CN112837626A - Display panel and manufacturing method thereof - Google Patents
Display panel and manufacturing method thereof Download PDFInfo
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- CN112837626A CN112837626A CN202110030302.3A CN202110030302A CN112837626A CN 112837626 A CN112837626 A CN 112837626A CN 202110030302 A CN202110030302 A CN 202110030302A CN 112837626 A CN112837626 A CN 112837626A
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 34
- 239000000758 substrate Substances 0.000 claims abstract description 41
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- 238000000034 method Methods 0.000 claims description 9
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- 238000007639 printing Methods 0.000 claims description 4
- 238000010023 transfer printing Methods 0.000 claims description 4
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- 230000002708 enhancing effect Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 229910021389 graphene Inorganic materials 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000010147 laser engraving Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/302—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements characterised by the form or geometrical disposition of the individual elements
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Abstract
The application provides a display panel and a manufacturing method thereof, the display panel comprises a bottom plate and at least two sub-display panels positioned on the bottom plate, any sub-display panel of the at least two sub-display panels comprises a substrate base plate, a driving circuit layer and a plurality of light emitting diode chips, the driving circuit layer comprises a driving circuit and a plurality of splicing leads, the drive circuit of the adjacent sub-display panel is conducted through the splicing lead which is arranged on at least one side edge of the sub-display panel and is connected with the drive circuit, therefore, the back of each sub-display panel is not required to be guided to the sub-display panel by the driving circuit and is bound with the printed circuit board, the difficulty of the manufacturing process of the display panel can be reduced, the situation that the display panel is penetrated by light rays due to the fact that the display panel is prevented from being guided to the printed circuit board and the driving circuit on the back of the display panel can be avoided, and the display effect of transparent display of the display panel is achieved.
Description
Technical Field
The present disclosure relates to display technologies, and particularly to a display panel and a method for manufacturing the display panel.
Background
With the development of display technology, micro light emitting diode (μ -LED) display panels gradually replace Liquid Crystal Display (LCD) panels and Organic Light Emitting Diode (OLED) display panels by virtue of their excellent performance, and become mainstream display technology.
The large-size mu-LED display panel formed by splicing the mu-LED display modules is not suitable for transparent display because the driving circuit and the printed circuit board need to be bound on the back of the backboard.
In summary, the conventional micro led display panel has a problem that the driving circuit of each micro led display module needs to be bound to the printed circuit board on the back side, which results in being unsuitable for transparent display. Therefore, it is desirable to provide a display panel and a method for manufacturing the display panel to improve the defect.
Disclosure of Invention
The embodiment of the application provides a display panel and a manufacturing method of the display panel, which are used for solving the problem that the existing micro light-emitting diode display panel is not suitable for transparent display because a driving circuit of each micro light-emitting diode display module needs to be bound with a printed circuit board on the back surface.
The embodiment of the application provides a display panel, including the bottom plate and being located at least two sub display panel on the bottom plate, arbitrary sub display panel in at least two sub display panel includes:
a substrate base plate;
the driving circuit layer is arranged on the substrate base plate; and
the plurality of light emitting diode chips are arrayed on one side of the driving circuit layer, which is far away from the substrate base plate;
the driving circuit layer comprises a driving circuit and a plurality of splicing leads, the splicing leads are located on at least one side edge of the sub-display panels, one ends of the splicing leads are connected with the driving circuit, and the other ends of the splicing leads are connected with the corresponding splicing leads on the adjacent sub-display panels.
According to an embodiment of the present application, an end of the patch conductor not connected to the driving circuit is configured to extend from a side of the driving circuit layer away from the substrate base plate to a side connected to a side of the driving circuit layer away from the substrate base plate.
According to an embodiment of the present application, the stitching wire extends from the top of the side connected to the side of the driving circuit layer away from the substrate base plate to the bottom of the side of the substrate base plate.
According to an embodiment of the application, a spacing space is arranged between the adjacent sub-display panels, conductive adhesive is filled in the spacing space, and the portion, extending to the side connected with the side, far away from the substrate base plate, of the splicing lead of the adjacent sub-display panels is connected through the conductive adhesive.
According to an embodiment of the application, the driving circuit comprises a plurality of scanning lines arranged at intervals and a plurality of data lines arranged at intervals along the direction perpendicular to the scanning lines, and one end of the splicing circuit connected with the driving circuit is respectively connected with the scanning lines and the data lines.
