CN107463293B - Touch panel - Google Patents
Touch panel Download PDFInfo
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- CN107463293B CN107463293B CN201710666209.5A CN201710666209A CN107463293B CN 107463293 B CN107463293 B CN 107463293B CN 201710666209 A CN201710666209 A CN 201710666209A CN 107463293 B CN107463293 B CN 107463293B
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- circuit
- cover plate
- touch panel
- transparent cover
- peripheral
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
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- General Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Position Input By Displaying (AREA)
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Abstract
A touch panel includes a transparent cover plate, a transparent conductive layer, a plurality of peripheral circuits and a plurality of first conductive adhesives. The transparent cover plate is provided with a touch area and a peripheral area surrounding the touch area. The transparent conducting layer is arranged on the transparent cover plate. The transparent conductive layer is provided with a plurality of sensing units, each sensing unit comprises a sensing part and an external connection part, and the sensing parts are connected with the external connection parts. The sensing part is positioned in the touch area, the external connecting part is positioned in the peripheral area, and the width of the external connecting part is smaller than that of the peripheral area. The peripheral circuit is arranged on the transparent cover plate and positioned outside the external connection part. The peripheral circuit comprises a first circuit pad. The first circuit pads are electrically connected to the external connection portions by the first conductive adhesive respectively. Because the peripheral circuit and the grounding circuit are formed on the transparent cover plate, the area occupied by the transparent conducting layer on the peripheral area is reduced, the edge width can be narrower, and the product design of a narrow frame is facilitated.
Description
Technical Field
The invention relates to a touch panel.
Background
Generally, in a conventional touch device, a frame is mostly required to be disposed at an edge of the basic structure of the touch device to shield a trace area of the touch device. However, with the popularization of touch display devices such as smart phones and tablet computers, users have increased demands for the appearance and touch area of the touch devices. Therefore, many touch devices are expected to adopt a narrow bezel design to reduce the area of the bezel occupied by the touch device.
In addition, in the conventional touch product, a ground line needs to be arranged at the outermost periphery of the sensing unit to protect against Electrostatic Discharge (ESD) or line interference, so as to reduce noise. However, the width requirement of the ground line is usually at least 0.15mm, and the distance requirements of the ground line to the edge of the touch panel and the distance to the trace line are usually at least 0.3mm and 0.15mm, respectively, that is, the ground space is at least 0.6mm in total, which occupies a large edge space of the touch product and conflicts with the current product design trend of the narrow bezel.
Disclosure of Invention
In view of the above, an objective of the present invention is to provide a touch panel capable of solving the above problems.
In order to achieve the above objective, according to an embodiment of the present invention, a touch panel includes a transparent cover plate, a transparent conductive layer, a plurality of peripheral circuits and a plurality of first conductive adhesives. The transparent cover plate is provided with a touch area and a peripheral area surrounding the touch area. The transparent conducting layer is arranged on the transparent cover plate. The transparent conductive layer is provided with a plurality of sensing units, each sensing unit comprises a sensing part and an external connection part, and the sensing parts are connected with the external connection parts. The sensing part is positioned in the touch area, the external connecting part is positioned in the peripheral area, and the width of the external connecting part is smaller than that of the peripheral area. The peripheral circuit is arranged on the transparent cover plate and positioned outside the external connection part. The peripheral circuit comprises a first circuit pad. The first circuit pads are electrically connected to the external connection portions by the first conductive adhesive respectively.
In one or more embodiments of the present invention, the touch panel further includes: a flexible circuit board and an anisotropic conductive film. The flexible circuit board is provided with a first surface close to the transparent cover plate. The first surface has a plurality of circuit pins. The peripheral circuit further comprises a second circuit pad. The second circuit pad is electrically connected to the circuit pin through the anisotropic conductive film.
In one or more embodiments of the present invention, the touch panel further includes: and a ground line. The grounding circuit is arranged on the transparent cover plate and surrounds the outer side of the peripheral circuit.
In one or more embodiments of the present invention, the touch panel further includes: a plurality of second conductive adhesives. The flexible circuit board further has a second surface far away from the transparent cover plate. The second surface has a plurality of grounding pins. The grounding circuit comprises a plurality of grounding pads. The grounding pads are electrically connected to the grounding pins by the second conductive adhesive respectively.
In one or more embodiments of the present invention, the ground line is formed by two ground blocks that are symmetrical to each other.
