JP2009272457A - Substrate mounting structure, liquid crystal display apparatus, and method of manufacturing the substrate mounting structure - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To suppress an increase of manufacturing steps, and to enhance an adhesive strength of a wiring substrate mounted on an element substrate. <P>SOLUTION: A method includes: an adhesive material supplying step of supplying an adhesive material 22 to at least one of an element substrate 11 and a wiring substrate 23 so that the material 22 may be applied on a surface of a mounting region 11a and a substrate end surface 11b of an end part where the mounting region 11a is defined; and a pressure bonding step of simultaneously bonding the wiring substrate 23 to the surface of the mounting region 11a and the substrate end surface 11b via the supplied adhesive material 22 to mount the wiring substrate 23 on the element substrate 11. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a substrate mounting structure, a liquid crystal display device, and a method for manufacturing the substrate mounting structure.

  In general, a liquid crystal display device includes a liquid crystal display panel in which a liquid crystal layer is sealed inside a frame-shaped sealing material provided between a pair of substrates, and is flexible for supplying signals and current to the liquid crystal display panel. It has a substrate mounting structure on which a printed wiring board (Flexible Printed Circuit, hereinafter referred to as FPC) is mounted.

  FIG. 11 is a cross-sectional view schematically showing a mounting portion of the FPC 106 in the conventional liquid crystal display panel 100.

  As shown in FIG. 11, the liquid crystal display panel 100 includes a TFT substrate 101 provided with a plurality of thin film transistors (hereinafter referred to as TFTs) and the like, and a plurality of colors arranged opposite to the TFT substrate 101. A CF substrate 102 provided with a filter (hereinafter referred to as “CF”) and the like, and a liquid crystal layer 104 sealed between the TFT substrate 101 and the CF substrate 102 inside a frame-shaped sealing material 103 are provided. I have.

  The liquid crystal display panel 100 includes a display area D that displays an image and a frame area F that is a non-display area that is arranged outside the display area D and does not contribute to image display. The TFT substrate 101 has a mounting region 101a defined at an end protruding from the CF substrate 102 in the frame region F, and the mounting region 101a is referred to as an anisotropic conductive film (hereinafter referred to as ACF). The FPC 106 is mounted through the network 105. The ACF 105 is an adhesive having insulating properties in which conductive particles 105a are dispersed inside. One end side of the FPC 106 is bonded to the surface of the mounting region 101a by the ACF 105, and is electrically connected to the external connection terminal pad 107 provided on the surface of the mounting region 101a via the conductive particles 105a in the ACF 105, and the other end. The side is folded back to the back side of the TFT substrate 101 so as to straddle the substrate end surface 101b at the end where the mounting region 101a is defined.

  By the way, the liquid crystal display device is preferably small in size and compact.

Therefore, in Patent Document 1, an adhesive material is disposed separately from the ACF between the end surface of the substrate where the mounting area is defined and the FPC, and the folded FPC is brought into close contact with the end surface of the substrate. It is disclosed that, by fixing, the length of the FPC that protrudes outside the folded portion can be reduced, and the size of the liquid crystal display device can be reduced. Further, in Patent Document 1, as a method of manufacturing a liquid crystal display device, an end portion in which a mounting region is defined when the FPC is folded after the one end side of the FPC is pressure-bonded to the surface of the mounting region via an ACF. It is disclosed that an adhesive is disposed on the end surface of the substrate and the folded portion of the FPC is bonded to the end surface of the substrate through the adhesive.
JP 2006-78622 A

  From the viewpoint of reducing the size of the liquid crystal display device, the liquid crystal display panel is required to have a wide display area and a narrow frame area. For this reason, if the adhesion area to which the FPC is bonded is reduced on the surface of the mounting area in order to narrow the mounting area, the adhesion strength of the FPC to the TFT substrate is lowered accordingly.

  Therefore, as in Patent Document 1, an adhesive is disposed separately from the ACF on the end surface of the substrate where the mounting area is defined, and the FPC is also bonded to the end surface of the substrate. It can be considered that the adhesion strength of the FPC to the TFT substrate is increased by supplementing the adhesion region on the surface of the region.

  However, as described above, when the FPC is pressure-bonded to the surface of the mounting area and the end face of the substrate at different timings, the FPC is affected by the heating during the previous pressure bonding (for example, pressure bonding to the surface of the mounting area). In order to avoid deterioration of the properties of the adhesive on the side to be crimped (for example, the end surface of the substrate), it is necessary to supply the adhesive to the side to which the FPC is later crimped after finishing the previous crimping. Therefore, in addition to the step of crimping the FPC to the substrate end surface separately from the step of crimping the FPC to the surface of the mounting region, the substrate end surface is separate from the step of supplying the adhesive (ACF) to the surface of the mounting region. Since it is necessary to perform the process which supplies an adhesive material to a manufacturing process, a manufacturing process will increase.

  Even if the adhesive is supplied so that the adhesive is disposed on the surface of the mounting region and the end surface of the substrate where the mounting region is defined for the FPC, the surface of the mounting region and the end surface of the substrate are different from each other. In the case where the FPC is pressure-bonded at the timing, the number of manufacturing processes increases as in the case where the adhesive is supplied to the surface of the mounting region and the end surface of the substrate.

  The present invention has been made in view of such various points, and the object of the present invention is to suppress an increase in the manufacturing process and to increase the adhesive strength of the wiring board mounted on the element substrate as much as possible. It is in.

  In order to achieve the above object, according to the present invention, the surface of the mounting region defined at the end portion of the element substrate and the substrate end surface of the end portion where the mounting region is defined relative to at least one of the element substrate and the wiring substrate. After the adhesive was supplied so that the adhesive was disposed on the wiring board, the flexible wiring board was simultaneously crimped to the surface of the mounting region and the end face of the substrate via the adhesive.

  Specifically, the method for manufacturing a substrate mounting structure according to the present invention includes an element substrate having a mounting area defined at an end, and a flexible wiring board mounted on the mounting area via an adhesive. A method of manufacturing a board mounting structure provided with the adhesive material disposed on at least one of the element board and the wiring board on a surface of the mounting area and an end face of the end where the mounting area is defined. An adhesive supply step for supplying the adhesive as described above, and simultaneously bonding the wiring substrate to the surface of the mounting region and the end surface of the substrate via the supplied adhesive, thereby connecting the wiring substrate to the element substrate And a crimping process to be mounted on.