According to an embodiment of the present application, the display panel includes a first encapsulation layer and a second encapsulation layer, the first encapsulation layer covers the led chip and other areas of one side surface of the driving circuit layer away from the substrate except the splicing wires, a groove is formed between the first encapsulation layers adjacent to each other on the sub-display panel, and the second encapsulation layer fills the groove and covers the splicing wires.
According to an embodiment of the present application, at least one side edge of a part of the sub display panel is provided with a binding portion, the display panel includes a printed circuit board, and the printed circuit board is bound and connected with the binding portion.
The embodiment of the present application further provides a manufacturing method of a display panel, where the manufacturing method is used to manufacture a display panel, where the display panel includes at least two sub-display panels, any one of the at least two sub-display panels includes a substrate, a driving circuit layer and a plurality of light emitting diode chips, the driving circuit layer includes a driving circuit, and the manufacturing method includes:
providing at least two sub-display panels, and forming a plurality of splicing leads connected with the driving circuit on the edge of at least one side of the corresponding sub-display panel;
providing a bottom plate, and attaching the other sub-display panel to a corresponding position on the bottom plate and fixing the sub-display panel;
and connecting the splicing lead on the corresponding sub-display panel with the corresponding splicing lead on the other sub-display panel, and attaching the other sub-display panel to the corresponding position on the bottom plate.
According to an embodiment of the present application, the step of forming a plurality of bonding wires connected to the driving circuit of the sub-display panel at least one side edge of the corresponding sub-display panel includes:
forming a plurality of connecting holes on at least one side edge of the corresponding display panel, wherein part of the driving circuit is exposed out of the connecting holes;
and forming a plurality of splicing leads which extend from one side of the driving circuit layer, which is far away from the substrate base plate, to one side of the driving circuit layer, which is connected with one side of the driving circuit layer, which is far away from the substrate base plate, in a transfer printing or spray printing mode.
According to an embodiment of the present application, any one of the at least two sub-display panels includes a first encapsulation layer, the first encapsulation layer covers other regions of the sub-display panels except for the stitching wires, and the manufacturing method further includes:
and after the corresponding sub-display panels are attached and fixed on the bottom plate, filling a groove formed between the first packaging layers of the adjacent sub-display panels to form a second packaging layer, wherein the second packaging layer covers the splicing wires.
The beneficial effects of the embodiment of the application are as follows: the embodiment of the application provides a display panel and a manufacturing method of the display panel, the display panel is formed by splicing a bottom plate and at least two sub-display panels, the drive circuit of the adjacent sub-display panel is conducted through a splicing wire which is arranged on at least one side edge of the sub-display panel and is connected with the drive circuit, therefore, the back of the sub-display panel guided by the drive circuit of each sub-display panel is not required to be bound with a printed circuit board, the difficulty of the manufacturing process of the display panel can be reduced, the situation that the light penetrates through the display panel due to the fact that the light is blocked by the printed circuit board and the drive circuit guided to the back of the display panel can be avoided, and the display panel is favorable for.
Drawings
In order to illustrate the embodiments or the technical solutions in the prior art more clearly, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the application, and it is obvious for those skilled in the art that other drawings can be obtained according to these drawings without creative efforts.
Fig. 1 is a schematic plan view of a display panel according to an embodiment of the present disclosure;
FIG. 2 is a schematic cross-sectional view of the display panel of FIG. 1 along the direction A-A' according to the present embodiment;
fig. 3 is a schematic flowchart of a method for manufacturing a display panel according to an embodiment of the present disclosure;
fig. 4A to 4D are schematic structural diagrams of a display panel corresponding to a manufacturing method of the display panel according to an embodiment of the present disclosure.
Detailed Description
The following description of the various embodiments refers to the accompanying drawings, which are included to illustrate specific embodiments that can be implemented by the application. Directional phrases used in this application, such as [ upper ], [ lower ], [ front ], [ rear ], [ left ], [ right ], [ inner ], [ outer ], [ side ], etc., refer only to the directions of the attached drawings. Accordingly, the directional terminology is used for purposes of illustration and understanding, and is in no way limiting. In the drawings, elements having similar structures are denoted by the same reference numerals.
The present application will be further described with reference to the following drawings and specific examples.
