TWI839096B - Display device and tiling display - Google Patents
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
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Abstract
Description
本發明是關於一種顯示裝置以及一種拼接式顯示器。The present invention relates to a display device and a spliced display.
在顯示裝置的技術領域中,窄邊框或無邊框的顯示裝置可以提供較大面積的顯示區,且可應用於拼接式產品。顯示裝置的周邊區設有一般的驅動結構以及用於監控阻值的測試結構。然而,若是測試結構與顯示區內的電子元件距離太近時,可能會發生靜電放電(electrostatic discharge,以下簡稱ESD),並造成電子元件的損壞。In the field of display device technology, narrow-frame or frameless display devices can provide a larger display area and can be applied to spliced products. The peripheral area of the display device is provided with a general driving structure and a test structure for monitoring resistance. However, if the test structure is too close to the electronic components in the display area, electrostatic discharge (ESD) may occur and cause damage to the electronic components.
為了解決上述的問題,克服現有技術的不足,本揭示內容提供一種顯示裝置以及一種拼接式顯示器,可以避免顯示裝置因ESD而造成顯示區中的電子元件的損壞。In order to solve the above problems and overcome the shortcomings of the prior art, the present disclosure provides a display device and a spliced display, which can prevent the electronic components in the display area of the display device from being damaged due to ESD.
本發明至少一實施方式所提供的顯示裝置包含顯示面板以及測試結構。顯示面板具有彼此相對的第一表面與第二表面、設置於第一表面與第二表面之間的側表面、以及設置於第一表面的顯示區。測試結構包含第一接觸墊、第一測試墊、第二接觸墊、第二測試墊以及第一橋接線路。第一接觸墊設置於第二表面上。第一測試墊設置於第二表面上且電性連接第一接觸墊。第二接觸墊設置於第二表面上。第二測試墊設置於第二表面上且電性連接第二接觸墊。第一橋接線路設置於顯示面板上,且電性連接第一接觸墊與第二接觸墊,其中第一橋接線路覆蓋第一接觸墊與第二接觸墊,第一橋接線路分布於第二表面與側表面上,且第一橋接線路沒有分布於第一表面上。The display device provided by at least one embodiment of the present invention includes a display panel and a test structure. The display panel has a first surface and a second surface opposite to each other, a side surface arranged between the first surface and the second surface, and a display area arranged on the first surface. The test structure includes a first contact pad, a first test pad, a second contact pad, a second test pad, and a first bridge circuit. The first contact pad is arranged on the second surface. The first test pad is arranged on the second surface and electrically connected to the first contact pad. The second contact pad is arranged on the second surface. The second test pad is arranged on the second surface and electrically connected to the second contact pad. The first bridge circuit is arranged on the display panel and electrically connects the first contact pad and the second contact pad, wherein the first bridge circuit covers the first contact pad and the second contact pad, the first bridge circuit is distributed on the second surface and the side surface, and the first bridge circuit is not distributed on the first surface.
在本發明至少一實施方式中,顯示面板的側表面包含第一斜面、平面以及第二斜面,平面設置於第一斜面與第二斜面之間,第一斜面設置於第一表面與平面之間,且第二斜面設置於第二表面與平面之間。In at least one embodiment of the present invention, the side surface of the display panel includes a first inclined surface, a plane and a second inclined surface, the plane is arranged between the first inclined surface and the second inclined surface, the first inclined surface is arranged between the first surface and the plane, and the second inclined surface is arranged between the second surface and the plane.
在本發明至少一實施方式中,第一橋接線路從第二表面延伸至第二斜面。In at least one embodiment of the present invention, the first bridge line extends from the second surface to the second inclined surface.
在本發明至少一實施方式中,第一橋接線路從第二表面延伸經過第二斜面至平面。In at least one embodiment of the present invention, the first bridge line extends from the second surface through the second inclined surface to the plane.
在本發明至少一實施方式中,第一橋接線路從第二表面延伸經過第二斜面與平面至第一斜面。In at least one embodiment of the present invention, the first bridge line extends from the second surface through the second inclined surface and the plane to the first inclined surface.
