CN109215521B - Display module, electronic equipment and manufacturing method of display module - Google Patents
Display module, electronic equipment and manufacturing method of display module Download PDFInfo
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- CN109215521B CN109215521B CN201811238003.3A CN201811238003A CN109215521B CN 109215521 B CN109215521 B CN 109215521B CN 201811238003 A CN201811238003 A CN 201811238003A CN 109215521 B CN109215521 B CN 109215521B
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Abstract
The invention provides a display module, electronic equipment and a manufacturing method of the display module, wherein the display module comprises: the circuit layer extends to a third surface of the first substrate to form a circuit connecting part, and the third surface is connected with the first surface; the second substrate is attached to the first surface; and the flexible circuit board is attached to the third surface and is electrically connected with the line connecting part. The invention can prevent the flexible circuit board from occupying the area of the first surface of the first substrate, thereby reducing the area size of the lower frame of the display module and realizing the design of the lower narrow frame.
Description
Technical Field
The invention relates to the technical field of electronics, in particular to a display module, electronic equipment and a manufacturing method of the display module.
Background
At present, the narrow-frame screen with the comprehensive screen is designed to be a development trend of most electronic equipment such as mobile phones and tablet computers, the narrow-frame screen can provide an extremely visual effect for users, and meanwhile, a larger displayable area can be realized on the same product size.
The existing display screen can be provided with narrow frames in left and right upper three-frame areas, but the narrow frame design of a lower frame area (commonly called as a chin) still has a plurality of technical difficulties.
A display module is a core component of a display screen, and in order to ensure a display effect of the display screen in the prior art, a chip packaging area or a screen cable binding area is usually disposed in a predetermined area (corresponding to a lower frame area of the display screen) outside a display portion of the display module, so as to achieve chip fixing or cable fixing, which also makes it difficult to further achieve a narrow frame design of the lower frame area of the display screen, especially a narrow frame design of the lower frame area of the display screen using glass as a substrate, such as an AMOLED (Active-matrix organic light emitting diode) and a TFT (Thin Film Transistor) structure.
Disclosure of Invention
The invention provides a display module, electronic equipment and a manufacturing method of the display module, and aims to solve the problem that narrow frame design of a lower frame area of a display screen is difficult to further realize in the prior art.
In order to solve the technical problem, the invention is realized as follows:
in a first aspect, an embodiment of the present invention provides a display module, including:
the circuit layer extends to a third surface of the first substrate to form a circuit connecting part, and the third surface is connected with the first surface;
the second substrate is attached to the first surface;
and the flexible circuit board is attached to the third surface and is electrically connected with the line connecting part.
In a second aspect, an embodiment of the invention provides an electronic device, including the display module described above.
In a third aspect, an embodiment of the present invention provides a method for manufacturing a display module, including:
providing a first target substrate and a second target substrate;
forming a groove on the first target substrate;
performing metal circuit coating on the first side surface of the groove and the preset surface of the first target substrate to form a circuit layer, wherein the first side surface of the groove is connected with the preset surface of the first target substrate, and the part of the circuit layer positioned on the first side surface is formed into a circuit connecting part;
attaching the first target substrate and the second target substrate, and cutting the first target substrate and the second target substrate along the first side surface of the groove to form a first substrate and a second substrate, wherein the preset surface is formed as the first surface of the first substrate, and the first side surface is formed as a part of the third surface of the first substrate;
and (3) connecting a flexible circuit board with the third surface in a fitting manner, and electrically connecting the flexible circuit board with the circuit connecting part to obtain the display module.
In the embodiment of the invention, the flexible circuit board is attached to the third surface of the first substrate and is electrically connected through the circuit connecting part extending from the circuit layer to the third surface, so that the flexible circuit board can be prevented from occupying the area of the first surface of the first substrate, the size of the lower frame area of the display module is reduced, and the design of the lower narrow frame is realized.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the description of the embodiments of the present invention will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to these drawings without inventive exercise.
