CN113674614B

CN113674614B - Display device and method for manufacturing the same

Info

Publication number: CN113674614B
Application number: CN202110923235.8A
Authority: CN
Inventors: 谢文章
Original assignee: AU Optronics Corp
Current assignee: AU Optronics Corp
Priority date: 2020-08-14
Filing date: 2021-08-12
Publication date: 2023-03-21
Anticipated expiration: 2041-08-12
Also published as: CN113674614A

Abstract

The invention discloses a display device and a manufacturing method thereof, wherein the display device comprises a display panel, a conductive pattern, a protective layer and a flexible substrate. The display panel is provided with a first surface, a second surface, a display area and a peripheral area, wherein the display area and the peripheral area are adjacent to each other, the display area is positioned on the first surface, the peripheral area comprises conductor pads arranged on the peripheral area, and the peripheral area is closer to the second surface than the display area. The conductive pattern is disposed on the display panel and electrically connected to the conductive pad, and the conductive pattern extends from the first surface to the second surface. The protective layer covers the conductor pad and part of the conductive pattern and extends to at least part of the second surface. The flexible substrate is arranged on the second surface and is electrically connected with the conductive pattern.

Description

Display device and method for manufacturing the same

Technical Field

The present invention relates to a display device and a method of manufacturing the display device.

Background

In response to the diversified applications of display devices, various manufacturing techniques and product designs are continuously developed. In order to provide more versatile applications, narrow-frame or frameless products are proposed. For example, a narrow-frame or frameless product can be applied to a tiled product (e.g., a tiled display panel) in addition to providing a larger area of functional area (e.g., a display area, a touch area, etc.).

Disclosure of Invention

The invention provides a display device.

The invention provides a manufacturing method of a display device, which can manufacture a display device with a narrow frame.

The display device comprises a display panel, a conductive pattern, a protective layer and a flexible substrate. The display panel is provided with a first surface, a second surface, a display area and a peripheral area, wherein the display area and the peripheral area are adjacent to each other, the display area is positioned on the first surface, the peripheral area comprises conductor pads arranged on the peripheral area, and the peripheral area is closer to the second surface than the display area. The conductive pattern is disposed on the display panel and electrically connected to the conductive pad, and the conductive pattern extends from the first surface to the second surface. The protective layer covers the conductor pad and part of the conductive pattern and extends to at least part of the second surface. The flexible substrate is arranged on the second surface and is electrically connected with the conductive pattern.

The method for manufacturing a display device of the present invention includes the following steps, but is not limited thereto. The display panel is provided with a first surface, a second surface, a display area and a peripheral area, wherein the display area and the peripheral area are adjacent to each other, the display area is positioned on the first surface, the peripheral area comprises conductor pads arranged on the peripheral area, and the peripheral area is closer to the second surface than the display area. Conductive patterns are formed on the display panel, wherein the conductive patterns are respectively electrically connected with the conductor pads and extend from the first surface to the second surface. And forming a protective layer to cover the conductor pads and the parts of the conductive patterns and extend to at least part of the second surface. After the protective layer is formed, a flexible substrate is arranged on the second surface so as to be electrically connected with the conductive pattern.

In an embodiment of the invention, a normal direction of the second surface is different from a normal direction of the first surface, the conductive pattern has a first turning section at a connection between the first surface and the second surface to form an L-shaped cross-sectional structure, and the passivation layer has a second turning section covering the first turning section.

In an embodiment of the invention, the flexible substrate has a first side connected to the conductive pattern and facing the second surface, the conductive pattern has a second side facing the first side, and the second turning section of the passivation layer is located between the first side of the flexible substrate and the second side of the conductive pattern.

In an embodiment of the invention, the conductive pattern has a first portion located on the first surface, the passivation layer includes a first sub-passivation layer covering the first portion, and the first sub-passivation layer continuously extends to two sides of the first portion.