  According to this manufacturing method, in the adhesive supply step, the adhesive is arranged so that the adhesive is disposed on the surface of the mounting region and the end surface of the end where the mounting region is defined with respect to at least one of the element substrate and the wiring substrate. In the crimping process, the wiring board is simultaneously crimped to the surface of the mounting area and the end face of the substrate via the adhesive, so that the wiring board is attached to the end face of the board separately from the process of crimping the wiring board to the surface of the mounting area. There is no need to perform a step of pressure bonding. And since a wiring board is adhere | attached on both the surface of a mounting area | region and a board | substrate end surface, compared with the case where a wiring board is adhere | attached only on the surface of a mounting area | region, the adhesive strength of the wiring board with respect to an element substrate is raised. Therefore, an increase in the manufacturing process is suppressed, and the adhesive strength of the wiring board to the element substrate is increased as much as possible.

  In the adhesive supplying step, it is preferable that the adhesive disposed on the surface of the mounting region and the adhesive disposed on the end surface of the substrate are integrally supplied.

  According to this manufacturing method, since the adhesive disposed on the surface of the mounting area and the adhesive disposed on the end surface of the substrate are integrally supplied in the adhesive supplying step, the adhesive is disposed on the surface of the mounting area. In addition to the step of supplying the adhesive to the substrate, it is not necessary to perform the step of supplying the adhesive so that the adhesive is disposed on the end surface of the substrate. As a result, the bonding strength of the wiring substrate to the element substrate can be increased as much as possible without increasing the number of manufacturing steps.

  In addition, when the wiring board is crimped to the element substrate, it is possible to perform the crimping of the wiring board to the surface of the mounting region and the end face of the substrate under the same crimping conditions (temperature condition and pressure condition) It becomes easy to simultaneously crimp the wiring board to the surface of the mounting area and the end face of the board.

  In the crimping step, the surface of the mounting region and the substrate are formed by a pressing jig having a pressing portion made of an elastic body that can be deformed so as to cover the surface of the mounting region and the portion to be crimped to the end face of the wiring board. It is preferable to pressurize the wiring board to the end face.

  According to this manufacturing method, the wiring board is pressed by a pressing jig having a pressing part made of an elastic body that can be deformed so as to cover the surface of the mounting area of the wiring board and the portion to be crimped to the end surface of the board. Since the wiring board is uniformly pressed to the surface of the mounting area and the end surface of the board by the pressing portion, the displacement of the wiring board due to the pressurization is suppressed, and the wiring board is simultaneously placed on the surface of the mounting area and the end face of the board with high positional accuracy. Crimped.

  In the crimping step, it is preferable that the chip component is pressed together with the wiring substrate by the pressing jig and mounted on the element substrate.

  According to this manufacturing method, by mounting the chip component on the element substrate together with the wiring substrate in the crimping step, it is not necessary to perform the step of mounting the chip component on the element substrate separately from the step of mounting the wiring substrate on the element substrate. Therefore, the manufacturing process is reduced.

  In the crimping step, the wiring board may be pressed against the surface of the mounting region and the end face of the board by different pressing jigs.

  According to this manufacturing method, since the wiring board is pressed against the surface of the mounting region and the end surface of the substrate by using different pressure jigs, adhesives having different proper pressure bonding conditions (temperature conditions and pressure conditions) are different from each other on the surface of the mounting region. When the circuit board is placed on each end face of the board, the wiring board is accurately placed on both the surface of the mounting area and the end face of the board by appropriately setting the crimping conditions for each pressing jig in accordance with the respective adhesives. It becomes possible to crimp well.

  In the crimping step, the wiring substrate is pressed against the surface of the mounting region and the end surface of the substrate by a pressing jig having a pressing surface formed in a step shape so as to face the surface of the mounting region and the end surface of the substrate. Also good.

  Also by this manufacturing method, since the wiring board is simultaneously pressure-bonded to the surface of the mounting region and the end face of the substrate, the effects of the present invention are specifically exhibited.

  In addition, a board mounting structure according to the present invention includes an element board having a mounting area defined at an end, and a flexible wiring board mounted on the mounting area via an adhesive. The wiring substrate is mounted on the element substrate by being bonded via the adhesive formed integrally with the surface of the mounting region and the end surface of the substrate where the mounting region is defined. It is characterized by that.

  According to this configuration, since the wiring board is pressure-bonded via the adhesive integrally formed on both the surface of the mounting region and the end surface of the substrate where the mounting region is defined, only on the surface of the mounting region. Compared with the case where the wiring board is bonded, the bonding strength of the wiring board to the element substrate is increased. Then, in mounting the wiring board on the element substrate, after the adhesive material is integrally supplied so that the adhesive material is disposed on the surface of the mounting region and the end surface of the substrate with respect to at least one of the element substrate and the wiring substrate, the bonding is performed. Separately from the step of supplying the adhesive so that the adhesive is disposed on the surface of the mounting region by simultaneously pressing the wiring board to the surface of the mounting region and the end surface of the substrate through the material, the adhesive is applied to the end surface of the substrate. There is no need to perform a step of supplying an adhesive so as to be disposed, and there is no need to perform a step of crimping the wiring substrate to the end surface of the substrate separately from a step of crimping the wiring substrate to the surface of the mounting region. Therefore, the bonding strength of the wiring board to the element substrate can be increased as much as possible without increasing the number of manufacturing steps.

  In addition, since the wiring board is bonded to the surface of the mounting region and the end face of the substrate through an integrally formed adhesive, the surface of the mounting region and the substrate when the wiring substrate is crimped to the element substrate. The wiring substrate can be pressure-bonded to the end surface under the same pressure-bonding conditions (temperature condition and pressure condition), and it becomes easy to simultaneously bond the wiring substrate to the surface of the mounting region and the substrate end surface.

  The element substrate has a side surface inclined at an end portion where the mounting region is defined, and the wiring substrate is electrically connected to a surface of the mounting region and a connection electrode provided on the inclined side surface. Preferably it is.

  According to this configuration, the element substrate has an inclined side surface at the end portion where the mounting area is defined, and the wiring board is electrically connected to the surface of the mounting area and the connection electrode provided on the inclined side surface. Compared with the case where the wiring board is electrically connected to the connection electrode provided on the surface of the flat mounting area, the wiring board is connected to the connection electrode formed larger on the inclined side surface. Therefore, the connection area between the connection electrode and the wiring board is increased, and the reliability of electrical connection between the connection electrode and the wiring board is increased. As a result, it is possible to suppress a reduction in the connection area between the connection electrode and the wiring board and to narrow the mounting area.

