TWI761100B - Electronic device - Google Patents

Abstract

An electronic device including a substrate, multiple side wires and a protection structure is provided. The substrate has a first main surface, a side surface and a first multi-turning surface connected between the first main surface and the side surface. The first multi-turning surface includes multiple first turning surfaces with various normal directions. The side wires are disposed on the substrate. Each of the side wires extends continuously from the first main surface passing across the first multi-turning surface to the side surface. The protection structure is disposed on the substrate and includes a wire protection part covering the side wires. The wire protection part has a first thickness at the side surface, a second thickness at the first main surface, and a third thickness at at least one of the turning surfaces. The first thickness is greater than the second thickness and the second thickness is greater than the third thickness.

Description

electronic device

The present invention relates to a device, and in particular, to an electronic device.

With the advancement and development of technology in the electronic industry, the application of electronic devices has spanned many fields to replace traditional products. As far as electronic devices related to display products are concerned, designs using splicing to meet various size requirements have been proposed. In order to achieve such a design, electronic devices, such as display panels, display devices, etc., are striving to develop designs with narrow or even bezels.

The present invention provides an electronic device with a narrow frame design and ideal quality.

The electronic device of the present invention includes a substrate, a plurality of edge wires and a protection structure. The substrate has a first main surface, a side surface, and a first multiple inflection surface connected between the first main surface and the side surface. The first multiple inflection surfaces include a plurality of first inflection surfaces with different normal directions. The edge wires are arranged on the substrate. The edge conductors are each first The main surface extends to the side surface through the first multi-turn surface. The protection structure is disposed on the substrate and includes a wire protection portion covering a plurality of edge wires. The wire protection portion has a first thickness on the side surface, a second thickness on the first main surface, and a third thickness on at least one of the plurality of first turning surfaces. The first thickness is greater than the second thickness, and the second thickness is greater than the third thickness.

In an embodiment of the present invention, the above-mentioned protection structure further includes a gap protection portion extending between the plurality of edge wires. The gap protection portion has a fourth thickness on the side surface, a fifth thickness on the first main surface, a sixth thickness on at least one of the plurality of first turning surfaces, the fourth thickness is greater than the fifth thickness, and the first The fifth thickness is greater than the sixth thickness.

In an embodiment of the present invention, the above-mentioned second thickness is greater than the fifth thickness.

In an embodiment of the present invention, the above-mentioned second thickness is greater than the fourth thickness.

In an embodiment of the present invention, the above-mentioned protective structure is formed by stacking a first protective layer and a second protective layer, and the first protective layer is located between the plurality of edge wires and the second protective layer.

In an embodiment of the present invention, the above-mentioned first protective layer covers a plurality of edge wires, and the outline of the edge wires conforms to the outline of the first protective layer.

In an embodiment of the present invention, the above-mentioned second protective layer includes an overlapping segment and a gap segment. The overlapping section is stacked on the first protective layer to form a wire protection portion with the first protective layer. The gap segment is located in the gap between the plurality of edge wires and contacts the substrate.

In an embodiment of the present invention, the above-mentioned second protective layer exposes a portion of the first protective layer on the first main surface.

In an embodiment of the present invention, the above-mentioned substrate further includes a second main surface and a second multiple inflection surface between the second main surface and the side surface. The second multiple inflection surfaces include a plurality of second inflection surfaces with different normal directions.

In an embodiment of the present invention, the above-mentioned edge wires respectively extend continuously from the first main surface, the first multiple inflection surface, the side surface, the second multi-inflection surface to the second main surface.

In an embodiment of the present invention, the intersection of the first multiple turning surface and the first main surface is a first lateral distance from the side surface, and the intersection of the second multiple turning surface and the second main surface is a second distance from the side surface. Two lateral distances, and the first lateral distance is smaller than the second lateral distance.

