CN107526222A - Array base palte and preparation method thereof, display device - Google Patents
Array base palte and preparation method thereof, display device Download PDFInfo
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- CN107526222A CN107526222A CN201710813375.3A CN201710813375A CN107526222A CN 107526222 A CN107526222 A CN 107526222A CN 201710813375 A CN201710813375 A CN 201710813375A CN 107526222 A CN107526222 A CN 107526222A
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- base palte
- array base
- external pin
- pin end
- data wire
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1345—Conductors connecting electrodes to cell terminals
- G02F1/13452—Conductors connecting driver circuitry and terminals of panels
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/133351—Manufacturing of individual cells out of a plurality of cells, e.g. by dicing
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/133509—Filters, e.g. light shielding masks
- G02F1/133512—Light shielding layers, e.g. black matrix
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- Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- Mathematical Physics (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
Originally it is bright to provide a kind of array base palte, including scan line, data wire and respectively with the first external pin end of scan line and data line contact, the second external pin end, the first external pin end is arranged on side side vertical with scan line on array base palte, and the second external pin end is arranged on side side vertical with data wire on array base palte.The invention provides a kind of preparation method of array base palte and display device.Compared with prior art, by the way that the binding area on array base palte is arranged on the side vertical with data wire and scan line, need to set binding area in the non-display area of array base palte so as to save, so as to which array base palte and colored filter substrate are cut into identical size, display device Rimless is realized.
Description
Technical field
The present invention relates to a kind of liquid panel technique, particularly a kind of array base palte and preparation method thereof, display device.
Background technology
Liquid crystal display industry continued to develop in the last few years, and panel appearance has the trend become narrow gradually, such as narrow frame TV,
Be edge non-display area is done it is narrow, frame use more succinct, careful moulding, make product more aesthetically pleasing.In addition to narrow frame,
Even there is proposition " Rimless " panel concept, that is, remove the housing for blocking panel non-display area, realize that Rimless is shown.
Liquid crystal display is in manufacturing process because the needs of liquid crystal drive are, it is necessary to the binding of reserved driver circuit
(bonding) area, the OLB (external pins contacted to COF substrates with data wire and scan line are provided in the binding area
End), traditional way is CF (colored filter) substrate on the ratio upper strata for making TFT (thin film transistor (TFT)) substrate with circuit
Somewhat larger (being typically larger than 1mm), binding area is arranged on the position, to reserve the binding position of driver circuit, still
So need Framed to bind area to cover in order to avoid influenceing to show outward appearance.
The content of the invention
For overcome the deficiencies in the prior art, the present invention provides a kind of array base palte and preparation method thereof, display device, realizes
Display device Rimless.
This is bright to provide a kind of array base palte, including scan line, data wire and respectively with scan line and data line contact
The first external pin end, the second external pin end, the first external pin end is arranged on array base palte hangs down with scan line
On straight side side, the second external pin end is arranged on side side vertical with data wire on array base palte.
Further, the first external pin end and the second outer lead end using silver or copper into.
Present invention also offers a kind of preparation method of array base palte, comprise the following steps：
Array substrate is cut, by the array base palte side vertical with scan line and the side vertical with data wire
Cut, make the cut edge and scan line and the end part aligning and exposed scan line and data of data wire of array base palte
The end of line；
One layer of conductive layer, conductive layer and scan line and the end of data wire are coated with the both sides side that array base palte is cut
Contact；
Conductive layer is carried out to be formed by curing conducting film；
To conductive film figure, the first external pin end, the second external pin end are formed.
Further, after the array substrate is cut, cut side is polished, polished.
Further, it is described that conductive layer is carried out being formed by curing conducting film to be to carry out heat treatment to conductive layer to consolidate conductive layer
Change forms conducting film.
Further, the temperature being heat-treated to conductive layer is no more than 100 DEG C.
Further, the heat treatment is infrared heating.
Further, during described pair of cut side is polished, polished, the roughness of the side edge surface is no more than
5um。
Present invention also offers a kind of display device, including colored filter substrate and COF substrates, in addition to it is described
Array base palte, the COF substrates are connected by conducting resinl with the first external pin end, the second external pin end respectively, in array
Substrate is provided with the both sides side at the first external pin end and the second external pin end and covers and seal by shading glue, described
Alignd with the edge of colored filter substrate the edge of array base palte.
Further, the shading glue is also by colored filter substrate and the first external pin end and the second external pin end
The covering of one end that the relative side in position and COF substrates are connected with the first external pin end and the second external pin end is simultaneously close
Envelope.
The present invention compared with prior art, is hung down by the way that the binding area on array base palte is arranged at data wire and scan line
On straight side, need to set binding area in the non-display area of array base palte so as to save, so as to by array base palte with it is color
Colo(u)r filter substrate cut realizes display device Rimless into identical size.
