CN217767710U

CN217767710U - Display module, mobile terminal and electronic equipment

Info

Publication number: CN217767710U
Application number: CN202122548612.2U
Authority: CN
Inventors: 魏玲枫
Original assignee: Truly Opto Electronics Ltd
Current assignee: Truly Opto Electronics Ltd
Priority date: 2021-10-21
Filing date: 2021-10-21
Publication date: 2022-11-08
Anticipated expiration: 2031-10-21

Abstract

The utility model relates to a display module assembly, mobile terminal and electronic equipment have mainboard and subplate, include: a backlight assembly including an iron frame; the first end of the guide plate is provided with a connection point, and the second end of the guide plate is electrically connected with the iron frame; the secondary plate is electrically connected with the guide plate through the connecting point. The utility model discloses a FPC guide subplate FPC equipment will attach and expand outward the increase at the conductive copper foil on main screen FPC simultaneously, has not only reduced the attached material and the cost of labor that guide wheat of module factory was drawn, has avoided because of the problem that the incomplete glue influence performance is drawn to wheat, still increases conductive copper foil and iron stand effective contact route in a poor light.

Description

Display module, mobile terminal and electronic equipment

Technical Field

The utility model relates to a flexible circuit board technique especially relates to a display module assembly, mobile terminal and electronic equipment.

Background

At present, most mobile phone items combine a circuit for connecting an auxiliary board (a USB/charging drive board) and a main board with a display module main screen FPC, and the FPC of the display module is provided with at least 2 connectors. At present, the mass production display module structure has following two kinds of problems:

1. because the auxiliary board FPC is shorter, when a module factory discharges goods, a guide mylar needs to be attached to the reinforcing position of the steel sheet of the auxiliary board FPC connector, and the auxiliary board FPC is assembled by the aid of the whole machine and penetrates through the middle frame. The contact surface of the guiding mylar and the connector steel sheet has viscosity, and the performance is affected by the fact that residual glue is easy to occur on the steel sheet when the guiding mylar and the connector steel sheet are torn off due to the influence of the temperature and the humidity of the environment.

2. In order to prevent Noise from interfering the Driver IC, a module factory is required to paste conductive copper foil on the IC (firstly paste insulating paper on the IC surface), the copper foil is bonded with exposed copper of the main screen FPC, and the main screen FPC is connected with a backlight iron frame through conductive double-sided bonding, so that the copper foil is effectively contacted with the ground, and Noise interference is prevented. When the conductive double-sided adhesive is not well adhered, the copper foil has poor grounding effect.

Disclosure of Invention

In view of the above circumstances, the utility model discloses a optimize main screen flexible circuit board, further optimize module structural performance.

Therefore, the utility model provides a following technical scheme:

a display module having a main board and a sub board, comprising:

a backlight assembly including an iron frame;

the guide plate comprises a first end and a second end, the first end of the guide plate is provided with a connection point, and the second end of the guide plate is electrically connected with the iron frame;

the auxiliary plate is electrically connected with the guide plate through a connecting point.

Preferably, the display module comprises a glass panel having an IC chip.

Preferably, a plurality of connection points are provided.

As a preferred technical solution, the guide plate is a flexible circuit board.

The metal foil comprises a first area and a second area, the first area covers part of the surface of the IC chip and part of the surface of the mainboard, and the second area is electrically connected with the iron frame.

As a preferred technical scheme, the surface of the IC chip is pasted with insulating paper, and the insulating paper is provided with a metal foil.

Preferably, the metal foil is a copper foil.

Preferably, one side of the iron frame, which is not covered with the metal foil, is attached to the glass panel.

The application also provides a mobile terminal which comprises the display module.

The application also provides an electronic device comprising the display module.

The utility model discloses a technical scheme can reach following beneficial effect:

1. in the traditional scheme, the guide Mylar is attached to the steel sheet reinforcing position of the FPC connector of the auxiliary board, the contact surface of the guide Mylar and the steel sheet of the connector has viscosity, and the residual glue is easy to occur on the steel sheet when the Mylar is torn off, so that the performance is affected. In the scheme, the auxiliary board FPC is guided to be assembled through the FPC, so that the material and labor cost for attaching and guiding Mylar in a module factory is reduced, and the problem that the residual Mylar rubber affects the performance is avoided;

2. in the traditional scheme, the main screen FPC is connected with a backlight iron frame through conductive double-sided adhesive, so that effective contact between a copper foil and the ground is realized, and Noise interference is prevented. When the conductive double-sided adhesive is not well adhered, the copper foil has poor grounding effect. Through will be attached the conductive copper foil who is on main screen FPC expands outward and increase in this scheme, bond with the iron stand in a poor light, can increase conductive copper foil and the effective contact route of iron stand in a poor light.

