TWI775506B - Display device and manufacturing method thereof - Google Patents
Display device and manufacturing method thereof Download PDFInfo
- Publication number
- TWI775506B TWI775506B TW110123670A TW110123670A TWI775506B TW I775506 B TWI775506 B TW I775506B TW 110123670 A TW110123670 A TW 110123670A TW 110123670 A TW110123670 A TW 110123670A TW I775506 B TWI775506 B TW I775506B
- Authority
- TW
- Taiwan
- Prior art keywords
- protective layer
- conductive pattern
- display device
- flexible substrate
- display panel
- Prior art date
Links
Images
Landscapes
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Electroluminescent Light Sources (AREA)
- Liquid Crystal (AREA)
- Physical Vapour Deposition (AREA)
- Screen Printers (AREA)
- Led Device Packages (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
Description
本發明是有關於一種顯示裝置及顯示裝置的製造方法。The present invention relates to a display device and a manufacturing method of the display device.
因應顯示裝置的多元化應用,各種製造技術及產品設計都不斷推陳出新。為了提供更多元的應用,窄邊框或無邊框的產品更是陸續被提出。舉例而言,窄邊框或無邊框的產品除了可以供更大面積的功能區(例如顯示區、觸控區等)之外,還可以應用於拼接式的產品(例如拼接顯示面板)中。In response to the diversified applications of display devices, various manufacturing technologies and product designs are constantly being introduced. In order to provide more diverse applications, products with narrow or no borders have been proposed one after another. For example, in addition to providing larger functional areas (such as display areas, touch areas, etc.), products with narrow or no bezels can also be used in spliced products (such as splicing display panels).
本發明提供一種顯示裝置。The present invention provides a display device.
本發明提供一種顯示裝置的製造方法,可製造窄邊框的顯示裝置。The present invention provides a manufacturing method of a display device, which can manufacture a display device with a narrow frame.
本發明的顯示裝置,包括顯示面板、導電圖案、保護層以及軟性基板。顯示面板具有相鄰的第一表面、第二表面以及位於第一表面的顯示區以及周邊區,且包括設置於周邊區的導體接墊,其中周邊區相較於顯示區更接近第二表面。導電圖案配置於顯示面板且電性連接導體接墊,導電圖案由第一表面延伸到第二表面。保護層覆蓋於導體接墊與導電圖案的局部且延伸至至少部分的第二表面。軟性基板配置於第二表面且電性連接於導電圖案。The display device of the present invention includes a display panel, a conductive pattern, a protective layer and a flexible substrate. The display panel has an adjacent first surface, a second surface, a display area and a peripheral area located on the first surface, and includes conductor pads disposed in the peripheral area, wherein the peripheral area is closer to the second surface than the display area. The conductive pattern is disposed on the display panel and is electrically connected to the conductor pads, and the conductive pattern extends from the first surface to the second surface. The protective layer covers part of the conductor pad and the conductive pattern and extends to at least part of the second surface. The flexible substrate is disposed on the second surface and is electrically connected to the conductive pattern.
本發明的顯示裝置的製造方法包括以下步驟,但不以此為限。提供顯示面板,具有相鄰的第一表面、第二表面以及位於第一表面的顯示區以及周邊區,且包括設置於周邊區的導體接墊,其中周邊區相較於顯示區更接近第二表面。於顯示面板上形成導電圖案,其中導電圖案分別電性連接導體接墊且由第一表面延伸到第二表面。形成保護層,以覆蓋導體接墊與導電圖案的局部且延伸至至少部分的第二表面。在保護層形成後,於第二表面上配置一軟性基板,以使軟性基板電性連接於些導電圖案。The manufacturing method of the display device of the present invention includes the following steps, but is not limited thereto. A display panel is provided, which has an adjacent first surface, a second surface, a display area and a peripheral area located on the first surface, and includes conductor pads disposed in the peripheral area, wherein the peripheral area is closer to the second surface than the display area. surface. Conductive patterns are formed on the display panel, wherein the conductive patterns are respectively electrically connected to the conductor pads and extend from the first surface to the second surface. A protective layer is formed to cover part of the conductor pads and the conductive pattern and extend to at least part of the second surface. After the protective layer is formed, a flexible substrate is disposed on the second surface, so that the flexible substrate is electrically connected to the conductive patterns.
在本發明的一實施例中,上述的第二表面的法向方向不同於第一表面的法線方向,導電圖案在第一表面與第二表面之間的連接處具有第一轉折區段而構成L字型的剖面結構,保護層具有覆蓋第一轉折區段的第二轉折區段。In an embodiment of the present invention, the normal direction of the second surface is different from the normal direction of the first surface, and the conductive pattern has a first turning section at the connection between the first surface and the second surface. To form an L-shaped cross-sectional structure, the protective layer has a second inflection section covering the first inflection section.
在本發明的一實施例中,上述的軟性基板具有連接導電圖案且朝向第二表面的第一側,導電圖案具有朝向第一側的第二側,保護層的第二轉折區段位於軟性基板的第一側與導電圖案的第二側之間。In an embodiment of the present invention, the above-mentioned flexible substrate has a first side connected to the conductive pattern and facing the second surface, the conductive pattern has a second side facing the first side, and the second turning section of the protective layer is located on the flexible substrate between the first side of the conductive pattern and the second side of the conductive pattern.
在本發明的一實施例中,上述的導電圖案具有位於第一表面的第一部分,保護層包括覆蓋第一部分的第一子保護層,第一子保護層連續地延伸至第一部分的兩側。In an embodiment of the present invention, the conductive pattern has a first portion located on the first surface, the protective layer includes a first sub-protective layer covering the first portion, and the first sub-protective layer continuously extends to both sides of the first portion.
在本發明的一實施例中,上述的導電圖案具有位於第二表面的第二部分,保護層包括配置在第二部分的兩側的第二子保護層。In an embodiment of the present invention, the above-mentioned conductive pattern has a second portion located on the second surface, and the protective layer includes second sub-protective layers disposed on both sides of the second portion.
