CN107463293A - Contact panel - Google Patents
Contact panel Download PDFInfo
- Publication number
- CN107463293A CN107463293A CN201710666209.5A CN201710666209A CN107463293A CN 107463293 A CN107463293 A CN 107463293A CN 201710666209 A CN201710666209 A CN 201710666209A CN 107463293 A CN107463293 A CN 107463293A
- Authority
- CN
- China
- Prior art keywords
- those
- cover plate
- transparent cover
- contact panel
- external connection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
Abstract
A kind of contact panel, including transparent cover plate, transparency conducting layer, a plurality of perimeter circuits and a plurality of first conducting resinls.Transparent cover plate has Touch Zone and around the peripheral region of Touch Zone.Transparency conducting layer is arranged on transparent cover plate.Transparency conducting layer has a plurality of sensing units, and sensing unit includes detecting part and external connection portion, and detecting part is connected to external connection portion.Detecting part is located at Touch Zone, and external connection portion is located at peripheral region, and the width of external connection portion is less than the width of peripheral region.Perimeter circuit is arranged on transparent cover plate and on the outside of external connection portion.Perimeter circuit includes first line connection pad.First line connection pad is electrically connected at external connection portion by the first conducting resinl respectively.Due to perimeter circuit and ground path are formed on transparent cover plate, therefore reduce transparency conducting layer in the area occupied by peripheral region so that hem width can become narrower, be advantageous to the product design of narrow frame.
Description
Technical field
The invention relates to a kind of contact panel.
Background technology
In general, common contactor control device, its basic framework need to set frame mostly in edge, to cover touch-control dress
The routing region put.However, with the popularization of the touch control display apparatus such as intelligent mobile phone, tablet PC, user is for touch-control
The outward appearance of device and the requirement of touch-control area also improve therewith.Therefore, many contactor control devices, which are hoped, can use setting for narrow frame
Meter, to reduce the area that frame accounts for contactor control device.
Further, since current touch-control product is required for arrangement to be grounded in sensing unit outermost, to be put for electrostatic
The problems such as electric (Electrostatic Discharge, ESD) or line-hit, is protected, and reaches the purpose of noise reduction.But
The width requirement of ground wire usually requires at least 0.15mm, and ground wire arrives touch panel edge and the required distance to cabling
Generally it is respectively necessary at least 0.3mm and 0.15mm, that is to say, that ground connection space needs at least 0.6mm altogether, therefore occupies
The very big rim space of touch-control product, mutually conflict with the product design trend of current narrow frame.
The content of the invention
In view of this, one of present invention purpose is to propose a kind of contact panel to solve the above problems.
In order to achieve the above object, according to one of present invention embodiment, a kind of contact panel, including transparent cover plate, thoroughly
Bright conductive layer, a plurality of perimeter circuit perimeter circuits and a plurality of first conducting resinls.Transparent cover plate has Touch Zone and enclosed
Around the peripheral region of Touch Zone.Transparency conducting layer is arranged on transparent cover plate.Transparency conducting layer has a plurality of sensing units, sensing
Unit includes detecting part and external connection portion, and detecting part is connected to external connection portion.Detecting part is located at Touch Zone, and external connection portion is located at periphery
Area, and the width of external connection portion is less than the width of peripheral region.Perimeter circuit is arranged on transparent cover plate and on the outside of external connection portion.Week
Sideline road includes first line connection pad.First line connection pad is electrically connected at external connection portion by the first conducting resinl respectively.
In one or more embodiments of the present invention, above-mentioned contact panel further includes：Flexible circuit board and different side
Property conducting film.Flexible circuit board has the first surface close to transparent cover plate.First surface has a plurality of circuit pins.Periphery
Circuit further includes the second circuit connection pad.Second circuit connection pad is electrically connected at circuit pin by anisotropic conductive film.
In one or more embodiments of the present invention, above-mentioned contact panel further includes：Ground path.Ground path is set
It is placed on transparent cover plate and is surrounded on the outside of perimeter circuit.
In one or more embodiments of the present invention, above-mentioned contact panel further includes：A plurality of second conducting resinls.It is soft
Property circuit board have more away from transparent cover plate second surface.Second surface has a plurality of grounding pins.Ground path includes
A plurality of ground connection connection pads.Ground connection connection pad is electrically connected at grounding pin by the second conducting resinl respectively.
In one or more embodiments of the present invention, above-mentioned ground path is by two symmetrical ground connection blocks
Formed.