Drawings

To more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the description of the embodiments will be briefly introduced below to form a part of the present invention, and the exemplary embodiments and the description thereof illustrate the present invention and do not unduly limit the present invention. In the drawings:

fig. 1 is a schematic structural view of a display module disclosed in embodiment 1 of the present invention;

fig. 2 is a schematic structural view of a display module disclosed in embodiments 1-2 of the present invention;

fig. 3 is a schematic structural view of a display module disclosed in embodiments 1-2 of the present invention;

fig. 4 is a schematic structural view of a display module according to embodiments 1-2 of the present invention.

Description of the reference numerals:

a main board 10; a sub-plate 20; a guide plate 30; mylar 30A; a first end 30B of the guide plate; a second end 30C of the guide plate; a connection point 31; a connector steel sheet 40; an IC chip 50; an iron frame 60; a middle frame 60A; a metal foil 70; a first region 70A; a second region 70B; FPC copper leakage 80.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention clearer, the following will clearly and completely describe the technical solutions of the present invention with reference to the specific embodiments of the present invention and the accompanying drawings. In the description of the present invention, it is noted that the term "or" is generally employed in its sense including "and/or" unless the content clearly dictates otherwise.

In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood as a specific case by those skilled in the art.

It is to be understood that the disclosed embodiments are merely exemplary of the invention, and are not intended to limit the invention to the precise embodiments disclosed. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Example 1

This embodiment 1 provides a display module, which has a main board 10 and a sub-board 20, and comprises:

a backlight assembly including an iron frame 60;

the guide plate 30, the guide plate 30 includes a first end and a second end, the first end 30B of the guide plate is provided with a connection point 31, and the second end 30C of the guide plate is electrically connected with the chase 60;

the sub-plate 20 is electrically connected to the guide plate 30 through a connection point 31.

The main board 10 and the sub-board 20 are both flexible circuit boards. Flexible circuit boards, also known as "flexible boards," are printed circuits made of flexible, insulating substrates. Flexible circuits provide excellent electrical performance, meet design requirements for smaller and higher density packaging, and also help reduce assembly processes and enhance reliability. The flexible circuit board is the only solution to meet the miniaturization and movement requirements of electronic products. The flexible printed circuit board can be freely bent, wound and folded, can bear millions of dynamic bending without damaging the lead, can be randomly arranged according to the space layout requirement, and can be freely moved and stretched in a three-dimensional space, so that the integration of component assembly and lead connection is realized; the flexible circuit board can greatly reduce the volume and the weight of the electronic product, and is suitable for the development of the electronic product towards high density, miniaturization and high reliability.

According to fig. 1, the conventional solution is that the sub-board 20FPC is short, and when the module factory is shipped, the mylar 30A needs to be attached and guided to the reinforcing position of the sub-board connector steel sheet 40, which assists the complete machine to assemble the sub-board 20FPC to pass through the middle frame 60A.

Mylar 30A, also known as mylar sheet, is a film formed by heating dimethyl terephthalate and ethylene glycol with the aid of a related catalyst, transesterification, and vacuum polycondensation, followed by biaxial stretching. The Mylar sheet has various colors such as white, black, transparent, natural color, etc. Has excellent tear strength, temperature resistance, weather resistance, moisture resistance, water resistance, chemical corrosion resistance and super electric insulation performance. And through the adjustment of the formula and the production process, the Mylar film can be made into an insulation type, a buffer type, a wear-resistant type, a sealing type and an appearance decoration type, and the most appropriate Mylar film can be selected according to the requirements of users.

Obviously, the contact surface of the guiding mylar 30A and the connector steel sheet 40 has viscosity, and is influenced by the temperature and humidity of the environment, and when the guiding mylar is torn off, residual glue is easy to be generated on the steel sheet, so that the performance is influenced.

According to fig. 2, this embodiment provides a better design scheme to optimize the structural performance of the module. Instead of the guide mylar 30A, it is preferable that the guide plate 30 be a flexible circuit board.