基於上述,在本發明的顯示裝置及其製造方法中,藉由先形成保護層於顯示面板的第一表面且延伸至顯示面板的至少部分的第二表面,而可以完整地保護導體接墊與導電圖案的局部。接著,再於第二表面上配置軟性基板。如此一來,顯示裝置在第一表面上可具有較大的元件設置面積供功能元件設置,且顯示裝置可具有窄邊框的設計。Based on the above, in the display device and the manufacturing method thereof of the present invention, by first forming the protective layer on the first surface of the display panel and extending to at least part of the second surface of the display panel, the conductor pads and the conductive pads can be completely protected. Part of the conductive pattern. Next, a flexible substrate is arranged on the second surface. In this way, the display device can have a larger area for disposing functional elements on the first surface, and the display device can have a design with a narrow frame.
為讓本發明的上述特徵和優點能更明顯易懂,下文特舉實施例,並配合所附圖式作詳細說明如下。In order to make the above-mentioned features and advantages of the present invention more obvious and easy to understand, the following embodiments are given and described in detail with the accompanying drawings as follows.
在下文中將參照附圖更全面地描述本發明,在附圖中示出了本發明的示例性實施例。如本領域技術人員將認識到的,可以以各種不同的方式修改所描述的實施例,而不脫離本發明的精神或範圍。The present invention will be described more fully hereinafter with reference to the accompanying drawings, in which exemplary embodiments of the invention are shown. As those skilled in the art would realize, the described embodiments may be modified in various different ways, all without departing from the spirit or scope of the present invention.
在附圖中,為了清楚起見,放大了層、膜、面板、區域等的厚度。在整個說明書中,相同的附圖標記表示相同的元件。應當理解,當諸如層、膜、區域或基板的元件被稱為在另一元件「上」或「連接到」另一元件時,其可以直接在另一元件上或與另一元件連接,或者中間元件可以也存在。相反,當元件被稱為「直接在另一元件上」或「直接連接到」另一元件時,不存在中間元件。如本文所使用的,「連接」可以指物理及/或電性連接。再者,「電性連接」或「耦合」係可為二元件間存在其它元件。In the drawings, the thickness of layers, films, panels, regions, etc., are exaggerated for clarity. The same reference numerals refer to the same elements throughout the specification. It will be understood that when an element such as a layer, film, region or substrate is referred to as being "on" or "connected to" another element, it can be directly on or connected to the other element, or Intermediate elements may also be present. In contrast, when an element is referred to as being "directly on" or "directly connected to" another element, there are no intervening elements present. As used herein, "connected" may refer to a physical and/or electrical connection. Furthermore, "electrically connected" or "coupled" may refer to the existence of other elements between the two elements.
此外,諸如「下」或「底部」和「上」或「頂部」的相對術語可在本文中用於描述一個元件與另一元件的關係,如圖所示。應當理解,相對術語旨在包括除了圖中所示的方位之外的裝置的不同方位。例如,如果一個附圖中的裝置翻轉,則被描述為在其他元件的「下」側的元件將被定向在其他元件的「上」側。因此,示例性術語「下」可以包括「下」和「上」的取向,取決於附圖的特定取向。類似地,如果一個附圖中的裝置翻轉,則被描述為在其它元件「下方」或「下方」的元件將被定向為在其它元件「上方」。因此,示例性術語「上面」或「下面」可以包括上方和下方的取向。Furthermore, relative terms such as "lower" or "bottom" and "upper" or "top" may be used herein to describe one element's relationship to another element, as shown in the figures. It should be understood that relative terms are intended to encompass different orientations of the device in addition to the orientation shown in the figures. For example, if the device in one of the figures is turned over, elements described as being on the "lower" side of other elements would then be oriented on "upper" sides of the other elements. Thus, the exemplary term "lower" may include an orientation of "lower" and "upper", depending on the particular orientation of the figures. Similarly, if the device in one of the figures is turned over, elements described as "below" or "beneath" other elements would then be oriented "above" the other elements. Thus, the exemplary terms "above" or "below" can encompass both an orientation of above and below.
本文使用的「約」、「近似」、或「實質上」包括所述值和在本領域普通技術人員確定的特定值的可接受的偏差範圍內的平均值,考慮到所討論的測量和與測量相關的誤差的特定數量(即,測量系統的限制)。例如,「約」可以表示在所述值的一個或多個標準偏差內,或±30%、±20%、±10%、±5%內。再者,本文使用的「約」、「近似」或「實質上」可依光學性質、蝕刻性質或其它性質,來選擇較可接受的偏差範圍或標準偏差,而可不用一個標準偏差適用全部性質。As used herein, "about", "approximately", or "substantially" includes the stated value and the average value within an acceptable deviation of the particular value as determined by one of ordinary skill in the art, considering the measurement in question and the A specified amount of measurement-related error (ie, a limitation of the measurement system). For example, "about" can mean within one or more standard deviations of the stated value, or within ±30%, ±20%, ±10%, ±5%. Furthermore, as used herein, "about", "approximately" or "substantially" may be used to select a more acceptable range of deviation or standard deviation depending on optical properties, etching properties or other properties, and not one standard deviation may apply to all properties. .
本文參考作為理想化實施例的示意圖的截面圖來描述示例性實施例。因此,可以預期到作為例如製造技術及/或(and/or)公差的結果的圖示的形狀變化。因此,本文所述的實施例不應被解釋為限於如本文所示的區域的特定形狀,而是包括例如由製造導致的形狀偏差。例如,示出或描述為平坦的區域通常可以具有粗糙及/或非線性特徵。此外,所示的銳角可以是圓的。因此,圖中所示的區域本質上是示意性的,並且它們的形狀不是旨在示出區域的精確形狀,並且不是旨在限制請求項的範圍。Exemplary embodiments are described herein with reference to cross-sectional illustrations that are schematic illustrations of idealized embodiments. Thus, variations in the shape of the illustrations as a result of, for example, manufacturing techniques and/or (and/or) tolerances can be expected. Accordingly, the embodiments described herein should not be construed as limited to the particular shapes of regions as shown herein, but rather include deviations in shapes resulting from, for example, manufacturing. For example, regions illustrated or described as flat may typically have rough and/or nonlinear features. Additionally, the acute angles shown may be rounded. Thus, the regions illustrated in the figures are schematic in nature and their shapes are not intended to illustrate the precise shape of a region and are not intended to limit the scope of the claims.
