WO2019119804A1 - Substrate frame return device, substrate frame return method and fully automatic coating machine - Google Patents

Substrate frame return device, substrate frame return method and fully automatic coating machine Download PDF

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Publication number
WO2019119804A1
WO2019119804A1 PCT/CN2018/096865 CN2018096865W WO2019119804A1 WO 2019119804 A1 WO2019119804 A1 WO 2019119804A1 CN 2018096865 W CN2018096865 W CN 2018096865W WO 2019119804 A1 WO2019119804 A1 WO 2019119804A1
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WO
WIPO (PCT)
Prior art keywords
substrate
substrate holder
lifting
returning
transfer
Prior art date
Application number
PCT/CN2018/096865
Other languages
French (fr)
Chinese (zh)
Inventor
施栓林
Original Assignee
北京铂阳顶荣光伏科技有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from CN201711394591.5A external-priority patent/CN107841726B/en
Priority claimed from CN201711397058.4A external-priority patent/CN108147128A/en
Application filed by 北京铂阳顶荣光伏科技有限公司 filed Critical 北京铂阳顶荣光伏科技有限公司
Priority to JP2018552075A priority Critical patent/JP2020507534A/en
Publication of WO2019119804A1 publication Critical patent/WO2019119804A1/en

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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65GTRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34Sputtering
    • C23C14/35Sputtering by application of a magnetic field, e.g. magnetron sputtering
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks

Definitions

  • the present disclosure relates to the field of coating, and in particular to a substrate carrier returning device, a substrate carrier returning method, and a fully automatic coating machine.
  • the production type magnetron sputtering deposition equipment used in the photovoltaic industry is mainly divided into two types: a horizontal magnetron sputtering coating machine and a vertical magnetron sputtering coating machine.
  • the main one is horizontal, and its main advantage is that the overall film uniformity is good.
  • the target slag phenomenon is inevitable, and the edge of the glass film layer is prone to sparking, which seriously affects the film formation quality.
  • an additional substrate holder is required to shield the edge of the glass.
  • a backhaul system needs to be added to realize automatic control.
  • the substrate backplane system cannot be externally mounted.
  • the ability to achieve automation has become a problem.
  • the present disclosure provides a substrate back transfer device and a substrate back transfer method, and a fully automatic coating machine, which can realize the back transfer function of the substrate holder, realize automatic production, and can effectively utilize the bottom space of the existing coating machine to reduce the land occupation.
  • the area is effective to solve the transformation problem of the coating equipment that has been put into production.
  • Some embodiments of the present disclosure provide a substrate holder returning device including a substrate holder conveying device and a substrate holder lifting and returning device; wherein the substrate holder conveying device is disposed at a bottom of the coating device, and the coating device The inlet end and the outlet end of the coating device are respectively provided with one of the substrate rack lifting and returning devices.
  • a substrate holder lifting and returning device at the inlet end of the coating apparatus is configured to receive the substrate holder transported back by the substrate holder transport device and configured to transport the substrate holder to a conveyor belt in the coating apparatus.
  • a substrate holder lifting and returning device at the exit end of the coating apparatus is configured to receive the substrate holder conveyed by the conveyor belt and configured to convey the substrate holder to the substrate holder conveying device.
  • the substrate holder transport device is a belt conveyor or a conveyor belt.
  • the substrate holder transport device includes a first return body and a support leg, the support legs being fixedly disposed at a bottom of the first return body.
  • the first return body is configured to drive the substrate carrier transported by the conveyor belt to move toward the inlet end of the conveyor belt.
  • the substrate rack lifting and returning device comprises a second returning body and a lifting device; the lifting device is arranged at the bottom of the second returning body. a second returning body in the substrate rack lifting and returning device at the outlet end of the coating device, configured to drive the substrate rack conveyed by the conveyor belt to move to the inlet end of the substrate rack conveying device; and the substrate rack lifting and returning device at the inlet end of the coating device
  • the second return body is configured to drive the substrate holder transported back by the substrate holder transport device to move to the inlet end of the conveyor belt.
  • the first return body is identical in structure to the second return body, and each includes a frame, a plurality of transfer wheels for transporting the substrate holder, a plurality of rotating shafts, and a drive motor.
  • a mounting groove is respectively disposed on two sides of the frame body, and the transfer wheel is disposed in each of the two mounting slots.
  • the transfer wheel in one of the mounting slots is coupled to the transfer wheel in the other of the mounting slots by the rotating shaft; any two adjacent rotating shafts are coupled by a belt and a pulley.
  • the drive motor is fixedly mounted on the frame, and an output shaft of the drive electrode is coupled to one of the rotating shafts.
  • the transfer wheel is a sheave.
  • the substrate holder returning device further comprises a substrate holder; the bottom of the substrate holder is provided with two flat-shaped guiding rods, and the two guiding rods respectively cooperate with the groove wheels in the two mounting grooves.
  • the lifting device is one of a hydraulic cylinder, a cylinder, and an electric push-pull rod.
  • Some embodiments of the present disclosure provide a substrate rack returning method applied to the substrate rack returning device, comprising: a substrate rack lifting and returning device at an inlet end of the coating device lifting the substrate rack and transmitting the substrate to the conveyor belt
  • the conveyor belt transports the substrate holder from the inlet end of the coating device to the outlet end of the coating device, and transfers the substrate holder to the substrate holder lifting and returning device at the outlet end of the coating device and in an ascending state.
  • the substrate rack lifting and returning device at the outlet end of the coating device is lowered with the substrate holder, and the substrate holder is transferred to the substrate holder conveying device.
  • the substrate rack transfer device returns the substrate rack from the bottom of the coating device to the substrate rack lifting and returning device at the inlet end of the coating device and is in a descending state, and completes a return process of the loop back substrate carrier.
  • the substrate holder lifting and returning device at the inlet end of the coating device is lowered to a third preset position; and the third predetermined position is a substrate carrier The position is flush.
  • the substrate holder lifting and returning device at the outlet end of the coating device rises to a fourth preset position during the substrate carrier returning; the fourth predetermined position is flush with the conveyor belt. s position.
  • Some embodiments of the present disclosure provide a fully automatic coating machine including a top sheeting device, a returning device, and a lower sheeting device.
  • the coating apparatus comprises a plurality of conveyor belts arranged in parallel, and a first gap is formed between two adjacent conveyor belts, each of which runs through the coating apparatus, and both ends of each conveyor belt extend into the upper and lower apparatus, respectively.
  • the back-transmission device is disposed under the coating device, and the back-transmission device is the substrate carrier return device described above.
  • the two ends of the backhaul device are respectively located in the upper device and the lower device.
  • the upper sheet device is connected to the inlet end of the coating device, configured to transfer and place the glass substrate on the substrate holder at the inlet end of the conveyor belt;
  • the lower sheet device is connected to the outlet end of the coating device, and is configured to be a glass on the substrate holder at the outlet end of the conveyor belt The substrate is transferred and sent to the next station.
  • the wafer loading apparatus includes a first substrate transfer belt, a first substrate lift mechanism, a first substrate transfer mechanism, a first substrate lift mechanism, and a first travel track.
  • the first substrate conveyor is configured to feed the glass substrate into the wafer apparatus.
  • the first substrate transfer mechanism is slidably disposed on the first traveling track.
  • the first substrate transfer mechanism has a first preset position and a second preset position on the first traveling track, the first preset position is directly above the first substrate conveyor, and the second preset position is first The substrate lifting mechanism is opposite.
  • the first substrate lift mechanism moves up and down relative to the substrate transfer belt in a direction perpendicular to the first substrate transfer belt.
  • the first substrate lifting mechanism is configured to lift the glass substrate on the first substrate transfer belt when jacking, to drop the glass substrate during landing, and to place the first substrate transfer mechanism that slides to the first predetermined position on.
  • the first substrate transfer mechanism is configured to elongate movement upon sliding to the second predetermined position to transfer the glass substrate directly above the conveyor belt.
  • the first substrate lifting mechanism is disposed below the inlet end of the conveyor belt.
  • the first substrate lift mechanism is configured to jack up the glass substrate on the first substrate transfer mechanism when it is raised, to drop the glass substrate upon landing and to place it on the substrate holder on the conveyor.
  • the lower sheet apparatus includes a second substrate transfer belt, a second substrate lift mechanism, a second substrate transfer mechanism, a second substrate lift mechanism, and a second travel track.
  • the second substrate transfer mechanism is slidably disposed on the second traveling track.
  • the second substrate transfer mechanism has a fifth preset position and a sixth preset position on the second traveling track, the fifth preset position is directly above the second substrate conveyor, the sixth preset The position is opposite to the second substrate jacking mechanism.
  • the second substrate transfer mechanism is configured to elongate movement upon sliding to the sixth predetermined position.
  • the second substrate lifting mechanism is disposed below the outlet end of the conveyor.
  • the second substrate lifting mechanism is configured to lift the glass substrate on the substrate holder on the conveyor belt when jacking up, to drop the glass substrate when landing, and to place the second elongated when sliding to the sixth predetermined position The substrate transfer mechanism.
  • the second substrate lift mechanism moves up and down relative to the second substrate transfer belt in a direction perpendicular to the second substrate transfer belt.
  • the second substrate lifting mechanism is configured to lift the glass substrate on the second substrate transfer mechanism that slides to the fifth predetermined position when jacking, to drop the glass substrate during landing and to place on the second substrate conveyor on.
  • the second substrate transfer belt is configured to feed the glass substrate out of the lower sheet device and feed it to the next station.
  • the first substrate lift mechanism and the second substrate lift mechanism each include a first lift fork and a lift cylinder.
  • the first lift fork includes a plurality of first plungers, a first plunger connecting rod, and a lift cylinder connecting rod.
  • the plurality of first plungers are fixed in parallel to the first plunger connecting rod, and the first plunger connecting rod is fixedly connected to the telescopic end of the lifting cylinder through the lifting cylinder connecting rod .
  • the first substrate conveyor belt is plural and arranged at equal intervals in parallel with each other, and the first plunger of the first substrate lifting mechanism is configured to pass through the second between the adjacent two first substrate conveyor belts during lifting. Gap.
  • the second substrate conveyor belt is plural and arranged at equal intervals in parallel with each other, and the first plunger of the second substrate lifting mechanism is configured to pass the second between the adjacent two second substrate conveyor belts during lifting Gap.
  • the first substrate transfer mechanism and the second substrate transfer mechanism each include a second lift fork, a telescopic cylinder, a slider, and a carriage.
  • the slider of the first substrate transfer mechanism is slidably disposed on the first traveling rail.
  • the carriage of the second substrate transfer mechanism is slidably disposed on the second traveling rail.
  • the slider is slidably disposed on the slider.
  • the telescopic cylinder is fixed to the slider.
  • the second lifting fork includes a plurality of second plungers and a second plunger connecting rod; the plurality of second plungers are equally spaced on the second plunger connecting rod; the second plunger connecting rod is fixed to the telescopic cylinder The telescopic end.
  • the first travel track and the second travel track each include an upper rail, a middle rail, and a lower rail.
  • the slide of the first substrate transfer mechanism is slidably coupled to the upper rail, the middle rail and the lower rail of the first traveling rail.
  • the carriage of the second substrate transfer mechanism is slidably coupled to the upper rail, the middle rail and the lower rail of the second traveling rail.
  • the first substrate transfer mechanism and the second substrate transfer mechanism each further include a first servo motor and a first rack.
  • the first rack is fixedly mounted on the middle rail; the first servo motor is fixed on the slider, and the first servo motor is connected to the first gear that meshes with the first rack.
  • one side of the carriage has two second rails arranged in parallel in a vertical direction; the slider is slidably mounted on the carriage by a second rail.
  • the first substrate transfer mechanism and the second substrate transfer mechanism each further include a second servo motor and a second rack.
  • the second rack is disposed on the carriage and disposed in parallel with the second rail.
  • the second servo motor is fixed to the slider, and the second servo motor is coupled to the second gear that meshes with the second rack.
  • the first substrate jacking mechanism and the second substrate jacking mechanism each include a base and a plurality of liftable lifting jacks, the jacking cylinder being secured to the base.
  • Each jacking cylinder is configured to pass a first gap between two adjacent conveyor belts when telescopic and through a gap between two adjacent second poles.
  • a substrate carrier back-transfer device provided by some embodiments of the present disclosure, automatic return of the substrate holder during the sputter coating process is achieved. Since the space for installing the bottom of the coating device is fully utilized, the substrate carrier conveying device with a large footprint is disposed under the coating device, thereby solving the problem that the coating device that has been put into production cannot add the substrate carrier returning system in a limited plant space. The problem.
  • the utility model has the advantages of simple structure and small occupied area, and the substrate holder can be reused, and one set is used, one set is used, and the other set is spared, and the substrate frame buffer room is not required to be disposed at the inlet and the back end of the coating device, thereby greatly reducing The cost.
  • the automatic loading, the automatic lowering, and the automatic backing of the substrate holder can be realized by the cooperation of the substrate backing device and the upper device and the lower device.
  • the function enables the coating equipment to achieve a high degree of automation control, eliminating the need for manual operation throughout the entire process, greatly improving production efficiency.
  • the returning device is disposed at the bottom of the coating device, the existing space can be effectively utilized, and the floor space is saved, which is not only suitable for the arrangement of the new device, but also suitable for the transformation of the old device.
  • FIG. 1 is a perspective view of an overall structure of a substrate carrier returning device according to some embodiments of the present disclosure
  • FIG. 2 is a perspective view of a substrate rack transport device according to some embodiments of the present disclosure
  • FIG. 3 is a perspective view of a first returning body provided by some embodiments of the present disclosure.
  • FIG. 4 is a perspective view of a substrate rack lifting and returning device according to some embodiments of the present disclosure
  • FIG. 5 is a perspective view of a second returning body provided by some embodiments of the present disclosure.
  • FIG. 6 is a perspective view of a substrate holder according to some embodiments of the present disclosure.
  • FIG. 7 is a schematic flow chart of a method for returning a substrate rack according to some embodiments of the present disclosure
  • FIG. 8 is a perspective view of an overall structure of a fully automatic coating machine according to some embodiments of the present disclosure.
  • FIG. 9 is a structural isometric view of a top sheet device according to some embodiments of the present disclosure.
  • FIG. 10 is a structural isometric view of a lower sheet device according to some embodiments of the present disclosure.
  • FIG. 11 is a perspective view of a first substrate lifting mechanism and a second substrate lifting mechanism according to some embodiments of the present disclosure
  • FIG. 12 is a perspective view of a first substrate transfer mechanism and a second substrate transfer mechanism according to some embodiments of the present disclosure
  • FIG. 13 is a structural isometric view of a first gear and a first rack engaged by some embodiments of the present disclosure
  • FIG. 14 is a structural isometric view of a second gear and a second rack engaged by some embodiments of the present disclosure
  • FIG. 15 is a perspective view of a first substrate jacking mechanism and a second substrate jacking mechanism provided by some embodiments of the present disclosure.
  • a substrate holder is added by providing a buffer chamber at the inlet end and the outlet end of the horizontal magnetron sputtering coater and a returning system disposed on the side of the horizontal magnetron sputtering coater.
  • a buffer chamber at the inlet end and the outlet end of the horizontal magnetron sputtering coater and a returning system disposed on the side of the horizontal magnetron sputtering coater.
  • Embodiments of the present disclosure provide a substrate holder returning device, as shown in FIG. 1, including a substrate holder transfer device 1 and a substrate holder lifting and returning device 2.
  • the substrate rack transfer device 1 is disposed at the bottom of the coating device 3, and a substrate holder lifting and returning device 2 is disposed at each end of the coating device 3.
  • a substrate rack lifting and lowering device 2 is disposed at the inlet end X1 of the coating device (the corresponding substrate rack lifting and lowering device 2 is also located at the outlet end X4 of the substrate holder conveying device 1), and another substrate holder lifting and returning device 2 is disposed at The outlet end X2 of the coating device 3 (the corresponding substrate holder lifting and returning device 2 is also located at the inlet end X3 of the substrate holder conveying device 1).
  • the substrate holder lifting and returning device 2 at the inlet end X1 of the coating apparatus is configured to receive the substrate holder 15 transported back by the substrate holder conveying device 1, and is configured to convey the substrate holder 15 to the conveyor belt 4 in the coating apparatus 3.
  • the substrate rack lifting and lowering device 2 at the exit end X2 of the coating device is configured to receive the substrate holder 15 conveyed by the conveyor belt 4, and is configured to convey the substrate holder 15 to the substrate holder conveying device 1.
  • some embodiments of the present disclosure provide a substrate carrier back-transfer device for transporting the substrate holder 15 as a carrier for the glass substrate for coating.
  • the substrate carrier returning device operates in such a manner that the substrate holder lifting and returning device 2 at the inlet end X1 of the coating device rises with the substrate holder 15.
  • the substrate rack lifting and lowering device 2 is raised to be in contact with the conveyor belt 4 of the coating device 3 (in some embodiments, the substrate rack lifting and lowering device 2 is raised to be flush with the conveyor belt 4 of the coating device 3)
  • the substrate is stopped, and the substrate is stopped.
  • the rack lifting and lowering device 2 starts to transport the substrate holder 15 and transports the substrate holder 15 to the conveyor belt 4 of the coating device 3.
  • the glass substrate is placed on the substrate holder 15, and the substrate holder 15 is guided by the conveyor belt 4 into the coating device 3 to coat the glass substrate.
  • the substrate holder lifting and returning device 2 at the inlet end X1 of the coating device is lowered and connected to the substrate holder conveying device 1 (in some embodiments, the substrate holder is moved back and forth)
  • the device 2 is lowered to be flush with the substrate holder transfer device 1).
  • the substrate holder 15 carries the glass substrate from the exit end X2 of the coating device, and is transferred to the substrate holder lifting and returning device 2 at the outlet end X2 of the coating device (at this time, the outlet end of the coating device X2)
  • the substrate rack lifting and lowering device 2 is in a rising state, flush with the conveyor belt 4).
  • the substrate holder lifting and returning device 2 at the exit end X2 of the coating device is lowered with the substrate holder 15.
  • the substrate rack 15 is transferred to the substrate rack transporting device 1.
  • the substrate holder conveying device 1 transports the substrate holder 15 to the substrate holder lifting and returning device 2 at the inlet end X1 of the coating device (at this time, the substrate holder lifting and returning device 2 at the inlet end X1 of the coating device is in a descending state, and the substrate holder The conveyor 1 is flush) to complete a duty cycle.
  • the substrate holder lifting/returning device 2 at the exit end X2 of the coating device rises, waiting for the substrate holder 15 for the next working cycle to be picked up.
  • Embodiments of the present disclosure provide a substrate holder returning device that realizes automatic return of the substrate holder 15 during sputter coating. Since the embodiment of the present disclosure makes full use of the space for installing the bottom of the coating device 3, the substrate carrier conveying device 1 having a large footprint is disposed under the coating device 3, thereby solving the problem that the coating device that has been put into production cannot be in a limited plant space.
  • the problem of adding the substrate rack return transmission system has the advantages of simple structure and small footprint, and the substrate holder 15 can be reused, one for use, one set for use, and the other for standby, without the need for the coating device 3
  • the inlet and outlet ends are provided with a substrate holder 15 buffer chamber, thereby greatly reducing the cost.
  • the substrate rack transfer device 1 has various structures.
  • the substrate carrier transfer device 1 employs a belt conveyor.
  • the substrate carrier transfer device 1 employs a conveyor belt.
  • the substrate carrier transfer device 1 employs a device having a transfer function.
