TW202207504A - Display device and manufacturing method thereof - Google Patents

Display device and manufacturing method thereof Download PDF

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TW202207504A
TW202207504A TW110124073A TW110124073A TW202207504A TW 202207504 A TW202207504 A TW 202207504A TW 110124073 A TW110124073 A TW 110124073A TW 110124073 A TW110124073 A TW 110124073A TW 202207504 A TW202207504 A TW 202207504A
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conductive pattern
substrate
display device
trace
protective layer
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TW110124073A
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TWI758203B (en
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陳梵宇
莊皓安
成昀
謝文章
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友達光電股份有限公司
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  • Electroluminescent Light Sources (AREA)
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Abstract

A display device includes a substrate, display elements, bonding pads, signal lines, a first conductive pattern and an insulating layer. The substrate has a first surface, a second surface opposite to the first surface, and side surfaces connecting the first surface and the second surface. The first surface has a display area and a peripheral area located on at least one side of the display area. The display elements are located on the display area. The bonding pads are located on the peripheral area. The signal lines are electrically connected to the bonding pads and extends from the peripheral area into the display area. The first conductive pattern partially overlaps the signal lines. The surface of the first conductive pattern has a laser trace. An antistatic ring includes the first conductive pattern. The insulating layer is located between the first conductive pattern and the signal lines.

Description

顯示裝置及其製造方法Display device and method of manufacturing the same

本發明是有關於一種顯示裝置，且特別是有關於一種包括抗靜電環的顯示裝置及其製造方法。The present invention relates to a display device, and more particularly, to a display device including an antistatic ring and a manufacturing method thereof.

發光二極體是一種電致發光的半導體元件，具有效率高、壽命長、不易破損、反應速度快、可靠性高等優點。隨著大量的時間與金錢的投入，發光二極體已能運用於顯示裝置（如手機、電腦螢幕、電視等）中。在製造發光二極體顯示裝置的製程中，常常會包括雷射製程。雷射製程例如用於移除製程中使用的臨時載板或用於移除電子元件或導線中不需要或損壞的部分。然而，在執行雷射製程時，很容易因為雷射的能量過大而導致雷射損傷到不想要移除的電子元件或導線。Light emitting diode is a kind of electroluminescent semiconductor element, which has the advantages of high efficiency, long life, not easy to break, fast response speed and high reliability. With the investment of a lot of time and money, light-emitting diodes have been used in display devices (such as mobile phones, computer screens, TVs, etc.). In the manufacturing process of the light emitting diode display device, a laser process is often included. Laser processes are used, for example, to remove temporary carriers used in the process or to remove unwanted or damaged parts of electronic components or wires. However, when the laser process is performed, it is easy to cause the laser to damage electronic components or wires that are not intended to be removed due to the excessive energy of the laser.

本發明提供一種顯示裝置，能避免訊號線在雷射製程中損壞，且能減少靜電對顯示裝製造成損害。The present invention provides a display device, which can avoid the damage of signal lines in the laser process, and can reduce the damage to the display device caused by static electricity.

本發明提供一種顯示裝置的製造方法，能避免訊號線在雷射製程中損壞，且能減少靜電對顯示裝製造成損害。The present invention provides a manufacturing method of a display device, which can avoid the damage of the signal line in the laser process, and can reduce the damage of the display device caused by static electricity.

本發明的至少一實施例提供一種顯示裝置。顯示裝置包括基板、多個顯示元件、多個接合墊、多個訊號線、第一導電圖案以及絕緣層。基板具有第一面、相對於第一面的第二面以及連接第一面與第二面的多個側面。第一面具有顯示區以及位於顯示區至少一側的周邊區。顯示元件位於顯示區上。接合墊位於周邊區上。訊號線電性連接接合墊，且自周邊區延伸進顯示區。第一導電圖案部分重疊於訊號線。第一導電圖案表面具有雷射痕跡。抗靜電環包括第一導電圖案。絕緣層位於第一導電圖案與訊號線之間。At least one embodiment of the present invention provides a display device. The display device includes a substrate, a plurality of display elements, a plurality of bonding pads, a plurality of signal lines, a first conductive pattern and an insulating layer. The substrate has a first surface, a second surface opposite to the first surface, and a plurality of side surfaces connecting the first surface and the second surface. The first surface has a display area and a peripheral area on at least one side of the display area. Display elements are located on the display area. Bond pads are located on the peripheral region. The signal line is electrically connected to the bonding pad, and extends from the peripheral area into the display area. The first conductive pattern is partially overlapped with the signal line. The surface of the first conductive pattern has laser traces. The antistatic ring includes a first conductive pattern. The insulating layer is located between the first conductive pattern and the signal line.

本發明的至少一實施例提供一種顯示裝置的製造方法，包括：提供電路基板，電路基板包括基板、多個接合墊、多個訊號線、第一導電圖案以及絕緣層。基板具有第一面、相對於第一面的第二面以及連接第一面與第二面的多個側面。第一面具有顯示區以及位於顯示區至少一側的周邊區。接合墊位於周邊區上。訊號線電性連接接合墊，且自周邊區延伸進顯示區。第一導電圖案部分重疊於訊號線。絕緣層位於第一導電圖案與訊號線之間。形成保護層於基板的第一面上。執行雷射製程以將保護層分為第一部分以及第二部分。第一部分重疊於周邊區，且第二部分重疊於顯示區。雷射製程於第一導電圖案上留下雷射痕跡。移除保護層的第一部分。形成至少一連接結構於接合墊上，其中第一抗靜電環包括第一導電圖案。移除保護層的第二部分。形成多個顯示元件於顯示區上。At least one embodiment of the present invention provides a method for manufacturing a display device, including: providing a circuit substrate, the circuit substrate includes a substrate, a plurality of bonding pads, a plurality of signal lines, a first conductive pattern, and an insulating layer. The substrate has a first surface, a second surface opposite to the first surface, and a plurality of side surfaces connecting the first surface and the second surface. The first surface has a display area and a peripheral area on at least one side of the display area. Bond pads are located on the peripheral region. The signal line is electrically connected to the bonding pad, and extends from the peripheral area into the display area. The first conductive pattern is partially overlapped with the signal line. The insulating layer is located between the first conductive pattern and the signal line. A protective layer is formed on the first surface of the substrate. A laser process is performed to divide the protective layer into a first part and a second part. The first part overlaps the peripheral area, and the second part overlaps the display area. The laser process leaves laser traces on the first conductive pattern. Remove the first part of the protective layer. At least one connection structure is formed on the bonding pad, wherein the first antistatic ring includes a first conductive pattern. Remove the second part of the protective layer. A plurality of display elements are formed on the display area.

圖1A是依照本發明的一實施例的一種電路基板的局部示意圖。圖1B是圖1A的顯示裝置的剖面示意圖，其中圖1B對應了圖1A之線A-A’的位置。圖1C是依照本發明的一實施例的一種電路基板的俯視示意圖。圖1D是依照本發明的一實施例的一種電路基板的仰視示意圖。FIG. 1A is a partial schematic diagram of a circuit substrate according to an embodiment of the present invention. FIG. 1B is a schematic cross-sectional view of the display device of FIG. 1A , wherein FIG. 1B corresponds to the position of the line A-A' of FIG. 1A . 1C is a schematic top view of a circuit substrate according to an embodiment of the present invention. 1D is a schematic bottom view of a circuit substrate according to an embodiment of the present invention.

請參考圖1A至圖1D，提供電路基板10。電路基板10包括基板100、多個接合墊110、多個訊號線120、第一導電圖案132以及第一絕緣層140。在本實施例中，電路基板10還包括第二絕緣層150、多個導孔162以及多個電極164。Referring to FIGS. 1A to 1D , a circuit substrate 10 is provided. The circuit substrate 10 includes a substrate 100 , a plurality of bonding pads 110 , a plurality of signal lines 120 , a first conductive pattern 132 and a first insulating layer 140 . In this embodiment, the circuit substrate 10 further includes a second insulating layer 150 , a plurality of vias 162 and a plurality of electrodes 164 .

基板100具有第一面102、相對於第一面102的第二面104以及連接第一面102與第二面104的多個側面106。第一面102具有顯示區DA以及位於顯示區DA至少一側的周邊區PA。基板100之材質可為玻璃、石英、有機聚合物、或是不透光/反射材料（例如：導電材料、金屬、晶圓、陶瓷或其他可適用的材料）或是其他可適用的材料。若使用導電材料或金屬時，則在基板100上覆蓋一層絕緣層（未繪示），以避免短路問題。在一些實施例中，基板100為可撓性的材料，舉例而言包括聚醯胺（Polyamide，PA）、聚亞醯胺（Polyimide，PI）、聚甲基丙烯酸甲酯（Poly（methyl methacrylate），PMMA）、聚萘二甲酸乙二醇酯（Polyethylene naphthalate，PEN）、聚對苯二甲酸乙二酯（Polyethylene terephthalate，PET）、玻璃纖維強化塑膠（Fiber reinforced plastics，FRP）、聚醚醚酮（Polyetheretherketone，PEEK）、環氧樹脂或其他合適的材料或上述材料之組合。The substrate 100 has a first surface 102 , a second surface 104 opposite to the first surface 102 , and a plurality of side surfaces 106 connecting the first surface 102 and the second surface 104 . The first surface 102 has a display area DA and a peripheral area PA on at least one side of the display area DA. The material of the substrate 100 can be glass, quartz, organic polymer, or opaque/reflective material (eg, conductive material, metal, wafer, ceramic or other applicable materials) or other applicable materials. If a conductive material or metal is used, an insulating layer (not shown) is covered on the substrate 100 to avoid the short circuit problem. In some embodiments, the substrate 100 is a flexible material, for example, including polyamide (Polyamide, PA), polyimide (Polyimide, PI), polymethyl methacrylate (Poly (methyl methacrylate)) , PMMA), polyethylene naphthalate (PEN), polyethylene terephthalate (PET), fiberglass reinforced plastics (FRP), polyetheretherketone (Polyetheretherketone, PEEK), epoxy resin or other suitable materials or a combination of the above materials.

接合墊110位於周邊區PA上。接合墊110為單層或多層的導電材料。接合墊110之材質可為金屬、金屬氧化物、金屬氮化物、其他導電材料或上述導電材料的組合。在本揭露的圖式中，各種元件的數量僅是用於示意，各種元件的數量不限於圖式所顯示的數量。在本實施例中，接合墊110靠近基板100的其中一個側面106設置，但本發明不以此為限。在其他實施例中，接合墊110靠近基板100的相對兩個側面106設置，也可以說接合墊110可設置於顯示區DA的相對兩側。The bonding pads 110 are located on the peripheral area PA. The bonding pad 110 is a single layer or multiple layers of conductive material. The material of the bonding pad 110 can be metal, metal oxide, metal nitride, other conductive materials or a combination of the above conductive materials. In the drawings of the present disclosure, the numbers of various elements are only for illustration, and the numbers of various elements are not limited to the numbers shown in the drawings. In this embodiment, the bonding pads 110 are disposed close to one of the side surfaces 106 of the substrate 100 , but the invention is not limited thereto. In other embodiments, the bonding pads 110 are disposed close to two opposite sides 106 of the substrate 100 . It can also be said that the bonding pads 110 can be disposed on opposite sides of the display area DA.