In one or more embodiments of the present invention, the width of the external connecting portion is between 0.5mm and 2 mm.
In one or more embodiments of the present invention, the material of the first conductive paste includes silver paste.
In one or more embodiments of the present invention, the material of the second conductive paste includes silver paste.
In one or more embodiments of the present invention, the touch panel further includes: and a light shielding layer. The shading layer is arranged on the transparent cover plate. The light-shielding layer defines a peripheral area, and the peripheral circuit is disposed on the light-shielding layer.
In one or more embodiments of the present invention, the touch panel further includes: and a ground line. The grounding circuit is arranged on the transparent cover plate and surrounds the outer side of the peripheral circuit.
In one or more embodiments of the present invention, the touch panel further includes: a flexible circuit board. The flexible circuit board has a plurality of grounding pins. The grounding circuit comprises a plurality of grounding pads. The grounding pads are respectively and electrically connected to the grounding pins.
In one or more embodiments of the present invention, the ground line is formed by two ground blocks that are symmetrical to each other.
In summary, in the touch panel of the present invention, the peripheral circuit and the ground circuit are formed on the transparent cover plate, so that the area occupied by the transparent conductive layer in the peripheral area is reduced, the edge width can be narrower, and the design of a narrow-frame product is facilitated. In addition, the peripheral circuit and the grounding circuit are formed on the transparent cover plate which is made of a material harder than that of the transparent conductive layer, so that the processing precision and the productivity efficiency are obviously improved. Moreover, the grounding circuit is formed on the transparent cover plate, and the grounding circuit can be made to be a larger advantage, so that the problems of electrostatic discharge, circuit interference and the like are better improved, and the noise reduction effect is further improved.
The foregoing is merely illustrative of the problems, solutions to problems, and other aspects of the present invention, and the specific details thereof are set forth in the following description and the related drawings.
Drawings
In order to make the aforementioned and other objects, features, advantages and embodiments of the invention more comprehensible, the following description is given:
fig. 1 is a bottom view of a touch panel according to an embodiment of the invention.
Fig. 2 is a partially enlarged view of a portion a of fig. 1.
Fig. 3 is a cross-sectional view taken along line 3-3 of fig. 2.
Fig. 4 is a partial bottom view of a touch panel according to another embodiment of the invention.
Fig. 5 is a cross-sectional view taken along line 5-5 of fig. 4.
Fig. 6 is a bottom view of a touch panel according to yet another embodiment of the present invention.
Reference numerals
100: touch panel
110: transparent cover plate
110A: touch control area
110B: peripheral zone
120: transparent conductive layer
121: first sensing unit
121A: a first sensing part
121B: a first external connection part
122: second sensing unit
122A: second sensing part
122B: second outer connecting part
122C: extension part
130: peripheral circuit
131: first line connection pad
132: second line connection pad
133: wiring
140: first conductive adhesive
150: second conductive adhesive
160: flexible circuit board
161: line pin
162: grounding pin
170: anisotropic conductive film
180: grounding circuit
181: grounding pad
180A: a first ground block
180B: second ground block
A: in part
H1, H2: width of
LB: light shielding layer
S1: first surface
S2: second surface
TA: transparent adhesive layer
Detailed Description
In the following description, for purposes of explanation, numerous implementation details are set forth in order to provide a thorough understanding of the present invention. It should be understood, however, that these implementation details are not to be interpreted as limiting the invention. That is, in some embodiments of the invention, such implementation details are not necessary. In addition, some conventional structures and components are shown in simplified schematic form in the drawings.
Fig. 1 is a bottom view of a touch panel 100 according to an embodiment of the invention. Fig. 2 is a partially enlarged view of a portion a of fig. 1. Fig. 3 is a cross-sectional view taken along line 3-3 of fig. 2. First, as shown in fig. 1 and fig. 3, in the present embodiment, the touch panel 100 includes a transparent cover 110, a transparent adhesive layer TA, a transparent conductive layer 120, a plurality of peripheral circuits 130, and a plurality of first conductive adhesives 140. The transparent cover 110 has a touch area 110A and a peripheral area 110B surrounding the touch area 110A. The transparent conductive layer 120 is disposed on the transparent cover plate 110. Specifically, the transparent conductive layer 120 is attached to the transparent cover plate 110 by a transparent adhesive layer TA, wherein the transparent conductive layer 120 has a plurality of first sensing units 121 and a plurality of second sensing units 122.
