CN110967881B - Display panel and preparation method thereof - Google Patents
Display panel and preparation method thereof Download PDFInfo
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- CN110967881B CN110967881B CN201911391351.9A CN201911391351A CN110967881B CN 110967881 B CN110967881 B CN 110967881B CN 201911391351 A CN201911391351 A CN 201911391351A CN 110967881 B CN110967881 B CN 110967881B
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- 238000002360 preparation method Methods 0.000 title abstract description 9
- 239000000758 substrate Substances 0.000 claims abstract description 158
- 239000010408 film Substances 0.000 claims abstract description 119
- 238000005520 cutting process Methods 0.000 claims abstract description 29
- 238000000227 grinding Methods 0.000 claims abstract description 26
- 239000003292 glue Substances 0.000 claims abstract description 18
- 239000004973 liquid crystal related substance Substances 0.000 claims abstract description 14
- 239000010409 thin film Substances 0.000 claims abstract description 12
- 238000000034 method Methods 0.000 claims description 12
- 230000002093 peripheral effect Effects 0.000 claims description 10
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 6
- 238000004519 manufacturing process Methods 0.000 claims description 6
- 239000000565 sealant Substances 0.000 claims description 4
- 239000011248 coating agent Substances 0.000 claims description 3
- 238000000576 coating method Methods 0.000 claims description 3
- 239000011521 glass Substances 0.000 abstract description 6
- 239000012634 fragment Substances 0.000 abstract 1
- 150000001875 compounds Chemical class 0.000 description 3
- 238000003825 pressing Methods 0.000 description 3
- 238000007789 sealing Methods 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- 239000004332 silver Substances 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- UTMWFJSRHLYRPY-UHFFFAOYSA-N 3,3',5,5'-tetrachlorobiphenyl Chemical compound ClC1=CC(Cl)=CC(C=2C=C(Cl)C=C(Cl)C=2)=C1 UTMWFJSRHLYRPY-UHFFFAOYSA-N 0.000 description 1
- 238000007688 edging Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
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Classifications
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1345—Conductors connecting electrodes to cell terminals
- G02F1/13452—Conductors connecting driver circuitry and terminals of panels
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1339—Gaskets; Spacers; Sealing of cells
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- Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- Mathematical Physics (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Liquid Crystal (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
The invention provides a display panel and a preparation method thereof, wherein the display panel comprises a color film substrate and an array substrate with mutually aligned side surfaces, a flip film, a PCB (printed Circuit Board), a liquid crystal layer and frame glue, wherein a plurality of thin film transistors distributed in an array manner and a plurality of signal terminals correspondingly and electrically connected with the thin film transistors are arranged on the array substrate, a cutting surface is arranged at the edge of one side of each signal terminal, the cutting surface is an inclined surface, the flip film is bonded to the cutting surface, and oblique grinding treatment is carried out on the side surfaces of the array substrate and the color film substrate, so that the flip film is arranged on the side surfaces of the array substrate and the color film substrate, the frame of the display panel can be reduced, the contact resistance is reduced, the cracks on two sides of glass are eliminated, the crack is prevented from being stressed to grow into fragments, and the strength of the glass is improved.
Description
Technical Field
The invention relates to the technical field of display, in particular to a display panel and a preparation method thereof.
Background
The TFT-LCD (thin Film transistor liquid crystal display) adopts outer pin bonding (Outer Lead Bonding, OLB), the upper and lower base plates are staggered for a distance by adopting a non-alignment design, the exposed TFT pins are connected with a driving Chip (Integrated Circuit Chip, IC), and driving signals are input into the display panel, wherein the method for connecting the driving IC is that one end of a Chip On Film (COF) is bonded On the pins, and the other end is in pressure connection with a printed circuit board (Printed Circuit Board, PCB) provided with the driving IC; anisotropic conductive films (Anisotropic Conductive Film, ACF) are generally adopted as an adhesive among the components to realize fixation and conduction, and the bonding area of the outer pins is reserved with enough width, so that the frame width of the whole machine is increased, and the appearance is influenced.
