WO2014172964A1

WO2014172964A1 - Lower substrate and manufacturing method therefor, liquid crystal display panel, and liquid crystal display

Info

Publication number: WO2014172964A1
Application number: PCT/CN2013/077048
Authority: WO
Inventors: 徐超; 张春芳; 魏燕; 金熙哲
Original assignee: 京东方科技集团股份有限公司
Priority date: 2013-04-22
Filing date: 2013-06-09
Publication date: 2014-10-30
Also published as: CN103217845A; CN103217845B

Abstract

Provided are a lower substrate and a manufacturing method therefor, a liquid crystal display panel, and a liquid crystal display. The lower substrate comprises a lining substrate (110). A display region (112) and a peripheral region (111) located on the periphery of the display region (112) are formed on the lining substrate (110). A lead wire is formed in the peripheral region (111). The lead wire comprises a first sub-lead wire (301) and a second sub-lead wire (302). The first sub-lead wire (301) is located on a front surface of the lining substrate (110), the second sub-lead wire (302) is located on a back surface of the lining substrate (110), and the first sub-lead wire (301) and the second sub-lead wire (302) are connected by using a connecting structure (6). The lower substrate reduces the length of the driving circuit, and accordingly, reduces the wiring area of the peripheral region and enables the liquid crystal display panel to realize a narrow frame structure.

Description

Lower substrate and manufacturing method thereof, liquid crystal display panel and liquid crystal display

The present invention relates to a lower substrate, a method of manufacturing the same, a liquid crystal display panel, and a liquid crystal display. Background technique

Liquid crystal displays are currently commonly used flat panel displays. Thin Film Transistor Liquid Crystal Display (TFT-LCD) is a mainstream product in liquid crystal displays.

The liquid crystal display includes: a driving circuit board, oppositely disposed upper and lower substrates, and a liquid crystal layer disposed between the upper substrate and the lower substrate. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a plan view showing a conventional liquid crystal display, and Fig. 2 is a cross-sectional view taken along line A-A of Fig. 1. As shown in FIGS. 1 and 2, the liquid crystal display comprises: a liquid crystal display panel and a driving circuit board 5. The driving circuit board 5 can be a printed circuit board (PCB). The liquid crystal display panel includes a lower substrate 1 and an upper substrate 2. The lower substrate 1 and the upper substrate 2 are opposed to each other, and the driving circuit board 5 is electrically connected to the lower substrate 1 through the flexible circuit board 4. Figure 3 is a plan view showing the peripheral region of the lower substrate 1 of Figure 1. The lower substrate 1 includes a substrate substrate 110 on which a display region 111 and a peripheral region 112 located around the periphery of the display region 111 are formed. A lead 3 connecting the display regions 111 is formed in the peripheral region 112, one end of the lead 3 is connected to the display region 111, and the other end of the lead 3 is connected to the drive circuit board 5 via the flexible circuit board 4. That is, the driving circuit board 5 is connected to the lead 3 through the flexible circuit board 4, and the lead 3 is connected to the display area of the lower substrate 1.

In the liquid crystal display described above, since the lead wires 3 are formed in the peripheral region 112 and the leads are positioned on the front surface of the substrate substrate, the lead wires occupy a large wiring area of the peripheral region 112, so that it is difficult to realize a narrow bezel structure for the liquid crystal display panel. Summary of the invention

The invention provides a lower substrate and a manufacturing method thereof, a liquid crystal display panel and a liquid crystal display, which are used for reducing the wiring area of the peripheral area, thereby realizing a narrow frame structure of the liquid crystal display panel, and at the same time, the invention effectively improves the substrate of the village substrate Utilization.

The present invention provides a lower substrate, comprising: a village substrate on which a display area and a peripheral area located around the periphery of the display area are formed, and a lead wire is formed in the peripheral area, wherein The lead includes a first sub-lead and a second sub-lead, the first sub-lead is located on the front surface of the substrate, the second sub-lead is located on the back surface of the substrate, and the first sub-lead and the second sub-lead are connected by a connection structure.

Optionally, the second sub-lead is connected to the driving circuit board through the first flexible circuit board.