Specifically, the first sensing unit 121 is adjacent to the peripheral region 110B compared to the second sensing unit 122. Each of the first sensing units 121 includes a first sensing portion 121A and a first external connection portion 121B, and the first sensing portion 121A is directly connected to the first external connection portion 121B, wherein the first sensing portion 121A is located in the touch area 110A, and the first external connection portion 121B is located in the peripheral area 110B. Each of the second sensing units 122 includes a second sensing portion 122A, a second external portion 122B and an extension portion 122C, and the second sensing portion 122A is connected to the second external portion 122B through the extension portion 122C, wherein the second sensing portion 122A is located in the touch region 110A, and the second external portion 122B is located in the peripheral region 110B.
As shown in fig. 1, since the first sensing unit 121 is adjacent to the peripheral region 110B, there is no other component block between the first sensing portion 121A and the first external connection portion 121B, and therefore the first sensing portion 121A can be directly connected to the first external connection portion 121B. However, since the second sensing units 122 are far from the peripheral region 110B compared to the first sensing units 121, each pair of the second sensing portions 122A and the second external portion 122B is obstructed by the other second sensing units 122 or the first sensing units 121, and cannot be directly connected. Therefore, by the arrangement of the extension portion 122C, the second sensing portion 122A can be connected to the second external portion 122B to be further electrically connected to the peripheral circuit 130 (the electrical connection will be described in detail later).
The peripheral circuits 130 are disposed on the transparent cover plate 110 and located outside the first external connection portion 121B and the second external connection portion 122B, wherein each peripheral circuit 130 includes a first circuit pad 131, a second circuit pad 132 and a trace 133, and the first circuit pad 131 is electrically connected to the second circuit pad 132 through the trace 133. Each of the first circuit pads 131 is electrically connected to the first external connection portion 121B or the second external connection portion 122B through the first conductive adhesive 140, so that the first sensing portion 121A and the second sensing portion 122A can be electrically connected to the peripheral circuit 130. In the present embodiment, the material of the first conductive paste 140 may include silver paste, for example, but the invention is not limited thereto, and other conductive colloids may also be used as the material of the first conductive paste 140.
It is noted that, as shown in fig. 2 and 3, the width H1 of the first external connecting portion 121B and the second external connecting portion 122B is smaller than the width H2 of the peripheral region 110B. Specifically, the width H1 of the first external connection portion 121B and the second external connection portion 122B is, for example, 0.5mm to 2 mm. Therefore, the transparent conductive layer 120 has less line space at the edge, so that the margin width (width H1) can be narrower, which is beneficial to the product design with narrow frame. In addition, since the width H1 of the first external connection portion 121B and the second external connection portion 122B is smaller than the width H2 of the peripheral area 110B, the peripheral circuit 130 can be disposed on the transparent cover 110 in the space outside the first external connection portion 121B and the second external connection portion 122B. That is, since the transparent conductive layer 120 covers only a very small portion of the peripheral region 110B, the peripheral circuit 130 can be disposed on a portion of the transparent cover plate 110 not covered by the transparent conductive layer 120. In other words, the vertical projections of the peripheral circuit 130 and the transparent conductive layer 120 on the transparent cover 110 do not overlap.
In the present embodiment, the material of the transparent cover plate 110 may include, for example, glass, Polycarbonate (PC), polymethyl methacrylate (PMMA), sapphire (sapphire), silicon, or multiple combinations thereof. The method for forming the peripheral circuit 130 may include: after the conductive silver paste is printed on the transparent cover plate 110, the laser etching process is performed to form the peripheral circuit 130. The material of the transparent conductive layer 120 may include Indium Tin Oxide (ITO), Indium Zinc Oxide (IZO), Zinc Oxide (ZnO), Aluminum Zinc Oxide (AZO), Aluminum Indium Oxide (AIO), Indium Oxide (InO ), or Gallium Oxide (GaO), for example. Since the material of the transparent cover plate 110 is harder than the material of the transparent conductive layer 120, the peripheral circuit 130 is formed on the transparent cover plate 110, and compared with the conventional method for forming the peripheral circuit 130 on the flexible transparent conductive layer 120, the processing precision or the production efficiency can be significantly improved.