In an embodiment of the present invention, the above-mentioned electronic device further includes a first conductive pad and a second conductive pad. The first conductive pad and the second conductive pad are respectively disposed on the first main surface and the second main surface, and one of the edge wires electrically connects the first conductive pad and the second conductive pad.

In an embodiment of the present invention, the above-mentioned second conductive pads are further away from the side surface than the first conductive pads.

In an embodiment of the present invention, the length of the first conductive pad is smaller than the length of the second conductive pad.

In an embodiment of the present invention, the above-mentioned electronic device further includes a light-emitting element. The light emitting element is disposed on the first main surface and is spaced apart from the protective structure.

In an embodiment of the present invention, the above-mentioned electronic device further includes an encapsulation layer to encapsulate the light-emitting element.

In an embodiment of the present invention, the above-mentioned encapsulation layer further overlaps a portion of the protective structure on the first main surface.

In an embodiment of the present invention, the normal direction of the first turning surfaces is between the normal direction of the first main surface and the normal direction of the side surface.

In an embodiment of the present invention, the intersection of the first multiple turning surface and the first main surface is a first lateral distance from the side surface, and the intersection of the first multiple turning surface and the side surface is far from the first main surface. The surface has a first vertical distance, and the first vertical distance is 0.5 times to 2 times the first lateral distance.

In an embodiment of the present invention, the above-mentioned first vertical distance is equal to the first lateral distance.

Based on the above, the electronic device of some embodiments of the present invention utilizes the edge wires disposed on the surface of the substrate to realize the signal transmission line, which can allow external electronic components (such as components such as circuit boards) to be bonded to surfaces other than the main surface. . In this way, the electronic device can arrange functional electronic components (such as display components, touch components, sensing components, etc.) on most of the main surface of the substrate, and even arrange these functional electronic components adjacent to the edge of the substrate. element. Therefore, the electronic device can have a narrow bezel or even almost bezel-less design. In addition, the board of the electronic device can have multiple inflection surfaces, so that the edge wires can continuously extend from the main surface through the multiple inflection surfaces to the side surfaces to ensure the continuity of the edge wires.

100, 200: Electronic devices

110: Substrate

112A: First major surface

112B: Second major surface

114: Side Surface

116A, 116A': The first multi-turn surface

116A1, 116A2, 116A3: The first turning surface

116B, 116B': The second multi-turn surface

116B1, 116B2: The second turning surface

120: Edge Wire

120': Conductor material layer

130, 230: Protection structure

130A: Conductor protection part

130B: Gap protection part

132: The first protective layer

134, 234: The second protective layer

134A: Overlapping Segments

134B: Gap Segment

140: Light-emitting element

150: encapsulation layer

D1, D1': the first lateral distance

D2, D2': the first vertical distance

D3': Second lateral distance

D4': Second vertical distance

G120: Clearance

P1, P1': the first conductive pad

P2, P2': the second conductive pad

R1, R2, R3, R4: Intersection angle

T1: first thickness

T132a, T132b, T132c, T132d: Thickness

T2: Second thickness

T3: The third thickness

T4: Fourth thickness

T5: Fifth thickness

T6: sixth thickness

X, Y, Z: direction

X1, X1', X2, X2', X3', X4': intersection

1 to 4 present some steps of manufacturing an electronic device according to some embodiments of the present invention.

FIG. 5 is a schematic cross-sectional view of the electronic device of FIG. 4 along line I-I.

FIG. 6 is a schematic cross-sectional view of the electronic device of FIG. 4 along line II-II.

FIG. 7 is a schematic cross-sectional view of the electronic device of FIG. 4 along line III-III.

FIG. 8 is a schematic partial cross-sectional view of a substrate according to an embodiment of the present invention.

FIG. 9 is a schematic partial cross-sectional view of a substrate according to another embodiment of the present invention.

10 is a partial cross-sectional schematic diagram of an electronic device according to another embodiment of the present invention.

11 is a partial cross-sectional schematic diagram of an electronic device according to still another embodiment of the present invention.

