CN109727539B - Display module assembly and electronic equipment - Google Patents
Display module assembly and electronic equipment Download PDFInfo
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- CN109727539B CN109727539B CN201811542883.3A CN201811542883A CN109727539B CN 109727539 B CN109727539 B CN 109727539B CN 201811542883 A CN201811542883 A CN 201811542883A CN 109727539 B CN109727539 B CN 109727539B
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
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Abstract
The invention provides a display module and an electronic device, wherein the display module comprises: the circuit board comprises a first substrate and a second substrate, wherein the first surface and the second surface are arranged in an opposite manner, the first surface is provided with a circuit layer, the first substrate is provided with a through hole penetrating through the first surface and the second surface, and the circuit layer extends to the part of the second surface through the through hole to form a circuit connecting part; the second substrate is arranged opposite to the first surface; and the flexible circuit board is electrically connected with the line connecting part on the second surface. The invention can avoid the area of the first surface of the first substrate occupied by the flexible circuit board, reduce or cancel a single layer area on the first substrate and a flexible circuit bending area in the prior art, further reduce the size of the black edge at the bottom of the display module and improve the strength of the bottom of the display module.
Description
Technical Field
The invention relates to the technical field of electronics, in particular to a display module and electronic equipment.
Background
The full-screen has become a development trend of most electronic devices such as mobile phones and tablet computers, and the black edge of the display screen is set to be narrower and narrower, so that the screen occupation ratio of the display screen is higher and higher. With the progress of the process technology, the display screen adopting COF (chip On FPC), cop (chip On pi) and other processes has broken through 90% of the screen occupation ratio, and the binding process of the Panel (Panel) and the driving circuit (IC/COF/FPC and the like) is continuously improved to achieve a higher screen occupation ratio.
Under the existing process, no matter the traditional COG (chip On glass) + FOG (film On glass), COF and COP, a binding region with a certain width is required to be reserved at the bottom of the panel so as to lead out a driving circuit of the panel, for example, an FPC (flexible printed circuit) is bound in a single-layer glass region of lower glass of a display screen and then bent to the back of the display screen for fixing, the single-layer glass region and the FPC bending region are the main reasons for causing the black edge at the bottom of the panel to be wider than the rest three edges, so that the black edge at the bottom of the panel cannot reach the same width as the other three edges in the process, and further improvement of the screen occupation ratio is prevented.
Disclosure of Invention
The invention provides a display module and electronic equipment, and aims to solve the problem that the display module in the prior art is difficult to further improve the screen occupation ratio.
In order to solve the technical problem, the invention is realized as follows:
in a first aspect, an embodiment of the present invention provides a display module, including:
a first substrate including a first surface and a second surface opposite to each other, the first surface being provided with a circuit layer,
the first substrate is provided with a through hole penetrating through the first surface and the second surface, and the circuit layer extends to the part of the second surface through the through hole to form a circuit connecting part;
the second substrate is arranged opposite to the first surface;
and the flexible circuit board is electrically connected with the line connecting part on the second surface.
In a second aspect, an embodiment of the invention provides an electronic device, including the display module described above.
In the embodiment of the invention, the through hole penetrating through the first surface and the second surface is formed in the first substrate, and the circuit layer is extended to the circuit connecting part formed on the second surface through the through hole, so that the flexible circuit board is electrically connected with the circuit connecting part, the area of the first surface of the first substrate occupied by the flexible circuit board can be avoided, a single layer area on the first substrate and a flexible circuit bending area in the prior art can be reduced or eliminated, the size of a black edge at the bottom of the display module is reduced, and the strength of the bottom of the display module can be improved.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the description of the embodiments of the present invention will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to these drawings without inventive exercise.
Fig. 1 is a schematic structural diagram of a display module according to an embodiment of the invention.
Detailed Description
In order to make the technical problems, technical solutions and advantages of the present invention more apparent, the following detailed description is given with reference to the accompanying drawings and specific embodiments.
Referring to fig. 1, a schematic structural diagram of a display module according to an embodiment of the present invention is shown, where the display module according to the embodiment of the present invention includes:
a first substrate 207 including a first surface and a second surface opposite to each other, the first surface being provided with a circuit layer 205, the first substrate 207 being provided with a through hole 208 penetrating the first surface and the second surface, the circuit layer 205 extending to the second surface through the through hole 208 to form a circuit connection portion 211;
a second substrate 204, the second substrate 204 being disposed opposite to the first surface;
and a flexible circuit board 210, wherein the flexible circuit board 210 is electrically connected with the line connection part 211 of the second surface.