Fig. 1 is a schematic structural diagram of a display module according to an embodiment of the invention;
fig. 2 is a second schematic structural diagram of a display module according to an embodiment of the invention;
fig. 3 is a third schematic structural diagram of a display module according to an embodiment of the invention;
FIG. 4 is a fourth schematic view illustrating a display module according to an embodiment of the present invention;
FIG. 5 is a fifth schematic view of a display module according to an embodiment of the present invention;
fig. 6 is a schematic flow chart illustrating a method for manufacturing a display module according to an embodiment of the invention;
FIG. 7 is a schematic view illustrating a manufacturing process of a display module according to an embodiment of the present invention;
FIG. 8 is a second schematic view illustrating a manufacturing process of a display module according to an embodiment of the invention;
FIG. 9 is a third schematic view illustrating a manufacturing process of a display module according to a third embodiment of the present invention;
FIG. 10 is a fourth schematic view illustrating a manufacturing process of a display module according to an embodiment of the present invention;
fig. 11 is a fifth schematic view showing a manufacturing process of the method for manufacturing a display module according to the embodiment of the invention.
Detailed Description
In order to make the technical problems, technical solutions and advantages of the present invention more apparent, the following detailed description is given with reference to the accompanying drawings and specific embodiments.
Fig. 1 is a first schematic structural diagram of a display module according to an embodiment of the present invention, fig. 2 is a second schematic structural diagram of a display module according to an embodiment of the present invention, fig. 3 is a third schematic structural diagram of a display module according to an embodiment of the present invention, fig. 4 is a fourth schematic structural diagram of a display module according to an embodiment of the present invention, and fig. 5 is a fifth schematic structural diagram of a display module according to an embodiment of the present invention.
Referring to fig. 1 to 3, an embodiment of the invention provides a display module, which may include:
a first substrate 110, wherein a circuit layer 111 is disposed on a first surface of the first substrate 110, the circuit layer 111 extends to a third surface 112 of the first substrate 110 to form a circuit connection portion 113, and the third surface 112 is connected to the first surface;
a second substrate 120, the second substrate 120 being attached to the first surface;
and the flexible circuit board 130 is attached to the third surface 112, and the flexible circuit board 130 is electrically connected to the line connecting portion 113.
In an embodiment of the present invention, the first substrate 110 includes a first surface, a second surface and a plurality of side surfaces respectively connected to the first surface and the second surface, and the third surface 112 is one of the side surfaces of the first substrate 110. Wherein, the first surface of this first base plate 110 has laid circuit layer 111 for realize the display drive of display module assembly, this circuit layer 111 extends at the third surface 112 of first base plate 110 and forms the line connecting portion 113 of being connected with flexible circuit board 130 electricity, so that connect flexible circuit board 130 laminating in third surface 112 and realize with the electric connection of circuit layer 111, thereby can avoid this flexible circuit board 130 to occupy the area of first surface, and then reduce the lower frame region size of display module assembly, realize the design of narrow frame down.
In the embodiment of the present invention, a cof (chip On fpc) packaging process may be adopted to fix the driving chip of the display module On the flexible circuit board 130, and the flexible circuit board 130 is disposed On the third surface 112 of the first substrate 110 through a fog (film On glass) bonding process.
In addition, in a preferred embodiment of the present invention, the first substrate 110 and the second substrate 120 may be glass substrates.
Referring to fig. 3 and 4, in a preferred embodiment of the present invention, the first portion 131 of the flexible circuit board 130 is attached to the third surface 112 and electrically connected to the circuit connecting portion 113, and the second portion 132 of the flexible circuit board 130 is disposed opposite to the second surface of the first substrate 110; wherein the second surface is opposite to the first surface and meets the third surface 112. In the embodiment of the present invention, the flexible circuit board 130 includes a first portion 131 and a second portion 132, and the first portion 131 of the flexible circuit board 130 is attached to the third surface 112 of the first substrate 110, so as to achieve a firm connection between the flexible circuit board 130 and the first substrate 110 and ensure an electrical connection with the line connection portion 113; meanwhile, the second portion 132 of the flexible circuit board 130 is bent to the second surface of the first substrate 110 and is disposed opposite to the second surface of the first substrate 110, so as to further reduce the size of the lower frame area of the display module. It should be noted that in the embodiment of the present invention, the second portion 132 of the flexible circuit board 130 is larger than the first portion 131, and in a specific example, the second portion 132 may be a main body portion of the flexible circuit board 130.