訊號線120位於周邊區PA上。訊號線120電性連接接合墊110，且自周邊區PA延伸進顯示區DA。訊號線120為單層或多層的導電材料。訊號線120之材質可為金屬、金屬氧化物、金屬氮化物、其他導電材料或上述導電材料的組合。在本實施例中，訊號線120與接合墊110一體成形，但本發明不以此為限。在其他實施例中，訊號線120與接合墊110分別屬於不同導電層，且透過絕緣層（未繪出）中的通孔而彼此電性連接。在一些實施例中，訊號線120上更設置有其他絕緣層（未繪出）。The signal line 120 is located on the peripheral area PA. The signal lines 120 are electrically connected to the bonding pads 110 and extend from the peripheral area PA into the display area DA. The signal line 120 is a single-layer or multi-layer conductive material. The material of the signal line 120 can be metal, metal oxide, metal nitride, other conductive materials or a combination of the above conductive materials. In this embodiment, the signal line 120 and the bonding pad 110 are integrally formed, but the invention is not limited thereto. In other embodiments, the signal line 120 and the bonding pad 110 belong to different conductive layers respectively, and are electrically connected to each other through through holes in the insulating layer (not shown). In some embodiments, other insulating layers (not shown) are further disposed on the signal lines 120 .

第一絕緣層140位於基板100的第一面102上。在本實施例中，第一絕緣層140覆蓋顯示區DA上的訊號線120，並暴露出周邊區PA上的接合墊110。第一絕緣層140為單層或多層結構。第一絕緣層140的材料包含無機材料（例如：氧化矽、氮化矽、氮氧化矽、其他合適的材料或上述至少二種材料的堆疊層）、有機材料或其他合適的材料或上述之組合。The first insulating layer 140 is located on the first surface 102 of the substrate 100 . In this embodiment, the first insulating layer 140 covers the signal lines 120 on the display area DA, and exposes the bonding pads 110 on the peripheral area PA. The first insulating layer 140 has a single-layer or multi-layer structure. The material of the first insulating layer 140 includes inorganic materials (for example: silicon oxide, silicon nitride, silicon oxynitride, other suitable materials or a stacked layer of at least two of the above materials), organic materials or other suitable materials or a combination of the above .

第一導電圖案132位於第一絕緣層140上，且第一導電圖案132部分重疊於訊號線120。第一絕緣層140位於第一導電圖案132與訊號線120之間。在本實施例中，電路基板10包括第一抗靜電環130，且第一抗靜電環130包括第一導電圖案132。在本實施例中，第一抗靜電環130（或第一導電圖案132）為環狀結構，且第一抗靜電環130（或第一導電圖案132）環繞顯示區DA。The first conductive pattern 132 is located on the first insulating layer 140 , and the first conductive pattern 132 is partially overlapped with the signal line 120 . The first insulating layer 140 is located between the first conductive pattern 132 and the signal line 120 . In this embodiment, the circuit substrate 10 includes a first antistatic ring 130 , and the first antistatic ring 130 includes a first conductive pattern 132 . In this embodiment, the first antistatic ring 130 (or the first conductive pattern 132 ) is a ring-shaped structure, and the first antistatic ring 130 (or the first conductive pattern 132 ) surrounds the display area DA.

第一導電圖案132為單層或多層的導電材料。第一導電圖案132之材質包括金屬（例如鋁、銀、銅或其他可導電且可反射及/或吸收雷射的材料）或其他合適的材料。在本實施例中，第一抗靜電環130為一體成形之環狀結構，且整個第一抗靜電環130皆位於第一面102上，但本發明不以此為限。在其他實施例中，第一抗靜電環130分佈於第一面102以及側面106上。在其他實施例中，第一抗靜電環130分佈於第一面102、側面106以及底面104上。The first conductive pattern 132 is a single-layer or multi-layer conductive material. The material of the first conductive pattern 132 includes metal (eg, aluminum, silver, copper, or other materials that can conduct electricity and can reflect and/or absorb laser light) or other suitable materials. In this embodiment, the first antistatic ring 130 is an integrally formed annular structure, and the entire first antistatic ring 130 is located on the first surface 102 , but the invention is not limited to this. In other embodiments, the first antistatic rings 130 are distributed on the first surface 102 and the side surface 106 . In other embodiments, the first antistatic rings 130 are distributed on the first surface 102 , the side surface 106 and the bottom surface 104 .

第二絕緣層150位於第一絕緣層140上。在本實施例中，第二絕緣層150為圖案化的絕緣層，且第二絕緣層150形成於顯示區DA中。在本實施例中，第二絕緣層150未覆蓋第一導電圖案132，但本發明不以此為限。在其他實施例中，第二絕緣層150覆蓋整個第一絕緣層140以及第一導電圖案132。The second insulating layer 150 is located on the first insulating layer 140 . In this embodiment, the second insulating layer 150 is a patterned insulating layer, and the second insulating layer 150 is formed in the display area DA. In this embodiment, the second insulating layer 150 does not cover the first conductive pattern 132, but the invention is not limited thereto. In other embodiments, the second insulating layer 150 covers the entire first insulating layer 140 and the first conductive pattern 132 .

電極164形成於第二絕緣層150上，且透過導孔162而電性連接至訊號線120，其中導孔162穿過第一絕緣層140以及第二絕緣層150。在圖1B中，訊號線120與電極164之間僅包含第一絕緣層140、第二絕緣層150以及導孔162，但本發明不以此為限。在一些實施例中，訊號線120與電極164之間還包括其他絕緣層以及其他導電結構。在一些實施例中，訊號線120與電極164之間還包括其他主動元件（未繪出）或被動元件（未繪出），訊號線120透過前述主動元件或被動元件而電性連接至電極164。The electrode 164 is formed on the second insulating layer 150 and is electrically connected to the signal line 120 through the via hole 162 , wherein the via hole 162 passes through the first insulating layer 140 and the second insulating layer 150 . In FIG. 1B , only the first insulating layer 140 , the second insulating layer 150 and the via hole 162 are included between the signal line 120 and the electrode 164 , but the invention is not limited thereto. In some embodiments, other insulating layers and other conductive structures are further included between the signal line 120 and the electrode 164 . In some embodiments, other active elements (not shown) or passive elements (not shown) are further included between the signal line 120 and the electrode 164 , and the signal line 120 is electrically connected to the electrode 164 through the aforementioned active element or passive element .

在本實施例中，電路基板10還包括第二抗靜電環170、接合墊180、訊號線190以及絕緣層142。第二抗靜電環170、接合墊180、訊號線190以及絕緣層142位於基板100的第二面104上。接合墊180電性連接至訊號線190。絕緣層142覆蓋訊號線190，且第二抗靜電環170位於絕緣層142上。在本實施例中，接合墊180靠近基板100的其中一個側面106設置，但本發明不以此為限。在其他實施例中，接合墊180靠近基板100的相對兩個側面106設置。在一些實施例中，第一抗靜電環130與第二抗靜電環170的材料皆包括金屬，且第一抗靜電環130及/或第二抗靜電環170電性連接至接地電壓，舉例來說，第一抗靜電環130及/或第二抗靜電環170電性連接至顯示區DA中之主動元件（未繪出）的VSS訊號線。In this embodiment, the circuit substrate 10 further includes a second antistatic ring 170 , a bonding pad 180 , a signal line 190 and an insulating layer 142 . The second antistatic ring 170 , the bonding pads 180 , the signal lines 190 and the insulating layer 142 are located on the second surface 104 of the substrate 100 . The bonding pads 180 are electrically connected to the signal lines 190 . The insulating layer 142 covers the signal line 190 , and the second antistatic ring 170 is located on the insulating layer 142 . In this embodiment, the bonding pads 180 are disposed close to one of the side surfaces 106 of the substrate 100 , but the invention is not limited thereto. In other embodiments, the bond pads 180 are disposed adjacent to opposite sides 106 of the substrate 100 . In some embodiments, the materials of the first antistatic ring 130 and the second antistatic ring 170 both include metal, and the first antistatic ring 130 and/or the second antistatic ring 170 are electrically connected to a ground voltage, for example That is, the first antistatic ring 130 and/or the second antistatic ring 170 are electrically connected to the VSS signal line of the active element (not shown) in the display area DA.

圖2B是依照本發明的一實施例的一種顯示裝置的製造方法的俯視示意圖，圖2A為圖2B的剖面圖。請參考圖2A與圖2B，形成保護層200於基板100的第一面102上。保護層200覆蓋顯示區DA以及週邊區PA。在本實施例中，保護層200整面地覆蓋電極164、第一導電圖案132以及接合墊150。FIG. 2B is a schematic top view of a manufacturing method of a display device according to an embodiment of the present invention, and FIG. 2A is a cross-sectional view of FIG. 2B . Referring to FIGS. 2A and 2B , a protective layer 200 is formed on the first surface 102 of the substrate 100 . The protective layer 200 covers the display area DA and the peripheral area PA. In this embodiment, the protective layer 200 covers the electrodes 164 , the first conductive patterns 132 and the bonding pads 150 all over.

在本實施例中，形成保護層200的方法例如為包括塗佈或印刷（例如網印）絕緣材料（例如聚氯乙烯(PVC)、樹脂或其他合適的材料）於基板100的第一面102上，接著再將前述絕緣材料固化以形成保護層200。在其他實施例中，保護層200為具有黏性的保護膜，且保護層200可以用任何合適的印刷方式形成並覆蓋於基板100的第一面102上。在一些實施例中，以滾軸將保護層200印刷於基板100的第一面102上。In this embodiment, the method for forming the protective layer 200 includes, for example, coating or printing (eg, screen printing) an insulating material (eg, polyvinyl chloride (PVC), resin, or other suitable materials) on the first surface 102 of the substrate 100 Then, the aforementioned insulating material is cured to form the protective layer 200 . In other embodiments, the protective layer 200 is an adhesive protective film, and the protective layer 200 can be formed and covered on the first surface 102 of the substrate 100 by any suitable printing method. In some embodiments, the protective layer 200 is printed on the first side 102 of the substrate 100 with a roller.

在本實施例中，保護層200的寬度WT1小於基板100的第一面102的寬度WT2，使部分第一導電圖案132在保護層200的寬度WT1的方向上被保護層200暴露出來，但本發明不以此為限。在其他實施例中，保護層200的寬度WT1約等於基板100的第一面102的寬度WT2，且保護層200完全覆蓋第一導電圖案132。In this embodiment, the width WT1 of the protective layer 200 is smaller than the width WT2 of the first surface 102 of the substrate 100 , so that part of the first conductive pattern 132 is exposed by the protective layer 200 in the direction of the width WT1 of the protective layer 200 . Inventions are not limited to this. In other embodiments, the width WT1 of the protective layer 200 is approximately equal to the width WT2 of the first surface 102 of the substrate 100 , and the protective layer 200 completely covers the first conductive pattern 132 .