In order to solve the problem, a novel flip-chip film Side Bonding (Side Bonding) technology appears in the industry, an upper substrate and a lower substrate are cut and aligned, pin sections are exposed through Side grinding, and then the flip-chip film is bound at the pin sections, so that an ultra-narrow frame is realized; however, when the side bonding technique is adopted, the contact resistance is high because the contact area between the flip chip film and the section of the pin is greatly reduced compared with that of the outer pin bonding.
In view of the foregoing, there is a need for a new display panel and a method for manufacturing the same, which solve the above-mentioned problems.
Disclosure of Invention
The invention provides a display panel and a preparation method thereof, which solve the technical problem of higher contact impedance caused by greatly reduced contact area between a flip-chip film and a pin section when the conventional display panel adopts flip-chip film side bonding.
In order to solve the problems, the technical scheme provided by the invention is as follows:
an embodiment of the present invention provides a display panel including:
a color film substrate;
the array substrate is arranged opposite to the color film substrate, the side face of the color film substrate is aligned with the side face of the array substrate, a plurality of thin film transistors distributed in an array mode and a plurality of signal terminals correspondingly and electrically connected with the thin film transistors are arranged on the array substrate, a cutting face is arranged at the edge of one side of each signal terminal, and the cutting face is an inclined face;
the flip chip film is bonded to the cut surface;
the PCB is connected with the flip chip film;
the liquid crystal layer is arranged between the color film substrate and the array substrate; and
and the frame glue is arranged on the outer side of the liquid crystal layer and is used for connecting the color film substrate and the array substrate.
According to the display panel provided by the embodiment of the invention, the peripheral edges of the array substrate and the peripheral edges of the color film substrate are respectively provided with the inclined surfaces, wherein the array substrate comprises a first inclined surface close to the color film substrate and a second inclined surface far away from the color film substrate, and the color film substrate comprises a third inclined surface close to the array substrate and a fourth inclined surface far away from the array substrate.
According to the display panel provided by the embodiment of the invention, the plane extending towards one side of the frame glue and the plane extending towards one side of the frame glue of the third inclined plane intersect to form a first included angle, and the first included angle, the frame glue and the signal terminal form a groove.
According to the display panel provided by the embodiment of the invention, the first inclined surface and the cutting surface are positioned on the same plane.
According to the display panel provided by the embodiment of the invention, the display panel further comprises a conductive layer, wherein the conductive layer is arranged in the groove and covers the cut-off surface of the signal terminal.
According to the display panel provided by the embodiment of the invention, the first included angle is 30-70 degrees.
According to the display panel provided by the embodiment of the invention, the second inclined surface and the four inclined surfaces are correspondingly arranged, and the plane extending away from one side of the frame glue of the second inclined surface is intersected with the plane extending away from one side of the frame glue of the fourth inclined surface to form a second included angle.
According to the display panel provided by the embodiment of the invention, the second included angle is 60-120 degrees; the orthographic projection width of the second inclined surface and the fourth inclined surface on one side of the array substrate, which is close to the color film substrate, is 50-200 um.
The embodiment of the invention provides a preparation method of a display panel, which comprises the following steps:
step S10: providing a color film substrate and an array substrate which are arranged in a box;
step S20: cutting off the part of the array substrate extending to the outside of the color film substrate so that the side surface of the color film substrate and the side surface of the array substrate are level with each other;
step 30: performing oblique grinding treatment on the side surface of the color film substrate and the side surface of the array substrate by using a grinding wheel so as to form a cutting surface at the edge of one side of a signal terminal arranged on the array substrate, wherein the cutting surface is an inclined surface;
step S40: coating conductive silver paste on the cut surface and curing to form a conductive layer;
step S50: preparing a flip chip film on the conductive layer; and
step S60: and connecting a PCB on the flip chip film.
According to the method for manufacturing a display panel provided by the embodiment of the invention, in the step S30, the grinding wheel performs chamfer angle cutting treatment on the peripheral edge of the array substrate and the peripheral edge of the color film substrate to form an inclined surface, wherein the array substrate comprises a first inclined surface close to the color film substrate and a second inclined surface far away from the color film substrate, and the color film substrate comprises a third inclined surface close to the array substrate and a fourth inclined surface far away from the array substrate.