In the drawings, the thickness of layers, films, panels, regions, etc., are exaggerated for clarity. The same reference numerals refer to the same elements throughout the specification. It will be understood that when an element such as a layer, film, region, or substrate is referred to as being "on," "connected to," "overlying" another element, it can be directly on the other element on or connected to another element, or intervening elements may also be present. In contrast, when an element is referred to as being "directly on" or "directly connected to" another element, there are no intervening elements present. As used herein, "connected" may refer to a physical and/or electrical connection. Furthermore, "electrically connected" or "coupled" may refer to the existence of other elements between the two elements.

It will be understood that, although the terms "first," "second," "third," etc. may be used herein to describe various elements, components, regions, layers and/or sections, these These elements, components, regions, and/or sections should not be limited by these terms. These terms are only used to distinguish one element, component, region, layer or section from another element, component, region, layer or section. Thus, "a first element," "component," "region," "layer," or "section" discussed below could be termed a second element, component, region, layer or section without departing from the teachings herein.

The terminology used herein is for the purpose of describing particular embodiments only and is not limiting. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms including "at least one" unless the content clearly dictates otherwise. "Or" means "and/or". As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items. It will also be understood that, when used in this specification, the terms "comprising" and/or "comprising" designate the stated feature, region, integer, step, operation, presence of an element and/or part, but do not exclude one or more The presence or addition of other features, entireties of regions, steps, operations, elements, components, and/or combinations thereof.

Furthermore, relative terms such as "lower" or "bottom" and "upper" or "top" may be used herein to describe one element's relationship to another element, as shown in the figures. It should be understood that relative terms are intended to encompass different orientations of the device in addition to the orientation shown in the figures. For example, if the device in one of the figures is turned over, elements described as being on the "lower" side of other elements would then be oriented on "upper" sides of the other elements. Thus, the exemplary term "lower" may include an orientation of "lower" and "upper", depending on the particular orientation of the figures. Similarly, if the device in one of the figures is turned over, elements described as "below" or "beneath" other elements would then be oriented on the other Element "above". Thus, the exemplary terms "below" or "above" can encompass both an orientation of above and below.

As used herein, "about", "substantially", or "approximately" includes the stated value and the average within an acceptable deviation of the particular value as determined by one of ordinary skill in the art, considering the measurement in question and the A specified amount of measurement-related error (ie, a limitation of the measurement system). For example, "about" can mean within one or more standard deviations of the stated value, or within ±30%, ±20%, ±10%, ±5%. Furthermore, as used herein, "about", "substantially", or "approximately" may be used to select a more acceptable range of deviation or standard deviation depending on optical properties, etching properties, or other properties, and not one standard deviation may apply to all. nature.

Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. It will be further understood that terms such as those defined in commonly used dictionaries should be construed as having meanings consistent with their meanings in the context of the related art and the present invention, and are not to be construed as idealized or excessive Formal meaning, unless expressly defined as such herein.

Exemplary embodiments are described herein with reference to cross-sectional illustrations that are schematic illustrations of idealized embodiments. Thus, variations in the shapes of the illustrations as a result of, for example, manufacturing techniques and/or tolerances, are to be expected. Accordingly, the embodiments described herein should not be construed as limited to the particular shapes of regions as shown herein, but rather include deviations in shapes resulting from, for example, manufacturing. For example, regions illustrated or described as flat may typically have rough and/or nonlinear features. Additionally, the acute angles shown may be rounded. Therefore, as shown in the figure The regions are schematic in nature and their shapes are not intended to illustrate the precise shape of a region and are not intended to limit the scope of the claims.

For the convenience of description, the following drawings all represent the orientation of the components presented in each drawing in the X direction, the Y direction and the Z direction. The X direction, the Y direction, and the Z direction may be orthogonal to each other, or may intersect with each other in a non-orthogonal manner.

