TW202206904A - Display apparatus - Google Patents
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Abstract
Description
本發明是有關於一種光電裝置,且特別是有關於一種顯示裝置。The present invention relates to an optoelectronic device, and more particularly, to a display device.
隨著顯示科技的發達,人們對顯示裝置的需求,不再滿足於高解析度、高對比等光學特性,人們還期待顯示裝置具有優雅的外觀。舉例而言,人們期待顯示裝置具有超窄邊框。With the development of display technology, people's demands for display devices are no longer satisfied with optical properties such as high resolution and high contrast, and people also expect display devices to have elegant appearance. For example, display devices are expected to have ultra-narrow bezels.
為使顯示裝置的邊框更窄,可使用側邊接合(side bonding)實現具有超窄邊框的顯示裝置。一般而言,在具有超窄邊框之顯示裝置的製程中,首先,會先研磨顯示面板的側壁,以露出訊號線的側壁;然後,在顯示面板的側壁上,形成銀膠;最後,令一連接元件與銀膠接合,以使連接元件與訊號線電性連接。然而,訊號線之側壁的面積過小,不利於顯示裝置的電性及/或信賴性。In order to make the bezel of the display device narrower, a display device with an ultra-narrow bezel may be implemented using side bonding. Generally speaking, in the manufacturing process of a display device with an ultra-narrow bezel, firstly, the sidewall of the display panel is ground to expose the sidewall of the signal line; then, silver paste is formed on the sidewall of the display panel; finally, a The connecting element is joined with the silver glue, so that the connecting element and the signal line are electrically connected. However, the area of the side wall of the signal line is too small, which is not conducive to the electrical performance and/or reliability of the display device.
本發明提供一種顯示裝置,具有超窄邊框且性能佳。The present invention provides a display device with ultra-narrow frame and good performance.
本發明的顯示裝置,包括第一基底、多個畫素結構、訊號線、第二基底、顯示介質、導電材料及連接元件。第一基底具有第一斜向側壁。多個畫素結構設置於第一基底上。訊號線設置於第一基底上,且電性連接至多個畫素結構。訊號線之端部的側壁與第一基板的第一斜向側壁實質上切齊。第二基底設置於第一基底的對向,且具有第二斜向側壁。顯示介質設置於第一基底與第二基底之間。導電材料設置於第一斜向側壁及第二斜向側壁上,且電性連接至訊號線的端部。連接元件透過導電材料電性連接至訊號線的端部。第一基底更具有背向顯示介質的非顯示面。第二基底更具有背向顯示介質的顯示面。第一基底的第一斜向側壁與第二基底的第二斜向側壁位於同一參考斜面。同一參考斜面相對於第一基底的非顯示面及第二基底的顯示面傾斜。同一參考斜面與第一基底的非顯示面於第一基底的材質內夾有一鈍角。The display device of the present invention includes a first substrate, a plurality of pixel structures, signal lines, a second substrate, a display medium, a conductive material and a connecting element. The first substrate has first inclined sidewalls. A plurality of pixel structures are disposed on the first substrate. The signal lines are arranged on the first substrate and are electrically connected to the plurality of pixel structures. The sidewalls of the end portions of the signal lines are substantially aligned with the first inclined sidewalls of the first substrate. The second base is disposed opposite to the first base and has a second inclined sidewall. The display medium is disposed between the first substrate and the second substrate. The conductive material is disposed on the first oblique sidewall and the second oblique sidewall, and is electrically connected to the end of the signal line. The connecting element is electrically connected to the end of the signal line through the conductive material. The first substrate further has a non-display surface facing away from the display medium. The second substrate further has a display surface facing away from the display medium. The first oblique sidewall of the first substrate and the second oblique sidewall of the second substrate are located on the same reference slope. The same reference slope is inclined with respect to the non-display surface of the first substrate and the display surface of the second substrate. The same reference slope and the non-display surface of the first base form an obtuse angle in the material of the first base.
現將詳細地參考本發明的示範性實施例,示範性實施例的實例說明於附圖中。只要有可能,相同元件符號在圖式和描述中用來表示相同或相似部分。Reference will now be made in detail to the exemplary embodiments of the present invention, examples of which are illustrated in the accompanying drawings. Wherever possible, the same reference numerals are used in the drawings and description to refer to the same or like parts.
