CN217656659U

CN217656659U - Circuit board module, camera and electronic equipment

Info

Publication number: CN217656659U
Application number: CN202220721291.3U
Authority: CN
Inventors: 王昕�; 程萍; 张歆雨
Original assignee: Beijing CHJ Automobile Technology Co Ltd
Current assignee: Beijing CHJ Automobile Technology Co Ltd
Priority date: 2022-03-29
Filing date: 2022-03-29
Publication date: 2022-10-25
Anticipated expiration: 2032-03-29

Abstract

The utility model relates to an optical imaging equipment technical field especially relates to a circuit board module, camera and electronic equipment. The circuit board module provided by the present disclosure includes a circuit board; the circuit board comprises a first board body and a second board body which are arranged at intervals along the height direction and correspondingly; the first plate body and the second plate body are respectively provided with a respective flexible board layer, and the first plate body and the second plate body are connected in the height direction through the respective flexible board layers. The first board body and the second board body are flexibly connected through the flexible board layer, and part of the flexible board layer serves as a flexible connecting part, so that the BTB connector is omitted. This public camera and electronic equipment that provides in addition all include this circuit board module, and the three all has the beneficial effect that part structure is simple, whole high dimension is little.

Description

Circuit board module, camera and electronic equipment

Technical Field

The present disclosure relates to the technical field of optical imaging devices, and in particular, to a circuit board module, a camera and an electronic device.

Background

The camera, as a common optical imaging device, plays an indispensable role in the fields of mobile phones, computers, unmanned aerial vehicles, smart homes, security, automobiles and the like. A conventional camera generally includes a lens, a lens holder, a photo sensor chip, and a circuit Board, where the photo sensor chip is mounted on the circuit Board in a COB (chip on Board) package and then mounted inside the lens holder.

Generally, circuit Board groups arranged at intervals in the height direction of the traditional camera are mostly connected by BTB Connectors (Board-to-Board Connectors), and although the BTB Connectors have excellent electrical connection stability, the BTB Connectors are arranged to increase the number of internal parts in the camera, and the height size of the camera is also increased seriously.

Therefore, the camera in the prior art has the problems of complex internal structure and large overall height and size.

SUMMERY OF THE UTILITY MODEL

In order to solve the above technical problem or at least partially solve the above technical problem, the present disclosure provides a circuit board module, which includes a circuit board;

the circuit board comprises a first board body and a second board body which are arranged at intervals along the height direction and are arranged correspondingly;

the first plate body and the second plate body are respectively provided with a respective flexible board layer, and the first plate body and the second plate body are connected in the height direction through the respective flexible board layers.

In one possible design, one side of the flexible sheet layer in the first panel has a flexible connection extending towards the second panel;

one side of the flexible plate layer in the second plate body is provided with a flexible connecting part extending towards the first plate body;

the flexible connecting portion in the first plate body is correspondingly connected with the flexible connecting portion in the second plate body.

In one possible design, the flexible connecting portion in the first board body is integrally connected with the flexible connecting portion in the second board body to form a C-shaped connecting portion.

In one possible design, the first plate body is provided with a hard plate layer on the upper plate surface and/or the lower plate surface of the flexible plate layer.

In one possible design, the first plate body is further provided with a reinforcing plate layer on the side of the hard plate layer facing the second plate body.

In one possible design, the reinforcing plate layer is a metal plate layer and is adhesively fixed with the hard plate layer.

In a possible design, a hollow part for mounting a photosensitive chip is correspondingly formed in the flexible board layer and the hard board layer of the first board body;

the sensitization chip can with reinforcement sheet layer butt, just the sensitization chip pass through the conducting wire with the flexonics sheet layer is connected.

In one possible embodiment, the second plate body is provided with a hard plate layer on the upper and/or lower surface of the flexible plate layer.

In addition, the present disclosure also provides a camera, which includes the above circuit board module and the housing;

the inside of casing has the appearance chamber, just circuit board module set up in the appearance chamber.

In addition, the present disclosure also provides an electronic device, which includes a device body and the camera.

Compared with the prior art, the technical scheme provided by the embodiment of the disclosure has the following advantages:

the circuit board module provided by the embodiment of the disclosure comprises a circuit board; the circuit board comprises a first board body and a second board body which are arranged at intervals along the height direction and are arranged correspondingly; the first plate body and the second plate body are respectively provided with a respective flexible board layer, and the first plate body and the second plate body are connected in the height direction through the respective flexible board layers.