  • the substrate carrier transfer device 1 includes a first return body 100 and a support leg 6 that is fixedly disposed at the bottom of the first return body 100.
  • the support legs 6 are foldable support legs. When the substrate holder conveying device 1 is not used, the support legs 6 can be folded, the occupied space of the substrate holder conveying device 1 can be reduced, and the transportation can be facilitated; when the substrate holder conveying device 1 needs to be repaired during production and use, The support legs 6 can be folded to reduce the occupied space of the substrate rack transporting device 1 and facilitate the maintenance of the staff.
  • the first returning body 100 is configured to drive the substrate holder 15 transported by the conveyor belt 4 to move toward the inlet end 401 of the conveyor belt to effect the return of the substrate holder 15 from the coating device outlet end X2 to the coating device inlet. End X1. It can be understood that the inlet end 401 of the conveyor belt, that is, the inlet end X1 of the coating device.
  • the first return body 100 includes a frame body 9, a plurality of transfer wheels 10, a plurality of rotating shafts 11, and a drive motor 12.
  • a mounting groove 13 is respectively disposed on two sides of the frame body 9, and a transfer wheel 10 is disposed in each of the two mounting slots 13.
  • Each of the transfer wheels 10 in one of the mounting slots 13 is connected to a transfer wheel 10 in the other mounting groove 13 via a rotating shaft 11 (in some embodiments, the rotating shaft 11 is arranged along the width direction W of the frame 9)
  • the two adjacent rotating shafts 11 are interlocked by the belt 14 and the pulley 300.
  • the drive motor 12 is fixedly mounted on the frame body 9, and the output shaft of the drive electrode 12 is coupled to one of the rotary shafts 11.
  • any two adjacent rotating shafts 11 are interlocked by the belt 14 and the pulley 300, and are realized in the following manner: except for one end of each of the rotating shafts 11 of the two sides of the rotating shaft 11 Each of the remaining shafts 11 is provided with two pulleys 300 at one end thereof, and any two adjacent pulleys 300 are connected by a belt 14.
  • a tensioning pulley 5 is disposed between the two rotating shafts 11, and the position of the tensioning pulley 5 is adjustable to adjust the tightness of the belt 14, and the belt 14 connecting the adjacent two rotating shafts 11 can be prevented. Slip.
  • the substrate rack lifting and lowering device 2 includes a second returning body 200 and a lifting device 8; the lifting device 8 is disposed at the bottom of the second returning body 200.
  • the second return main body 200 of the substrate rack lifting and lowering device 2 located at the exit end X2 of the coating device is configured to move the substrate holder 15 transported by the conveyor 4 to the inlet end X3 of the substrate rack transfer device 1.
  • the second return body 200 in the substrate rack lifting and lowering device 2 at the inlet end X1 of the coating device is configured to drive the substrate holder 15 transported back by the substrate carrier transfer device 1 to move to the inlet end 401 of the conveyor.
  • the lifting device 8 employs a hydraulic cylinder. In other embodiments, the lifting device 8 employs a cylinder. In still other embodiments, the lifting device 8 employs an electric push-pull rod. Of course, the specific structure of the lifting device 8 is not limited to the illustrated structure.
  • the second backhaul body 200 is identical in structure to the first backhaul body 100.
  • the second return main body 200 also includes a frame body 9, a plurality of transfer wheels 10, a plurality of rotating shafts 11, and a drive motor 12.
  • a mounting groove 13 is respectively disposed on two sides of the frame body 9, and a transfer wheel 10 is disposed in each of the two mounting slots 13.
  • Each of the transfer wheels 10 in one of the mounting slots 13 is connected to a transfer wheel 10 in the other mounting slot 13 via a rotating shaft 11, and any two adjacent rotating shafts 11 are coupled by a belt 14 and a pulley 300.
  • the drive motor 12 is fixedly mounted on the frame body 9, and the output shaft of the drive motor 12 is coupled to one of the rotating shafts 11.
  • one pulley 300 is provided, and one end of each of the rotating shafts 11 is provided with two pulleys 300, any two adjacent to each other.
  • the pulleys 300 are each connected by a belt 14.
  • a tensioning pulley 5 is disposed between the two rotating shafts 11, and the position of the tensioning pulley 5 is adjustable to adjust the tightness of the belt 14, and the belt 14 connecting the adjacent two rotating shafts 11 can be prevented. Slip.
  • the driving motor 12 drives one of the rotating shafts 11 to rotate. Since any two adjacent rotating shafts 11 are connected by the belt 14, all the rotating shafts 11 rotate in the same direction, and at the same time, the conveying wheel 10 thereon is rotated, so that the conveying wheel 10 moves with the substrate holder 15 to realize The transfer of the substrate holder 15.
  • the transfer wheel 10 employs a sheave. Based on this, as shown in FIG. 6, since the substrate holder returning device is used to transport the substrate holder 15, in some embodiments, the substrate holder returning device further includes a substrate holder 15, the bottom of the substrate holder 15. There are two guide rods 16 arranged in a flat shape. Referring to FIG.
  • the two guide rods 16 are respectively engaged with the sheaves in the two mounting slots 13, that is, the two guide rods 16 are placed in the slots of the sheaves in the two mounting slots 13, so that the substrate holder During the transfer process, the guide rod 16 at the bottom of the substrate holder 15 moves along the groove on the transfer wheel 10, effectively preventing the deviation, and the contact area between the two is increased, the friction is increased, and the friction can be prevented. The role of slipping.
  • Some embodiments of the present disclosure provide a substrate carrier return method applied to the substrate carrier return device, as shown in FIG. 7 , including:
  • the substrate holder lifting and returning device 2 at the inlet end X1 of the coating device lifts the substrate holder 15 and transports it to the conveyor belt 4, and the conveyor belt 4 transports the substrate holder 15 from the inlet end X1 of the coating device 3 to the outlet end X2 of the coating device. And transporting the substrate holder 15 to the substrate holder lifting and returning device 2 at the outlet end X2 of the coating apparatus and in an ascending state.
  • the substrate rack lifting and lowering device 2 at the exit end X2 of the coating device is lowered with the substrate holder 15, and the substrate holder 15 is transferred to the substrate holder conveying device 1.
  • the substrate holder conveying device 1 returns the substrate holder 15 from the bottom of the coating device 3 to the substrate holder lifting and returning device 2 at the inlet end X1 of the coating device and in a descending state, and completes a loopback of the substrate holder 15 Pass the process.
  • a substrate carrier return method applied to the substrate carrier return device includes:
  • the substrate rack lifting and lowering device 2 at the inlet end X1 of the coating device lifts the substrate holder 15 and transports it to the conveyor belt 4.
  • the conveyor belt 4 transports the substrate holder 15 from the coating device inlet end X1 to the coating device outlet end X2. And transporting the substrate holder 15 to the substrate rack lifting and lowering device 2 at the outlet end X2 of the coating device and rising to the fourth preset position; in the process of conveying the substrate holder 15 by the conveyor belt 4, at the inlet end X1 of the coating device
  • the substrate holder lifting and returning device 2 is lowered to a third preset position.
  • step S10 the substrate holder 15 is lifted by the substrate holder lifting/returning device 2 at the inlet end X2 of the coating device, that is, the process in which the substrate holder 15 is raised.
  • the conveyor belt 4 transports the substrate holder 15 from the coating device inlet end X1 to the coating device outlet end X2, and transfers the substrate holder 15 to the substrate holder lifting and returning device 2 at the outlet end X2 of the coating device and is in a rising state, that is, It is a process in which the substrate holder 15 is transported.
  • the third predetermined position refers to a position that is flush with the substrate holder transport device 1.
  • the fourth predetermined position refers to a position that is flush with the conveyor belt 4.
  • the substrate rack lifting and lowering device 2 at the exit end X2 of the coating device is lowered with the substrate holder 15, and the substrate holder 15 is transferred to the substrate holder conveying device 1.
  • the substrate holder conveying device 1 returns the substrate holder 15 from the bottom of the coating device 3 to the substrate holder lifting and returning device 2 at the inlet end X1 of the coating device and at a third preset position, to complete a working cycle; During the process of returning the frame 15, the substrate holder lifting and returning device 2 at the outlet end X2 of the coating device rises to a fourth predetermined position.
  • Some embodiments of the present disclosure provide a fully automatic coater, as shown in FIG. 8, including a coating apparatus 3, a sheeting apparatus 7, a returning device 17, and a lowering apparatus 18.
  • the coating device 3 comprises a plurality of conveyor belts 4 arranged in parallel at equal intervals and extending through the entire coating device 3, a first slit 400 is formed between two adjacent belts 4 (as shown in Figures 9 and 10), and each conveyor belt 4 Both ends extend into the upper sheet device 7 and the lower sheet device 18, respectively.
  • the return device 17 is disposed below the coating device 3, and the return device 17 is the substrate carrier return device described above, and both ends of the return device 17 are located in the upper device 7 and the lower device 18, respectively.
  • the two ends of the backhaul device 17 are respectively located in the upper device 7 and the lower device 18, that is, the substrate rack lifting and transmitting device 2 on both sides of the return device 17 are respectively located in the upper device 7 and the lower device.
  • the substrate rack lifting and transmitting device 2 on both sides of the return device 17 are respectively located in the upper device 7 and the lower device.
  • the top sheet device 7 is coupled to the coating device inlet end X1 and is configured to transfer and place the glass substrate 500 on the substrate holder 15 at the inlet end of the conveyor belt 4.
  • the lower sheet device 18 is coupled to the coating device outlet end X1 and configured to transfer the glass substrate 500 on the substrate holder 15 at the outlet end of the conveyor belt 4 and feed it to the next station.
  • the top sheet device 7 and the lower sheet device 18 are further provided with a spare substrate holder storage area configured to store the spare substrate holder 15. That is to use a set of substrate holders 15 to prevent accidents and ensure the normal operation of the equipment at all times.
  • the top sheet device 7 is identical in structure to the lower sheet device 18 and symmetrically disposed relative to the coating device 3, thereby saving floor space.
  • the wafer loading apparatus 7 includes a first substrate transfer belt I-19, a first substrate lifting mechanism I-20, a first substrate transfer mechanism I-21, and a first base.
  • the sheet lifting mechanism 22 is provided.
  • the first substrate transfer belt I-19 is perpendicular to the returning device 17, i.e., the length direction (or conveying direction) of the first substrate conveying belt I-19 is perpendicular to the returning device 17, and the first substrate conveying belt I-19 is close to The substrate holder lifting and returning device 2 is disposed.
  • the first substrate transfer belt I-19 is configured to feed the glass substrate into the top sheet device 7.
  • the fully automatic coater further includes a first travel track I-23 disposed in parallel with the return device 17, and the first substrate transfer mechanism I-21 is slidably mounted on the first travel track I-23.
  • the first substrate transfer mechanism I-21 has a first preset position Y1 and a second preset position Y2 on the first traveling track I-23, and the first preset position Y1 is located on the first substrate transfer belt I-19.
  • the second preset position Y2 is opposite to the first substrate jacking mechanism I-22.
  • the first substrate transfer mechanism I-21 is configured to elongate while sliding to the second preset position Y2 to transfer the glass substrate directly above the conveyor belt 4.
  • the first substrate lifting mechanism I-20 is disposed between the first substrate transfer belt I-19 and the substrate holder lifting and returning device 2.
  • the first substrate lifting mechanism I-20 moves up and down in a direction perpendicular to the first substrate conveying belt I-19 with respect to the first substrate conveying belt I-19.
  • the first substrate lift mechanism I-20 is configured to lift the glass substrate 500 on the first substrate transfer belt I-19 when jacked up, drop the glass substrate 500 when landing, and place it on the first preset The first substrate transfer mechanism I-21 at the Y1 position.
  • the first substrate jacking mechanism I-22 is disposed below the inlet end of the conveyor belt 4 of the coating device 3 (ie, the first substrate jacking mechanism I-22 is disposed at the inlet end of the conveyor belt 4 below the substrate rack lifting and returning device 2) ).
  • the first substrate jacking mechanism I-22 is configured to jack up the glass substrate 500 on the first substrate transfer mechanism I-21 when jacking up, drop the glass substrate 500 at the time of landing, and place it on the conveyor belt 4.
  • the first substrate transfer belt I-19 in the top sheet device 7 feeds the glass substrate 500 into the top sheet device 7, and the first substrate lift mechanism I-20 first performs a lifting motion to the glass.
  • the substrate 500 is lifted off from the first substrate transfer belt I-19, and then subjected to a falling motion to place the glass substrate 500 on the first substrate transfer mechanism I-21 at the first preset position Y1.
  • the first substrate transfer mechanism I-21 slides to the second preset position Y2, and transfers the glass substrate 500 directly above the conveyor belt 4.
  • the first substrate lifting mechanism I-22 first performs the jacking motion.
  • the glass substrate 500 on a substrate transfer mechanism I-21 is then subjected to a falling motion to place the glass substrate 500 on the substrate holder 15 on the conveyor belt 4.
  • the lower sheet device 18 includes a second substrate transfer belt II-19, a second substrate lift mechanism II-20, a second substrate transfer mechanism II-21, and a second base.
  • the second substrate transfer mechanism II-21 is slidably disposed on the second traveling track II-23; the second substrate transfer mechanism II-21 has a fifth preset position Y5 and the second on the second traveling track II-23 Six preset positions Y6, the fifth preset position Y5 is located directly above the second substrate conveyor belt II-19, and the sixth preset position Y6 is opposite to the second substrate jacking mechanism II-22.
  • the second substrate transfer mechanism II-21 is configured to elongate motion when sliding to the sixth preset position Y6.
  • the second substrate lifting mechanism II-22 is disposed below the outlet end of the conveyor belt 4.
  • the second substrate jacking mechanism II-22 is configured to lift the glass substrate 500 on the substrate holder 15 on the conveyor belt 4 when jacking up, to drop the glass substrate 500 during landing and to slide it to the sixth preset At the position Y6, the second substrate transfer mechanism II-21 is elongated.
  • the second substrate lifting mechanism II-20 moves in a direction perpendicular to the second substrate conveying belt II-19 with respect to the second substrate conveying belt II-19; the second substrate lifting mechanism II-20 is configured to be lifted at the time of jacking
  • the glass substrate 500 on the second substrate transfer mechanism II-21 slid to the fifth preset position Y5 is dropped onto the glass substrate 500 and placed on the second substrate transfer belt II-19.
  • the second substrate transfer belt II-19 is configured to feed the glass substrate 500 out of the lower sheet device 18 and to the next station.
  • the second substrate jacking mechanism II-22 in the lower sheet device 18 performs the jacking motion to lift the glass substrate on the substrate holder 15, and the second substrate transfer mechanism II-21 located at the sixth preset position Y6 catches The glass substrate 500 directly above the conveyor belt 4 is slid to the fifth predetermined position Y5 to transport the glass substrate 500 directly above the second substrate conveyor belt II-19.
  • the second substrate lifting mechanism II-20 first performs the jacking motion lifting to pick up the glass substrate 500 directly above the second substrate conveyor belt II-19, and then performs a falling motion to place it on the second substrate conveyor belt II- At 19, the second substrate transfer belt II-19 feeds the glass substrate 500 out of the lower sheet device 18 and feeds it to the next station.
  • the fully automatic coating machine can automatically complete the upper, lower and coating work of the glass substrate, realize full automatic control, and the whole process does not require manual operation.
  • the first substrate lifting mechanism I-20 and the second substrate lifting mechanism II-20 each include a first lifting fork 50 and a lifting cylinder 40
  • the first The lift fork 50 includes a plurality of first plungers 25, a first plunger connecting rod 26, and a lift cylinder connecting rod 27.
  • the plurality of first plungers 25 are fixed in parallel at equal intervals to the first plunger connecting rod 26, and the first plunger connecting rod 26 is fixedly coupled to the telescopic end 41 of the lift cylinder 40 via the lift cylinder connecting rod 27.
  • the first substrate transfer belts I-19 are plural, and are arranged in parallel with each other at equal intervals (that is, a second slit 191 is formed between any adjacent two first substrate transfer belts I-19, first
  • the first plunger 25 of the substrate lifting mechanism I-20 is disposed opposite to the second slit 191 between the first substrate conveying belts I-19, so that the first plunger 25 can be lifted and lowered through the adjacent first substrate.
  • the second slit 191 between the conveyor belts I-19 that is, the width of the first plunger 25 is smaller than the second slit 191 between the first substrate conveyors I-19.
  • the second substrate conveyor belt II -19 are plural and arranged in parallel with each other at equal intervals (ie, a second slit 191 is formed between any two adjacent second substrate conveyor belts II-19), and the first of the second substrate lifting mechanism II-20
  • the second slit 191 between the plunger 25 and the second substrate transfer belt II-19 is disposed opposite to each other, and the first plunger 25 can be lifted and lowered through the second gap between the adjacent second substrate conveyors II-19.
  • 191 that is, the width of the first plunger 25 is smaller than the second slit 191 between the second substrate conveyors II-19.
  • the first substrate lifting mechanism I-20 realizes that the glass substrate 500 is removed from the first substrate transfer belt I-19 and placed on the first substrate transfer mechanism I- 21 on.
  • the second substrate lifting mechanism II-20 realizes that the glass substrate 500 is removed from the second substrate transfer mechanism II-2 and placed on the second substrate transfer belt II-19. .
  • the first substrate transfer mechanism I-21 and the second substrate transfer mechanism II-21 each include a second lift fork 60, a telescopic cylinder 28, a slider 29, and a carriage. 30.
  • the carriage 30 of the first substrate transfer mechanism I-21 is slidably disposed on the first traveling rail I-23; the carriage 30 of the second substrate transfer mechanism II-21 is slidably disposed on the second traveling rail II -23.
  • the slider 29 is slidably disposed on the carriage 30.
  • the telescopic cylinder 28 is fixed to the slider 29.
  • the second lift fork 60 includes a plurality of second plungers 36 and a second plunger connecting rod 37; the plurality of second plungers 36 are equally spaced on the second plunger connecting rod 37; the second plunger connecting rods 37 It is fixed to the telescopic end 281 of the telescopic cylinder 28.
  • the second lift fork 60 is fixed to the slider 29 by a telescopic cylinder 28.
  • the second lift fork 60 is telescopically moved by the telescopic cylinder 28.
  • the first substrate transfer mechanism I-21 realizes sliding on the first traveling rail I-23, and when sliding to the second preset position Y2, the glass is extended by the stretching motion.
  • the substrate 500 is transferred directly above the conveyor belt 4.
  • the second substrate transfer mechanism II-21 realizes an elongation movement when sliding to the sixth preset position Y6, thereby picking up the glass substrate 500 directly above the conveyor belt 4 and sliding it to the fifth pre- With the position Y5, the glass substrate 500 is transported directly above the second substrate transfer belt II-19.
  • the first travel track I-23 and the second travel track II-23 each include an upper rail 231, a middle rail 232, and a lower rail 233 that are disposed in parallel.
  • the carriage 30 of the first substrate transfer mechanism I-21 is slidably coupled to the upper rail 231, the middle rail 232, and the lower rail 233 of the first traveling rail I-23.
  • the carriage 30 of the second substrate transfer mechanism II-21 is slidably coupled to the upper rail 231, the middle rail 232, and the lower rail 233 of the second traveling rail II-23.
  • the middle rail 232 and the lower rail 233 are slidably connected to ensure smooth sliding of the slider 30.
  • the first substrate transfer mechanism I-21 and the second substrate transfer mechanism II-21 each further include a first servo motor 31 and a first rack 33.
  • the first rack 33 is fixedly mounted on the middle rail 232.