在一些實施例中，除了於基板100的第一面102上形成保護層200之外，更於基板100的第二面104上形成保護層200a，且保護層200a覆蓋第二抗靜電環170、接合墊180以及訊號線190。在一些實施例中，保護層200a的寬度約等於保護層200的寬度WT1。In some embodiments, in addition to forming the protective layer 200 on the first surface 102 of the substrate 100, a protective layer 200a is further formed on the second surface 104 of the substrate 100, and the protective layer 200a covers the second antistatic ring 170, Bonding pads 180 and signal lines 190 . In some embodiments, the width of the protective layer 200a is approximately equal to the width WT1 of the protective layer 200 .

圖3B是依照本發明的一實施例的一種顯示裝置的製造方法的俯視示意圖，圖3A為圖3B的剖面圖。請參考圖3A與圖3B，執行雷射製程LS以將保護層200分為第一部分210以及第二部分220。第一部分210重疊於周邊區PA，且第二部分220重疊於顯示區DA。執行雷射製程LS以將保護層200a分為第一部分210a以及第二部分220a。第一部分210a重疊於周邊區PA，且第二部分220a重疊於顯示區DA。保護層200以及保護層200a可以在相同或不同的時間切割。3B is a schematic top view of a manufacturing method of a display device according to an embodiment of the present invention, and FIG. 3A is a cross-sectional view of FIG. 3B . Referring to FIGS. 3A and 3B , a laser process LS is performed to divide the protective layer 200 into a first part 210 and a second part 220 . The first portion 210 overlaps the peripheral area PA, and the second portion 220 overlaps the display area DA. A laser process LS is performed to divide the protective layer 200a into a first portion 210a and a second portion 220a. The first portion 210a overlaps the peripheral area PA, and the second portion 220a overlaps the display area DA. The protective layer 200 and the protective layer 200a may be cut at the same or different times.

雷射製程LS於第一導電圖案132上留下雷射痕跡LT。雷射痕跡LT例如為第一導電圖案132在吸收雷射的能量後所產生之顏色深度不同或表面凹凸不平的部分。第一導電圖案132可以保護訊號線120不被雷射損壞，因此可以提高顯示裝置的製造良率。The laser process LS leaves a laser trace LT on the first conductive pattern 132 . The laser trace LT is, for example, a portion of the first conductive pattern 132 with different color depths or uneven surface after absorbing the energy of the laser. The first conductive pattern 132 can protect the signal line 120 from being damaged by the laser, thereby improving the manufacturing yield of the display device.

在一些實施例中，雷射製程LS是選用波長約為103 奈米至104 奈米的雷射，且第一導電圖案132所選用的材料可以反射及/或吸收波長約為103 奈米至104 奈米的雷射。在一些實施例中，選用對波長約為103 奈米至104 奈米的雷射高反射且低吸收的材料（例如金屬）作為第一導電圖案132，然而，只要有少部分的雷射被第一導電圖案132所吸收，即會於第一導電圖案132表面留下雷射痕跡LT。在本實施例中，第一導電圖案132重疊於訊號線120的部分的寬度W1為30微米至70微米，藉此避免雷射製程LS出現的誤差導致雷射照射到訊號線120。In some embodiments, the laser process LS uses a laser with a wavelength of about 10 3 nm to 10 4 nm, and the material selected for the first conductive pattern 132 can reflect and/or absorb a wavelength of about 10 3 nm meters to 10 4 nm lasers. In some embodiments, a material (such as metal) with high reflection and low absorption for laser light with a wavelength of about 10 3 nm to 10 4 nm is selected as the first conductive pattern 132 , however, as long as there is a small part of the laser light Absorbed by the first conductive pattern 132 , a laser trace LT is left on the surface of the first conductive pattern 132 . In this embodiment, the width W1 of the portion of the first conductive pattern 132 overlapping the signal line 120 is 30 μm to 70 μm, so as to prevent the laser from irradiating the signal line 120 due to errors in the laser process LS.

請參考圖4，移除保護層200的第一部分210以暴露出接合墊110。移除保護層200a的第一部分210a以暴露出接合墊180。在其他實施例中，當接合墊110以及接合墊180靠近基板100的相對兩個側面106設置時，切割保護層200兩次以使位於基板100的相對兩個側面106之接合墊110得以被暴露出來，切割保護層200a兩次以使位於基板100的相對兩個側面106之接合墊180得以被暴露出來。換句話說，當接合墊110以及接合墊180靠近基板100的相對兩個側面106設置時，第一導電圖案132上可以有對應於基板100的相對兩個側面106之兩條雷射痕跡LT，且第二抗靜電環170上可以有對應於基板100的相對兩個側面106之兩條雷射痕跡LT。Referring to FIG. 4 , the first portion 210 of the protective layer 200 is removed to expose the bonding pads 110 . The first portion 210a of the protective layer 200a is removed to expose the bond pads 180 . In other embodiments, when the bond pads 110 and the bond pads 180 are disposed near the opposite sides 106 of the substrate 100 , the protective layer 200 is cut twice to expose the bond pads 110 on the opposite sides 106 of the substrate 100 Then, the protective layer 200 a is cut twice to expose the bonding pads 180 on the opposite sides 106 of the substrate 100 . In other words, when the bonding pads 110 and the bonding pads 180 are disposed close to the two opposite sides 106 of the substrate 100 , the first conductive pattern 132 may have two laser traces LT corresponding to the two opposite sides 106 of the substrate 100 , And the second antistatic ring 170 may have two laser traces LT corresponding to the two opposite side surfaces 106 of the substrate 100 .

請參考圖5，形成至少一連接結構310於接合墊150上。在本實施例中，連接結構310從基板100的第一面102延伸至基板100的側面106，且從基板100的側面106延伸至基板100的第二面104。在一些實施例中，連接結構310電性連接接合墊110至接合墊180在一些實施例中，連接結構310包括導電膠，例如銀膠或其他合適的材料。在一些實施例中，第二面104之其他接合墊適用於與其他電路板、晶片或驅動電路電性連接。藉由接合墊110、連接結構310以及接合墊180之設置，其他電路板、晶片或驅動電路可設置於基板100的第二面104。Referring to FIG. 5 , at least one connecting structure 310 is formed on the bonding pad 150 . In this embodiment, the connection structure 310 extends from the first surface 102 of the substrate 100 to the side surface 106 of the substrate 100 , and extends from the side surface 106 of the substrate 100 to the second surface 104 of the substrate 100 . In some embodiments, the connection structure 310 electrically connects the bond pad 110 to the bond pad 180 In some embodiments, the connection structure 310 includes a conductive glue, such as silver glue or other suitable materials. In some embodiments, other bonding pads on the second side 104 are suitable for electrical connection with other circuit boards, chips or driving circuits. With the arrangement of the bonding pads 110 , the connection structures 310 and the bonding pads 180 , other circuit boards, chips or driving circuits can be arranged on the second surface 104 of the substrate 100 .

保護層320以及保護層322形成於連接結構310上。在一些實施例中，保護層320以及保護層322例如透過塗佈的方式形成於連接結構310上。The protective layer 320 and the protective layer 322 are formed on the connection structure 310 . In some embodiments, the protective layer 320 and the protective layer 322 are formed on the connection structure 310 by, for example, coating.

在本實施例中，保護層200覆蓋了顯示區DA，因此，形成連接結構310的製程、形成保護層320的製程以及形成保護層322的製程都不會對顯示區DA中的元件造成損傷，藉此提高顯示裝置的製造良率。In this embodiment, the protective layer 200 covers the display area DA. Therefore, the process of forming the connection structure 310, the process of forming the protective layer 320, and the process of forming the protective layer 322 will not cause damage to the components in the display area DA. Thereby, the manufacturing yield of the display device is improved.

在其他實施例中，當接合墊110以及接合墊180靠近基板100的相對兩個側面106設置時，於基板100的相對兩個側面106皆形成連接結構310、保護層320以及保護層322。In other embodiments, when the bonding pads 110 and the bonding pads 180 are disposed near two opposite sides 106 of the substrate 100 , the connecting structures 310 , the protective layer 320 and the protective layer 322 are formed on the opposite two sides 106 of the substrate 100 .

請參考圖6，移除保護層200的第二部分220。形成多個顯示元件400於顯示區DA上。顯示元件400電性連接至電極164。Referring to FIG. 6 , the second portion 220 of the protective layer 200 is removed. A plurality of display elements 400 are formed on the display area DA. The display element 400 is electrically connected to the electrode 164 .

在本實施例中，顯示元件400為微型發光二極體（Micro-LED），但本發明不以此為限。在其他實施例中，形成有機發光二極體（OLED）於顯示區DA上。In this embodiment, the display element 400 is a micro light-emitting diode (Micro-LED), but the invention is not limited to this. In other embodiments, an organic light emitting diode (OLED) is formed on the display area DA.

在本實施例中，在移除保護層200的第二部分220之後才形成顯示元件400於顯示區DA上，但本發明不以此為限。在一些實施例中，移除保護層200a的第二部分220a。In this embodiment, the display element 400 is formed on the display area DA after the second portion 220 of the protective layer 200 is removed, but the invention is not limited thereto. In some embodiments, the second portion 220a of the protective layer 200a is removed.

圖7A是依照本發明的一實施例的一種顯示裝置的局部示意圖。圖7B是圖7A的顯示裝置的剖面示意圖，其中圖7B對應了圖7A之線A-A’的位置。圖7C是依照本發明的一實施例的一種顯示裝置的俯視示意圖。圖7D是依照本發明的一實施例的一種顯示裝置的仰視示意圖。圖7E是依照本發明的一實施例的一種第一抗靜電環與第二抗靜電環的立體示意圖。FIG. 7A is a partial schematic diagram of a display device according to an embodiment of the present invention. FIG. 7B is a schematic cross-sectional view of the display device of FIG. 7A , wherein FIG. 7B corresponds to the position of the line A-A' of FIG. 7A . 7C is a schematic top view of a display device according to an embodiment of the present invention. 7D is a schematic bottom view of a display device according to an embodiment of the present invention. 7E is a schematic perspective view of a first antistatic ring and a second antistatic ring according to an embodiment of the present invention.