應當理解,當諸如層、膜、區域或基板的元件被稱為在另一元件“上”或“連接到”另一元件時,其可以直接在另一元件上或與另一元件連接,或者中間元件可以也存在。相反,當元件被稱為“直接在另一元件上”或“直接連接到”另一元件時,不存在中間元件。如本文所使用的,“連接”可以指物理及/或電性連接。再者,“電性連接”或“耦合”可以是二元件間存在其它元件。It will be understood that when an element such as a layer, film, region or substrate is referred to as being "on" or "connected to" another element, it can be directly on or connected to the other element, or Intermediate elements may also be present. In contrast, when an element is referred to as being "directly on" or "directly connected to" another element, there are no intervening elements present. As used herein, "connected" may refer to a physical and/or electrical connection. Furthermore, "electrically connected" or "coupled" may refer to the existence of other elements between the two elements.
本文使用的“約”、“近似”、或“實質上”包括所述值和在本領域普通技術人員確定的特定值的可接受的偏差範圍內的平均值,考慮到所討論的測量和與測量相關的誤差的特定數量(即,測量系統的限制)。例如,“約”可以表示在所述值的一個或多個標準偏差內,或±30%、±20%、±10%、±5%內。再者,本文使用的“約”、“近似”或“實質上”可依光學性質、蝕刻性質或其它性質,來選擇較可接受的偏差範圍或標準偏差,而可不用一個標準偏差適用全部性質。As used herein, "about," "approximately," or "substantially" includes the stated value and the average within an acceptable deviation from the particular value as determined by one of ordinary skill in the art, given the measurement in question and the A specific amount of measurement-related error (ie, the limitations of the measurement system). For example, "about" can mean within one or more standard deviations of the stated value, or within ±30%, ±20%, ±10%, ±5%. Furthermore, as used herein, "about", "approximately" or "substantially" may be used to select a more acceptable range of deviation or standard deviation depending on optical properties, etching properties or other properties, and not one standard deviation may apply to all properties. .
除非另有定義,本文使用的所有術語(包括技術和科學術語)具有與本發明所屬領域的普通技術人員通常理解的相同的含義。將進一步理解的是,諸如在通常使用的字典中定義的那些術語應當被解釋為具有與它們在相關技術和本發明的上下文中的含義一致的含義,並且將不被解釋為理想化的或過度正式的意義,除非本文中明確地這樣定義。Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. It will be further understood that terms such as those defined in commonly used dictionaries should be construed as having meanings consistent with their meanings in the context of the related art and the present invention, and are not to be construed as idealized or excessive Formal meaning, unless expressly defined as such herein.
圖1為本發明一實施例之顯示裝置10的立體示意圖。FIG. 1 is a schematic perspective view of a
圖2為本發明一實施例之顯示裝置10的剖面示意圖。FIG. 2 is a schematic cross-sectional view of the
