CN110119053A - Display device and preparation method thereof - Google Patents
Display device and preparation method thereof Download PDFInfo
- Publication number
- CN110119053A CN110119053A CN201910327866.6A CN201910327866A CN110119053A CN 110119053 A CN110119053 A CN 110119053A CN 201910327866 A CN201910327866 A CN 201910327866A CN 110119053 A CN110119053 A CN 110119053A
- Authority
- CN
- China
- Prior art keywords
- substrate
- flexible circuit
- circuit board
- display panel
- driving chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1345—Conductors connecting electrodes to cell terminals
- G02F1/13452—Conductors connecting driver circuitry and terminals of panels
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/35—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being liquid crystals
Landscapes
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Nonlinear Science (AREA)
- General Physics & Mathematics (AREA)
- Mathematical Physics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
A kind of display device, comprising: display panel and chip package mould group, the chip package mould group include hard substrate, driving chip and the first flexible circuit board；Wherein, first flexible circuit board is connect with the display panel and the hard substrate respectively.By the way that the part positioned at binding region of display panel is cut, the binding for obtaining fritter has the glass substrate of driving chip, and display panel is connect with the glass substrate using bent flexible circuit board, form the chip package mould group of COG structure, on the one hand the size of the chip package mould group is unrestricted, can flexible design；On the other hand production cost can also be saved.
Description
Technical field
The present invention relates to field of display technology more particularly to a kind of display device and preparation method thereof.
Background technique
Smart phone is lived indispensable a part as modern people, and performance is concerned, comprehensive screen mobile phone
Occur, not only increases the aesthetic measure of mobile phone, higher screen accounting also brings better visual experience to user.In order to realize
Higher screen accounting, using COF (Chip On Film, chip package is on film) the traditional COG of technical substitution (Chip On
Glass, chip package is on glass) technology carries out the encapsulation of driving chip.
On the one hand, it is easy to appear driving chip when mould assembles complete machine to contact with backlight module, COF and backlight module
Between have gap, may result in the damage of driving chip, and COF technique, to the more demanding of size, COF can only be made into spy
Fixed size；On the other hand, COF material is expensive, is unfavorable for saving production cost.
Summary of the invention
The present invention provides a kind of display device and preparation method thereof, to solve existing display panel, due to using COF skill
Art encapsulates driving chip, is easy to cause chip to contact with backlight when mould assembles complete machine, damages chip, and the cost of COF
It is higher, it is unfavorable for the problem of saving production cost.
To solve the above problems, technical solution provided by the invention is as follows:
The present invention provides a kind of display device, including display panel and chip package mould group, defines on the display panel
There are display area and the frame region around display area setting；The chip package mould group includes hard substrate, is set to
Driving chip and the first flexible circuit board on the hard substrate；Wherein, the first end of first flexible circuit board with
The display panel connection, the second end of first flexible circuit board are connect with the hard substrate.
In an embodiment of the present invention, the first end of first flexible circuit board is connect with the frame region.
In an embodiment of the present invention, the chip package mould group further includes second connect with the hard substrate
Flexible circuit board.
In an embodiment of the present invention, the second end of first flexible circuit board and the hard substrate is close
One end of the display panel connects, second flexible circuit board and the one end of the hard substrate far from the display panel
Connection.
In an embodiment of the present invention, the hard substrate is glass substrate.
In an embodiment of the present invention, the display panel further includes underlay substrate, the underlay substrate with it is described
Hard substrate is respectively two substrates made of same substrate cut.
The present invention also provides a kind of display module including above-mentioned display device, the display module further includes described in support
The frame of display panel is provided with the groove to match with the driving chip on the frame；Wherein, the driving chip is received
It is dissolved in the groove.
The present invention also provides a kind of preparation methods of above-mentioned display device, comprising:
S10 provides a display panel including underlay substrate, and definition has display area and sets around the display area thereon
The frame region set.
S20, binds driving chip on the underlay substrate, and the driving chip is located at the frame region；
S30 cuts the underlay substrate, obtains the hard substrate that a binding has the driving chip；
The hard substrate is connect by S40 using the first flexible circuit board with the display panel.
In an embodiment of the present invention, the underlay substrate is glass substrate.
