TWI775506B - Display device and manufacturing method thereof - Google Patents

Abstract

A display device including a display panel, a conductive pattern, a protective layer and a flexible substrate. The display panel has a first surface and a second surface adjacent to each other, a display area and a periphery area on the first surface, and include conductive pad disposed in the periphery area, wherein the periphery area is closer to the second surface than the display area. The conductive pattern is disposed on the display panel and electrically connected to the conductive pad. The conductive pattern extends from the first surface to the second surface. The protective layer covers a part of the conductive pad and the conductive pattern and extends to at least a part of the second surface. The flexible substrate is disposed on the second surface and is electrically connected to the conductive pattern. Another method for manufacturing a display device is provided.

Description

Display device and method of manufacturing the same

The present invention relates to a display device and a manufacturing method of the display device.

In response to the diversified applications of display devices, various manufacturing technologies and product designs are constantly being introduced. In order to provide more diverse applications, products with narrow or no borders have been proposed one after another. For example, in addition to providing larger functional areas (such as display areas, touch areas, etc.), products with narrow or no bezels can also be used in spliced products (such as splicing display panels).

The present invention provides a display device.

The present invention provides a manufacturing method of a display device, which can manufacture a display device with a narrow frame.

The display device of the present invention includes a display panel, a conductive pattern, a protective layer and a flexible substrate. The display panel has an adjacent first surface, a second surface, a display area and a peripheral area located on the first surface, and includes conductor pads disposed in the peripheral area, wherein the peripheral area is closer to the second surface than the display area. The conductive pattern is disposed on the display panel and is electrically connected to the conductor pads, and the conductive pattern extends from the first surface to the second surface. The protective layer covers part of the conductor pad and the conductive pattern and extends to at least part of the second surface. The flexible substrate is disposed on the second surface and is electrically connected to the conductive pattern.

The manufacturing method of the display device of the present invention includes the following steps, but is not limited thereto. A display panel is provided, which has an adjacent first surface, a second surface, a display area and a peripheral area located on the first surface, and includes conductor pads disposed in the peripheral area, wherein the peripheral area is closer to the second surface than the display area. surface. Conductive patterns are formed on the display panel, wherein the conductive patterns are respectively electrically connected to the conductor pads and extend from the first surface to the second surface. A protective layer is formed to cover part of the conductor pads and the conductive pattern and extend to at least part of the second surface. After the protective layer is formed, a flexible substrate is disposed on the second surface, so that the flexible substrate is electrically connected to the conductive patterns.

In an embodiment of the present invention, the normal direction of the second surface is different from the normal direction of the first surface, and the conductive pattern has a first turning section at the connection between the first surface and the second surface. To form an L-shaped cross-sectional structure, the protective layer has a second inflection section covering the first inflection section.

In an embodiment of the present invention, the above-mentioned flexible substrate has a first side connected to the conductive pattern and facing the second surface, the conductive pattern has a second side facing the first side, and the second turning section of the protective layer is located on the flexible substrate between the first side of the conductive pattern and the second side of the conductive pattern.

In an embodiment of the present invention, the conductive pattern has a first portion located on the first surface, the protective layer includes a first sub-protective layer covering the first portion, and the first sub-protective layer continuously extends to both sides of the first portion.

In an embodiment of the present invention, the above-mentioned conductive pattern has a second portion located on the second surface, and the protective layer includes second sub-protective layers disposed on both sides of the second portion.

Based on the above, in the display device and the manufacturing method thereof of the present invention, by first forming the protective layer on the first surface of the display panel and extending to at least part of the second surface of the display panel, the conductor pads and the conductive pads can be completely protected. Part of the conductive pattern. Next, a flexible substrate is arranged on the second surface. In this way, the display device can have a larger area for disposing functional elements on the first surface, and the display device can have a design with a narrow frame.

In order to make the above-mentioned features and advantages of the present invention more obvious and easy to understand, the following embodiments are given and described in detail with the accompanying drawings as follows.