In the embodiment of the present invention, the first substrate 207 includes a first surface, a second surface, and a plurality of side surfaces respectively connected to the first surface and the second surface, and the first surface and the second surface are disposed opposite to each other, wherein the first surface of the first substrate 207 is disposed with a circuit layer 205 for implementing display driving of a display module; a through hole 208 is provided in a predetermined region of the first substrate 207, and the through hole 208 penetrates the first surface and the second surface to extend the wiring layer 205 of the first surface to the second surface to form a wiring connection portion 211 for electrical connection with the flexible circuit board 210. In this way, the flexible circuit board 210 can be disposed on one side of the second surface of the first substrate 207, so that the flexible circuit board 210 can be directly electrically connected to the second surface and the line connection portion 211, thereby avoiding the flexible circuit board 210 occupying the area of the first surface of the first substrate 207, reducing or eliminating a single layer area on the first substrate for leading out a line layer and eliminating a flexible circuit bending area in the prior art, and further reducing the size of a black edge at the bottom of the display module; and, owing to can cancel the single layer region on the first base plate among the prior art, can promote the intensity of display module assembly bottom, further, owing to cancelled flexible circuit bending region, can avoid setting up too much and appearing the problem that the structure interferes because of display module assembly substructure.
In an alternative embodiment of the present invention, the first substrate may be a glass substrate, and preferably, the first glass may be Low Temperature Polysilicon (LTPS) glass.
In the embodiment of the present invention, the through hole 208 may be provided as one, that is, the line layer 205 is extended to the second surface by one through hole to form the line connection portion 211 for electrical connection with the flexible circuit board 210; alternatively, the number of the through holes 208 may be plural in consideration that if the number of the through holes 208 is one, the opening of the through holes 208 is large and is not favorable for the structural strength of the first substrate 207, and here, for the arrangement of the plurality of through holes 208, each through hole 208 may be a micro hole of um level by using a laser process in a predetermined region of the first substrate 207.
In some optional embodiments of the present invention, to ensure that the first substrate 207 and the second substrate 204 can be firmly disposed, the display module further includes: the sealant 206 is disposed between the first substrate 207 and the second substrate 204, and the sealant 206 is connected to the first substrate 207 and the second substrate 204 respectively.
In the embodiment of the present invention, in combination with the setting region of the sealant 206, the setting position of the through hole 208 on the first substrate 207 can be provided with a plurality of setting manners.
For example, in an alternative embodiment of the present invention, the through hole 208 may be located outside the orthographic projection of the sealant 206 on the first substrate 207 and in the edge region of the first surface. In the embodiment of the present invention, by disposing the through hole 208 in the edge region of the first surface of the first substrate 207, a sufficient disposing space can be provided for the through hole 208, so that the disposing and canceling of the single layer region on the first substrate in the prior art can be reduced.
Advantageously, in another optional embodiment of the present invention, the through hole 208 may be located within a range of an orthographic projection of the sealant 206 on the first substrate 207. In the embodiment of the present invention, since the through hole 208 is located in the range of the orthographic projection of the frame sealing adhesive 206 on the first substrate 207, the frame sealing adhesive 206 covers the opening surface of the through hole 208 facing the first surface, so that a single layer area on the first substrate in the prior art can be eliminated, and the through hole 208 can be protected by the frame sealing adhesive 206, thereby improving the corrosion resistance.
In addition, in some alternative embodiments of the present invention, the line connection portion 211 may include a first connection portion disposed in the through hole 208 and a second connection portion disposed on the second surface. Specifically, the second connection portion may be a conductive material layer disposed on a sidewall of the through hole 208. In the embodiment of the present invention, the conductive material layer is disposed on the sidewall of the through hole 208 to form the first connection portion of the line connection portion 211, so that the line layer 205 can be ensured to extend to the second surface to realize signal transmission with the flexible circuit board 210, and the flexible circuit board 210 can be prevented from occupying the area of the first surface of the first substrate 207.
Further, in some alternative embodiments of the present invention, a conductive material may be coated on the sidewall of the through hole 208 to form a conductive material layer, and the conductive material layer may be used as a first connection portion to extend the circuit layer 205 on the first surface to the second surface. In the embodiment of the present invention, the conductive material may be a metal conductive material such as Mu and Nb, or may also be an ITO (indium tin oxide) conductive material.
In some alternative embodiments of the present invention, the second connection portion may be formed by a plating or yellow light process.
In some optional embodiments of the present invention, the first substrate 207 and the second substrate 204 have the same size, so that the first substrate 207 and the second substrate 204 are adapted to each other, a single layer area for leading out a circuit layer on the first substrate in the prior art is eliminated, and the strength of the display module is improved.
In some alternative embodiments of the present invention, the line connection part 211 includes at least one first connection pin electrically connected with a second connection pin on the flexible circuit board 210. In the embodiment of the present invention, at least one first connection pin is electrically connected to a second connection pin disposed on the flexible circuit board 210, so as to ensure normal display driving of the display module, where the number of the first connection pins is adapted to the number of the second connection pins disposed on the flexible circuit board 210.
