embodiments disclosed below.

In the description of the present utility model, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings are merely for convenience in describing the present utility model and simplifying the description, and do not indicate or imply that the device or element being referred to must have a specific orientation, be configured and operated in a specific orientation, and therefore should not be construed as limiting the present utility model.

Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In the description of the present utility model, the meaning of "plurality" means at least two, for example, two, three, etc., unless specifically defined otherwise.

In the present utility model, unless explicitly specified and limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; either directly or indirectly, through intermediaries, or both, may be in communication with each other or in interaction with each other, unless expressly defined otherwise. The specific meaning of the above terms in the present utility model can be understood by those of ordinary skill in the art according to the specific circumstances.

In the present utility model, unless expressly stated or limited otherwise, a first feature "up" or "down" a second feature may be the first and second features in direct contact, or the first and second features in indirect contact via an intervening medium. Moreover, a first feature being "above," "over" and "on" a second feature may be a first feature being directly above or obliquely above the second feature, or simply indicating that the first feature is level higher than the second feature. The first feature being "under", "below" and "beneath" the second feature may be the first feature being directly under or obliquely below the second feature, or simply indicating that the first feature is less level than the second feature.

It will be understood that when an element is referred to as being "fixed" or "disposed" on another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and the like are used herein for illustrative purposes only and are not meant to be the only embodiment.

As shown in fig. 1 to 4, the present utility model provides a flexible circuit board having a buffer structure, comprising: the flexible substrate 10, the connector 20, the nickel sheet 30, the bonding pad and at least one connecting piece 40, wherein a plurality of buffer grooves 106 are formed on two sides of the flexible substrate 10 along the first direction, each buffer groove 106 is of a hollowed-out structure along the thickness direction of the flexible substrate 10, meanwhile, the buffer grooves 106 are of an L-shaped structure, the connector 20 is arranged on the upper surface of the flexible substrate 10 through UV (ultraviolet) glue 50, and the connector 20 is electrically connected with a circuit layer 103 on the flexible substrate 10; the bonding pad is arranged on one side of the circuit layer 103 facing the connector 20, the nickel sheet 30 is welded on the bonding pad, and the buffer groove 106 surrounds the periphery of the bonding pad; the connecting member 40 is disposed in the buffer tank 106 for connecting the buffer tank 106 with the flexible substrate 10.

The first direction is illustratively the left-right direction as viewed in fig. 2, and the thickness direction is the up-down direction as viewed in fig. 1. The connector 20 comprises an insulating shell, conductive terminals and a pressing piece, a connector with proper PIN number is selected according to different loops, the connector is used for quickly assembling two materials and achieving the function of connection conduction, the connector is arranged at the position shown in fig. 1, the connector 20 is adhered to the flexible substrate 10 through the UV adhesive 50, and therefore the flexible circuit board can communicate with other circuit boards or devices and transmit signals, power and data. Because the copper layer of the flexible circuit board is thinner, the flexible circuit board cannot be directly welded on the battery by laser, ultrasonic wave or other methods, and the nickel sheet 30 is used for connecting the two. In use, one end of the nickel plate 30 is welded to the battery and the other end is connected to the bonding pad.

According to the flexible circuit board, the hollow buffer groove is formed in the thickness direction of the flexible substrate, so that the buffer performance after assembly can be met; because the connecting piece is arranged in each buffer groove, the connecting piece can connect the buffer grooves with the flexible substrate together, so that the buffer grooves are not disconnected with the flexible substrate, the problem of turnover in the production process is avoided, the organization of the whole product is facilitated, and the operation efficiency is improved.

In some embodiments, in order to ensure the cushioning performance of the cushioning slot, the overall size of the connecting piece 40 is prevented from being oversized, the width of the connecting piece 40 in the application is 0.6-1.0mm, and a plurality of connecting pieces 40 are arranged in the cushioning slot 106, and the plurality of connecting pieces 40 are uniformly distributed.

Further, the connecting member 40 in the present application is located in the buffer slot 106, and the periphery of the connecting member 40 is closely attached to the inner wall of the buffer slot 106.

In some embodiments, the plurality of buffer grooves 106 on one side of the first direction are symmetrically configured along the predetermined center line. Since the buffer grooves 106 are symmetrically configured along the preset center line, the buffer grooves 106 on the flexible substrate 10 are uniformly distributed, so that the buffer degree of each buffer groove 106 is substantially the same when the flexible substrate 10 receives the buffer.

In some embodiments, in order to avoid contamination of the front surface of the circuit layer 103, the flexible substrate 10 in the present application includes a board body 101, a glue layer 102, and a protective film 104, where the circuit layer 103 is adhered to the front surface of the board body 101 by the glue layer 102, and the protective film 104 is disposed on a side of the circuit layer 103 facing the connector 20. The arrangement of the protective film 104 can effectively prevent the front surface of the circuit layer 103 from being polluted by impurities such as dust.