  In addition, the liquid crystal display device according to the present invention includes an element substrate having a mounting region defined at an end, a flexible wiring substrate mounted on the mounting region with an adhesive, and facing the element substrate. And a liquid crystal layer provided between the element substrate and the counter substrate, wherein the mounting region is disposed outside the counter substrate, The wiring board is mounted on the element substrate by being bonded via the adhesive formed integrally with the surface of the mounting region and the substrate end surface of the end portion where the mounting region is defined. To do.

  According to this configuration, since the wiring board is pressure-bonded via the adhesive integrally formed on both the surface of the mounting region and the end surface of the substrate where the mounting region is defined, only on the surface of the mounting region. Compared with the case where the wiring board is bonded, the bonding strength of the wiring board to the element substrate is increased. Then, in mounting the wiring board on the element substrate, after the adhesive material is integrally supplied so that the adhesive material is disposed on the surface of the mounting region and the end surface of the substrate with respect to at least one of the element substrate and the wiring substrate, the bonding is performed. Separately from the step of supplying the adhesive so that the adhesive is disposed on the surface of the mounting region by simultaneously pressing the wiring board to the surface of the mounting region and the end surface of the substrate through the material, the adhesive is applied to the end surface of the substrate. There is no need to perform a step of supplying an adhesive so as to be disposed, and there is no need to perform a step of crimping the wiring substrate to the end surface of the substrate separately from a step of crimping the wiring substrate to the surface of the mounting region. Therefore, the bonding strength of the wiring board to the element substrate can be increased as much as possible without increasing the number of manufacturing steps. This makes it possible to reduce the bonding strength of the wiring board to the element substrate as much as possible without increasing the number of manufacturing steps, and to narrow the mounting area.

  In addition, since the wiring board is bonded to the surface of the mounting area and the end face of the board via an integrally formed adhesive, the surface of the mounting area and the board are bonded when the wiring board is crimped to the mounting area. The wiring substrate can be pressure-bonded to the end surface under the same pressure-bonding conditions (temperature condition and pressure condition), and it becomes easy to simultaneously bond the wiring substrate to the surface of the mounting region and the substrate end surface.

  According to the present invention, the adhesive is disposed on the surface of the mounting region and the substrate end surface of the end portion in which the mounting region is defined with respect to at least one of the element substrate and the wiring board in which the mounting region is defined in the end portion. After performing the adhesive supply process for supplying the adhesive as described above, a crimping process for simultaneously crimping a flexible wiring board to the surface of the mounting region and the substrate end surface through the adhesive is performed. The increase can be suppressed, and the adhesive strength of the wiring substrate to the element substrate can be increased as much as possible.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. The present invention is not limited to the following embodiments.

Embodiment 1 of the Invention
1 to 4 show Embodiment 1 of the present invention. FIG. 1 is a plan view schematically showing the liquid crystal display device S. FIG. FIG. 2 is a cross-sectional view schematically showing the liquid crystal display device S along the line II-II in FIG.

  As shown in FIGS. 1 and 2, the liquid crystal display device S can supply the liquid crystal display panel 10 and signals and currents for driving the liquid crystal display panel 10 from an external circuit (not shown) to the liquid crystal display panel 10. And a flexible printed circuit board (hereinafter referred to as FPC) 23, which is a flexible printed circuit board, and has a substrate mounting structure in which the FPC 23 is mounted on the liquid crystal display panel 10.

  The liquid crystal display panel 10 includes a TFT substrate 11, which is an element substrate provided with a plurality of thin film transistors (hereinafter referred to as TFTs), and a plurality of color filters (Color Filters) disposed opposite the TFT substrate 11. , Hereinafter referred to as CF), and a liquid crystal layer 13 provided between the TFT substrate 11 and the CF substrate 12. The liquid crystal display panel 10 includes a display area D that includes a plurality of pixels and displays an image, and a frame area F that is a non-display area that is arranged outside the display area D and does not contribute to image display. Yes.

  Although the TFT substrate 11 and the CF substrate 12 are formed in a rectangular shape or the like and are not shown in the drawing, an alignment film is provided on the surface on the liquid crystal layer 13 side, and a polarization is applied on the surface opposite to the liquid crystal layer 13. Each plate is provided. A frame-shaped sealing material 14 is disposed between the TFT substrate 11 and the CF substrate 12, and a liquid crystal material is sealed inside the sealing material 14, thereby forming the liquid crystal layer 13. Yes.

  Although not shown, the CF substrate 12 is provided with a common electrode on the liquid crystal layer 13 side so as to cover each CF. In addition, the TFT substrate 11 has a common wiring for supplying a signal to the common electrode, a plurality of display wirings for gate lines and source lines electrically connected to the TFTs, and an electrical connection to the TFTs. A plurality of pixel electrodes connected in a matrix are provided on the liquid crystal layer 13 side.

  Further, as shown in FIGS. 1 and 2, the TFT substrate 11 has a mounting region 11 a defined in an end portion protruding outward from the CF substrate 12 in the frame region F.

  As shown in FIG. 2, a plurality of external connection terminal pads 17 which are connection electrodes electrically connected to the display wirings are formed in the mounting region 11a. Each external connection terminal pad 17 is provided on an insulating film 16 covering a plurality of lead wirings 15 drawn from the display wirings to the mounting region 11 a, and through a through hole 16 a formed in the insulating film 16. Are connected to the respective lead wires 15.

  In the mounting area 11a, the FPC 23 is mounted, for example, via an anisotropic conductive film (hereinafter referred to as ACF) 22. The ACF 22 is an insulating adhesive material in which the conductive particles 22a are dispersed inside, and exhibits conductivity at the portion where the conductive particles 22a are sandwiched between the external connection terminals 17 and the FPC 23.

  Although not shown in the figure, the FPC 23 is an integrated circuit chip for driving a liquid crystal (hereinafter referred to as an IC chip), which is a chip component having a driver and a timing controller for driving each TFT of the TFT substrate 11. ) Is installed. That is, the liquid crystal display device S has a so-called COF (Chip On Film) structure.

  In this embodiment, an IC chip having a driver, a timing controller, and the like is mounted on the FPC 23. However, the driver, the timing controller, etc. are formed directly on the TFT substrate without being mounted on the FPC 23. May be.

  The FPC 23 is provided with a plurality of wirings 25 made of copper foil or the like for electrically connecting each external connection terminal pad 17 and an external circuit to an IC chip, for example, on the surface of a base material 24 made of polyimide or the like. The portions of the wirings 25 except for the terminal portions for external connection 17, the external circuits, and the terminal portions connected to the IC chip are covered with a coverlay 26 made of polyimide or the like.