Optionally, the connection structure is a second flexible circuit board.

Optionally, the substrate of the village comprises a glass substrate or a flexible material substrate.

The invention also provides a method for manufacturing a lower substrate, comprising: forming an array pattern on a substrate of the village, the array pattern is located in the display area; forming a lead on the substrate of the village, the lead is located in the peripheral area, and the lead comprises the first sub-lead And a second sub-lead, the peripheral area is located at a periphery of the display area; and the first sub-lead and the second sub-lead are connected by a connection structure.

Optionally, forming the lead on the substrate of the substrate comprises: forming a first sub-lead on the front side of the substrate; and forming a second sub-lead on the back side of the substrate.

Optionally, connecting the first sub-lead and the second sub-lead through the connection structure comprises: connecting the connection structure to the first sub-lead and the second sub-lead respectively by a chip lamination process.

Optionally, the connection structure is a flexible circuit board.

The present invention also provides a liquid crystal display panel comprising: an upper substrate and the lower substrate, the upper substrate and the lower substrate being oppositely disposed.

To achieve the above object, the present invention provides a liquid crystal display comprising the above liquid crystal display. In the technical solution of the lower substrate and the manufacturing method thereof, the liquid crystal display panel and the liquid crystal display provided by the present invention, the display substrate and the peripheral region located around the display region are formed on the substrate, and the lead is formed in the peripheral region, and the lead includes the first The sub-lead and the second sub-lead are located on the front surface of the substrate, the second sub-lead is located on the back surface of the substrate, and the first sub-lead and the second sub-lead are connected by a connection structure. The invention reduces the length of the single-sided lead of the lower substrate, thereby reducing the wiring area of the peripheral area, so that the liquid crystal display panel realizes the narrow frame structure, and at the same time, the invention effectively improves the utilization ratio of the village substrate. DRAWINGS

In order to more clearly illustrate the technical solutions in the present disclosure or the prior art, the drawings to be used in the technical solutions provided in the present disclosure or in the description of the prior art will be briefly described below, and obviously, the attached in the following description The drawings are merely illustrative of some specific embodiments of the technical solutions of the present disclosure, and those skilled in the art can obtain other drawings according to the drawings without any creative work. 1 is a schematic structural view of a liquid crystal display in the prior art;

Figure 2 is a cross-sectional view taken along line A-A of Figure 1;

3 is a schematic structural view of a peripheral region of the lower substrate of FIG. 1;

4 is a schematic structural diagram of a lower substrate according to Embodiment 1 of the present invention;

Figure 5 is a cross-sectional view taken along line B-B of Figure 4;

6 is a schematic structural view of a peripheral region of a front surface of the lower substrate of FIG. 4;

7 is a schematic structural view of a peripheral region of the back surface of the lower substrate of FIG. 4;

8 is a flow chart of a method for manufacturing a lower substrate according to a second embodiment of the present invention; FIG. 9 is a schematic structural view of a liquid crystal display according to a fourth embodiment of the present invention; and FIG. 10 is a cross-sectional view taken along line C-C of FIG.

11 is a schematic view showing a splicing screen using a liquid crystal display panel of the related art; and

Fig. 12 is a schematic view showing a splicing screen using the liquid crystal display panel of the present invention. detailed description

The technical solutions in the embodiments of the present disclosure are clearly and completely described in the following with reference to the drawings in the embodiments of the present disclosure. It is obvious that the described embodiments are only a part of the embodiments of the present disclosure, and not all of the embodiments. All other embodiments obtained by a person of ordinary skill in the art based on the embodiments of the present disclosure without departing from the inventive scope are the scope of the disclosure.

Unless otherwise defined, technical terms or scientific terms used herein shall be used in the ordinary meaning as understood by those of ordinary skill in the art. The words "first", "second" and similar terms used in the specification and claims of the present disclosure do not denote any order, quantity or importance, but are merely used to distinguish different components. Similarly, the words "a" or "an" do not mean a quantity limitation, but rather mean that there is at least one. Words such as "connected" or "connected" are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect. "Up", "Down", "Left", "Right", etc. are only used to indicate the relative positional relationship, and when the absolute position of the object to be described is changed, the relative positional relationship is also changed accordingly.