In one or more embodiments of the present invention, the width of above-mentioned external connection portion is between 0.5mm~2mm.
In one or more embodiments of the present invention, the material of the first above-mentioned conducting resinl includes silver paste.
In one or more embodiments of the present invention, the material of the second above-mentioned conducting resinl includes silver paste.
In one or more embodiments of the present invention, above-mentioned contact panel further includes：Light shield layer.Light shield layer is arranged at
On transparent cover plate.Light shield layer defines peripheral region, and perimeter circuit is arranged on light shield layer.
In one or more embodiments of the present invention, above-mentioned contact panel further includes：Ground path.Ground path is set
It is placed on transparent cover plate and is surrounded on the outside of perimeter circuit.
In one or more embodiments of the present invention, above-mentioned contact panel further includes：Flexible circuit board.Flexible circuit
Plate has a plurality of grounding pins.Ground path includes a plurality of ground connection connection pads.Ground connection connection pad is electrically connected in grounding lead
Pin.
In one or more embodiments of the present invention, above-mentioned ground path is by two symmetrical ground connection blocks
Formed.
In summary, contact panel of the invention is due to perimeter circuit and ground path are formed on transparent cover plate,
Therefore transparency conducting layer is reduced in the area occupied by peripheral region so that hem width can become narrower, be advantageous to narrow frame
Product design.In addition, perimeter circuit and ground path are formed in the material transparent cover plate hard compared to transparency conducting layer
On be also obviously improved machining accuracy and capacity efficiency.Moreover, ground path is formed on transparent cover plate, it may have can
With the benefit that ground path does more, therefore it is more conducive to improve static discharge and the problems such as line-hit, Jin Erti
Lift the effect made an uproar.
Described above is only to illustrate the problem of present invention is to be solved, solve the technological means of problem and its produce
The effect of etc., the detail of the present invention will be discussed in detail in embodiment below and correlative type.
Brief description of the drawings
For above-mentioned and other purposes, feature, advantage and the embodiment of the present invention can be become apparent, institute's accompanying drawings are said
It is bright as follows：
Fig. 1 is the bottom view of the contact panel of an embodiment of the present invention.
Fig. 2 is the partial enlarged drawing of Fig. 1 part A.
Fig. 3 is the profile along Fig. 2 3-3 line segments.
Fig. 4 is the partial bottom view of the contact panel of another embodiment of the present invention.
Fig. 5 is the profile along Fig. 4 5-5 line segments.
Fig. 6 is the bottom view of the contact panel of a further embodiment of this invention.
Reference
100：Contact panel
110：Transparent cover plate
110A：Touch Zone
110B：Peripheral region
120：Transparency conducting layer
121：First sensing unit
121A：First detecting part
121B：First external connection portion
122：Second sensing unit
122A：Second detecting part
122B：Second external connection portion
122C：Extension
130：Perimeter circuit
131：First line connection pad
132：Second circuit connection pad
133：Cabling
140：First conducting resinl
150：Second conducting resinl
160：Flexible circuit board
161：Circuit pin
162：Grounding pin
170：Anisotropic conductive film
180：Ground path
181：It is grounded connection pad
180A：First ground connection block
180B：Second ground connection block
A：Part
H1、H2：Width
LB：Light shield layer
S1：First surface
S2：Second surface
TA：Transparent mucigel
Embodiment
A plurality of embodiments of the present invention will be disclosed with schema below, it is as clearly stated, thin in many practices
Section will be explained in the following description.It should be appreciated, however, that the details in these practices is not applied to limit the present invention.
That is in some embodiments of the present invention, the details in these practices is non-essential.In addition, for the sake of simplifying schema,
Some known usual structures will illustrate it in a manner of simply illustrating in the drawings with component.
Fig. 1 is the bottom view of the contact panel 100 of an embodiment of the present invention.Fig. 2 is the partial enlargement of Fig. 1 part A
Figure.Fig. 3 is the profile along Fig. 2 3-3 line segments.First, as shown in Figure 1 and Figure 3, in present embodiment, touch surface
Plate 100 includes transparent cover plate 110, transparent mucigel TA, transparency conducting layer 120, a plurality of perimeter circuits 130 and a plurality of the
One conducting resinl 140.Transparent cover plate 110 has the Touch Zone 110A and peripheral region 110B around Touch Zone 110A.Electrically conducting transparent
Layer 120 is arranged on transparent cover plate 110.Specifically, transparency conducting layer 120 fits in transparency cover by transparent mucigel TA
On plate 110, wherein transparency conducting layer 120 has a plurality of first sensing units 121 and a plurality of second sensing units 122.