除非另有定義,本文使用的所有術語(包括技術和科學術語)具有與本發明所屬領域的普通技術人員通常理解的相同的含義。將進一步理解的是,諸如在通常使用的字典中定義的那些術語應當被解釋為具有與它們在相關技術和本發明的上下文中的含義一致的含義,並且將不被解釋為理想化的或過度正式的意義,除非本文中明確地這樣定義。Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. It will be further understood that terms such as those defined in commonly used dictionaries should be construed as having meanings consistent with their meanings in the context of the related art and the present invention, and are not to be construed as idealized or excessive Formal meaning, unless expressly defined as such herein.
本案圖式中標註了X方向、Y方向、Z方向以呈現圖面中各構件的配置關係,X方向、Y方向、Z方向彼此相交,但不限定彼此正交。圖1至圖3呈現本發明的一實施例的製造顯示裝置的部分步驟。圖4為本發明的一實施例的顯示裝置的局部俯視示意圖。在圖1中,於顯示面板110上預先形成導體接墊120。顯示面板110為具有一定機械強度而可以承載物件,以供多個膜層及/或多個物件配置其上的板狀物。在一些實施例中,顯示面板110為單基板,且材質包括玻璃、高分子材料、陶瓷等。顯示面板110會先被切割成適當的大小,並進行磨邊,再配置導體接墊120。顯示面板110具有第一表面112、第二表面114、第三表面116以及位於第一表面112的顯示區A1以及周邊區E1(以虛線示意性地區分顯示區A1以及周邊區E1)。第二表面114連接於第一表面112與第三表面116之間。周邊區E1相較於顯示區A1更接近第二表面114。The X direction, the Y direction, and the Z direction are marked in the drawing to show the arrangement relationship of the components in the drawing. The X direction, the Y direction, and the Z direction intersect with each other, but are not limited to be orthogonal to each other. 1 to 3 illustrate some steps of manufacturing a display device according to an embodiment of the present invention. FIG. 4 is a partial top schematic view of a display device according to an embodiment of the present invention. In FIG. 1 ,
在此,第二表面114的法線方向不同於第一表面112的法線方向,也不同於第三表面116的法線方向。在一些實施例中,第一表面112的法線方向與第三表面116的法向方向可彼此平行,但不以此為限。舉例而言,第一表面112與第三表面116例如分別為平行於X方向-Y方向的平面,而第二表面114則平行於Y方向-Z方向的平面。在另外一些實施例中,第二表面114上所設置的構件可應用於其他第二表面,例如平行於X方向-Z方向的平面的第二表面。在一些實施例中,還可在顯示面板110的第一表面112上設置包括電性連接於導體接墊120的畫素電路結構(圖1未示出)。Here, the normal direction of the
在圖1中,導體接墊120的數量為多個,且多個導體接墊120可沿著Y方向排列設置。導體接墊120位於第一表面112上,且導體接墊120設置在顯示面板110的周邊區E1。此外,導體接墊120可配置在顯示面板110的單側,亦或是配置在顯示面板110的相對兩側,導體接墊120的數量及配置可視實際需求而定,本發明不以此為限。In FIG. 1 , the number of the
在圖2中,於顯示面板110上形成多個導電圖案130,導電圖案130具有位於第一表面112的第一部分131以及位於第二表面114的第二部分132。導電圖案130配置於顯示面板110的周邊區E1。多個條狀的導電圖案130可沿Y方向排列,且對應於導體接墊120。導電圖案130與導體接墊120一對一設置。換言之,導電圖案130的數量可相同於導體接墊120的數量,因此每個導電圖案130都僅重疊一個導體接墊120。In FIG. 2 , a plurality of
此處,導電圖案130可採用邊緣轉印,濺鍍或噴墨的方式形成於顯示面板110上。導電圖案130例如是銀膠,本發明不以此為限。導電圖案130可以連續的由第一表面112延伸到第二表面114。導電圖案130可以接觸且直接覆蓋住導體接墊120,以電性連接導體接墊120。在一些實施例中,導電圖案130沿Z方向在第一表面112上的正投影可以重疊導體接墊120沿Z方向在第一表面112上的正投影。在一些實施例中,導電圖案130可電連接於顯示面板110上所設置畫素電路結構。Here, the
在圖3與圖4中,於顯示面板110上形成保護層140,保護層140覆蓋於導體接墊120與導電圖案130的局部且延伸至至少部分的第二表面114。導電圖案130在第一表面112與第二表面114之間的連接處具有第一轉折區段B1而構成L字型的剖面結構。保護層140具有覆蓋第一轉折區段B1的第二轉折區段B2。具體來說,顯示面板110還具有連接於第一表面112與第二表面114之間的倒角部分。第一轉折區段B1與第二轉折區段B2皆對應於第一表面112與第二表面114之間的倒角部分。In FIGS. 3 and 4 , a
由於保護層140會從第一表面112越過第一表面112的邊緣至第二表面114的局部,故保護層140可以覆蓋暴露於顯示面板110正面的導電圖案130。如圖4所示,保護層140沿Z方向在第一表面112上的正投影可以完全重疊導體接墊120與導電圖案130沿Z方向在第一表面112上的正投影。Since the
在一些實施例中,保護層140可採用轉印方式製作於顯示面板110上。保護層140例如是Tuffy膠、UV膠或其他防水絕緣膠。在一些製作流程中,可先將保護層140塗佈或是施加於印刷工具上,再以印刷工具抵壓顯示面板110的第二表面114,使得印刷工具上的保護層140附著於顯示面板110的第一表面112。另外,印刷工具可採用彈性材質,例如橡膠等,製作。因此,當印刷工具抵壓顯示面板110的第二表面114時,輕壓邊緣端使印刷工具上的保護層140附著到顯示面板110的第一表面112的邊緣。舉例而言,印刷工具在印刷過程中可沿X方向朝向顯示面板110移動就將保護層140轉印於第一表面112與第二表面114。接著,移除印刷工具後,可對附著於顯示面板110上的保護層140進行固化步驟。在其他實施例中,也可採用噴塗或其他適當的方式,使保護層140附著於顯示面板110上的適當位置,並不以上述為限。In some embodiments, the
在上述的配置方式之下,而獲得如圖5所示的顯示裝置100。圖5為本發明的一實施例的顯示裝置的局部剖面示意圖,其中圖5的剖面結構可對應於圖3的線I-I’。在圖5中,顯示裝置100可包括顯示面板110、導體接墊120、導電圖案130、保護層140以及軟性基板160,其中顯示面板110、導體接墊120、導電圖案130與保護層140的相對配置關係可參照圖1至圖4的描述。Under the above configuration, the