  • the first servo motor 31 is fixed to the slider 29, and the first servo motor 31 is connected with a first gear 71 (shown in Fig. 13) that meshes with the first rack 33.
  • the first servo motor 31 can follow the slider 29
  • the middle rail 232 slides in the extending direction, but does not exert a large force on the slider 29 to avoid deforming the slider 29.
  • one side of the carriage 30 has two second slide rails 34 arranged in parallel in the vertical direction, and the slider 29 is slidably mounted on the carriage by the second slide rail 34. 30 on. Based on this, when the slider 29 slides on the carriage 30 along the second slide rail 34, the second lift fork 60 can be moved up and down.
  • the first substrate transfer mechanism I-21 and the second substrate transfer mechanism II-21 each further include a second servo motor 32 and a second rack 35.
  • the second rack 35 is disposed on the carriage 30 and disposed in parallel with the second rail 34; the second servo motor 32 is fixed on the slider 29, and the second servo motor 32 is coupled to the second rack 35.
  • the second gear 72 (shown in Figure 14). Based on this, the second servo motor 32 can be slid in the vertical direction following the slider 29, but does not exert a large force on the slider 29 to avoid deformation of the slider 29.
  • the first substrate jacking mechanism I-22 and the second substrate jacking mechanism II-22 each include a base 38 and a plurality of telescopically movable jacks 39.
  • the jacking cylinders 39 are fixed to the base 38, and each jacking cylinder 39 is configured to pass through the first gap 400 between the adjacent two conveyor belts 4 when telescopic, and between the adjacent two second plungers 36 gap.
  • the number of jacking cylinders 39 is at least three.
  • the jacking cylinder 39 extends through the gap between the first slot 400 and the second plunger 36 between the conveyor belts 4 to effect the width of the telescoping end of the jacking glass substrate, i.e., the jacking cylinder 39. It is smaller than the first slit 400 between the adjacent two conveyor belts 4 and smaller than the gap between the adjacent two second plungers 36.
  • the first substrate lifting mechanism I-22 removes the glass substrate 500 from the second lifting fork 60 on the first substrate transfer mechanism I-21, and places it.
  • the second substrate lift mechanism II-22 implements a second lift fork that removes the glass substrate 500 from the substrate holder 15 and places it on the second substrate transfer mechanism II-21. 60 on.
  • the working principle of the automatic coating machine will be described below based on a fully automatic coating machine including the upper sheet device 7, the returning device 17, and the lower sheet device 18.
  • the upper sheet process is: the substrate holder 15 is transferred to the substrate holder lifting and returning device 2 at the inlet end X1 of the coating device through the substrate holder conveying device 1, and the lifting device 8 of the substrate holder lifting and returning device 2 is extended and the second time is The main body 200 is raised.
  • the lifting device 8 stops elongating.
  • the drive motor 12 on the second return main body 200 starts to operate, and the transfer wheel 10 drives the substrate holder 15 to move, and the substrate holder 15 is sent to the conveyor belt 4.
  • the conveyor belt 4 is stopped, waiting for the glass substrate 500 to be placed.
  • the lifting device 8 is contracted and lowered with the second return main body 200 to be in contact with the substrate holder conveying device 1.
  • the glass substrate 500 is carried into the upper sheet device 7 through the first substrate transfer belt I-19, and reaches the first of the first substrate lifting mechanism I-20 at the glass substrate 500.
  • the first substrate transfer belt I-19 is stopped after the lift fork 50 is positioned directly above.
  • the lift cylinder 40 of the first substrate lifting mechanism I-20 is elongated, and the glass substrate 500 is lifted up during the rise of the first lift fork 50 under the first substrate transfer belt I-19, and rises above
  • the position of the height of the second lift fork 60 of the first substrate transfer mechanism I-21 stops rising.
  • the first substrate transfer mechanism I-21 moves along the first traveling track I-23 to the first preset position Y1 under the driving action of the first servo motor 31, and at this time, the first substrate transfer mechanism I-21
  • the two lift forks 60 are located just below the glass substrate 500.
  • the glass substrate 500 is placed on the second lift fork 60 by contraction of the lift cylinder 40 of the first substrate lifting mechanism I-20.
  • the first lift fork 50 is driven by the contraction of the lift cylinder 40 until it is under the first substrate transfer belt I-19 to wait for the next glass substrate 500.
  • the first substrate transfer mechanism I-21 is moved to the second preset position Y2 (position opposite to the substrate holder 15) by the driving of the first servo motor 31, and then the telescopic cylinder 28 is elongated to send the glass substrate 500.
  • the jacking cylinder 39 of the first substrate jacking mechanism I-22 located below the conveyor belt 4 extends through the substrate holder 15 and lifts up the glass substrate 500 to separate the glass substrate 500 from the second lift 60 fork. Thereafter, the telescopic cylinder 28 is contracted and returned to the initial position, the jacking cylinder 39 is contracted and lowered with the glass substrate 500, and the glass substrate 500 is dropped on the substrate holder 15.
  • the conveyor belt 4 carries the substrate holder 15 and the glass substrate 500 together into the coating apparatus 3 to perform a coating process. After the coating process is completed, it enters the lower sheet device 18.
  • the unloading process is: when the substrate holder 15 moves together with the film-coated glass substrate 500 to the outlet end of the conveyor belt 4, the conveyor belt 4 stops running, and the top substrate of the second substrate lifting mechanism II-22 in the lower sheet device 18 39 elongates and lifts the film-coated glass substrate 500.
  • the second lift fork 60 of the second substrate transfer mechanism II-21 moves under the elongation of the telescopic cylinder 28 directly below the film-coated glass substrate 500, and the lift cylinder 39 contracts to coat the filmed glass.
  • the substrate 500 is placed on the second lift fork 60.
  • the telescopic cylinder 28 of the second substrate transfer mechanism II-21 is contracted to return the second lift fork 60 to the original position, and the glass-coated glass substrate 500 is driven to the second by the driving of the first servo motor 31.
  • the substrate transfer belt II-19 i.e., the fifth preset position Y5
  • the first lift fork 50 on the second substrate lift mechanism II-20 rises and picks up the film-coated glass substrate 500.
  • the second substrate transfer mechanism II-21 is operated to a position opposite to the empty substrate holder 15 (ie, the sixth preset position Y6), waiting for the next piece of the film-coated glass substrate 500, the first lifting fork
  • the 50 drops and the film-coated glass substrate 500 is placed on the second substrate transfer belt II-19.
  • the second substrate transfer belt II-19 feeds the film-coated glass substrate to the next station.
  • the conveyor belt 4 feeds the empty substrate holder 15 to the substrate holder lifting and returning device 2 at the exit end X2 of the coating apparatus in the returning device 17.
  • the lifting device 8 of the substrate rack lifting and lowering device 2 is contracted, and the substrate rack lifting and lowering device 2 is lowered to be in contact with the substrate holder conveying device 1, and the empty substrate holder 15 is transferred to the substrate holder conveying device 1 after docking. At this point, complete a complete workflow.

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Abstract

A substrate frame return device and a substrate frame return method, as well as a fully automatic coating machine using the substrate frame return device. The substrate frame return device comprises a substrate frame conveying device (1) and substrate frame lifting and returning devices (2), wherein the substrate frame conveying device (1) is disposed at the bottom of coating devices (3), two ends of the substrate frame conveying device are respectively provided with one substrate frame lifting and returning device (2), and the substrate frame conveying device (1) is connected to a conveyor belt (4) on the coating devices when the substrate frame lifting and returning devices (2) are lifted. The substrate frame return method comprises four steps of substrate frame lifting, substrate frame conveying, substrate frame lowering and substrate frame returning. The substrate frame return device may implement the return function of the substrate frame, implement automatic coating, and may effectively use existing space, thereby solving the problem of modifying coating devices that are already in production.

Description

基板架回传装置及基板架回传方法、全自动镀膜机Substrate frame return device and substrate frame return method, automatic coating machine
本申请要求于2017年12月21日提交中国专利局、申请号为201711397058.4、申请名称为“基板架回传装置及基板架回传方法”,申请号为201711394591.5、申请名称为“全自动镀膜机”的中国专利申请的优先权,其全部内容通过引用结合在本申请中。This application is required to be submitted to the China Patent Office on December 21, 2017, the application number is 201711397058.4, the application name is “substrate rack return device and substrate frame return method”, the application number is 201711394591.5, and the application name is “automatic coating machine”. The priority of the Chinese Patent Application, the entire contents of which is incorporated herein by reference.
技术领域Technical field
本公开涉及镀膜领域,具体涉及一种基板架回传装置及基板架回传方法、全自动镀膜机。The present disclosure relates to the field of coating, and in particular to a substrate carrier returning device, a substrate carrier returning method, and a fully automatic coating machine.
背景技术Background technique
在光伏行业里所用生产型磁控溅射沉积设备主要分为卧式磁控溅射镀膜机和立式磁控溅射镀膜机两种。其中主要以卧式为主,其主要优点是整体膜层均匀性好。The production type magnetron sputtering deposition equipment used in the photovoltaic industry is mainly divided into two types: a horizontal magnetron sputtering coating machine and a vertical magnetron sputtering coating machine. Among them, the main one is horizontal, and its main advantage is that the overall film uniformity is good.
在溅射镀膜制程过程中,靶材掉渣现象不可避免,玻璃膜层边缘容易出现打火现象,严重影响成膜质量。为避免打火现象的发生,需要附加基板架对玻璃边缘进行遮挡。而添加基板架的同时需要加设回传系统以实现自动化控制,但因厂区空间有限,无法外设基板架回传系统。此外能否实现自动化也成了难题。During the sputtering coating process, the target slag phenomenon is inevitable, and the edge of the glass film layer is prone to sparking, which seriously affects the film formation quality. In order to avoid the occurrence of sparking, an additional substrate holder is required to shield the edge of the glass. When the substrate holder is added, a backhaul system needs to be added to realize automatic control. However, due to limited space in the factory, the substrate backplane system cannot be externally mounted. In addition, the ability to achieve automation has become a problem.
发明内容Summary of the invention
本公开提供一种基板架回传装置及基板架回传方法、全自动镀膜机,能够实现基板架的回传功能,实现自动化生产,且可以有效利用现有镀膜机的底部空间,减少占地面积,有效解决已投产镀膜设备的改造问题。The present disclosure provides a substrate back transfer device and a substrate back transfer method, and a fully automatic coating machine, which can realize the back transfer function of the substrate holder, realize automatic production, and can effectively utilize the bottom space of the existing coating machine to reduce the land occupation. The area is effective to solve the transformation problem of the coating equipment that has been put into production.
本公开的一些实施例,提供了一种基板架回传装置,包括基板架传送装置和基板架升降回传装置;其中,所述基板架传送装置设置在镀膜设备的底部,且所述镀膜设备进口端和镀膜设备出口端分别设有一个所述基板架升降回传装置。Some embodiments of the present disclosure provide a substrate holder returning device including a substrate holder conveying device and a substrate holder lifting and returning device; wherein the substrate holder conveying device is disposed at a bottom of the coating device, and the coating device The inlet end and the outlet end of the coating device are respectively provided with one of the substrate rack lifting and returning devices.
位于镀膜设备进口端的基板架升降回传装置,配置为承接由基板架传送装置传送回的基板架,以及配置为将基板架传送至镀膜设备中的传送带上。A substrate holder lifting and returning device at the inlet end of the coating apparatus is configured to receive the substrate holder transported back by the substrate holder transport device and configured to transport the substrate holder to a conveyor belt in the coating apparatus.
位于镀膜设备出口端的基板架升降回传装置,配置为承接由传送带传送出的基板架,以及配置为将基板架传送至基板架传送装置上。A substrate holder lifting and returning device at the exit end of the coating apparatus is configured to receive the substrate holder conveyed by the conveyor belt and configured to convey the substrate holder to the substrate holder conveying device.
在一些实施例中,所述基板架传送装置为皮带机或传送带。In some embodiments, the substrate holder transport device is a belt conveyor or a conveyor belt.
在一些实施例中,所述基板架传送装置包括第一回传主体和支撑腿,所述支撑腿固定设置在所述第一回传主体的底部。第一回传主体配置为带动由传送带传送出的基板架向传送带的进口端移动。In some embodiments, the substrate holder transport device includes a first return body and a support leg, the support legs being fixedly disposed at a bottom of the first return body. The first return body is configured to drive the substrate carrier transported by the conveyor belt to move toward the inlet end of the conveyor belt.
基板架升降回传装置包括第二回传主体和升降装置;升降装置设置在第二回传主体的底部。位于镀膜设备出口端的基板架升降回传装置中的第二回传主体,配置为带动由传送带传送出的基板架移动至基板架传送装置的进口端;位于镀膜设备进口端的基板架升降回传装置中的第二回传主体,配置为带动由基板架传送装置传送回的基板架移动至传送带的进口端。The substrate rack lifting and returning device comprises a second returning body and a lifting device; the lifting device is arranged at the bottom of the second returning body. a second returning body in the substrate rack lifting and returning device at the outlet end of the coating device, configured to drive the substrate rack conveyed by the conveyor belt to move to the inlet end of the substrate rack conveying device; and the substrate rack lifting and returning device at the inlet end of the coating device The second return body is configured to drive the substrate holder transported back by the substrate holder transport device to move to the inlet end of the conveyor belt.
在一些实施例中,所述第一回传主体与所述第二回传主体的结构相同,均包括架体、用于传送基板架的多个传送轮、多根转轴和驱动电机。所述架体的两侧分别设有一个安装槽,且两个所述安装槽内均设有所述传送轮。其中一个所述安装槽内的所述传送轮通过所述转轴与另一个所述安装槽内的所述传送轮连接;任意相邻两根所述转轴通过皮带和皮带轮联动。所述驱动电机固定安装在所述架体上,所述驱动电极的输出轴与其中一根所述转轴连接。In some embodiments, the first return body is identical in structure to the second return body, and each includes a frame, a plurality of transfer wheels for transporting the substrate holder, a plurality of rotating shafts, and a drive motor. A mounting groove is respectively disposed on two sides of the frame body, and the transfer wheel is disposed in each of the two mounting slots. The transfer wheel in one of the mounting slots is coupled to the transfer wheel in the other of the mounting slots by the rotating shaft; any two adjacent rotating shafts are coupled by a belt and a pulley. The drive motor is fixedly mounted on the frame, and an output shaft of the drive electrode is coupled to one of the rotating shafts.
在一些实施例中,所述传送轮为槽轮。所述基板架回传装置还包括基板架;基板架的底部设有两根平形布置的导杆,且两根所述导杆分别与两个所述安装槽内的所述槽轮配合。In some embodiments, the transfer wheel is a sheave. The substrate holder returning device further comprises a substrate holder; the bottom of the substrate holder is provided with two flat-shaped guiding rods, and the two guiding rods respectively cooperate with the groove wheels in the two mounting grooves.
在一些实施例中,所述升降装置为液压缸、气缸以及电动推拉杆中的一种。In some embodiments, the lifting device is one of a hydraulic cylinder, a cylinder, and an electric push-pull rod.
本公开的一些实施例,提供了一种应用于所述基板架回传装置的基板架回传方法,包括:位于镀膜设备进口端的基板架升降回传装置将基板架举升,并传送至传送带上,传送带将基板架从镀膜设备进口端传送至镀膜设备出口端,并将基板架传送至位于镀膜设备出口端且处于上升状态的基板架升降回传装置上。位于镀膜设备出口端的基板架升降回传装置带着基板架下降,并将基板架传送至基板架传送装置上。基板架传送装置将基板架从镀膜设备的底部回传至位于镀膜设备进口端且处于下降状态的基板架升降回传装置上,完成循环回传基板架的一个回传过程。Some embodiments of the present disclosure provide a substrate rack returning method applied to the substrate rack returning device, comprising: a substrate rack lifting and returning device at an inlet end of the coating device lifting the substrate rack and transmitting the substrate to the conveyor belt The conveyor belt transports the substrate holder from the inlet end of the coating device to the outlet end of the coating device, and transfers the substrate holder to the substrate holder lifting and returning device at the outlet end of the coating device and in an ascending state. The substrate rack lifting and returning device at the outlet end of the coating device is lowered with the substrate holder, and the substrate holder is transferred to the substrate holder conveying device. The substrate rack transfer device returns the substrate rack from the bottom of the coating device to the substrate rack lifting and returning device at the inlet end of the coating device and is in a descending state, and completes a return process of the loop back substrate carrier.
在一些实施例中,在基板架被传送带传送的过程中,位于所述镀膜设备进口端的所述基板架升降回传装置下降至第三预设位置;第三预设位置为与基板架传送装置平齐的位置。In some embodiments, during the transfer of the substrate holder by the conveyor belt, the substrate holder lifting and returning device at the inlet end of the coating device is lowered to a third preset position; and the third predetermined position is a substrate carrier The position is flush.
在一些实施例中,在基板架回传的过程中,位于所述镀膜设备出口端的所述基板架升降回传装置上升至第四预设位置;第四预设位置为与所述传送带平齐的位置。In some embodiments, the substrate holder lifting and returning device at the outlet end of the coating device rises to a fourth preset position during the substrate carrier returning; the fourth predetermined position is flush with the conveyor belt. s position.
本公开的一些实施例,提供了一种全自动镀膜机,包括上片设备、回传装置和下片设备。镀膜设备包括多个平行布置的传送带,相邻两个传送带之间形成第一缝隙,每个传送带均贯穿于镀膜设备,且每个传送带的两端分别伸入上片设备和下片设备内。Some embodiments of the present disclosure provide a fully automatic coating machine including a top sheeting device, a returning device, and a lower sheeting device. The coating apparatus comprises a plurality of conveyor belts arranged in parallel, and a first gap is formed between two adjacent conveyor belts, each of which runs through the coating apparatus, and both ends of each conveyor belt extend into the upper and lower apparatus, respectively.
所述回传装置设于所述镀膜设备的下方,且所述回传装置为上述的基板架回传装置。所述回传装置的两端分别位于所述上片设备和所述下片设备内。The back-transmission device is disposed under the coating device, and the back-transmission device is the substrate carrier return device described above. The two ends of the backhaul device are respectively located in the upper device and the lower device.
上片设备与镀膜设备进口端连接,配置为将玻璃基片转送并放置在位于传送带进口端的基板架上;下片设备与镀膜设备出口端连接,配置为将位于传送带出口端的基板架上的玻璃基片转送出,并送入下一工位。The upper sheet device is connected to the inlet end of the coating device, configured to transfer and place the glass substrate on the substrate holder at the inlet end of the conveyor belt; the lower sheet device is connected to the outlet end of the coating device, and is configured to be a glass on the substrate holder at the outlet end of the conveyor belt The substrate is transferred and sent to the next station.
在一些实施例中上片设备包括第一基片传送带、第一基片举升机构、第一基片转送机构、第一基片顶升机构和第一行走轨道。In some embodiments the wafer loading apparatus includes a first substrate transfer belt, a first substrate lift mechanism, a first substrate transfer mechanism, a first substrate lift mechanism, and a first travel track.
第一基片传送带配置为将玻璃基片送入上片设备内。The first substrate conveyor is configured to feed the glass substrate into the wafer apparatus.
第一基片转送机构可滑动地设置在第一行走轨道上。第一基片转送机构在第一行走轨道上具有第一预设位置和第二预设位置,所述第一预设位置位于第一基片传送带的正上方,第二预设位置与第一基片顶升机构相对。The first substrate transfer mechanism is slidably disposed on the first traveling track. The first substrate transfer mechanism has a first preset position and a second preset position on the first traveling track, the first preset position is directly above the first substrate conveyor, and the second preset position is first The substrate lifting mechanism is opposite.