In an embodiment of the present invention, the preparation method further include:
Second flexible circuit board is connect by S50 with the hard substrate.
In an embodiment of the present invention, in the S30, the underlay substrate is cut into two along a cutting line
Part, a portion are the hard substrate, and the cutting line is between the display area and the driving chip.
The invention has the benefit that being obtained small by cutting the part positioned at binding region of display panel
The binding of block has the glass substrate of driving chip, and is connected display panel and the glass substrate using bent flexible circuit board
It connects, forms the chip package mould group of COG structure, on the one hand the size of the chip package mould group is unrestricted, can flexible design；Separately
On the one hand production cost can also be saved.
Detailed description of the invention
It, below will be to embodiment or the prior art in order to illustrate more clearly of embodiment or technical solution in the prior art
Attached drawing needed in description is briefly described, it should be apparent that, the accompanying drawings in the following description is only some of invention
Embodiment for those of ordinary skill in the art without creative efforts, can also be attached according to these
Figure obtains other attached drawings.
Fig. 1 is the top view of the display device of that present invention；
Fig. 2 is the side view of the display device of that present invention；
Fig. 3 is the step flow chart of the preparation method of the display device of that present invention；
Fig. 4 is the structural schematic diagram in the preparation process of the display device of that present invention.
Specific embodiment
The explanation of following embodiment is referred to the additional illustration, the particular implementation that can be used to implement to illustrate the present invention
Example.The direction term that the present invention is previously mentioned, such as [on], [under], [preceding], [rear], [left side], [right side], [interior], [outer], [side]
Deng being only the direction with reference to annexed drawings.Therefore, the direction term used be to illustrate and understand the present invention, rather than to
The limitation present invention.The similar unit of structure is with being given the same reference numerals in the figure.
The present invention is directed to existing display panel, due to encapsulating driving chip using COF technology, when mould assembles complete machine
Time is easy to cause chip to contact with backlight, damages chip, and the higher cost of COF, is unfavorable for saving production cost, the present embodiment
It is able to solve the defect.
As shown in Figure 1, a kind of display device 100 of the present patent application, including display panel 10 and with the display panel 10
The chip package mould group 20 of connection.
Wherein, definition has display area AA and frame region NA, the frame region NA to surround on the display panel 10
The display area AA setting, the display area AA is for showing picture, and the frame region NA is to accommodate surrounding cabling
And the shading devices such as camera.
The chip package mould group 20 includes hard substrate 21, driving chip 22, the first flexible circuit board 23.
Wherein, the driving chip 22 is set on the hard substrate 21, and the first of first flexible circuit board 23
End is connect with the display panel 10, and the second end of first flexible circuit board 23 is connect with the hard substrate 21, wherein
The first end and the second end of first flexible circuit board 23 are that two of first flexible circuit board 23 are opposite
End.
As shown in Fig. 2, first flexible circuit board 23 has flexibility, can be bent, so that the hard substrate
21 and the driving chip 22 be folded into together the display panel 10 the back side it is (opposite with the light-emitting surface of the display panel 10
A side surface), and then the area of the frame region of the display panel 10 is saved, to improve the screen of the display panel 10
Accounting.
The chip package mould group 20 further includes the second flexible circuit board 24, by second flexible circuit board 24 by institute
It states driving chip 22 and connect (not shown) with the microcontroller of the display device 100.
Specifically, the close display panel of the second end of first flexible circuit board 23 and the hard substrate 21
10 one end connection, second flexible circuit board 24 connect with the hard substrate 21 far from one end of the display panel 10
It connects.
A side of first flexible circuit board 23 is connect with the frame region NA of the display panel 10, opposite
Another side is connect with the hard substrate 21.
The display panel 10 includes underlay substrate 11, and the hard substrate 21 can be same with the underlay substrate 11
Two substrates made of substrate cut simplify preparation process, and can save raw material.
As shown in figure 3, the present embodiment is illustrated with mobile phone display device, and in the present embodiment, the underlay substrate 11
Can be glass substrate, when preparing the display panel 10, its lower edge can be configured to it is wider compared with other frame regions under
Frame region, and then the packaging area of the driving chip 22 can be reserved in the following frame region.