Embodiment 1

4 is a plan view of a lower substrate according to a first embodiment of the present invention, and FIG. 5 is a cross-sectional view taken along line BB of FIG. 4. As shown in FIG. 4 and FIG. 5, the lower substrate includes: a village substrate 110. The village substrate 110 is formed with a display area 112 and a peripheral area 111 located around the display area 112. Lead wires are formed in the peripheral region 111, and the leads include a first sub-lead 301 and a second sub-lead 302. The first sub-lead 301 is located on the front surface of the village substrate 110, and the second sub-lead 302 is located on the back surface of the village substrate 110. The first sub-lead 301 and the second sub-lead 302 are connected by a connection structure 6.

In this embodiment, optionally, the second sub-lead 302 is connected to the driving circuit board through the first flexible circuit board 4.

In this embodiment, the connection structure 6 is a second flexible circuit board. When the first sub-lead 301 and the second sub-lead 302 are connected through the second flexible circuit board, the chip bonding process (bonding) may be adopted. A sub-lead 301 and a second sub-lead 302 are respectively connected to the second flexible circuit board.

One end of the first sub-lead 301 is connected to the second flexible circuit board, and the other end of the first sub-lead 301 is connected to the gate line and/or the data line in the display area.

In this embodiment, optionally, the village substrate 110 includes a glass substrate or a flexible material substrate. When the village substrate 110 is a glass substrate, the lower substrate is generally used in a conventional TFT-LCD. When the village substrate 110 is a flexible material substrate, the lower substrate can be used in a flexible display.

6 is a plan view showing a peripheral region of the front surface of the lower substrate of FIG. 4, and FIG. 7 is a plan view showing a peripheral region of the back surface of the lower substrate of FIG. 4. As shown in FIG. 6 and FIG. 7, in the embodiment, the substrate 110 is A display area 112 and a peripheral area 111 located around the periphery of the display area 112 are formed thereon, and the lead is divided into a first sub-lead 301 and a second sub-lead 302. The first sub-lead 301 is located on the front side of the village substrate 110, and the second sub-lead 302 is located on the back surface of the substrate 110, and the first sub-lead 301 and the second sub-lead 302 are connected by the connection structure 6, which reduces the length of the single-sided lead on the substrate substrate 110, thereby reducing the wiring area of the peripheral region 111. Further, the area of the peripheral region 111 is reduced.

In the lower substrate provided in this embodiment, the lead is divided into two parts of the first lead and the second lead, and a part of the lead is disposed on the front surface of the substrate and the other part of the lead is disposed on the back surface of the substrate, which is reduced. The length of the single-sided lead on the lower substrate is reduced, so that the wiring area of the peripheral area is reduced, so that the liquid crystal display panel realizes a narrow bezel structure. At the same time, the technical solution of the embodiment effectively improves the utilization ratio of the substrate.

In the present invention, the lower substrate may be an array substrate, and the upper substrate may be a color film substrate. Since the color film layer can be formed on the array substrate, the lower substrate can also be an array substrate having a color film layer, and the upper substrate is a substrate substrate having no color film layer.

Embodiment 2

FIG. 8 is a flowchart of a method for manufacturing a lower substrate according to Embodiment 2 of the present invention. As shown in Figure 8, the method includes: Step SI: Form an array pattern on the substrate of the village, and the array pattern is located in the display area.

In this embodiment, the array pattern may include: a gate line and a data line, the gate line and the data line define a pixel unit, and the pixel unit includes a thin film transistor and a pixel electrode electrically connected to the thin film transistor.

Step S2: forming a lead on the substrate of the village, the lead is located in the peripheral area, and the lead includes a first sub-lead and a second sub-lead, and the peripheral area is located at the periphery of the display area.

In this embodiment, the step S2 may specifically include: Step S21: forming a first sub-lead on the front surface of the substrate substrate; Step S22: forming a second sub-lead on the back surface of the substrate. Alternatively, the order of execution of step S21 and step S22 may be reversed.