The present invention will be described more fully hereinafter with reference to the accompanying drawings, in which exemplary embodiments of the invention are shown. As those skilled in the art would realize, the described embodiments may be modified in various different ways, all without departing from the spirit or scope of the present invention.

In the drawings, the thickness of layers, films, panels, regions, etc., are exaggerated for clarity. The same reference numerals refer to the same elements throughout the specification. It will be understood that when an element such as a layer, film, region or substrate is referred to as being "on" or "connected to" another element, it can be directly on or connected to the other element, or Intermediate elements may also be present. In contrast, when an element is referred to as being "directly on" or "directly connected to" another element, there are no intervening elements present. As used herein, "connected" may refer to a physical and/or electrical connection. Furthermore, "electrically connected" or "coupled" may refer to the existence of other elements between the two elements.

Furthermore, relative terms such as "lower" or "bottom" and "upper" or "top" may be used herein to describe one element's relationship to another element, as shown in the figures. It should be understood that relative terms are intended to encompass different orientations of the device in addition to the orientation shown in the figures. For example, if the device in one of the figures is turned over, elements described as being on the "lower" side of other elements would then be oriented on "upper" sides of the other elements. Thus, the exemplary term "lower" may include an orientation of "lower" and "upper", depending on the particular orientation of the figures. Similarly, if the device in one of the figures is turned over, elements described as "below" or "beneath" other elements would then be oriented "above" the other elements. Thus, the exemplary terms "above" or "below" can encompass both an orientation of above and below.

As used herein, "about", "approximately", or "substantially" includes the stated value and the average value within an acceptable deviation of the particular value as determined by one of ordinary skill in the art, considering the measurement in question and the A specified amount of measurement-related error (ie, a limitation of the measurement system). For example, "about" can mean within one or more standard deviations of the stated value, or within ±30%, ±20%, ±10%, ±5%. Furthermore, as used herein, "about", "approximately" or "substantially" may be used to select a more acceptable range of deviation or standard deviation depending on optical properties, etching properties or other properties, and not one standard deviation may apply to all properties. .

Exemplary embodiments are described herein with reference to cross-sectional illustrations that are schematic illustrations of idealized embodiments. Thus, variations in the shape of the illustrations as a result of, for example, manufacturing techniques and/or (and/or) tolerances can be expected. Accordingly, the embodiments described herein should not be construed as limited to the particular shapes of regions as shown herein, but rather include deviations in shapes resulting from, for example, manufacturing. For example, regions illustrated or described as flat may typically have rough and/or nonlinear features. Additionally, the acute angles shown may be rounded. Thus, the regions illustrated in the figures are schematic in nature and their shapes are not intended to illustrate the precise shape of a region and are not intended to limit the scope of the claims.

Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. It will be further understood that terms such as those defined in commonly used dictionaries should be construed as having meanings consistent with their meanings in the context of the related art and the present invention, and are not to be construed as idealized or excessive Formal meaning, unless expressly defined as such herein.

The X direction, the Y direction, and the Z direction are marked in the drawing to show the arrangement relationship of the components in the drawing. The X direction, the Y direction, and the Z direction intersect with each other, but are not limited to be orthogonal to each other. 1 to 3 illustrate some steps of manufacturing a display device according to an embodiment of the present invention. FIG. 4 is a partial top schematic view of a display device according to an embodiment of the present invention. In FIG. 1 , conductor pads 120 are pre-formed on the display panel 110 . The display panel 110 has a certain mechanical strength and can support objects, so that a plurality of film layers and/or a plurality of objects are arranged on the plate. In some embodiments, the display panel 110 is a single substrate, and the material includes glass, polymer materials, ceramics, and the like. The display panel 110 will be cut to an appropriate size and edged, and then the conductor pads 120 will be arranged. The display panel 110 has a first surface 112 , a second surface 114 , a third surface 116 , and a display area A1 and a peripheral area E1 located on the first surface 112 (the display area A1 and the peripheral area E1 are schematically distinguished by dotted lines). The second surface 114 is connected between the first surface 112 and the third surface 116 . The peripheral area E1 is closer to the second surface 114 than the display area A1.