請參考圖7A至圖7E，形成覆蓋膠層500於基板100的第一面102上。在一些實施例中，覆蓋膠層500還延伸至基板100的部分側面106，以部分覆蓋保護層320。在本實施例中，覆蓋膠層500從基板100的第一面102延伸至基板100的靠近接合墊110之其中一個側面106，並部分覆蓋前述靠近接合墊110之其中一個側面106，但本發明不以此為限。在其他實施例中，覆蓋膠層500還從基板100的第一面102延伸至其他未對應於接合墊110之側面106，並部分覆蓋未對應於接合墊110之側面106。舉例來說，基板100的每個側面106都可以被覆蓋膠層500部分覆蓋。至此，顯示裝置1大致完成。覆蓋膠層500覆蓋顯示元件400以及第一導電圖案132的雷射痕跡LT。覆蓋膠層500例如為顯示元件400的封裝膠或形成於顯示元件400的封裝膠上之其他材料。在一些實施例中，覆蓋膠層500具有抗反射特性，使底下金屬眩光程度降低。換句話說，覆蓋膠層500為抗反射層，且有助於避免第一抗靜電環130反射之光線影響顯示裝置1的顯示品質。Referring to FIGS. 7A to 7E , a cover adhesive layer 500 is formed on the first surface 102 of the substrate 100 . In some embodiments, the cover adhesive layer 500 also extends to a part of the side surface 106 of the substrate 100 to partially cover the protective layer 320 . In this embodiment, the cover adhesive layer 500 extends from the first surface 102 of the substrate 100 to one of the side surfaces 106 of the substrate 100 near the bonding pads 110 and partially covers the aforementioned one of the side surfaces 106 near the bonding pads 110, but the present invention Not limited to this. In other embodiments, the cover adhesive layer 500 also extends from the first side 102 of the substrate 100 to other side surfaces 106 not corresponding to the bonding pads 110 , and partially covers the side surfaces 106 not corresponding to the bonding pads 110 . For example, each side 106 of the substrate 100 may be partially covered by the coverlay 500 . So far, the display device 1 is substantially completed. The cover adhesive layer 500 covers the display element 400 and the laser trace LT of the first conductive pattern 132 . The cover adhesive layer 500 is, for example, the encapsulant of the display element 400 or other materials formed on the encapsulant of the display element 400 . In some embodiments, the cover layer 500 has anti-reflection properties to reduce the glare of the underlying metal. In other words, the cover adhesive layer 500 is an anti-reflection layer, and helps to prevent the light reflected by the first anti-static ring 130 from affecting the display quality of the display device 1 .

圖8A是依照本發明的一實施例的一種顯示裝置的局部示意圖。圖8B是圖8A的顯示裝置的剖面示意圖，其中圖8B對應了圖8A之線A-A’的位置。圖8C是依照本發明的一實施例的一種顯示裝置的俯視示意圖。圖8D是依照本發明的一實施例的一種顯示裝置的仰視示意圖。圖8E是依照本發明的一實施例的一種第一抗靜電環與第二抗靜電環的立體示意圖。FIG. 8A is a partial schematic diagram of a display device according to an embodiment of the present invention. FIG. 8B is a schematic cross-sectional view of the display device of FIG. 8A , wherein FIG. 8B corresponds to the position of the line A-A' of FIG. 8A . 8C is a schematic top view of a display device according to an embodiment of the present invention. 8D is a schematic bottom view of a display device according to an embodiment of the present invention. 8E is a schematic perspective view of a first antistatic ring and a second antistatic ring according to an embodiment of the present invention.

在此必須說明的是，圖8A至圖8E的實施例沿用圖1A至圖7E的實施例的元件標號與部分內容，其中採用相同或近似的標號來表示相同或近似的元件，並且省略了相同技術內容的說明。關於省略部分的說明可參考前述實施例，在此不贅述。It must be noted here that the embodiments of FIGS. 8A to 8E use the element numbers and part of the content of the embodiment of FIGS. 1A to 7E , wherein the same or similar numbers are used to represent the same or similar elements, and the same elements are omitted. Description of technical content. For the description of the omitted part, reference may be made to the foregoing embodiments, which will not be repeated here.

圖8A至圖8E的顯示裝置2與圖7A至圖7E的顯示裝置1的差異在於：在顯示裝置2中，第一抗靜電環130a部份位於第一面102上，且另一部分位於側面106上。The difference between the display device 2 of FIGS. 8A to 8E and the display device 1 of FIGS. 7A to 7E is that in the display device 2 , part of the first antistatic ring 130 a is located on the first surface 102 , and the other part is located on the side surface 106 superior.

在本實施例中，第一抗靜電環130a分佈於基板100的第一面102上以及側面106上，且第二抗靜電環170位於基板100的第二面104上。第一抗靜電環130a包括第一導電圖案132a、第二導電圖案134a、第一側面走線136a以及第二側面走線138a。In this embodiment, the first antistatic rings 130 a are distributed on the first surface 102 and the side surface 106 of the substrate 100 , and the second antistatic rings 170 are located on the second surface 104 of the substrate 100 . The first antistatic ring 130a includes a first conductive pattern 132a, a second conductive pattern 134a, a first side trace 136a and a second side trace 138a.

電路基板包括第一導電圖案132a以及第二導電圖案134a。第一導電圖案132a以及第二導電圖案134a位於基板100的第一面102上，且第一導電圖案132a以及第二導電圖案134a位於顯示區DA的相對兩側。第一導電圖案132a部分重疊於訊號線120。雷射痕跡LT位於第一導電圖案132a上。在一些實施例中，不只第一抗靜電環130a的第一導電圖案132a上具有雷射痕跡LT，第一抗靜電環130a的第二導電圖案134a以及第二抗靜電環170上也具有雷射痕跡LT。在一些實施例中，第一導電圖案132a以及第二導電圖案134a為單層或多層的導電材料。第一導電圖案132a之材質包括金屬（例如鋁、銀、銅或其他可導電且可反射及吸收雷射的材料）或其他合適的材料。在一些實施例中，第二導電圖案134a之材質可與第一導電圖案132a之材質相同或不同。The circuit substrate includes a first conductive pattern 132a and a second conductive pattern 134a. The first conductive pattern 132a and the second conductive pattern 134a are located on the first surface 102 of the substrate 100, and the first conductive pattern 132a and the second conductive pattern 134a are located on opposite sides of the display area DA. The first conductive pattern 132a partially overlaps the signal line 120 . The laser trace LT is located on the first conductive pattern 132a. In some embodiments, not only the first conductive pattern 132a of the first anti-static ring 130a has laser traces LT, but also the second conductive pattern 134a of the first anti-static ring 130a and the second anti-static ring 170 have laser traces Traces lt. In some embodiments, the first conductive pattern 132a and the second conductive pattern 134a are single-layer or multi-layer conductive materials. The material of the first conductive pattern 132a includes metal (eg, aluminum, silver, copper, or other materials that can conduct electricity and can reflect and absorb laser light) or other suitable materials. In some embodiments, the material of the second conductive pattern 134a may be the same as or different from the material of the first conductive pattern 132a.

形成第一側面走線136a以及第二側面走線138a於基板100的側面106上。第一側面走線136a以及第二側面走線138a的材料不同於第一導電圖案132a以及第二導電圖案134a的材料。在一些實施例中，第一側面走線136a以及第二側面走線138a包括導電膠，例如銀膠或其他合適的材料。The first side wiring 136 a and the second side wiring 138 a are formed on the side surface 106 of the substrate 100 . The materials of the first side traces 136a and the second side traces 138a are different from the materials of the first conductive patterns 132a and the second conductive patterns 134a. In some embodiments, the first side traces 136a and the second side traces 138a include conductive glue, such as silver glue or other suitable materials.

形成第一側面走線136a以及第二側面走線138a的方法類似或不同於形成連接結構310的方法。在一些實施例中，例如在形成保護層200（請參考圖2至圖4）後才形成第一側面走線136a以及第二側面走線138a，藉此避免形成第一側面走線136a以及第二側面走線138a的製程對顯示區DA中之元件造成損傷。The method of forming the first side trace 136 a and the second side trace 138 a is similar to or different from the method of forming the connection structure 310 . In some embodiments, for example, the first side traces 136 a and the second side traces 138 a are formed after the protective layer 200 (please refer to FIG. 2 to FIG. 4 ) is formed, thereby avoiding the formation of the first side traces 136 a and the second side traces 138 a. The process of the two side traces 138a causes damage to the components in the display area DA.

第一側面走線136a以及第二側面走線138a電性連接第一導電圖案132a以及第二導電圖案134a。第一側面走線136a連接第一導電圖案132a的一端以及第二導電圖案134a的一端，且第二側面走線138a連接第一導電圖案132a的另一端以及第二導電圖案134a的另一端。第一導電圖案132a、第二導電圖案134a、第一側面走線136a以及第二側面走線138a依序相連以構成第一抗靜電環130a。The first side wiring 136a and the second side wiring 138a are electrically connected to the first conductive pattern 132a and the second conductive pattern 134a. The first side trace 136a is connected to one end of the first conductive pattern 132a and one end of the second conductive pattern 134a, and the second side trace 138a is connected to the other end of the first conductive pattern 132a and the other end of the second conductive pattern 134a. The first conductive pattern 132a, the second conductive pattern 134a, the first side traces 136a, and the second side traces 138a are sequentially connected to form the first antistatic ring 130a.

在一些實施例中，在未執行雷射製程前或在執行雷射製程後，保護層200（或第二部分220）與基板100之左右兩側之間的部分第一導電圖案132a未被保護層200（或第二部分220）所覆蓋。因此，在形成第一側面走線136a以及第二側面走線138a時，第一側面走線136a以及第二側面走線138a會分別從基板100之左右兩側延伸至第一導電圖案132a被保護層200（或第二部分220）所暴露出之部分頂面，並覆蓋住第一導電圖案132a被保護層200（或第二部分220）所暴露出之部分頂面，但本發明不以此為限。在其他實施例中，第一側面走線136a以及第二側面走線138a未覆蓋第一導電圖案132a的頂面以及第二導電圖案134a的頂面。In some embodiments, before the laser process is performed or after the laser process is performed, a portion of the first conductive pattern 132 a between the protective layer 200 (or the second portion 220 ) and the left and right sides of the substrate 100 is not protected layer 200 (or second portion 220). Therefore, when the first side traces 136a and the second side traces 138a are formed, the first side traces 136a and the second side traces 138a respectively extend from the left and right sides of the substrate 100 to the first conductive patterns 132a to be protected The exposed part of the top surface of the layer 200 (or the second part 220 ) covers the part of the top surface of the first conductive pattern 132a exposed by the protective layer 200 (or the second part 220 ), but the present invention does not use this limited. In other embodiments, the first side traces 136a and the second side traces 138a do not cover the top surface of the first conductive pattern 132a and the top surface of the second conductive pattern 134a.

覆蓋膠層500覆蓋顯示元件400、第一導電圖案132a以及第二導電圖案134a。在一些實施例中，覆蓋膠層500有助於避免第一導電圖案132a以及第二導電圖案134a反射之光線影響顯示裝置2的顯示品質。換句話說，覆蓋膠層500可以為抗反射層。The cover adhesive layer 500 covers the display element 400, the first conductive pattern 132a and the second conductive pattern 134a. In some embodiments, the capping layer 500 helps to prevent the light reflected by the first conductive pattern 132 a and the second conductive pattern 134 a from affecting the display quality of the display device 2 . In other words, the cover adhesive layer 500 may be an anti-reflection layer.

在本實施例中，第一導電圖案132a可避免雷射製程LS（如圖3所示）對訊號線120造成之損傷，藉此提升顯示裝置2的製造良率。In this embodiment, the first conductive pattern 132 a can avoid damage to the signal line 120 caused by the laser process LS (as shown in FIG. 3 ), thereby improving the manufacturing yield of the display device 2 .