Because the circuit board module flexibly connects the first board body and the second board body through the flexible board layer, and the part of the flexible board layer playing a connecting role is used as a flexible connecting part, a BTB connector is omitted, the structural component of the circuit board module is simplified, and the overall height size is reduced.

In addition, this disclosed embodiment still provides a camera and electronic equipment, all includes foretell circuit board module, can realize all its beneficial effects, and no longer give unnecessary details here.

Drawings

The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present disclosure and together with the description, serve to explain the principles of the disclosure.

In order to more clearly illustrate the embodiments or technical solutions in the prior art of the present disclosure, the drawings used in the description of the embodiments or prior art will be briefly described below, and it is obvious for those skilled in the art that other drawings can be obtained according to the drawings without inventive exercise.

Fig. 1 is a schematic structural diagram of a circuit board module according to an embodiment of the disclosure;

fig. 2 is a vertical cross-sectional view of a camera provided by an embodiment of the present disclosure.

Reference numerals: 1. a circuit board; 11. a first plate body; 12. a second plate body; 13. a flexible sheet layer; 131. a C-shaped connecting portion; 14. a hard plate layer; 15. a reinforcing ply; 2. a housing; 21. an output port; 3. a photosensitive chip; 31. and a conductive line.

Detailed Description

In order that the above objects, features and advantages of the present disclosure may be more clearly understood, aspects of the present disclosure will be further described below. It should be noted that the embodiments and features of the embodiments of the present disclosure may be combined with each other without conflict.

In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present disclosure, but the present disclosure may be practiced otherwise than as described herein; it is to be understood that the embodiments disclosed in the specification are only a few embodiments of the present disclosure, and not all embodiments.

Referring to fig. 1, a circuit board module according to an embodiment of the present disclosure includes a circuit board 1: the circuit board 1 comprises a first board body 11 and a second board body 12 which are arranged at intervals along the height direction and are arranged correspondingly; the first plate 11 and the second plate 12 each have a respective flexible sheet layer 13, and are connected in the height direction by the respective flexible sheet layers 13.

The above-mentioned flexible board layer 13 may be, but not limited to, polyimide or polyester film, which can ensure that the flexible board layer 13 has better flexibility and excellent bending property; in addition, the first board 11 and the second board 12 made of the flexible board layer 13 as the substrate have the characteristics of light weight, thin thickness and good bending property after printed circuit.

The first board body 11 and the second board body 12 in the circuit board module are connected in the height direction through the respective flexible board layers 13, so that the function of electrically connecting the first board body 11 and the second board body 12 can be realized by directly printing and manufacturing corresponding connecting circuits in the flexible board layers 13, the first board body 11 and the second board body 12 are flexibly connected through the flexible board layers 13, the part of the flexible board layers 13 which play a connecting role is taken as a flexible connecting part, the BTB connector is omitted, the structural components of the circuit board module are simplified, and the overall height size is reduced.

To sum up, the circuit board module that this disclosed embodiment provided has the beneficial effect that part structure is simple, whole height dimension is little.

It should be noted that, when the circuit board 1 further includes a third board body, a fourth board body and more board bodies, other two adjacent board bodies may also be electrically connected through their respective flexible board layers 13.

In some specific embodiments, one side of the flexible sheet layer 13 in the first board body 11 has a flexible connection portion extending toward the second board body 12; one side of the flexible sheet layer 13 in the second plate body 12 has a flexible connection portion extending toward the first plate body 11; the flexible connecting portion in the first board body 11 is correspondingly connected with the flexible connecting portion in the second board body 12.

Specifically, as shown in fig. 1, in this figure, the flexible board layer 13 in the first board body 11 is bent and extended toward the second board body 12 at the rightmost side of the first board body 11 to form a flexible connection portion, and the flexible board layer 13 in the second board body 12 is bent and extended toward the first board body 11 at the rightmost side of the second board body 12 to form a flexible connection portion, but the flexible connection portions may not be limited to be set to have completely identical sizes and shapes, so that the flexible connection portions of the two board bodies can be completely and correspondingly connected in the height direction, and the first board body 11 and the second board body 12 have a better flexible connection effect.

In addition, the flexible connecting portion in the first board body 11 and the flexible connecting portion in the second board body 12 may be connected in various ways, preferably but not limited to, integrally connected.