Here, the normal direction of the second surface 114 is different from the normal direction of the first surface 112 and is also different from the normal direction of the third surface 116 . In some embodiments, the normal direction of the first surface 112 and the normal direction of the third surface 116 may be parallel to each other, but not limited thereto. For example, the first surface 112 and the third surface 116 are respectively a plane parallel to the X direction-Y direction, and the second surface 114 is a plane parallel to the Y direction-Z direction. In other embodiments, the components disposed on the second surface 114 can be applied to other second surfaces, for example, the second surface parallel to the plane of the X direction-Z direction. In some embodiments, a pixel circuit structure (not shown in FIG. 1 ) that is electrically connected to the conductor pads 120 may also be disposed on the first surface 112 of the display panel 110 .

In FIG. 1 , the number of the conductor pads 120 is multiple, and the multiple conductor pads 120 may be arranged along the Y direction. The conductor pads 120 are located on the first surface 112 , and the conductor pads 120 are disposed in the peripheral area E1 of the display panel 110 . In addition, the conductor pads 120 can be arranged on one side of the display panel 110 or on opposite sides of the display panel 110 . The number and arrangement of the conductor pads 120 can be determined according to actual needs, and the present invention is not limited thereto. .

In FIG. 2 , a plurality of conductive patterns 130 are formed on the display panel 110 . The conductive patterns 130 have a first portion 131 located on the first surface 112 and a second portion 132 located on the second surface 114 . The conductive pattern 130 is disposed in the peripheral area E1 of the display panel 110 . A plurality of strip-shaped conductive patterns 130 may be arranged along the Y direction and correspond to the conductor pads 120 . The conductive patterns 130 and the conductor pads 120 are arranged one-to-one. In other words, the number of the conductive patterns 130 may be the same as the number of the conductor pads 120 , so each conductive pattern 130 overlaps only one conductor pad 120 .

Here, the conductive pattern 130 may be formed on the display panel 110 by means of edge transfer, sputtering or inkjet. The conductive pattern 130 is, for example, silver paste, but the invention is not limited thereto. The conductive pattern 130 may extend continuously from the first surface 112 to the second surface 114 . The conductive patterns 130 may contact and directly cover the conductor pads 120 to electrically connect the conductor pads 120 . In some embodiments, the orthographic projection of the conductive pattern 130 on the first surface 112 in the Z direction may overlap the orthographic projection of the conductor pads 120 on the first surface 112 in the Z direction. In some embodiments, the conductive pattern 130 may be electrically connected to the pixel circuit structure disposed on the display panel 110 .

In FIGS. 3 and 4 , a protective layer 140 is formed on the display panel 110 . The protective layer 140 covers part of the conductor pads 120 and the conductive patterns 130 and extends to at least part of the second surface 114 . The conductive pattern 130 has a first turning section B1 at the connection between the first surface 112 and the second surface 114 to form an L-shaped cross-sectional structure. The protective layer 140 has a second inflection section B2 covering the first inflection section B1. Specifically, the display panel 110 also has a chamfered portion connected between the first surface 112 and the second surface 114 . Both the first turning section B1 and the second turning section B2 correspond to the chamfered portion between the first surface 112 and the second surface 114 .

Since the protective layer 140 spans from the edge of the first surface 112 to a part of the second surface 114 from the first surface 112 , the protective layer 140 can cover the conductive patterns 130 exposed on the front surface of the display panel 110 . As shown in FIG. 4 , the orthographic projection of the protective layer 140 on the first surface 112 along the Z direction may completely overlap the orthographic projection of the conductor pads 120 and the conductive pattern 130 on the first surface 112 along the Z direction.