In an embodiment of the invention, the conductive pattern has a second portion located on the second surface, and the passivation layer includes second sub-passivation layers disposed on two sides of the second portion.

In view of the above, in the display device and the manufacturing method thereof of the present invention, the protective layer is formed on the first surface of the display panel and extends to at least a portion of the second surface of the display panel, so that the conductive pads and the conductive patterns can be completely protected. Then, a flexible substrate is disposed on the second surface. Therefore, the display device can have a larger element arrangement area on the first surface for arranging the functional elements, and the display device can have a narrow frame design.

Drawings

In order to make the aforementioned and other features and advantages of the invention more comprehensible, embodiments accompanied with figures are described in detail below.

Fig. 1 to 3 show some steps of manufacturing a display device according to an embodiment of the invention.

Fig. 4 is a partial top view schematically illustrating a display device according to an embodiment of the invention.

Fig. 5 is a partial cross-sectional view of a display device according to an embodiment of the invention.

Fig. 6 to 8 are schematic perspective views of display devices according to other embodiments of the present invention.

Description of the symbols

100. 100B, 100C, 100D display device

110 display panel

112 first surface

1121 first side

1122 second side

114 second surface

1141 first edge

1142 second side

116 third surface

120: conductor pad

130 conductive pattern

131 first part

132 second part

134 second side

140. 140B, 140C, 140D protective layer

141B, 141C, 141D a first sub-protective layer

142C, 142D the second sub-passivation layer

160 flexible substrate

162 first side

170 conductive bonding layer

A1 display region

B1 first turning section

B2 second turning section

E1 peripheral area

I-I' wire

X, Y, Z Direction

Detailed Description

The present invention will now be described more fully hereinafter with reference to the accompanying drawings, in which exemplary embodiments of the invention are shown. As those skilled in the art will recognize, the described embodiments may be modified in various different ways, without departing from the spirit or scope of the present invention.

In the drawings, the thickness of layers, films, panels, regions, etc. have been exaggerated for clarity. Like reference numerals refer to like elements throughout the specification. It will be understood that when an element such as a layer, film, region, or substrate is referred to as being "on" or "connected to" another element, it can be directly on or connected to the other element or intervening elements may also be present. In contrast, when an element is referred to as being "directly on" or "directly connected to" another element, there are no intervening elements present. As used herein, "connected" may refer to physical and/or electrical connections. Further, "electrically connected" or "coupled" may mean that there are additional elements between the two elements.

Furthermore, relative terms, such as "lower" or "bottom" and "upper" or "top," may be used herein to describe one element's relationship to another element, as illustrated. It will be understood that relative terms are intended to encompass different orientations of the device in addition to the orientation depicted in the figures. For example, if the device in one of the figures is turned over, elements described as being on the "lower" side of other elements would then be oriented on "upper" sides of the other elements. Thus, the exemplary term "lower" can encompass both an orientation of "lower" and "upper," depending on the particular orientation of the figure. Similarly, if the device in one of the figures is turned over, elements described as "below" or "beneath" other elements would then be oriented "above" the other elements. Thus, the exemplary terms "above" or "below" may include both an orientation of above and below.

As used herein, "about", "approximately", or "substantially" includes the stated value and the average value within an acceptable range of deviation of the specified value as determined by one of ordinary skill in the art, taking into account the measurement in question and the specified amount of error associated with the measurement (i.e., the limitations of the measurement system). For example, "about" may mean within one or more standard deviations of the stated value, or within ± 30%, ± 20%, ± 10%, ± 5%. Further, as used herein, "about", "approximately" or "substantially" may be selected based on optical properties, etch properties, or other properties, with a more acceptable range of deviation or standard deviation, and not all properties may be applied with one standard deviation.