The driving chip 22 first is prepared in the part positioned at following frame region of the underlay substrate 11, it later will be described
Glass substrate is cut into two pieces of substrates, and one piece of substrate is the display panel 10 for including the display area AA, and another piece of substrate is
Hard substrate 21 including the driving chip 22.Two pieces of substrates are connected using flexible circuit board later, are formed
" COG " structure.
In other embodiments, the underlay substrate 11 can not use same glass substrate to carry out with the hard substrate 21
It cuts, the packaging area of the driving chip 22 can not be reserved on the underlay substrate 11, directly the selection suitable glass of size
Glass substrate is as the hard substrate 21.
The present invention also provides a kind of display module including above-mentioned display device 100, the display module includes being used for group
The frame of complete machine is filled, the frame supports the display panel 10, and is provided on the frame and 22 phase of driving chip
Matched groove, the driving chip 22 are contained in the groove, and the driving chip is avoided to connect with other component
Touching is squeezed and is damaged.
The present embodiment is by taking liquid crystal display die set as an example, and the display module further includes providing the backlight module of light source, in institute
When stating display panel 10 and the chip package mould group 20 and carrying out complete machine assembling, the groove can avoid the driving chip 22 with
The backlight module contact causes the driving chip 22 to damage.Compared with existing COF technology, the ruler of the hard substrate 21
Very little design is unrestricted, can be designed accordingly according to the needs of complete machine, and the hard substrate 21 and existing COF technique
It compares, production cost is lower；Meanwhile the hard substrate 21 can be for made of same substrate cut with the underlay substrate 11
Two substrates can simplify technique, save cost of material.
As shown in Figure 2 and Figure 4, the present embodiment also provides a kind of preparation method of above-mentioned display device 100, comprising:
S10 provides a display panel 10 including underlay substrate 11, and definition has display area AA and around the display thereon
The frame region NA of region AA setting.
S20, binds driving chip 22 on the underlay substrate 11, and the driving chip 22 is located at the frame region
NA；
S30 cuts the underlay substrate 11, obtains the hard substrate 21 that a binding has the driving chip 22；
The hard substrate 21 is connect by S40 using the first flexible circuit board 23 with the display panel 10.
The preparation method further include: the second flexible circuit board 24 is connect by S50 with the hard substrate 21.
First flexible circuit board 23 is opposite with the two of the hard substrate respectively with second flexible circuit board 24
Side connection.
Wherein, the underlay substrate 11 is glass substrate, and the underlay substrate 11 is cut into two along a cutting line L
Point, a portion be that binding has the hard substrate 21 of the driving chip 22, another part be include showing for display area AA
Show panel 10, the cutting line L is between the display area AA and the driving chip 22.
The utility model has the advantages that the binding for obtaining fritter has by cutting the part positioned at binding region of display panel
The glass substrate of driving chip, and connect display panel with the glass substrate using bent flexible circuit board, form COG
The chip package mould group of structure, on the one hand the size of the chip package mould group is unrestricted, can flexible design；On the other hand also can
Enough save production cost.
In conclusion although the present invention has been disclosed above in the preferred embodiment, but above preferred embodiment is not to limit
The system present invention, those skilled in the art can make various changes and profit without departing from the spirit and scope of the present invention
Decorations, therefore protection scope of the present invention subjects to the scope of the claims.
Claims (10)
1. a kind of display device characterized by comprising
Display panel, thereon definition have display area and the frame region around display area setting；
Chip package mould group, including hard substrate, the driving chip being set on the hard substrate and the first flexible circuit
Plate；Wherein,
The first end of first flexible circuit board is connect with the display panel, the second end of first flexible circuit board with
The hard substrate connection.
2. display device according to claim 1, which is characterized in that the first end of first flexible circuit board with
The frame region connection.
3. display device according to claim 1, which is characterized in that the chip package mould group further includes and the hard
Second flexible circuit board of substrate connection.
4. display device according to claim 3, which is characterized in that the second end of first flexible circuit board with it is described
One end close to the display panel of hard substrate connects, and second flexible circuit board and the hard substrate are far from described
One end of display panel connects.
5. display device according to claim 1, which is characterized in that the hard substrate is glass substrate.