The overall thickness of the flexible substrate 10 is: 105-140 μm and 200-2000mm, wherein the plate body 101 is made of flexible material PI, and the thickness of the plate body 101 is 25+ -5 μm. The protective film 104 includes a polyimide film, which is adhered to the side of the circuit layer 103 facing away from the adhesive layer 102 by a resin adhesive. The film has outstanding high temperature resistance, radiation resistance, chemical corrosion resistance and electrical insulation property, can be used in the air at the temperature of 250-280 ℃ for a long time, and can effectively protect the surface of the circuit layer 103. The thickness of the glue layer 102 is 20-30 μm. The thickness of the circuit layer 103 is 35-70 μm, so that the thickness of the entire flexible circuit board can be ensured.

In some embodiments, in order to enhance the mechanical strength of the flexible circuit board, the surface of the flexible circuit board is provided with parts, and the support connector is used, as shown in fig. 1, the flexible substrate 10 of the present utility model further comprises a support member, wherein the support member is disposed on a side of the board body 101 away from the circuit layer 103, and the support member and the connector 20 are located at the same end of the board body 101.

Further, the support includes a plurality of reinforcing pieces 105, and the plurality of reinforcing pieces 105 are detachably connected together. Since the plurality of reinforcing pieces 105 are detachably connected together, the number of reinforcing pieces 105 can be easily added according to different strength requirements.

In some embodiments, to further increase the strength of the reinforcement panel, the support in the present application further includes a stiffener disposed on the reinforcement panel 105. The provision of the reinforcing ribs effectively improves the overall strength of the reinforcing sheet 105.

The utility model relates to a manufacturing process of a flexible circuit board with a buffer structure, which sequentially comprises the following steps: preparing coil stock, attaching a dry film, exposing, developing, etching, removing the dry film, optically detecting (AOI), chemically cleaning, cutting the sheet stock, attaching a covering film, baking, checking QC, forming, testing functions, checking out goods (FQC), finally checking (FQA), SMT, dispensing, testing, FQC-FQA, packaging and shipping; wherein, the flexible substrate is made of polyimide material, and is composed of a polyimide film and a copper foil, and the overall thickness is as follows: 105-140 μm, 200-2000mm in length, 35-70 μm in thickness of copper foil; wherein the bump generating step is molding.

The technical features of the above-described embodiments may be arbitrarily combined, and all possible combinations of the technical features in the above-described embodiments are not described for brevity of description, however, as long as there is no contradiction between the combinations of the technical features, they should be considered as the scope of the description.

The above examples illustrate only a few embodiments of the utility model, which are described in detail and are not to be construed as limiting the scope of the utility model. It should be noted that it will be apparent to those skilled in the art that several variations and modifications can be made without departing from the spirit of the utility model, which are all within the scope of the utility model. Accordingly, the scope of protection of the present utility model is to be determined by the appended claims.

Claims

1. A flexible circuit board having a buffer structure, comprising:

a flexible substrate (10), wherein a plurality of buffer grooves (106) are formed in two sides of the flexible substrate (10) along a first direction, and each buffer groove (106) is of a hollowed-out structure along the thickness direction of the flexible substrate (10);

a connector (20), the connector (20) being provided on an upper surface of the flexible substrate (10), and the connector (20) being electrically connected to a circuit layer (103) on the flexible substrate (10);

nickel flakes (30);

a pad provided on a side of the circuit layer (103) facing the connector (20), the nickel plate (30) being connected to the pad, the buffer groove (106) surrounding the periphery of the pad;

at least one connecting member (40), the connecting member (40) is arranged in the buffer groove (106) and is used for connecting the buffer groove (106) and the flexible substrate (10) together.

2. The flexible circuit board with the buffer structure according to claim 1, wherein the width of the connecting piece (40) is 0.6-1.0mm, a plurality of connecting pieces (40) are arranged in the buffer groove (106), and the plurality of connecting pieces (40) are uniformly distributed.

3. The flexible circuit board with the buffer structure according to claim 1, wherein the connecting member (40) is located in the buffer groove (106), and the periphery of the connecting member (40) is in close contact with the inner wall of the buffer groove (106).

4. The flexible circuit board with the buffer structure according to claim 1, wherein the buffer groove (106) has an L-shaped structure.

5. The flexible circuit board with a buffer structure according to any one of claims 1 to 4, wherein the plurality of buffer grooves (106) at one side of the first direction are symmetrically structured along a predetermined center line.

6. The flexible circuit board with the buffer structure according to claim 1, characterized in that the flexible substrate (10) includes a board body (101), a glue layer (102), and a protective film (104), the circuit layer (103) is adhered to the front surface of the board body (101) through the glue layer (102), and the protective film (104) is disposed on a side of the circuit layer (103) facing the connector (20).

7. The flexible circuit board with the buffer structure according to claim 6, wherein the thickness of the protective film (104) is 25-60 μm.

8. The flexible circuit board with the buffer structure according to claim 6, characterized in that the flexible substrate (10) further comprises a support member, which is arranged on a side of the board body (101) facing away from the circuit layer (103), and which is located at the same end of the board body (101) as the connector (20).

9. The flexible circuit board with a cushioning structure according to claim 8, wherein the support member includes a plurality of reinforcing sheets (105), and a plurality of the reinforcing sheets (105) are detachably connected together.

10. The flexible circuit board with the buffer structure according to claim 9, characterized in that the support further comprises a stiffener, which is provided on the stiffener sheet (105).