The beneficial effects of the invention are as follows: according to the display panel and the preparation method thereof, the cut surface is arranged at one end of the signal terminal, is an inclined surface, and the flip chip film is bonded to the cut surface; meanwhile, the side surfaces of the array substrate and the color film substrate are aligned, oblique grinding treatment is carried out on the side surfaces of the array substrate and the color film substrate, and the flip chip film is arranged on the side surfaces of the array substrate and the color film substrate, so that the contact resistance can be reduced, the cracks on two sides of the glass are eliminated, the cracks are prevented from growing and breaking due to stress, and the strength of the glass is improved.
Drawings
In order to more clearly illustrate the embodiments or the technical solutions in the prior art, the following description will briefly introduce the drawings that are needed in the embodiments or the description of the prior art, it is obvious that the drawings in the following description are only some embodiments of the invention, and that other drawings can be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic cross-sectional structure of a display panel according to an embodiment of the present invention;
fig. 2 is a flowchart of a method for manufacturing a display panel according to an embodiment of the present invention;
fig. 3 to 8 are schematic flow chart structures of a method for manufacturing a display panel according to an embodiment of the present invention;
fig. 9 is a schematic cross-sectional structure of a grinding wheel according to an embodiment of the invention.
Detailed Description
The following description of the embodiments refers to the accompanying drawings, which illustrate specific embodiments in which the invention may be practiced. The directional terms mentioned in the present invention, such as [ upper ], [ lower ], [ front ], [ rear ], [ left ], [ right ], [ inner ], [ outer ], [ side ], etc., are only referring to the directions of the attached drawings. Accordingly, directional terminology is used to describe and understand the invention and is not limiting of the invention. In the drawings, like elements are designated by like reference numerals.
Aiming at the display panel and the preparation method thereof in the prior art, when the side surface of the flip chip film is bonded, the contact area between the flip chip film and the section of the pin is greatly reduced, so that the technical problem of higher contact impedance is solved.
As shown in fig. 1, the display panel provided in the embodiment of the invention includes a color film substrate 10, an array substrate 20, a liquid crystal layer 30, a frame glue 40, a flip chip film 70, and a printed circuit board (Printed circuit boards, PCB) 80, where the array substrate 20 and the color film substrate 10 are disposed opposite to each other, and the sides of the two substrates are aligned to each other, the liquid crystal layer 30 is disposed between the color film substrate 10 and the array substrate 20, and the frame glue 40 is disposed on the outer side of the liquid crystal layer 30 to connect the array substrate 20 and the color film substrate 10, so that the two substrates are stacked to form a sealed liquid crystal box.
Specifically, the array substrate 20 is provided with a plurality of thin film transistors distributed in an array and a plurality of signal terminals 50 electrically connected with the thin film transistors correspondingly, and a cutting surface 501 is provided at an edge of one side of the signal terminals 50, and compared with the arrangement of the signal terminals 50 in a step area of the array substrate 20, the display panel in the embodiment of the invention has a narrow frame; the flip chip film 70 is bonded to the cut surface, and an anisotropic conductive film (Anisotropic Conductive Film, ACF) 90 is disposed between the PCB board 80 and the flip chip film 70 to realize fixation and conduction, so that the signal terminal 50 accesses a driving signal through the flip chip film 70 and transmits the driving signal to the thin film transistor to control the liquid crystal molecules in the liquid crystal layer 30 to deflect, and then the display panel displays images.
The cut surface 501 is an inclined surface, and compared with the cut surface in the prior art, the contact area between the flip chip film 70 and the signal terminal 50 is increased, thereby reducing the contact impedance, and improving the conductivity of the signal terminal 50 and the connection stability of the signal terminal 50 and the flip chip film 70, thereby improving the display effect of the display panel.