The transparent conductive layer 120 may be formed, for example, by: a transparent conductive film is formed on a substrate (not shown), and then the transparent conductive film is patterned to form the first sensing unit 121 and the second sensing unit 122, thereby completing the fabrication of the transparent conductive layer 120. Then, the manufactured transparent conductive layer 120 and the substrate material are attached to the transparent cover plate 110 by the transparent adhesive layer TA. During the bonding process, one surface of the transparent adhesive layer TA contacts the substrate material, and the opposite surface contacts the transparent cover plate 110, so that the transparent conductive layer 120 is far away from the transparent cover plate 110 than the substrate material, thereby facilitating the subsequent electrical connection between the first external connection portion 121B and the second external connection portion 122B and the first circuit pad 131. The matrix material may be, for example, Polyester (PET) or Polyimide (PI), but the invention is not limited thereto.
Please refer to fig. 1 and fig. 3 again. In this embodiment, the touch panel 100 further includes a ground line 180. The grounding circuit 180 is disposed on the transparent cover 110 and surrounds the peripheral circuit 130. The forming method of the ground line 180 may be, for example: after the conductive silver paste is printed on the transparent cover plate 110, laser etching is performed to form the grounding circuit 180. In some embodiments, the peripheral line 130 and the ground line 180 may be formed simultaneously. For example, after printing a conductive silver paste on the transparent cover plate 110, a laser etching process is performed to form the peripheral circuit 130 and the ground circuit 180.
Similarly, since the transparent conductive layer 120 reduces the circuit space of the ground circuit that needs to be disposed at the outermost circle originally, the area occupied by the transparent conductive layer 120 is reduced, so that the edge width can be narrower, which is beneficial to the product design of a narrow frame. In addition, the grounding circuit 180 is formed on the transparent cover plate 110, which not only can significantly improve the processing precision and the productivity efficiency, but also can make the grounding circuit 180 larger, thereby further contributing to improving the problems of electrostatic discharge and circuit interference, and further improving the noise reduction effect.
In addition, in the present embodiment, the touch panel 100 further includes a light-shielding layer LB. The light-shielding layer LB is disposed on the transparent cover 110, wherein the light-shielding layer LB defines the peripheral region 110B, and the first external connection portion 121B, the second external connection portion 122B, the peripheral circuit 130, and the ground circuit 180 are disposed on the light-shielding layer LB. The material of the light-shielding layer LB may include, for example, black or dark insulating ink.
Fig. 4 is a partial bottom view of a touch panel 100 according to another embodiment of the invention. Fig. 5 is a cross-sectional view taken along line 5-5 of fig. 4. As shown in fig. 4 and 5, in the present embodiment, the touch panel 100 further includes a Flexible Printed Circuit (FPC) 160. The flexible circuit board 160 has a first surface S1 close to the transparent cover 110 and a second surface S2 far from the transparent cover 110. The first surface S1 has a plurality of circuit leads 161, and the second circuit pads 132 are electrically connected to the circuit leads 161 via an Anisotropic Conductive Film (ACF) 170. In this way, the first sensing unit 121 and the second sensing unit 122 can be electrically connected to the flexible circuit board 160 through the peripheral circuit 130, so that the first sensing unit 121 and the second sensing unit 122 can transmit signals with an external circuit.
Please refer to fig. 4 and fig. 5. The touch panel 100 further includes a plurality of second conductive adhesives 150. The second surface S2 of the flexible circuit board 160 has a plurality of ground pins 162, and the ground circuit 180 further includes a plurality of ground pads 181, wherein the ground pads 181 are electrically connected to the ground pins 162 through the second conductive paste 150. In the present embodiment, the material of the second conductive paste 150 may include silver paste, for example, but the invention is not limited thereto, and other conductive colloids may also be used as the material of the second conductive paste 150.
In some embodiments, the first conductive paste 140 and the second conductive paste 150 may be formed by a silver paste method, for example. When the first conductive paste 140 and the second conductive paste 150 are formed by silver paste dispensing, they are located on the same side of the transparent cover plate 110, and thus can be completed in the same process. Therefore, the effects of reducing cost, saving time and simplifying the manufacturing process can be achieved.