In some optional embodiments of the present invention, the display module may further include a buffer layer 209, and the buffer layer 209 is disposed between the second surface of the first substrate 207 and the flexible circuit board 210, wherein the buffer layer 209 may be made of foam.
In addition, in the embodiment of the present invention, the line layer 205 and the line connection portion 211 may be metal lines, or may also be ITO lines.
In addition, in the embodiment of the present invention, the display module may further include a series of basic components, such as a buffer structure for protecting, a transparent cover plate 201, a full-lamination adhesive 202 (the full-lamination adhesive 202 may be OCR or OCA) for laminating and connecting the transparent cover plate 201 and the second substrate 204, a polarizer 203 disposed between the transparent cover plate 201 and the second substrate 204, and a housing for accommodating each component, which are not described in detail in the embodiment of the present invention.
According to the display module provided by the embodiment of the invention, the through hole penetrating through the first surface and the second surface is formed in the first substrate, and the circuit layer is extended to the circuit connecting part formed by the through hole, so that the flexible circuit board is electrically connected with the circuit connecting part, the area of the first surface of the first substrate occupied by the flexible circuit board can be avoided, a single layer area on the first substrate in the prior art can be reduced or eliminated, a flexible circuit bending area is eliminated, the black edge size of the bottom of the display module is further reduced, the strength of the bottom of the display module can be improved, and the process yield of the display module and the quality performance of the whole display module after sale can be improved.
In addition, the embodiment of the invention also provides electronic equipment which comprises the display module. The electronic device may further include a series of basic components such as an earphone, a speaker, a microphone, and the like, which are not described in detail in the embodiment of the present invention.
In the embodiment of the present invention, the electronic device may be a mobile phone or a tablet computer. Of course, the electronic device is not limited to a mobile phone and a tablet Computer, and may be an electronic device with a screen display, such as a Laptop Computer (Laptop Computer) or a Personal Digital Assistant (PDA).
In the embodiment of the invention, the electronic equipment with the display module can reduce or cancel the single layer region on the first substrate and the flexible circuit bending region in the prior art, so that the size of the black edge at the bottom of the display module can be reduced, the strength at the bottom of the display module can be improved, the narrow frame design of the electronic equipment can be realized, and the problem of poor display of the display module can be avoided.
It should be appreciated that reference throughout this specification to "one embodiment," "an embodiment," or "some embodiments" means that a particular feature, structure, or characteristic described in connection with the embodiment is included in at least one embodiment or example of the present invention. Thus, the appearances of the phrases "in one embodiment," "in one embodiment," or "in some embodiments" in various places throughout this specification are not necessarily all referring to the same embodiment. Furthermore, elements, structures, or features illustrated in one drawing or one embodiment of the invention may be combined in any suitable manner with elements, structures, or features illustrated in one or more other drawings or embodiments.
It should be noted that, in one or more embodiments herein, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element.
In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," "secured," "disposed," and the like are to be construed broadly and can, for example, be fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
In addition, the present invention may repeat reference numerals and/or letters in the various examples or embodiments. This repetition is for the purpose of simplicity and clarity and does not in itself dictate a relationship between the various embodiments and/or configurations discussed.
Moreover, in the embodiments of the present invention, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions.
While the present invention has been described with reference to the embodiments shown in the drawings, the present invention is not limited to the embodiments, which are illustrative and not restrictive, and it will be apparent to those skilled in the art that various changes and modifications can be made therein without departing from the spirit and scope of the invention as defined in the appended claims.
Claims (7)
1. A display module, comprising:
a first substrate (207) comprising a first surface and a second surface which are arranged oppositely, wherein the first surface is provided with a circuit layer (205), the first substrate (207) is provided with a through hole (208) penetrating through the first surface and the second surface, and the circuit layer (205) extends to the part of the second surface through the through hole (208) to form a circuit connection part (211);
a second substrate (204), the second substrate (204) disposed opposite the first surface;
a flexible circuit board (210), the flexible circuit board (210) being electrically connected with the line connection portion (211) of the second surface;
the frame sealing glue (206) is arranged between the first substrate (207) and the second substrate (204), the frame sealing glue (206) is respectively connected with the first substrate (207) and the second substrate (204), the through hole (208) is located in the range of orthographic projection of the frame sealing glue (206) on the first substrate (207), and the frame sealing glue (206) covers the opening surface of the through hole (208) facing the first surface.
2. The display module according to claim 1, wherein the line connection portion (211) comprises a first connection portion and a second connection portion, the first connection portion is disposed in the through hole (208), and the second connection portion is disposed on the second surface.