在本發明至少一實施方式中,顯示裝置更包含多個測試結構,其中多個測試結構的多個第一測試墊與多個第二測試墊設置於第二表面上且鄰近第二斜面設置。In at least one embodiment of the present invention, the display device further includes a plurality of test structures, wherein a plurality of first test pads and a plurality of second test pads of the plurality of test structures are disposed on the second surface and adjacent to the second inclined surface.
在本發明至少一實施方式中,第一接觸墊的側邊與第一測試墊的側邊齊切,且第二接觸墊的側邊與第二測試墊的側邊齊切。In at least one embodiment of the present invention, a side of the first contact pad is aligned with a side of the first test pad, and a side of the second contact pad is aligned with a side of the second test pad.
在本發明至少一實施方式中,顯示裝置更包含絕緣層,其中絕緣層覆蓋設置於第一表面的周邊區、側表面、第一接觸墊、第一測試墊、第二接觸墊以及第二測試墊。In at least one embodiment of the present invention, the display device further includes an insulating layer, wherein the insulating layer covers the peripheral area, the side surface, the first contact pad, the first test pad, the second contact pad, and the second test pad disposed on the first surface.
在本發明至少一實施方式中,顯示裝置更包含第三接觸墊、第四接觸墊以及第二橋接線路。第三接觸墊設置於位在第一表面的周邊區,其中第三接觸墊電性連接至畫素陣列。第四接觸墊設置於第二表面。第二橋接線路電性連接第三接觸墊與第四接觸墊,其中第二橋接線路從第一表面經過側表面並延伸至第二表面。In at least one embodiment of the present invention, the display device further includes a third contact pad, a fourth contact pad, and a second bridge circuit. The third contact pad is disposed in a peripheral area of the first surface, wherein the third contact pad is electrically connected to the pixel array. The fourth contact pad is disposed on the second surface. The second bridge circuit electrically connects the third contact pad and the fourth contact pad, wherein the second bridge circuit extends from the first surface through the side surface and to the second surface.
本發明至少一實施方式所提供的拼接式顯示器包含多個前述的顯示面板,其中多個顯示裝置呈規則排列,並且彼此相連。At least one embodiment of the present invention provides a spliced display comprising a plurality of the aforementioned display panels, wherein a plurality of display devices are regularly arranged and connected to each other.
基於上述,由於測試結構的橋接線路遠離顯示區中的電子元件,因此可以避免顯示裝置因ESD而造成鄰近周邊區的電子元件的損壞之情形。Based on the above, since the bridge circuit of the test structure is far away from the electronic components in the display area, it is possible to avoid the situation where the electronic components in the surrounding area of the display device are damaged due to ESD.
以下將以實施方式對上述之說明做詳細的描述,並對本揭示內容之技術方案提供更進一步的解釋。The following will describe the above description in detail with an implementation method and provide a further explanation of the technical solution of the present disclosure.
以下揭示提供許多不同實施方式或實施例,用於實現本揭示內容的不同特徵。以下敘述部件與佈置的特定實施方式,以簡化本揭示內容。這些當然僅為實施例,並且不是意欲作為限制。舉例而言,在隨後的敘述中,第一特徵在第二特徵上方或在第二特徵上的形成,可包括第一特徵及第二特徵形成為直接接觸的實施方式,亦可包括有另一特徵可形成在第一特徵及第二特徵之間,以使得第一特徵及第二特徵可不直接接觸的實施方式。此外,本揭示內容可能會在不同的實例中重複標號或文字。重複的目的是為了簡化及明確敘述,而非界定所討論之不同實施方式及配置間的關係。The following disclosure provides many different implementations or examples for implementing different features of the present disclosure. Specific implementations of components and arrangements are described below to simplify the present disclosure. These are of course only examples and are not intended to be limiting. For example, in the subsequent description, the formation of a first feature over or on a second feature may include implementations in which the first feature and the second feature are formed to be in direct contact, and may also include implementations in which another feature may be formed between the first feature and the second feature so that the first feature and the second feature are not in direct contact. In addition, the present disclosure may repeat numbers or text in different examples. The purpose of repetition is to simplify and clarify the description, not to define the relationship between the different implementations and configurations discussed.