Although the ground lead 162 and the circuit lead 161 are disposed on different surfaces of the flexible circuit board 160 in the present embodiment, the invention is not limited thereto. In other embodiments, the ground pin 162 may be disposed on the same surface of the flexible circuit board 160 as the circuit pin 161, that is, the ground pin 162 may also be disposed on the first surface S1 of the flexible circuit board 160 close to the transparent cover 110 as the circuit pin 161 and electrically connected to the ground pad 181 through the anisotropic conductive film 170. In other words, the position of the grounding pin 162 is not limited to the first surface S1 or the second surface S2 of the flexible circuit board 160, and a person skilled in the art can flexibly adjust the position of the grounding pin 162 according to actual requirements as long as the grounding pad 181 is electrically connected to the grounding pin 162.
Fig. 6 is a bottom view of a touch panel 100 according to yet another embodiment of the invention. For clarity, fig. 6 only shows the transparent cover plate 110 and the ground line 180. In the present embodiment, the ground line 180 is composed of two ground blocks that are symmetrical to each other. Specifically, the ground circuit 180 includes a first ground block 180A and a second ground block 180B, wherein the first ground block 180A and the second ground block 180B are symmetrical to each other. That is, unlike the design of the ground line 180 of the previous embodiment which is a single ground block, the ground line 180 of the present embodiment is composed of a first ground block 180A and a second ground block 180B which are symmetrical to each other.
Please refer to fig. 1 again. As can be seen from fig. 1, in the foregoing embodiment of the invention, the outline of the touch panel 100 is circular. However, the invention is not limited thereto, and in other embodiments, the outline of the touch panel 100 may be rectangular or other shapes, and those skilled in the art can flexibly select the shape of the outline of the touch panel 100 according to actual requirements.
As can be clearly seen from the above detailed description of the embodiments of the present invention, the touch panel of the present invention has the peripheral circuit and the ground circuit formed on the transparent cover plate, so that the area occupied by the transparent conductive layer in the peripheral area is reduced, the edge width can be narrower, and the design of a narrow-frame product is facilitated. In addition, the peripheral circuit and the grounding circuit are formed on the transparent cover plate which is made of a material harder than that of the transparent conductive layer, so that the processing precision and the productivity efficiency are obviously improved. Moreover, the grounding circuit is formed on the transparent cover plate, and the grounding circuit can be made to be a larger advantage, so that the problems of electrostatic discharge, circuit interference and the like are better improved, and the noise reduction effect is further improved.
Although the present invention has been described with reference to the above embodiments, it should be understood that various changes and modifications can be made therein by those skilled in the art without departing from the spirit and scope of the invention as defined by the appended claims.
Claims (11)
1. A touch panel, comprising:
the transparent cover plate is provided with a touch area and a peripheral area surrounding the touch area;
a transparent conductive layer disposed on the transparent cover plate through a transparent adhesive layer, wherein the transparent conductive layer has a plurality of sensing units, each of the sensing units includes a sensing portion and an external portion, and the sensing portion is connected to the external portion, wherein the sensing portion is located in the touch area, the external portion is located in the peripheral area, and the width of the external portion is smaller than that of the peripheral area;
a plurality of peripheral circuits disposed on the transparent cover plate and outside the external connection portions, wherein each peripheral circuit includes a first circuit pad, and a top surface of the first circuit pad is lower than a top surface of the external connection portion;
a light shielding layer arranged on the transparent cover plate, wherein the light shielding layer defines the peripheral area, and the peripheral circuits are arranged on the light shielding layer, wherein the thickness of the transparent adhesive layer is greater than that of the light shielding layer; and
the plurality of first conductive adhesives respectively extend from the top surface of the external connection part to the top surface of the first circuit pad.
2. The touch panel of claim 1, further comprising:
a flexible circuit board having a first surface close to the transparent cover plate, wherein the first surface has a plurality of circuit pins; and
and an anisotropic conductive film, wherein each of the peripheral circuits further comprises a second circuit pad electrically connected to the circuit pins via the anisotropic conductive film.
3. The touch panel of claim 2, further comprising:
and the grounding circuit is arranged on the transparent cover plate and surrounds the outer sides of the peripheral circuits.
4. The touch panel of claim 3, further comprising:
the flexible circuit board further has a second surface far away from the transparent cover plate, the second surface has a plurality of grounding pins, and the grounding circuit includes a plurality of grounding pads electrically connected to the grounding pins by the second conductive adhesives.
5. The touch panel of claim 3, wherein the ground circuit is formed by two ground blocks that are symmetrical to each other.