  The one end side of the FPC 23 is bonded to the front end side surface of the mounting region 11 a via the ACF 22, and each wiring 25 is electrically connected to each external connection terminal pad 17 via the conductive particles 22 a in the ACF 22. The other end side is folded back to the back side of the TFT substrate 11 so as to straddle the substrate end surface 11b of the end portion where the mounting region 11a is defined. An ACF 22 formed integrally with the ACF 22 disposed on the surface of the mounting region 11 a is disposed on the substrate end surface 11 b, and the FPC 23 is bonded via the ACF 22. That is, the FPC 23 is bonded via the ACF 22 integrally formed on both the surface of the mounting region 11a and the substrate end surface 11b.

  Although not shown, the liquid crystal display panel 10 on which the FPC 23 is mounted is formed on a metal bezel that is formed in a rectangular frame shape so that the display area D is exposed and disposed on the front side of the liquid crystal display panel 10. Is retained. The bezel holding the liquid crystal display panel 10 is attached to the front side of the chassis. The chassis has a side wall formed by being bent and raised at the outer edge portion, and the bezel is attached to the side wall by screwing or the like. Inside the chassis, a plurality of optical sheets such as a diffusion sheet and a prism sheet, and a backlight unit for emitting light to the liquid crystal display panel 10 through these optical sheets are arranged.

  Thus, the liquid crystal display device S applies a voltage to the liquid crystal layer 13 for each pixel based on the signal input via the FPC 23, and controls the alignment state of the liquid crystal molecules according to the magnitude of the voltage. Thus, the transmittance when the light emitted from the backlight unit is transmitted through the liquid crystal display panel 10 is adjusted to display a desired image.

-Manufacturing method-
Next, a method for manufacturing the liquid crystal display device S will be described.

  In order to manufacture the liquid crystal display device S, first, the TFT substrate 11 and the CF substrate 12 are respectively produced, and both the substrates 11 and 12 are bonded to each other via the sealing material 14, and the TFT substrate 11 is sealed by the sealing material 14. The liquid crystal display panel 10 is manufactured by enclosing the liquid crystal layer 13 between the CF substrate 12 and the CF substrate 12. Then, after polarizing plates are attached to both surfaces of the liquid crystal display panel 10, the FPC 23 is mounted on the liquid crystal display panel 10. Thereafter, the liquid crystal display panel 10 to which the FPC 23 is attached is held by the bezel, and the bezel is attached to a chassis in which a plurality of optical sheets, a backlight unit, and the like are arranged in advance. Since the liquid crystal display device S according to the present invention is characterized in the mounting method and mounting structure of the FPC 23 on the liquid crystal display panel 10, the mounting method of the FPC 23 on the liquid crystal display panel 10 will be described below with reference to FIGS. It will be described in detail. FIG. 3 is a perspective view schematically showing a pressure device 30 used for pressure bonding of the FPC 23 to the liquid crystal display panel 10. FIG. 4 is a cross-sectional view showing a state where the FPC 23 is pressure-bonded to the liquid crystal display panel 10.

  The method of mounting the FPC 23 on the liquid crystal display panel 10 includes an adhesive supply process and a crimping process.

  In the adhesive supply process, when the FPC 23 is pressure-bonded to the TFT substrate 11, the ACF 22 covers all the external connection terminal pads 17, and the ACF 22 is disposed on the surface of the mounting region 11a and the substrate end surface 11b. The integrally formed ACF 22 is attached to one end side of the FPC 23. In this way, the adhesive (ACF22) disposed on the surface of the mounting region 11a and the adhesive (ACF22) disposed on the substrate end surface 11b are integrally supplied to the FPC 23.

  Here, in the present embodiment, one integrally formed ACF 22 is attached to the FPC 23, but a plurality of ACFs are attached so that each ACF covers the external connection terminal pads 17 every predetermined number. May be.

  By the way, FPC is easy to break each wiring due to stress concentration due to folding etc. at the edge part of the coverlay. Therefore, when ACF is pasted on the surface of the mounting area and the end face of the board, each wiring is protected at the edge part of the coverlay. It is necessary to apply a protective resin, which increases the cost. Further, when a protective resin is applied to the FPC, a protruding portion is provided on the back side of the liquid crystal display panel by the thickness of the protective resin, and the FPC in the state where the protruding portion by the protective resin is folded back to the back side of the TFT substrate. The overhanging length increases, which restricts the setting of the liquid crystal display panel to the chassis and hinders the thinning of the liquid crystal display device.

  On the other hand, in the present embodiment, by attaching the ACF 22 to the FPC 23, the ACF 22 also functions to suppress disconnection of each wiring 22 at the edge portion of the cover lay 23. Therefore, a protective resin is used separately from the ACF 22. There is no need to apply to.

  In the next crimping step, the FPC 23 is crimped and mounted on the TFT substrate 11 using the pressure device 30 shown in FIG. The pressure device 30 includes a stage 31 on which the liquid crystal display panel 10 is placed, and a pressure jig 32 disposed on the stage 31.

  The stage 31 is configured to hold the liquid crystal display panel 10 by vacuum suction or the like. In this stage 31, a groove 31a is formed so as to overlap with the region of the FPC 23 disposed outside the substrate end surface 11b in order to securely adhere the FPC 23 also to the lower end of the substrate side surface 11b in the figure. ing. The pressurizing jig 32 has a pressurizing portion 32a made of rubber or the like that can be deformed so as to cover the surface of the mounting area 11a in the FPC 23 and the portion to be crimped to the substrate end surface 11b. The part 32a is configured to be heated by a heater (not shown) or the like and to descend to the stage 31 side. Here, an arrow 33 in FIG. 3 indicates a direction in which the pressing jig 32 descends.

  In this crimping step, as shown in FIG. 3, first, after the liquid crystal display panel 10 is placed on the stage 31, one end side of the FCP 23 in which the ACF 22 (not shown in FIG. 3) is attached to the surface of the mounting region 11a. And one end side of the FPC 23 is temporarily pressure-bonded to the surface of the mounting region 11a via the ACF 22. At this time, it is preferable to temporarily press-bond the FPC 23 to the substrate end surface 11b from the viewpoint of suppressing the displacement of the FPC 23 with respect to the substrate end surface 11b.