Exemplary embodiments are described herein with reference to cross-sectional views that are schematic illustrations of idealized embodiments. Thus, variations from the shapes of the illustrations as a result, for example, of manufacturing techniques and/or (and/or) tolerances, are to be expected. Thus, the embodiments described herein should not be construed as limited to the particular shapes of regions as illustrated herein but are to include deviations in shapes that result, for example, from manufacturing. For example, a region shown or described as flat may generally have rough and/or nonlinear features. Further, the acute angles shown may be rounded. Thus, the regions illustrated in the figures are schematic in nature and their shapes are not intended to illustrate the precise shape of a region and are not intended to limit the scope of the claims.

Unless defined otherwise, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. It will be further understood that terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the relevant art and the present invention and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.

In the drawings, the X direction, the Y direction, and the Z direction are denoted to show the arrangement of the members in the drawing, and the X direction, the Y direction, and the Z direction intersect with each other, but are not limited to being orthogonal to each other. Fig. 1 to 3 show some steps of manufacturing a display device according to an embodiment of the invention. Fig. 4 is a partial top view schematically illustrating a display device according to an embodiment of the invention. In fig. 1, the conductive pads 120 are formed on the display panel 110 in advance. The display panel 110 has a certain mechanical strength and can support an object, such as a plurality of films and/or a plate on which a plurality of objects are disposed. In some embodiments, the display panel 110 is a single substrate, and the material includes glass, polymer material, ceramic, and the like. The display panel 110 is cut into a proper size, and then the conductive pads 120 are disposed thereon. The display panel 110 has a first surface 112, a second surface 114, a third surface 116, and a display area A1 and a peripheral area E1 (the display area A1 and the peripheral area E1 are schematically distinguished by a dotted line) on the first surface 112. The second surface 114 is connected between the first surface 112 and the third surface 116. The peripheral region E1 is closer to the second surface 114 than the display region A1.

Here, the normal direction of the second surface 114 is different from the normal direction of the first surface 112 and is also different from the normal direction of the third surface 116. In some embodiments, the normal direction of the first surface 112 and the normal direction of the third surface 116 may be parallel to each other, but not limited thereto. For example, the first surface 112 and the third surface 116 are planes parallel to the X-Y direction, and the second surface 114 is a plane parallel to the Y-Z direction, respectively. In still other embodiments, the features provided on the second surface 114 may be applied to other second surfaces, such as a second surface that is parallel to a plane in the X-Z direction. In some embodiments, a pixel circuit structure (not shown in fig. 1) including an electrical connection to the conductor pad 120 may be further disposed on the first surface 112 of the display panel 110.

In fig. 1, the number of the conductive pads 120 is plural, and the plural conductive pads 120 may be arranged along the Y direction. The conductive pad 120 is located on the first surface 112, and the conductive pad 120 is disposed in the peripheral region E1 of the display panel 110. In addition, the conductive pads 120 may be disposed on a single side of the display panel 110, or disposed on two opposite sides of the display panel 110, and the number and the arrangement of the conductive pads 120 may be determined according to practical requirements, which is not limited in the present invention.

In fig. 2, a plurality of conductive patterns 130 are formed on the display panel 110, and the conductive patterns 130 have a first portion 131 on the first surface 112 and a second portion 132 on the second surface 114. The conductive pattern 130 is disposed in the peripheral region E1 of the display panel 110. The plurality of stripe-shaped conductive patterns 130 may be arranged along the Y direction and correspond to the conductive pads 120. The conductive patterns 130 are disposed in one-to-one correspondence with the conductive pads 120. In other words, the number of the conductive patterns 130 may be the same as the number of the conductive pads 120, so that each conductive pattern 130 overlaps only one conductive pad 120.

Here, the conductive pattern 130 may be formed on the display panel 110 by edge transfer, sputtering or ink-jet. The conductive pattern 130 is, for example, silver paste, which is not limited in the present invention. The conductive pattern 130 may continuously extend from the first surface 112 to the second surface 114. The conductive pattern 130 may contact and directly cover the conductive pad 120 to electrically connect the conductive pad 120. In some embodiments, an orthographic projection of the conductive pattern 130 on the first surface 112 along the Z direction may overlap an orthographic projection of the conductor pad 120 on the first surface 112 along the Z direction. In some embodiments, the conductive pattern 130 may be electrically connected to a pixel circuit structure disposed on the display panel 110.