Brief description of the drawings
Fig. 1 is the structural representation one of display device of the present invention；
Fig. 2 is the structural representation two of display device of the present invention；
Fig. 3 is the schematic diagram after array substrate of the present invention is cut；
Fig. 4 is the schematic diagram of present invention conducting layer coated on cut side；
Fig. 5 is the schematic diagram that the present invention is patterned to conducting film.
Embodiment
The present invention is described in further detail with reference to the accompanying drawings and examples.
Fig. 1-Fig. 5 is omitted, simplified and the array base palte that had big loss structure in order to be clearly understood from the present invention, still
It is worth noting that, the internal structure of array substrate is not changed in the present invention, it is only the setting position for binding area to change
Put and the set location at external pin end；Schematic figures and embodiment with reference to shown by accompanying drawing are to explain this hair
Bright principle and its practical application, so that others skilled in the art are it will be appreciated that various embodiments of the present invention and suitable
Together in the various modifications of specific intended application.
As depicted in figs. 1 and 2, array base palte 100 of the invention is included in the He of multi-strip scanning line 1 arranged in a crossed manner on substrate
A plurality of data lines 2：The the first external pin end contacted respectively with scan line 1 and data wire 2 is additionally provided with array base palte 100
3rd, the second external pin end 4；Wherein：First external pin end 3 is arranged at side side vertical with scan line 1 on array base palte
On, the second external pin end 4 is arranged on side side vertical with data wire 2 on array base palte.
By the set-up mode at above-mentioned external pin end, by the existing binding for being used to set external pin end
(bonding) area is arranged on the side of array base palte, further reduces the size of array base palte, this is noticeable
It is the edge of array base palte and the edge pair for colored filter substrate opposed with its and into box in the present invention
Together, i.e., both size it is identical, so as to realize display device Rimless.
In order to ensure that the first external pin end 3 and the end of the second external pin 4 can be steady in the array base palte 100 of the present invention
Solid be attached on the side of array base palte, the edge of the array base palte 100 to completing is cut herein, makes array base
Plate 100 is located at the end part aligning with a vertical lateral edges for scan line 1 and data wire 2 and scan line 1 and data wire 2, so as to
The end of scan line 1 and data wire 2 is exposed, it is necessary to be carried out to cut side after array substrate 100 is cut
Polishing, polishing, ensure that the first external pin end 3 and the second external pin end 4 can be very good to adhere to.But the invention is not restricted to
This, can also be cut after existing array base palte 100 has made external pin end, and at this moment exposed part is drawn to be external
The remaining part of foot, by the method to set up at the external pin end 4 of the first external pin end 3 and second of the present invention,
Conductor wire is set on cut side, realized and COF (Chip On Flex or Chip On Film, often claim chip on film)
The electrical connection of substrate.
In the present invention, the first external pin end 3 and the second outer lead end 4 can be made of silver, but the invention is not restricted to this,
It can also use as having the material of high conductivity to be made, such as copper.
The invention also discloses a kind of preparation method of array base palte, before following steps are carried out, the making of array base palte
Method is using the processing procedure realization of prior art, the herein no longer preparation of the array base palte such as film transistor device of array substrate
Repeated, the preparation method of the present invention is illustrated below, comprised the following steps：
Array substrate 100 is cut, and is hung down by the side vertical with scan line 1 of array base palte 100 and with data wire 2
Straight side is cut, and is made the cut edge of array base palte and scan line 1 and the end part aligning of data wire 2 and exposed is swept
The end (shown in Fig. 3) of line 1 and data wire 2 is retouched, Fig. 3 illustrate only the part of scan line 1, due to the cutting part to data wire 2
Divide principle identical, be not shown here the cutting of data wire 2；It is herein referring to it is noted that the part of cutting is leads in the prior art
The binding area with OLB areas understood；
Array base palte 100 be cut both sides side be coated with one layer of conductive layer 7, conductive layer 7 respectively with the sum of scan line 1
According to the ends contact of line 2 (shown in Fig. 4)；Specifically, coating method can use the coating method of substrate of the prior art to realize,
Such as the mode of printing, it is not specifically limited herein；Conductive layer uses the material with high conductivity, such as silver, and single present invention is not
It is limited to this, copper can also be used.
Conductive layer 7 is carried out to be formed by curing conducting film；It is to conductive layer herein conductive layer 7 to be carried out being formed by curing conducting film
7, which carry out heat treatment, makes conductive layer be formed by curing conducting film；The temperature of heat treatment is no more than 100 DEG C.It is preferred that use infrared heating
Mode solidifies to conductive layer, conducting film is fully contacted with the end of scan line 1 and data wire 2 from heat.