The embodiment of the present application provides a display panel, which is described in detail below with reference to fig. 1 and 2. As shown in fig. 1 and fig. 2, fig. 1 is a schematic plan structure diagram of a display panel provided in an embodiment of the present application, and fig. 2 is a schematic cross-sectional structure diagram of the display panel 1 provided in the embodiment of the present application along a-a', where the display panel 1 includes a bottom plate 10 and a plurality of sub-display panels located on the bottom plate 10.
In one embodiment, as shown in fig. 2, each of the sub-display panels includes a substrate 111, a driving circuit layer 112 disposed on the substrate 111, and a plurality of led chips 113 arranged on the driving circuit layer 112 in an array. The driving circuit layer 112 includes a driving circuit 114, and the driving circuit 114 is composed of a plurality of thin film transistors arranged in an array, a storage capacitor, and a signal line for connecting each component in the driving circuit. The driving circuit layer 112 further includes a plurality of splicing wires 115, the splicing wires 115 are located at least one side edge of the sub-display panel, one end of the splicing wires 115 is connected with the driving circuit 114, the other end of the splicing wires 115 is connected with the corresponding splicing wires 115 on the adjacent sub-display panel, the driving circuit 114 of the two adjacent sub-display panels is conducted, thereby the driving circuit of each sub-display panel is not required to be guided to the back of the sub-display panel and is bound with the printed circuit board, not only the difficulty of the display panel manufacturing process can be reduced, but also the printed circuit board and the driving circuit guided to the back of the display panel can be avoided from blocking light to penetrate through the display panel, and the display effect of transparent display of the display panel can be realized.
In one embodiment, the plurality of bonding wires 115 are respectively disposed on one side edge of the sub-display panel close to the adjacent sub-display panel. Taking the display panel 1 shown in fig. 1 as an example, the display panel 1 includes 4 sub-display panels, namely, a first sub-display panel 11, a second sub-display panel 12, a third sub-display panel 13, and a fourth sub-display panel 14, and the structures of the sub-display panels are substantially the same, except that the positions of the bonding wires 115 disposed on the sub-display panels are different. As shown in fig. 1, the right side edge and the lower side edge of the first sub-display panel 11 are respectively spliced with the left side edge of the second sub-display panel 12 and the upper side edge of the third sub-display panel 13, the plurality of splicing wires 115 on the first sub-display panel 11 are respectively located at one side edge of the first sub-display panel 11 close to the second sub-display panel 12 and one side edge of the first sub-display panel 11 close to the third sub-display panel 13, and so on, the positions where the splicing wires 115 are located on the other sub-display panels are also the same, and the description is omitted here. In other embodiments, the number of the sub-display panels in the display panel 1 is not limited to 4 provided in this embodiment, and may also be only 2 sub-display panels spliced left and right or up and down, or may also include more than 2 sub-display panels. The number of the sub-display panels in the display panel 1 may be set according to practical situations, and is not limited herein.
In one embodiment, as shown in fig. 1, each sub-display panel is shaped as a rectangle with the same area, and each long side is connected to the long side of an adjacent sub-display panel, and each short side is connected to the short side of the adjacent sub-display panel. In other embodiments, the shape of the sub-display panel is not limited to the rectangle in this embodiment, and may also be a triangle, a circle, an ellipse, or a polygon, or may also be other special-shaped display panels, the shapes and sizes of a plurality of sub-display panels on the same display panel may be the same or different, the shapes and the splicing manners of the sub-display panels may be set according to actual situations, the distribution of the splicing wires 15 may be adjusted according to the shapes of the sub-display panels, and the present disclosure is not limited herein.
In one embodiment, the end of the patch lead 115 not connected to the driving circuit 114 is configured to extend from a side of the driving circuit layer 112 away from the substrate base 111 to a side connected to a side of the driving circuit layer 112 away from the substrate base 111. As shown in fig. 2, through the side conducting wire manufacturing process, the splicing conducting wire 115 may extend from the side of the driving circuit layer 112 away from the substrate base plate 111 to the side of the driving circuit layer 112 and the substrate base plate 111, as well as the splicing conducting wire 115 of the adjacent sub-display panels, so that the driving circuits 114 of the adjacent two sub-display panels may be electrically connected through the splicing conducting wire 115 extending to the side of the driving circuit layer 112 and the substrate base plate 111, and conduction between the driving circuits 114 of the adjacent two sub-display panels is achieved. The contact area between the splicing wires 115 can be effectively increased by extending the splicing wires 115 to the side edges of the driving circuit layer 112 and the substrate base plate 111, the connection stability between the splicing wires 115 of the adjacent sub-display panels is improved, the phenomenon of open circuit of the splicing wires 115 of the adjacent sub-display panels can be prevented, the resistance of the splicing wires 115 can be effectively reduced, heating of the joints of the splicing wires 115 due to overlarge resistance is prevented, the power consumption of the driving circuit 114 is reduced, and the stability of the display panel 1 is improved.