圖3為本發明一實施例之顯示裝置10之畫素陣列基板100的上視示意圖。FIG. 3 is a schematic top view of the
圖1示意性地繪出畫素陣列基板100的第一基底110及訊號線120,而省略畫素陣列基板100的其它構件。此外,圖1還省略框膠400及側邊封膠700的繪示。FIG. 1 schematically illustrates the
圖2示意性地繪出畫素陣列基板100的第一基底110及訊號線120,而省略畫素陣列基板100的其它構件。FIG. 2 schematically illustrates the
請參照圖1及圖2,顯示裝置10包括畫素陣列基板100、對向基板200及顯示介質300。畫素陣列基板100包括第一基底110。對向基板200包括第二基底210。第二基底210設置於第一基底110的對向。顯示介質300設置於第一基底110與第二基底210之間。在本實施例中,顯示裝置10更包括框膠400,設置於第一基底110與第二基底210之間,其中顯示介質300設置於第一基底110、第二基底210及框膠400圍出的空間S內。Referring to FIG. 1 and FIG. 2 , the
舉例而言,在本實施例中,顯示介質300例如是液晶。然而,本發明不限於此,在其它實施例中,顯示介質300也可以是有機電致發光圖案、微型發光二極體(μLED)或其它適當材料。在本實施例中,第一基底110的材質可以是玻璃、石英、有機聚合物、或是不透光/反射材料(例如:晶圓、陶瓷等)、或是其它可適用的材料;第二基底210的材質可以是玻璃、石英、有機聚合物、或是其它可適用的材料;但本發明不以此為限。For example, in this embodiment, the
請參照圖1及圖2,第一基底110具有背向顯示介質300的一非顯示面112,且第二基底210具有背向顯示介質300的一顯示面212。第二基底210的顯示面212面向顯示裝置100的觀看者。第一基底110的一非顯示面112背向顯示裝置100的觀看者。舉例而言,在本實施例中,顯示裝置100可以選擇性地包括背光模組(未繪示),第一基底110的一非顯示面112可以面向背光模組的表面,第二基底210的顯示面212可以是背向背光模組的表面。Referring to FIGS. 1 and 2 , the
請參照圖1、圖2及圖3,畫素陣列基板100更包括多個畫素結構SPX,設置於第一基底110上。在本實施例中,每一畫素結構SPX可包括薄膜電晶體(未繪示)及電性連接至薄膜電晶體的畫素電極(未繪示),其中薄膜電晶體具有源極、汲極、閘極和半導體圖案,源極與汲極分別電性連接至半導體圖案的不同兩區,且畫素電極電性連接至汲極。Referring to FIGS. 1 , 2 and 3 , the
畫素陣列基板100更包括訊號線120,電性連接至多個畫素結構SPX。舉例而言,在本實施例中,訊號線120可包括資料線DL、第一閘極線HG、第二閘極線VG及共用線CL;多條資料線DL在第一方向d1上排列,每一畫素結構SPX之薄膜電晶體的源極電性連接至對應的一資料線DL;多條第一閘極線HG(也可稱水平閘極線)在第二方向d2上排列,第二方向d2與第一方向d1交錯,每一畫素結構SPX之薄膜電晶體的閘極電性連接至對應的一第一閘極線HG;多條第二閘極線VG(也可稱垂直閘極線)在第一方向d1上排列且穿插於多個畫素結構SPX之間,多條第二閘極線VG電性連接至多條第一閘極線HG;共用線CL與畫素結構SPX的畫素電極部分重疊,以形成儲存電容。然而,本發明不限於此,在其它實施例中,畫素陣列基板100的訊號線120 也可不包括第二閘極線VG。The
在本實施例中,訊號線120之材質的選用以具有高延展性的導電材料為佳。舉例而言,在本實施例中,訊號線120之材質可以是金屬。然而,本發明不限於此,在其他實施例中,訊號線120的材質也可以是其它材料,例如但不限於:合金、金屬材料的氮化物、金屬材料的氧化物、金屬材料的氮氧化物、或是金屬材料與其它導電材料的堆疊層。In this embodiment, the material of the
請參照圖1及圖2,值得注意的是,畫素陣列基板100之第一基底110具有第一斜向側壁114,對向基板200之第二基底210具有第二斜向側壁214,訊號線120之端部122的側壁122s與第一基板110的第一斜向側壁114實質上會在一斜向方向d3上切齊。Please refer to FIG. 1 and FIG. 2 , it is worth noting that the
具體而言,在本實施例中,於顯示裝置10的製造過程中,會對畫素陣列基板100及對向基板200同時進行一斜向研磨工序,以露出訊號線120的側壁122s。因此,第一基底110的第一斜向側壁114、訊號線120的側壁122s及第二基底210的第二斜向側壁214實質上會在一斜向方向d3上切齊。換言之,第一基底110的第一斜向側壁114、訊號線120的側壁122s及第二基底210的第二斜向側壁214實質上位於同一參考斜面R上,其中參考斜面R相對於第一基底110的非顯示面112及第二基底210的顯示面212傾斜。Specifically, in the present embodiment, during the manufacturing process of the
值得一提的是,從微觀的角度來看,訊號線120的側壁122s也是一斜向側壁,且具有較大的面積。具有較大面積的側壁122s有助於增加訊號線120與導電材料500的接觸面積,進而能提升顯示裝置10的電性及/或信賴性。It is worth mentioning that, from a microscopic point of view, the