圖9A是依照本發明的一實施例的一種顯示裝置的局部示意圖。圖9B是圖9A的顯示裝置的剖面示意圖，其中圖9B對應了圖9A之線A-A’的位置。圖9C是依照本發明的一實施例的一種顯示裝置的俯視示意圖。圖9D是依照本發明的一實施例的一種顯示裝置的仰視示意圖。圖9E是依照本發明的一實施例的一種第一抗靜電環與第二抗靜電環的立體示意圖。FIG. 9A is a partial schematic diagram of a display device according to an embodiment of the present invention. 9B is a schematic cross-sectional view of the display device of FIG. 9A , wherein FIG. 9B corresponds to the position of the line A-A' of FIG. 9A . 9C is a schematic top view of a display device according to an embodiment of the present invention. FIG. 9D is a schematic bottom view of a display device according to an embodiment of the present invention. 9E is a schematic perspective view of a first antistatic ring and a second antistatic ring according to an embodiment of the present invention.

在此必須說明的是，圖9A至圖9E的實施例沿用圖1A至圖7E的實施例的元件標號與部分內容，其中採用相同或近似的標號來表示相同或近似的元件，並且省略了相同技術內容的說明。關於省略部分的說明可參考前述實施例，在此不贅述。It must be noted here that the embodiments of FIGS. 9A to 9E use the element numbers and part of the content of the embodiment of FIGS. 1A to 7E , wherein the same or similar numbers are used to represent the same or similar elements, and the same elements are omitted. Description of technical content. For the description of the omitted part, reference may be made to the foregoing embodiments, which will not be repeated here.

圖9A至圖9E的顯示裝置3與圖7A至圖7E的顯示裝置1的差異在於：在顯示裝置3中，第一抗靜電環130b分佈於第一面102、側面106以及第二面104上。第一抗靜電環130b包括第一導電圖案132b、第二導電圖案134b、導電環135b、第一側面走線136b、第二側面走線137b、第三側面走線138b以及第四側面走線139b。The difference between the display device 3 of FIGS. 9A to 9E and the display device 1 of FIGS. 7A to 7E is that in the display device 3 , the first antistatic rings 130 b are distributed on the first surface 102 , the side surface 106 and the second surface 104 . The first antistatic ring 130b includes a first conductive pattern 132b, a second conductive pattern 134b, a conductive ring 135b, a first side trace 136b, a second side trace 137b, a third side trace 138b and a fourth side trace 139b .

請參考圖9A至圖9E，電路基板包括第一導電圖案132b、第二導電圖案134b以及導電環135b。第一導電圖案132b以及第二導電圖案134b位於基板100的第一面102上，且第一導電圖案132b以及第二導電圖案134b位於顯示區DA的相對兩側，第一導電圖案132b部分重疊於訊號線120。雷射痕跡LT位於第一導電圖案132b上。導電環135b位於基板100的第二面104上。在一些實施例中，不只第一導電圖案132b上具有雷射痕跡LT，第二導電圖案134b以及導電環135b上也具有雷射痕跡LT。在一些實施例中，第一導電圖案132b以及第二導電圖案134b為單層或多層的導電材料。第一導電圖案132b之材質包括金屬（例如鋁、銀、銅或其他可導電且可反射及吸收雷射的材料）或其他合適的材料。在一些實施例中，第二導電圖案134b與導電環135b之材質可與第一導電圖案132b之材質相同或不同。Referring to FIGS. 9A to 9E , the circuit substrate includes a first conductive pattern 132b, a second conductive pattern 134b and a conductive ring 135b. The first conductive pattern 132b and the second conductive pattern 134b are located on the first surface 102 of the substrate 100, and the first conductive pattern 132b and the second conductive pattern 134b are located on opposite sides of the display area DA, and the first conductive pattern 132b is partially overlapped on the display area DA. Signal line 120. The laser trace LT is located on the first conductive pattern 132b. The conductive ring 135b is located on the second side 104 of the substrate 100 . In some embodiments, not only the first conductive pattern 132b has laser traces LT, but also the second conductive pattern 134b and the conductive ring 135b have laser traces LT. In some embodiments, the first conductive pattern 132b and the second conductive pattern 134b are single-layer or multi-layer conductive materials. The material of the first conductive pattern 132b includes metal (eg, aluminum, silver, copper or other materials that can conduct electricity and can reflect and absorb laser light) or other suitable materials. In some embodiments, the material of the second conductive pattern 134b and the conductive ring 135b may be the same as or different from the material of the first conductive pattern 132b.

形成第一側面走線136b、第二側面走線137b、第三側面走線138b以及第四側面走線139b於基板100的側面106上。第一側面走線136b、第二側面走線137b、第三側面走線138b以及第四側面走線139b的材料不同於第一導電圖案132b、第二導電圖案134b與導電環135b的材料。在一些實施例中，第一側面走線136b、第二側面走線137b、第三側面走線138b以及第四側面走線139b包括導電膠，例如銀膠或其他合適的材料。A first side trace 136 b , a second side trace 137 b , a third side trace 138 b and a fourth side trace 139 b are formed on the side surface 106 of the substrate 100 . The materials of the first side traces 136b, the second side traces 137b, the third side traces 138b and the fourth side traces 139b are different from those of the first conductive pattern 132b, the second conductive pattern 134b and the conductive ring 135b. In some embodiments, the first side traces 136b, the second side traces 137b, the third side traces 138b, and the fourth side traces 139b include conductive glue, such as silver glue or other suitable materials.

形成第一側面走線136b、第二側面走線137b、第三側面走線138b以及第四側面走線139b的方法類似於形成連接結構310的方法。在一些實施例中，例如在形成保護層200（請參考圖2至圖4）後才形成第一側面走線136b、第二側面走線137b、第三側面走線138b以及第四側面走線139b，藉此避免形成第一側面走線136b、第二側面走線137b、第三側面走線138b以及第四側面走線139b的製程對顯示區DA中之元件造成損傷。The method of forming the first side wiring 136b, the second side wiring 137b, the third side wiring 138b and the fourth side wiring 139b is similar to the method of forming the connection structure 310 . In some embodiments, for example, the first side wiring 136b, the second side wiring 137b, the third side wiring 138b and the fourth side wiring are formed after the protective layer 200 (please refer to FIG. 2 to FIG. 4 ) is formed. 139b, thereby avoiding damage to components in the display area DA during the process of forming the first side wiring 136b, the second side wiring 137b, the third side wiring 138b, and the fourth side wiring 139b.

第一側面走線136b、第二側面走線137b、第三側面走線138b以及第四側面走線139b電性連接第一導電圖案132b、第二導電圖案134b與導電環135b。第一側面走線136b與第二側面走線137b分別連接第一導電圖案132b的兩端。第三側面走線138b與第四側面走線139b分別連接第二導電圖案134b的兩端。第一側面走線136b、第二側面走線137b、第三側面走線138b以及第四側面走線139b電性連接導電環135b。The first side trace 136b, the second side trace 137b, the third side trace 138b and the fourth side trace 139b are electrically connected to the first conductive pattern 132b, the second conductive pattern 134b and the conductive ring 135b. The first side wiring 136b and the second side wiring 137b are respectively connected to two ends of the first conductive pattern 132b. The third side wiring 138b and the fourth side wiring 139b are respectively connected to both ends of the second conductive pattern 134b. The first side wiring 136b, the second side wiring 137b, the third side wiring 138b, and the fourth side wiring 139b are electrically connected to the conductive ring 135b.

在一些實施例中，第一側面走線136b、第二側面走線137b、第三側面走線138b以及第四側面走線139b自基板100的側面106延伸至基板100的第一面102。在一些實施例中，在未執行雷射製程前或在執行雷射製程後，保護層200（或第二部分220）與基板100之左右兩側之間的部分第一導電圖案132b以及部分第二導電圖案134b未被保護層200（或第二部分220）所覆蓋。因此，在形成第一側面走線136b、第二側面走線137b、第三側面走線138b以及第四側面走線139b時，第一側面走線136b、第二側面走線137b、第三側面走線138b以及第四側面走線139b會分別從基板100之左右兩側延伸至部分第一導電圖案132b以及部分第二導電圖案134b被保護層200（或第二部分220）所暴露出之部分頂面，並覆蓋住第一導電圖案132b以及第二導電圖案134b被保護層200（或第二部分220）所暴露出之部分頂面，但本發明不以此為限。在其他實施例中，第一側面走線136b、第二側面走線137b、第三側面走線138b以及第四側面走線139b未覆蓋第一導電圖案132b的頂面以及第二導電圖案134b的頂面。In some embodiments, the first side traces 136 b , the second side traces 137 b , the third side traces 138 b and the fourth side traces 139 b extend from the side surface 106 of the substrate 100 to the first side 102 of the substrate 100 . In some embodiments, before the laser process is performed or after the laser process is performed, a part of the first conductive pattern 132 b and a part of the first conductive pattern 132 b between the protective layer 200 (or the second part 220 ) and the left and right sides of the substrate 100 The two conductive patterns 134b are not covered by the protective layer 200 (or the second portion 220). Therefore, when forming the first side wiring 136b, the second side wiring 137b, the third side wiring 138b, and the fourth side wiring 139b, the first side wiring 136b, the second side wiring 137b, the third side wiring 136b, the third side wiring The traces 138b and the fourth side traces 139b respectively extend from the left and right sides of the substrate 100 to a part of the first conductive pattern 132b and a part of the second conductive pattern 134b exposed by the protective layer 200 (or the second part 220 ) The top surface of the first conductive pattern 132b and the part of the top surface of the second conductive pattern 134b exposed by the protective layer 200 (or the second portion 220) are covered, but the invention is not limited thereto. In other embodiments, the first side traces 136b, the second side traces 137b, the third side traces 138b and the fourth side traces 139b do not cover the top surface of the first conductive pattern 132b and the second conductive pattern 134b. top.

在一些實施例中，第一側面走線136b、第二側面走線137b、第三側面走線138b以及第四側面走線139b自基板100的側面106延伸至基板100的第二面104。在一些實施例中，第一側面走線136b、第二側面走線137b、第三側面走線138b以及第四側面走線139b部分覆蓋導電環135b背對基板100的頂面，但本發明不以此為限。在其他實施例中，第一側面走線136b、第二側面走線137b、第三側面走線138b以及第四側面走線139b未覆蓋導電環135b的頂面。In some embodiments, the first side traces 136 b , the second side traces 137 b , the third side traces 138 b and the fourth side traces 139 b extend from the side surface 106 of the substrate 100 to the second side 104 of the substrate 100 . In some embodiments, the first side traces 136b, the second side traces 137b, the third side traces 138b and the fourth side traces 139b partially cover the top surface of the conductive ring 135b facing away from the substrate 100, but the present invention does not This is the limit. In other embodiments, the first side trace 136b, the second side trace 137b, the third side trace 138b, and the fourth side trace 139b do not cover the top surface of the conductive ring 135b.