除此之外,空間相對用語如「下面」、「下方」、「低於」、「上面」、「上方」及其他類似的用語,在此是為了方便描述圖中的一個元件或特徵和另一個元件或特徵的關係。空間相對用語除了涵蓋圖中所描繪的方位外,該用語更涵蓋裝置在使用或操作時的其他方位。(擇1)也就是說,當該裝置的方位與圖式不同(旋轉90度或在其他方位)時,在本揭示中所使用的空間相對用語同樣可相應地進行解釋。In addition, spatially relative terms such as "below", "below", "lower than", "above", "above" and other similar terms are used here to conveniently describe the relationship between one element or feature in the figure and another element or feature. In addition to covering the orientation depicted in the figure, the spatially relative terms also cover other orientations of the device when it is in use or operation. (Option 1) That is, when the orientation of the device is different from the figure (rotated 90 degrees or in other orientations), the spatially relative terms used in this disclosure can also be interpreted accordingly.
將理解的是,儘管這裡可以使用「第一」、「第二」等術語來描述各種元件,但是這些元件不應受到這些術語的限制。這些術語僅用於將一個元件與另一個元件區分開來。例如,在不脫離實施方式的範疇的情況下,第一元件可以被稱為第二元件,並且類似地,第二元件可以被稱為第一元件。如本文所使用的,術語「及/或」包括一個或多個相關列出的項目的任何和所有組合。It will be understood that although the terms "first," "second," etc. may be used herein to describe various elements, these elements should not be limited by these terms. These terms are only used to distinguish one element from another. For example, a first element may be referred to as a second element, and similarly, a second element may be referred to as a first element, without departing from the scope of the embodiments. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
以下將以圖式揭露本揭示之複數個實施方式,為明確說明起見,許多實務上的細節將在以下敘述中一併說明。然而,應瞭解到,這些實務上的細節不應用以限制本揭示內容。也就是說,在本揭示內容的部分實施方式中,這些實務上的細節是非必要的。此外,為簡化圖式起見,一些習知慣用的結構與元件在圖式中將以簡單示意的方式繪示之。The following will disclose multiple embodiments of the present disclosure with drawings. For the purpose of clarity, many practical details will be described together in the following description. However, it should be understood that these practical details should not be used to limit the content of the present disclosure. In other words, in some embodiments of the present disclosure, these practical details are not necessary. In addition, in order to simplify the drawings, some commonly used structures and components will be depicted in the drawings in a simple schematic manner.