1 to 4 present some steps of manufacturing an electronic device according to some embodiments of the present invention. In FIG. 1 , a first conductive pad P1 and a second conductive pad (not shown in FIG. 1 ) are pre-formed on the substrate 110 , and a conductive material layer 120 ′ is formed on the substrate 110 . The substrate 110 is a plate-like object with a certain mechanical strength that can support objects, for multiple film layers and/or multiple objects to be arranged thereon. In some embodiments, the material of the substrate 110 includes glass, polymer materials, ceramics, and the like. In other embodiments, the substrate 110 may be a multi-layer substrate, which is formed by stacking multiple sub-layers. The substrate 110 has a first main surface 112A, a second main surface 112B, and a side surface 114 . In FIG. 1 , the number of the first conductive pads P1 is multiple, and the plurality of first conductive pads P1 can be arranged along the Y direction. The first conductive pads P1 are located on the first main surface 112A, and the second conductive pads not shown in FIG. 1 may be located on the second main surface 112B.

The conductor material layer 120' may cover the first conductive pads P1 on the first main surface 112A of the substrate 110, and may continuously extend from the first main surface 112A through the side surface 114 to the second main surface 112B. The conductor material layer 120' may be formed on the substrate 110 by edge sputtering. The material of the conductor material layer 120' includes copper, aluminum, molybdenum, silver, gold, nickel, titanium ITO, IGZO, and the like. The conductor material layer 120' may contact and directly cover the first conductive pad P1. provided on the second main surface 112B with When a pad (eg, a second conductive pad, not shown) is used, the conductor material layer 120' may contact and directly cover the second conductive pad on the second main surface 112B.

In FIG. 2 , the first protective layer 132 is formed on the substrate 110 . The first protective layer 132 may have a stripe pattern, and the first protective layer 132 may continuously extend from the first main surface 112A to the second main surface 112B through the side surface 114 . As shown in FIG. 2 , a plurality of strip-shaped first protective layers 132 may be arranged along the Y direction, and the plurality of strip-shaped first protective layers 132 may be disposed corresponding to the first conductive pads P1 . In some embodiments, the first protective layer 132 may be fabricated on the substrate 110 by printing. For example, in some manufacturing processes, the protective layer material can be coated or applied on the printing tool first, and then the printing tool is pressed against the side surface 114 of the substrate 110 so that the protective layer material on the printing tool is attached to the conductor on the material layer 120'. Next, after removing the printing tool, the first protective layer 132 may be formed by curing the protective layer material attached to the conductor material layer 120'.

After the first protective layer 132 in FIG. 2 is fabricated, a patterning step may be performed to remove the conductor material layer 120' not covered by the first protective layer 132 to form the edge wires 120 shown in FIG. 3 . The method of patterning the conductor material layer 120' includes an isotropic etching method. For example, the patterning step is such that the conductor material layer 120' not covered by the first protective layer 132 is brought into contact with the etchant. Here, the etchant for patterning the conductor material layer 120' has selectivity to the conductor material layer 120' and the first protective layer 132. That is to say, the etchant used in the patterning step is not easy, and even does not react with the material of the first protective layer 132, so the first protective layer 132 is generally not damaged during the etching step and acts as a hard mask use.

The edge wires 120 are disposed on the substrate 110 and correspond to the first protective layer 132 . The number of the edge wires 120 may be the same as the number of the first protective layers 132 . Each edge wire 120 is sandwiched between one of the strip-shaped first protective layers 132 and the substrate 110 , and extends continuously from the first main surface 112A of the substrate 110 to the second main surface of the substrate 110 through the side surface 114 of the substrate 110 . Surface 112B.

Next, as shown in FIG. 4 , a second protective layer 134 is further formed on the structure of FIG. 3 to complete the electronic device 100 . The second protective layer 134 is disposed on the substrate 110 and covers the first protective layer 132 . The second protective layer 134 can be produced by printing (eg, transfer printing) or by dipping. For example, the second protective layer 134 can be fabricated by dipping the substrate 110 in a solution of protective material to make the protective material adhere to the substrate 110, and then the second protective layer 134 can be formed after the protective material is cured . The first protective layer 132 and the second protective layer 134 may constitute a protective structure 130 for protecting the edge wires 120 .