In fig. 3 and fig. 4, a protection layer 140 is formed on the display panel 110, and the protection layer 140 covers a portion of the conductive pad 120 and the conductive pattern 130 and extends to at least a portion of the second surface 114. The conductive pattern 130 has a first turning section B1 at a connection between the first surface 112 and the second surface 114 to form an L-shaped cross-sectional structure. The passivation layer 140 has a second turning section B2 covering the first turning section B1. Specifically, the display panel 110 further has a chamfered portion connected between the first surface 112 and the second surface 114. The first turning section B1 and the second turning section B2 both correspond to a chamfered portion between the first surface 112 and the second surface 114.

Since the protection layer 140 may extend from the first surface 112 to a part of the second surface 114 beyond the edge of the first surface 112, the protection layer 140 may cover the conductive pattern 130 exposed on the front surface of the display panel 110. As shown in fig. 4, an orthographic projection of the passivation layer 140 on the first surface 112 along the Z direction may completely overlap an orthographic projection of the conductive pad 120 and the conductive pattern 130 on the first surface 112 along the Z direction.

In some embodiments, the protection layer 140 may be formed on the display panel 110 by a transfer printing method. The protection layer 140 is, for example, tuffy glue, UV glue or other waterproof insulating glue. In some manufacturing processes, the protection layer 140 may be coated or applied on a printing tool, and then the printing tool is pressed against the second surface 114 of the display panel 110, so that the protection layer 140 on the printing tool is attached to the first surface 112 of the display panel 110. Alternatively, the printing tool may be made of an elastic material, such as rubber or the like. Therefore, when the printing tool is pressed against the second surface 114 of the display panel 110, the edge end is lightly pressed to attach the protection layer 140 on the printing tool to the edge of the first surface 112 of the display panel 110. For example, the printing tool can move toward the display panel 110 along the X direction during the printing process to transfer the protection layer 140 to the first surface 112 and the second surface 114. Next, after removing the printing tool, a curing step may be performed on the protection layer 140 attached to the display panel 110. In other embodiments, the protection layer 140 may be attached to the display panel 110 by spraying or other suitable methods, which are not limited to the above.

With the above-described arrangement, the display device 100 shown in fig. 5 is obtained. Fig. 5 is a partial cross-sectional view of a display device according to an embodiment of the invention, wherein the cross-sectional structure of fig. 5 may correspond to the line I-I' of fig. 3. In fig. 5, the display device 100 may include a display panel 110, a conductor pad 120, a conductive pattern 130, a passivation layer 140 and a flexible substrate 160, wherein the relative arrangement relationship of the display panel 110, the conductor pad 120, the conductive pattern 130 and the passivation layer 140 can be described with reference to fig. 1 to 4.

Specifically, the display panel 110 is a single substrate, such as a glass substrate, a quartz plate, a ceramic substrate, a polymer substrate, a composite substrate, or other plate-shaped objects with sufficient mechanical strength and support. The display panel 110 has a first surface 112, a second surface 114, and a third surface 116. The second surface 114 is connected between the first surface 112 and the third surface 116, and the normal direction of the second surface 114 is different from the first surface 112 and the third surface 116. The normal directions of the first surface 112 and the third surface 116 may be the same, such as parallel to the Z direction, and the normal direction of the second surface 114 is parallel to the X direction, but not limited thereto. In some embodiments, the display panel 110 may be a transparent substrate, but in other embodiments, the display panel 110 may be an opaque substrate.