6. display device according to claim 5, which is characterized in that the display panel further includes underlay substrate, described
Underlay substrate and the hard substrate are respectively two substrates made of same substrate cut.
7. a kind of display module, including display device as described in any one of claims 1 to 6, which is characterized in that the display
Mould group further include:
The frame of the display panel is supported, the groove to match with the driving chip is provided on the frame；Wherein,
The driving chip is contained in the groove.
8. a kind of preparation method of display device as described in any one of claims 1 to 6 characterized by comprising
S10 provides a display panel including underlay substrate, and definition thereon has display area and around display area setting
Frame region.
S20, binds driving chip on the underlay substrate, and the driving chip is located at the frame region；
S30 cuts the underlay substrate, obtains the hard substrate that a binding has the driving chip；
The hard substrate is connect by S40 using the first flexible circuit board with the display panel.
9. preparation method according to claim 8, which is characterized in that the preparation method further include:
Second flexible circuit board is connect by S50 with the hard substrate.
10. preparation method according to claim 8, which is characterized in that, will be described along a cutting line in the S30
Underlay substrate is cut into two parts, and a portion is the hard substrate, and the cutting line is located at the display area and institute
It states between driving chip.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910327866.6A CN110119053A (en) | 2019-04-23 | 2019-04-23 | Display device and preparation method thereof |
| PCT/CN2019/106419 WO2020215599A1 (en) | 2019-04-23 | 2019-09-18 | Display device and preparation method therefor, and display module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910327866.6A CN110119053A (en) | 2019-04-23 | 2019-04-23 | Display device and preparation method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110119053A true CN110119053A (en) | 2019-08-13 |
Family
ID=67521391
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910327866.6A Pending CN110119053A (en) | 2019-04-23 | 2019-04-23 | Display device and preparation method thereof |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN110119053A (en) |
| WO (1) | WO2020215599A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020215599A1 (en) * | 2019-04-23 | 2020-10-29 | 武汉华星光电技术有限公司 | Display device and preparation method therefor, and display module |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1446325A (en) * | 2001-06-08 | 2003-10-01 | 那纳须株式会社 | Liquid crystal display device and method for manufacturing the same |
| CN1811539A (en) * | 2006-02-16 | 2006-08-02 | 友达光电股份有限公司 | Planar display device |
| CN101551539A (en) * | 2008-04-03 | 2009-10-07 | 北京京东方光电科技有限公司 | Mold framework and liquid crystal display device |
| CN102073155A (en) * | 2009-11-20 | 2011-05-25 | 群康科技(深圳)有限公司 | Circuit board fixing structure, liquid crystal display device with circuit board fixing structure and electronic device with circuit board fixing structure |
| CN103631039A (en) * | 2013-11-29 | 2014-03-12 | 南京中电熊猫液晶显示科技有限公司 | Integrated liquid crystal displayer and manufacturing method thereof |
| CN107561764A (en) * | 2017-10-30 | 2018-01-09 | 上海天马微电子有限公司 | A kind of display panel and its display device |
| CN107728365A (en) * | 2017-10-31 | 2018-02-23 | 武汉华星光电技术有限公司 | Narrow frame display panel and display device |
| CN108445660A (en) * | 2018-02-09 | 2018-08-24 | 武汉华星光电技术有限公司 | A kind of COF single-layer-flex circuits and corresponding liquid crystal display |
| CN108681126A (en) * | 2018-07-02 | 2018-10-19 | 惠科股份有限公司 | Display device and assembly method of display device |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20150095988A (en) * | 2014-02-13 | 2015-08-24 | 삼성디스플레이 주식회사 | Display device and method of manufacturing the same |
| TWI599996B (en) * | 2016-11-09 | 2017-09-21 | 奕力科技股份有限公司 | Display apparatus |
| CN108845445A (en) * | 2018-08-24 | 2018-11-20 | 武汉华星光电技术有限公司 | Comprehensive display screen and the display device using comprehensive display screen |