In some embodiments, the protective layer 140 may be fabricated on the display panel 110 by a transfer method. The protective layer 140 is, for example, Tuffy glue, UV glue or other waterproof insulating glue. In some manufacturing processes, the protective layer 140 may be coated or applied on the printing tool first, and then the printing tool is pressed against the second surface 114 of the display panel 110 , so that the protective layer 140 on the printing tool is attached to the display panel 110 of the first surface 112 . In addition, the printing tool can be made of elastic material, such as rubber. Therefore, when the printing tool is pressed against the second surface 114 of the display panel 110 , the edge end is lightly pressed so that the protective layer 140 on the printing tool is attached to the edge of the first surface 112 of the display panel 110 . For example, during the printing process, the printing tool can move toward the display panel 110 along the X direction to transfer the protective layer 140 to the first surface 112 and the second surface 114 . Next, after removing the printing tool, a curing step may be performed on the protective layer 140 attached to the display panel 110 . In other embodiments, the protective layer 140 may also be attached to a proper position on the display panel 110 by spraying or other appropriate methods, which is not limited to the above.

Under the above configuration, the display device 100 shown in FIG. 5 is obtained. 5 is a partial cross-sectional schematic diagram of a display device according to an embodiment of the present invention, wherein the cross-sectional structure of FIG. 5 may correspond to the line I-I' of FIG. 3 . In FIG. 5 , the display device 100 may include a display panel 110 , conductor pads 120 , a conductive pattern 130 , a protective layer 140 and a flexible substrate 160 , wherein the display panel 110 , the conductor pads 120 , the conductive pattern 130 and the protective layer 140 are opposite to each other. For the configuration relationship, reference may be made to the descriptions in FIG. 1 to FIG. 4 .

Specifically, the display panel 110 is a single substrate, such as a glass substrate, a quartz plate, a ceramic substrate, a polymer substrate, a composite substrate, or other plate-like objects with support and sufficient mechanical strength. The display panel 110 has a first surface 112 , a second surface 114 and a third surface 116 . The second surface 114 is connected between the first surface 112 and the third surface 116 , and the normal direction of the second surface 114 is different from that of the first surface 112 and the third surface 116 . The normal directions of the first surface 112 and the third surface 116 may be the same, for example, parallel to the Z direction, and the normal direction of the second surface 114, for example, parallel to the X direction, but not limited thereto. In some embodiments, the display panel 110 may be a transparent substrate, but in other embodiments, the display panel 110 may be an opaque substrate.

The conductor pads 120 are disposed on the first surface 112 of the display panel 110 and are used for providing electrical transmission channels to electrically connect the pixel circuit structure (not shown) on the display panel 110 to other components, such as the flexible substrate 160 . Here, the flexible substrate 160 includes, for example, a driving wafer. During the process of fabricating the conductor pads 120 on the first surface 112 of the display panel 110 , the pixel circuit structure may be fabricated on the first surface 112 at the same time. The so-called pixel circuit structure may include active elements, capacitors, signal lines, and the like. Meanwhile, the conductor pads 120 can be connected to signal lines in the pixel circuit structure for transmitting electrical signals to the pixel circuit structure. In some embodiments, the display device 100 further includes functional elements disposed on the first surface 112 to provide required functions. For example, the functional elements may include display elements and the like. The pixel circuit structure can be used to drive functional elements to enable the display device 100 to provide display functions and the like.

The conductive patterns 130 are disposed on the display panel 110 and directly contact the conductive pads 120 . The flexible substrate 160 may be bonded to the conductive pattern 130 to be electrically connected to the conductor pads 120 on the first surface 112 . The flexible substrate 160 is disposed on the second surface 114 and is electrically connected to the conductive pattern 130 . The flexible substrate 160 can be bonded to the conductive pattern 130 through the conductive bonding layer 170 . In the X direction, the conductive bonding layer 170 overlaps with the protective layer 140 . The material of the conductive bonding layer 170 may include anisotropic conductive adhesive, solder, or other materials that can provide conductive bonding.