The conductive pads 120 are disposed on the first surface 112 of the display panel 110 and are used for providing an electrical transmission channel to electrically connect the pixel circuit structure (not shown) on the display panel 110 to other components, such as the flexible substrate 160. Here, the flexible substrate 160 includes, for example, a driver chip. In the process of forming the conductive pads 120 on the first surface 112 of the display panel 110, the pixel circuit structure can be formed on the first surface 112. So-called pixel circuit structures may include active (active) elements, capacitors, signal lines, etc. Meanwhile, the conductor pad 120 may be connected to a signal line in the pixel circuit structure for transmitting an electrical signal to the pixel circuit structure. In some embodiments, the display device 100 further comprises a functional element disposed on the first surface 112 to provide a desired function. For example, the functional element may include a display element or the like. The pixel circuit structure can be used to drive functional elements, so that the display device 100 provides display functions, and the like.

The conductive pattern 130 is disposed on the display panel 110 and directly contacts the conductive pad 120. The flexible substrate 160 can be bonded to the conductive pattern 130, thereby electrically connecting to the conductive pads 120 on the first surface 112. The flexible substrate 160 is disposed on the second surface 114 and electrically connected to the conductive pattern 130. The flexible substrate 160 can be bonded to the conductive pattern 130 through the conductive bonding layer 170. In the X direction, the conductive bonding layer 170 is overlapped with the protection layer 140 (Overlap). The material of the conductive bonding layer 170 may include anisotropic conductive paste, solder or other materials that provide conductive bonding.

The seamless splicing of led displays can be scaled up, and in order to achieve Zero Border (Zero Border), the area where the front of the display is bonded (Bonding) to a Chip On Film (COF) package must be reduced. In some implementations, after the COF is bonded to the front surface of the display, the COF is bent along the corners of the edges of the display panel to reduce the presence of the stitching seams. Then, the COF is fixed on the front surface of the display by coating the colloid, and the colloid covers the exposed metal area so as to prevent the metal from causing poor electrical property due to environmental factors. However, since the Bonding area of the front surface of the display is too small, the Bonding force between the adhesive and the display may be insufficient, and the COF Bonding area is easily peeled (Peeling). This may cause problems such as poor contact or impedance rise, and in order to improve the above problems, a Side Bonding (Side Bonding) technique may be adopted to extend the conductive pads to the Side of the display. However, in the case of COFs already disposed on the display side, the COF height is not controllable due to the tolerance of the dicing and bonding alignment, and therefore, a glue with a lower viscosity is required to ensure the glue to penetrate into all the gaps. However, the above method has problems that the Bonding area is narrow, the colloid with low viscosity is easy to overflow to the display area or other unexpected areas, which will affect the process yield, and the COF Bonding has more gaps, so it is not easy to implement complete protection measures. If the viscosity of the adhesive is increased, the adhesive thickness is not easy to control, which is not beneficial to the subsequent process and can not fill the gap. For example, the difficulty in controlling the thickness of the glue can result in uneven surfaces, and interference problems can easily occur when the light emitting diodes are disposed thereon.

In the display device 100 of the embodiment, the protective layer 140 is disposed before the flexible substrate 160 is bonded to the display panel 110, so that the protective layer 140 is at least continuously disposed on the first surface 112 to the second surface 114 of the display panel 110 and covers the conductor pads 120 and a portion of the conductive patterns 130. Specifically, the extending direction of the flexible substrate 160 in the Z direction of the present embodiment does not overlap with the extending direction of the protective layer 140 in the Z direction. In other words, the display device 100 of the embodiment can omit the step of bending the flexible substrate 160 to the first surface 112 of the display panel 110, and the flexible substrate 160 is not covered by the protection layer 140, but is not limited thereto.