Specifically, the first sensing unit 121 is compared to the adjacent perimeter area 110B of the second sensing unit 122.Each first
Sensing unit 121 includes the first detecting part 121A and the first external connection portion 121B, and the first detecting part 121A is directly connected in
One external connection portion 121B, wherein the first detecting part 121A is located at Touch Zone 110A, the first external connection portion 121B is located at peripheral region 110B.Often
Individual second sensing unit 122 includes the second detecting part 122A, the second external connection portion 122B and extension 122C, and the second detecting part
122A is connected to the second external connection portion 122B by extension 122C, wherein the second detecting part 122A is located at Touch Zone 110A, second
External connection portion 122B is located at peripheral region 110B.
As shown in figure 1, due to the adjacent perimeter area 110B of the first sensing unit 121, therefore the first detecting part 121A and
Other assemblies obstruction is had no between one external connection portion 121B, therefore the first detecting part 121A may be directly connected to the first external connection portion
121B.However, due to the second sensing unit 122 compared to the first sensing unit 121 further from peripheral region 110B so that each
To between the second detecting part 122A and the second external connection portion 122B by other sensing units of the second sensing unit 122 or first
121 obstruction and can not be directly connected to.Therefore, by extension 122C setting, the second detecting part 122A can be allowed to be connected to
Second external connection portion 122B, to be further electrically connected with (electric connection in a manner of refer to aftermentioned) with perimeter circuit 130.
Perimeter circuit 130 is arranged on transparent cover plate 110, and is located at the first external connection portion 121B and the second external connection portion 122B
Outside, wherein each perimeter circuit 130 includes first line connection pad 131, the second circuit connection pad 132 and cabling 133, wherein the
One circuit connection pad 131 is electrically connected at the second circuit connection pad 132 by cabling 133.Each first line connection pad 131 respectively by
First external connection portion 121B or the second external connection portion 122B are electrically connected at by the first conducting resinl 140 so that the first detecting part 121A with
And second detecting part 122A can be electrically connected at perimeter circuit 130.In the present embodiment, the material of the first conducting resinl 140
Such as may include silver paste, but the present invention is not limited, and the colloid of other conductive matter can also be used as the first conducting resinl 140
Material.
It is worth noting that, as shown in FIG. 2 and 3, the first external connection portion 121B and the second external connection portion 122B width
H1 is less than peripheral region 110B width H2.Specifically, the first external connection portion 121B and the second external connection portion 122B width H1 examples
As between 0.5mm~2mm.Therefore, transparency conducting layer 120 has lacked the circuit space at edge so that hem width (width H1) can become
Must be narrower, be advantageous to the product design of narrow frame.In addition, also due to the first external connection portion 121B and the second external connection portion 122B width
The width H2 that H1 is less than peripheral region 110B is spent, therefore perimeter circuit 130 can be outside the first external connection portion 121B and second
Socket part 122B outer space is arranged on transparent cover plate 110.That is, because transparency conducting layer 120 only covers periphery
Part considerably less area 110B, so perimeter circuit 130 can be arranged on transparent cover plate 110 and not covered by transparency conducting layer 120
To part on.In other words, the upright projection of perimeter circuit 130 and transparency conducting layer 120 on transparent cover plate 110 does not weigh
Repeatedly.
In the present embodiment, the material of transparent cover plate 110 for example may include glass, makrolon
(Polycarbonate, PC), polymethyl methacrylate (Polymethylmethacrylate, PMMA), sapphire
(sapphire), silicon or its Multiple Combination.The forming method of perimeter circuit 130 for example can be：First printed on transparent cover plate 110
After conductive silver paste, then laser etching and processing is carried out to form perimeter circuit 130.The material of transparency conducting layer 120 for example may include
Tin indium oxide (Indium Tin Oxide, ITO), indium zinc oxide (Indium Zinc Oxide, IZO), zinc oxide (Zinc
Oxide, ZnO), zinc oxide aluminum (Aluminum doped Zinc Oxide, AZO), aluminum oxide indium (Aluminum indium
Oxide, AIO), the material such as indium oxide (Indium oxide, InO) or gallium oxide (Gallium oxide, GaO).Due to transparent
The material of cover plate 110 is come firmly compared to the material of transparency conducting layer 120, therefore forms perimeter circuit on transparent cover plate 110
130, the method for forming perimeter circuit 130 on soft transparency conducting layer 120 compared to tradition, whether in machining accuracy or
It is that capacity efficiency can be obviously improved.