在本實施例中，第一導電圖案132b可避免雷射製程LS（如圖3所示）對訊號線120造成之損傷，藉此提升顯示裝置3的製造良率。In this embodiment, the first conductive pattern 132 b can avoid damage to the signal line 120 caused by the laser process LS (as shown in FIG. 3 ), thereby improving the manufacturing yield of the display device 3 .

圖10A是依照本發明的一實施例的一種顯示裝置的局部示意圖。圖10B是圖10A的顯示裝置的剖面示意圖，其中圖10B對應了圖10A之線A-A’的位置。圖10C是依照本發明的一實施例的一種顯示裝置的俯視示意圖。圖10D是依照本發明的一實施例的一種顯示裝置的仰視示意圖。圖10E是依照本發明的一實施例的一種第一抗靜電環與第二抗靜電環的立體示意圖。FIG. 10A is a partial schematic diagram of a display device according to an embodiment of the present invention. FIG. 10B is a schematic cross-sectional view of the display device of FIG. 10A , wherein FIG. 10B corresponds to the position of the line A-A' of FIG. 10A . FIG. 10C is a schematic top view of a display device according to an embodiment of the present invention. FIG. 10D is a schematic bottom view of a display device according to an embodiment of the present invention. 10E is a schematic perspective view of a first antistatic ring and a second antistatic ring according to an embodiment of the present invention.

在此必須說明的是，圖10A至圖10E的實施例沿用圖1A至圖7E的實施例的元件標號與部分內容，其中採用相同或近似的標號來表示相同或近似的元件，並且省略了相同技術內容的說明。關於省略部分的說明可參考前述實施例，在此不贅述。It must be noted here that the embodiments of FIGS. 10A to 10E use the element numbers and part of the content of the embodiment of FIGS. 1A to 7E , wherein the same or similar numbers are used to represent the same or similar elements, and the same elements are omitted. Description of technical content. For the description of the omitted part, reference may be made to the foregoing embodiments, which will not be repeated here.

圖10A至圖10E的顯示裝置4與圖7A至圖7E的顯示裝置1的差異在於：在顯示裝置4中，第一抗靜電環130c分佈於第一面102、側面106以及第二面104上。第一抗靜電環130c包括第一導電圖案131c、第二導電圖案132c、第三導電圖案133c、第四導電圖案134c、第一側面走線136c以及第二側面走線138c。The difference between the display device 4 of FIGS. 10A to 10E and the display device 1 of FIGS. 7A to 7E is that in the display device 4 , the first antistatic rings 130 c are distributed on the first surface 102 , the side surface 106 and the second surface 104 . The first antistatic ring 130c includes a first conductive pattern 131c, a second conductive pattern 132c, a third conductive pattern 133c, a fourth conductive pattern 134c, a first side trace 136c and a second side trace 138c.

請參考圖10A至圖10E，電路基板包括第一導電圖案131c、第二導電圖案132c、第三導電圖案133c以及第四導電圖案134c。第一導電圖案131c以及第二導電圖案132c位於基板100的第一面102上，且第一導電圖案131c以及第二導電圖案132c位於顯示區DA的相對兩側，第一導電圖案131c部分重疊於訊號線120。雷射痕跡LT位於第一導電圖案131c上。第三導電圖案133c以及第四導電圖案134c位於基板100的第二面104上。在一些實施例中，不只第一導電圖案131c上具有雷射痕跡LT，第二導電圖案132c、第三導電圖案133c以及第四導電圖案134c上也具有雷射痕跡LT。第三導電圖案133c以及第四導電圖案134c分別重疊第一導電圖案131c以及第二導電圖案132c。在一些實施例中，第一導電圖案131c、第二導電圖案132c、第三導電圖案133c以及第四導電圖案134c為單層或多層的導電材料。第一導電圖案131c、第二導電圖案132c、第三導電圖案133c以及第四導電圖案134c之材質包括金屬（例如鋁、銀、銅或其他可導電且可反射及吸收雷射的材料）或其他合適的材料。在一些實施例中，第二導電圖案132c、第三導電圖案133c以及第四導電圖案134c之材質可與第一導電圖案131c之材質相同或不同。Referring to FIGS. 10A to 10E, the circuit substrate includes a first conductive pattern 131c, a second conductive pattern 132c, a third conductive pattern 133c and a fourth conductive pattern 134c. The first conductive pattern 131c and the second conductive pattern 132c are located on the first surface 102 of the substrate 100, and the first conductive pattern 131c and the second conductive pattern 132c are located on opposite sides of the display area DA, and the first conductive pattern 131c is partially overlapped on the display area DA. Signal line 120. The laser trace LT is located on the first conductive pattern 131c. The third conductive pattern 133c and the fourth conductive pattern 134c are located on the second surface 104 of the substrate 100 . In some embodiments, not only the first conductive pattern 131c has laser traces LT, but also the second conductive pattern 132c, the third conductive pattern 133c and the fourth conductive pattern 134c have laser traces LT. The third conductive pattern 133c and the fourth conductive pattern 134c overlap the first conductive pattern 131c and the second conductive pattern 132c, respectively. In some embodiments, the first conductive pattern 131c, the second conductive pattern 132c, the third conductive pattern 133c, and the fourth conductive pattern 134c are single-layer or multi-layer conductive materials. The materials of the first conductive pattern 131c, the second conductive pattern 132c, the third conductive pattern 133c and the fourth conductive pattern 134c include metals (such as aluminum, silver, copper or other materials that can conduct electricity, reflect and absorb laser light) or other materials. suitable material. In some embodiments, the material of the second conductive pattern 132c, the third conductive pattern 133c and the fourth conductive pattern 134c may be the same as or different from the material of the first conductive pattern 131c.

形成第一側面走線136c以及第二側面走線138c於基板100的側面106上。第一側面走線136c以及第二側面走線138c的材料不同於第一導電圖案131c、第二導電圖案132c、第三導電圖案133c以及第四導電圖案134c的材料。在一些實施例中，第一側面走線136c以及第二側面走線138c包括導電膠，例如銀膠或其他合適的材料。The first side wiring 136c and the second side wiring 138c are formed on the side surface 106 of the substrate 100 . The materials of the first side traces 136c and the second side traces 138c are different from the materials of the first conductive patterns 131c, the second conductive patterns 132c, the third conductive patterns 133c and the fourth conductive patterns 134c. In some embodiments, the first side traces 136c and the second side traces 138c include conductive glue, such as silver glue or other suitable materials.

形成第一側面走線136c以及第二側面走線138c的方法類似於形成連接結構310的方法。在一些實施例中，例如在形成保護層200（請參考圖2至圖4）後才形成第一側面走線136c以及第二側面走線138c，藉此避免形成第一側面走線136c以及第二側面走線138c的製程對顯示區DA中之元件造成損傷。The method of forming the first side trace 136c and the second side trace 138c is similar to the method of forming the connection structure 310 . In some embodiments, for example, the first side wiring 136c and the second side wiring 138c are formed after the protective layer 200 (please refer to FIG. 2 to FIG. 4 ) is formed, thereby avoiding the formation of the first side wiring 136c and the second side wiring 136c. The process of the two side traces 138c causes damage to the components in the display area DA.

第一側面走線136c以及第二側面走線138c電性連接第一導電圖案131c、第二導電圖案132c、第三導電圖案133c以及第四導電圖案134c。The first side traces 136c and the second side traces 138c are electrically connected to the first conductive pattern 131c, the second conductive pattern 132c, the third conductive pattern 133c and the fourth conductive pattern 134c.

第一側面走線136c連接第一導電圖案131c的一端以及第二導電圖案132c的一端，且第二側面走線138c連接第一導電圖案131c的另一端以及第二導電圖案132c的另一端。第一側面走線136c連接第三導電圖案133c的一端以及第四導電圖案134c的一端，且第二側面走線138c連接第三導電圖案133c的另一端以及第四導電圖案134c的另一端。The first side trace 136c is connected to one end of the first conductive pattern 131c and one end of the second conductive pattern 132c, and the second side trace 138c is connected to the other end of the first conductive pattern 131c and the other end of the second conductive pattern 132c. The first side trace 136c is connected to one end of the third conductive pattern 133c and one end of the fourth conductive pattern 134c, and the second side trace 138c is connected to the other end of the third conductive pattern 133c and the other end of the fourth conductive pattern 134c.

第一側面走線136c以及第二側面走線138c自基板100的側面106延伸至基板100的第一面102。在一些實施例中，在未執行雷射製程前或在執行雷射製程後，保護層200（或第二部分220）與基板100之左右兩側之間的部分第一導電圖案131c以及部分第二導電圖案132c未被保護層200（或第二部分220）所覆蓋。因此，在形成第一側面走線136c以及第二側面走線138時，第一側面走線136c以及第二側面走線138會分別從基板100之左右兩側延伸至第一導電圖案131c以及第二導電圖案132c被保護層200（或第二部分220）所暴露出之部分頂面，並覆蓋住第一導電圖案131c以及第二導電圖案132c被保護層200（或第二部分220）所暴露出之部分頂面，但本發明不以此為限。在其他實施例中，第一側面走線136c以及第二側面走線138未覆蓋第一導電圖案131c的頂面以及第二導電圖案132c的頂面。The first side wiring 136c and the second side wiring 138c extend from the side surface 106 of the substrate 100 to the first surface 102 of the substrate 100 . In some embodiments, before the laser process is performed or after the laser process is performed, a portion of the first conductive pattern 131 c and a portion of the first conductive pattern 131 c between the protective layer 200 (or the second portion 220 ) and the left and right sides of the substrate 100 The two conductive patterns 132c are not covered by the protective layer 200 (or the second portion 220). Therefore, when the first side traces 136c and the second side traces 138 are formed, the first side traces 136c and the second side traces 138 will extend from the left and right sides of the substrate 100 to the first conductive pattern 131c and the first conductive pattern 131c and the second trace respectively. Parts of the top surfaces of the two conductive patterns 132c exposed by the protective layer 200 (or the second portion 220 ) cover the first conductive patterns 131c and the second conductive patterns 132c exposed by the protective layer 200 (or the second portion 220 ) part of the top surface, but the present invention is not limited to this. In other embodiments, the first side traces 136c and the second side traces 138 do not cover the top surface of the first conductive pattern 131c and the top surface of the second conductive pattern 132c.

第一側面走線136c以及第二側面走線138c自基板100的側面106延伸至基板100的第二面104。在一些實施例中，第一側面走線136c以及第二側面走線138c部分覆蓋第三導電圖案133c背對基板100的頂面以及第四導電圖案134c背對基板100的頂面，但本發明不以此為限。在其他實施例中，第一側面走線136c以及第二側面走線138c未覆蓋第三導電圖案133c的頂面以及第四導電圖案134c的頂面。The first side wiring 136c and the second side wiring 138c extend from the side surface 106 of the substrate 100 to the second side 104 of the substrate 100 . In some embodiments, the first side traces 136c and the second side traces 138c partially cover the top surface of the third conductive pattern 133c facing away from the substrate 100 and the fourth conductive pattern 134c facing away from the top surface of the substrate 100, but the present invention Not limited to this. In other embodiments, the first side traces 136c and the second side traces 138c do not cover the top surface of the third conductive pattern 133c and the top surface of the fourth conductive pattern 134c.