第一基片举升机构相对基片传送带沿垂直第一基片传送带的方向做升降运动。第一基片举升机构配置为在顶升时举升第一基片传送带上的玻璃基片,在降落时降落玻璃基片并放置在滑动至第一预设位置的第一基片转送机构上。The first substrate lift mechanism moves up and down relative to the substrate transfer belt in a direction perpendicular to the first substrate transfer belt. The first substrate lifting mechanism is configured to lift the glass substrate on the first substrate transfer belt when jacking, to drop the glass substrate during landing, and to place the first substrate transfer mechanism that slides to the first predetermined position on.
第一基片转送机构配置为在滑动至第二预设位置时伸长运动,将玻璃基片转送至传送带的正上方。The first substrate transfer mechanism is configured to elongate movement upon sliding to the second predetermined position to transfer the glass substrate directly above the conveyor belt.
第一基片顶升机构设于传送带进口端的下方。第一基片顶升机构配置为在顶升时顶起第一基片转送机构上的玻璃基片,在降落时降落玻璃基片并放置在位于传送带上的基板架上。The first substrate lifting mechanism is disposed below the inlet end of the conveyor belt. The first substrate lift mechanism is configured to jack up the glass substrate on the first substrate transfer mechanism when it is raised, to drop the glass substrate upon landing and to place it on the substrate holder on the conveyor.
在一些实施例中,所述下片设备包括第二基片传送带、第二基片举升机构、第二基片转送机构、第二基片顶升机构和第二行走轨道。In some embodiments, the lower sheet apparatus includes a second substrate transfer belt, a second substrate lift mechanism, a second substrate transfer mechanism, a second substrate lift mechanism, and a second travel track.
第二基片转送机构可滑动地设置在第二行走轨道上。所述第二基片转送机构在第二行走轨道上具有第五预设位置和第六预设位置,所述第五预设位置位于第二基片传送带的正上方,所述第六预设位置与第二基片顶升机构相对。The second substrate transfer mechanism is slidably disposed on the second traveling track. The second substrate transfer mechanism has a fifth preset position and a sixth preset position on the second traveling track, the fifth preset position is directly above the second substrate conveyor, the sixth preset The position is opposite to the second substrate jacking mechanism.
第二基片转送机构配置为在滑动至所述第六预设位置时伸长运动。The second substrate transfer mechanism is configured to elongate movement upon sliding to the sixth predetermined position.
第二基片顶升机构设于传送带出口端的下方。第二基片顶升机构配置为在顶升时顶起位于传送带上的基板架上的玻璃基片,在降落时降落玻璃基片并放置在滑动至第六预设位置时伸长的第二基片转送机构上。The second substrate lifting mechanism is disposed below the outlet end of the conveyor. The second substrate lifting mechanism is configured to lift the glass substrate on the substrate holder on the conveyor belt when jacking up, to drop the glass substrate when landing, and to place the second elongated when sliding to the sixth predetermined position The substrate transfer mechanism.
第二基片举升机构相对第二基片传送带沿垂直第二基片传送带的方向做升降运动。第二基片举升机构配置为在顶升时举升滑动至第五预设位置的第二基片转送机构上的玻璃基片,在降落时降落玻璃基片并放置在第二基片传送带上。The second substrate lift mechanism moves up and down relative to the second substrate transfer belt in a direction perpendicular to the second substrate transfer belt. The second substrate lifting mechanism is configured to lift the glass substrate on the second substrate transfer mechanism that slides to the fifth predetermined position when jacking, to drop the glass substrate during landing and to place on the second substrate conveyor on.
第二基片传送带配置为将玻璃基片送出下片设备,并送入下一工位。The second substrate transfer belt is configured to feed the glass substrate out of the lower sheet device and feed it to the next station.
在一些实施例中,所述第一基片举升机构和第二基片举升机构均包括第一举升叉和举升缸。所述第一举升叉包括多个第一插杆、第一插杆连接杆和举升缸连接杆。所述多个第一插杆等间距平行固定在所述第一插杆连接杆上,所述第一插杆连接杆通过所述举升缸连接杆与所述举升缸的伸缩端固定连接。所述第一基片传送带为多个,且相互等间距平行布置,第一基片举升机构的第一插杆配置为在升降时通过相邻两个第一基片传送带之间的第二缝隙。所述第二基片传送带为多个,且相互等间距平行布置,第二基片举升机构的第一插杆配置为在升降时通过相邻两个第二基片传送带之间的第二缝隙。In some embodiments, the first substrate lift mechanism and the second substrate lift mechanism each include a first lift fork and a lift cylinder. The first lift fork includes a plurality of first plungers, a first plunger connecting rod, and a lift cylinder connecting rod. The plurality of first plungers are fixed in parallel to the first plunger connecting rod, and the first plunger connecting rod is fixedly connected to the telescopic end of the lifting cylinder through the lifting cylinder connecting rod . The first substrate conveyor belt is plural and arranged at equal intervals in parallel with each other, and the first plunger of the first substrate lifting mechanism is configured to pass through the second between the adjacent two first substrate conveyor belts during lifting. Gap. The second substrate conveyor belt is plural and arranged at equal intervals in parallel with each other, and the first plunger of the second substrate lifting mechanism is configured to pass the second between the adjacent two second substrate conveyor belts during lifting Gap.
在一些实施例中,第一基片转送机构和第二基片转送机构均包括第二举升叉、伸缩缸、滑块和滑座。第一基片转送机构的滑座可滑动地设置在第一行走轨道上。第二基片转送机构的滑座可滑动地设置在第二行走轨道上。滑块可滑动地设置在滑座上。伸缩缸固定在滑块上。所述第二举升叉包括多个第二插杆和第二插杆连接杆;多个第二插杆等间距固定在第二插杆连接杆上;第二插杆连接杆固定在伸缩缸的伸缩端。In some embodiments, the first substrate transfer mechanism and the second substrate transfer mechanism each include a second lift fork, a telescopic cylinder, a slider, and a carriage. The slider of the first substrate transfer mechanism is slidably disposed on the first traveling rail. The carriage of the second substrate transfer mechanism is slidably disposed on the second traveling rail. The slider is slidably disposed on the slider. The telescopic cylinder is fixed to the slider. The second lifting fork includes a plurality of second plungers and a second plunger connecting rod; the plurality of second plungers are equally spaced on the second plunger connecting rod; the second plunger connecting rod is fixed to the telescopic cylinder The telescopic end.
在一些实施例中,第一行走轨道和第二行走轨道均包括上轨、中轨和下轨。第一基片转送机构的滑座与第一行走轨道的上轨、中轨和下轨滑动连接。第二基片转送机构的滑座与第二行走轨道的上轨、中轨和下轨滑动连接。In some embodiments, the first travel track and the second travel track each include an upper rail, a middle rail, and a lower rail. The slide of the first substrate transfer mechanism is slidably coupled to the upper rail, the middle rail and the lower rail of the first traveling rail. The carriage of the second substrate transfer mechanism is slidably coupled to the upper rail, the middle rail and the lower rail of the second traveling rail.
在一些实施例中,第一基片转送机构和第二基片转送机构均还包括第一伺服电机和第一齿条。第一齿条固定安装在中轨上;第一伺服电机固定在滑块上,第一伺服电机连接有与第一齿条相啮合的第一齿轮。In some embodiments, the first substrate transfer mechanism and the second substrate transfer mechanism each further include a first servo motor and a first rack. The first rack is fixedly mounted on the middle rail; the first servo motor is fixed on the slider, and the first servo motor is connected to the first gear that meshes with the first rack.
在一些实施例中,滑座的一侧具有两条沿竖直方向平行布置的第二滑轨;滑块通过第二滑轨可滑动地安装在滑座上。In some embodiments, one side of the carriage has two second rails arranged in parallel in a vertical direction; the slider is slidably mounted on the carriage by a second rail.
在一些实施例中,第一基片转送机构和第二基片转送机构均还包括第二伺服电机和第二齿条。第二齿条设置在滑座上,且与第二滑轨平行布置。第二伺服电机固定在滑块上,第二伺服电机连接有与第二齿条相啮合的第二齿轮。In some embodiments, the first substrate transfer mechanism and the second substrate transfer mechanism each further include a second servo motor and a second rack. The second rack is disposed on the carriage and disposed in parallel with the second rail. The second servo motor is fixed to the slider, and the second servo motor is coupled to the second gear that meshes with the second rack.
在一些实施例中,第一基片顶升机构和第二基片顶升机构均包括底座和多个可升降运动的顶升缸,顶升缸固定在所述底座上。每个顶升缸配置为在伸缩时通过相邻两个传送带之间的第一缝隙,并通过相邻两个第二插杆之间的间隙。In some embodiments, the first substrate jacking mechanism and the second substrate jacking mechanism each include a base and a plurality of liftable lifting jacks, the jacking cylinder being secured to the base. Each jacking cylinder is configured to pass a first gap between two adjacent conveyor belts when telescopic and through a gap between two adjacent second poles.
在本公开的一些实施例提供的一种基板架回传装置中,实现了在溅射镀膜过程中基板架的自动回传。由于充分利用了安装镀膜设备底部的空间,将占地面积较大的基板架传送装置设置在镀膜设备的下方,因此解决了已投产的镀膜设备无法在有限的厂区空间内添加基板架回传系统的问题。具有结构简单和占地面积小的优点,而且基板架可以被重复使用,用一备一,一套使用,另一套备用,无需在镀膜设备的进出口端设置基板架缓存室,从而大大降低了成本。In a substrate carrier back-transfer device provided by some embodiments of the present disclosure, automatic return of the substrate holder during the sputter coating process is achieved. Since the space for installing the bottom of the coating device is fully utilized, the substrate carrier conveying device with a large footprint is disposed under the coating device, thereby solving the problem that the coating device that has been put into production cannot add the substrate carrier returning system in a limited plant space. The problem. The utility model has the advantages of simple structure and small occupied area, and the substrate holder can be reused, and one set is used, one set is used, and the other set is spared, and the substrate frame buffer room is not required to be disposed at the inlet and the back end of the coating device, thereby greatly reducing The cost.
在本公开的一些实施例提供的一种全自动镀膜机中,通过基板架回传装置与上片设备和下片设备的配合,可以实现自动上片、自动下片、基板架自动回传的功能,使镀膜设备实现高度自动化控制,全程无需人工操作,极大地提高了生产效率。且由于回传装置设置在镀膜设备的底部,可以有效利用现有空间,节省占地面积,不但适用于新设备的布置,还适用于旧设备的改造。In a fully automatic coating machine provided by some embodiments of the present disclosure, the automatic loading, the automatic lowering, and the automatic backing of the substrate holder can be realized by the cooperation of the substrate backing device and the upper device and the lower device. The function enables the coating equipment to achieve a high degree of automation control, eliminating the need for manual operation throughout the entire process, greatly improving production efficiency. Moreover, since the returning device is disposed at the bottom of the coating device, the existing space can be effectively utilized, and the floor space is saved, which is not only suitable for the arrangement of the new device, but also suitable for the transformation of the old device.
附图说明DRAWINGS
图1是本公开一些实施例提供的一种基板架回传装置的整体结构轴测图;1 is a perspective view of an overall structure of a substrate carrier returning device according to some embodiments of the present disclosure;
图2是本公开一些实施例提供的一种基板架传送装置的轴测图;2 is a perspective view of a substrate rack transport device according to some embodiments of the present disclosure;
图3是本公开一些实施例提供的一种第一回传主体的轴测图;3 is a perspective view of a first returning body provided by some embodiments of the present disclosure;
图4是本公开一些实施例提供的一种基板架升降回传装置的轴测图;4 is a perspective view of a substrate rack lifting and returning device according to some embodiments of the present disclosure;
图5是本公开一些实施例提供的一种第二回传主体的轴测图;FIG. 5 is a perspective view of a second returning body provided by some embodiments of the present disclosure; FIG.
图6是本公开一些实施例提供的一种基板架的轴测图;6 is a perspective view of a substrate holder according to some embodiments of the present disclosure;
图7是本公开一些实施例提供的一种基板架回传方法的流程示意图;7 is a schematic flow chart of a method for returning a substrate rack according to some embodiments of the present disclosure;
图8是本公开一些实施例提供的一种全自动镀膜机整体结构轴测图;8 is a perspective view of an overall structure of a fully automatic coating machine according to some embodiments of the present disclosure;
图9是本公开一些实施例提供的一种上片设备的结构轴测图;9 is a structural isometric view of a top sheet device according to some embodiments of the present disclosure;
图10是本公开一些实施例提供的一种下片设备的结构轴测图;FIG. 10 is a structural isometric view of a lower sheet device according to some embodiments of the present disclosure; FIG.
图11是本公开一些实施例提供的一种第一基片举升机构和第二基片举升机构的轴测图;11 is a perspective view of a first substrate lifting mechanism and a second substrate lifting mechanism according to some embodiments of the present disclosure;
图12是本公开一些实施例提供的一种第一基片转送机构和第二基片转送机构的轴测图;12 is a perspective view of a first substrate transfer mechanism and a second substrate transfer mechanism according to some embodiments of the present disclosure;
图13是本公开一些实施例提供的一种第一齿轮和第一齿条相啮合的结构轴测图;13 is a structural isometric view of a first gear and a first rack engaged by some embodiments of the present disclosure;
图14是本公开一些实施例提供的一种第二齿轮和第二齿条相啮合的结构轴测图;14 is a structural isometric view of a second gear and a second rack engaged by some embodiments of the present disclosure;
图15是本公开一些实施例提供的一种第一基片顶升机构和第二基片顶升机构的轴测图。15 is a perspective view of a first substrate jacking mechanism and a second substrate jacking mechanism provided by some embodiments of the present disclosure.
具体实施方式Detailed ways
下面详细描述本公开的实施例,所述实施例的示例在附图中示出,其中自始至终相同的标号表示相同的元件或具有相同功能的元件。下面通过参考附图描述的实施例 是示例性的,仅用于解释本公开,而不能解释为对本公开的限制。The embodiments of the present disclosure are described in detail below, and the examples of the embodiments are illustrated in the accompanying drawings, in which the same reference numerals refer to the same elements or elements having the same function. The embodiments described below with reference to the accompanying drawings are intended to be illustrative only, and are not to be construed as limiting.
相关技术中,通过在卧式磁控溅射镀膜机的进口端和出口端设置缓存室,并使回传系统设置在卧式磁控溅射镀膜机的侧面,来添加基板架。但由于这种设计占地面积非常大,因此需要提前预留空间,对于已投产设备无法实现。In the related art, a substrate holder is added by providing a buffer chamber at the inlet end and the outlet end of the horizontal magnetron sputtering coater and a returning system disposed on the side of the horizontal magnetron sputtering coater. However, due to the large footprint of this design, it is necessary to reserve space in advance, which is impossible for the equipment that has been put into production.
本公开的实施例提供一种基板架回传装置,如图1所示,包括基板架传送装置1和基板架升降回传装置2。基板架传送装置1设置在镀膜设备3的底部,且镀膜设备3的两端分别设有一个基板架升降回传装置2。一个基板架升降回传装置2设置在镀膜设备进口端X1(相应的该基板架升降回传装置2也位于基板架传送装置1的出口端X4),另一个基板架升降回传装置2设置在镀膜设备3出口端X2(相应的该基板架升降回传装置2也位于基板架传送装置1的进口端X3)。Embodiments of the present disclosure provide a substrate holder returning device, as shown in FIG. 1, including a substrate holder transfer device 1 and a substrate holder lifting and returning device 2. The substrate rack transfer device 1 is disposed at the bottom of the coating device 3, and a substrate holder lifting and returning device 2 is disposed at each end of the coating device 3. A substrate rack lifting and lowering device 2 is disposed at the inlet end X1 of the coating device (the corresponding substrate rack lifting and lowering device 2 is also located at the outlet end X4 of the substrate holder conveying device 1), and another substrate holder lifting and returning device 2 is disposed at The outlet end X2 of the coating device 3 (the corresponding substrate holder lifting and returning device 2 is also located at the inlet end X3 of the substrate holder conveying device 1).
位于镀膜设备进口端X1的基板架升降回传装置2,配置为承接由基板架传送装置1传送回的基板架15,以及配置为将基板架15传送至镀膜设备3中的传送带4上。位于镀膜设备出口端X2的基板架升降回传装置2,配置为承接由所述传送带4传送出的基板架15,以及配置为将基板架15传送至基板架传送装置1上。The substrate holder lifting and returning device 2 at the inlet end X1 of the coating apparatus is configured to receive the substrate holder 15 transported back by the substrate holder conveying device 1, and is configured to convey the substrate holder 15 to the conveyor belt 4 in the coating apparatus 3. The substrate rack lifting and lowering device 2 at the exit end X2 of the coating device is configured to receive the substrate holder 15 conveyed by the conveyor belt 4, and is configured to convey the substrate holder 15 to the substrate holder conveying device 1.
可以理解的是,本公开的一些实施例提供的基板架回传装置,用于传送基板架15,而基板架15作为镀膜用玻璃基片的承载体。It will be appreciated that some embodiments of the present disclosure provide a substrate carrier back-transfer device for transporting the substrate holder 15 as a carrier for the glass substrate for coating.
在本公开的一些实施例中,基板架回传装置的工作过程为:位于镀膜设备进口端X1的基板架升降回传装置2带着基板架15上升。当基板架升降回传装置2上升至与镀膜设备3的传送带4相接(在一些实施例中,基板架升降回传装置2上升至与镀膜设备3的传送带4平齐)时停止上升,基板架升降回传装置2开始传送基板架15,将基板架15传送至镀膜设备3的传送带4上。然后,将玻璃基片放置在基板架15上,基板架15在传送带4的带动下进入镀膜设备3对玻璃基片进行镀膜。其中,在基板架15被传送带4传送过程中,位于镀膜设备进口端X1的基板架升降回传装置2下降,并与基板架传送装置1相接(在一些实施例中,基板架升降回传装置2下降至与基板架传送装置1平齐)。当完成镀膜后,基板架15带着玻璃基片从镀膜设备出口端X2出来,并被传送至位于镀膜设备出口端X2的基板架升降回传装置2上(此时,镀膜设备出口端X2的基板架升降回传装置2处于上升状态,与传送带4平齐)。通过人工或机械设备将镀膜后的玻璃基片卸下后,位于镀膜设备出口端X2的基板架升降回传装置2带着基板架15下降。当位于镀膜设备出口端X2的基板架升降回传装置2下降至与基板架传送装置1相接后,将基板架15传送至基板架传送装置1上。基板架传送装置1将基板架15传送至位于镀膜设备进口端X1的基板架升降回传装置2上(此时,镀膜设备进口端X1的基板架升降回传装置2处于下降状态,与基板架传送装置1平齐),从而完成一个工作循环。其中,在基板架15被基板架传送装置1传送过程中,位于镀膜设备出口端X2的基板架升降回传装置2上升,等待接取下一个工作循环用到的基板架15。In some embodiments of the present disclosure, the substrate carrier returning device operates in such a manner that the substrate holder lifting and returning device 2 at the inlet end X1 of the coating device rises with the substrate holder 15. When the substrate rack lifting and lowering device 2 is raised to be in contact with the conveyor belt 4 of the coating device 3 (in some embodiments, the substrate rack lifting and lowering device 2 is raised to be flush with the conveyor belt 4 of the coating device 3), the substrate is stopped, and the substrate is stopped. The rack lifting and lowering device 2 starts to transport the substrate holder 15 and transports the substrate holder 15 to the conveyor belt 4 of the coating device 3. Then, the glass substrate is placed on the substrate holder 15, and the substrate holder 15 is guided by the conveyor belt 4 into the coating device 3 to coat the glass substrate. Wherein, during the transfer of the substrate holder 15 by the conveyor belt 4, the substrate holder lifting and returning device 2 at the inlet end X1 of the coating device is lowered and connected to the substrate holder conveying device 1 (in some embodiments, the substrate holder is moved back and forth) The device 2 is lowered to be flush with the substrate holder transfer device 1). After the coating is completed, the substrate holder 15 carries the glass substrate from the exit end X2 of the coating device, and is transferred to the substrate holder lifting and returning device 2 at the outlet end X2 of the coating device (at this time, the outlet end of the coating device X2) The substrate rack lifting and lowering device 2 is in a rising state, flush with the conveyor belt 4). After the coated glass substrate is removed by manual or mechanical means, the substrate holder lifting and returning device 2 at the exit end X2 of the coating device is lowered with the substrate holder 15. When the substrate rack elevating and returning device 2 at the exit end X2 of the coating device is lowered to be in contact with the substrate rack transporting device 1, the substrate rack 15 is transferred to the substrate rack transporting device 1. The substrate holder conveying device 1 transports the substrate holder 15 to the substrate holder lifting and returning device 2 at the inlet end X1 of the coating device (at this time, the substrate holder lifting and returning device 2 at the inlet end X1 of the coating device is in a descending state, and the substrate holder The conveyor 1 is flush) to complete a duty cycle. Here, during the transfer of the substrate holder 15 by the substrate holder transfer device 1, the substrate holder lifting/returning device 2 at the exit end X2 of the coating device rises, waiting for the substrate holder 15 for the next working cycle to be picked up.