The generation type of transparency conducting layer 120 for example can be：First transparent lead is formed on a host material (not shown)
Electrolemma, the first sensing unit 121 and the second sensing unit 122 are then patterned to form to nesa coating again, such as
This just completes the making of transparency conducting layer 120.Then again by the transparency conducting layer 120 to complete together with host material, by
Fitted in by transparent mucigel TA on transparent cover plate 110.During fitting, transparent mucigel TA one sides are contacted with host material, phase
To another side be contacted with transparent cover plate 110 so that transparency conducting layer 120 compared to host material away from transparent cover plate 110, with
Beneficial to the electric connection of follow-up first external connection portion 121B and the second external connection portion 122B and first line connection pad 131.Host material
Such as can be polyester (Polythylene terephthalate, PET) or pi (Polyimide, PI), but it is of the invention
It is not limited.
Referring once again to Fig. 1 and Fig. 3.In the present embodiment, contact panel 100 also includes ground path 180.Ground connection
Circuit 180 is arranged on transparent cover plate 110, and is surrounded on the outside of perimeter circuit 130.The forming method of ground path 180 is for example
Can be：After first printing conductive silver paste on transparent cover plate 110, then laser etching and processing is carried out to form ground path 180.One
In a little embodiments, perimeter circuit 130 and ground path 180 can be formed simultaneously.For example, printed on transparent cover plate 110
After conductive silver paste, then laser etching and processing is carried out to form perimeter circuit 130 and ground path 180.
Similarly, need to be arranged on the circuit space of the ground path of outmost turns originally because transparency conducting layer 120 has lacked,
Therefore the area shared by transparency conducting layer 120 is reduced so that hem width can become narrower, and the product for being advantageous to narrow frame is set
Meter.In addition, ground path 180 is made on transparent cover plate 110, except machining accuracy and capacity efficiency can be obviously improved
Outside, ground path 180 can also do more, therefore be more conducive to improve static discharge and the problems such as line-hit, and then
Lift the effect of noise reduction.
In addition, in the present embodiment, contact panel 100 also includes light shield layer LB.Light shield layer LB is arranged at transparent cover plate
On 110, wherein light shield layer LB defines peripheral region 110B, and the first external connection portion 121B, the second external connection portion 122B, perimeter circuit
130 and ground path 180 be arranged on light shield layer LB.Light shield layer LB material for example may include the insulation of black or dark color
Ink.
Fig. 4 is the partial bottom view of the contact panel 100 of another embodiment of the present invention.Fig. 5 is the 5-5 lines along Fig. 4
The profile of section.As shown in FIG. 4 and 5, in the present embodiment, contact panel 100 also includes flexible circuit board
(Flexible Printed Circuit, FPC) 160.Flexible circuit board 160 has the first surface close to transparent cover plate 110
The S1 and second surface S2 away from transparent cover plate 110.First surface S1 has a plurality of circuit pins 161, and the second circuit connects
Pad 132 is electrically connected at circuit pin by anisotropic conductive film (Anisotropic Conductive Film, ACF) 170
161.Consequently, it is possible to the first sensing unit 121 and the second sensing unit 122 just can be electrically connected with by perimeter circuit 130
To flexible circuit board 160 so that the first sensing unit 121 and the second sensing unit 122 can carry out signal with external circuit
Between transmission.
Continue referring to Fig. 4 and Fig. 5.Contact panel 100 also includes a plurality of second conducting resinls 150.Flexible circuit board
160 second surface S2 has a plurality of grounding pins 162, and ground path 180 also includes a plurality of ground connection connection pads 181, ground connection
Connection pad 181 is electrically connected at grounding pin 162 by the second conducting resinl 150 respectively.In the present embodiment, the second conducting resinl
150 material for example may include silver paste, but the present invention is not limited, and the colloid of other conductive matter can also be used as second
The material of conducting resinl 150.
In some embodiments, the forming method of the first conducting resinl 140 and the second conducting resinl 150 for example can be point silver
The mode of slurry.When the first conducting resinl 140 and the second conducting resinl 150 using point silver paste by the way of to be formed when, due to both
It is the same side for being located at transparent cover plate 110, therefore can be completed in the processing procedure with along with.Thereby, can reach reduces cost, section
The effect of saving time, and simplifying processing procedure.