  Thereafter, the pressurizing portion 32a of the pressurizing jig 32 is heated to, for example, about 190 ° C., and the surface of the mounting region 11a is heated by the pressurizing portion 32a heated by lowering the pressurizing jig 32 as shown in FIG. Further, the FPC 23 is pressed against the surface of the mounting region 11a and the substrate end surface 11b through the ACF 22 simultaneously by pressurizing the FPC 23 to the substrate end surface 11b for about 10 seconds to 15 seconds, for example. Here, an arrow 34 in FIG. 4 indicates a direction in which the pressurizing unit 32 a pressurizes the FPC 23. Then, each external connection terminal pad 17 and each wiring 25 of the FPC 23 are electrically connected via the conductive particles 22a in the ACF 22, and the FPC 23 is mounted on the liquid crystal display panel 10 (TFT substrate 11). .

  In this embodiment, the pressurizing unit 32a is heated to about 190 ° C. and the FPC 23 is pressurized for about 10 to 15 seconds. However, the heating temperature of the pressurizing unit 32a and the pressurizing time of the FPC 23 are as follows. It is possible to appropriately set the ACF 22 so that the FPC 23 is bonded to the surface of the mounting portion 11a and the substrate end surface 11b. Further, although the pressurizing unit 32a is heated by the heater, the pressurizing unit 32a or the ACF 22 may be heated by other methods such as light irradiation with infrared rays, ultraviolet rays, or laser.

-Effect of Embodiment 1-
Therefore, according to the first embodiment, in the adhesive supply process, the ACF 22 integrally formed so that the ACF 22 is disposed on the surface of the mounting region 11a and the substrate end surface 11b is attached to the FPC 23, thereby mounting the mounting region 11a. After the adhesive disposed on the surface of the substrate and the adhesive disposed on the substrate end surface 11b are integrally supplied to the FPC 23, the FPC 23 is simultaneously applied to the surface of the mounting region 11a and the substrate end surface 11b via the ACF 22 in the crimping process. In order to perform pressure bonding, it is necessary to perform a step of supplying an adhesive so that the adhesive is disposed on the substrate end surface 11b separately from a step of supplying the adhesive so that the adhesive is disposed on the surface of the mounting region 11a. And the step of crimping the FPC 23 to the substrate end surface 11b separately from the step of crimping the FPC 23 to the surface of the mounting region 11a. Cormorant is not necessary. Since the FPC 23 is bonded to both the surface of the mounting region 11a and the substrate end surface 11b, the bonding strength of the FPC 23 to the TFT substrate 11 can be increased as compared with the case where the FPC is bonded only to the surface of the mounting region. it can. Therefore, the adhesion strength of the FPC 23 to the TFT substrate 11 can be increased as much as possible without increasing the number of manufacturing steps. As a result, the mounting region 11a can be narrowed by suppressing as much as possible a decrease in the adhesive strength of the FPC 23 to the TFT substrate 11 without increasing the number of manufacturing steps.

  In addition, in order to integrally supply the adhesive disposed on the surface of the mounting area 11a and the adhesive disposed on the substrate end surface 11b to the FPC 23 in the adhesive supplying step, the surface of the mounting area 11a and the substrate end surface The FPC 23 can be crimped to 11b under the same crimping conditions (temperature condition and pressure condition), and the FPC 23 can be easily crimped simultaneously to the surface of the mounting region 11a and the substrate end surface 11b.

  Further, in the crimping step, the FPC 23 is pressed by the pressing jig 32 having the pressing portion 32a made of an elastic body that can be deformed so as to cover the surface of the mounting area 11a in the FPC 23 and the portion to be pressed to the substrate end surface 11b. The FPC 23 can be uniformly pressed against the surface of the mounting region 11a and the substrate end surface 11b. As a result, displacement of the FPC 23 due to pressurization can be suppressed, and the FPC 23 can be simultaneously crimped to the surface of the mounting region 11a and the substrate end surface 11b with high positional accuracy.

<< Embodiment 2 of the Invention >>
5 and 6 show Embodiment 2 of the present invention. In the following embodiments, the same parts as those in FIGS. 1 to 4 are denoted by the same reference numerals, and detailed description thereof is omitted. FIG. 5 is a cross-sectional view schematically showing the mounting region 11a in the liquid crystal display device S of the present embodiment. FIG. 6 is a cross-sectional view showing a state in which the FPC 23 is pressure-bonded to the TFT substrate 11 in the pressure-bonding process in the present embodiment.

  In the first embodiment, the liquid crystal display device S having the COF structure has been described as an example. In the present embodiment, the liquid crystal display device S having a so-called COG (Chip On Glass) structure will be described.

  In the liquid crystal display device S of the present embodiment, as shown in FIG. 5, an IC chip 36 is mounted on the surface of the mounting region 11 a inside the FPC 23 via the ACF 35. In the mounting area 11 a, in addition to the external connection terminal pads 17, a plurality of input terminal pads 18 and a plurality of output terminal pads 19 for connecting the IC chip 36 are provided.

  Each input terminal pad 18 and each output terminal pad 19 are provided on the insulating film 16 together with each external connection terminal pad 17, and are formed in the mounting region 11 a via the respective through holes 16 a formed in the insulating film 16. Each of the formed wirings 20 and 21 is connected. Each external connection terminal pad 17 is connected to the wiring 20. Each input terminal pad 18 is connected to each wiring 20 connected to each external connection terminal pad 17, while each output terminal pad 19 is drawn to each mounting wiring 11 a from each display wiring. Each is connected to the wiring 21.

  The IC chip 36 has a plurality of input bump electrodes 37 and a plurality of output bump electrodes 38 provided on the bottom surface corresponding to the input terminal pads 18 and the output terminal pads 19 on the mounting area 11a. have. The bump electrodes 37 and 38 are electrically connected to the terminal pads 18 and 19 through conductive particles 35a in the ACF 35, respectively.

  The FPC 23 is mounted on the TFT substrate 11 by being bonded to the surface of the mounting region 11a and the substrate end surface 11b via the ACF 22 in the same manner as in the first embodiment. Thus, the liquid crystal display device S is configured such that the signal output from the FPC 23 is input to the liquid crystal display panel 10 via the IC chip 36.

  In order to manufacture the liquid crystal display device S of the present embodiment, the ACF 22 is attached to the FPC 23 so that the ACF 22 is disposed on the surface of the mounting region 11a and the substrate end surface 11b in the adhesive supplying step, as in the first embodiment. At the same time, an ACF 35 for mounting the IC chip 36 is attached to the mounting region 11 a so as to cover the terminal pads 18 and 19.