The materials of the first protective layer 132 and the second protective layer 134 may include polyester resins, phenolic resins, alkyd resins, polycarbonate resins, and polyphenolic resins. Amine resins (polyamide resins), polyurethane resins (polyurethane resins), silicone resins (silicone resins), epoxy resins (epoxy resins), polyethylene resins (polyethylene resins), acrylic resins (acrylic resins), polystyrene resins ( polystyrene resins), polypropylene resins, or other materials with waterproof protection. The first protective layer 132 and the second protective layer 134 can be made of the same material or can be made of different materials.

FIG. 4 is a partial schematic diagram of an electronic device according to an embodiment of the present invention. FIG. 5 is a schematic cross-sectional view of the electronic device of FIG. 4 along line I-I. In FIGS. 4 and 5 , the electronic device 100 includes a substrate 110 , a plurality of edge wires 120 and a protection structure 130 , but not limited thereto. In some embodiments, the electronic device 100 may further include other signal lines, other electronic components, and the like. For example, in addition to the components in the figures, the electronic device 100 may further include light-emitting elements, display elements, touch-control elements, or combinations thereof. For example, as shown in FIG. 5 , the electronic device 100 may further include a first conductive pad P1 and a second conductive pad P2 , wherein the first conductive pad P1 is disposed on the first main surface 112A of the substrate 110 , and The second conductive pads P2 are disposed on the second main surface 112B of the substrate 110 . Each edge wire 120 is disposed corresponding to one of the first conductive pads P1 , and one of the edge wires 120 can electrically connect the first conductive pad P1 and the corresponding second conductive pad P2 to establish a connection between the first main conductive pad P1 and the corresponding second conductive pad P2. Surface 112A extends continuously to the electrical transmission path of second major surface 112B.

In FIGS. 4 to 5 , the substrate 110 has, for example, a first main surface 112A, a second main surface 112B, and a side surface 114 . In this embodiment, the normal direction of the first main surface 112A and the second main surface 112B can be parallel to the direction Z, for example, and the normal direction of the side surface 114 can be parallel to the direction X. In other words, the normal direction of the first main surface 112A may intersect with the normal direction of the side surface 114 and be parallel to the normal direction of the second main surface 112B, but not limited thereto.

6 is a schematic cross-sectional view of the electronic device of FIG. 4 along line II-II, and FIG. 7 is a schematic cross-sectional view of the electronic device of FIG. 4 taken along line III-III. The substrate 110 can be cut to have the required size. In addition, the first main surface 112A and the side surface 114 are The corners between the two can be chamfered so that the substrate 110 has the first multi-turn surface 116A. The first multi-turn surface 116A is connected between the first main surface 112A and the side surface 114 . The normal direction of the first multi-turn surface 116A may be between the normal direction of the first main surface 112A and the normal direction of the side surface 114 .

In FIG. 6 and FIG. 7 , the first multi-turn surface 116A can be formed through two chamfering processes. For example, the first multiple inflection surfaces 116A may include two first inflection surfaces 116A1 and 116A2, wherein the first inflection surface 116A1 is connected between the first inflection surface 116A2 and the first main surface 112A, and the first inflection surface 116A1 116A2 is connected between the first turning surface 116A1 and the side surface 114 . In other embodiments, the first multiple inflection surfaces 116A may selectively have three or more inflection surfaces.

Similarly, the corners between the second main surface 112B and the side surfaces 114 can be beveled to make the substrate 110 have the second multi-turn surface 116B. The second multiple inflection surfaces 116B are connected between the second main surface 112B and the side surface 114 and can be formed by the second inflection surfaces 116B1 and 116B2 , but not limited thereto. In other embodiments, the corner between the second main surface 112B and the side surface 114 may optionally not be chamfered, but not limited thereto. The normal direction of the second multi-turn surface 116B may be between the normal direction of the second main surface 112B and the normal direction of the side surface 114 .