Further, since the side surfaces of the array substrate 20 and the side surfaces of the color film substrate 10 are aligned, cracks are more likely to occur due to the stress of the side surfaces during lamination, the peripheral edges of the array substrate 20 and the peripheral edges of the color film substrate 10 are subjected to bevel cutting to form inclined surfaces, so that the cracks can be prevented from being forced to grow and break, and the strength of the array substrate 20 and the color film substrate 10 can be improved; specifically, the array substrate 20 includes a first inclined surface 201 near the color film substrate 10 and a second inclined surface 202 far away from the color film substrate, the color film substrate 10 includes a third inclined surface 101 near the array substrate 20 and a fourth inclined surface 102 far away from the array substrate 20, wherein a plane of the cut surface 501 extending toward the frame glue 40 and a plane of the third inclined surface 101 extending toward the frame glue 40 intersect to form a first included angle, and form a groove with the frame glue 40 and the signal terminal 50.
In the embodiment of the present invention, the first inclined surface 201 and the cut surface 501 are completed in the same process, so that the first inclined surface 201 and the cut surface 501 are in the same plane, that is, the inclination angle of the first inclined surface 201 reaches the maximum at this time, which can increase the coating area of the subsequent conductive film.
Specifically, the first included angle is 30 ° to 70 °, in different embodiments, the first included angle may be 30 °, 35 °, 40 °, 45 °, 50 °, 55 °, 60 °, 65 °, 70 ° and the like, which is not specifically limited in this embodiment; when the first included angle is smaller, the area of the cut surface 501 of the signal terminal 50 is larger, and at this time, the contact area between the flip chip film 70 and the signal terminal 50 is the largest, so that the contact impedance can be reduced maximally; when the first angle is larger, the area of the cut surface 501 of the signal terminal 50 is smaller, and at this time, the contact area between the flip-chip film 70 and the signal terminal 50 is smallest, and the degree of decrease in contact impedance is relatively smaller, so the magnitude of the first angle should be determined according to the specific magnitude of the contact impedance between the flip-chip film 70 and the signal terminal 50 in actual situations.
Further, the display panel further includes a conductive layer 60, where the conductive layer 60 covers the cut surface 501 of the signal terminal 50, and in this embodiment of the present invention, the conductive layer 60 may be disposed in the groove, and it is understood that the conductive layer 60 covers the side surface of the frame glue 40, the cut surface 501 of the signal terminal 50, the first inclined surface 201, and the third inclined surface 101, so that the coverage area of the conductive layer 60 can be increased, so as to further improve the connection stability between the signal terminal 50 and the flip chip film 70.
Specifically, the material of the conductive layer 60 is silver.
Specifically, the second inclined surface 202 and the fourth inclined surface 102 are disposed correspondingly, and a plane extending from the second inclined surface 202 to a side far away from the frame glue 40 and a plane extending from the fourth inclined surface 102 to a side far away from the frame glue 40 intersect to form a second included angle, in this embodiment of the present invention, the second inclined surface 202 and the fourth inclined surface 102 are the same, and the first inclined surface 201 and the third inclined surface 101 are the same.
The second included angle is 60 ° to 120 °, the first included angle may be 60 °, 70 °, 80 °, 90 °, 100 °, 110 °, 120 °, etc., which is not particularly limited in this embodiment; the orthographic projection width B of the second inclined plane 202 and the fourth inclined plane 102 on the side of the array substrate 20 close to the color film substrate 10 is 50 um-200 um, so the positions of the second inclined plane 202 and the fourth inclined plane 102 are limited by the second included angle and the size of B, thereby limiting the size of the obliquely ground volume at the corners of the array substrate 20 and the color film substrate 10, ensuring complete crack removal and preventing the excessively ground volume.
Further, the conductive layer 60 is further covered with a sealing compound, and the sealing compound is used for adhering the frame, and meanwhile, the sealing compound can be made of black shading materials, so as to avoid light leakage on the side surface of the display panel.
As shown in fig. 2, the embodiment of the invention further provides a method for manufacturing a display panel, which includes the following steps:
step S10: providing a color film substrate 10 and an array substrate 20 which are arranged in a box;
specifically, as shown in fig. 3, the array substrate 20 and the color film substrate 10 are disposed opposite to each other, and a liquid crystal layer 30 and a sealant 40 formed on the outer side of the liquid crystal layer 30 are formed between the array substrate 20 and the color film substrate 10, where the sealant 40 is used for connecting the array substrate 20 and the color film substrate 10; a plurality of thin film transistors distributed in an array and a plurality of signal terminals 50 electrically connected to the thin film transistors are formed on the array substrate 20.