具體而言,顯示面板110為單基板例如為玻璃基板、石英機板、陶瓷基板、高分子基板、複合基板或是其他具有支撐性與足夠機械強度的板狀物。顯示面板110具有第一表面112、第二表面114以及第三表面116。第二表面114連接於第一表面112與第三表面116之間,且第二表面114的法向方向不同於第一表面112也不同於第三表面116。第一表面112與第三表面116的法向方向可以相同,例如平行於Z方向,而第二表面114的法向方向例如平行X方向,但不以此為限。在一些實施例中,顯示面板110可為透明基板,但在另一些實施例中,顯示面板110可為不透明基板。Specifically, the
導體接墊120配置於顯示面板110的第一表面112上,且用於提供電傳輸通道以將顯示面板110上的畫素電路結構(未示出)電連接至其他構件,例如軟性基板160。此處,軟性基板160例如包括驅動晶片。將導體接墊120製作於顯示面板110的第一表面112上的過程中,可一併於第一表面112上製作畫素電路結構。所謂的畫素電路結構可包括主動元件、電容、訊號線等。同時,導體接墊120可以連接至畫素電路結構中的訊號線以用於傳輸電訊號給畫素電路結構。在一些實施例中,顯示裝置100還包括配置於第一表面112上的功能元件,以提供需要的功能。舉例而言,功能元件可包括顯示元件等。畫素電路結構可用於驅動功能元件,使顯示裝置100提供顯示功能等。The
導電圖案130配置於顯示面板110上,且直接接觸導體接墊120。軟性基板160可接合至導電圖案130,從而電連接至位於第一表面112上的導體接墊120。軟性基板160配置於第二表面114且電性連接於導電圖案130。軟性基板160可透過導電接合層170接合於導電圖案130。在X方向上,導電接合層170會與保護層140疊合(Overlap)。導電接合層170的材質可包括異方性導電膠、焊錫或是其他可提供導電接合作用的材料。The
發光二極體顯示器無縫拼接可將尺寸大型化,為了達到零邊界(Zero Border),顯示器正面與薄膜覆晶封裝(Chip On Film, COF)接合(Bonding)的區域必需縮小。在一些作法中,當COF接合於顯示器正面後,會將COF沿著顯示面板邊緣的轉角處彎折以降低拼接接縫的存在感。接著,再塗膠體固定COF於顯示器正面,膠體會覆蓋裸露出的金屬區域,以免金屬會因環境因素造成電性不良。但由於顯示器正面的接合區域太小,膠體與顯示器之間的接合力可能不足,COF Bonding區域容易產生剝離(Peeling)。這會造成接觸不良或阻抗上升等問題,為改善上述問題,可以改採側面接合(Side Bonding)的技術,將導體接墊延伸到顯示器側面。不過,在已經配置COF於顯示器側面的情況下,COF高度會因為切割與接合對位的公差,使空間縫隙與填補高度較不可控制,故需選擇黏度較低的膠,確保膠體滲入所有縫隙中。但上述方式的問題是,Bonding區域很窄,黏度較低的膠體容易溢流至顯示區或其他非預期的區域,這將會影響製程良率,且先COF Bonding的話,因為縫隙較多,比較不容易做到完整的保護措施。若業者提高膠體的黏度,則有膠厚不易控制,不利於後續製程與無法確實填補縫隙等問題。舉例來說,膠厚不易控制會導致表面不平整,之後將發光二極體配置於其上會容易有干涉問題。The seamless splicing of light-emitting diode displays can increase the size. In order to achieve zero border (Zero Border), the area where the front side of the display and the chip on film (COF) bonding (bonding) area must be reduced. In some practices, after the COF is joined to the front of the display, the COF is bent along the corners of the edge of the display panel to reduce the presence of the spliced seam. Next, apply colloid to fix the COF on the front of the display. The colloid will cover the exposed metal area to prevent the metal from causing electrical failure due to environmental factors. However, since the bonding area on the front side of the display is too small, the bonding force between the colloid and the display may be insufficient, and peeling is likely to occur in the COF Bonding area. This will cause problems such as poor contact or increased impedance. In order to improve the above problems, the technology of side bonding can be used instead, and the conductor pads can be extended to the side of the display. However, when the COF has been placed on the side of the display, the height of the COF will be uncontrollable due to the tolerance of cutting and joint alignment, so the gap and filling height are uncontrollable. Therefore, it is necessary to choose a glue with a lower viscosity to ensure that the glue penetrates into all the gaps. . However, the problem with the above method is that the bonding area is very narrow, and the colloid with low viscosity is easy to overflow into the display area or other unexpected areas, which will affect the process yield. Complete protection measures are not easy to achieve. If the manufacturer increases the viscosity of the colloid, it will be difficult to control the thickness of the glue, which is not conducive to the subsequent process and cannot fill the gap. For example, the difficulty in controlling the thickness of the glue will cause the surface to be uneven, and then there will be interference problems when the light-emitting diodes are disposed thereon.