Alternatively, step S1 and step S2 may also be performed simultaneously, and a lead pattern may be formed in a peripheral region of the lower substrate while forming an array pattern on the display area of the lower substrate.

Step S3: connecting the first sub-lead and the second sub-lead through a connection structure.

In this embodiment, optionally, connecting the first sub-lead and the second sub-lead through the connection structure comprises: connecting the connection structure to the first sub-lead and the second sub-lead respectively by a chip lamination process. Specifically, after the card process is completed, a chip lamination process is performed to connect the connection structure to the first sub-lead and the second sub-lead, respectively.

In this embodiment, optionally, the connection structure is a second flexible circuit board.

The method for manufacturing the lower substrate provided in this embodiment can be used to manufacture the lower substrate provided in the first embodiment. For the detailed description of the structure of the lower substrate, refer to the first embodiment.

The method for manufacturing the lower substrate provided by the embodiment, the lead is formed on the substrate of the village, the lead is located in the peripheral area, the lead includes a first sub-lead and a second sub-lead, and the peripheral area is located at the periphery of the display area; The first sub-lead and the second sub-lead are connected. In this embodiment, the lead is divided into the first sub-lead and the second sub-lead, which reduces the length of the single-sided lead on the lower substrate, thereby reducing the wiring area of the peripheral area, so that the liquid crystal display panel realizes a narrow bezel structure, and at the same time The technical solution of the embodiment also effectively improves the utilization rate of the substrate of the village.

Embodiment 3

A third embodiment of the present invention provides a liquid crystal display panel, comprising: an upper substrate and a lower substrate, wherein the upper substrate and the lower substrate are oppositely disposed. The lower substrate is the lower substrate provided in the first embodiment. For details, refer to the description in the first embodiment, and details are not described herein again.

In the liquid crystal display panel provided in this embodiment, a display area and a peripheral area around the periphery of the display area are formed on the substrate, and a lead is formed in the peripheral area, and the lead includes a first sub-lead and a second sub-lead, and the first sub-lead is located The front side of the substrate, the second sub-lead is located on the back of the substrate of the village. The first sub-lead and the second sub-lead are connected by a connection structure. The invention reduces the length of the single-sided lead on the lower substrate, thereby reducing the wiring area of the peripheral area, so that the liquid crystal display panel realizes the narrow frame structure, and the technical solution of the embodiment also effectively improves the substrate of the village substrate. Utilization rate.

Embodiment 4

9 is a schematic plan view of a liquid crystal display according to Embodiment 4 of the present invention, and FIG. 10 is a cross-sectional view taken along line C-C of FIG. 9. As shown in FIG. 9 and FIG. 10, the liquid crystal display comprises: a liquid crystal display panel. The liquid crystal display panel includes: an upper substrate 2 and a lower substrate 1, and the upper substrate 2 and the lower substrate 1 are oppositely disposed. The lower substrate 1 includes: a substrate substrate 110 on which a display region and a peripheral region located around the periphery of the display region are formed, and lead wires are formed in the peripheral region, and the lead wires include a first sub-lead 301 and a second sub-lead 302. One sub-lead 301 is located on the front surface of the substrate substrate, the second sub-lead 302 is located on the back surface of the substrate, and the first sub-lead 301 and the second sub-lead 302 are connected by the connection structure 6.

Further, the liquid crystal display may further include a driving circuit board 5, which may be a printed circuit board. The drive circuit board is connected to the leads through the first flexible circuit board 4. For example, one end of the first sub-lead 301 is connected to one end of the connection structure 6, the other end of the first sub-lead 301 is connected to the gate line and/or the data line in the display area, and one end of the second sub-lead 302 is connected to the connection structure 6. The other end of the second sub-lead 302 is connected to one end of the first flexible circuit board 4, and the other end of the first flexible circuit board 4 is connected to the driving circuit board 5.

In this embodiment, the connection structure 6 is a second flexible circuit board. When the first sub-lead 301 and the second sub-lead 302 are connected through the second flexible circuit board, the first sub-lead can be processed by a chip lamination process. 301. The second sub-leads 302 are respectively connected to the second flexible circuit board.