本公开实施例提供一种基板架回传装置,实现了在溅射镀膜过程中基板架15的自动回传。由于本公开实施例充分利用了安装镀膜设备3底部的空间,将占地面积较大的基板架传送装置1设置在镀膜设备3的下方,因此解决了已投产的镀膜设备无法在有限的厂区空间内添加基板架回传系统的问题,具有结构简单和占地面积小的优点, 而且基板架15可以被重复使用,用一备一,一套使用,另一套备用,无需在镀膜设备3的进出口端设置基板架15缓存室,从而大大降低了成本。Embodiments of the present disclosure provide a substrate holder returning device that realizes automatic return of the substrate holder 15 during sputter coating. Since the embodiment of the present disclosure makes full use of the space for installing the bottom of the coating device 3, the substrate carrier conveying device 1 having a large footprint is disposed under the coating device 3, thereby solving the problem that the coating device that has been put into production cannot be in a limited plant space. The problem of adding the substrate rack return transmission system has the advantages of simple structure and small footprint, and the substrate holder 15 can be reused, one for use, one set for use, and the other for standby, without the need for the coating device 3 The inlet and outlet ends are provided with a substrate holder 15 buffer chamber, thereby greatly reducing the cost.
需要说明的是,基板架传送装置1具有多种结构。在一些实施例中,基板架传送装置1采用皮带机。在另一些实施例中,基板架传送装置1采用传送带。在另一些实施例中,基板架传送装置1采用具备转运功能的设备。It should be noted that the substrate rack transfer device 1 has various structures. In some embodiments, the substrate carrier transfer device 1 employs a belt conveyor. In other embodiments, the substrate carrier transfer device 1 employs a conveyor belt. In other embodiments, the substrate carrier transfer device 1 employs a device having a transfer function.
在一些实施例中,如图2所示,基板架传送装置1包括第一回传主体100和支撑腿6,支撑腿6固定设置在第一回传主体100的底部。In some embodiments, as shown in FIG. 2, the substrate carrier transfer device 1 includes a first return body 100 and a support leg 6 that is fixedly disposed at the bottom of the first return body 100.
在一些实施例中,支撑腿6为可折叠的支撑腿。在不使用基板架传送装置1时,可以对支撑腿6进行折叠,减少基板架传送装置1的占用空间,有助于移动运输;在投产使用过程中需要对基板架传送装置1进行维修时,可以对支撑腿6进行折叠,减少基板架传送装置1的占用空间,方便工作人员维修。In some embodiments, the support legs 6 are foldable support legs. When the substrate holder conveying device 1 is not used, the support legs 6 can be folded, the occupied space of the substrate holder conveying device 1 can be reduced, and the transportation can be facilitated; when the substrate holder conveying device 1 needs to be repaired during production and use, The support legs 6 can be folded to reduce the occupied space of the substrate rack transporting device 1 and facilitate the maintenance of the staff.
在一些实施例中,第一回传主体100配置为带动由传送带4传送出的基板架15向传送带的进口端401移动,以实现将基板架15由镀膜设备出口端X2回传至镀膜设备进口端X1。可以理解的是,传送带的进口端401,即镀膜设备进口端X1。In some embodiments, the first returning body 100 is configured to drive the substrate holder 15 transported by the conveyor belt 4 to move toward the inlet end 401 of the conveyor belt to effect the return of the substrate holder 15 from the coating device outlet end X2 to the coating device inlet. End X1. It can be understood that the inlet end 401 of the conveyor belt, that is, the inlet end X1 of the coating device.
在一些实施例中,如图3所示,第一回传主体100包括架体9、多个传送轮10、多根转轴11和驱动电机12。架体9的两侧分别设有一个安装槽13,且两个安装槽13内均设有传送轮10。其中一个安装槽13内的每一个传送轮10各通过一根转轴11与另一个安装槽13内的一个传送轮10连接(在一些实施例中,转轴11沿架体9的宽度方向W布置),任意相邻两根转轴11之间通过皮带14和皮带轮300联动。驱动电机12固定安装在架体9上,驱动电极12的输出轴与其中一根转轴11连接。In some embodiments, as shown in FIG. 3, the first return body 100 includes a frame body 9, a plurality of transfer wheels 10, a plurality of rotating shafts 11, and a drive motor 12. A mounting groove 13 is respectively disposed on two sides of the frame body 9, and a transfer wheel 10 is disposed in each of the two mounting slots 13. Each of the transfer wheels 10 in one of the mounting slots 13 is connected to a transfer wheel 10 in the other mounting groove 13 via a rotating shaft 11 (in some embodiments, the rotating shaft 11 is arranged along the width direction W of the frame 9) The two adjacent rotating shafts 11 are interlocked by the belt 14 and the pulley 300. The drive motor 12 is fixedly mounted on the frame body 9, and the output shaft of the drive electrode 12 is coupled to one of the rotary shafts 11.
在一些实施例中,任意相邻两根转轴11之间通过皮带14和皮带轮300联动,采用如下方式实现:除最两侧的转轴11中每根转轴11的一端部各设有一个皮带轮300外,其余每根转轴11的一端部均设有两个皮带轮300,任意相邻两个皮带轮300均通过一个皮带14连接。在另一些实施例中,在两根转轴11之间设置张紧轮5,张紧轮5的位置可调,实现对皮带14松紧度的调节,可以防止连接相邻两根转轴11的皮带14打滑。In some embodiments, any two adjacent rotating shafts 11 are interlocked by the belt 14 and the pulley 300, and are realized in the following manner: except for one end of each of the rotating shafts 11 of the two sides of the rotating shaft 11 Each of the remaining shafts 11 is provided with two pulleys 300 at one end thereof, and any two adjacent pulleys 300 are connected by a belt 14. In other embodiments, a tensioning pulley 5 is disposed between the two rotating shafts 11, and the position of the tensioning pulley 5 is adjustable to adjust the tightness of the belt 14, and the belt 14 connecting the adjacent two rotating shafts 11 can be prevented. Slip.
在一些实施例中,如图4所示,基板架升降回传装置2包括第二回传主体200和升降装置8;升降装置8设置在第二回传主体200的底部。位于镀膜设备出口端X2的基板架升降回传装置2中的第二回传主体200,配置为带动由传送带4传送出的基板架15移动至基板架传送装置1的进口端X3。位于镀膜设备进口端X1的基板架升降回传装置2中的第二回传主体200,配置为带动由基板架传送装置1传送回的基板架15移动至传送带的进口端401。In some embodiments, as shown in FIG. 4, the substrate rack lifting and lowering device 2 includes a second returning body 200 and a lifting device 8; the lifting device 8 is disposed at the bottom of the second returning body 200. The second return main body 200 of the substrate rack lifting and lowering device 2 located at the exit end X2 of the coating device is configured to move the substrate holder 15 transported by the conveyor 4 to the inlet end X3 of the substrate rack transfer device 1. The second return body 200 in the substrate rack lifting and lowering device 2 at the inlet end X1 of the coating device is configured to drive the substrate holder 15 transported back by the substrate carrier transfer device 1 to move to the inlet end 401 of the conveyor.
在一些实施例中,升降装置8采用液压缸。在另一些实施例中,升降装置8采用气缸。再另一些实施例中,升降装置8采用电动推拉杆。当然,升降装置8的具体结构不限于所列举的结构。In some embodiments, the lifting device 8 employs a hydraulic cylinder. In other embodiments, the lifting device 8 employs a cylinder. In still other embodiments, the lifting device 8 employs an electric push-pull rod. Of course, the specific structure of the lifting device 8 is not limited to the illustrated structure.
在一些实施例中,第二回传主体200与第一回传主体100的结构相同。如图5所示,第二回传主体200也包括架体9、多个传送轮10、多根转轴11和驱动电机12。架体9的两侧分别设有一个安装槽13,且两个安装槽13内均设有传送轮10。其中一个安装槽13内的每一个传送轮10各通过一根转轴11与另一个安装槽13内的一个传 送轮10连接,任意相邻两根转轴11之间通过皮带14和皮带轮300联动。驱动电机12固定安装在架体9上,驱动电机12输出轴与其中一根转轴11连接。In some embodiments, the second backhaul body 200 is identical in structure to the first backhaul body 100. As shown in FIG. 5, the second return main body 200 also includes a frame body 9, a plurality of transfer wheels 10, a plurality of rotating shafts 11, and a drive motor 12. A mounting groove 13 is respectively disposed on two sides of the frame body 9, and a transfer wheel 10 is disposed in each of the two mounting slots 13. Each of the transfer wheels 10 in one of the mounting slots 13 is connected to a transfer wheel 10 in the other mounting slot 13 via a rotating shaft 11, and any two adjacent rotating shafts 11 are coupled by a belt 14 and a pulley 300. The drive motor 12 is fixedly mounted on the frame body 9, and the output shaft of the drive motor 12 is coupled to one of the rotating shafts 11.
在一些实施例中,除最两侧的转轴11中每根转轴11的一端部各设有一个皮带轮300外,其余每根转轴11的一端部均设有两个皮带轮300,任意相邻两个皮带轮300均通过一个皮带14连接。在另一些实施例中,在两根转轴11之间设置张紧轮5,张紧轮5的位置可调,实现对皮带14松紧度的调节,可以防止连接相邻两根转轴11的皮带14打滑。In some embodiments, except for one end of each of the rotating shafts 11 on the most two sides of the rotating shaft 11, one pulley 300 is provided, and one end of each of the rotating shafts 11 is provided with two pulleys 300, any two adjacent to each other. The pulleys 300 are each connected by a belt 14. In other embodiments, a tensioning pulley 5 is disposed between the two rotating shafts 11, and the position of the tensioning pulley 5 is adjustable to adjust the tightness of the belt 14, and the belt 14 connecting the adjacent two rotating shafts 11 can be prevented. Slip.
需要说明的是,驱动电机12带动其中一根转轴11旋转。由于任意相邻两根转轴11之间均通过皮带14连接,因此所有的转轴11均沿同一方向转动,同时带动其上的传送轮10转动,从而使传送轮10带着基板架15移动,实现基板架15的传送。It should be noted that the driving motor 12 drives one of the rotating shafts 11 to rotate. Since any two adjacent rotating shafts 11 are connected by the belt 14, all the rotating shafts 11 rotate in the same direction, and at the same time, the conveying wheel 10 thereon is rotated, so that the conveying wheel 10 moves with the substrate holder 15 to realize The transfer of the substrate holder 15.
为了保证基板架15能够按照规定路线移动,防止其跑偏。在一些实施例中,如图4所示,传送轮10采用槽轮。基于此,如图6所示,由于所述基板架回传装置用于传送基板架15,因此,在一些实施例中,所述基板架回传装置还包括基板架15,基板架15的底部设有两根平形布置的导杆16。参考图4所示,两根导杆16分别与两个安装槽13内的槽轮配合,即,两根导杆16置于两个安装槽13内的槽轮的槽内,这样在基板架15传送过程中,基板架15底部的导杆16沿着传送轮10上的沟槽移动,有效防止跑偏,而且二者之间的接触面积增大,增加了摩擦力,还可以起到防止打滑的作用。In order to ensure that the substrate holder 15 can move according to a prescribed route, it is prevented from running off. In some embodiments, as shown in Figure 4, the transfer wheel 10 employs a sheave. Based on this, as shown in FIG. 6, since the substrate holder returning device is used to transport the substrate holder 15, in some embodiments, the substrate holder returning device further includes a substrate holder 15, the bottom of the substrate holder 15. There are two guide rods 16 arranged in a flat shape. Referring to FIG. 4, the two guide rods 16 are respectively engaged with the sheaves in the two mounting slots 13, that is, the two guide rods 16 are placed in the slots of the sheaves in the two mounting slots 13, so that the substrate holder During the transfer process, the guide rod 16 at the bottom of the substrate holder 15 moves along the groove on the transfer wheel 10, effectively preventing the deviation, and the contact area between the two is increased, the friction is increased, and the friction can be prevented. The role of slipping.
本公开一些实施例提供了一种应用于所述基板架回传装置的基板架回传方法,如图7所示,包括:Some embodiments of the present disclosure provide a substrate carrier return method applied to the substrate carrier return device, as shown in FIG. 7 , including:
S1、位于镀膜设备进口端X1的基板架升降回传装置2将基板架15举升,并传送至传送带4上,传送带4将基板架15从镀膜设备3进口端X1传送至镀膜设备出口端X2,并将基板架15传送至位于镀膜设备出口端X2且处于上升状态的基板架升降回传装置2上。S1, the substrate holder lifting and returning device 2 at the inlet end X1 of the coating device lifts the substrate holder 15 and transports it to the conveyor belt 4, and the conveyor belt 4 transports the substrate holder 15 from the inlet end X1 of the coating device 3 to the outlet end X2 of the coating device. And transporting the substrate holder 15 to the substrate holder lifting and returning device 2 at the outlet end X2 of the coating apparatus and in an ascending state.
S2、位于镀膜设备出口端X2的基板架升降回传装置2带着基板架15下降,并将基板架15传送至基板架传送装置1上。S2, the substrate rack lifting and lowering device 2 at the exit end X2 of the coating device is lowered with the substrate holder 15, and the substrate holder 15 is transferred to the substrate holder conveying device 1.
S3、基板架传送装置1将基板架15从镀膜设备3的底部回传至位于镀膜设备进口端X1且处于下降状态的基板架升降回传装置2上,完成循环回传基板架15的一个回传过程。S3, the substrate holder conveying device 1 returns the substrate holder 15 from the bottom of the coating device 3 to the substrate holder lifting and returning device 2 at the inlet end X1 of the coating device and in a descending state, and completes a loopback of the substrate holder 15 Pass the process.
在一些实施例中,一种应用于所述基板架回传装置的基板架回传方法包括:In some embodiments, a substrate carrier return method applied to the substrate carrier return device includes:
S10、位于镀膜设备进口端X1的基板架升降回传装置2将基板架15举升,并传送至传送带4上,传送带4将基板架15从镀膜设备进口端X1传送至镀膜设备出口端X2,并将基板架15传送至位于镀膜设备出口端X2且处于上升至第四预设位置的基板架升降回传装置2上;在基板架15被传送带4传送的过程中,位于镀膜设备进口端X1的基板架升降回传装置2下降至第三预设位置。S10. The substrate rack lifting and lowering device 2 at the inlet end X1 of the coating device lifts the substrate holder 15 and transports it to the conveyor belt 4. The conveyor belt 4 transports the substrate holder 15 from the coating device inlet end X1 to the coating device outlet end X2. And transporting the substrate holder 15 to the substrate rack lifting and lowering device 2 at the outlet end X2 of the coating device and rising to the fourth preset position; in the process of conveying the substrate holder 15 by the conveyor belt 4, at the inlet end X1 of the coating device The substrate holder lifting and returning device 2 is lowered to a third preset position.
在步骤S10中,通过位于镀膜设备进口端X2的基板架升降回传装置2将基板架15举升的过程,也即是基板架15上升的过程。传送带4将基板架15从镀膜设备进口端X1传送至镀膜设备出口端X2,并将基板架15传送至位于镀膜设备出口端X2且处于上升状态的基板架升降回传装置2上的过程,即是基板架15被传送的过程。In step S10, the substrate holder 15 is lifted by the substrate holder lifting/returning device 2 at the inlet end X2 of the coating device, that is, the process in which the substrate holder 15 is raised. The conveyor belt 4 transports the substrate holder 15 from the coating device inlet end X1 to the coating device outlet end X2, and transfers the substrate holder 15 to the substrate holder lifting and returning device 2 at the outlet end X2 of the coating device and is in a rising state, that is, It is a process in which the substrate holder 15 is transported.
在一些实施例中,该第三预设位置是指与基板架传送装置1平齐的位置。在一些 实施例中,该第四预设位置是指与传送带4平齐的位置。In some embodiments, the third predetermined position refers to a position that is flush with the substrate holder transport device 1. In some embodiments, the fourth predetermined position refers to a position that is flush with the conveyor belt 4.
S20、位于镀膜设备出口端X2的基板架升降回传装置2带着基板架15下降,并将基板架15传送至基板架传送装置1上。S20, the substrate rack lifting and lowering device 2 at the exit end X2 of the coating device is lowered with the substrate holder 15, and the substrate holder 15 is transferred to the substrate holder conveying device 1.
S30、基板架传送装置1将基板架15从镀膜设备3的底部回传至位于镀膜设备进口端X1且处于第三预设位置的基板架升降回传装置2上,完成一个工作循环;在基板架15回传的过程中,位于镀膜设备出口端X2的基板架升降回传装置2上升至第四预设位置。S30, the substrate holder conveying device 1 returns the substrate holder 15 from the bottom of the coating device 3 to the substrate holder lifting and returning device 2 at the inlet end X1 of the coating device and at a third preset position, to complete a working cycle; During the process of returning the frame 15, the substrate holder lifting and returning device 2 at the outlet end X2 of the coating device rises to a fourth predetermined position.
需要说明的是,第三预设位置和第四预设位置中的“第三”和“第四”仅为区分该两个预设位置。It should be noted that “third” and “fourth” in the third preset position and the fourth preset position only distinguish the two preset positions.
本公开的一些实施例提供一种全自动镀膜机,如图8所示,包括镀膜设备3、上片设备7、回传装置17和下片设备18。镀膜设备3包括多个等间距平行布置且贯穿整个镀膜设备3的传送带4,相邻两个传动带4之间形成第一缝隙400(如图9和图10所示),且每个传送带4的两端分别伸入上片设备7和下片设备18内。回传装置17设于镀膜设备3的下方,且回传装置17为上述的基板架回传装置,回传装置17的两端分别位于上片设备7和下片设备18内。Some embodiments of the present disclosure provide a fully automatic coater, as shown in FIG. 8, including a coating apparatus 3, a sheeting apparatus 7, a returning device 17, and a lowering apparatus 18. The coating device 3 comprises a plurality of conveyor belts 4 arranged in parallel at equal intervals and extending through the entire coating device 3, a first slit 400 is formed between two adjacent belts 4 (as shown in Figures 9 and 10), and each conveyor belt 4 Both ends extend into the upper sheet device 7 and the lower sheet device 18, respectively. The return device 17 is disposed below the coating device 3, and the return device 17 is the substrate carrier return device described above, and both ends of the return device 17 are located in the upper device 7 and the lower device 18, respectively.