In the present embodiment, the protection layer 140 extends from the first surface 112 to a part of the second surface 114 over the edge of the first surface 112. This has the advantage that the exposed metal region can be more completely covered, and since the flexible substrate 160 is not bonded, the problems of small gap and uneasy filling are not needed to be considered, and the protective layer 140 with proper viscosity can be selected to preferably control the thickness of the protective layer 140, so as to facilitate the subsequent process (for example, configuring the led) and improve the process yield. In addition, since the flexible substrate 160 is bonded to the second surface 114, the amount of the filling of the passivation layer 140 is not affected by the height of the flexible substrate 160. Therefore, the manufacturer is not limited to select only the passivation layer 140 with low viscosity, and can select the passivation layer 140 with proper viscosity to protect the exposed metal region. Then, the flexible substrate 160 is bonded.

In other words, if the flexible substrate 160 is disposed after the protective layer 140 is disposed, the protective layer 140 with appropriate fluidity and viscosity can be selected, and the selection range of the viscosity of the protective layer 140 is not limited. In the process of configuring the protection layer 140, the protection layer 140 will not flow randomly, and the problems that the protection layer 140 is easy to overflow, the thickness is not easy to control, or gaps cannot be filled up reliably, etc. can be solved.

In addition, in fig. 5, the flexible substrate 160 has a first side 162 connected to the conductive pattern 130 and facing the second surface 114, the conductive pattern 130 has a second side 134 facing the first side 162, and the second turning section B2 of the passivation layer 140 is located between the first side 162 of the flexible substrate 160 and the second side 134 of the conductive pattern 130.

Fig. 6 to 8 are schematic perspective views of display devices according to other embodiments of the present invention. It should be noted that the illustration of the flexible substrate is omitted in fig. 6 to 8. Referring to fig. 6, the display device 100B may include the display panel 110, the conductor pads 120, the conductive patterns 130 and the passivation layer 140B, and may be manufactured by the manufacturing method of fig. 1 to 4, so that the relative arrangement relationship between the display panel 110, the conductor pads 120 and the conductive patterns 130 may be described with reference to fig. 1 to 4. The display device 100B differs from the display device 100 mainly in the distribution of the protective layer 140B.

In the present embodiment, the protective layer 140B includes a first sub-protective layer 141B covering the first portion 131 of the conductive pattern 130, and the first sub-protective layer 141B extends to both sides of the first portion 131 of the conductive pattern 130 in the Y direction. Specifically, the first surface 112 has a first side 1121 and a second side 1122 opposite to each other, and the first sub-passivation layer 141B is in a stripe pattern and extends to the first side 1121 and the second side 1122.

Referring to fig. 7, the display device 100C is different from the display device 100B mainly in the distribution of the protection layer 140C. In the present embodiment, the protection layer 140C includes a first sub-protection layer 141C covering the first portion 131 of the conductive pattern 130 and a second sub-protection layer 142C extending from the first sub-protection layer 141C to the second surface 114. The second sub-protection layer 142C exposes a portion of the second portion 132. The second sub-passivation layer 142C is disposed on two sides of the second portion 132 of the conductive pattern 130 in the Y direction, and can block moisture on the sides. In some embodiments, the material of the protection layer 140C includes a dark material, such as ink, so as to achieve anti-reflection and light-shielding effects.

Referring to fig. 8, the display device 100D is different from the display device 100C mainly in the distribution of the protection layer 140D. In the present embodiment, the second surface 114 has a first edge 1141 and a second edge 1142 opposite to each other. The second sub-passivation 142D on one side of the second portion 132 of the conductive pattern 130 extends to the first edge 1141, and the second sub-passivation 142D on the other side of the second portion 132 of the conductive pattern 130 extends to the second edge 1142, so as to block moisture on two sides of the second portion 132 of the conductive pattern 130. In some embodiments, the material of the protection layer 140D includes a dark material, such as ink, so that the anti-reflection and uniform light shielding effects can be achieved.