The seamless splicing of light-emitting diode displays can increase the size. In order to achieve zero border (Zero Border), the area where the front side of the display and the chip on film (COF) bonding (bonding) area must be reduced. In some practices, after the COF is joined to the front of the display, the COF is bent along the corners of the edge of the display panel to reduce the presence of the spliced seam. Next, apply colloid to fix the COF on the front of the display. The colloid will cover the exposed metal area to prevent the metal from causing electrical failure due to environmental factors. However, since the bonding area on the front side of the display is too small, the bonding force between the colloid and the display may be insufficient, and peeling is likely to occur in the COF Bonding area. This will cause problems such as poor contact or increased impedance. In order to improve the above problems, the technology of side bonding can be used instead, and the conductor pads can be extended to the side of the display. However, when the COF has been placed on the side of the display, the height of the COF will be uncontrollable due to the tolerance of cutting and joint alignment, so the gap and filling height are uncontrollable. Therefore, it is necessary to choose a glue with a lower viscosity to ensure that the glue penetrates into all the gaps. . However, the problem with the above method is that the bonding area is very narrow, and the colloid with low viscosity is easy to overflow into the display area or other unexpected areas, which will affect the process yield. Complete protection measures are not easy to achieve. If the manufacturer increases the viscosity of the colloid, it will be difficult to control the thickness of the glue, which is not conducive to the subsequent process and cannot fill the gap. For example, the difficulty in controlling the thickness of the glue will cause the surface to be uneven, and then there will be interference problems when the light-emitting diodes are disposed thereon.

In the display device 100 of this embodiment, the protective layer 140 is disposed before the flexible substrate 160 is bonded to the display panel 110 , so that the protective layer 140 is continuously disposed on at least the first surface 112 to the second surface 114 of the display panel 110 and Covers the conductor pads 120 and a part of the conductive pattern 130 . Specifically, the extension direction of the flexible substrate 160 in the Z direction in this embodiment does not overlap with the extension direction of the protective layer 140 in the Z direction. In other words, the display device 100 of this embodiment may omit the step of bending the flexible substrate 160 to the first surface 112 of the display panel 110 , and the flexible substrate 160 will not be covered by the protective layer 140 , but not limited thereto.

In the present embodiment, the protective layer 140 will extend from the edge of the first surface 112 to a part of the second surface 114 from the first surface 112 . The advantage of this is that the exposed metal area can be covered more completely, and because the flexible substrate 160 has not yet been joined, it is less necessary to consider the problems of small gaps and difficult to fill, and the protective layer 140 with an appropriate viscosity can be selected to better The thickness of the protective layer 140 is appropriately controlled to facilitate subsequent processes (eg, configuring light-emitting diodes) and improve the process yield. In addition, since the flexible substrate 160 is bonded to the second surface 114 , the filling amount of the protective layer 140 is not affected by the height of the flexible substrate 160 . In this way, the manufacturer is not limited to only select the protective layer 140 with low viscosity, but can select the protective layer 140 with appropriate viscosity to protect the exposed metal area. Next, the flexible substrate 160 is bonded.

In other words, if the flexible substrate 160 is disposed after the protective layer 140 is disposed, the protective layer 140 with appropriate fluidity and viscosity can be selected, and the selection range of the viscosity of the protective layer 140 is not limited. In the process of disposing the protective layer 140 , the protective layer 140 will not flow randomly, which can solve the problems that the protective layer 140 is easy to overflow, the thickness is difficult to control, or the gap cannot be filled reliably.

In addition, in FIG. 5 , the flexible substrate 160 has a first side 162 connected to the conductive pattern 130 and facing the second surface 114 , the conductive pattern 130 has a second side 134 facing the first side 162 , and a second turning area of the protective layer 140 Segment B2 is located between the first side 162 of the flexible substrate 160 and the second side 134 of the conductive pattern 130 .