在一些实施例中,回传装置17的两端分别位于上片设备7和下片设备18内,即回传装置17两侧的基板架升降回传装置2分别位于上片设备7和下片设备18内。In some embodiments, the two ends of the backhaul device 17 are respectively located in the upper device 7 and the lower device 18, that is, the substrate rack lifting and transmitting device 2 on both sides of the return device 17 are respectively located in the upper device 7 and the lower device. Within device 18.
上片设备7与镀膜设备进口端X1连接,配置为将玻璃基片500转送并放置在位于传送带4进口端的基板架15上。The top sheet device 7 is coupled to the coating device inlet end X1 and is configured to transfer and place the glass substrate 500 on the substrate holder 15 at the inlet end of the conveyor belt 4.
下片设备18与镀膜设备出口端X1连接,配置为将位于传送带4出口端的基板架15上的玻璃基片500转送出,并送入下一工位。The lower sheet device 18 is coupled to the coating device outlet end X1 and configured to transfer the glass substrate 500 on the substrate holder 15 at the outlet end of the conveyor belt 4 and feed it to the next station.
在一些实施例中,上片设备7和下片设备18内还设有备用基板架存放区,配置为储存备用基板架15。即用一套备一套基板架15,防止意外情况发生,时刻保证设备的正常运行。In some embodiments, the top sheet device 7 and the lower sheet device 18 are further provided with a spare substrate holder storage area configured to store the spare substrate holder 15. That is to use a set of substrate holders 15 to prevent accidents and ensure the normal operation of the equipment at all times.
在一些实施例中,如图8所示,上片设备7与下片设备18结构相同,且相对于镀膜设备3对称设置,从而节省占地空间。In some embodiments, as shown in FIG. 8, the top sheet device 7 is identical in structure to the lower sheet device 18 and symmetrically disposed relative to the coating device 3, thereby saving floor space.
在一些实施例中,如图9所示,上片设备7包括第一基片传送带I-19、第一基片举升机构I-20、第一基片转送机构I-21和第一基片顶升机构22。In some embodiments, as shown in FIG. 9, the wafer loading apparatus 7 includes a first substrate transfer belt I-19, a first substrate lifting mechanism I-20, a first substrate transfer mechanism I-21, and a first base. The sheet lifting mechanism 22 is provided.
第一基片传送带I-19垂直于回传装置17,即,第一基片传送带I-19的长度方向(或者传送方向)垂直于回传装置17,且第一基片传送带I-19靠近基板架升降回传装置2设置。第一基片传送带I-19配置为将玻璃基片送入上片设备7内。The first substrate transfer belt I-19 is perpendicular to the returning device 17, i.e., the length direction (or conveying direction) of the first substrate conveying belt I-19 is perpendicular to the returning device 17, and the first substrate conveying belt I-19 is close to The substrate holder lifting and returning device 2 is disposed. The first substrate transfer belt I-19 is configured to feed the glass substrate into the top sheet device 7.
全自动镀膜机还包括与回传装置17平行设置的第一行走轨道I-23,第一基片转送机构I-21可滑动地安装在第一行走轨道I-23上。第一基片转送机构I-21在第一行走轨道I-23上具有第一预设位置Y1和第二预设位置Y2,第一预设位置Y1位于第一基片传送带I-19的正上方,第二预设位置Y2与第一基片顶升机构I-22相对。第一基片转送机构I-21配置为在滑动至第二预设位置Y2时伸长运动,将玻璃基片转送至传送带4的正上方。The fully automatic coater further includes a first travel track I-23 disposed in parallel with the return device 17, and the first substrate transfer mechanism I-21 is slidably mounted on the first travel track I-23. The first substrate transfer mechanism I-21 has a first preset position Y1 and a second preset position Y2 on the first traveling track I-23, and the first preset position Y1 is located on the first substrate transfer belt I-19. Above, the second preset position Y2 is opposite to the first substrate jacking mechanism I-22. The first substrate transfer mechanism I-21 is configured to elongate while sliding to the second preset position Y2 to transfer the glass substrate directly above the conveyor belt 4.
第一基片举升机构I-20设于第一基片传送带I-19与基板架升降回传装置2之间。第一基片举升机构I-20相对第一基片传送带I-19沿垂直第一基片传送带I-19的方向做 升降运动。第一基片举升机构I-20配置为在顶升时举升第一基片传送带I-19上的玻璃基片500,在降落时降落玻璃基片500并放置在滑动至第一预设Y1位置的第一基片转送机构I-21上。The first substrate lifting mechanism I-20 is disposed between the first substrate transfer belt I-19 and the substrate holder lifting and returning device 2. The first substrate lifting mechanism I-20 moves up and down in a direction perpendicular to the first substrate conveying belt I-19 with respect to the first substrate conveying belt I-19. The first substrate lift mechanism I-20 is configured to lift the glass substrate 500 on the first substrate transfer belt I-19 when jacked up, drop the glass substrate 500 when landing, and place it on the first preset The first substrate transfer mechanism I-21 at the Y1 position.
第一基片顶升机构I-22设于镀膜设备3的传送带4进口端的下方(即,第一基片顶升机构I-22设于传送带4进口端靠近基板架升降回传装置2的下方)。第一基片顶升机构I-22配置为在顶升时顶起第一基片转送机构I-21上的玻璃基片500,在降落时降落玻璃基片500并放置在位于传送带4上的基板架15上。The first substrate jacking mechanism I-22 is disposed below the inlet end of the conveyor belt 4 of the coating device 3 (ie, the first substrate jacking mechanism I-22 is disposed at the inlet end of the conveyor belt 4 below the substrate rack lifting and returning device 2) ). The first substrate jacking mechanism I-22 is configured to jack up the glass substrate 500 on the first substrate transfer mechanism I-21 when jacking up, drop the glass substrate 500 at the time of landing, and place it on the conveyor belt 4. On the substrate holder 15.
在一些实施例中,上片设备7内的第一基片传送带I-19将玻璃基片500送入上片设备7内,第一基片举升机构I-20先做顶升运动将玻璃基片500从第一基片传送带I-19上举升取下,后做降落运动将玻璃基片500放置在位于第一预设位置Y1的第一基片转送机构I-21上。第一基片转送机构I-21滑动至第二预设位置Y2,并将玻璃基片500转送至传送带4的正上方,第一基片顶升机构I-22先做顶升运动顶起第一基片转送机构I-21上的玻璃基片500,后做降落运动将玻璃基片500放置在位于传送带4上的基板架15上。In some embodiments, the first substrate transfer belt I-19 in the top sheet device 7 feeds the glass substrate 500 into the top sheet device 7, and the first substrate lift mechanism I-20 first performs a lifting motion to the glass. The substrate 500 is lifted off from the first substrate transfer belt I-19, and then subjected to a falling motion to place the glass substrate 500 on the first substrate transfer mechanism I-21 at the first preset position Y1. The first substrate transfer mechanism I-21 slides to the second preset position Y2, and transfers the glass substrate 500 directly above the conveyor belt 4. The first substrate lifting mechanism I-22 first performs the jacking motion. The glass substrate 500 on a substrate transfer mechanism I-21 is then subjected to a falling motion to place the glass substrate 500 on the substrate holder 15 on the conveyor belt 4.
在一些实施例中,如图10所示,下片设备18包括第二基片传送带Ⅱ-19、第二基片举升机构Ⅱ-20、第二基片转送机构Ⅱ-21、第二基片顶升机构Ⅱ-22和第二行走轨道Ⅱ-23。In some embodiments, as shown in FIG. 10, the lower sheet device 18 includes a second substrate transfer belt II-19, a second substrate lift mechanism II-20, a second substrate transfer mechanism II-21, and a second base. The top lift mechanism II-22 and the second travel track II-23.
第二基片转送机构Ⅱ-21可滑动地设置在第二行走轨道Ⅱ-23上;第二基片转送机构Ⅱ-21在第二行走轨道Ⅱ-23上具有第五预设位置Y5和第六预设位置Y6,第五预设位置Y5位于第二基片传送带Ⅱ-19的正上方,第六预设位置Y6与第二基片顶升机构Ⅱ-22相对。The second substrate transfer mechanism II-21 is slidably disposed on the second traveling track II-23; the second substrate transfer mechanism II-21 has a fifth preset position Y5 and the second on the second traveling track II-23 Six preset positions Y6, the fifth preset position Y5 is located directly above the second substrate conveyor belt II-19, and the sixth preset position Y6 is opposite to the second substrate jacking mechanism II-22.
第二基片转送机构Ⅱ-21配置为在滑动至第六预设位置Y6时伸长运动。The second substrate transfer mechanism II-21 is configured to elongate motion when sliding to the sixth preset position Y6.
第二基片顶升机构Ⅱ-22设于传送带4出口端的下方。第二基片顶升机构Ⅱ-22配置为在顶升时顶起位于传送带4上的基板架15上的玻璃基片500,在降落时降落玻璃基片500并放置在滑动至第六预设位置Y6时伸长的第二基片转送机构Ⅱ-21上。The second substrate lifting mechanism II-22 is disposed below the outlet end of the conveyor belt 4. The second substrate jacking mechanism II-22 is configured to lift the glass substrate 500 on the substrate holder 15 on the conveyor belt 4 when jacking up, to drop the glass substrate 500 during landing and to slide it to the sixth preset At the position Y6, the second substrate transfer mechanism II-21 is elongated.
第二基片举升机构Ⅱ-20相对第二基片传送带Ⅱ-19沿垂直第二基片传送带Ⅱ-19的方向移动;第二基片举升机构Ⅱ-20配置为在顶升时举升滑动至第五预设位置Y5的第二基片转送机构Ⅱ-21上的玻璃基片500,在降落时降落玻璃基片500并放置在第二基片传送带Ⅱ-19上。The second substrate lifting mechanism II-20 moves in a direction perpendicular to the second substrate conveying belt II-19 with respect to the second substrate conveying belt II-19; the second substrate lifting mechanism II-20 is configured to be lifted at the time of jacking The glass substrate 500 on the second substrate transfer mechanism II-21 slid to the fifth preset position Y5 is dropped onto the glass substrate 500 and placed on the second substrate transfer belt II-19.
第二基片传送带Ⅱ-19配置为将玻璃基片500送出下片设备18,并送入下一工位。The second substrate transfer belt II-19 is configured to feed the glass substrate 500 out of the lower sheet device 18 and to the next station.
下片设备18内的第二基片顶升机构Ⅱ-22做顶升运动顶起基板架15上的玻璃基片,位于第六预设位置Y6的第二基片转送机构Ⅱ-21接住传送带4正上方的玻璃基片500并滑动至第五预设位置Y5,将玻璃基片500转运至第二基片传送带Ⅱ-19的正上方。第二基片举升机构Ⅱ-20先做顶升运动举升接取第二基片传送带Ⅱ-19正上方的玻璃基片500,后做降落运动将其放在第二基片传送带Ⅱ-19上,第二基片传送带Ⅱ-19将玻璃基片500送出下片设备18,并送入下一工位。The second substrate jacking mechanism II-22 in the lower sheet device 18 performs the jacking motion to lift the glass substrate on the substrate holder 15, and the second substrate transfer mechanism II-21 located at the sixth preset position Y6 catches The glass substrate 500 directly above the conveyor belt 4 is slid to the fifth predetermined position Y5 to transport the glass substrate 500 directly above the second substrate conveyor belt II-19. The second substrate lifting mechanism II-20 first performs the jacking motion lifting to pick up the glass substrate 500 directly above the second substrate conveyor belt II-19, and then performs a falling motion to place it on the second substrate conveyor belt II- At 19, the second substrate transfer belt II-19 feeds the glass substrate 500 out of the lower sheet device 18 and feeds it to the next station.
基于此,该全自动镀膜机可以自动完成玻璃基片的上片、下片以及镀膜工作,实现全自动化控制,整个过程无需人工操作。Based on this, the fully automatic coating machine can automatically complete the upper, lower and coating work of the glass substrate, realize full automatic control, and the whole process does not require manual operation.
在一些实施例中,如图11所示,第一基片举升机构I-20和第二基片举升机构Ⅱ-20 均包括第一举升叉50和举升缸40,第一举升叉50包括多个第一插杆25、第一插杆连接杆26和举升缸连接杆27。多个第一插杆25等间距平行固定在第一插杆连接杆26上,第一插杆连接杆26通过举升缸连接杆27与举升缸40的伸缩端41固定连接。In some embodiments, as shown in FIG. 11, the first substrate lifting mechanism I-20 and the second substrate lifting mechanism II-20 each include a first lifting fork 50 and a lifting cylinder 40, the first The lift fork 50 includes a plurality of first plungers 25, a first plunger connecting rod 26, and a lift cylinder connecting rod 27. The plurality of first plungers 25 are fixed in parallel at equal intervals to the first plunger connecting rod 26, and the first plunger connecting rod 26 is fixedly coupled to the telescopic end 41 of the lift cylinder 40 via the lift cylinder connecting rod 27.
如图11所示,第一基片传送带I-19为多个,且相互等间距平行布置(即,任意相邻两个第一基片传送带I-19之间形成第二缝隙191,第一基片举升机构I-20的第一插杆25与第一基片传送带I-19之间的第二缝隙191一一相对设置,能够使第一插杆25升降通过相邻第一基片传送带I-19之间的第二缝隙191,即,第一插杆25的宽度小于第一基片传送带I-19之间的第二缝隙191。如图11所示,第二基片传送带Ⅱ-19为多个,且相互等间距平行布置(即,任意相邻两个第二基片传送带Ⅱ-19之间形成第二缝隙191),第二基片举升机构Ⅱ-20的第一插杆25与第二基片传送带Ⅱ-19之间的第二缝隙191一一相对设置,能够使第一插杆25升降通过相邻的第二基片传送带Ⅱ-19之间的第二缝隙191,即,第一插杆25的宽度小于第二基片传送带Ⅱ-19之间的第二缝隙191。As shown in FIG. 11, the first substrate transfer belts I-19 are plural, and are arranged in parallel with each other at equal intervals (that is, a second slit 191 is formed between any adjacent two first substrate transfer belts I-19, first The first plunger 25 of the substrate lifting mechanism I-20 is disposed opposite to the second slit 191 between the first substrate conveying belts I-19, so that the first plunger 25 can be lifted and lowered through the adjacent first substrate. The second slit 191 between the conveyor belts I-19, that is, the width of the first plunger 25 is smaller than the second slit 191 between the first substrate conveyors I-19. As shown in Fig. 11, the second substrate conveyor belt II -19 are plural and arranged in parallel with each other at equal intervals (ie, a second slit 191 is formed between any two adjacent second substrate conveyor belts II-19), and the first of the second substrate lifting mechanism II-20 The second slit 191 between the plunger 25 and the second substrate transfer belt II-19 is disposed opposite to each other, and the first plunger 25 can be lifted and lowered through the second gap between the adjacent second substrate conveyors II-19. 191, that is, the width of the first plunger 25 is smaller than the second slit 191 between the second substrate conveyors II-19.
如此,对于上片设备7来说,第一基片举升机构I-20实现将玻璃基片500从第一基片传送带I-19上取下,并放置在第一基片转送机构I-21上。对于下片设备18来说,第二基片举升机构Ⅱ-20实现将玻璃基片500从第二基片转送机构Ⅱ-2上取下,并放置在第二基片传送带Ⅱ-19上。Thus, for the wafer apparatus 7, the first substrate lifting mechanism I-20 realizes that the glass substrate 500 is removed from the first substrate transfer belt I-19 and placed on the first substrate transfer mechanism I- 21 on. For the lower sheet device 18, the second substrate lifting mechanism II-20 realizes that the glass substrate 500 is removed from the second substrate transfer mechanism II-2 and placed on the second substrate transfer belt II-19. .
在一些实施例中,如图12所示,第一基片转送机构I-21和第二基片转送机构Ⅱ-21均包括第二举升叉60、伸缩缸28、滑块29和滑座30。In some embodiments, as shown in FIG. 12, the first substrate transfer mechanism I-21 and the second substrate transfer mechanism II-21 each include a second lift fork 60, a telescopic cylinder 28, a slider 29, and a carriage. 30.
第一基片转送机构I-21的滑座30可滑动地设置在第一行走轨道I-23上;第二基片转送机构Ⅱ-21的滑座30可滑动地设置在第二行走轨道Ⅱ-23上。The carriage 30 of the first substrate transfer mechanism I-21 is slidably disposed on the first traveling rail I-23; the carriage 30 of the second substrate transfer mechanism II-21 is slidably disposed on the second traveling rail II -23.
滑块29可滑动地设置在滑座30上。The slider 29 is slidably disposed on the carriage 30.
伸缩缸28固定在滑块29上。The telescopic cylinder 28 is fixed to the slider 29.
第二举升叉60包括多个第二插杆36和第二插杆连接杆37;多个第二插杆36等间距固定在第二插杆连接杆37上;第二插杆连接杆37固定在伸缩缸28的伸缩端281。第二举升叉60通过伸缩缸28固定在滑块29上。第二举升叉60在伸缩缸28的带动下做伸缩运动。The second lift fork 60 includes a plurality of second plungers 36 and a second plunger connecting rod 37; the plurality of second plungers 36 are equally spaced on the second plunger connecting rod 37; the second plunger connecting rods 37 It is fixed to the telescopic end 281 of the telescopic cylinder 28. The second lift fork 60 is fixed to the slider 29 by a telescopic cylinder 28. The second lift fork 60 is telescopically moved by the telescopic cylinder 28.
如此,对于上片设备7来说,第一基片转送机构I-21实现在第一行走轨道I-23上的滑动,并在滑动至第二预设位置Y2时,通过伸长运动将玻璃基片500转送至传送带4的正上方。对于下片设备18来说,第二基片转送机构Ⅱ-21实现在滑动至第六预设位置Y6时伸长运动,从而接取传送带4正上方的玻璃基片500并滑动至第五预设位置Y5,将玻璃基片500转运至第二基片传送带Ⅱ-19的正上方。Thus, for the top sheet device 7, the first substrate transfer mechanism I-21 realizes sliding on the first traveling rail I-23, and when sliding to the second preset position Y2, the glass is extended by the stretching motion. The substrate 500 is transferred directly above the conveyor belt 4. For the lower sheet device 18, the second substrate transfer mechanism II-21 realizes an elongation movement when sliding to the sixth preset position Y6, thereby picking up the glass substrate 500 directly above the conveyor belt 4 and sliding it to the fifth pre- With the position Y5, the glass substrate 500 is transported directly above the second substrate transfer belt II-19.
在一些实施例中,如图12所示,第一行走轨道I-23和第二行走轨道Ⅱ-23均包括平行设置的上轨231、中轨232和下轨233。第一基片转送机构I-21的滑座30与第一行走轨道I-23的上轨231、中轨232和下轨233滑动连接。第二基片转送机构Ⅱ-21的滑座30与第二行走轨道Ⅱ-23的上轨231、中轨232和下轨233滑动连接。In some embodiments, as shown in FIG. 12, the first travel track I-23 and the second travel track II-23 each include an upper rail 231, a middle rail 232, and a lower rail 233 that are disposed in parallel. The carriage 30 of the first substrate transfer mechanism I-21 is slidably coupled to the upper rail 231, the middle rail 232, and the lower rail 233 of the first traveling rail I-23. The carriage 30 of the second substrate transfer mechanism II-21 is slidably coupled to the upper rail 231, the middle rail 232, and the lower rail 233 of the second traveling rail II-23.