In summary, in the display device and the manufacturing method thereof of the present invention, the protective layer is formed on the first surface of the display panel and extends to at least a portion of the second surface of the display panel, so as to completely protect the conductive pads and the conductive patterns. Then, a flexible substrate is disposed on the second surface. Therefore, the protective layer can not cover the flexible substrate, and the problems that the filling height of the protective layer and the space gap can not be controlled and the like due to the tolerance of cutting or joint alignment of the flexible substrate can not be caused. Therefore, the manufacturer can select a protective layer with a proper viscosity without being limited to select only a protective layer with a low viscosity, so as to effectively control the ductility of the protective layer and have a preferable protection effect, and further solve the problems that the protective layer is easy to overflow, the thickness is difficult to control, or gaps cannot be filled reliably. In some embodiments, the material of the protective layer includes a dark material, so as to achieve the anti-reflection and light-shielding effects. In some embodiments, the passivation layer has second sub-passivation layers extending to the left and right sides of the portion of the conductive pattern on the second surface, so as to block moisture on the sides, and to prevent reflection and make the light shielding effect more uniform.

Although the present invention has been described with reference to the above embodiments, it should be understood that various changes and modifications can be made therein by those skilled in the art without departing from the spirit and scope of the invention as defined in the appended claims.

Claims

1. A display device, comprising:

the display panel is provided with a first surface, a second surface, a display area and a peripheral area, wherein the display area and the peripheral area are adjacent to each other, the display area is positioned on the first surface, and the display panel comprises a conductor pad arranged on the peripheral area, and the peripheral area is closer to the second surface than the display area;

a conductive pattern disposed on the display panel and electrically connected to the conductive pad, the conductive pattern extending from the first surface to the second surface;

the protective layer covers the conductor connecting pad and part of the conductive pattern and extends to at least part of the second surface; and

a flexible substrate disposed on the second surface and electrically connected to the conductive pattern,

the normal direction of the second surface is different from the normal direction of the first surface, the conductive pattern has a first turning section at the joint between the first surface and the second surface to form an L-shaped cross section structure, the protective layer has a second turning section covering the first turning section, the flexible substrate has a first side connected with the conductive pattern and facing the second surface, the conductive pattern has a second side facing the first side, and the second turning section of the protective layer is located between the first side of the flexible substrate and the second side of the conductive pattern.

2. The display device according to claim 1, wherein the conductive pattern has a first portion on the first surface, the protective layer has a first sub-protective layer covering the first portion, and the first sub-protective layer continuously extends to both sides of the first portion.

3. The display device according to claim 2, wherein the conductive pattern has a second portion on the second surface, and the passivation layer has second sub-passivation layers disposed on both sides of the second portion.

4. A method of manufacturing a display device, comprising:

providing a display panel, which is provided with a first surface, a second surface, a display area and a peripheral area, wherein the display area and the peripheral area are adjacent to each other, the display area is positioned on the first surface, and the display panel comprises a conductor pad arranged on the peripheral area, and the peripheral area is closer to the second surface than the display area;

forming conductive patterns on the display panel, wherein the conductive patterns are respectively electrically connected with the conductor pads and extend from the first surface to the second surface;

forming a protective layer to cover the conductor pad and part of the conductive pattern and extend to at least part of the second surface; and

after the protective layer is formed, a flexible substrate is arranged on the second surface so as to be electrically connected with the conductive pattern.

5. The method according to claim 4, wherein a normal direction of the second surface is different from a normal direction of the first surface, the conductive pattern has a first turning section at a connection between the first surface and the second surface to form an L-shaped cross-sectional structure, and the passivation layer has a second turning section covering the first turning section.

6. The method according to claim 5, wherein the flexible substrate has a first side connected to the conductive pattern and facing the second surface, the conductive pattern has a second side facing the first side, and the second turning segment of the passivation layer is located between the first side of the flexible substrate and the second side of the conductive pattern.

7. The method of claim 4, wherein the conductive pattern has a first portion on the first surface, the passivation layer has a first sub-passivation layer covering the first portion, and the first sub-passivation layer continuously extends to both sides of the first portion.

8. The method of claim 7, wherein the conductive pattern has a second portion on the second surface, and the passivation layer has second sub-passivation layers disposed on two sides of the second portion.