本案圖式中標註了方向X、方向Y、方向Z以呈現圖面中各構件的配置關係,方向X、方向Y、方向Z彼此相交,但不限定彼此正交。圖1A為根據本揭示內容之一實施方式所繪示部分的顯示裝置100的三維透視圖。請參閱圖1A,顯示裝置100包含顯示面板110。顯示面板110具有彼此相對的第一表面112與第二表面116、設置於第一表面112與第二表面116之間的側表面114。顯示面板110的側表面114包含第一斜面S1、平面PS以及第二斜面S2,平面PS設置於第一斜面S1與第二斜面S2之間,第一斜面S1設置於第一表面112與平面PS之間,且第二斜面S2設置於第二表面116與平面PS之間。The directions X, Y, and Z are marked in the drawings of the present case to show the configuration relationship of each component in the drawings. The directions X, Y, and Z intersect with each other, but are not limited to being orthogonal to each other. FIG. 1A is a three-dimensional perspective view of a
在圖1A所示的實施例中,第一斜面S1、平面PS以及第二斜面S2皆可為平面,且三者的法線方向不同於第一表面112的法線方向,也不同於第二表面116的法線方向。例如,第一表面112平行於方向X-方向Y的平面,但平面PS則平行於方向Y-方向Z的平面,其中第一斜面S1與第二斜面S2不平行於方向X-方向Y的平面以及方向Y-方向Z的平面。In the embodiment shown in FIG. 1A , the first inclined surface S1, the plane PS, and the second inclined surface S2 can all be planes, and the normal directions of the three are different from the normal directions of the
第一表面112的法線方向與第二表面116的法線方向可彼此平行,但不以此為限。舉例而言,第一表面112與第二表面116例如分別平行於方向X-方向Y的平面。此外,在其他實施方式中,第一斜面S1及/或第二斜面S2可以為曲面,或由複數個平面組合而成的曲面或斜面。The normal direction of the
顯示裝置100還包含測試結構120以及驅動結構130。應理解的是,顯示面板110為可以承載元件(例如測試結構120以及驅動結構130)的板狀物。顯示面板110可包含玻璃基板或印刷電路板。顯示面板110的表面上設置有測試結構120以及驅動結構130。如圖1A所示,測試結構120與驅動結構130皆為立體的線路結構。The
顯示區R1設置於第一表面112。顯示區R1中可包含畫素陣列(未標示),其中畫素陣列包括薄膜電晶體元件以及多條訊號線(皆未繪示),而這些訊號線例如是資料線與掃描線。周邊區R2設置於第一表面112。周邊區R2相較於顯示區R1更接近側表面114的第一斜面S1,而周邊區R2內設置一部分的驅動結構130。The display region R1 is disposed on the
驅動結構130設置於第一表面112、側表面114(包含第一斜面S1、平面PS及/或第二斜面S2)及第二表面116上,如圖1A所示。第一表面112上還包含配置以驅動顯示區R1中的功能元件131,以使顯示裝置100提供顯示功能。功能元件131可例如為閘極驅動陣列(gate driver on array;GOA)或信號選擇器(multiplexer;MUX),但不限於此。圖1B將詳細描述圖1A中各個元件的配置與連接關係。The driving
圖1B為圖1A的顯示裝置100的展開圖。請參閱圖1A與圖1B,圖1B將圖1A的第一表面112、側表面114與第二表面116繪示為連續的平面,並繪示出各種元件的配置與連接關係。具體而言,圖1B所示的顯示裝置100是將圖1A的顯示裝置100展開,並讓第一表面112、側表面114與第二表面116全部攤平,以使圖1B所示的第一表面112、側表面114與第二表面116共平面,其中圖1B也繪示攤平的側表面114,所以第一斜面S1、平面PS與第二斜面S2也是共平面。FIG. 1B is an unfolded view of the
測試結構120包含第一接觸墊122、第一測試墊124、第二接觸墊126、第二測試墊128以及第一橋接線路B1。第一接觸墊122、第一測試墊124、第二接觸墊126以及第二測試墊128皆設置於第二表面116上,且鄰近側表面114的第二斜面S2。第一測試墊124和第二測試墊128適用於接收經由探針所傳送之測試訊號。第一測試墊124電性連接第一接觸墊122,而第二測試墊128電性連接第二接觸墊126。第一橋接線路B1電性連接且覆蓋第一接觸墊122與第二接觸墊126。第一橋接線路B1分布於第二表面116與側表面114上,但第一橋接線路B1沒有分布於第一表面112上。The
圖1A和圖1B中的實施方式為第一橋接線路B1從第二表面116延伸經過側表面114的第二斜面S2至側表面114的平面PS。換句話說,第一橋接線路B1沒有延伸至側表面114的第一斜面S1。如圖1B所示,第一橋接線路B1為具有U字型的線路圖案。另外,在一些實施方式中,第一斜面S1與第二斜面S2可以為平面,如圖1A所示。In the implementations shown in FIG. 1A and FIG. 1B , the first bridge line B1 extends from the
仍參考圖1B。驅動結構130包含第三接觸墊132、第四接觸墊136以及第二橋接線路B2。第三接觸墊132設置於位在第一表面112的周邊區R2。第三接觸墊132電性連接至顯示區R1中的畫素陣列。第四接觸墊136設置於第二表面116。第二橋接線路B2電性連接且覆蓋第三接觸墊132與第四接觸墊136,其中第二橋接線路B2從第一表面112經過側表面114並延伸至第二表面116。Still referring to FIG. 1B , the driving