Step S20: and cutting out the part of the array substrate 20 extending beyond the color film substrate 10 so that the side surface of the color film substrate 10 and the side surface of the array substrate 20 are flush with each other.
Specifically, as shown in fig. 4, the array substrate 20 may be cut by a laser beam cutting method.
Step 30: the side surface of the color film substrate 10 and the side surface of the array substrate 20 are subjected to oblique grinding treatment by using a grinding wheel 1, so that a cutting surface 501 is formed at the edge of one side of the signal terminal 50 arranged on the array substrate 20, and the cutting surface 501 is an oblique surface.
Specifically, as shown in fig. 5, the side surface of the color film substrate 10 and the side surface of the array substrate 20 are subjected to oblique grinding treatment using a grinding wheel 1.
Referring to fig. 9, the side of the grinding wheel 1 near the display panel includes a protrusion 11, a first groove 12 and a second groove 13, wherein the protrusion 11 is located in the middle of the grinding wheel 1, the first groove 12 and the second groove 13 are located at the upper and lower sides of the grinding wheel, respectively, and the side of the display panel is subjected to oblique grinding treatment by the grinding wheel 1, so that the protrusion 11 forms the cutting surface 501 at the edge of one side of the signal terminal 50, and the cutting surface 501 is an inclined surface, so that the contact area between the subsequently formed flip chip film 70 and the signal terminal 50 is increased, thereby reducing the contact resistance; the first groove 12 and the second groove 13 respectively perform chamfer angle cutting treatment on the peripheral corners of the array substrate 20 and the peripheral corners of the color film substrate 10, so that the array substrate 20 comprises a first inclined surface 201 close to the color film substrate 10 and a second inclined surface 202 far away from the color film substrate 10, and the color film substrate 10 comprises a third inclined surface 101 close to the array substrate 20 and a fourth inclined surface 102 far away from the array substrate 20, thereby preventing cracks from growing and breaking to improve the strength of the array substrate 20 and the color film substrate 10.
The specified edging amount is achieved by controlling the pressing amount, the speed and the times of the grinding wheel 1, the pressing depth is generally controlled to be 100um because of the risk of breaking pieces due to the overlarge pressing amount, and the speed is adaptively adjusted according to the size of the grinding wheel 1.
It should be noted that, the side of the grinding wheel 1 away from the display panel may also be provided with the protrusion 11, the first groove 12 and the second groove 13, so as to perform oblique grinding on the display panel located on two opposite sides of the grinding wheel 1, thereby improving the working efficiency.
Step S40: the conductive silver paste is applied at the cut surface 501 and cured to form the conductive layer 60.
Specifically, as shown in fig. 6, the conductive layer 60 is formed by a silver paste transfer process, and it is particularly required to control the thickness and uniformity of the silver paste.
Step S50: a flip chip film 70 is prepared on the conductive layer 60.
Specifically, as shown in fig. 7, the flip-chip film 70 is prepared on the conductive layer, and the flip-chip film 70 and the signal terminal 50 are conducted through the conductive layer 60.
Step S60: a PCB board 80 is attached to the flip chip film 70.
Specifically, as shown in fig. 8, the anisotropic conductive film 90 is used as an adhesive between the PCB 80 and the flip chip film 70 to achieve fixation and conduction.
It should be noted that, after the oblique grinding process is completed, the array substrate 20 and the color film substrate 10 need to be cleaned to remove the generated particles or scraps.
The beneficial effects are as follows: according to the display panel and the preparation method thereof provided by the embodiment of the invention, the cut surface is arranged at one end of the signal terminal, is an inclined surface, and the flip chip film is bonded to the cut surface; meanwhile, the side surfaces of the array substrate and the color film substrate are aligned, oblique grinding treatment is carried out on the side surfaces of the array substrate and the color film substrate, and the flip chip film is arranged on the side surfaces of the array substrate and the color film substrate, so that the contact resistance can be reduced, the cracks on two sides of the glass are eliminated, the cracks are prevented from growing and breaking due to stress, and the strength of the glass is improved.