In this embodiment, optionally, the village substrate includes a glass substrate or a flexible material substrate. When the base substrate is a glass substrate, the lower substrate is usually used in a conventional TFT-LCD. When the substrate of the village is a flexible material substrate, the lower substrate can be used in a flexible display.

In the liquid crystal display of the embodiment, a display area and a peripheral area around the periphery of the display area are formed on the substrate, and a lead is formed in the peripheral area, and the lead includes a first sub-lead and a second sub-lead, and the first sub-lead Located on the front side of the substrate of the village, the second sub-lead is located on the back side of the substrate of the village, and the first sub-lead and the second sub-lead are connected by a connection structure. The invention reduces the length of the single-sided lead on the lower substrate, thereby reducing the wiring area of the peripheral area, so that the liquid crystal display panel realizes the narrow frame structure, and the technical solution of the embodiment also effectively improves the substrate of the village substrate. Utilization rate.

The liquid crystal display panel of the present invention can be applied to a compact television (Compact TV) or wisdom In the TV (Smart TV).

11 is a schematic diagram of a liquid crystal display panel using a prior art as a splicing screen. As shown in FIG. 11, when a liquid crystal display panel of the prior art is used as a splicing screen, a seam 7 is generated between two adjacent liquid crystal display panels, and The seam 7 is wider, especially when viewing the image of the splicing screen at a close distance, because the seam is wider, the overall visual effect of the splicing screen is not good. 12 is a schematic view showing a splicing screen using the liquid crystal display panel of the present invention. As shown in FIG. 12, when the liquid crystal display panel of the present invention is used as a splicing screen, a seam 7 is generated between adjacent liquid crystal display panels, but the seam is formed. 7 is narrower, and the overall visual effect is very good when looking at the image of the splicing screen at close range or long distance.

The above embodiments are merely illustrative of the disclosure, and are not intended to limit the scope of the disclosure, and various changes and modifications may be made without departing from the spirit and scope of the disclosure. The equivalent technical solutions are also within the scope of the disclosure, and the scope of the patent protection of the disclosure should be defined by the claims.

Claims

claims

1. A lower substrate, including: a bottom substrate, a display area and a peripheral area located around the display area formed on the bottom substrate, and leads formed in the peripheral area, characterized in that, the leads It includes a first sub-lead and a second sub-lead, the first sub-lead is located on the front side of the base substrate, the second sub-lead is located on the back side of the base substrate, the first sub-lead and the The second sub-lead is connected through the connecting structure.

2. The lower substrate according to claim 1, wherein the second sub-lead is connected to the drive circuit board through the first flexible circuit board.

3. The lower substrate according to claim 1, wherein the connection structure is a second flexible circuit board.

4. The lower substrate according to claim 1, wherein the lower substrate includes a glass substrate or a flexible material substrate.

5. A method for manufacturing a lower substrate, characterized in that it includes:

An array pattern is formed on the base substrate, and the array pattern is located in the display area;

Leads are formed on the base substrate, the leads are located in a peripheral area, the leads include first sub-leads and second sub-leads, the peripheral area is located around the periphery of the display area; and

The first sub-lead and the second sub-lead are connected through a connection structure.

6. The manufacturing method of the lower substrate according to claim 5, wherein the forming leads on the lower substrate includes:

Forming a first sub-lead on the front side of the base substrate; and

A second sub-lead is formed on the back side of the base substrate.

7. The manufacturing method of the lower substrate according to claim 5, wherein the connecting the first sub-lead and the second sub-lead through a connection structure includes: connecting the connection through a chip coating process. The structure is respectively connected to the first sub-lead and the second sub-lead.

8. The manufacturing method of the lower substrate according to any one of claims 5 to 7, wherein the connection structure is a second flexible circuit board.

9. A liquid crystal display panel, comprising: an upper substrate and any lower substrate according to claims 1 to 4, the upper substrate and the lower substrate being arranged oppositely.

10. A liquid crystal display, comprising: the liquid crystal display panel according to claim 9.