6 to 8 are schematic perspective views of display devices according to other embodiments of the present invention. It should be noted that the illustration of the flexible substrate is omitted in FIGS. 6 to 8 . Referring to FIG. 6 , the display device 100B may include a display panel 110 , conductor pads 120 , conductive patterns 130 and a protective layer 140B, and may be fabricated by using the fabrication methods of FIGS. 1 to 4 . Therefore, the display panel 110 , conductor pads 120 and The relative arrangement relationship of the conductive patterns 130 can be referred to the description of FIG. 1 to FIG. 4 . The display device 100B is different from the display device 100 mainly in the distribution of the protective layer 140B.

In this embodiment, the protective layer 140B includes a first sub-protective layer 141B covering the first portion 131 of the conductive pattern 130 , and the first sub-protective layer 141B extends to both sides of the first portion 131 of the conductive pattern 130 in the Y direction. Specifically, the first surface 112 has opposite first sides 1121 and second sides 1122 , and the first sub-protective layer 141B has a strip-like pattern extending to the first sides 1121 and the second sides 1122 .

Referring to FIG. 7 , the display device 100C is different from the display device 100B mainly in the distribution of the protective layer 140C. In the present embodiment, the protective layer 140C includes a first sub-protective layer 141C covering the first portion 131 of the conductive pattern 130 and a second sub-protective layer 142C extending from the first sub-protective layer 141C to the second surface 114 . The second sub-protection layer 142C exposes a portion of the second portion 132 . The second sub-protection layer 142C is disposed on both sides of the second portion 132 of the conductive pattern 130 in the Y direction, and can block moisture from the side. In some embodiments, the material of the protective layer 140C includes a dark material, such as ink, so that anti-reflection and light-shielding effects can be achieved.

Referring to FIG. 8 , the display device 100D is different from the display device 100C mainly in the distribution of the protective layer 140D. In this embodiment, the second surface 114 has opposite first sides 1141 and second sides 1142 . The second sub-protective layer 142D on one side of the second portion 132 of the conductive pattern 130 extends to the first side 1141 , and the second sub-protective layer 142D on the other side of the second portion 132 of the conductive pattern 130 extends to and the second side 1142 , so as to block water vapor on both sides of the second portion 132 of the conductive pattern 130 . In some embodiments, the material of the protective layer 140D includes a dark material, such as ink, so that anti-reflection and uniform light-shielding effects can be achieved.

To sum up, in the display device and the manufacturing method thereof of the present invention, by first forming the protective layer on the first surface of the display panel and extending to at least part of the second surface of the display panel, the conductor connection can be completely protected. Parts of pads and conductive patterns. Next, a flexible substrate is arranged on the second surface. Therefore, the protective layer will not cover the flexible substrate, so there will be no problems such as uncontrollable filling height of the protective layer and uncontrollable space gap due to the tolerance of the cutting of the flexible substrate or the tolerance of the joint alignment. In this way, the industry is not limited to only choosing a protective layer with low viscosity, but can choose a protective layer with an appropriate viscosity to effectively control the ductility of the protective layer and have a better protective effect, which can solve the problem of the protective layer. It is easy to overflow, the thickness is not easy to control, or the gap cannot be filled properly. In some embodiments, the material of the protective layer includes a dark material, so that anti-reflection and light-shielding effects can be achieved. In some embodiments, the protective layer has second sub-protective layers extending to the left and right sides of the portion of the conductive pattern located on the second surface, which can block moisture from the side, and can resist reflection and make the shading effect more uniform. .

Although the present invention has been disclosed above by the embodiments, it is not intended to limit the present invention. Anyone with ordinary knowledge in the technical field can make some changes and modifications without departing from the spirit and scope of the present invention. Therefore, The protection scope of the present invention shall be determined by the scope of the appended patent application.