Referring to fig. 2 and 5, in a preferred embodiment of the present invention, the circuit connection portion 113 may include at least one first connection pin 1131, and the first connection pin 1131 is electrically connected to a second connection pin on the flexible circuit board 130. In the embodiment of the present invention, at least one first connection pin 1131 is electrically connected to a second connection pin disposed on the flexible circuit board 130, so as to ensure normal display driving of the display module, where the number of the first connection pins 1131 is adapted to the number of the second connection pins disposed on the flexible circuit board 130. Optionally, in the embodiment of the present invention, the flexible circuit board 130 includes a first portion 131 and a second portion 132, and in this case, the second connection pin may be disposed on the first portion 131.
In a preferred embodiment of the present invention, in order to ensure a firm connection between the flexible circuit board 130 and the third surface 112 of the first substrate 110 and ensure an electrical connection between the flexible circuit board 130 and the line connection portion 113, as shown in fig. 4, the first portion 131 of the flexible circuit board 130 and the third surface 112 are attached by the conductive adhesive 140. Preferably, the conductive Paste 140 may be an ACF (anisotropic conductive Film), or the conductive Paste 140 may be an ACP (anisotropic conductive Paste).
In addition, in order to avoid the problem that the circuit layer 111 is easily worn at the connection portion, i.e. the bending position, between the first surface and the third surface 112 of the first substrate 110, in a preferred embodiment of the present invention, as shown in fig. 4, the connection portion between the first surface and the third surface 112 corresponding to the circuit connection portion 113 is in an arc shape (not labeled in the figure).
Advantageously, in the preferred embodiment of the present invention, the first substrate 110 and the second substrate 120 are the same size, which facilitates the mutual adaptation of the first substrate 110 and the second substrate 120.
In addition, in the embodiment of the present invention, the circuit layer 111 may specifically be a metal circuit layer. Alternatively, the circuit layer 111 may be made of a single metal material, for example, the circuit layer 111 may be made of one of Mo (molybdenum), Al (aluminum), Ti (titanium), and the like. Alternatively, the circuit layer 111 may also be formed by stacking a plurality of metal materials, for example, the circuit layer 111 may be formed by stacking metal MoAlMo.
In addition, in the embodiment of the present invention, the display module may further include a series of basic components, such as a buffer structure for protection, a transparent cover plate, and a housing for accommodating each component, which are not described in detail in the embodiment of the present invention.
According to the display module provided by the embodiment of the invention, the flexible circuit board is attached to the third surface of the first substrate and is electrically connected through the line connecting part extending from the line layer to the third surface, so that the area of the first surface of the first substrate occupied by the flexible circuit board can be avoided, the size of the lower frame area of the display module is reduced, and the design of the lower narrow frame is realized.
In addition, the embodiment of the invention also provides electronic equipment which can comprise the display module.
In the embodiment of the present invention, since the structure of the electronic device body is the prior art, and the structural principle of the display module is described in detail in the above embodiments, the detailed description of the structure of the electronic device in this embodiment is omitted.
In the embodiment of the present invention, the electronic device may be a mobile phone or a tablet computer. Of course, the device is not limited to a mobile phone and a tablet Computer, and may be an electronic device such as a Laptop Computer (Laptop Computer) or a Personal Digital Assistant (PDA).
In the embodiment of the invention, the electronic device with the display module can further realize the design of the lower narrow frame of the electronic device because the display module can prevent the flexible circuit board from occupying the area of the first surface of the first substrate and reduce the size of the lower frame area of the display module.
In addition, referring to fig. 6, which is a schematic flow chart illustrating a manufacturing method of a display module according to an embodiment of the present invention, the embodiment of the present invention further provides a manufacturing method of a display module, which may include the following steps:
In this step, as shown in fig. 7, reference numeral 11 is a first target substrate, reference numeral 13 is a groove, and by forming the groove 13 in a predetermined position area on the first target substrate 11, one side (first side) of the groove 13 connected to the first target substrate 11 becomes a part of the third surface of the first substrate. The distance between the bottom surface of the groove and the preset surface of the first target substrate (namely, the height dimension of the side surface of the groove) and the width dimension of the side surface of the groove can be set according to actual design requirements, the height dimension of the side surface of the groove can be generally set according to the thickness of the first substrate of the display module, the contact area of the electrical connection of the flexible circuit board and the like, and the width dimension of the side surface of the groove can be set according to the width of the first substrate of the display module.