在本實施例中，第一導電圖案131c可避免雷射製程LS（如圖3所示）對訊號線120造成之損傷，藉此提升顯示裝置4的製造良率。In this embodiment, the first conductive pattern 131 c can avoid damage to the signal line 120 caused by the laser process LS (as shown in FIG. 3 ), thereby improving the manufacturing yield of the display device 4 .

圖11是依照本發明的一實施例的一種顯示裝置的俯視示意圖。FIG. 11 is a schematic top view of a display device according to an embodiment of the present invention.

在此必須說明的是，圖11的實施例沿用圖10A至圖11E的實施例的元件標號與部分內容，其中採用相同或近似的標號來表示相同或近似的元件，並且省略了相同技術內容的說明。關於省略部分的說明可參考前述實施例，在此不贅述。It must be noted here that the embodiment of FIG. 11 uses the element numbers and part of the content of the embodiment of FIGS. 10A to 11E , wherein the same or similar reference numbers are used to represent the same or similar elements, and the same technical content is omitted. illustrate. For the description of the omitted part, reference may be made to the foregoing embodiments, which will not be repeated here.

請參考圖11，在本實施例中，顯示裝置4更包括導電外框600。基板100設置於導電外框600中，且導電外框600電性連接至第一抗靜電環130c。在本實施例中，導電外框600例如接觸第一側面走線136c以及第二側面走線138c中的至少一者。Referring to FIG. 11 , in this embodiment, the display device 4 further includes a conductive outer frame 600 . The substrate 100 is disposed in the conductive outer frame 600, and the conductive outer frame 600 is electrically connected to the first antistatic ring 130c. In this embodiment, the conductive outer frame 600 contacts at least one of the first side wiring 136c and the second side wiring 138c, for example.

綜上所述，本發明第一抗靜電環可避免雷射製程對訊號線造成之損傷，藉此提升顯示裝置的製造良率。此外，抗反射層有助於避免第一抗靜電環反射之光線影響顯示裝置的顯示品質。To sum up, the first antistatic ring of the present invention can avoid damage to the signal lines caused by the laser process, thereby improving the manufacturing yield of the display device. In addition, the anti-reflection layer helps to prevent the light reflected by the first anti-static ring from affecting the display quality of the display device.

1、2、3、4:顯示裝置 100:基板 102:第一面 104:第二面 106:側面 110、180:接合墊 120、190:訊號線 130、130a、130b、130c:第一抗靜電環 132、132a、132b、131c:第一導電圖案 134a、134b、132c:第二導電圖案 133c:第三導電圖案 134c:第四導電圖案 135b:導電環 136a、136b、136c:第一側面走線 138a、137b、138c:第二側面走線 138b:第三側面走線 139b:第四側面走線 140:第一絕緣層 142:絕緣層 150:第二絕緣層 162:導孔 164:電極 170:第二抗靜電環 200、200a:保護層 210、210a:第一部分 220、220a:第二部分 310:連接結構 320:保護層 322:保護層 400:顯示元件 500:覆蓋膠層 600:導電外框 DA:顯示區 LS:雷射製程 LT:雷射痕跡 PA:周邊區 W1:寬度1, 2, 3, 4: Display device 100: Substrate 102: The first side 104: Second Side 106: Side 110, 180: Bonding pads 120, 190: Signal line 130, 130a, 130b, 130c: the first antistatic ring 132, 132a, 132b, 131c: the first conductive pattern 134a, 134b, 132c: the second conductive pattern 133c: the third conductive pattern 134c: Fourth conductive pattern 135b: Conductive ring 136a, 136b, 136c: first side wiring 138a, 137b, 138c: Second side wiring 138b: Third side routing 139b: Fourth side trace 140: first insulating layer 142: Insulation layer 150: Second insulating layer 162: Pilot hole 164: Electrodes 170: The second antistatic ring 200, 200a: protective layer 210, 210a: Part 1 220, 220a: Part II 310: Connection Structure 320: Protective Layer 322: Protective Layer 400: Display Components 500: cover glue layer 600: Conductive frame DA: display area LS: Laser Process LT: Laser Trace PA: Surrounding area W1: width

圖1A是依照本發明的一實施例的一種電路基板的局部示意圖。 圖1B是圖1A的電路基板的剖面示意圖。 圖1C是依照本發明的一實施例的一種電路基板的俯視示意圖。 圖1D是依照本發明的一實施例的一種電路基板的仰視示意圖。 圖2A、圖3A、圖4至圖6是依照本發明的一實施例的一種顯示裝置的製造方法的剖面示意圖。 圖2B至圖3B是依照本發明的一實施例的一種顯示裝置的製造方法的俯視示意圖。 圖7A是依照本發明的一實施例的一種顯示裝置的局部示意圖。 圖7B是圖7A的顯示裝置的剖面示意圖。 圖7C是依照本發明的一實施例的一種顯示裝置的俯視示意圖。 圖7D是依照本發明的一實施例的一種顯示裝置的仰視示意圖。 圖7E是依照本發明的一實施例的一種第一抗靜電環與第二抗靜電環的立體示意圖。 圖8A是依照本發明的一實施例的一種顯示裝置的局部示意圖。 圖8B是圖8A的顯示裝置的剖面示意圖。 圖8C是依照本發明的一實施例的一種顯示裝置的俯視示意圖。 圖8D是依照本發明的一實施例的一種顯示裝置的仰視示意圖。 圖8E是依照本發明的一實施例的一種第一抗靜電環與第二抗靜電環的立體示意圖。 圖9A是依照本發明的一實施例的一種顯示裝置的局部示意圖。 圖9B是圖9A的顯示裝置的剖面示意圖。 圖9C是依照本發明的一實施例的一種顯示裝置的俯視示意圖。 圖9D是依照本發明的一實施例的一種顯示裝置的仰視示意圖。 圖9E是依照本發明的一實施例的一種第一抗靜電環與第二抗靜電環的立體示意圖。 圖10A是依照本發明的一實施例的一種顯示裝置的局部示意圖。 圖10B是圖10A的顯示裝置的剖面示意圖。 圖10C是依照本發明的一實施例的一種顯示裝置的俯視示意圖。 圖10D是依照本發明的一實施例的一種顯示裝置的仰視示意圖。 圖10E是依照本發明的一實施例的一種第一抗靜電環與第二抗靜電環的立體示意圖。 圖11是依照本發明的一實施例的一種顯示裝置的俯視示意圖。FIG. 1A is a partial schematic diagram of a circuit substrate according to an embodiment of the present invention. FIG. 1B is a schematic cross-sectional view of the circuit substrate of FIG. 1A . 1C is a schematic top view of a circuit substrate according to an embodiment of the present invention. 1D is a schematic bottom view of a circuit substrate according to an embodiment of the present invention. 2A , FIG. 3A , and FIGS. 4 to 6 are schematic cross-sectional views of a method for manufacturing a display device according to an embodiment of the present invention. 2B to 3B are schematic top views of a method for manufacturing a display device according to an embodiment of the present invention. FIG. 7A is a partial schematic diagram of a display device according to an embodiment of the present invention. FIG. 7B is a schematic cross-sectional view of the display device of FIG. 7A . 7C is a schematic top view of a display device according to an embodiment of the present invention. 7D is a schematic bottom view of a display device according to an embodiment of the present invention. 7E is a schematic perspective view of a first antistatic ring and a second antistatic ring according to an embodiment of the present invention. FIG. 8A is a partial schematic diagram of a display device according to an embodiment of the present invention. FIG. 8B is a schematic cross-sectional view of the display device of FIG. 8A . 8C is a schematic top view of a display device according to an embodiment of the present invention. 8D is a schematic bottom view of a display device according to an embodiment of the present invention. 8E is a schematic perspective view of a first antistatic ring and a second antistatic ring according to an embodiment of the present invention. FIG. 9A is a partial schematic diagram of a display device according to an embodiment of the present invention. FIG. 9B is a schematic cross-sectional view of the display device of FIG. 9A . 9C is a schematic top view of a display device according to an embodiment of the present invention. FIG. 9D is a schematic bottom view of a display device according to an embodiment of the present invention. 9E is a schematic perspective view of a first antistatic ring and a second antistatic ring according to an embodiment of the present invention. FIG. 10A is a partial schematic diagram of a display device according to an embodiment of the present invention. FIG. 10B is a schematic cross-sectional view of the display device of FIG. 10A . FIG. 10C is a schematic top view of a display device according to an embodiment of the present invention. FIG. 10D is a schematic bottom view of a display device according to an embodiment of the present invention. 10E is a schematic perspective view of a first antistatic ring and a second antistatic ring according to an embodiment of the present invention. FIG. 11 is a schematic top view of a display device according to an embodiment of the present invention.

1:顯示裝置1: Display device

100:基板100: Substrate

106:側面106: Side

110:接合墊110: Bond pads

120:訊號線120: Signal line

130:第一抗靜電環130: The first antistatic ring

132:第一導電圖案132: the first conductive pattern

140:第一絕緣層140: first insulating layer

150:第二絕緣層150: Second insulating layer

320:保護層320: Protective Layer

400:顯示元件400: Display Components

500:覆蓋膠層500: cover glue layer

DA:顯示區DA: display area

LT:雷射痕跡LT: Laser Trace

Claims (16)