In some embodiments, the flexible connecting portion of the first board 11 is integrally connected to the flexible connecting portion of the second board 12 to form a C-shaped connecting portion 131.

Specifically, as shown in fig. 1, the flexible connecting portion in the first board 11 is set to be a 1/4 arc extending toward the second board 12, and the flexible connecting portion in the second board 12 is set to be a 1/4 arc extending toward the first board 11, and the two are integrally connected to form a C-shaped connecting portion 131, so that when the circuit board module is stably mounted in an electronic component, the first board 11 can be stably and parallelly floating above the second board 12 at an interval.

The arrangement of the flexible connecting portion of the first board 11 and the flexible connecting portion of the second board 12 has the advantages of simple structure, good stability of flexible connection, and capability of positioning the first board 11 above the second board 12 at stable intervals.

Of course, the flexible connecting portion in the first plate 11 and the flexible connecting portion in the second plate 12 may be integrally connected to form other shapes, such as an "Ω" shape, an "m" shape, and so on, to adapt to different use conditions.

In some embodiments, the first plate body 11 is provided with a hard plate layer 14 on the upper and/or lower plate surface of the flexible plate layer 13.

Specifically, as shown in fig. 1, in this case, the upper plate surface and the lower plate surface of the flexible plate layer 13 in the first plate body 11 are both provided with the hard plate layers 14, and the two hard plate layers 14 may be, but are not limited to, adhered to the upper plate surface and the lower plate surface of the flexible plate layer 13 by using an adhesive.

The upper plate surface and the lower plate surface of the flexible plate layer 13 in the first plate body 11 are provided with the hard plate layer 14 to improve the overall structural strength and the overall flatness of the first plate body 11, so that the first plate body 11 can have enough structural strength and installation flatness to support and install other components.

Of course, it is also possible to provide a hard plate layer 14 only on the upper or lower surface of the flexible plate layer 13 in the first plate body 11 according to different requirements of the use conditions.

In some embodiments, the first plate 11 is further provided with a reinforcing sheet layer 15 on the side of the hard sheet layer 14 facing the second plate 12.

Specifically, as shown in fig. 1, a reinforcing sheet layer 15 is further provided on the outer surface of the hard sheet layer 14 located on the lower plate surface of the first plate 11, and the hard sheet layer 14, the flexible sheet layer 13, and the hard sheet layer 14 stacked in this order are supported and supported integrally by the reinforcing sheet layer 15.

Through setting up foretell reinforcement sheet layer 15 can further provide first plate 11 structural strength, make and to set up more components and parts in the first plate 11.

In some embodiments, the reinforcing ply 15 is a metal ply and is adhesively secured to the hard ply 14.

Specifically, as shown in fig. 1, since the first plate 11 is provided with the conductive circuit and the components, the first plate 11 inevitably generates some heat when the first plate is powered on, the reinforcing plate layer 15 is configured as a metal plate layer and is bonded to the hard plate layer 14 through the heat dissipation adhesive, and the reinforcing plate layer 15 can be further connected to the metal shell of the device, so that the metal reinforcing plate layer 15 can well conduct the heat generated in the first plate 11 to the device shell to be dissipated.

Set up the reinforcement sheet layer 15 to the sheet metal layer, can improve first plate body 11 structural strength promptly, can carry out the efficient conduction to the heat that first plate body 11 circular telegram during operation produced again and give off.

Of course, the reinforcement plies 15 described above may be made from other composite materials that have good structural strength and thermal conductivity.

In some specific embodiments, the first plate 11 is provided with a hollow portion for mounting the photo sensor chip 3 in the flexible board layer 13 and the hard board layer 14; the photosensitive chip 3 can abut against the reinforcing sheet layer 15, and the photosensitive chip 3 is electrically connected to the flexible sheet layer 13 through the conductive line 31.

Specifically, as shown in fig. 1, a hollow portion for installing the photosensitive chip 3 is correspondingly provided in the flexible board layer 13 and the hard board layers 14 on both sides of the flexible board layer 13, the upper surface of the photosensitive chip 3 located above the flexible board layer 13 is a photosensitive surface, the photosensitive surface has a photosensitive area and a non-photosensitive area, and the photosensitive area and the non-photosensitive area are respectively connected with the circuit in the flexible board layer 13 through the conductive circuit 31.