In this step, as shown in fig. 8, the first side surface of the groove is a side surface where the groove is connected to the preset surface of the first target substrate, and a circuit layer 111 for implementing display driving of the display module is formed by performing circuit coating on the preset surface of the first target substrate 11 and the first side surface of the groove 13, where a portion of the circuit layer 111 located on the first side surface is formed as a circuit connection portion electrically connected to the flexible circuit board.
In an embodiment of the invention, the circuit layer may be a metal circuit layer, and the circuit layer may be plated on the predetermined surface of the first target substrate and the first side surface of the groove in a plating manner such as vacuum sputtering, and the circuit pattern may be obtained by exposure, etching, and stripping after the plating is completed, and at this time, the circuit connection portion includes at least one first connection pin. In addition, in the embodiment of the present invention, optionally, the circuit layer may be made of a single-layer metal material, for example, the circuit layer may be made of one of Mo, Al, Ti, and the like; or, optionally, the circuit layer may also be formed by stacking a plurality of metal materials, for example, a metal MoAlMo; the thickness of the circuit layer can be 1nm to 999nm, and is preferably 350 nm.
In this step, after the circuit layer 111 is formed on the first target substrate 11 based on the step 603, as shown in fig. 9, the first target substrate 11 and the second target substrate 12 are bonded, and then the second target substrate 12 is bonded to the predetermined surface of the first target substrate 11, and then as shown in fig. 10, the first target substrate 11 and the second target substrate 12 are separated along the first side of the groove 13 to form the first substrate 110 and the second substrate 120 as shown in fig. 11, respectively, in which the predetermined surface is the first surface of the first substrate 110, the first side surface of the groove 13 is a part of the third surface of the first substrate 110, and the first surface is connected to the third surface.
And 605, connecting a flexible circuit board to the third surface in a fitting manner, and electrically connecting the flexible circuit board to the line connecting part to obtain the display module.
In the embodiment of the invention, the flexible circuit board is connected to the third surface of the first substrate in an attaching manner and is electrically connected through the line connecting part extending from the line layer to the third surface, so that the area of the first surface of the first substrate occupied by the flexible circuit board can be avoided, the size of the lower frame area of the display module is reduced, and the design of the lower narrow frame is realized; and the layout of the circuit layer is realized by utilizing the large first target substrate and the large second target substrate, and then the first substrate and the second substrate which are formed into small pieces are cut, so that the display module is obtained, the batch operation efficiency of the display module can be improved, and the manufacturing cost is saved.
In a preferred embodiment of the present invention, in order to avoid that the circuit layer is easily worn at a connection portion, i.e., a bending position, between the predetermined surface of the first target substrate and the first side of the groove, step 602, after forming a groove on the first target substrate, the manufacturing method may further include: and processing the joint of the first side surface of the groove and the preset surface into an arc shape. Therefore, the circuit layer formed by subsequent metal circuit coating can be in arc transition to the first side edge, and the connecting part between the first surface and the third surface of the first substrate formed by cutting the first target substrate and corresponding to the circuit connecting part is in an arc shape. Specifically, in the embodiment of the present invention, the joint between the predetermined surface of the first target substrate and the first side surface of the groove may be laser-engraved to form a fillet, so that the joint between the predetermined surface of the first target substrate and the first side surface of the groove is processed to be arc-shaped.
In a preferred embodiment of the present invention, in step 605, attaching a flexible circuit board to the third surface and electrically connecting the flexible circuit board to the line connection portion to obtain the display module, the method may include: and coating conductive adhesive on the third surface of the first substrate, so that the flexible circuit board is attached to the third surface of the first substrate through the conductive adhesive. In the embodiment of the invention, the conductive adhesive is coated on the third surface of the first substrate, so that the flexible circuit board and the third surface can be firmly connected, and the electrical connection between the flexible circuit board and the circuit connecting part can be ensured. Preferably, the conductive adhesive may be ACF, or the conductive adhesive may also be ACP.