Although in the present embodiment, grounding pin 162 is arranged on the difference of flexible circuit board 160 with circuit pin 161
Surface, but the present invention is not limited.In other embodiments, grounding pin 162 can also be arranged on circuit pin 161
On the same surface of flexible circuit board 160, that is to say, that grounding pin 162 can also be arranged on soft as circuit pin 161
Property circuit board 160 is electrically connected at ground connection on the first surface S1 of transparent cover plate 110, and by anisotropic conductive film 170
Connection pad 181.In other words, the set location of grounding pin 162 is not limited to the first surface S1 or second of flexible circuit board 160
On the S2 of surface, the visual actual demand of one skilled in the art and elasticity adjustment grounding pin 162 position, as long as can
Ground connection connection pad 181 is allowed to be electrically connected in grounding pin 162.
Fig. 6 is the bottom view of the contact panel 100 of a further embodiment of this invention.For clear explanation, Fig. 6 is only illustrated
Bright cover plate 110 and ground path 180.In the present embodiment, ground path 180 is by two symmetrical ground connection blocks
Formed.Specifically, ground path 180 includes the first ground connection block 180A and the second ground connection block 180B, wherein first
It is symmetrical to be grounded the ground connection of block 180A and second block 180B.That is, the ground path with aforementioned embodiments
180 is different for the design of single ground connection block, and the ground path 180 of present embodiment is by the first symmetrical ground connection block
The ground connection of 180A and second block 180B is formed.
Referring once again to Fig. 1.As seen from Figure 1, state before making the present invention in embodiment, the wheel of contact panel 100
Exterior feature is circle.But the present invention is not limited, in other embodiments, the profile of contact panel 100 also can be rectangle or
Other shapes, the visual actual demand of one skilled in the art and elasticity selection contact panel 100 profile shape.
The above of detailed description by to(for) the embodiment of the present invention, it is apparent that the contact panel of the present invention
Due to perimeter circuit and ground path are formed on transparent cover plate, therefore reduce transparency conducting layer occupied by peripheral region
Area so that hem width can become narrower, be advantageous to the product design of narrow frame.In addition, by perimeter circuit and ground wire
Road forms and is also obviously improved machining accuracy and capacity efficiency on the material transparent cover plate hard compared to transparency conducting layer.
Moreover, ground path is formed on transparent cover plate, it may have the benefit that ground path can be done more, therefore more have
The problems such as helping improve static discharge and line-hit, and then lift the effect of noise reduction.
Although the present invention is disclosed above with embodiment, so it is any to be familiar with this skill not to limit the present invention
Person, without departing from the spirit and scope of the present invention, when can be used for a variety of modifications and variations, therefore protection scope of the present invention is worked as
It is defined depending on appended claims institute defender.
Claims (12)
- A kind of 1. contact panel, it is characterised in that including：One transparent cover plate, there is a Touch Zone and around a peripheral region of the Touch Zone；One transparency conducting layer, be arranged on the transparent cover plate, wherein the transparency conducting layer has a plurality of sensing units, it is each those Sensing unit includes a detecting part and an external connection portion, and the detecting part is connected to the external connection portion, and wherein the detecting part, which is located at, is somebody's turn to do Touch Zone, the external connection portion is located at the peripheral region, and the width of the external connection portion is less than the width of the peripheral region；A plurality of perimeter circuits, it is arranged on the transparent cover plate and on the outside of those external connection portions, wherein those each perimeter circuits Including a first line connection pad；AndA plurality of first conducting resinls, wherein those first line connection pads are electrically connected at those by those first conducting resinls respectively External connection portion.
- 2. contact panel as claimed in claim 1, it is characterised in that further include：One flexible circuit board, has the first surface close to the transparent cover plate, and the wherein first surface has a plurality of circuits Pin；AndOne anisotropic conductive film, wherein those each perimeter circuits further include one second circuit connection pad, those the second circuit connection pads by Those circuit pins are electrically connected at by the anisotropic conductive film.
- 3. contact panel as claimed in claim 2, it is characterised in that further include：One ground path, it is arranged on the transparent cover plate and is surrounded on the outside of those perimeter circuits.
- 4. contact panel as claimed in claim 3, it is characterised in that further include：A plurality of second conducting resinls, the wherein flexible circuit board have more the second surface away from the transparent cover plate, and this second Surface has a plurality of grounding pins, and the ground path includes a plurality of ground connection connection pads, and those ground connection connection pads are respectively by this A little second conducting resinls are electrically connected at those grounding pins.