第一基底110之第一斜向側壁114及第二基底210之第二斜向側壁214所在的參考斜面R與第一基底110的非顯示面112於第一基底110的材質內夾有鈍角α。參考斜面R與第二基底210的顯示面212於第二基底210的材質內夾有銳角β。換言之,顯示裝置10具有一斜向側壁10s,斜向側壁10s包括第一基底110的第一斜向側壁114、訊號線120的側壁122s及第二基底210的第二斜向側壁214,而顯示裝置10的斜向側壁10s是朝向遠離觀看者的方向d4。舉例而言,在本實施例中,95o
<α<110o
;70o
<β<85o
,但本發明不以此為限。The reference slope R on which the first
請參照圖2,顯示裝置10更包括導電材料500,設置於第一基底110的第一斜向側壁114及第二基底210的第二斜向側壁214上,且電性連接至訊號線120的端部122。舉例而言,在本實施例中,導電材料500可以是利用印刷方式形成於顯示裝置10之斜向側壁10s上的銀膠,但本發明不以此為限。Referring to FIG. 2 , the
請參照圖2,顯示裝置10更包括一連接元件600,透過導電材料500電性連接至訊號線120的端部122。舉例而言,在本實施例中,連接元件600可以是覆晶軟板(Chip On Film;COF),但本發明不以此為限。在其它實施例中,連接元件600也可以是其它電子元件,例如但不限於:柔性印刷電路板(flexible printed circuit,FPC)。Referring to FIG. 2 , the
參考斜面R與第一基底110的非顯示面112於第一基底110的材質內夾有鈍角α;也就是說,畫素陣列基板100的側壁100s包括第一基底110的第一斜向側壁114及訊號線120之端部122的側壁122s,且畫素陣列基板100的側壁100s與畫素陣列基板100的下表面(即第一基底110的非顯示面112)夾有一鈍角α。設置於第一斜向側壁114及第二斜向側壁214上的連接元件600彎折至非顯示面112下方時,連接元件600不易被畫素陣列基板100的鈍角α所傷。The reference slope R and the
在本實施例中,顯示裝置10更包括側邊封膠700,設置於連接元件600上。在本實施例中,側邊封膠700具有高光學密度值,而具有遮光作用。側邊封膠700的至少一部分與第二基底210的第二斜向側壁214重疊。側邊封膠700的至少一部分與第一基底110的第一斜向側壁114重疊。也就是說,對於位於顯示裝置10前方的觀看者而言,側邊封膠700的至少一部分會藏在顯示裝置10之斜向側壁10s的後方。In this embodiment, the
在此必須說明的是,下述實施例沿用前述實施例的元件標號與部分內容,其中採用相同的標號來表示相同或近似的元件,並且省略了相同技術內容的說明。關於省略部分的說明可參考前述實施例,下述實施例不再重述。It must be noted here that the following embodiments use the element numbers and part of the contents of the previous embodiments, wherein the same numbers are used to represent the same or similar elements, and the description of the same technical contents is omitted. For the description of the omitted part, reference may be made to the foregoing embodiments, and the following embodiments will not be repeated.
圖4為本發明一實施例之顯示裝置10A的剖面示意圖。圖4的顯示裝置10A與圖2的顯示裝置10類似,以下說明圖4之顯示裝置10A與圖2之顯示裝置10的差異,兩者相同或相似處便不再重述。FIG. 4 is a schematic cross-sectional view of a
請參照圖4,在本實施例中,顯示裝置10A更包括墊高結構H,設置於訊號線120的端部122上,且位於訊號線120之端部122與第二基底210之間。墊高結構H設置第一基底110與第二基底210之間,且位於框膠400的外圍,以阻擋導電材料500滲入畫素陣列基板100與對向基板200之間。Referring to FIG. 4 , in this embodiment, the
值得注意的是,在本實施例中,墊高結構H具有一第三斜向側壁Hs,且第一斜向側壁114、第二斜向側壁214及第三斜向側壁Hs位於同一參考斜面R上。也就是說,在顯示裝置10A的斜向研磨工序中,墊高結構H也會被研磨到,而第一基底110的第一斜向側壁114、第二基底210的第二斜向側壁214及墊高結構H的第三斜向側壁Hs實質上會在一斜向方向d3上切齊。It is worth noting that, in this embodiment, the pad structure H has a third inclined sidewall Hs, and the first
舉例而言,在本實施例中,墊高結構H可包括彩色濾光圖案130;墊高結構H的第三斜向側壁Hs可包括彩色濾光圖案130的一側壁134。墊高結構H可更包括絕緣層140,設置於彩色濾光圖案130上;墊高結構Hs的第三斜向側壁Hs更包括絕緣層140的一側壁144。墊高結構H可更包括光阻圖案150,設置於絕緣層140上;墊高結構H的第三斜向側壁Hs可更包括光阻圖案150的一側壁154。For example, in this embodiment, the raised structure H may include a