本實施例的顯示裝置100,藉由在接合軟性基板160於顯示面板110之前就先配置保護層140,使保護層140至少連續的設置於顯示面板110的第一表面112至第二表面114且覆蓋導體接墊120、導電圖案130的一部分。具體來說,本實施例的軟性基板160在Z方向的延伸方向不重疊於保護層140在Z方向的延伸方向。換言之,本實施例的顯示裝置100可以省略將軟性基板160彎折至顯示面板110的第一表面112的步驟,且軟性基板160也不會被保護層140覆蓋,但不以此為限。In the
在本實施例中,保護層140會從第一表面112越過第一表面112的邊緣至第二表面114的局部。這樣的好處在於,可以較完整地包覆裸露的金屬區域,且因為軟性基板160尚未接合,故較不需要考慮縫隙小且不易填補等問題,且可選用適當黏度的保護層140,以較佳地控制保護層140的厚度,以利於後續製程(例如配置發光二極體)並提高製程良率。此外,由於軟性基板160是接合於第二表面114,故保護層140填補量的多寡不會受軟性基板160的高度影響。如此一來,業者不會被限制於僅能選擇黏度低的保護層140,而可以選擇適當黏度的保護層140,來保護金屬裸露區域。接著,接合軟性基板160。In the present embodiment, the
換句話說,在配置保護層140之後再配置軟性基板160的話,就可以選用適當的流動性、黏度的保護層140,保護層140的黏度選擇範圍較不受限。在配置保護層140的過程中,保護層140不會隨意的流動,而可以解決保護層140容易溢流、厚度不易控制或無法確實填補縫隙等問題。In other words, if the
此外,在圖5中,軟性基板160具有連接導電圖案130且朝向第二表面114的第一側162,導電圖案130具有朝向第一側162的第二側134,保護層140的第二轉折區段B2位於軟性基板160的第一側162與導電圖案130的第二側134之間。In addition, in FIG. 5 , the
圖6至圖8為本發明的其他實施例的顯示裝置的立體示意圖。需注意的是,圖6至圖8中省略了軟性基板的繪示。請參考圖6,顯示裝置100B可包括顯示面板110、導體接墊120、導電圖案130以及保護層140B,且可採用圖1至圖4的製作方法製作,因此顯示面板110、導體接墊120與導電圖案130的相對配置關係可參照圖1至圖4的描述。顯示裝置100B不同於顯示裝置100之處主要在於,保護層140B的分佈。6 to 8 are schematic perspective views of display devices according to other embodiments of the present invention. It should be noted that the illustration of the flexible substrate is omitted in FIGS. 6 to 8 . Referring to FIG. 6 , the
在本實施例中,保護層140B包括覆蓋導電圖案130的第一部分131的第一子保護層141B,第一子保護層141B延伸至導電圖案130的第一部分131在Y方向上的兩側。具體來說,第一表面112具有相對的第一邊1121以及第二邊1122,且第一子保護層141B呈條狀的圖案,並延伸至第一邊1121以及第二邊1122。In this embodiment, the
請參考圖7,顯示裝置100C不同於顯示裝置100B之處主要在於,保護層140C的分佈。在本實施例中,保護層140C包括覆蓋導電圖案130的第一部分131的第一子保護層141C以及自第一子保護層141C延伸至第二表面114的第二子保護層142C。第二子保護層142C暴露出部分的第二部分132。第二子保護層142C配置在導電圖案130的第二部分132在Y方向上的兩側,而可阻擋側邊的水氣。在一些實施例中,保護層140C的材質包括深色材料,例如墨水,故可達到抗反射以及遮光的效果。Referring to FIG. 7 , the
請參考圖8,顯示裝置100D不同於顯示裝置100C之處主要在於,保護層140D的分佈。在本實施例中,第二表面114具有相對的第一邊1141以及第二邊1142。位於導電圖案130的第二部分132的一側的第二子保護層142D會延伸至第一邊1141,位於導電圖案130的第二部分132的另一側的第二子保護層142D會延伸至以及第二邊1142,而可阻擋導電圖案130的第二部分132的兩側的水氣。在一些實施例中,保護層140D的材質包括深色材料,例如墨水,故可達到抗反射以及均勻的遮光效果。Referring to FIG. 8 , the
綜上所述,在本發明的顯示裝置及其製造方法中,藉由先形成保護層於顯示面板的第一表面且延伸至顯示面板的至少部分的第二表面,而可以完整地保護導體接墊與導電圖案的局部。接著,再於第二表面上配置軟性基板。因此,保護層不會覆蓋到軟性基板上,故不會因軟性基板的切割會有公差或者是接合對位會有公差,而產生保護層填補高度與空間縫隙較不可控制等問題。如此一來,業者不會被限制於僅能選擇黏度低的保護層,而可以選擇適當黏度的保護層,以有效地控制保護層的延展性且具有較佳的保護效果,進而可以解決保護層容易溢流、厚度不易控制或無法確實填補縫隙等問題。在一些實施例中,保護層的材質包括深色材料,故可達到抗反射以及遮光的效果。在一些實施例中,保護層具有延伸至導電圖案位於第二表面的部分的左右兩側的第二子保護層,而可阻擋側邊的水氣,且可抗反射以及使遮光的效果更加均勻。To sum up, in the display device and the manufacturing method thereof of the present invention, by first forming the protective layer on the first surface of the display panel and extending to at least part of the second surface of the display panel, the conductor connection can be completely protected. Parts of pads and conductive patterns. Next, a flexible substrate is arranged on the second surface. Therefore, the protective layer will not cover the flexible substrate, so there will be no problems such as uncontrollable filling height of the protective layer and uncontrollable space gap due to the tolerance of the cutting of the flexible substrate or the tolerance of the joint alignment. In this way, the industry is not limited to only choosing a protective layer with low viscosity, but can choose a protective layer with an appropriate viscosity to effectively control the ductility of the protective layer and have a better protective effect, which can solve the problem of the protective layer. It is easy to overflow, the thickness is not easy to control, or the gap cannot be filled properly. In some embodiments, the material of the protective layer includes a dark material, so that anti-reflection and light-shielding effects can be achieved. In some embodiments, the protective layer has second sub-protective layers extending to the left and right sides of the portion of the conductive pattern located on the second surface, which can block moisture from the side, and can resist reflection and make the shading effect more uniform. .
雖然本發明已以實施例揭露如上,然其並非用以限定本發明,任何所屬技術領域中具有通常知識者,在不脫離本發明的精神和範圍內,當可作些許的更動與潤飾,故本發明的保護範圍當視後附的申請專利範圍所界定者為準。Although the present invention has been disclosed above by the embodiments, it is not intended to limit the present invention. Anyone with ordinary knowledge in the technical field can make some changes and modifications without departing from the spirit and scope of the present invention. Therefore, The protection scope of the present invention shall be determined by the scope of the appended patent application.