第一橋接線路B1與第二橋接線路B2可例如藉由濺鍍金屬材料(例如銅)於顯示面板110的表面上,再於金屬上覆蓋遮罩層(例如光阻),之後經蝕刻而得具有圖案化的線路,但不以此方法為限。顯示裝置100還包含第三測試墊134、第四測試墊138以及接墊135。第三測試墊134鄰近且電性連接第三接觸墊132,而第四測試墊138鄰近且電性連接第四接觸墊136。第三測試墊134與第四測試墊138適用於接收經由探針所傳送之測試訊號。The first bridge circuit B1 and the second bridge circuit B2 can be formed, for example, by sputtering a metal material (e.g., copper) on the surface of the
在一些實施方式中,接墊135可用於電性連接軟性電路板139 (flexible printed circuit;FPC,請參考圖2)。在一些實施方式中,第一接觸墊122的側邊122s、第二接觸墊126的側邊126s、第四接觸墊136的側邊136s以及第四測試墊138的側邊138s可相互齊切,如圖1B所示。在一些實施方式中,第三接觸墊132的側邊132s與第三測試墊134的側邊134s齊切,如圖1B所示。In some embodiments, the
在一些實施方式中,第一接觸墊122、第二接觸墊126、第三接觸墊132、第四接觸墊136的尺寸彼此相同,且第一測試墊124、第二測試墊128、第三測試墊134、第四測試墊138的尺寸彼此相同。在一些實施方式中,第一接觸墊122、第二接觸墊126、第三接觸墊132與第四接觸墊136的尺寸皆小於第一測試墊124、第二測試墊128、第三測試墊134與第四測試墊138的尺寸,如圖1B所示。In some embodiments, the sizes of the
第一測試墊124與第二測試墊128配置以量測第一橋接線路B1的電阻值。第三測試墊134與第四測試墊138配置以量測第二橋接線路B2的電阻值。當第一接觸墊122、第二接觸墊126、第三接觸墊132及/或第四接觸墊136表面上接觸到汙染物時,例如微粒(particle)或油汙,電阻值會改變。當上述接觸墊具有較小尺寸(例如面積)時,接觸到汙染物的接觸墊之電阻值會出現較為明顯或劇烈的變化,以提高電阻解析度,從而提升監控的功能。The
圖2為圖1B的顯示裝置100於另一實施方式中的展開圖。在圖2的實施方式中,在圖1B的顯示裝置100上覆蓋絕緣層210。絕緣層210直接覆蓋橋接線路(包含第一橋接線路B1和第二橋接線路B2),而橋接線路直接覆蓋接觸墊。Fig. 2 is an expanded view of the
絕緣層210也可作為保護層,並能降低後續製程發生ESD而損壞周圍元件的風險。絕緣層210也能減少或避免第一橋接線路B1、第二橋接線路B2、第一測試墊124、第二測試墊128、第三測試墊134與第四測試墊138發生短路的風險。絕緣層210覆蓋設置於第一表面112的周邊區R2、側表面114、第一接觸墊122、第一測試墊124、第二接觸墊126以及第二測試墊128。詳細來說,絕緣層210還覆蓋第一橋接線路B1、第三接觸墊132、第三測試墊134、第四接觸墊136、第四測試墊138以及第二橋接線路B2。此外,絕緣層210覆蓋周邊區R2,但沒有覆蓋電性連接至顯示區R1的功能元件131。在一些實施方式中,軟性電路板139覆蓋且電性連接接墊135。The insulating
圖3A為根據本揭示內容之一實施方式所繪示部分的顯示裝置300的三維透視圖。圖3B為圖3A的顯示裝置300的展開圖。圖1A、圖1B的顯示裝置100與圖3A、圖3B的顯示裝置300差異在於,測試結構120的第一橋接線路B1以及測試結構120a的第一橋接線路B3的線路圖案。FIG. 3A is a three-dimensional perspective view of a portion of a
請參閱圖3A與圖3B,第一橋接線路B3具有長方形的線路圖案,且不像圖1B中的U形第一橋接線路B1,所以第一橋接線路B3沿著方向Y延伸而沒有暴露出下方的平面PS、第二斜面S2以及第二表面116的開口或缺口。須說明的是,可在顯示裝置300上覆蓋如圖2中的蓋絕緣層210,以防止後續製程發生ESD而損壞周圍元件與短路的風險。3A and 3B , the first bridge circuit B3 has a rectangular circuit pattern and is not like the U-shaped first bridge circuit B1 in FIG. 1B , so the first bridge circuit B3 extends along the direction Y without exposing the lower plane PS, the second inclined surface S2, and the opening or notch of the
圖4A為根據本揭示內容之一實施方式所繪示部分的顯示裝置400的三維透視圖。圖4B為圖4A的顯示裝置400的展開圖。圖3A、圖3B的顯示裝置300與圖4A、圖4B的顯示裝置400差異在於,測試結構120a的第一橋接線路B3以及測試結構120b的第一橋接線路B4的線路圖案。FIG. 4A is a three-dimensional perspective view of a portion of a