6. The touch panel of claim 1, wherein the width of each of the external connection portions is 0.5mm to 2 mm.
7. The touch panel of claim 1, wherein the first conductive pastes are made of silver paste.
8. The touch panel of claim 4, wherein the second conductive paste comprises silver paste.
9. The touch panel of claim 1, further comprising:
and the grounding circuit is arranged on the transparent cover plate and surrounds the outer sides of the peripheral circuits.
10. The touch panel of claim 9, further comprising:
a flexible circuit board having a plurality of grounding pins, wherein the grounding circuit includes a plurality of grounding pads electrically connected to the grounding pins respectively.
11. The touch panel of claim 9, wherein the ground circuit is formed by two ground blocks that are symmetrical to each other.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710666209.5A CN107463293B (en) | 2017-08-07 | 2017-08-07 | Touch panel |
| TW106130029A TWI631498B (en) | 2017-08-07 | 2017-09-01 | Touch panel |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710666209.5A CN107463293B (en) | 2017-08-07 | 2017-08-07 | Touch panel |
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| Publication Number | Publication Date |
|---|---|
| CN107463293A CN107463293A (en) | 2017-12-12 |
| CN107463293B true CN107463293B (en) | 2020-06-16 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710666209.5A Active CN107463293B (en) | 2017-08-07 | 2017-08-07 | Touch panel |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN107463293B (en) |
| TW (1) | TWI631498B (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109917962B (en) * | 2019-03-05 | 2022-04-15 | 业成科技（成都）有限公司 | Touch panel |
| CN110970477B (en) * | 2019-10-31 | 2022-09-30 | 武汉天马微电子有限公司 | Organic light emitting display panel and display device |
| CN114327110A (en) | 2020-09-30 | 2022-04-12 | 宸美（厦门）光电有限公司 | Touch control module |
| TWI755889B (en) * | 2020-10-14 | 2022-02-21 | 大陸商宸美（廈門）光電有限公司 | Touch module |
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| EP2722737A1 (en) * | 2012-08-17 | 2014-04-23 | Shanghai Tianma Micro-Electronics Co., Ltd. | Electric connection structure of touch control liquid crystal display device |
| CN204347791U (en) * | 2014-12-24 | 2015-05-20 | 山东华芯富创电子科技有限公司 | Do not establish the narrow frame in cabling district touch panel structure provided |
| CN104866126A (en) * | 2014-02-25 | 2015-08-26 | 宸鸿科技(厦门)有限公司 | Touch panel |
| CN105739732A (en) * | 2014-12-08 | 2016-07-06 | 纬创资通股份有限公司 | Touch module and manufacturing method for touch module |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW496164U (en) * | 2001-10-04 | 2002-07-21 | Jing-Lu Shiu | Exercise device for pedaling by lying down |
| TWM488053U (en) * | 2014-04-10 | 2014-10-11 | Wintek Corp | Touch panel |
| TWM497811U (en) * | 2014-08-01 | 2015-03-21 | Unidisplay Inc | Panel structure |
| CN105700747B (en) * | 2016-01-08 | 2017-03-22 | 宸美（厦门）光电有限公司 | Jointing method of curved touch panel and flexible circuit board |
| CN106339132A (en) * | 2016-10-20 | 2017-01-18 | 友达光电（昆山）有限公司 | Touch panel |
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2017
- 2017-08-07 CN CN201710666209.5A patent/CN107463293B/en active Active
- 2017-09-01 TW TW106130029A patent/TWI631498B/en active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2722737A1 (en) * | 2012-08-17 | 2014-04-23 | Shanghai Tianma Micro-Electronics Co., Ltd. | Electric connection structure of touch control liquid crystal display device |
| CN104866126A (en) * | 2014-02-25 | 2015-08-26 | 宸鸿科技(厦门)有限公司 | Touch panel |
| CN105739732A (en) * | 2014-12-08 | 2016-07-06 | 纬创资通股份有限公司 | Touch module and manufacturing method for touch module |
| CN204347791U (en) * | 2014-12-24 | 2015-05-20 | 山东华芯富创电子科技有限公司 | Do not establish the narrow frame in cabling district touch panel structure provided |
Also Published As
| Publication number | Publication date |
|---|---|
| CN107463293A (en) | 2017-12-12 |
| TW201910992A (en) | 2019-03-16 |
| TWI631498B (en) | 2018-08-01 |
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