100、100B、100C、100D:顯示裝置
110:顯示面板
112:第一表面
1121:第一邊
1122:第二邊
114:第二表面
1141:第一邊
1142:第二邊
116:第三表面
120:導體接墊
130:導電圖案
131:第一部分
132:第二部分
134:第二側
140、140B、140C、140D:保護層
141B、141C、141D:第一子保護層
142C、142D:第二子保護層
160:軟性基板
162:第一側
170:導電接合層
A1:顯示區
B1:第一轉折區段
B2:第二轉折區段
E1:周邊區
I-I’:線
X、Y、Z:方向100, 100B, 100C, 100D: display device
110: Display panel
112: First Surface
1121: First side
1122: Second side
114: Second Surface
1141: First side
1142: Second side
116: Third Surface
120: Conductor pads
130: Conductive Pattern
131: Part One
132: Part Two
134:
圖1至圖3呈現本發明的一實施例的製造顯示裝置的部分步驟。 圖4為本發明的一實施例的顯示裝置的局部俯視示意圖。 圖5為本發明的一實施例的顯示裝置的局部剖面示意圖。 圖6至圖8為本發明的其他實施例的顯示裝置的立體示意圖。1 to 3 illustrate some steps of manufacturing a display device according to an embodiment of the present invention. FIG. 4 is a partial top schematic view of a display device according to an embodiment of the present invention. FIG. 5 is a partial cross-sectional schematic diagram of a display device according to an embodiment of the present invention. 6 to 8 are schematic perspective views of display devices according to other embodiments of the present invention.
100:顯示裝置100: Display device
110:顯示面板110: Display panel
112:第一表面112: First Surface
114:第二表面114: Second Surface
116:第三表面116: Third Surface
120:導體接墊120: Conductor pads
130:導電圖案130: Conductive Pattern
131:第一部分131: Part One
132:第二部分132: Part Two
134:第二側134: Second Side
140:保護層140: protective layer
160:軟性基板160: Flexible substrate
162:第一側162: First Side
170:導電接合層170: Conductive bonding layer
B1:第一轉折區段B1: The first turning section
B2:第二轉折區段B2: Second turning section
X、Z:方向X, Z: direction
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202110923235.8A CN113674614B (en) | 2020-08-14 | 2021-08-12 | Display device and method for manufacturing the same |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US202063065641P | 2020-08-14 | 2020-08-14 | |
US63/065,641 | 2020-08-14 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW202207192A TW202207192A (en) | 2022-02-16 |
TWI775506B true TWI775506B (en) | 2022-08-21 |
Family
ID=78283416
Family Applications (13)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW109136358A TWI737520B (en) | 2020-08-14 | 2020-10-21 | Display panel |
TW109141519A TWI741885B (en) | 2020-08-14 | 2020-11-26 | Display device |
TW109146921A TWI749974B (en) | 2020-08-14 | 2020-12-30 | Display apparatus |
TW110100092A TWI753735B (en) | 2020-08-14 | 2021-01-04 | Display device |
TW110104760A TWI751020B (en) | 2020-08-14 | 2021-02-08 | Electronic device and manufacturing method of electronic device |
TW110105874A TWI750034B (en) | 2020-08-14 | 2021-02-19 | Sputtering equipment and operation method thereof |
TW110107470A TWI761100B (en) | 2020-08-14 | 2021-03-03 | Electronic device |
TW110108336A TWI758124B (en) | 2020-08-14 | 2021-03-09 | Flat display device and manufacturing method of flat display device |
TW110112666A TWI763419B (en) | 2020-08-14 | 2021-04-08 | Printing apparatus and printing method |
TW110112830A TWI761171B (en) | 2020-08-14 | 2021-04-09 | Panel device and manufacturing method of panel device |
TW110123670A TWI775506B (en) | 2020-08-14 | 2021-06-29 | Display device and manufacturing method thereof |
TW110124073A TWI758203B (en) | 2020-08-14 | 2021-06-30 | Display device and manufacturing method thereof |
TW110125040A TWI767785B (en) | 2020-08-14 | 2021-07-07 | Display device and manufacturing method thereof |
Family Applications Before (10)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW109136358A TWI737520B (en) | 2020-08-14 | 2020-10-21 | Display panel |
TW109141519A TWI741885B (en) | 2020-08-14 | 2020-11-26 | Display device |
TW109146921A TWI749974B (en) | 2020-08-14 | 2020-12-30 | Display apparatus |
TW110100092A TWI753735B (en) | 2020-08-14 | 2021-01-04 | Display device |
TW110104760A TWI751020B (en) | 2020-08-14 | 2021-02-08 | Electronic device and manufacturing method of electronic device |
TW110105874A TWI750034B (en) | 2020-08-14 | 2021-02-19 | Sputtering equipment and operation method thereof |
TW110107470A TWI761100B (en) | 2020-08-14 | 2021-03-03 | Electronic device |
TW110108336A TWI758124B (en) | 2020-08-14 | 2021-03-09 | Flat display device and manufacturing method of flat display device |
TW110112666A TWI763419B (en) | 2020-08-14 | 2021-04-08 | Printing apparatus and printing method |
TW110112830A TWI761171B (en) | 2020-08-14 | 2021-04-09 | Panel device and manufacturing method of panel device |
Family Applications After (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW110124073A TWI758203B (en) | 2020-08-14 | 2021-06-30 | Display device and manufacturing method thereof |
TW110125040A TWI767785B (en) | 2020-08-14 | 2021-07-07 | Display device and manufacturing method thereof |
Country Status (1)
Country | Link |
---|---|
TW (13) | TWI737520B (en) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI801172B (en) * | 2022-03-22 | 2023-05-01 | 友達光電股份有限公司 | Electronic device |
TWI812124B (en) * | 2022-03-28 | 2023-08-11 | 李銘洛 | Electronic module and carrier structure thereof and manufacturing method thereof |
TWI814434B (en) * | 2022-04-01 | 2023-09-01 | 友達光電股份有限公司 | Light emitting diode array substrate |
TWI839096B (en) * | 2023-01-31 | 2024-04-11 | 友達光電股份有限公司 | Display device and tiling display |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW201504872A (en) * | 2013-07-17 | 2015-02-01 | Wintek Corp | Touch panel and touch display device |
CN107870472A (en) * | 2016-09-22 | 2018-04-03 | 三星显示有限公司 | Display device and its manufacture method |
TW201913192A (en) * | 2017-09-11 | 2019-04-01 | 友達光電股份有限公司 | Array substrate |