請參閱圖4A與圖4B,第一橋接線路B1從第二表面116延伸經過第二斜面S2與平面PS至第一斜面S1,而沒有延伸至第一表面112。第一橋接線路B1具有長方形的線路圖案,即第一橋接線路B1沿著方向Y延伸而沒有暴露出下方的第一斜面S1、平面PS、第二斜面S2以及第二表面116的開口或缺口。須說明的是,可在顯示裝置400上覆蓋如圖2中的絕緣層210,以防止後續製程發生ESD而損壞周圍元件與短路的風險。4A and 4B , the first bridge line B1 extends from the
圖5A為根據本揭示內容之一實施方式所繪示部分的顯示裝置500的三維透視圖。圖5B為圖5A的顯示裝置500的展開圖。圖3A、圖3B的顯示裝置300與圖5A、圖5B的顯示裝置500差異在於,測試結構120a的第一橋接線路B3以及測試結構120c的第一橋接線路B3、B5的線路圖案。FIG. 5A is a three-dimensional perspective view of a portion of a
請參閱圖5A與圖5B所示,第一橋接線路B5從第二表面116延伸至第二斜面S2,而沒有延伸至平面PS、第一斜面S1以及第一表面112。第一橋接線路B1具有長方形的線路圖案,即第一橋接線路B1沿著方向Y延伸而沒有暴露出下方的第二斜面S2以及第二表面116的開口或缺口。須說明的是,可在顯示裝置400上覆蓋如圖2中的絕緣層210,以防止後續製程發生ESD而損壞周圍元件與短路的風險。5A and 5B , the first bridge line B5 extends from the
圖6為根據本揭示內容之一實施方式所繪示部分的顯示裝置600的展開圖。圖6所繪示的展開圖類似於圖2的展開圖。圖2的顯示裝置100A與圖6的顯示裝置600差異在於第一測試墊124與第二測試墊128的尺寸(即面積)與位置以及圖6的絕緣層210a的圖案。詳細來說,在圖6的顯示裝置100A中,第一接觸墊122的側邊122s與第一測試墊124的側邊124s齊切,且第二接觸墊126的側邊126s與第二測試墊128的側邊128s齊切。類似於圖2中的絕緣層210,圖6中的絕緣層210a也覆蓋第一測試墊124和第二測試墊128。FIG6 is an unfolded view of a display device 600 according to an embodiment of the present disclosure. The unfolded view shown in FIG6 is similar to the unfolded view of FIG2 . The
圖7為根據本揭示內容之一實施方式所繪示部分的顯示裝置700的展開圖。詳細來說,圖7的顯示裝置700是由圖6中的顯示裝置600的重複結構U所組成。換句話說,顯示裝置700包含多個測試結構120d。須說明的是,由於視角緣故以及簡化圖式起見,一些元件(例如功能元件131)沒有繪示於圖7中。FIG. 7 is an expanded view of a
顯示裝置700包含多個測試結構120d,其中多個測試結構120d的多個第一測試墊124與多個第二測試墊128設置於第二表面116上且鄰近側表面114的第二斜面S2設置。多個測試結構120d沿著方向Y排列於顯示面板110的第二表面116的兩側。在其他實施方式中,測試結構120d可僅設置於顯示面板110的四個角落。多個測試結構120d可以提升電阻值的取樣數以增加數值準確度。例如,偵測顯示面板110的變形是否超出規格。The
圖8為根據本揭示內容之一實施方式所繪示部分的顯示裝置800的三維透視圖。圖1A的顯示裝置100與圖8的顯示裝置800差異在於側表面114。詳細來說,顯示裝置800的側表面114實質上垂直於第一表面112與第二表面116。如圖8所示,測試結構120e的第一橋接線路B6分布於第二表面116與側表面114上,且第一橋接線路B6沒有分布於第一表面112上。相同於圖1A的顯示裝置100,顯示裝置800的第一橋接線路B6電性連接且覆蓋第一接觸墊122與第二接觸墊126。FIG8 is a three-dimensional perspective view of a portion of a
請參考圖1A、圖3A、圖4A、圖5A以及圖8,在一些實施方式中,第三測試墊134於方向Z上至少部分重疊對應第四測試墊138,第三接觸墊132於方向Z上至少部分重疊對應第四接觸墊136。在一些實施方式中,多個前述的顯示裝置100、300、400、500、600、700、800形成拼接式顯示器,其中多個顯示裝置呈規則排列,並且彼此相連。1A, 3A, 4A, 5A and 8, in some embodiments, the
綜上所述,由於本揭示內容的測試結構的橋接線路遠離顯示區中的電子元件,因此可以避免顯示裝置因ESD而造成鄰近周邊區的電子元件的損壞之情形,從而提升製程良率。In summary, since the bridge circuit of the test structure disclosed in the present invention is far away from the electronic components in the display area, it is possible to avoid the electronic components in the surrounding area of the display device being damaged due to ESD, thereby improving the process yield.