Specifically, in a preferred embodiment of the present invention, in step 605, attaching a flexible circuit board to the third surface and electrically connecting the flexible circuit board to the line connection portion to obtain the display module, the method may include the following steps: the first part of the flexible circuit board is attached to the third surface and is electrically connected with the line connecting part; bending the second part of the flexible circuit board to be opposite to the second surface of the first substrate; wherein the second surface is opposite to the first surface and is connected with the third surface. In this way, the first part of the flexible circuit board is in fit connection with the third surface of the first substrate, so that the flexible circuit board is firmly connected with the first substrate and the electric connection between the flexible circuit board and the circuit connecting part is ensured; meanwhile, the second part of the flexible circuit board is bent and arranged on the second surface of the first substrate, and therefore the size of the lower frame area of the display module is further reduced. It should be noted that in the embodiment of the present invention, the second portion of the flexible circuit board is larger than the first portion, and in a specific example, the second portion may be a main body portion of the flexible circuit board.
According to the manufacturing method of the display module, the area of the first surface of the first substrate occupied by the flexible circuit board can be avoided, the size of the lower frame area of the display module is reduced, and the design of the lower narrow frame is realized; moreover, the batch operation efficiency of the display module can be improved, and the manufacturing cost is saved.
It should be appreciated that reference throughout this specification to "one embodiment," "an embodiment," or "some embodiments" means that a particular feature, structure, or characteristic described in connection with the embodiment is included in at least one embodiment or example of the present invention. Thus, the appearances of the phrases "in one embodiment," "in one embodiment," or "in some embodiments" in various places throughout this specification are not necessarily all referring to the same embodiment. Furthermore, elements, structures, or features illustrated in one drawing or one embodiment of the invention may be combined in any suitable manner with elements, structures, or features illustrated in one or more other drawings or embodiments.
It should be noted that, in one or more embodiments herein, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element.
In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," "secured," "disposed," and the like are to be construed broadly and can, for example, be fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
In addition, the present invention may repeat reference numerals and/or letters in the various examples or embodiments. This repetition is for the purpose of simplicity and clarity and does not in itself dictate a relationship between the various embodiments and/or configurations discussed.
Moreover, in the embodiments of the present invention, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions.
While the present invention has been described with reference to the embodiments shown in the drawings, the present invention is not limited to the embodiments, which are illustrative and not restrictive, and it will be apparent to those skilled in the art that various changes and modifications can be made therein without departing from the spirit and scope of the invention as defined in the appended claims.
Claims (8)
1. A display module, comprising:
the circuit board comprises a first substrate, a second substrate and a third substrate, wherein a circuit layer is arranged on the first surface of the first substrate, the circuit layer extends to the third surface of the first substrate to form a circuit connecting part, and the third surface is connected with the first surface;
the second substrate is attached to the first surface;
the flexible circuit board is attached to the third surface and electrically connected with the circuit connecting part;
the first substrate comprises a first surface, a second surface and a plurality of side faces respectively connected with the first surface and the second surface, and the third surface is one of the side faces of the first substrate;
the first part of the flexible circuit board is in fit connection with the third surface and is electrically connected with the circuit connecting part, and the second part of the flexible circuit board is bent to the second surface of the first substrate and is arranged opposite to the second surface of the first substrate; wherein the second surface is opposite the first surface and meets the third surface; the second portion of the flexible circuit board is larger than the first portion.
2. The display module assembly according to claim 1, wherein the circuit connection portion comprises at least one first connection pin electrically connected to a second connection pin on the flexible circuit board.
3. The display module assembly according to claim 1, wherein the first portion of the flexible circuit board is attached to the third surface by a conductive adhesive.
4. The display module according to claim 1, wherein a connection between the first surface and the third surface corresponding to the line connection portion is arc-shaped.