一種顯示裝置，包括： 一基板，具有一第一面、相對於該第一面的一第二面以及連接該第一面與該第二面的多個側面，其中該第一面具有一顯示區以及位於該顯示區至少一側的一周邊區； 多個顯示元件，位於該顯示區上； 多個第一接合墊，位於該周邊區上； 多個訊號線，電性連接該些第一接合墊，且自該周邊區延伸進該顯示區； 一第一導電圖案，部分重疊於該些訊號線，且該第一導電圖案表面具有一雷射痕跡，其中一抗靜電環包括該第一導電圖案；以及 一絕緣層，位於該第一導電圖案與該些訊號線之間。A display device, comprising: a substrate having a first surface, a second surface opposite to the first surface, and a plurality of side surfaces connecting the first surface and the second surface, wherein the first surface has a display area and is located in the display area a peripheral area on at least one side; a plurality of display elements, located on the display area; a plurality of first bond pads on the peripheral region; a plurality of signal lines electrically connected to the first bonding pads and extending from the peripheral region into the display region; a first conductive pattern partially overlapping the signal lines, and a surface of the first conductive pattern has a laser trace, wherein an antistatic ring includes the first conductive pattern; and An insulating layer is located between the first conductive pattern and the signal lines. 如請求項1所述的顯示裝置，更包括： 一第二抗靜電環，其中該第一抗靜電環位於該基板的該第一面上，且該第二抗靜電環位於該基板的該第二面上。The display device according to claim 1, further comprising: A second antistatic ring, wherein the first antistatic ring is located on the first surface of the substrate, and the second antistatic ring is located on the second surface of the substrate. 如請求項1所述的的顯示裝置，其中該第一抗靜電環包括： 該第一導電圖案以及一第二導電圖案，位於該基板的該第一面上，且該第一導電圖案部分重疊於該些訊號線，其中該雷射痕跡位於該第一導電圖案上；以及 一第一側面走線以及一第二側面走線，位於該基板的該些側面上，其中該第一側面走線連接該第一導電圖案的一端以及該第二導電圖案的一端，且該第二側面走線連接該第一導電圖案的另一端以及該第二導電圖案的另一端。The display device of claim 1, wherein the first antistatic ring comprises: The first conductive pattern and a second conductive pattern are located on the first surface of the substrate, and the first conductive pattern partially overlaps the signal lines, wherein the laser trace is located on the first conductive pattern; and A first side trace and a second side trace are located on the sides of the substrate, wherein the first side trace is connected to one end of the first conductive pattern and one end of the second conductive pattern, and the first The two side traces are connected to the other end of the first conductive pattern and the other end of the second conductive pattern. 如請求項3所述的的顯示裝置，更包括： 一第二抗靜電環，位於該基板的該第二面上。The display device according to claim 3, further comprising: A second antistatic ring is located on the second surface of the substrate. 如請求項3所述的的顯示裝置，其中該第一側面走線以及該第二側面走線的材料不同於該第一導電圖案以及該第二導電圖案的材料。The display device of claim 3, wherein materials of the first side wiring and the second side wiring are different from materials of the first conductive pattern and the second conductive pattern. 如請求項1所述的的顯示裝置，其中該第一抗靜電環包括： 該第一導電圖案以及一第二導電圖案，位於該基板的該第一面上，且該第一導電圖案部分重疊於該些訊號線，其中該雷射痕跡位於該第一導電圖案上； 一第一側面走線、一第二側面走線、一第三側面走線以及一第四側面走線，位於該基板的該些側面上，其中該第一側面走線與該第二側面走線分別連接該第一導電圖案的兩端，且該第三側面走線與該第四側面走線分別連接該第二導電圖案的兩端；以及 一導電環，位於該基板的該第二面上，其中該第一側面走線、該第二側面走線、該第三側面走線以及該第四側面走線電性連接該導電環。The display device of claim 1, wherein the first antistatic ring comprises: the first conductive pattern and a second conductive pattern are located on the first surface of the substrate, and the first conductive pattern partially overlaps the signal lines, wherein the laser trace is located on the first conductive pattern; A first side trace, a second side trace, a third side trace and a fourth side trace are located on the sides of the substrate, wherein the first side trace and the second side trace run Lines are respectively connected to both ends of the first conductive pattern, and the third side wiring and the fourth side wiring are respectively connected to both ends of the second conductive pattern; and A conductive ring is located on the second surface of the substrate, wherein the first side wiring, the second side wiring, the third side wiring and the fourth side wiring are electrically connected to the conductive ring. 如請求項1所述的的顯示裝置，其中該第一抗靜電環包括： 該第一導電圖案以及一第二導電圖案，位於該基板的該第一面上，且該第一導電圖案部分重疊於該些訊號線，其中該雷射痕跡位於該第一導電圖案上； 一第一側面走線以及一第二側面走線，位於該基板的該些側面上，其中該第一側面走線連接該第一導電圖案的一端以及該第二導電圖案的一端，且該第二側面走線連接該第一導電圖案的另一端以及該第二導電圖案的另一端；以及 一第三導電圖案以及一第四導電圖案，位於該基板的該第二面上，其中該第一側面走線連接該第三導電圖案的一端以及該第四導電圖案的一端，且該第二側面走線連接該第三導電圖案的另一端以及該第四導電圖案的另一端。The display device of claim 1, wherein the first antistatic ring comprises: the first conductive pattern and a second conductive pattern are located on the first surface of the substrate, and the first conductive pattern partially overlaps the signal lines, wherein the laser trace is located on the first conductive pattern; A first side trace and a second side trace are located on the sides of the substrate, wherein the first side trace is connected to one end of the first conductive pattern and one end of the second conductive pattern, and the first Two side traces are connected to the other end of the first conductive pattern and the other end of the second conductive pattern; and A third conductive pattern and a fourth conductive pattern are located on the second surface of the substrate, wherein the first side trace connects one end of the third conductive pattern and one end of the fourth conductive pattern, and the second The side traces are connected to the other end of the third conductive pattern and the other end of the fourth conductive pattern. 如請求項1所述的顯示裝置，更包括： 至少一連接結構，位於該些第一接合墊上，且該至少一連接結構從該基板該第一面延伸至該基板的該第二面，並電性連接至位於該第二面上的多個第二接合墊； 一保護層，形成於該至少一連接結構上；以及 一覆蓋膠層，位於該基板的該第一面上，且覆蓋該些顯示元件以及該第一導電圖案的該雷射痕跡。The display device according to claim 1, further comprising: At least one connecting structure is located on the first bonding pads, and the at least one connecting structure extends from the first surface of the substrate to the second surface of the substrate, and is electrically connected to a plurality of connecting structures located on the second surface the second bond pad; a protective layer formed on the at least one connection structure; and A cover adhesive layer is located on the first surface of the substrate and covers the display elements and the laser trace of the first conductive pattern. 如請求項1所述的顯示裝置，更包括： 一導電外框，電性連接至該第一抗靜電環。The display device according to claim 1, further comprising: A conductive outer frame is electrically connected to the first antistatic ring. 一種顯示裝置的製造方法，包括： 提供一電路基板，該電路基板包括： 一基板，具有一第一面、相對於該第一面的一第二面以及連接該第一面與該第二面的多個側面，其中該第一面具有一顯示區以及位於該顯示區至少一側的一周邊區； 多個第一接合墊，位於該周邊區上； 多個訊號線，電性連接該些第一接合墊，且自該周邊區延伸進該顯示區； 一第一導電圖案，部分重疊於該些訊號線；以及 一絕緣層，位於該第一導電圖案與該些訊號線之間； 形成一保護層於該基板的該第一面上； 執行一雷射製程以將該保護層分為一第一部分以及一第二部分，其中該第一部分重疊於該周邊區，且該第二部分重疊於該顯示區，其中該雷射製程於該第一導電圖案上留下一雷射痕跡； 移除該保護層的該第一部分； 形成至少一連接結構於該些第一接合墊上，其中一第一抗靜電環包括該第一導電圖案； 移除該保護層的該第二部分；以及 形成多個顯示元件於該顯示區上。A method of manufacturing a display device, comprising: A circuit substrate is provided, the circuit substrate includes: a substrate having a first surface, a second surface opposite to the first surface, and a plurality of side surfaces connecting the first surface and the second surface, wherein the first surface has a display area and is located in the display area a peripheral area on at least one side; a plurality of first bond pads on the peripheral region; a plurality of signal lines electrically connected to the first bonding pads and extending from the peripheral region into the display region; a first conductive pattern partially overlapping the signal lines; and an insulating layer between the first conductive pattern and the signal lines; forming a protective layer on the first surface of the substrate; A laser process is performed to divide the protective layer into a first part and a second part, wherein the first part overlaps the peripheral area, and the second part overlaps the display area, wherein the laser process is performed on the first part A laser trace is left on a conductive pattern; removing the first portion of the protective layer; forming at least one connection structure on the first bonding pads, wherein a first antistatic ring includes the first conductive pattern; removing the second portion of the protective layer; and A plurality of display elements are formed on the display area. 如請求項10所述的顯示裝置的製造方法，其中該電路基板包括： 一第二抗靜電環，其中該第一抗靜電環位於該基板的該第一面上，且該第二抗靜電環位於該基板的該第二面上。The method for manufacturing a display device according to claim 10, wherein the circuit substrate comprises: A second antistatic ring, wherein the first antistatic ring is located on the first surface of the substrate, and the second antistatic ring is located on the second surface of the substrate. 如請求項10所述的顯示裝置的製造方法，更包括： 形成多個側面走線於該基板的該些側面上，其中該些側面走線電性連接該第一導電圖案。The manufacturing method of the display device according to claim 10, further comprising: A plurality of side wirings are formed on the side surfaces of the substrate, wherein the side wirings are electrically connected to the first conductive pattern. 如請求項10所述的顯示裝置的製造方法，更包括： 在移除該保護層的該第二部分之後，形成一覆蓋膠層於該基板的該第一面上，其中該覆蓋膠層覆蓋該些顯示元件以及該第一導電圖案的該雷射痕跡。The manufacturing method of the display device according to claim 10, further comprising: After removing the second portion of the protective layer, a cover adhesive layer is formed on the first surface of the substrate, wherein the cover adhesive layer covers the display elements and the laser trace of the first conductive pattern. 如請求項13所述的顯示裝置的製造方法，其中該覆蓋膠層為抗反射層。The manufacturing method of the display device according to claim 13, wherein the cover adhesive layer is an anti-reflection layer. 如請求項10所述的顯示裝置的製造方法，其中在形成該保護層於該基板的該第一面上之前或在移除該保護層的該第二部分之後，形成該些顯示元件於該顯示區上。The method for manufacturing a display device as claimed in claim 10, wherein the display elements are formed on the first surface of the substrate before the protective layer is formed or after the second portion of the protective layer is removed. on the display area. 如請求項10所述的顯示裝置的製造方法，其中該至少一連接結構電性連接該些第一接合墊至位於該第二面上的多個第二接合墊。The manufacturing method of a display device as claimed in claim 10, wherein the at least one connection structure electrically connects the first bonding pads to the second bonding pads on the second surface.
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CN110277018B (en) * 2019-06-24 2020-12-25 武汉华星光电技术有限公司 Display panel and preparation method thereof
CN110764323A (en) * 2019-10-18 2020-02-07 深圳市华星光电技术有限公司 Display panel, manufacturing method thereof and display device
CN210626839U (en) * 2019-11-28 2020-05-26 维沃移动通信有限公司 Display module and electronic equipment
CN110928061B (en) * 2019-11-29 2022-04-26 武汉华星光电技术有限公司 Display panel and display device
CN110967881B (en) * 2019-12-30 2023-05-30 Tcl华星光电技术有限公司 Display panel and preparation method thereof
CN111192883A (en) * 2020-01-08 2020-05-22 深圳市华星光电半导体显示技术有限公司 Side edge binding structure of display panel and manufacturing method thereof
CN111427202A (en) * 2020-04-08 2020-07-17 深圳市华星光电半导体显示技术有限公司 Narrow-frame display panel and display device
CN111352270B (en) * 2020-04-16 2023-01-31 京东方科技集团股份有限公司 Liquid crystal display panel, manufacturing method thereof and liquid crystal display device

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TWI812124B (en) * 2022-03-28 2023-08-11 李銘洛 Electronic module and carrier structure thereof and manufacturing method thereof
TWI807946B (en) * 2022-04-01 2023-07-01 友達光電股份有限公司 Display panel and method of manufacturing the same

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