上文概述多個實施方式的特徵,使得熟習此項技術者可更好地理解本揭示內容的態樣。熟習此項技術者應瞭解,可輕易使用本揭示內容作為設計或修改其他製程及結構的基礎,以便執行本文所介紹的實施方式的相同目的及/或實現相同優點。熟習此項技術者亦應認識到,此類等效構造並未脫離本揭示內容的精神及範疇,且可在不脫離本揭示內容的精神及範疇的情況下產生本文的各種變化、取代及更改。The above summarizes the features of multiple implementations so that those skilled in the art can better understand the state of the disclosure. Those skilled in the art should understand that the disclosure can be easily used as a basis for designing or modifying other processes and structures to perform the same purpose and/or achieve the same advantages of the implementations described herein. Those skilled in the art should also recognize that such equivalent structures do not depart from the spirit and scope of the disclosure, and that various changes, substitutions, and modifications of the disclosure can be made without departing from the spirit and scope of the disclosure.
100,100A:顯示裝置
110:顯示面板
112:第一表面
114:側表面
116:第二表面
120,120a,120b,120c,120d,120e:測試結構
122:第一接觸墊
122s:側邊
124:第一測試墊
124s:側邊
126:第二接觸墊
126s:側邊
128:第二測試墊
128s:側邊
130:驅動結構
131:功能元件
132:第三接觸墊
132s:側邊
134:第三測試墊
134s:側邊
135:接墊
136:第四接觸墊
136s:側邊
138:第四測試墊
138s:側邊
139:軟性電路板
210,210a:絕緣層
300,400,500,600,700,800:顯示裝置
B1,B3,B4,B5,B6:第一橋接線路
B2:第二橋接線路
R1:顯示區
R2:周邊區
S1:第一斜面
S2:第二斜面
PS:平面
U:重複結構
X,Y,Z:方向100, 100A: display device
110: display panel
112: first surface
114: side surface
116:
當結合附圖閱讀時,根據以下詳細描述可以最好地理解本揭示內容的各個態樣。應了解的是,根據行業中的標準實踐,各種特徵未按比例繪製。實際上,為了清楚起見,可以任意增加或減小各種特徵的尺寸。 圖1A為根據本揭示內容之一實施方式所繪示部分的顯示裝置的三維透視圖。 圖1B為圖1A的顯示裝置的展開圖。 圖2為圖1B的顯示裝置於另一實施方式中的展開圖。 圖3A為根據本揭示內容之一實施方式所繪示部分的顯示裝置的三維透視圖。 圖3B為圖3A的顯示裝置的展開圖。 圖4A為根據本揭示內容之一實施方式所繪示部分的顯示裝置的三維透視圖。 圖4B為圖4A的顯示裝置的展開圖。 圖5A為根據本揭示內容之一實施方式所繪示部分的顯示裝置的三維透視圖。 圖5B為圖5A的顯示裝置的展開圖。 圖6為根據本揭示內容之一實施方式所繪示部分的顯示裝置的展開圖。 圖7為根據本揭示內容之一實施方式所繪示部分的顯示裝置的展開圖。 圖8為根據本揭示內容之一實施方式所繪示部分的顯示裝置的三維透視圖。 When read in conjunction with the accompanying drawings, the various aspects of the present disclosure can be best understood according to the following detailed description. It should be understood that various features are not drawn to scale in accordance with standard practices in the industry. In fact, the sizes of various features may be arbitrarily increased or decreased for clarity. FIG. 1A is a three-dimensional perspective view of a display device of a portion shown in accordance with one embodiment of the present disclosure. FIG. 1B is an expanded view of the display device of FIG. 1A. FIG. 2 is an expanded view of the display device of FIG. 1B in another embodiment. FIG. 3A is a three-dimensional perspective view of a display device of a portion shown in accordance with one embodiment of the present disclosure. FIG. 3B is an expanded view of the display device of FIG. 3A. FIG. 4A is a three-dimensional perspective view of a display device of a portion shown in accordance