5. The display module of claim 1, wherein the first substrate and the second substrate are the same size.
6. An electronic device, comprising the display module according to any one of claims 1 to 5.
7. A manufacturing method of a display module applied to the display module according to any one of claims 1 to 5, comprising:
providing a first target substrate and a second target substrate;
forming a groove on the first target substrate;
performing metal circuit coating on the first side surface of the groove and the preset surface of the first target substrate to form a circuit layer, wherein the first side surface of the groove is connected with the preset surface of the first target substrate, and the part of the circuit layer positioned on the first side surface is formed into a circuit connecting part;
attaching the first target substrate and the second target substrate, and cutting the first target substrate and the second target substrate along a first side surface of the groove to form a first substrate and a second substrate, wherein the preset surface is formed as a first surface of the first substrate, and the first side surface is formed as a part of a third surface of the first substrate;
a flexible circuit board is connected with the third surface in a fitting mode and is electrically connected with the circuit connecting part, and the display module is obtained;
the first substrate comprises a first surface, a second surface and a plurality of side faces respectively connected with the first surface and the second surface, and the third surface is one of the side faces of the first substrate;
with a flexible circuit board with third surface laminating is connected, and with the line connection portion electricity is connected, obtains display module assembly includes:
the first part of the flexible circuit board is attached to the third surface and is electrically connected with the circuit connecting part;
bending a second part of the flexible circuit board to be arranged opposite to the second surface of the first substrate; wherein the second surface is opposite to the first surface and meets the third surface.
8. The method of manufacturing of claim 7, further comprising, after forming a recess in the first target substrate:
processing the joint of the first side surface of the groove and the preset surface into an arc shape;
bending a second part of the flexible circuit board to be arranged opposite to the second surface of the first substrate; wherein the second surface is opposite to the first surface and meets the third surface.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811238003.3A CN109215521B (en) | 2018-10-23 | 2018-10-23 | Display module, electronic equipment and manufacturing method of display module |
| PCT/CN2019/111845 WO2020083104A1 (en) | 2018-10-23 | 2019-10-18 | Display module, electronic device, and method for manufacturing display module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811238003.3A CN109215521B (en) | 2018-10-23 | 2018-10-23 | Display module, electronic equipment and manufacturing method of display module |
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| CN109215521A CN109215521A (en) | 2019-01-15 |
| CN109215521B true CN109215521B (en) | 2022-03-25 |
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| CN109215521B (en) * | 2018-10-23 | 2022-03-25 | 维沃移动通信有限公司 | Display module, electronic equipment and manufacturing method of display module |
| CN109979316A (en) * | 2019-03-22 | 2019-07-05 | 维沃移动通信有限公司 | The display screen of terminal device, the preparation method of display screen and terminal device |
| CN110148608B (en) * | 2019-06-29 | 2021-08-10 | 上海天马微电子有限公司 | Display panel and display device |
| KR20210016237A (en) * | 2019-08-02 | 2021-02-15 | 삼성디스플레이 주식회사 | Display device, manufacturing method thereof, and multi display device |
| US11126046B2 (en) | 2019-08-22 | 2021-09-21 | Wuhan China Star Optoelectronics Technology Co., Ltd. | Display panel, manufacturing method thereof, and display device |
| CN110579916A (en) * | 2019-08-22 | 2019-12-17 | 武汉华星光电技术有限公司 | display panel, preparation method thereof and display device |
| CN110782789A (en) * | 2019-10-21 | 2020-02-11 | Oppo广东移动通信有限公司 | Display module and electronic equipment |
| CN110794988B (en) * | 2019-10-22 | 2021-12-03 | 维沃移动通信有限公司 | Display module assembly and electronic equipment |
| CN110796948B (en) * | 2019-10-30 | 2022-03-22 | 维沃移动通信有限公司 | Display module, electronic equipment and display module processing method |
| CN110938382B (en) * | 2019-11-25 | 2022-04-22 | 维沃移动通信有限公司 | Conductive adhesive film, display module and electronic equipment |
| CN111158522B (en) * | 2019-12-30 | 2023-10-03 | 上海摩软通讯技术有限公司 | Flexible circuit board, touch component and electronic equipment |
| CN111459334B (en) * | 2020-04-03 | 2024-03-19 | 维沃移动通信有限公司 | Display module and electronic equipment |
| CN111857247A (en) * | 2020-07-07 | 2020-10-30 | 北京小米移动软件有限公司 | Display module and electronic equipment |
| CN113674614B (en) * | 2020-08-14 | 2023-03-21 | 友达光电股份有限公司 | Display device and method for manufacturing the same |
| CN113140454B (en) * | 2021-03-24 | 2024-06-07 | 南京昀光科技有限公司 | Display panel manufacturing method and display panel |
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| Publication number | Publication date |
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| CN109215521A (en) | 2019-01-15 |
| WO2020083104A1 (en) | 2020-04-30 |
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