In addition, sensitization chip 3 can also specifically bond through heat conduction viscose and metal material's reinforcement sheet layer 15, when guaranteeing that sensitization chip 3 normally installs and the electricity connection function like this, reinforcement sheet layer 15 can also give off the timely conduction of the heat of output in the 3 course of operation of sensitization chip.

In some embodiments, the second plate 12 is provided with a hard plate 14 on the upper and/or lower surface of the flexible plate 13.

Specifically, as shown in fig. 1, in this case, the upper plate surface and the lower plate surface of the flexible plate layer 13 in the second plate body 12 are both provided with the hard plate layers 14, and the two hard plate layers 14 may be, but are not limited to, adhered to the upper plate surface and the lower plate surface of the flexible plate layer 13 by using an adhesive.

The upper plate surface and the lower plate surface of the flexible plate layer 13 in the second plate body 12 are provided with the hard plate layers 14 to improve the overall structural strength and the overall flatness of the second plate body 12, so that the second plate body 12 can have enough structural strength and installation flatness to support and install other components or install the components at an installation station.

Of course, it is also possible to provide only one hard plate layer 14 on the upper or lower surface of the flexible plate layer 13 in the second plate body 12 according to different requirements of the use conditions.

In addition, the embodiment of the present disclosure further provides a camera, which includes the above circuit board module and the housing 2; the inside of casing 2 has the appearance chamber, and the circuit board module sets up in holding the chamber.

Specifically, as shown in fig. 2, the camera includes the circuit board module and the housing 2, which can achieve all the advantages of the circuit board module and are not described herein again.

Moreover, the housing 2 is correspondingly provided with an output port 21 electrically connected with the circuit board module, and the camera can be electrically connected with other devices through the output port 21, so that the other devices can read the stored information in the photosensitive chip 3 conveniently.

In addition, in order to simplify the structure and assembly process of the camera, the lens barrel and the housing 2 in the camera may be integrally formed, but the lens barrel and the housing 2 may be directly integrally injection-molded by an injection molding machine during processing and manufacturing, and the assembly process of the lens barrel and the housing 2 is directly omitted during assembly.

In addition, the embodiment of the disclosure also provides an electronic device, which comprises a device body and the camera.

The electronic equipment also comprises the circuit board module, so that all the beneficial effects of the circuit board module can be realized, and the description is omitted.

In addition, the electronic device may be, but is not limited to, a camera, a mobile phone, a computer, an unmanned aerial vehicle, a smart home camera device, a security camera device, a vehicle-mounted camera device, and the like, which are not listed in detail herein.

It is noted that, in this document, relational terms such as "first" and "second," and the like, are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising a … …" does not exclude the presence of another identical element in a process, method, article, or apparatus that comprises the element.

The previous description is only for the purpose of describing particular embodiments of the present disclosure, so as to enable those skilled in the art to understand or implement the present disclosure. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the disclosure. Thus, the present disclosure is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A circuit board module is characterized by comprising a circuit board;

2. The circuit board module according to claim 1, wherein one side of the flexible board layer in the first board body has a flexible connection portion extending toward the second board body;

3. The circuit board module as claimed in claim 2, wherein the flexible connecting portion of the first board body and the flexible connecting portion of the second board body are integrally connected to form a C-shaped connecting portion.

4. The circuit board module according to any one of claims 1 to 3, wherein the first board body is provided with a hard board layer on an upper board surface and/or a lower board surface of the flexible board layer.

5. The circuit board module according to claim 4, wherein the first board body is further provided with a reinforcing plate layer on a side of the hard plate layer facing the second board body.

6. The circuit board module as claimed in claim 5, wherein the reinforcing plate layer is a metal plate layer and is bonded and fixed to the hard plate layer.

7. The circuit board module according to claim 5, wherein the first board body is correspondingly provided with a hollow part for mounting a photosensitive chip in the flexible board layer and the hard board layer;

8. A circuit board module according to any one of claims 1 to 3, wherein the second board body is provided with a hard board layer on each of the upper and/or lower surfaces of the flexible board layer.

9. A camera comprising the circuit board module according to any one of claims 1 to 8, wherein the camera further comprises a housing;

the inside of casing has the appearance chamber, just circuit board module set up in hold the chamber.

10. An electronic apparatus comprising an apparatus body and the camera set forth in claim 9.