US20190312224A1 (en) * | 2018-04-10 | 2019-10-10 | Canon Kabushiki Kaisha | Display apparatus and method of manufacturing the same |
TW202006448A (en) * | 2018-07-04 | 2020-02-01 | 南韓商三星電子股份有限公司 | Display panel and large format display apparatus using the same |
US20200152896A1 (en) * | 2018-04-02 | 2020-05-14 | Samsung Display Co., Ltd. | Display device and method for manufacturing display device |
Family Cites Families (49)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4749465A (en) * | 1985-05-09 | 1988-06-07 | Seagate Technology | In-line disk sputtering system |
US6317248B1 (en) * | 1998-07-02 | 2001-11-13 | Donnelly Corporation | Busbars for electrically powered cells |
US6460369B2 (en) * | 1999-11-03 | 2002-10-08 | Applied Materials, Inc. | Consecutive deposition system |
EP1376212A1 (en) * | 2002-06-21 | 2004-01-02 | Asulab S.A. | Display cell, in particular comprising liquid crystals, or photovoltaic cell comprising connection means to a driver circuit |
TWI278417B (en) * | 2006-04-14 | 2007-04-11 | Yi-Sung Tzeng | Automatic storage controlling system for a sputtering machine and method for carrying jigs |
JP2009105081A (en) * | 2007-10-19 | 2009-05-14 | Ebatekku:Kk | Substrate processing apparatus |
DE112009003614T5 (en) * | 2008-11-14 | 2013-01-24 | Tokyo Electron Ltd. | Substrate processing system |
TWI540361B (en) * | 2011-07-05 | 2016-07-01 | 友達光電股份有限公司 | Method for cutting mother board of display panel |
DE102012221002A1 (en) * | 2012-11-16 | 2014-05-22 | Jumatech Gmbh | Angled and / or angled printed circuit board structure with at least two printed circuit board sections and method for their production |
TW201432532A (en) * | 2013-02-05 | 2014-08-16 | Unidisplay Inc | Touch panel and manufacturing method thereof and touch display panel |
WO2015042309A1 (en) * | 2013-09-20 | 2015-03-26 | Applied Materials, Inc. | Substrate carrier with integrated electrostatic chuck |
TWI520851B (en) * | 2013-09-26 | 2016-02-11 | 余敏守 | Marking and printing device for metal workpieces |
KR102109752B1 (en) * | 2013-10-02 | 2020-05-12 | 엘지이노텍 주식회사 | Circuit board and lighting device having the circuit board |
JP6303024B2 (en) * | 2013-12-23 | 2018-03-28 | アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated | Holding arrangement for holding a substrate under a vacuum process, apparatus for depositing a layer on a substrate, and method for transporting a holding arrangement |
KR102380645B1 (en) * | 2014-07-31 | 2022-03-31 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | Display device and electronic device |
CN106573462B (en) * | 2014-08-08 | 2019-07-09 | 株式会社富士 | Silk-screen printing device |
JP6401373B2 (en) * | 2015-02-19 | 2018-10-10 | 富士フイルム株式会社 | Printing apparatus and printing method |
KR102304632B1 (en) * | 2015-07-17 | 2021-09-24 | 엘지디스플레이 주식회사 | Display device |
KR102403671B1 (en) * | 2015-09-18 | 2022-05-27 | 엘지디스플레이 주식회사 | Display Device |
KR102655712B1 (en) * | 2016-09-07 | 2024-04-11 | 삼성디스플레이 주식회사 | Display device and method for manufacturing the same |
TWI610281B (en) * | 2017-03-09 | 2018-01-01 | 友達光電股份有限公司 | Display panel |
TWI621900B (en) * | 2017-04-28 | 2018-04-21 | 友達光電股份有限公司 | Display and method of fabricating the same |
US10416509B2 (en) * | 2017-07-31 | 2019-09-17 | Shenzhen China Star Optoelectronics Technology Co., Ltd | Display panel, electronic device, and display panel fabrication method |
CN107323078A (en) * | 2017-08-26 | 2017-11-07 | 梅明会 | A kind of weaving dyeing and printing device easy to use |
CN107544715A (en) * | 2017-09-08 | 2018-01-05 | 业成科技(成都)有限公司 | Touch control display apparatus |
JP2020507534A (en) * | 2017-12-21 | 2020-03-12 | 北京▲伯▼陽頂栄光伏科技有限公司 | Substrate tray return device, substrate tray return method, and fully automatic coating machine |
KR20190083014A (en) * | 2018-01-02 | 2019-07-11 | 삼성디스플레이 주식회사 | Display device |
TWI642044B (en) * | 2018-01-09 | 2018-11-21 | 友達光電股份有限公司 | Electronic device and manufacturing method thereof |
TWI662525B (en) * | 2018-02-07 | 2019-06-11 | 友達光電股份有限公司 | Electronic device |
TWI649795B (en) * | 2018-02-13 | 2019-02-01 | 友達光電股份有限公司 | Display panel |
TWI648574B (en) * | 2018-02-22 | 2019-01-21 | 友達光電股份有限公司 | Display panel |
TWI669816B (en) * | 2018-04-18 | 2019-08-21 | 友達光電股份有限公司 | Tiling display panel and manufacturing method thereof |
CN108582187A (en) * | 2018-05-07 | 2018-09-28 | 长泰朗德机械设备有限公司 | A kind of printing equipment that processing effect is good |
TWI662341B (en) * | 2018-05-31 | 2019-06-11 | 友達光電股份有限公司 | Display apparatus |
CN108957878B (en) * | 2018-07-19 | 2022-03-11 | 武汉天马微电子有限公司 | Display module, preparation method thereof and display device |
TWI674466B (en) * | 2018-07-30 | 2019-10-11 | 友達光電股份有限公司 | Display panel and manufacturing method thereof |
KR20200019813A (en) * | 2018-08-14 | 2020-02-25 | 삼성디스플레이 주식회사 | Display apparatus and manufacturing the same |
TWI687740B (en) * | 2019-01-02 | 2020-03-11 | 友達光電股份有限公司 | Thin film transistor driving circuit and liquid crystal display device |
TWI702453B (en) * | 2019-01-04 | 2020-08-21 | 友達光電股份有限公司 | Display device and manufacturing method thereof |
TWI734074B (en) * | 2019-01-30 | 2021-07-21 | 友達光電股份有限公司 | Display panel and manufacturing method thereof |
CN109739057B (en) * | 2019-02-28 | 2023-02-07 | 京东方科技集团股份有限公司 | Display device and binding method of display substrate |
CN110277018B (en) * | 2019-06-24 | 2020-12-25 | 武汉华星光电技术有限公司 | Display panel and preparation method thereof |
CN110764323A (en) * | 2019-10-18 | 2020-02-07 | 深圳市华星光电技术有限公司 | Display panel, manufacturing method thereof and display device |