  In the crimping step, after the FPC 23 is temporarily crimped to the surface of the mounting region 11a, the FPC 23 is heated by the heated pressurizing unit 32a as shown in FIG. The IC chip 36 is pressed against the TFT substrate 11, and the FPC 23 is simultaneously crimped to the surface of the mounting region 11 a and the substrate end surface 11 b via the ACF 22, and the IC chip 36 is crimped to the surface of the mounting region 11 a via the ACF 35. . Here, an arrow 39 in FIG. 6 indicates a direction in which the pressurizing unit 32 a pressurizes the FPC 23 and the IC chip 36. Then, the IC chip 36 is pressed together with the FPC 23 and mounted on the liquid crystal display panel 10 (TFT substrate 11).

  In this embodiment, the IC chip 36 is mounted on the liquid crystal display panel 10 together with the FPC 23. However, in addition to the IC chip 36, chip components such as capacitors and resistors, and diodes are also mounted on the liquid crystal display panel 10 together with the FPC 23. Is possible.

-Effect of Embodiment 2-
Therefore, also in the second embodiment, after the ACF 22 is attached to the FPC 23 so that the ACF 22 is disposed on the surface of the mounting region 11a and the substrate end surface 11b in the adhesive supply step, the ACF 22 is passed through the ACF 22 in the pressure bonding step. Since the FPC 23 is simultaneously pressure-bonded to the surface of the mounting region 11a and the substrate end surface 11b, the same effect as in the first embodiment can be obtained.

  In addition, by mounting the IC chip 36 on the TFT substrate 11 together with the FPC 23 in the crimping step, the step of mounting the IC chip 36 on the TFT substrate 11 is performed separately from the step of mounting the FPC 23 on the TFT substrate 11. Since it is not necessary, the manufacturing process can be reduced.

<< Embodiment 3 of the Invention >>
FIG. 7 shows Embodiment 3 of the present invention. FIG. 7 is a cross-sectional view for explaining the crimping process in the present embodiment.

  In the first embodiment and the second embodiment, the FPC 23 is pressed against the surface of the mounting region 11a and the substrate end surface 11b by using a single pressing jig 32. However, in this embodiment, different pressures are used. The FPC 23 is pressed against the surface of the mounting region 11a and the substrate end surface 11b by the jigs 40 and 41.

  First, as in the first embodiment, after the ACF 22 is attached to one end of the FPC 23 so that the ACF 22 is disposed on the surface of the mounting region 11a and the substrate end surface 11b in the adhesive supply step, the ACF 22 is attached in the pressure bonding step. One end side of the attached FCP 20 is disposed on the surface of the mounting area 11 a of the liquid crystal display panel 10 placed on the stage 31, and one end side of the FPC 23 is temporarily pressure-bonded to the surface of the mounting area 11 a via the ACF 22.

  Then, in the crimping process of the present embodiment, as shown in FIG. 7, the FPC 23 is pressed against the surface of the mounting region 11a by the different pressing jigs 40 and 41 respectively heated by a heater or the like, and at the substrate end surface 11b. Is pressed simultaneously to the surface of the mounting region 11a and the substrate end surface 11b. Here, arrows 42 and 43 in FIG. 7 indicate directions in which the pressurizing jigs 40 and 41 pressurize the FPC 23, respectively.

-Effect of Embodiment 3-
Therefore, also in the third embodiment, the ACF 22 is attached to the FPC 23 so that the ACF 22 is disposed on the surface of the mounting region 11a and the substrate end surface 11b in the adhesive supply step, and then the ACF 22 is passed through the ACF 22 in the pressure bonding step. Since the FPC 23 is simultaneously pressure-bonded to the surface of the mounting region 11a and the substrate end surface 11b, the same effect as in the first embodiment can be obtained.

<< Embodiment 4 of the Invention >>
FIG. 8 shows Embodiment 4 of the present invention. FIG. 8 is a cross-sectional view for explaining a method of mounting the FPC 23 on the TFT substrate 11 in the present embodiment.

  In the present embodiment, the FPC 23 is applied to the surface of the mounting region 11a and the substrate end surface 11b by the pressing jig 45 having the pressing surface 45a formed in a step shape so as to face the surface of the mounting region 11a and the substrate end surface 11b. Press.

  First, as in the first embodiment, after the ACF 22 is attached to one end of the FPC 23 so that the ACF 22 is disposed on the surface of the mounting region 11a and the substrate end surface 11b in the adhesive supply step, the ACF 22 is attached in the pressure bonding step. One end side of the attached FCP 23 is disposed on the surface of the mounting area 11 a of the liquid crystal display panel 10 placed on the stage 31, and one end side of the FPC 23 is temporarily pressure-bonded to the surface of the mounting area 11 a via the ACF 22.

  And in the crimping | compression-bonding process of this embodiment, as shown in FIG. 8, the pressurization jig | tool 45 which has the said step-shaped pressurization surface 45a heated with the heater etc. is dropped to the stage 31 side, and the mounting area | region 11 is shown. By pressing the FPC 23 onto the surface and pressing the FPC 23 onto the substrate end surface 11b, the FPC 23 is simultaneously pressed against the surface of the mounting region 11a and the substrate end surface 11b. Here, an arrow 46 in FIG. 8 indicates a direction in which the pressing jig 45 is lowered.

-Effect of Embodiment 4-
Therefore, also in the fourth embodiment, after the ACF 22 is attached so that the ACF 22 is disposed on the surface of the mounting area 11a and the substrate end face 11b with respect to the FPC 23 in the adhesive supply process, the surface of the mounting area 11a in the pressure bonding process. In addition, since the FPC 23 is simultaneously pressure-bonded to the substrate end surface 11b, the same effect as in the first embodiment can be obtained.

<< Embodiment 5 of the Invention >>
FIG. 9 shows Embodiment 5 of the present invention. FIG. 9 is a cross-sectional view schematically showing a mounting portion of the FPC 23 of the liquid crystal display device S in the present embodiment.

  In the liquid crystal display device S of the present embodiment, as shown in FIG. 9, the TFT substrate 11 has an inclined side surface 11c at an end portion where the mounting region 11a is defined, and the surface of the mounting region 11a and the inclined side surface 11c. Each external connection terminal pad 17 having the same size as that of the first embodiment is provided. Here, the inclined side surface 11c is preferably formed relatively large from the viewpoint of narrowing the mounting region 11a.