Further, a spacing space is arranged between two adjacent sub-display panels, the spacing space is filled with a conductive adhesive 116, and the portions of the splicing leads 115 of the two adjacent sub-display panels, which extend to the side connected with the side of the driving circuit layer 112 far away from the substrate base plate 111, are connected through the conductive adhesive 116. As shown in fig. 2, a space exists between the first sub-display panel 11 and the second sub-display panel 12, the bonding wires 115 of the first sub-display panel 11 and the second sub-display panel 12 are located at two sides of the space and electrically connected by the conductive adhesive 116 filled in the space, and the viscosity of the conductive adhesive 116 can prevent the occurrence of an open circuit problem caused by poor contact between the bonding wires 115 connected between different sub-display panels, so as to improve the connection stability of the bonding wires 115 of the adjacent sub-display panels. The width of the spacing space is much smaller than the size of the light emitting diode chip 113, so that the width of the splicing gap between the sub-display panels can be effectively reduced, and the overall display effect of the display panel 1 is improved.
In one embodiment, the bonding wires 115 extend from the top of the side connected to the side of the driving circuit layer 112 away from the substrate base 111 to the bottom of the side of the substrate base 111. As shown in fig. 2, the bonding wires 115 extend from the top of the side of the driving circuit layer 112 to the bottom of the side of the substrate base plate 111, so as to further increase the contact area between the bonding wires 115, and the space is fully filled with the bonding wires 115 and the conductive adhesive 116, thereby eliminating the gap between adjacent sub-display panels, and while enhancing the connection stability of the bonding wires 115, preventing the display device from being damaged due to air or moisture penetrating into the display panel through the gap.
In an embodiment, the conductive adhesive 116 is an Anisotropic Conductive Film (ACF), and the ACF has good adhesion strength and anisotropy, and can conduct in a direction perpendicular to a plane where the splicing conductive lines are located, and does not conduct in other directions, so that the splicing conductive lines of adjacent sub-display panels can be bonded to each other, separation is avoided, the bonding strength of the splicing conductive lines of the adjacent sub-display panels is ensured, a short circuit of a driving circuit can be prevented, and the stability of the display panel is further improved. In other embodiments, the conductive paste 116 may also be other conductive pastes with anisotropy, and the type of the conductive paste 116 may be selected according to practical situations, and is not limited herein.
In an embodiment, the driving circuit 114 includes a plurality of scan lines arranged at intervals, and a plurality of data lines arranged at intervals along a direction perpendicular to the scan lines, and one ends of the plurality of stitching wires 115 connected to the driving circuit 114 are respectively connected to the scan lines and the data lines. Taking the display panel shown in fig. 1 as an example, each sub display panel includes a plurality of data lines arranged at intervals along the direction from the first sub display panel 11 to the second sub display panel 12 and a plurality of scan lines arranged at intervals along the direction from the first sub display panel 11 to the third sub display panel 13, the plurality of scan lines on the first sub display panel 11 are conducted with the corresponding scan lines on the second sub display panel 12 through a plurality of splicing conductive lines 115 located on the right side of the first sub display panel 11 and a plurality of corresponding splicing conductive lines 115 located on the left side of the second sub display panel 12, and the plurality of data lines on the first sub display panel 11 are conducted with the corresponding data lines on the third sub display panel 13 through a plurality of splicing conductive lines 115 located on the lower side of the first sub display panel 11 and a plurality of corresponding splicing conductive lines 115 located on the upper side of the third sub display panel 13. The connection mode between other sub-display panels is substantially the same as that between the sub-display panels, and is not described herein again.