- 5. contact panel as claimed in claim 3, it is characterised in that the ground path is by two symmetrical access areas Block is formed.
- 6. contact panel as claimed in claim 1, it is characterised in that the width of those each external connection portions is between 0.5mm~2mm.
- 7. contact panel as claimed in claim 1, it is characterised in that the material of those the first conducting resinls includes silver paste.
- 8. contact panel as claimed in claim 4, it is characterised in that the material of those the second conducting resinls includes silver paste.
- 9. contact panel as claimed in claim 1, it is characterised in that further include：One light shield layer, it is arranged on the transparent cover plate, wherein the light shield layer defines the peripheral region, and those perimeter circuits are set In on the light shield layer.
- 10. contact panel as claimed in claim 1, it is characterised in that further include：One ground path, it is arranged on the transparent cover plate and is surrounded on the outside of those perimeter circuits.
- 11. contact panel as claimed in claim 10, it is characterised in that further include：One flexible circuit board, there are a plurality of grounding pins, the wherein ground path includes a plurality of ground connection connection pads, those ground connection Connection pad is electrically connected in those grounding pins.
- 12. contact panel as claimed in claim 10, it is characterised in that the ground path is by two symmetrical ground connection Block is formed.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710666209.5A CN107463293B (en) | 2017-08-07 | 2017-08-07 | Touch panel |
| TW106130029A TWI631498B (en) | 2017-08-07 | 2017-09-01 | Touch panel |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710666209.5A CN107463293B (en) | 2017-08-07 | 2017-08-07 | Touch panel |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107463293A true CN107463293A (en) | 2017-12-12 |
| CN107463293B CN107463293B (en) | 2020-06-16 |
Family
ID=60547344
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710666209.5A Active CN107463293B (en) | 2017-08-07 | 2017-08-07 | Touch panel |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN107463293B (en) |
| TW (1) | TWI631498B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109917962A (en) * | 2019-03-05 | 2019-06-21 | 业成科技（成都）有限公司 | Touch panel |
| CN110970477A (en) * | 2019-10-31 | 2020-04-07 | 上海天马有机发光显示技术有限公司 | Organic light emitting display panel and display device |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114327110A (en) | 2020-09-30 | 2022-04-12 | 宸美（厦门）光电有限公司 | Touch control module |
| TWI755889B (en) * | 2020-10-14 | 2022-02-21 | 大陸商宸美（廈門）光電有限公司 | Touch module |
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| EP2722737A1 (en) * | 2012-08-17 | 2014-04-23 | Shanghai Tianma Micro-Electronics Co., Ltd. | Electric connection structure of touch control liquid crystal display device |
| CN204347791U (en) * | 2014-12-24 | 2015-05-20 | 山东华芯富创电子科技有限公司 | Do not establish the narrow frame in cabling district touch panel structure provided |
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| TWM497811U (en) * | 2014-08-01 | 2015-03-21 | Unidisplay Inc | Panel structure |
| CN105700747B (en) * | 2016-01-08 | 2017-03-22 | 宸美（厦门）光电有限公司 | Jointing method of curved touch panel and flexible circuit board |
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| EP2722737A1 (en) * | 2012-08-17 | 2014-04-23 | Shanghai Tianma Micro-Electronics Co., Ltd. | Electric connection structure of touch control liquid crystal display device |
| CN104866126A (en) * | 2014-02-25 | 2015-08-26 | 宸鸿科技(厦门)有限公司 | Touch panel |
| CN105739732A (en) * | 2014-12-08 | 2016-07-06 | 纬创资通股份有限公司 | Touch module and manufacturing method for touch module |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109917962A (en) * | 2019-03-05 | 2019-06-21 | 业成科技（成都）有限公司 | Touch panel |
| CN109917962B (en) * | 2019-03-05 | 2022-04-15 | 业成科技（成都）有限公司 | Touch panel |
| CN110970477A (en) * | 2019-10-31 | 2020-04-07 | 上海天马有机发光显示技术有限公司 | Organic light emitting display panel and display device |
| CN110970477B (en) * | 2019-10-31 | 2022-09-30 | 武汉天马微电子有限公司 | Organic light emitting display panel and display device |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201910992A (en) | 2019-03-16 |
| TWI631498B (en) | 2018-08-01 |
| CN107463293B (en) | 2020-06-16 |
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