基于此,不管是第一行走轨道I-23,还是第二行走轨道Ⅱ-23,通过将其设置为包括上轨231、中轨232和下轨233,并使滑座30与上轨231、中轨232和下轨233滑动连接,可保证滑座30平稳滑动。Based on this, whether it is the first traveling track I-23 or the second traveling track II-23, by setting it to include the upper rail 231, the middle rail 232, and the lower rail 233, and the carriage 30 and the upper rail 231, The middle rail 232 and the lower rail 233 are slidably connected to ensure smooth sliding of the slider 30.
在一些实施例中,如图12所示,第一基片转送机构I-21和第二基片转送机构Ⅱ-21均还包括第一伺服电机31和第一齿条33。第一齿条33固定安装在中轨232上。第一伺服电机31固定在滑块29上,第一伺服电机31连接有与第一齿条33相啮合的第一齿轮71(如图13所示)。In some embodiments, as shown in FIG. 12, the first substrate transfer mechanism I-21 and the second substrate transfer mechanism II-21 each further include a first servo motor 31 and a first rack 33. The first rack 33 is fixedly mounted on the middle rail 232. The first servo motor 31 is fixed to the slider 29, and the first servo motor 31 is connected with a first gear 71 (shown in Fig. 13) that meshes with the first rack 33.
通过将第一齿条33固定安装在中轨232上,并使第一伺服电机31连接有与第一齿条33相啮合的第一齿轮71,可使第一伺服电机31跟随滑块29沿中轨232延伸方向滑动,但又不会对滑块29产生大的作用力,避免使滑块29变形。By fixing the first rack 33 to the middle rail 232 and connecting the first servo motor 31 with the first gear 71 meshing with the first rack 33, the first servo motor 31 can follow the slider 29 The middle rail 232 slides in the extending direction, but does not exert a large force on the slider 29 to avoid deforming the slider 29.
在一些实施例中,如图12所示,滑座30的一侧具有两条沿竖直方向平行布置的第二滑轨34,滑块29通过第二滑轨34可滑动地安装在滑座30上。基于此,当滑块29沿第二滑轨34在滑座30上滑动时,可带动第二举升叉60上下移动。In some embodiments, as shown in FIG. 12, one side of the carriage 30 has two second slide rails 34 arranged in parallel in the vertical direction, and the slider 29 is slidably mounted on the carriage by the second slide rail 34. 30 on. Based on this, when the slider 29 slides on the carriage 30 along the second slide rail 34, the second lift fork 60 can be moved up and down.
在一些实施例中,如图12所示,第一基片转送机构I-21和第二基片转送机构Ⅱ-21均还包括第二伺服电机32和第二齿条35。第二齿条35设置在滑座30上,且与第二滑轨34平行布置;第二伺服电机32固定在滑块29上,第二伺服电机32连接有与第二齿条35相啮合的第二齿轮72(如图14所示)。基于此,可使第二伺服电机32跟随滑块29沿竖直方向滑动,但又不会对滑块29产生大的作用力,避免使滑块29变形。In some embodiments, as shown in FIG. 12, the first substrate transfer mechanism I-21 and the second substrate transfer mechanism II-21 each further include a second servo motor 32 and a second rack 35. The second rack 35 is disposed on the carriage 30 and disposed in parallel with the second rail 34; the second servo motor 32 is fixed on the slider 29, and the second servo motor 32 is coupled to the second rack 35. The second gear 72 (shown in Figure 14). Based on this, the second servo motor 32 can be slid in the vertical direction following the slider 29, but does not exert a large force on the slider 29 to avoid deformation of the slider 29.
在一些实施例中,如图15所示,第一基片顶升机构I-22和第二基片顶升机构Ⅱ-22均包括底座38和多个可伸缩运动的顶升缸39。顶升缸39固定在底座38上,每个顶升缸39配置为在伸缩时通过相邻两个传送带4之间的第一缝隙400,并通过相邻两个第二插杆36之间的间隙。In some embodiments, as shown in FIG. 15, the first substrate jacking mechanism I-22 and the second substrate jacking mechanism II-22 each include a base 38 and a plurality of telescopically movable jacks 39. The jacking cylinders 39 are fixed to the base 38, and each jacking cylinder 39 is configured to pass through the first gap 400 between the adjacent two conveyor belts 4 when telescopic, and between the adjacent two second plungers 36 gap.
其中,顶升缸39的数量至少为三个。Among them, the number of jacking cylinders 39 is at least three.
在一些实施例中,顶升缸39伸长通过传送带4之间的第一缝隙400和第二插杆36之间的间隙,实现顶起玻璃基片,即,顶升缸39的伸缩端的宽度小于相邻两个传送带4之间的第一缝隙400,并小于相邻两个第二插杆36之间的间隙。如此,对于上片设备7来说,第一基片顶升机构I-22实现将玻璃基片500从第一基片转送机构I-21上的第二举升叉60上取下,并放置在传送带4上的基板架15上。对于下片设备18来说,第二基片顶升机构Ⅱ-22实现将玻璃基片500从基板架15上取下并放置在第二基片转送机构Ⅱ-21上的第二举升叉60上。In some embodiments, the jacking cylinder 39 extends through the gap between the first slot 400 and the second plunger 36 between the conveyor belts 4 to effect the width of the telescoping end of the jacking glass substrate, i.e., the jacking cylinder 39. It is smaller than the first slit 400 between the adjacent two conveyor belts 4 and smaller than the gap between the adjacent two second plungers 36. Thus, for the wafer apparatus 7, the first substrate lifting mechanism I-22 removes the glass substrate 500 from the second lifting fork 60 on the first substrate transfer mechanism I-21, and places it. On the substrate holder 15 on the conveyor belt 4. For the lower sheet device 18, the second substrate lift mechanism II-22 implements a second lift fork that removes the glass substrate 500 from the substrate holder 15 and places it on the second substrate transfer mechanism II-21. 60 on.
下面基于包括上片设备7、回传装置17和下片设备18的全自动镀膜机,说明全自动镀膜机的工作原理。The working principle of the automatic coating machine will be described below based on a fully automatic coating machine including the upper sheet device 7, the returning device 17, and the lower sheet device 18.
上片流程为:基板架15通过基板架传送装置1传至位于镀膜设备进口端X1的基板架升降回传装置2上,基板架升降回传装置2的升降装置8伸长并将第二回传主体200抬高。当第二回传主体200与镀膜设备3的传送带4平齐时,升降装置8停止伸长。同时,第二回传主体200上的驱动电机12开始工作,传送轮10带动基板架15移动,将基板架15送至传送带4上。当基板架15在传送带4上运动至第一基片顶升机构I-22的正上方位置后传送带4停止运转,等待放置玻璃基片500。在基板架15送至传送带4上后,升降装置8收缩并带着第二回传主体200下降,与基板架传送装置1对接。The upper sheet process is: the substrate holder 15 is transferred to the substrate holder lifting and returning device 2 at the inlet end X1 of the coating device through the substrate holder conveying device 1, and the lifting device 8 of the substrate holder lifting and returning device 2 is extended and the second time is The main body 200 is raised. When the second return main body 200 is flush with the conveyor belt 4 of the coating apparatus 3, the lifting device 8 stops elongating. At the same time, the drive motor 12 on the second return main body 200 starts to operate, and the transfer wheel 10 drives the substrate holder 15 to move, and the substrate holder 15 is sent to the conveyor belt 4. When the substrate holder 15 is moved on the conveyor belt 4 to a position directly above the first substrate lifting mechanism I-22, the conveyor belt 4 is stopped, waiting for the glass substrate 500 to be placed. After the substrate holder 15 is fed onto the conveyor belt 4, the lifting device 8 is contracted and lowered with the second return main body 200 to be in contact with the substrate holder conveying device 1.
在基板架15传送的过程中,玻璃基片500通过第一基片传送带I-19运入上片设备7内,并在玻璃基片500到达第一基片举升机构I-20的第一举升叉50正上方位置 后第一基片传送带I-19停止运行。第一基片举升机构I-20的举升缸40伸长,位于第一基片传送带I-19下方的第一举升叉50上升的过程中托起玻璃基片500,并上升至高于第一基片转送机构I-21的第二举升叉60高度的位置后停止上升。第一基片转送机构I-21在第一伺服电机31的驱动作用下沿第一行走轨道I-23运动至第一预设位置Y1,此时第一基片转送机构I-21上的第二举升叉60恰好位于玻璃基片500的正下方。通过第一基片举升机构I-20的举升缸40收缩,使玻璃基片500放在第二举升叉60上。然后,第一举升叉50在举升缸40收缩的带动下,一直运行至第一基片传送带I-19的下方等待接取下一块玻璃基片500。第一基片转送机构I-21在第一伺服电机31的驱动作用下运动至第二预设位置Y2(与基板架15相对的位置),然后伸缩缸28伸长,将玻璃基片500送至基板架15的正上方。位于传送带4下方的第一基片顶升机构I-22的顶升缸39伸长穿过基板架15并顶起玻璃基片500,使玻璃基片500与第二举升60叉分离。之后,伸缩缸28收缩并返回初始位置,顶升缸39收缩并带着玻璃基片500下降,玻璃基片500落在基板架15上。传送带4带着基板架15和玻璃基片500一同进入镀膜设备3内进行镀膜工序。完成镀膜工序后进入下片设备18内。During the transfer of the substrate holder 15, the glass substrate 500 is carried into the upper sheet device 7 through the first substrate transfer belt I-19, and reaches the first of the first substrate lifting mechanism I-20 at the glass substrate 500. The first substrate transfer belt I-19 is stopped after the lift fork 50 is positioned directly above. The lift cylinder 40 of the first substrate lifting mechanism I-20 is elongated, and the glass substrate 500 is lifted up during the rise of the first lift fork 50 under the first substrate transfer belt I-19, and rises above The position of the height of the second lift fork 60 of the first substrate transfer mechanism I-21 stops rising. The first substrate transfer mechanism I-21 moves along the first traveling track I-23 to the first preset position Y1 under the driving action of the first servo motor 31, and at this time, the first substrate transfer mechanism I-21 The two lift forks 60 are located just below the glass substrate 500. The glass substrate 500 is placed on the second lift fork 60 by contraction of the lift cylinder 40 of the first substrate lifting mechanism I-20. Then, the first lift fork 50 is driven by the contraction of the lift cylinder 40 until it is under the first substrate transfer belt I-19 to wait for the next glass substrate 500. The first substrate transfer mechanism I-21 is moved to the second preset position Y2 (position opposite to the substrate holder 15) by the driving of the first servo motor 31, and then the telescopic cylinder 28 is elongated to send the glass substrate 500. Up to the top of the substrate holder 15. The jacking cylinder 39 of the first substrate jacking mechanism I-22 located below the conveyor belt 4 extends through the substrate holder 15 and lifts up the glass substrate 500 to separate the glass substrate 500 from the second lift 60 fork. Thereafter, the telescopic cylinder 28 is contracted and returned to the initial position, the jacking cylinder 39 is contracted and lowered with the glass substrate 500, and the glass substrate 500 is dropped on the substrate holder 15. The conveyor belt 4 carries the substrate holder 15 and the glass substrate 500 together into the coating apparatus 3 to perform a coating process. After the coating process is completed, it enters the lower sheet device 18.
卸片流程为:当基板架15连同镀好膜的玻璃基片500运动至传送带4的出口端时传送带4停止运行,下片设备18中第二基片顶升机构Ⅱ-22的顶升缸39伸长并顶起镀好膜的玻璃基片500。第二基片转送机构Ⅱ-21的第二举升叉60在伸缩缸28的伸长作用下运动至镀好膜的玻璃基片500的正下方,顶升缸39收缩将镀好膜的玻璃基片500放置在第二举升叉60上。第二基片转送机构Ⅱ-21的伸缩缸28收缩,使第二举升叉60回复原位,在第一伺服电机31的驱动作用下带着镀好膜的玻璃基片500运行至第二基片传送带Ⅱ-19的正上方(即第五预设位置Y5)。第二基片举升机构Ⅱ-20上的第一举升叉50上升并接取镀好膜的玻璃基片500。然后,第二基片转送机构Ⅱ-21运行至与空的基板架15相对的位置(即第六预设位置Y6)等待接取下一片镀好膜的玻璃基片500,第一举升叉50下降并将镀好膜的玻璃基片500放在第二基片传送带Ⅱ-19上。第二基片传送带Ⅱ-19将镀好膜的玻璃基片送至下一工位。The unloading process is: when the substrate holder 15 moves together with the film-coated glass substrate 500 to the outlet end of the conveyor belt 4, the conveyor belt 4 stops running, and the top substrate of the second substrate lifting mechanism II-22 in the lower sheet device 18 39 elongates and lifts the film-coated glass substrate 500. The second lift fork 60 of the second substrate transfer mechanism II-21 moves under the elongation of the telescopic cylinder 28 directly below the film-coated glass substrate 500, and the lift cylinder 39 contracts to coat the filmed glass. The substrate 500 is placed on the second lift fork 60. The telescopic cylinder 28 of the second substrate transfer mechanism II-21 is contracted to return the second lift fork 60 to the original position, and the glass-coated glass substrate 500 is driven to the second by the driving of the first servo motor 31. Immediately above the substrate transfer belt II-19 (i.e., the fifth preset position Y5). The first lift fork 50 on the second substrate lift mechanism II-20 rises and picks up the film-coated glass substrate 500. Then, the second substrate transfer mechanism II-21 is operated to a position opposite to the empty substrate holder 15 (ie, the sixth preset position Y6), waiting for the next piece of the film-coated glass substrate 500, the first lifting fork The 50 drops and the film-coated glass substrate 500 is placed on the second substrate transfer belt II-19. The second substrate transfer belt II-19 feeds the film-coated glass substrate to the next station.
传送带4将空的基板架15送至回传装置17内位于镀膜设备出口端X2的基板架升降回传装置2上。基板架升降回传装置2的升降装置8收缩,基板架升降回传装置2下降至与基板架传送装置1对接,对接后将空的基板架15传送至基板架传送装置1上。至此,完成一个完整的工作流程。The conveyor belt 4 feeds the empty substrate holder 15 to the substrate holder lifting and returning device 2 at the exit end X2 of the coating apparatus in the returning device 17. The lifting device 8 of the substrate rack lifting and lowering device 2 is contracted, and the substrate rack lifting and lowering device 2 is lowered to be in contact with the substrate holder conveying device 1, and the empty substrate holder 15 is transferred to the substrate holder conveying device 1 after docking. At this point, complete a complete workflow.
以上所述仅为本公开的一些实施例,但本公开并不限于此。凡是依照本公开的构想所作的改变,或修改为等同变化的等效实施例,均应在本公开的保护范围内。The above description is only some embodiments of the present disclosure, but the present disclosure is not limited thereto. All changes which are made in accordance with the teachings of the present disclosure, or equivalents to equivalent variations, are intended to be within the scope of the present disclosure.

Claims (19)

  1. 一种基板架回传装置,其特征在于:包括基板架传送装置(1)和基板架升降回传装置(2);其中,A substrate rack returning device, comprising: a substrate rack conveying device (1) and a substrate rack lifting and returning device (2); wherein
    所述基板架传送装置(1)设置在镀膜设备(3)的底部,且镀膜设备进口端(X1)和镀膜设备出口端(X2)分别设有一个所述基板架升降回传装置(2);The substrate rack conveying device (1) is disposed at the bottom of the coating device (3), and the coating device inlet end (X1) and the coating device outlet end (X2) are respectively provided with one of the substrate rack lifting and returning devices (2) ;
    位于所述镀膜设备进口端(X1)的基板架升降回传装置(2),配置为承接由所述基板架传送装置(1)传送回的基板架(15),以及配置为将基板架(15)传送至所述镀膜设备(3)中的所述传送带(4)上;a substrate rack lifting and returning device (2) located at an inlet end (X1) of the coating device, configured to receive a substrate holder (15) conveyed back by the substrate holder conveying device (1), and configured to mount the substrate holder ( 15) being transferred to the conveyor belt (4) in the coating device (3);
    位于所述镀膜设备出口端(X2)的基板架升降回传装置(2),配置为承接由所述传送带(4)传送出的基板架(15),以及配置为将所述基板架(15)传送至所述基板架传送装置(1)上。a substrate holder lifting and returning device (2) located at an outlet end (X2) of the coating device, configured to receive a substrate holder (15) conveyed by the conveyor belt (4), and configured to mount the substrate holder (15) Transfer to the substrate holder transport device (1).
  2. 根据权利要求1所述的基板架回传装置,其特征在于:所述基板架传送装置(1)包括第一回传主体(100)和支撑腿(6);所述支撑腿(6)固定设置在所述第一回传主体(100)的底部;所述第一回传主体(100)配置为带动由所述传送带(4)传送出的基板架(15)向传送带的进口端(401)移动。The substrate holder returning device according to claim 1, wherein said substrate holder conveying device (1) comprises a first returning body (100) and a supporting leg (6); said supporting leg (6) is fixed Provided at the bottom of the first returning body (100); the first returning body (100) is configured to drive the substrate holder (15) conveyed by the conveyor belt (4) to the inlet end of the conveyor belt (401) )mobile.
  3. 根据权利要求2所述的基板架回传装置,其特征在于:所述基板架升降回传装置(2)包括第二回传主体(200)和升降装置(8);所述升降装置(8)设置在所述第二回传主体(200)的底部;The substrate holder returning device according to claim 2, wherein said substrate holder lifting and returning device (2) comprises a second returning body (200) and a lifting device (8); said lifting device (8) Provided at the bottom of the second return body (200);
    位于所述镀膜设备出口端(X2)的基板架升降回传装置(2)中的所述第二回传主体(200),配置为带动由所述传送带(4)传送出的基板架(15)移动至所述基板架传送装置的进口端(X3);The second return body (200) located in the substrate rack lifting and lowering device (2) of the coating device outlet end (X2) is configured to drive the substrate holder (15) conveyed by the conveyor belt (4) Moving to the inlet end (X3) of the substrate holder transport device;
    位于所述镀膜设备进口端(X1)的基板架升降回传装置(2)中的所述第二回传主体(200),配置为带动由所述基板架传送装置(1)传送回的基板架(15)移动至所述传送带的进口端(401)。The second return body (200) located in the substrate rack lifting and returning device (2) at the inlet end (X1) of the coating device is configured to drive the substrate transported back by the substrate carrier transfer device (1) The frame (15) is moved to the inlet end (401) of the conveyor.
  4. 根据权利要求3所述的基板架回传装置,其特征在于:所述第一回传主体(100)与所述第二回传主体(200)的结构相同,均包括架体(9)、用于传送基板架(15)的多个传送轮(10)、多根转轴(11)和驱动电机(12);The substrate carrier returning device according to claim 3, wherein the first returning body (100) and the second returning body (200) have the same structure, each comprising a frame body (9), a plurality of transfer wheels (10) for conveying the substrate holder (15), a plurality of rotating shafts (11) and a driving motor (12);
    所述架体(9)的两侧分别设有一个安装槽(13),且两个所述安装槽(13)内均设有所述传送轮(10),其中一个所述安装槽(13)内的所述传送轮(10)通过所述转轴(11)与另一个所述安装槽(13)内的所述传送轮(10)连接;任意相邻两根所述转轴(11)通过皮带(14)和皮带轮(300)联动;A mounting groove (13) is respectively disposed on two sides of the frame body (9), and the transfer wheel (10) is disposed in each of the two mounting grooves (13), and one of the mounting slots (13) The transfer wheel (10) in the middle is connected to the transfer wheel (10) in the other of the mounting grooves (13) through the rotating shaft (11); any two adjacent rotating shafts (11) pass The belt (14) and the pulley (300) are linked;
    所述驱动电机(12)固定安装在所述架体(9)上,所述驱动电机(12)的输出轴与其中一根所述转轴(11)连接。The drive motor (12) is fixedly mounted on the frame body (9), and an output shaft of the drive motor (12) is connected to one of the rotating shafts (11).