100, 100B, 100C, 100D: display device 110: Display panel 112: First Surface 1121: First side 1122: Second side 114: Second Surface 1141: First side 1142: Second side 116: Third Surface 120: Conductor pads 130: Conductive Pattern 131: Part One 132: Part Two 134: Second Side 140, 140B, 140C, 140D: protective layer 141B, 141C, 141D: the first sub-protective layer 142C, 142D: Second sub-protective layer 160: Flexible substrate 162: First Side 170: Conductive bonding layer A1: Display area B1: The first turning section B2: Second turning section E1: Surrounding area I-I': line X, Y, Z: direction

1 to 3 illustrate some steps of manufacturing a display device according to an embodiment of the present invention. FIG. 4 is a partial top schematic view of a display device according to an embodiment of the present invention. FIG. 5 is a partial cross-sectional schematic diagram of a display device according to an embodiment of the present invention. 6 to 8 are schematic perspective views of display devices according to other embodiments of the present invention.

100: Display device

110: Display panel

112: First Surface

114: Second Surface

116: Third Surface

120: Conductor pads

130: Conductive Pattern

131: Part One

132: Part Two

134: Second Side

140: protective layer

160: Flexible substrate

162: First Side

170: Conductive bonding layer

B1: The first turning section

B2: Second turning section

X, Z: direction

Claims (10)

A display device, comprising: a display panel having adjacent first surfaces, second surfaces, a display area and a peripheral area located on the first surface, and comprising conductor pads arranged in the peripheral area, wherein the peripheral area is The second surface is closer to the display area than the display area, and the normal direction of the second surface is different from the normal direction of the first surface; the conductive pattern is arranged on the display panel and is electrically connected to the conductor pad, the conductive pattern a pattern extending from the first surface to the second surface; a protective layer covering a part of the conductor pad and the conductive pattern and extending to at least part of the second surface; and a flexible substrate disposed on the second surface and electrically connected to the conductive pattern. The display device as claimed in claim 1, wherein the conductive pattern has a first turning section at the connection between the first surface and the second surface to form an L-shaped cross-sectional structure, and the protective layer has an L-shaped cross-sectional structure covering the conductive pattern. The second inflection section of the first inflection section. The display device of claim 2, wherein the flexible substrate has a first side connected to the conductive pattern and facing the second surface, the conductive pattern has a second side facing the first side, the first side of the protective layer Two inflection sections are located between the first side of the flexible substrate and the second side of the conductive pattern. The display device of claim 1, wherein the conductive pattern has a first portion located on the first surface, and the protective layer has a surface covering the first portion a first sub-protection layer, the first sub-protection layer continuously extends to both sides of the first part. The display device of claim 4, wherein the conductive pattern has a second portion located on the second surface, and the protective layer has second sub-protective layers disposed on both sides of the second portion. A method of manufacturing a display device, comprising: providing a display panel having adjacent first surfaces, second surfaces, a display area and a peripheral area located on the first surface, and including conductor pads disposed in the peripheral area, wherein The peripheral area is closer to the second surface than the display area, and the normal direction of the second surface is different from the normal direction of the first surface; forming conductive patterns on the display panel, wherein the conductive patterns are respectively electrically connecting the conductor pad and extending from the first surface to the second surface; forming a protective layer to cover the conductor pad and part of the conductive pattern and extending to at least part of the second surface; and in the protection After the layer is formed, a flexible substrate is disposed on the second surface, so that the flexible substrate is electrically connected to the conductive patterns. The method for manufacturing a display device as claimed in claim 6, wherein the conductive pattern has a first turning section at the connection between the first surface and the second surface to form an L-shaped cross-sectional structure, and the protective layer There is a second inflection section covering the first inflection section. The manufacturing method of a display device according to claim 7, wherein the flexible substrate has a first side connected to the conductive pattern and facing the second surface, the conductive The electrical pattern has a second side facing the first side, and the second turning section of the protective layer is located between the first side of the flexible substrate and the second side of the conductive pattern. The manufacturing method of a display device as claimed in claim 6, wherein the conductive pattern has a first portion located on the first surface, the protective layer has a first sub-protective layer covering the first portion, and the first sub-protective layer is continuous extends to both sides of the first portion. The manufacturing method of a display device as claimed in claim 9, wherein the conductive pattern has a second portion located on the second surface, and the protective layer has second sub-protective layers disposed on both sides of the second portion.

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