To conductive film figure, form the first external pin end 3, the second external pin end 4 (shown in Fig. 5)；Specifically, scheme
Shapeization can use existing photoetching process to realize, specially laser engraving technique, according to scan line 1 and the line width of data wire 2 with
And conducting film is fabricated to the first external pin end 3 and the second external pin end 4 of corresponding line width by thickness.
When array substrate and colored filter substrate are assembled into box, COF substrates external are drawn by conducting resinl 6 with first
The external pin end 4 of foot 3 and second electrically connects, and the array substrate of shading glue 5 of black is provided with the first external pin
The side side at external pin end 4 of end 3 and second carries out covering sealing, further by COF substrates and the first external pin end 3 and
(Fig. 1 and Fig. 2 shown in) is fixed at second external pin end 4.
In order to ensure the adhesion effect of conductive layer, after array substrate 100 is cut, cut side is carried out
Polishing, polishing；During cut side is polished, polished, the roughness of the side edge surface is no more than 5um.Here
Polishing, polishing shell are carried out by the way of such as Plasma or laser, remove cut side edge surface burr or needle pore defect.
As depicted in figs. 1 and 2, the invention also discloses a kind of display device, including colored filter substrate 200, COF bases
Plate 300, array base palte 100 and backlight module 400, array base palte 100 are included in multi-strip scanning line 1 arranged in a crossed manner on substrate
With a plurality of data lines 2：The first external pin contacted respectively with scan line 1 and data wire 2 is additionally provided with array base palte 100
Hold the 3, second external pin end 4；Wherein：First external pin end 3 is arranged at side side vertical with scan line 1 on array base palte
Bian Shang, the second external pin end 4 are arranged on side side vertical with data wire 2 on array base palte；
The COF substrates 300 are connected by conducting resinl 6 with the first external pin end 3, the second external pin end 4 respectively,
Array base palte 100 is provided with the both sides side at the first external pin end 3 and the second external pin end 4 by the shading glue of black
5 seal and block, and shading glue 5 is also by the external pin end 3 of colored filter substrate 200 and first and 4, the second external pin end
Put one end covering that relative side and COF substrates 300 electrically connect with the first external pin end 3 and the second external pin end 4
And seal, the edge of the array base palte 100 is alignd with the edge of colored filter substrate 200；
Backlight module 400 is arranged on the side that array base palte 100 deviates from colored filter substrate 200, and COF substrates 300 are curved
It is folded to the side surface that backlight module 400 deviates from array base palte 100.
The conducting resinl 6 uses ACF (Anisotropic Conductive Film) glue, i.e. anisotropic conductive adhesive paste, due to
Contain conducting particles in this colloid, when improving the binding bonding areas that side is set conducting resinl with external pin end in contact not
The problem of good, therefore ACF and terminal pad contact area are substantially increased, improve signal conduction yield and intensity.
Although the present invention has shown and described with reference to specific embodiment, it should be appreciated by those skilled in the art that：
In the case where not departing from the spirit and scope of the present invention limited by claim and its equivalent, can carry out herein form and
Various change in details.
Claims (10)
1. a kind of array base palte, including scan line (1), data wire (2) and contacted respectively with scan line (1) and data wire (2)
The first external pin end (3), the second external pin end (4), it is characterised in that：The first external pin end (3) is arranged at
On array base palte on the side side vertical with scan line (1), the second external pin end (4) be arranged on array base palte with
On the vertical side side of data wire (2).
2. array base palte according to claim 1, it is characterised in that：Draw outside the first external pin end (3) and second
Foot (4) using silver or copper into.
A kind of 3. preparation method of array base palte, it is characterised in that：Comprise the following steps：
Array substrate is cut, by the array base palte side vertical with scan line (1) and vertical with data wire (2) one
Side is cut, and makes end part aligning and the exposed scanning at the cut edge and scan line (1) and data wire (2) of array base palte
The end of line (1) and data wire (2)；
One layer of conductive layer, conductive layer and scan line (1) and the end of data wire (2) are coated with the both sides side that array base palte is cut
Portion contacts；
Conductive layer is carried out to be formed by curing conducting film；
To conductive film figure, the first external pin end (3), the second external pin end (4) are formed.
4. the preparation method of array base palte according to claim 3, it is characterised in that：The array substrate is cut
Afterwards, cut side is polished, polished.
5. the preparation method of array base palte according to claim 3, it is characterised in that：It is described that solidification shape is carried out to conductive layer
Conductive layer is set to be formed by curing conducting film to carry out heat treatment to conductive layer into conducting film.