  5. 根据权利要求4所述的基板架回传装置,其特征在于:所述传送轮(10)为槽轮;The substrate carrier returning device according to claim 4, wherein the transfer wheel (10) is a sheave;
    所述基板架回传装置还包括基板架(15);所述基板架(15)的底部设有两根平形布置的导杆(16),且两根所述导杆(16)分别与两个所述安装槽(13)内的所述槽轮配合。The substrate holder returning device further comprises a substrate holder (15); the bottom of the substrate holder (15) is provided with two flat-shaped guiding rods (16), and the two guiding rods (16) are respectively and two The sheaves in the mounting slots (13) are mated.
  6. 根据权利要求3所述的基板架回传装置,其特征在于:所述升降装置(8)为 液压缸、气缸以及电动推拉杆中的一种。The substrate holder returning device according to claim 3, wherein said lifting device (8) is one of a hydraulic cylinder, a cylinder, and an electric push-pull rod.
  7. 一种应用于如权利要求1所述基板架回传装置的基板架回传方法,其特征在于:包括:A substrate carrier back-transfer method applied to the substrate carrier back-transfer device of claim 1 is characterized in that it comprises:
    位于镀膜设备进口端(X1)的基板架升降回传装置(2)将基板架(15)举升,并传送至传送带(4)上,传送带(4)将基板架(15)从镀膜设备进口端(X1)传送至镀膜设备出口端(X2),并将基板架(15)传送至位于镀膜设备出口端(X2)且处于上升状态的基板架升降回传装置(2)上;The substrate holder lifting and returning device (2) at the inlet end (X1) of the coating device lifts the substrate holder (15) and conveys it to the conveyor belt (4). The conveyor belt (4) imports the substrate holder (15) from the coating device. The end (X1) is transferred to the outlet end (X2) of the coating device, and the substrate holder (15) is transferred to the substrate holder lifting and returning device (2) at the outlet end (X2) of the coating device and in an ascending state;
    位于镀膜设备出口端(X2)的基板架升降回传装置(2)带着基板架(15)下降,并将基板架(15)传送至基板架传送装置(1)上;a substrate holder lifting and returning device (2) located at the outlet end (X2) of the coating device is lowered with the substrate holder (15), and the substrate holder (15) is transferred to the substrate holder conveying device (1);
    基板架传送装置(1)将基板架(15)从镀膜设备(3)的底部回传至位于镀膜设备进口端(X1)且处于下降状态的基板架升降回传装置(2)上,完成循环回传基板架(15)的一个回传过程。The substrate holder conveying device (1) returns the substrate holder (15) from the bottom of the coating device (3) to the substrate holder lifting and returning device (2) at the inlet end (X1) of the coating device and is in a descending state, and completes the cycle. A return process of the substrate holder (15) is returned.
  8. 根据权利要求7所述的基板架回传方法,其特征在于:在所述基板架(15)被所述传送带(4)传送的过程中,位于所述镀膜设备进口端(X1)的所述基板架升降回传装置(2)下降至第三预设位置;The substrate carrier returning method according to claim 7, wherein said said substrate holder (15) is located at said inlet end (X1) of said coating apparatus during transfer of said substrate holder (15) by said conveyor belt (4) The substrate rack lifting and returning device (2) is lowered to a third preset position;
    所述第三预设位置为与所述基板架传送装置(1)平齐的位置。The third preset position is a position flush with the substrate holder transport device (1).
  9. 根据权利要求7所述的基板架回传方法,其特征在于:在所述基板架(15)回传的过程中,位于所述镀膜设备出口端(X2)的所述基板架升降回传装置(2)上升至第四预设位置;The substrate carrier returning method according to claim 7, wherein in the process of returning the substrate holder (15), the substrate holder lifting and returning device at the outlet end (X2) of the coating device (2) rising to the fourth preset position;
    所述第四预设位置为与所述传送带(4)平齐的位置。The fourth preset position is a position flush with the conveyor belt (4).
  10. 一种全自动镀膜机,包括镀膜设备(3),其特征在于:还包括上片设备(7)、回传装置(17)和下片设备(18);A fully automatic coating machine, comprising a coating device (3), characterized by: further comprising a top device (7), a return device (17) and a lower device (18);
    所述镀膜设备(3)包括多个平行布置的传送带(4),相邻两个所述传送带(4)之间形成第一缝隙(400),每个所述传送带(4)均贯穿于所述镀膜设备(3),且每个所述传送带(4)的两端分别伸入所述上片设备(7)和所述下片设备(18)内;The coating device (3) comprises a plurality of conveyor belts (4) arranged in parallel, a first gap (400) is formed between two adjacent conveyor belts (4), and each of the conveyor belts (4) runs through the same a coating device (3), and two ends of each of the conveyor belts (4) respectively protrude into the top sheet device (7) and the lower sheet device (18);
    所述回传装置(17)设于所述镀膜设备(3)的下方,且所述回传装置(17)为权利要求1所述的基板架回传装置;所述回传装置(17)的两端分别位于所述上片设备(7)和所述下片设备(18)内;The returning device (17) is disposed under the coating device (3), and the back transmitting device (17) is the substrate carrier returning device of claim 1; the returning device (17) The two ends are respectively located in the upper piece device (7) and the lower piece device (18);
    所述上片设备(7)与所述镀膜设备进口端(X1)连接,配置为将玻璃基片(500)转送并放置在位于传送带(4)进口端的基板架(15)上;The top sheet device (7) is connected to the inlet end (X1) of the coating device, configured to transfer the glass substrate (500) and placed on the substrate holder (15) at the inlet end of the conveyor belt (4);
    所述下片设备(18)与所述镀膜设备出口端(X2)连接,配置为将位于传送带(4)出口端的基板架(15)上的玻璃基片(500)转送出,并送入下一工位。The lower sheet device (18) is connected to the outlet end (X2) of the coating device, and is configured to transfer the glass substrate (500) on the substrate holder (15) at the outlet end of the conveyor belt (4) and feed it into the lower portion. A station.
  11. 根据权利要求10所述的全自动镀膜机,其特征在于:所述上片设备(7)包括第一基片传送带(I-19)、第一基片举升机构(I-20)、第一基片转送机构(I-21)、第一基片顶升机构(I-22)和第一行走轨道(I-23);The automatic coating machine according to claim 10, characterized in that said top sheet device (7) comprises a first substrate transfer belt (I-19), a first substrate lifting mechanism (I-20), a substrate transfer mechanism (I-21), a first substrate lifting mechanism (I-22) and a first traveling track (I-23);
    所述第一基片传送带(I-19)配置为将玻璃基片(500)送入所述上片设备(7)内;The first substrate transfer belt (I-19) is configured to feed the glass substrate (500) into the top sheet device (7);
    所述第一基片转送机构(I-21)可滑动地设置在所述第一行走轨道(I-23)上;所述第一基片转送机构(I-21)在所述第一行走轨道(I-23)上具有第一预设位置(Y1) 和第二预设位置(Y2),所述第一预设位置(Y1)位于所述第一基片传送带(I-19)的正上方,所述第二预设位置(Y2)与所述第一基片顶升机构(I-22)相对;The first substrate transfer mechanism (I-21) is slidably disposed on the first traveling track (I-23); the first substrate transfer mechanism (I-21) is in the first walking The track (I-23) has a first preset position (Y1) and a second preset position (Y2), the first preset position (Y1) being located on the first substrate conveyor belt (I-19) Directly above, the second preset position (Y2) is opposite to the first substrate jacking mechanism (I-22);
    所述第一基片举升机构(I-20)相对第一基片传送带(I-19)沿垂直所述第一基片传送带(I-19)的方向做升降运动;The first substrate lifting mechanism (I-20) moves up and down relative to the first substrate conveyor (I-19) in a direction perpendicular to the first substrate conveyor (I-19);
    所述第一基片转送机构(I-21)配置为在滑动至第二预设位置(Y2)时伸长运动,将玻璃基片(500)转送至所述传送带(4)的正上方;The first substrate transfer mechanism (I-21) is configured to elongate movement when sliding to a second preset position (Y2) to transfer the glass substrate (500) directly above the conveyor belt (4);
    所述第一基片顶升机构(I-22)设于所述传送带(4)进口端的下方。The first substrate lifting mechanism (I-22) is disposed below the inlet end of the conveyor belt (4).
  12. 根据权利要求11所述的全自动镀膜机,其特征在于:所述下片设备(18)包括第二基片传送带(Ⅱ-19)、第二基片举升机构(Ⅱ-20)、第二基片转送机构(Ⅱ-21)、第二基片顶升机构(Ⅱ-22)和第二行走轨道(Ⅱ-23);A fully automatic coater according to claim 11, wherein said lower sheet device (18) comprises a second substrate transfer belt (II-19), a second substrate lifting mechanism (II-20), a two-substrate transfer mechanism (II-21), a second substrate lift mechanism (II-22), and a second travel track (II-23);
    所述第二基片转送机构(Ⅱ-21)可滑动地设置在所述第二行走轨道(Ⅱ-23)上;所述第二基片转送机构(Ⅱ-21)在所述第二行走轨道(Ⅱ-23)上具有第五预设位置(Y5)和第六预设位置(Y6),所述第五预设位置(Y5)位于所述第二基片传送带(Ⅱ-19)的正上方,所述第六预设位置(Y6)与所述第二基片顶升机构(Ⅱ-22)相对;The second substrate transfer mechanism (II-21) is slidably disposed on the second traveling track (II-23); the second substrate transfer mechanism (II-21) is in the second walking The track (II-23) has a fifth preset position (Y5) and a sixth preset position (Y6), and the fifth preset position (Y5) is located on the second substrate conveyor belt (II-19) Directly above, the sixth preset position (Y6) is opposite to the second substrate jacking mechanism (II-22);
    所述第二基片转送机构(Ⅱ-21)配置为在滑动至所述第六预设(Y6)位置时伸长运动;The second substrate transfer mechanism (II-21) is configured to elongate when sliding to the sixth preset (Y6) position;
    所述第二基片顶升机构(Ⅱ-22)设于所述传送带(4)出口端的下方;The second substrate lifting mechanism (II-22) is disposed below the outlet end of the conveyor belt (4);
    所述第二基片举升机构(Ⅱ-20)相对所述第二基片传送带(Ⅱ-19)沿垂直所述第二基片传送带(Ⅱ-19)的方向做升降运动;The second substrate lifting mechanism (II-20) is moved up and down in a direction perpendicular to the second substrate conveying belt (II-19) with respect to the second substrate conveying belt (II-19);
    所述第二基片传送带(Ⅱ-19)配置为将玻璃基片(500)送出所述下片设备(18),并送入下一工位。The second substrate transfer belt (II-19) is configured to feed the glass substrate (500) out of the lower sheet device (18) and to the next station.
  13. 根据权利要求12所述的全自动镀膜机,其特征在于:所述第一基片举升机构(I-20)和所述第二基片举升机构(Ⅱ-20)均包括第一举升叉(50)和举升缸(40);The fully automatic coating machine according to claim 12, wherein said first substrate lifting mechanism (I-20) and said second substrate lifting mechanism (II-20) each comprise a first lifting Lift fork (50) and lift cylinder (40);
    所述第一举升叉(50)包括多个第一插杆(25)、第一插杆连接杆(26)和举升缸连接杆(27);所述多个第一插杆(25)等间距平行固定在所述第一插杆连接杆(26)上,所述第一插杆连接杆(26)通过所述举升缸连接杆(27)与所述举升缸(40)的伸缩端(41)固定连接;The first lift fork (50) includes a plurality of first plungers (25), a first plunger connecting rod (26), and a lift cylinder connecting rod (27); the plurality of first plungers (25) Equally spaced parallel to the first plunger connecting rod (26), the first plunger connecting rod (26) passing through the lift cylinder connecting rod (27) and the lifting cylinder (40) The telescopic end (41) is fixedly connected;
    所述第一基片传送带(I-19)为多个,且相互等间距平行布置,所述第一基片举升机构(I-20)的第一插杆(25)配置为在升降时通过相邻两个所述第一基片传送带(I-19)之间的第二缝隙(191);The first substrate transfer belt (I-19) is plural and arranged in parallel with each other at equal intervals, and the first plunger (25) of the first substrate lifting mechanism (I-20) is configured to be raised and lowered Passing a second gap (191) between two adjacent first substrate transfer belts (I-19);
    所述第二基片传送带(Ⅱ-20)为多个,且相互等间距平行布置,所述第二基片举升机构(Ⅱ-20)的第一插杆(25)配置为在升降时通过相邻两个所述第二基片传送带(Ⅱ-19)之间的第二缝隙(191)。The second substrate transfer belt (II-20) is plural and arranged in parallel with each other at equal intervals, and the first plunger (25) of the second substrate lifting mechanism (II-20) is configured to be raised and lowered A second slit (191) between the two adjacent second substrate transfer belts (II-19) is passed.
  14. 根据权利要求12所述的全自动镀膜机,其特征在于:所述第一基片转送机构(I-21)和所述第二基片转送机构(Ⅱ-21)均包括第二举升叉(60)、伸缩缸(28)、滑块(29)和滑座(30);A fully automatic coater according to claim 12, wherein said first substrate transfer mechanism (I-21) and said second substrate transfer mechanism (II-21) each comprise a second lift fork (60), a telescopic cylinder (28), a slider (29) and a carriage (30);
    所述第一基片转送机构(I-21)的滑座(30)可滑动地设置在所述第一行走轨道(I-23)上;所述第二基片转送机构(Ⅱ-21)的滑座(30)可滑动地设置在所述第二 行走轨道(Ⅱ-23)上;a carriage (30) of the first substrate transfer mechanism (I-21) slidably disposed on the first traveling rail (I-23); the second substrate transfer mechanism (II-21) a sliding seat (30) slidably disposed on the second traveling rail (II-23);
    所述滑块(29)可滑动地设置在所述滑座(30)上;The slider (29) is slidably disposed on the slider (30);
    所述伸缩缸(28)固定在所述滑块(29)上;The telescopic cylinder (28) is fixed on the slider (29);
    所述第二举升叉(60)包括多个第二插杆(36)和第二插杆连接杆(37);所述多个第二插杆(36)等间距固定在所述第二插杆连接杆(37)上;所述第二插杆连接杆(37)固定在所述伸缩缸(28)的伸缩端(281)。The second lift fork (60) includes a plurality of second plungers (36) and a second plunger connecting rod (37); the plurality of second plungers (36) are equally spaced at the second a plunger connecting rod (37); the second plunger connecting rod (37) is fixed to the telescopic end (281) of the telescopic cylinder (28).
  15. 根据权利要求14所述的全自动镀膜机,其特征在于:所述第一行走轨道(I-23)和所述第二行走轨道(Ⅱ-23)均包括上轨(231)、中轨(232)和下轨(233);A fully automatic coating machine according to claim 14, wherein said first traveling rail (I-23) and said second traveling rail (II-23) each comprise an upper rail (231) and a middle rail ( 232) and lower rail (233);
    所述第一基片转送机构(I-21)的滑座(30)与所述第一行走轨道(I-23)的上轨(231)、中轨(232)和下轨(233)滑动连接;The sliding seat (30) of the first substrate transfer mechanism (I-21) slides with the upper rail (231), the middle rail (232) and the lower rail (233) of the first traveling rail (I-23) connection;
    所述第二基片转送机构(Ⅱ-21)的滑座(30)与所述第二行走轨道(Ⅱ-23)的上轨(231)、中轨(232)和下轨(233)滑动连接。The sliding seat (30) of the second substrate transfer mechanism (II-21) slides with the upper rail (231), the middle rail (232) and the lower rail (233) of the second traveling rail (II-23) connection.
  16. 根据权利要求15所述的全自动镀膜机,其特征在于:所述第一基片转送机构(I-21)和所述第二基片转送机构(Ⅱ-21)均还包括第一伺服电机(31)和第一齿条(33);A fully automatic coating machine according to claim 15, wherein said first substrate transfer mechanism (I-21) and said second substrate transfer mechanism (II-21) each further comprise a first servo motor (31) and a first rack (33);
    所述第一齿条(33)固定安装在所述中轨(232)上;The first rack (33) is fixedly mounted on the middle rail (232);
    所述第一伺服电机(31)固定在所述滑块(29)上,所述第一伺服电机(31)连接有与所述第一齿条(33)相啮合的第一齿轮(71)。The first servo motor (31) is fixed on the slider (29), and the first servo motor (31) is connected with a first gear (71) that meshes with the first rack (33). .
  17. 根据权利要求16所述的全自动镀膜机,其特征在于:所述滑座(30)的一侧具有两条沿竖直方向平行布置的第二滑轨(34);The automatic coating machine according to claim 16, wherein one side of the sliding seat (30) has two second sliding rails (34) arranged in parallel in the vertical direction;
    所述滑块(29)通过所述第二滑轨(34)可滑动地安装在所述滑座(30)上。The slider (29) is slidably mounted on the carriage (30) by the second slide rail (34).
  18. 根据权利要求17所述的全自动镀膜机,其特征在于:所述第一基片转送机构(I-21)和所述第二基片转送机构(Ⅱ-21)均还包括第二伺服电机(32)和第二齿条(35);A fully automatic coater according to claim 17, wherein said first substrate transfer mechanism (I-21) and said second substrate transfer mechanism (II-21) each further comprise a second servo motor (32) and a second rack (35);
    所述第二齿条(35)设置在所述滑座(30)上,且与所述第二滑轨(34)平行布置;The second rack (35) is disposed on the slider (30) and arranged in parallel with the second rail (34);
    所述第二伺服电机(32)固定在所述滑块(29)上,所述第二伺服电机(32)连接有与所述第二齿条(35)相啮合的第二齿轮(72)。The second servo motor (32) is fixed to the slider (29), and the second servo motor (32) is connected with a second gear (72) that meshes with the second rack (35). .
  19. 根据权利要求14所述的全自动镀膜机,其特征在于:所述第一基片顶升机构(I-22)和所述第二基片顶升机构(Ⅱ-22)均包括底座(38)和多个可伸缩运动的顶升缸(39),所述顶升缸(39)固定在所述底座(38)上;每个所述顶升缸(39)配置为在伸缩时通过相邻两个所述传送带(4)之间的第一缝隙(400),并通过相邻两个所述第二插杆(36)之间的间隙。The fully automatic coater according to claim 14, wherein said first substrate lifting mechanism (I-22) and said second substrate lifting mechanism (II-22) each comprise a base (38). And a plurality of telescopically movable jacking cylinders (39) fixed to the base (38); each of the jacking cylinders (39) configured to pass through the phase during telescoping Adjacent to the first gap (400) between the two conveyor belts (4), and passing through a gap between two adjacent second rods (36).
PCT/CN2018/096865 2017-12-21 2018-07-24 Substrate frame return device, substrate frame return method and fully automatic coating machine WO2019119804A1 (en)

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CN201711397058.4A CN108147128A (en) 2017-12-21 2017-12-21 Frame substrate return device and frame substrate retransmission method
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