  As in the first embodiment, the FPC 23 is electrically connected to each external connection terminal pad 17 via the conductive particles 22a in the ACF 22, and to the surface of the mounting region 11a and the substrate end face 11b via the ACF 22. It is bonded and mounted on the TFT substrate 11.

  In order to manufacture the liquid crystal display device S, before the FPC 23 is mounted on the liquid crystal display panel 10, the corner portion of the end portion where the mounting region 11a of the TFT substrate 11 is defined is polished by a grindstone or the like, thereby mounting the liquid crystal display device S. An inclined side surface 11c is formed at the end where the region 11a is defined. Next, after cleaning the liquid crystal display panel 10 on which the inclined side surface 11c is formed, each external connection terminal pad 17 is patterned on the surface of the mounting region 11a by drawing with a dispenser, printing method, ink jet method, photolithography method or the like. Form.

  After that, similarly to the first embodiment, the ACF 22 is attached to the FPC 23 in the adhesive supplying process, and the FPC 23 is simultaneously pressed onto the surface of the mounting region 11a and the substrate end surface 11b in the pressure bonding process to mount the FPC 23 on the TFT substrate 11.

-Effect of Embodiment 5-
Therefore, according to the fifth embodiment, similarly to the first embodiment, the ACF 22 is attached to the FPC 23 in the adhesive supplying step, and the FPC 23 is simultaneously pressed onto the surface of the mounting region 11a and the substrate end surface 11b in the pressure bonding step. The same effect as in the first embodiment can be obtained.

  In addition, the mounting region 11a has inclined side surfaces 11c at the defined end portions, and each exterior having the same size as that of the first embodiment provided on the surface of the mounting region 11a and the inclined side surface 11c. Since the FPC 23 is electrically connected to the connection terminal pad 17, the FPC 23 is connected to each external connection terminal pad 17 of the same size provided on the surface of the flat mounting region 11 a as in the first embodiment. In the case where the external connection terminal pads 17 and the FPC 23 are connected, the external connection terminal pads 17 are formed on the inclined side surface 11c without reducing the connection area. The projecting length can be shortened, and the mounting area 11a can be further narrowed.

Embodiment 6 of the Invention
FIG. 10 shows Embodiment 6 of the present invention. FIG. 10 is a cross-sectional view schematically showing a mounting portion of the FPC 23 of the liquid crystal display device S in the present embodiment.

  In the fifth embodiment, each external connection terminal pad 17 having the same size as that of the first embodiment is provided on the surface of the mounting region 11a and the inclined side surface 11c. However, in the present embodiment, FIG. As shown in FIG. 11, each external connection terminal pad 17 having the same size as each external connection terminal pad 107 of the conventional liquid crystal display panel 100 shown in FIG. 11 is provided on the surface of the mounting region 11a and the inclined side surface 11c. The FPC 23 is electrically connected to each of the external connection terminal pads 17.

-Effect of Embodiment 6-
Therefore, according to the sixth embodiment, in addition to obtaining the same effects as those of the first embodiment, each external connection of the conventional liquid crystal display panel 100 provided on the surface of the mounting region 11a and the inclined side surface 11c. Since the FPC 23 is electrically connected to each external connection terminal pad 17 having the same size as the terminal pad 107 for connection, the connection between each external connection terminal pad 17 and the FPC 23 with respect to a conventional liquid crystal display device. The mounting region 11a can be narrowed without reducing the area and without reducing the adhesive strength of the FPC 23 to the TFT substrate 11.

<< Other Embodiments >>
In each of the above embodiments, the ACF 22 is attached to the FPC 23 in the adhesive supply step. However, the present invention is not limited to this, and the ACF 22 is attached to the surface of the mounting region 11a and the substrate end surface 11b in the adhesive supply step. Also good.

  When the ACF 22 is affixed to the surface of the mounting region 11a and the substrate end surface 11b in the adhesive material supplying step, the ACF 22 is difficult to affix to the substrate end surface 11b if the flatness of the substrate end surface 11b is relatively low. It is preferable to improve the flatness of the substrate end surface 11b by, for example, polishing the substrate end surface 11b with a grindstone or the like.

  Further, in a method of manufacturing a multi-panel liquid crystal display device in which a plurality of liquid crystal display panels are manufactured by dividing a liquid crystal display mother panel that is an aggregate of a plurality of liquid crystal display panels, a TFT substrate constituting the liquid crystal display mother panel is manufactured. It is preferable to divide the TFT substrate by cutting the TFT mother substrate, which is an aggregate, over the entire depth direction with a laser or a cutter wheel. In this way, after forming a scribe groove on the surface of the TFT mother substrate, the TFT mother substrate is divided by pressing the TFT mother substrate from the back side along the scribe groove, so-called scribe break method. Compared with the case of dividing the substrate, it is possible to improve the flatness of the substrate end surface 11b which is a cut surface.

  Further, in the adhesive supply process, each adhesive may be supplied so that different adhesives are arranged on the surface of the mounting region 11a and the substrate end surface 11b with respect to at least one of the TFT substrate 11 and the FPC 23. Good.

  Thus, even if different adhesives are supplied so as to be arranged on the surface of the mounting region 11a and the substrate end surface 11b, respectively, the surface of the mounting region 11a and the substrate end surface 11b are interposed via these adhesives in the crimping process. By simultaneously pressing the FPC 23, it is possible to suppress an increase in manufacturing steps and increase the adhesive strength of the FPC 23 mounted on the TFT substrate 11.

  When supplying different adhesives so as to be arranged on the surface of the mounting area 11a and the substrate end face 11b, the surface of the mounting area 11a is applied by different crimping jigs 40 and 41 as in the second embodiment. And it is preferable to pressurize FPC23 to the board | substrate end surface 11b.

  In this way, even when the proper pressure bonding conditions (temperature conditions and pressure conditions) of the respective adhesive materials are different from each other, the pressure bonding conditions for the pressure jigs 40 and 41 are appropriate for the respective adhesive materials. By setting to, the FPC 23 can be accurately bonded to both the surface of the mounting region 11a and the substrate end surface 11b.

  In each of the above embodiments, the FPC 23 is mounted on the TFT substrate 11 via the ACF 22. However, the present invention is not limited to this, and an anisotropic conductive paste (ACP) or non-conductive paste (NCP: Non) is used. The FPC 23 may be mounted on the TFT substrate 11 via Conductive Paste).

  In the second embodiment, the IC chip 36 is mounted on the TFT substrate 11 together with the FPC 23. However, the present invention is not limited to this, and the IC chip 36 is mounted on the TFT substrate 11 separately from mounting the FPC 23 on the TFT substrate 11. May be.