The binding part 17 on the right side of the second sub-display panel 12 is connected with the printed circuit board 15 on the right side through the flip chip on the right side 16 for receiving the gate driving signal, the lower side of the third sub-display panel 13 is connected with the printed circuit board 15 on the lower side through the flip chip on the lower side 16 for receiving the source driving signal, the binding parts 17 are arranged on the right side and the lower side of the fourth sub-display panel 14 and are respectively bound and connected with the printed circuit boards 15 on the right side and the lower side through the flip chip on the right side 16. The flip-chip film 16 and the bonding portion 17 of the sub-display panel are bonded by an adhesive, which may also be an anisotropic conductive film provided in the above embodiments.
In an embodiment, each of the display panels 1 further includes a first packaging layer 117 and a second packaging layer 118, the first packaging layer 117 covers the led chip 113 and other areas of the side surface of the driving circuit layer 112 away from the substrate 111 except for the bonding wires 115, a groove is formed between the first packaging layers 117 on two adjacent sub-display panels, and the second packaging layer 118 fills the groove and covers the bonding wires 115. Taking the display panel shown in fig. 2 as an example, the first encapsulation layer 117 is used to protect the led chip 113 and the driving circuit 114 and expose a portion of the driving circuit 114, one end of the bonding wire 115 is connected to the exposed portion of the driving circuit 114 and covers a portion of the first encapsulation layer 117, and the second encapsulation layer 118 is formed after the sub-display panels are bonded and used to protect the bonding wire 115 and the region where the sub-display panels are bonded and prevent water and oxygen from penetrating into the display panel through the bonding gap between the adjacent sub-display panels and prevent the led chip 113 and the driving circuit 114 in the display panel from being damaged.
In an embodiment, the led chips 113 are micro led chips, the size of which is only about 1-10 μm, and the led chips 113 include a red led chip, a blue led chip and a green led chip, each led chip corresponds to a sub-pixel of one color, and the led chips 113 are arranged on the surface of the driving circuit layer in an array manner according to a predetermined method, so that the display panel can achieve a full-color display effect.
To sum up, the display panel that this application embodiment provided, display panel is formed by bottom plate and two at least sub-display panel concatenations, through set up in each sub-display panel at least one side reason and switch on adjacent sub-display panel's drive circuit with drive circuit's concatenation wire, need not to bind with the back and the printed circuit board that guide each sub-display panel's drive circuit to sub-display panel and be connected, not only can reduce the degree of difficulty of display panel preparation technology, realize little emitting diode display panel's big screen display effect, can also avoid guiding to the printed circuit board at the display panel back and drive circuit to block that light pierces through display panel, be favorable to display panel to realize transparent display's display effect.
The embodiment of the present application further provides a display device, the display device includes a device main body and a display panel arranged in the device main body, the device main body includes a housing, a power supply, a processor, a camera module, a circuit module and other components arranged in the housing, the display panel is the display panel provided by the above embodiment, and the display device provided by the embodiment of the present application can also achieve the same technical effects as the display panel provided by the above embodiment, and the details are not repeated here.
An embodiment of the present application further provides a manufacturing method of a display panel, where the manufacturing method is used to manufacture and form the display panel, and details are described below with reference to fig. 3 and fig. 4A to 4D, fig. 3 is a schematic flow diagram of the manufacturing method of the display panel provided in the embodiment of the present application, fig. 4A to 4D are schematic structural diagrams of the display panel corresponding to the manufacturing method provided in the embodiment of the present application, an upper portion of fig. 4A to 4D is a schematic cross-sectional structure diagram of the display panel, and a lower portion of fig. 4A to 4D is a schematic plane structure diagram, where the manufacturing method includes:
step S10: providing at least two sub-display panels, and forming a plurality of splicing leads connected with the driving circuit on the edge of at least one side of each sub-display panel.
As shown in fig. 4A, a first sub-display panel 21 and a second sub-display panel 22 are provided, each of the first sub-display panel 21 and the second sub-display panel 22 includes a substrate 211, a driving circuit layer 212 and a plurality of light emitting diode chips 213, the driving circuit layer 212 includes a driving circuit 214, and the driving circuit 214 is composed of a plurality of thin film transistors arranged in an array, a capacitor, a plurality of data lines arranged at intervals, and a scanning line.