In summary, although the present invention has been described in terms of the preferred embodiments, the preferred embodiments are not limited to the above embodiments, and various modifications and changes can be made by one skilled in the art without departing from the spirit and scope of the invention, and the scope of the invention is defined by the appended claims.
Claims (8)
1. A display panel, comprising:
a color film substrate;
the array substrate is arranged opposite to the color film substrate, the side face of the color film substrate is aligned with the side face of the array substrate, a plurality of thin film transistors distributed in an array mode and a plurality of signal terminals correspondingly and electrically connected with the thin film transistors are arranged on the array substrate, a cutting face is arranged at the edge of one side of each signal terminal, and the cutting face is an inclined face;
the flip chip film is bonded to the cut surface;
the PCB is connected with the flip chip film;
the liquid crystal layer is arranged between the color film substrate and the array substrate;
the frame glue is arranged on the outer side of the liquid crystal layer and is used for connecting the color film substrate and the array substrate; and
the conducting layer is arranged between the signal terminal and the flip chip film;
the array substrate comprises a first inclined surface close to the color film substrate, the color film substrate comprises a third inclined surface close to the array substrate, the cutting surface and the third inclined surface intersect to form a first included angle, the first inclined surface, the cutting surface, the side surface of the frame glue and the third inclined surface form a groove together, and the conducting layer covers the groove.
2. The display panel of claim 1, wherein the peripheral edge of the array substrate and the peripheral edge of the color film substrate are each provided with an inclined surface, wherein the array substrate includes a second inclined surface away from the color film substrate, and the color film substrate includes a fourth inclined surface away from the array substrate.
3. The display panel according to claim 2, wherein the first inclined surface and the cut-off surface are in the same plane.
4. The display panel of claim 1, wherein the first included angle is 30 ° to 70 °.
5. The display panel according to claim 2, wherein the second inclined surface and the four inclined surfaces are disposed correspondingly, and a plane extending away from the side of the sealant and the plane extending away from the side of the sealant intersect to form a second included angle.
6. The display panel of claim 5, wherein the second included angle is 60 ° to 120 °; the orthographic projection width of the second inclined surface and the fourth inclined surface on one side of the array substrate, which is close to the color film substrate, is 50-200 um.
7. A method of manufacturing the display panel according to any one of claims 1 to 6, comprising the steps of:
step S10: providing a color film substrate and an array substrate which are arranged in a box;
step S20: cutting off the part of the array substrate extending to the outside of the color film substrate so that the side surface of the color film substrate and the side surface of the array substrate are level with each other;
step 30: performing oblique grinding treatment on the side surface of the color film substrate and the side surface of the array substrate by using a grinding wheel so as to form a cutting surface at the edge of one side of a signal terminal arranged on the array substrate, wherein the cutting surface is an inclined surface, the periphery edge of the array substrate and the periphery edge of the color film substrate are subjected to oblique cutting angle treatment by using the grinding wheel so that the array substrate comprises a first inclined surface close to the color film substrate, the color film substrate comprises a third inclined surface close to the array substrate, the cutting surface and the third inclined surface are intersected to form a first included angle, the first inclined surface, the cutting surface, the side surface of the frame glue and the third inclined surface form a groove together, and the conducting layer covers the groove;
step S40: coating conductive silver paste on the cut surface and curing to form a conductive layer;
step S50: preparing a flip chip film on the conductive layer; and
step S60: and connecting a PCB on the flip chip film.
8. The method of claim 7, wherein the array substrate includes a second inclined surface away from the color film substrate, and wherein the color film substrate includes a fourth inclined surface away from the array substrate.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201911391351.9A CN110967881B (en) | 2019-12-30 | 2019-12-30 | Display panel and preparation method thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911391351.9A CN110967881B (en) | 2019-12-30 | 2019-12-30 | Display panel and preparation method thereof |
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| CN110967881A CN110967881A (en) | 2020-04-07 |
| CN110967881B true CN110967881B (en) | 2023-05-30 |
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| CN111679463A (en) * | 2020-06-10 | 2020-09-18 | Tcl华星光电技术有限公司 | Liquid crystal display screen with lateral binding design and manufacturing method thereof |
| CN113257127B (en) * | 2020-08-14 | 2023-03-14 | 友达光电股份有限公司 | Display device |
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