  In the fifth embodiment, each external connection terminal pad 17 is formed in the same size as the first embodiment. In the sixth embodiment, each external connection terminal pad 17 is formed in the same size as each external connection terminal pad 107 of the conventional liquid crystal display panel 100. However, the present invention is not limited to this. However, each external connection terminal pad 17 is formed so that the connection area between each external connection terminal pad 17 and the FPC 23 is sufficiently secured by appropriately adjusting the size of the inclined side surface 11c. Just do it.

  In each of the above embodiments, the FPC 23 is folded back to the back side of the TFT substrate 11. However, the present invention is not limited to this, and the FPC 23 is not folded back to the back side, but is attached to the back side end of the substrate end surface 11b. It may be arranged extending from the portion in the protruding direction of the mounting region 11a, as long as the surface of the mounting region 11a and the substrate end surface 11b of the end portion where the mounting region 11a is defined.

  In each of the above embodiments, the liquid crystal display device S having a substrate mounting structure has been described as an example. However, the present invention is not limited thereto, and other display devices such as an electroluminescence display device and a plasma display device, and a manufacturing method thereof. The present invention can be applied to a substrate mounting structure in which a flexible wiring substrate is mounted on an end portion of an element substrate, and a manufacturing method thereof.

  As described above, the present invention is useful for a substrate mounting structure, a liquid crystal display device, and a method for manufacturing the substrate mounting structure. In particular, an increase in manufacturing steps is suppressed and a wiring substrate mounted on an element substrate is used. It is suitable for a substrate mounting structure, a liquid crystal display device, and a method for manufacturing the substrate mounting structure that require an increase in adhesive strength.

1 is a plan view schematically showing a liquid crystal display device of Embodiment 1. FIG. It is a figure which shows schematically the II-II sectional view taken on the line of FIG. FIG. 3 is a perspective view schematically showing a pressing jig used in the crimping process of the first embodiment. FIG. 3 is a cross-sectional view showing a state in which an FPC is crimped to a TFT substrate in the crimping process of Embodiment 1. FIG. 6 is a cross-sectional view of a mounting region schematically showing a mounting portion of an IC chip and an FPC in the liquid crystal display device of Embodiment 2. 6 is a cross-sectional view of a mounting region showing a state in which an FPC is pressure-bonded to a TFT substrate in a pressure-bonding process of Embodiment 2. FIG. 10 is a cross-sectional view of a mounting region showing a state in which an FPC is pressure-bonded to a TFT substrate in a pressure-bonding process of Embodiment 3. FIG. FIG. 10 is a cross-sectional view of a mounting region showing a state in which an FPC is crimped to a TFT substrate in the crimping process of Embodiment 4. FIG. 10 is a cross-sectional view schematically showing a mounting portion of an FPC in the liquid crystal display device of Embodiment 5. FIG. 10 is a cross-sectional view schematically illustrating a mounting part of an FPC in a liquid crystal display device according to a sixth embodiment. It is sectional drawing which shows schematically the mounting part of FPC in the conventional liquid crystal display device.

Explanation of symbols

S Liquid crystal display device 11 TFT substrate (element substrate)
11a Mounting region 11b Substrate end surface 11c at the end where the mounting region is defined Inclined side surface 12 CF substrate (counter substrate)
13 Liquid crystal layer 14 Sealing material 22 ACF (adhesive)
23 FPC (wiring board)
32, 40, 41, 45 Pressurizing jig 32a Pressurizing part 36 IC chip (chip component)
45a Pressure surface

Claims (9)

A method of manufacturing a substrate mounting structure comprising an element substrate having a mounting area defined at an end, and a flexible wiring board mounted on the mounting area via an adhesive,
Adhesive material supplying step of supplying the adhesive material to at least one of the element substrate and the wiring substrate so that the adhesive material is disposed on the surface of the mounting region and the end surface of the substrate where the mounting region is defined. When,
A circuit board mounting comprising: a step of crimping the wiring board to the element substrate by simultaneously crimping the wiring board to the surface of the mounting region and the end surface of the substrate through the supplied adhesive. Structure manufacturing method. In the manufacturing method of the board | substrate mounting structure of Claim 1,
In the adhesive material supplying step, an adhesive material disposed on the surface of the mounting region and an adhesive material disposed on the end surface of the substrate are integrally supplied. In the manufacturing method of the board | substrate mounting structure of Claim 1,
In the crimping step, the surface of the mounting region and the substrate are formed by a pressing jig having a pressing portion made of an elastic body that can be deformed so as to cover the surface of the mounting region and the portion to be crimped to the end face of the wiring board. A method for manufacturing a substrate mounting structure, comprising pressurizing the wiring substrate to an end face. In the manufacturing method of the board | substrate mounting structure of Claim 3,
In the crimping step, the chip component is pressed together with the wiring board by the pressing jig and mounted on the element substrate. In the manufacturing method of the board | substrate mounting structure of Claim 1,
In the crimping step, the wiring board is pressed against the surface of the mounting area and the end face of the board by using different pressing jigs. In the manufacturing method of the board | substrate mounting structure of Claim 1,
In the crimping step, the wiring board is pressed against the surface of the mounting region and the end surface of the substrate by a pressing jig having a pressing surface formed in a step shape so as to face the surface of the mounting region and the end surface of the substrate. A method for manufacturing a substrate mounting structure characterized by the above. An element substrate whose mounting area is defined at the end; and
A board mounting structure comprising a flexible wiring board mounted on the mounting area via an adhesive,
The wiring board is mounted on the element substrate by being bonded via the adhesive formed integrally with the surface of the mounting region and the substrate end surface of the end portion where the mounting region is defined. PCB mounting structure. The board mounting structure according to claim 7,
The element substrate has a side surface inclined at an end portion where the mounting area is defined,
The board mounting structure, wherein the wiring board is electrically connected to connection electrodes provided on a surface of the mounting area and the inclined side surface. An element substrate whose mounting area is defined at the end; and
A flexible wiring board mounted on the mounting region via an adhesive;
A counter substrate disposed to face the element substrate;
A liquid crystal layer provided between the element substrate and the counter substrate;
The mounting area is a liquid crystal display device arranged outside the counter substrate,
The wiring board is mounted on the element substrate by being bonded via the adhesive formed integrally with the surface of the mounting region and the substrate end surface of the end portion where the mounting region is defined. Liquid crystal display device.

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