In one embodiment, the step of forming a plurality of bonding wires 215 connected to the driving circuit 214 on at least one side edge of the sub-display panel includes: a plurality of connection holes are formed at least one side edge of the sub display panel, and the connection holes expose a part of the driving circuit 214; a plurality of bonding wires 215 extending from the side of the driving circuit layer 212 far from the substrate 211 to the side connected to the side of the driving circuit layer 212 far from the substrate 211 are formed by transfer printing or jet printing. In other embodiments, the patterned wire 215 may be formed by depositing a conductive material and then laser engraving.
In one embodiment, the material of the splice wire 215 is Ag. In other embodiments, the stitching wire 215 may also be made of a conductive material such as graphene, which is convenient for the transfer printing and the jet printing processes, and the specific material may be selected according to practical situations, which is not limited herein.
In an embodiment, the bottom plate 20 is made of a transparent glass material, which can improve the transmittance of light on the display panel, so that the display panel can achieve the display effect of transparent display. In other embodiments, the bottom plate 20 may also be made of other transparent materials or opaque materials, or high thermal conductive metal materials such as Al, Cu, etc., and the specific materials may be selected according to practical situations, which are not limited herein.
Step S20: a chassis base 20 is provided, and one of the sub display panels is attached to a corresponding position on the chassis base and fixed.
As shown in fig. 4B, each sub-display panel and the bottom plate 20 are provided with corresponding alignment marks, so that each sub-display panel 21 can be fixed to a corresponding position on the bottom plate 20, and it is ensured that the widths of the splicing gaps between the sub-display panels are consistent. The first sub-display panel 21 is fixed on the base plate 20 by an adhesive 25, and the adhesive 25 may be, but is not limited to, OCA, OCR, SCR, or the like.
Step S30: and connecting the splicing lead 215 on the sub-display panel with the corresponding splicing lead 215 on the other sub-display panel, and attaching the other sub-display panel to the corresponding position on the bottom plate.
As shown in fig. 4C, after the first sub-display panel 21 is fixed on the bottom plate 20, the bonding wires 215 on the second sub-display panel 22 are bonded to the corresponding bonding wires 215 on the first sub-display panel 21 by the conductive adhesive 216, so that the driving circuits 214 of two adjacent sub-display panels are turned on.
In an embodiment, the sub-display panel includes a first encapsulation layer, and the first encapsulation layer covers other regions of the sub-display panel except for the bonding wires, and the manufacturing method further includes:
as shown in fig. 4C, after the second sub-display panel 22 is attached and fixed on the bottom plate 20, the groove formed between the first encapsulation layers 217 of two adjacent sub-display panels is filled with the second encapsulation layer 218, and the second encapsulation layer 218 covers the bonding wires 215, so that the second encapsulation layer 218 can be used to protect the bonding wires 215 and fill the bonding gap between the adjacent first sub-display panel 21 and the second sub-display panel 22, thereby preventing the display device from being damaged due to the intrusion of water vapor and oxygen into the display panel through the bonding gap.
In one embodiment, the manufacturing method further includes:
step S40: repeating the above steps until all the sub-display panels are attached and fixed on the bottom plate 20, and binding the printed circuit board 25 with the binding portions 27 of the sub-display panels through the flip-chip film 26 by the binding process.
As shown in fig. 4D, the right edge of the second sub-display panel 22, the lower edge of the third sub-display panel 23, and the right edge and the lower edge of the fourth sub-display panel 24 are respectively provided with a binding portion, and the printed circuit board 25 is respectively bound and connected with the binding portions of the sub-display panels through the flip chip 26 by a binding process.
To sum up, the embodiment of the present application provides a manufacturing method of a display panel, which is used for manufacturing and forming the display panel, the display panel is formed by splicing a bottom plate and at least two sub-display panels, and a splicing lead connected with a driving circuit is formed at least one side edge of each sub-display panel to switch on a driving circuit of an adjacent sub-display panel, the driving circuit of each sub-display panel is not required to be guided to the back of the sub-display panel and is bound with a printed circuit board, not only can the difficulty of the manufacturing process of the display panel be reduced, but also the printed circuit board and the driving circuit guided to the back of the display panel can be prevented from blocking light from penetrating through the display panel, and the display panel can be favorably realized with a.
In summary, although the present application has been described with reference to the preferred embodiments, the above-described preferred embodiments are not intended to limit the present application, and those skilled in the art can make various changes and modifications without departing from the spirit and scope of the present application, so that the scope of the present application is defined by the appended claims.