簡言之,在本實施例中,墊高結構H可由依序堆疊的彩色濾光圖案130、絕緣層140及光阻圖案150所組成,墊高結構H的第三斜向側壁Hs可包括在斜向方向d3上切齊之彩色濾光圖案130的側壁134、絕緣層140的側壁144及光阻圖案150的側壁154。然而,本發明不以此為限,在其它實施例中,墊高結構H也可以由其它構件堆疊而成。In short, in this embodiment, the pad structure H can be composed of the
圖5為本發明一實施例之顯示裝置10B的剖面示意圖。圖5的顯示裝置10B與圖2的顯示裝置10類似,以下說明圖5之顯示裝置10B與圖2之顯示裝置10的差異,兩者相同或相似處便不再重述。FIG. 5 is a schematic cross-sectional view of a
請參照圖5,在本實施例中,框膠400具有第四斜向側壁404,且第一基板110的第一斜向側壁114、第二基板210的第二斜向側壁214及框膠400的第四斜向側壁404位於同一參考斜面R上。具體而言,在本實施例中,在前述斜向研磨的製程中,部分的框膠400也會被研磨到,而第一基板110的第一斜向側壁114、第二基板210的第二斜向側壁214及框膠400的第四斜向側壁404實質上會在斜向方向d3上切齊。Referring to FIG. 5 , in this embodiment, the
圖6為本發明一實施例之拼接顯示裝置1的立體示意圖。圖6示意性地繪出各顯示裝置10之畫素陣列基板100的第一基底110及訊號線120,而省略各顯示裝置10之畫素陣列基板100的其它構件。此外,圖6還省略各顯示裝置10之框膠400及側邊封膠700的繪示。FIG. 6 is a three-dimensional schematic diagram of a
請參照圖6,本實施例之拼接顯示裝置1可由前述之圖2的多個顯示裝置10、前述之圖4的多個顯示裝置10A或前述之圖5的多個顯示裝置10B拼接而成。Referring to FIG. 6 , the
1:拼接顯示裝置
10、10A、10B:顯示裝置
10s:斜向側壁
100:畫素陣列基板
100s:側壁
110:第一基底
112:非顯示面
114:第一斜向側壁
120:訊號線
122:端部
122s:側壁
130:彩色濾光圖案
134:側壁
140:絕緣層
144:側壁
150:光阻圖案
154:側壁
200:對向基板
210:第二基底
212:顯示面
214:第二斜向側壁
300:顯示介質
400:框膠
404:第四斜向側壁
500:導電材料
600:連接元件
700:側邊封膠
CL:共用線
DL:資料線
d1:第一方向
d2:第二方向
d3:斜向方向
d4:方向
H:墊高結構
HG:第一閘極線
Hs:第三斜向側壁
VG:第二閘極線
R:參考斜面
S:空間
SPX:畫素結構
α:鈍角
β:銳角1:
圖1為本發明一實施例之顯示裝置10的立體示意圖。
圖2為本發明一實施例之顯示裝置10的剖面示意圖。
圖3為本發明一實施例之顯示裝置10之畫素陣列基板100的上視示意圖。
圖4為本發明一實施例之顯示裝置10A的剖面示意圖。
圖5為本發明一實施例之顯示裝置10B的剖面示意圖。
圖6為本發明一實施例之拼接顯示裝置1的立體示意圖。FIG. 1 is a schematic perspective view of a
10:顯示裝置10: Display device
100:畫素陣列基板100: pixel array substrate
110:第一基底110: The first base
120:訊號線120: Signal line
122:端部122: End
200:對向基板200: Opposite substrate
210:第二基底210: Second base
300:顯示介質300: Display medium
500:導電材料500: Conductive material
600:連接元件600: Connection element
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US63/065,641 | 2020-08-14 |
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TW110108336A TWI758124B (en) | 2020-08-14 | 2021-03-09 | Flat display device and manufacturing method of flat display device |
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TW110112830A TWI761171B (en) | 2020-08-14 | 2021-04-09 | Panel device and manufacturing method of panel device |
TW110123670A TWI775506B (en) | 2020-08-14 | 2021-06-29 | Display device and manufacturing method thereof |
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