3. The display module according to claim 2, wherein the first connection portion is a conductive material layer disposed on a sidewall of the through hole (208).
4. The display module according to claim 1, wherein the first substrate (207) and the second substrate (204) are the same size.
5. The display module according to claim 1, wherein the line connection portion (211) comprises at least one first connection pin, and the first connection pin is electrically connected with a second connection pin on the flexible circuit board (210).
6. The display module according to claim 1, wherein the number of the through holes (208) is plural.
7. An electronic device, comprising the display module according to any one of claims 1 to 6.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811542883.3A CN109727539B (en) | 2018-12-17 | 2018-12-17 | Display module assembly and electronic equipment |
| PCT/CN2019/117447 WO2020125271A1 (en) | 2018-12-17 | 2019-11-12 | Display module and electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811542883.3A CN109727539B (en) | 2018-12-17 | 2018-12-17 | Display module assembly and electronic equipment |
Publications (2)
| Publication Number | Publication Date |
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| CN109727539A CN109727539A (en) | 2019-05-07 |
| CN109727539B true CN109727539B (en) | 2020-10-30 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201811542883.3A Active CN109727539B (en) | 2018-12-17 | 2018-12-17 | Display module assembly and electronic equipment |
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| CN (1) | CN109727539B (en) |
| WO (1) | WO2020125271A1 (en) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109727539B (en) * | 2018-12-17 | 2020-10-30 | 维沃移动通信有限公司 | Display module assembly and electronic equipment |
| CN110320689A (en) * | 2019-06-24 | 2019-10-11 | 武汉华星光电技术有限公司 | Display device and preparation method thereof |
| CN110570794A (en) * | 2019-08-29 | 2019-12-13 | 维沃移动通信有限公司 | Display module, terminal equipment and manufacturing method of display module |
| CN110794988B (en) * | 2019-10-22 | 2021-12-03 | 维沃移动通信有限公司 | Display module assembly and electronic equipment |
| CN110930881B (en) * | 2019-11-28 | 2021-10-08 | 武汉华星光电半导体显示技术有限公司 | Flexible display module and flexible display device |
| CN112946936A (en) * | 2019-12-11 | 2021-06-11 | 北京小米移动软件有限公司 | Display panel and electronic device |
| CN111128022B (en) | 2019-12-24 | 2021-04-23 | 云谷（固安）科技有限公司 | Display panel, preparation method thereof and display device |
| CN111666005A (en) * | 2020-06-22 | 2020-09-15 | 南昌欧菲显示科技有限公司 | Touch control assembly and preparation method thereof |
| CN112234156B (en) * | 2020-12-16 | 2021-04-09 | 浙江荷清柔性电子技术有限公司 | Full-flexible display module, packaging method, driving module and display terminal |
| CN113394355B (en) * | 2021-06-16 | 2024-03-15 | 京东方科技集团股份有限公司 | Display device and terminal equipment |
| CN114967250A (en) * | 2022-06-22 | 2022-08-30 | 南昌勤胜电子科技有限公司 | Liquid crystal display module and preparation method thereof |
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| CN102279662A (en) * | 2010-06-13 | 2011-12-14 | 明兴光电股份有限公司 | Touch-control display panel and colorized filtering touch-control baseplate |
| CN103918021B (en) * | 2012-09-18 | 2016-05-25 | 深圳市柔宇科技有限公司 | Large scale display screen and manufacture method thereof |
| CN102931214A (en) * | 2012-11-26 | 2013-02-13 | 李崇 | Organic light emitting diode (OLED) display unit and OLED display device adopting display unit |
| CN104049802A (en) * | 2014-06-06 | 2014-09-17 | 深圳莱宝高科技股份有限公司 | Touch display device |
| CN107315294A (en) * | 2017-07-25 | 2017-11-03 | 深圳市华星光电技术有限公司 | A kind of preparation method of display base plate, display panel and display base plate |
| CN109727539B (en) * | 2018-12-17 | 2020-10-30 | 维沃移动通信有限公司 | Display module assembly and electronic equipment |
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2018
- 2018-12-17 CN CN201811542883.3A patent/CN109727539B/en active Active
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2019
- 2019-11-12 WO PCT/CN2019/117447 patent/WO2020125271A1/en active Application Filing
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| JPH1138439A (en) * | 1997-07-16 | 1999-02-12 | Toshiba Corp | Active matrix substrate, its manufacture and active matrix liquid crystal display device |
| CN203376939U (en) * | 2013-07-02 | 2014-01-01 | 广东欧珀移动通信有限公司 | Display device without frame |
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Also Published As
| Publication number | Publication date |
|---|---|
| CN109727539A (en) | 2019-05-07 |
| WO2020125271A1 (en) | 2020-06-25 |
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