6. the preparation method of array base palte according to claim 5, it is characterised in that：It is described that conductive layer is heat-treated
Temperature be no more than 100 DEG C.
7. the preparation method of the array base palte according to claim 5 or 6, it is characterised in that：The heat treatment adds to be infrared
Heat.
8. the preparation method of array base palte according to claim 4, it is characterised in that：Described pair of cut side is carried out
In polishing, polishing, the roughness of the side edge surface is no more than 5um.
9. a kind of display device, including colored filter substrate is with (200) and COF substrates (300), it is characterised in that：Also include
Array base palte as described in claim 1-2 any one, the COF substrates (300) respectively by conducting resinl (6) and first outside
Leads ends (3), the connection of the second external pin end (4) are connect, array base palte (100) is provided with the first external pin end (3) and the
Cover and seal, the surrounding of the array base palte (100) by shading glue (5) on the both sides side at two external pin ends (4)
Edge aligns with the edge of colored filter substrate (200).
10. display device according to claim 9, it is characterised in that：The shading glue (5) is also by colored filter substrate
(200) side relative with the first external pin end (3) and second external pin end (4) position and COF substrates (300) and the
One external pin end (3) and one end of the second external pin end (4) connection cover and sealed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710813375.3A CN107526222A (en) | 2017-09-11 | 2017-09-11 | Array base palte and preparation method thereof, display device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710813375.3A CN107526222A (en) | 2017-09-11 | 2017-09-11 | Array base palte and preparation method thereof, display device |
Publications (1)
| Publication Number | Publication Date |
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| CN107526222A true CN107526222A (en) | 2017-12-29 |
Family
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| Application Number | Title | Priority Date | Filing Date |
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| CN201710813375.3A Pending CN107526222A (en) | 2017-09-11 | 2017-09-11 | Array base palte and preparation method thereof, display device |
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Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108447891A (en) * | 2018-05-07 | 2018-08-24 | 京东方科技集团股份有限公司 | A kind of production method of display panel, display panel and printer device |
| CN108594549A (en) * | 2018-04-24 | 2018-09-28 | 武汉华星光电技术有限公司 | Panel driving framework, flip fexible film and flip fexible film reinforcement |
| CN109212851A (en) * | 2018-10-18 | 2019-01-15 | 深圳市华星光电技术有限公司 | Display panel and preparation method thereof, display device |
| CN109202546A (en) * | 2018-09-29 | 2019-01-15 | 信利半导体有限公司 | Improve the method for flexible base board cutting burr |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105223747A (en) * | 2015-10-27 | 2016-01-06 | 南京中电熊猫液晶显示科技有限公司 | A kind of display panel |
| US20170059926A1 (en) * | 2015-08-31 | 2017-03-02 | Lg Display Co., Ltd. | Side cover film for display and display device comprising the same |
| CN106647070A (en) * | 2017-01-03 | 2017-05-10 | 京东方科技集团股份有限公司 | Display panel and display device |
| CN107121854A (en) * | 2017-06-19 | 2017-09-01 | 深圳市华星光电技术有限公司 | Display panel and its manufacture method, display device |
| CN109426018A (en) * | 2017-08-22 | 2019-03-05 | 京东方科技集团股份有限公司 | Substrate and its manufacturing method, display panel, mosaic screen |
-
2017
- 2017-09-11 CN CN201710813375.3A patent/CN107526222A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20170059926A1 (en) * | 2015-08-31 | 2017-03-02 | Lg Display Co., Ltd. | Side cover film for display and display device comprising the same |
| CN105223747A (en) * | 2015-10-27 | 2016-01-06 | 南京中电熊猫液晶显示科技有限公司 | A kind of display panel |
| CN106647070A (en) * | 2017-01-03 | 2017-05-10 | 京东方科技集团股份有限公司 | Display panel and display device |
| CN107121854A (en) * | 2017-06-19 | 2017-09-01 | 深圳市华星光电技术有限公司 | Display panel and its manufacture method, display device |
| CN109426018A (en) * | 2017-08-22 | 2019-03-05 | 京东方科技集团股份有限公司 | Substrate and its manufacturing method, display panel, mosaic screen |
Cited By (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108594549A (en) * | 2018-04-24 | 2018-09-28 | 武汉华星光电技术有限公司 | Panel driving framework, flip fexible film and flip fexible film reinforcement |
| CN108594549B (en) * | 2018-04-24 | 2020-12-22 | 武汉华星光电技术有限公司 | Panel driving framework, chip-on-film flexible film and chip-on-film flexible film reinforcing method |
| WO2019214491A1 (en) * | 2018-05-07 | 2019-11-14 | 京东方科技集团股份有限公司 | Manufacturing method for display panel, display panel, and pad printing device |
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