| CN109212808A (en) * | 2018-11-23 | 2019-01-15 | 京东方科技集团股份有限公司 | The production method of liquid crystal display panel, display device and liquid crystal display panel |
| CN110119053A (en) * | 2019-04-23 | 2019-08-13 | 武汉华星光电技术有限公司 | Display device and preparation method thereof |
-
2019
- 2019-04-23 CN CN201910327866.6A patent/CN110119053A/en active Pending
- 2019-09-18 WO PCT/CN2019/106419 patent/WO2020215599A1/en active Application Filing
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1446325A (en) * | 2001-06-08 | 2003-10-01 | 那纳须株式会社 | Liquid crystal display device and method for manufacturing the same |
| CN1811539A (en) * | 2006-02-16 | 2006-08-02 | 友达光电股份有限公司 | Planar display device |
| CN101551539A (en) * | 2008-04-03 | 2009-10-07 | 北京京东方光电科技有限公司 | Mold framework and liquid crystal display device |
| CN102073155A (en) * | 2009-11-20 | 2011-05-25 | 群康科技(深圳)有限公司 | Circuit board fixing structure, liquid crystal display device with circuit board fixing structure and electronic device with circuit board fixing structure |
| CN103631039A (en) * | 2013-11-29 | 2014-03-12 | 南京中电熊猫液晶显示科技有限公司 | Integrated liquid crystal displayer and manufacturing method thereof |
| CN107561764A (en) * | 2017-10-30 | 2018-01-09 | 上海天马微电子有限公司 | A kind of display panel and its display device |
| CN107728365A (en) * | 2017-10-31 | 2018-02-23 | 武汉华星光电技术有限公司 | Narrow frame display panel and display device |
| CN108445660A (en) * | 2018-02-09 | 2018-08-24 | 武汉华星光电技术有限公司 | A kind of COF single-layer-flex circuits and corresponding liquid crystal display |
| CN108681126A (en) * | 2018-07-02 | 2018-10-19 | 惠科股份有限公司 | Display device and assembly method of display device |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020215599A1 (en) * | 2019-04-23 | 2020-10-29 | 武汉华星光电技术有限公司 | Display device and preparation method therefor, and display module |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2020215599A1 (en) | 2020-10-29 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN106646983B (en) | A kind of manufacture craft for ultra-narrow display screen frame | |
| US11061438B2 (en) | Flexible display panel, manufacturing method thereof and display device | |
| US20190384080A1 (en) | Liquid crystal panel and the manufacturing method thereof | |
| CN109215511A (en) | A kind of preparation method of flexible display panels, flexible display panels and display device | |
| CN109343249A (en) | Display panel and preparation method thereof, display device | |
| CN204595373U (en) | FPC bends positioning fixture | |
| CN107526222A (en) | Array base palte and preparation method thereof, display device | |
| CN109377877A (en) | Display module and electronic device | |
| WO2020258459A1 (en) | Display panel and preparation method therefor | |
| CN204347379U (en) | A kind of liquid crystal display module and liquid crystal display | |
| WO2014172964A1 (en) | Lower substrate and manufacturing method therefor, liquid crystal display panel, and liquid crystal display | |
| CN109448553A (en) | Cover board, display device and cover board production method | |
| US10622330B2 (en) | Flexible display panel and preparation method thereof, flexible display device | |
| CN206039087U (en) | Liquid crystal module and liquid crystal display TV thereof | |
| US20230176432A1 (en) | Display panel, manufacturing method thereof, and display device | |
| CN105137646A (en) | LCD panel and LCD module | |
| CN110286791B (en) | Touch substrate, manufacturing method of touch substrate, display panel, manufacturing method of display panel and display device | |
| CN106965534A (en) | A kind of preparation method of touch-control display module | |
| CN110119053A (en) | Display device and preparation method thereof | |
| CN104777633A (en) | Adhesive tape, backlight module and liquid crystal display device | |
| WO2019178924A1 (en) | Liquid crystal display and manufacturing method therefor | |
| CN107272109A (en) | Liquid crystal display module and assemble method, mobile terminal | |
| CN111290151A (en) | Assembling method for assembling and laminating planar LCD into curved surface display and integrated screen | |
| US20190204674A1 (en) | Liquid crystal panel and manufacturing method thereof and display device | |
| CN201233482Y (en) | Special coating glue clamp |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20190813 |
|
| RJ01 | Rejection of invention patent application after publication |