with one embodiment of the present disclosure. FIG. 4B is an unfolded view of the display device of FIG. 4A. FIG. 5A is a three-dimensional perspective view of a portion of the display device depicted according to one embodiment of the present disclosure. FIG. 5B is an unfolded view of the display device of FIG. 5A. FIG. 6 is an unfolded view of a portion of the display device depicted according to one embodiment of the present disclosure. FIG. 7 is an unfolded view of a portion of the display device depicted according to one embodiment of the present disclosure. FIG. 8 is a three-dimensional perspective view of a portion of the display device depicted according to one embodiment of the present disclosure.
國內寄存資訊(請依寄存機構、日期、號碼順序註記) 無 國外寄存資訊(請依寄存國家、機構、日期、號碼順序註記) 無 Domestic storage information (please note in the order of storage institution, date, and number) None Foreign storage information (please note in the order of storage country, institution, date, and number) None
100:顯示裝置 100: Display device
110:顯示面板 110: Display panel
112:第一表面 112: First surface
114:側表面 114: Side surface
116:第二表面 116: Second surface
120:測試結構 120:Test structure
130:驅動結構 130: Driving structure
131:功能元件 131: Functional components
132:第三接觸墊 132: Third contact pad
134:第三測試墊 134: Third test pad
136:第四接觸墊 136: Fourth contact pad
138:第四測試墊 138: Fourth test pad
B1:第一橋接線路 B1: First bridge line
R1:顯示區 R1: Display area
R2:周邊區 R2: Peripheral area
S1:第一斜面 S1: First slope
S2:第二斜面 S2: Second slope
PS:平面 PS: plane
X,Y,Z:方向 X,Y,Z: Direction
Claims (10)
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JP2021033307A (en) * | 2019-08-28 | 2021-03-01 | エルジー ディスプレイ カンパニー リミテッド | Display device |
JP2021523391A (en) * | 2019-04-19 | 2021-09-02 | 北京小米移動軟件有限公司Beijing Xiaomi Mobile Software Co.,Ltd. | Mobile terminals, screen control methods, devices, programs and recording media |
TW202206907A (en) * | 2020-08-14 | 2022-02-16 | 友達光電股份有限公司 | Display device and manufacturing method thereof |
TW202242497A (en) * | 2021-04-16 | 2022-11-01 | 友達光電股份有限公司 | Display device |
TW202303545A (en) * | 2021-03-26 | 2023-01-16 | 群創光電股份有限公司 | Manufacturing method of electronic device |
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JP2021523391A (en) * | 2019-04-19 | 2021-09-02 | 北京小米移動軟件有限公司Beijing Xiaomi Mobile Software Co.,Ltd. | Mobile terminals, screen control methods, devices, programs and recording media |
JP2021033307A (en) * | 2019-08-28 | 2021-03-01 | エルジー ディスプレイ カンパニー リミテッド | Display device |
TW202206907A (en) * | 2020-08-14 | 2022-02-16 | 友達光電股份有限公司 | Display device and manufacturing method thereof |
TW202303545A (en) * | 2021-03-26 | 2023-01-16 | 群創光電股份有限公司 | Manufacturing method of electronic device |
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