CN210626839U (en) * | 2019-11-28 | 2020-05-26 | 维沃移动通信有限公司 | Display module and electronic equipment |
CN110928061B (en) * | 2019-11-29 | 2022-04-26 | 武汉华星光电技术有限公司 | Display panel and display device |
CN110967881B (en) * | 2019-12-30 | 2023-05-30 | Tcl华星光电技术有限公司 | Display panel and preparation method thereof |
CN111192883A (en) * | 2020-01-08 | 2020-05-22 | 深圳市华星光电半导体显示技术有限公司 | Side edge binding structure of display panel and manufacturing method thereof |
CN111427202A (en) * | 2020-04-08 | 2020-07-17 | 深圳市华星光电半导体显示技术有限公司 | Narrow-frame display panel and display device |
CN111352270B (en) * | 2020-04-16 | 2023-01-31 | 京东方科技集团股份有限公司 | Liquid crystal display panel, manufacturing method thereof and liquid crystal display device |
-
2020
- 2020-10-21 TW TW109136358A patent/TWI737520B/en active
- 2020-11-26 TW TW109141519A patent/TWI741885B/en active
- 2020-12-30 TW TW109146921A patent/TWI749974B/en active
-
2021
- 2021-01-04 TW TW110100092A patent/TWI753735B/en active
- 2021-02-08 TW TW110104760A patent/TWI751020B/en active
- 2021-02-19 TW TW110105874A patent/TWI750034B/en active
- 2021-03-03 TW TW110107470A patent/TWI761100B/en active
- 2021-03-09 TW TW110108336A patent/TWI758124B/en active
- 2021-04-08 TW TW110112666A patent/TWI763419B/en active
- 2021-04-09 TW TW110112830A patent/TWI761171B/en active
- 2021-06-29 TW TW110123670A patent/TWI775506B/en active
- 2021-06-30 TW TW110124073A patent/TWI758203B/en active
- 2021-07-07 TW TW110125040A patent/TWI767785B/en active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW201504872A (en) * | 2013-07-17 | 2015-02-01 | Wintek Corp | Touch panel and touch display device |
CN107870472A (en) * | 2016-09-22 | 2018-04-03 | 三星显示有限公司 | Display device and its manufacture method |
TW201913192A (en) * | 2017-09-11 | 2019-04-01 | 友達光電股份有限公司 | Array substrate |
US20200152896A1 (en) * | 2018-04-02 | 2020-05-14 | Samsung Display Co., Ltd. | Display device and method for manufacturing display device |
US20190312224A1 (en) * | 2018-04-10 | 2019-10-10 | Canon Kabushiki Kaisha | Display apparatus and method of manufacturing the same |
TW202006448A (en) * | 2018-07-04 | 2020-02-01 | 南韓商三星電子股份有限公司 | Display panel and large format display apparatus using the same |
Also Published As
Publication number | Publication date |
---|---|
TW202207504A (en) | 2022-02-16 |
TWI741885B (en) | 2021-10-01 |
TWI761100B (en) | 2022-04-11 |
TW202206904A (en) | 2022-02-16 |
TWI753735B (en) | 2022-01-21 |
TW202206294A (en) | 2022-02-16 |
TWI761171B (en) | 2022-04-11 |
TW202206900A (en) | 2022-02-16 |
TW202206907A (en) | 2022-02-16 |
TWI763419B (en) | 2022-05-01 |
TW202206909A (en) | 2022-02-16 |
TW202206899A (en) | 2022-02-16 |
TWI749974B (en) | 2021-12-11 |
TW202207190A (en) | 2022-02-16 |
TWI758124B (en) | 2022-03-11 |
TW202206905A (en) | 2022-02-16 |
TW202206906A (en) | 2022-02-16 |
TWI750034B (en) | 2021-12-11 |
TWI758203B (en) | 2022-03-11 |
TW202206627A (en) | 2022-02-16 |
TWI767785B (en) | 2022-06-11 |
TW202207192A (en) | 2022-02-16 |
TW202207498A (en) | 2022-02-16 |
TWI737520B (en) | 2021-08-21 |
TWI751020B (en) | 2021-12-21 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TWI775506B (en) | Display device and manufacturing method thereof | |
KR102490624B1 (en) | Flexible Display and Method for Manufacturing the Same | |
EP3136164B1 (en) | Liquid crystal display device | |
WO2019037501A1 (en) | Substrate, manufacturing method therefor, display panel, manufacturing method therefor, and tiled screens | |
US9343621B2 (en) | Liquid crystal display panel and manufacturing method thereof | |
US20090197111A1 (en) | Method of producing electro-optical device and electro-optical device | |
TWI734074B (en) | Display panel and manufacturing method thereof | |
WO2021003784A1 (en) | Display device and manufacturing method therefor | |
JPWO2007063667A1 (en) | Circuit member, electrode connection structure, and display device including the same | |
CN113674614B (en) | Display device and method for manufacturing the same | |
WO2018126710A1 (en) | Touch panel, touch display device and touch panel preparation method | |
KR102348373B1 (en) | Liquid crystal display device | |
WO2015089892A1 (en) | Array substrate and manufacturing method thereof and display device | |
KR20110033602A (en) | Liquid crystal display and manufacturing method thereof | |
US11372289B2 (en) | Display panel comprising at least one binding alignment block having a thickness greater than a thickness of each of a plurality of binding pins and method of manufacturing the same | |
US20090208731A1 (en) | Conductive adhesive film, method of producing conductive adhesive film, electronic apparatus including conductive adhesive film, and method of producing electronic apparatus including conductive adhesive film | |
WO2018161781A1 (en) | Bonding region structure, manufacturing method therefor, panel, and touch display device | |
US20220317508A1 (en) | Display substrate and method for manufacturing the same, display device | |
CN113156722A (en) | Liquid crystal display panel and preparation method thereof | |
JP2000111939A (en) | Liquid crystal display device | |
TWI817805B (en) | Display panel and display device | |
TWI843409B (en) | Display device | |
JP2008233636A (en) | Liquid crystal display device and manufacturing method thereof | |
TWI783616B (en) | Stretchable display panel | |
TWI712835B (en) | Display panel and method for manufacturing the same |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
GD4A | Issue of patent certificate for granted invention patent |