Claims (10)
1. A display panel, comprising a bottom plate and at least two sub-display panels located on the bottom plate, wherein any one of the at least two sub-display panels comprises:
a substrate base plate;
the driving circuit layer is arranged on the substrate base plate; and
the plurality of light emitting diode chips are arrayed on one side of the driving circuit layer, which is far away from the substrate base plate;
the driving circuit layer comprises a driving circuit and a plurality of splicing leads, the splicing leads are located on at least one side edge of the corresponding sub-display panel, one end of each splicing lead is connected with the driving circuit, and the other end of each splicing lead is connected with the corresponding splicing lead on the sub-display panel adjacent to the corresponding sub-display panel.
2. The display panel according to claim 1, wherein an end of the patch conductor line not connected to the driver circuit is configured to extend from a side of the driver circuit layer away from the substrate base plate to a side connected to a side of the driver circuit layer away from the substrate base plate.
3. The display panel according to claim 2, wherein the patch conductive line extends from a top of a side connected to a side of the driver circuit layer away from the substrate base to a bottom of a side connected to the substrate base.
4. The display panel according to claim 2, wherein a space is provided between adjacent sub-display panels, the space is filled with a conductive adhesive, and portions of two corresponding bonding wires of two adjacent sub-display panels, which extend to a side connected to a side of the driving circuit layer away from the substrate, are connected by the conductive adhesive.
5. The display panel according to claim 1, wherein the driving circuit includes a plurality of scanning lines arranged at intervals, and a plurality of data lines arranged at intervals in a direction perpendicular to the scanning lines, and one ends of the plurality of the tiling circuits connected to the driving circuit are connected to the scanning lines and the data lines, respectively.
6. The display panel of claim 1, wherein the display panel comprises a first packaging layer and a second packaging layer, the first packaging layer covers the light emitting diode chip and the other area of the side surface of the driving circuit layer away from the substrate except for the splicing conducting wires, a groove is formed between the first packaging layers on two adjacent sub-display panels, and the second packaging layer fills the groove and covers the splicing conducting wires.
7. The display panel of claim 1, wherein at least one side edge of a part of the at least two sub-display panels is provided with a binding portion, the display panel comprises a printed circuit board, and the printed circuit board is bound and connected with the binding portion.
8. A manufacturing method of a display panel is used for manufacturing the display panel, the display panel comprises at least two sub-display panels, any one of the at least two sub-display panels comprises a substrate, a driving circuit layer and a plurality of light emitting diode chips, the driving circuit layer comprises a driving circuit, and the manufacturing method comprises the following steps:
providing at least two sub-display panels, and forming a plurality of splicing leads connected with the driving circuit on the edge of at least one side of the corresponding sub-display panel;
providing a bottom plate, and attaching the other sub-display panel to a corresponding position on the bottom plate and fixing the sub-display panel;
and connecting the splicing lead on the corresponding sub-display panel with the corresponding splicing lead on the other sub-display panel, and attaching the other sub-display panel to the corresponding position on the bottom plate.
9. The method for manufacturing a display panel according to claim 8, wherein the step of forming a plurality of bonding wires connected to the driving circuits of the sub-display panels at least one side edge of the corresponding sub-display panel comprises:
forming a plurality of connecting holes on at least one side edge of the corresponding display panel, wherein part of the driving circuit is exposed out of the connecting holes;
and forming a plurality of splicing leads which extend from one side of the driving circuit layer, which is far away from the substrate base plate, to one side of the driving circuit layer, which is connected with one side of the driving circuit layer, which is far away from the substrate base plate, in a transfer printing or spray printing mode.
10. The method of manufacturing a display panel according to claim 8, wherein any one of the at least two sub-display panels includes a first encapsulation layer covering other regions of the sub-display panels except for the bonding wires, the method further comprising:
and after the corresponding sub-display panels are attached and fixed on the bottom plate, filling a groove formed between the first packaging layers of the adjacent sub-display panels to form a second packaging layer, wherein the second packaging layer covers the splicing wires.
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| CN202110030302.3A CN112837626A (en) | 2021-01-11 | 2021-01-11 | Display panel and manufacturing method thereof |
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| CN202110030302.3A CN112837626A (en) | 2021-01-11 | 2021-01-11 | Display panel and manufacturing method thereof |
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Application publication date: 20210525 |