According to the figures 3-4, when the FPC is manufactured, a part of FPC is reserved for guiding use, one end of an FPC guiding plate is provided with a plurality of connecting points 31 and then is connected with an auxiliary plate 20 through the connecting points 31, one end, which is not provided with connecting points, of the guiding plate penetrates through the middle frame 60A, after the FPC of the whole auxiliary plate is assembled, the FPC part is guided to be torn off, the FPC of the auxiliary plate is guided to be assembled through the FPC, so that the material and labor cost for attaching and guiding Mylar in a module factory are reduced, and the problem that the performance is influenced by Mylar cull is avoided.

The specific size of the flexible circuit for the guiding plate 30 can be set by those skilled in the art according to actual requirements, and the embodiment of the present invention is not limited thereto.

Example 2

This embodiment 2 provides a flexible circuit board structure design.

The display module includes a glass panel having an IC chip 50, and a backlight assembly including an iron frame 60.

The metal foil 70 includes a first region 70A and a second region 70B, the first region 70A covers a portion of the surface of the IC chip 50 and a portion of the surface of the main board 10, and the second region 70B is electrically connected to the bezel 60.

The IC end of the flexible circuit board main board 10 is spliced with the IC chip 50, the flexible circuit board is bent, and one side of the flexible circuit board which is not provided with the metal foil is electrically connected with the iron frame 60.

The surface of the IC chip 50 is first coated with an insulating paper, and then a metal foil 70 is disposed on the insulating paper.

Preferably, the metal foil 70 is a copper foil.

The bezel 60 is attached to the glass panel on the side not covered by the metal foil.

In the traditional scheme, in order to prevent Noise from interfering the work of the drive IC, a module factory is required to paste conductive copper foil (an IC surface is firstly pasted with insulating paper) on an IC chip, the copper foil is bonded with a main screen FPC copper leakage 80, and the main screen FPC is connected with a backlight iron frame through conductive double-sided bonding, so that the copper foil is effectively contacted with the ground, and the Noise interference is prevented. When the conductive double-sided adhesive is not well adhered, the copper foil has poor grounding effect.

According to fig. 2-4, in this embodiment, the conductive copper foil attached to the main screen FPC is enlarged, the backlight bezel is assembled on the surface of the glass panel, and then the flexible circuit board is bent as shown in fig. 2, and one surface of the flexible circuit board not provided with the metal foil is attached to the backlight bezel 60, wherein the second region 70B is electrically connected to the backlight bezel 60.

The thickness of the copper foil needs to be controlled in the utility model, and the first reason is that the uniform copper foil can have very uniform resistance temperature coefficient, so that the signal transmission loss is smaller; and secondly, the temperature rise of the thin copper foil is small when a large current passes through the thin copper foil, so that the thin copper foil is beneficial to heat dissipation and the service life of elements.

The specific thickness and size of copper foil can be set by those skilled in the art according to actual needs, and the embodiment of the present invention is not limited thereto.

Example 3

The application further provides a mobile terminal which comprises the display module provided by the embodiment 1-2.

The application also provides electronic equipment which comprises the display module provided by the embodiment 1-2.

The display module, the mobile terminal and the electronic device in the embodiment of the present application are described in detail above, and specific examples are applied in this document to explain the principle and the embodiment of the present application, and the description of the above embodiments is only used to help understand the method and the core idea of the present application; meanwhile, for a person skilled in the art, according to the idea of the present application, the specific implementation manner and the application scope may be changed, and in summary, the content of the present specification should not be construed as a limitation to the present application.

Claims

1. The utility model provides a display module assembly, has mainboard and subplate, its characterized in that includes:

a backlight assembly including an iron frame;

the secondary plate is electrically connected with the guide plate through the connecting point.

2. The display module of claim 1, further comprising a glass panel having an IC chip.

3. The display module of claim 1, wherein the connection point is provided in plurality.

4. The display module according to claim 1, wherein the guide plate is a flexible circuit board.

5. The display module according to claim 2, further comprising a metal foil, wherein the metal foil comprises a first region and a second region, the first region covers a portion of the surface of the IC chip and a portion of the surface of the main board, and the second region is electrically connected to the bezel.

6. The display module of claim 2, wherein the surface of the IC chip is coated with an insulating paper, and the insulating paper is provided with a metal foil.

7. The display module according to any one of claims 5-6, wherein the metal foil is a copper foil.

8. The display module of claim 2, wherein one side of the metal foil sheet not covered by the bezel is attached to the glass panel.

9. A mobile terminal, characterized in that it comprises a display module according to any one of claims 1 to 8.

10. An electronic device comprising the display module according to any one of claims 1 to 8.