The first multi-turn surface 116A is sandwiched between the first main surface 112A and the side surface 114 and the second multi-turn surface 116B is sandwiched between the second main surface 112B and the side surface 114 so that there is an obtuse angle between the adjacent surfaces corner. In this way, any film layers and/or components that traverse adjacent surfaces can have better continuity and are less likely to be interrupted at corners. Therefore, the quality of the electronic device 100 can be ensured.

It can be seen from FIGS. 4 , 5 and 6 that the edge wires 120 are disposed on the substrate 110 , and each edge wire 120 extends from the first main surface 112A to the side surface 114 through the first multi-turn surface 116A. Depending on design requirements, each edge wire 120 may further extend from the side surface 114 to the second main surface 112B through the second multiple inflection surfaces 116B. The first multiple turning surface 116A and the second multiple turning surface 116B make the adjacent surfaces have obtuse corners, so the edge wire 120 can be continuous from the first main surface 112A, through the first multiple turning surface 116A, the side surface 114 and the second multi-turn surface 116B extend to the second main surface 112B. In other words, the edge conductor 120 has good continuity between surfaces with different normal vectors, which helps to ensure the electrical signal transmission quality of the edge conductor 120 .

The protection structure 130 is disposed on the substrate 110 and includes a wire protection portion 130A covering the plurality of edge wires 120 and a gap protection portion 130B extending between the edge wires 120 . In this embodiment, the wire protection portion 130A refers to the portion of the protection structure 130 overlapping the edge wire 120 , and the gap protection portion 130B refers to the portion of the protection structure 130 extending in the gap G120 of the edge wire 120 . That is, the lead wire protection portion 130A and the gap protection portion 130B are distinguished by their distribution positions.

Specifically, the protection structure 130 may be formed by stacking the first protection layer 132 and the second protection layer 134 . The first protective layer 132 has a plurality of protective layers in stripe patterns. Each strip pattern of the first protective layer 132 is disposed corresponding to one of the edge wires 120 to cover the edge wires 120 . As can be seen from FIGS. 4 and 5 , the outline of the edge wires 120 conforms to the outline of the first protective layer 132 , and the first protective layer 132 covers each of the edge wires 120 correspondingly. The second protective layer 134 continuously covers the edge guide The gap G120 between the wire 120 and the edge wire 120 . The second protective layer 134 may cover the first protective layer 132 and completely cover the first protective layer 132 and the edge wires 120, but is not limited thereto.

In some embodiments, the first protective layer 132 and the second protective layer 134 may have the same material, so there is no obvious boundary between the first protective layer 132 and the second protective layer 134 . In other embodiments, the first protective layer 132 and the second protective layer 134 may have different materials, and a clear boundary exists therebetween. In addition, the second protective layer 134 may include overlapping segments 134A and gap segments 134B. The overlapping section 134A is stacked on the first protective layer 132 to form a wire protection portion 130A with the first protective layer 132 . The gap segment 134B is located in the gap G120 between the plurality of edge wires 120 and contacts the substrate 110 to constitute the gap protection portion 130B of the protection structure 130 .

Referring to FIG. 6 , the wire protection portion 130A of the protection structure 130 is mainly composed of a first protection layer 132 and an overlapping segment 134A stacked on the first protection layer 132 . The wire protection portion 130A has a first thickness T1 on the side surface 114, a second thickness T2 on the first main surface 112A, and a third thickness T3 on the first turning surface 116A1. The first thickness T1 is greater than the second thickness T2, and the second thickness T2 is greater than the third thickness T3.

Referring to FIGS. 4 and 7 , the gap protection portion 130B extending between the plurality of edge wires 120 is mainly composed of the gap segments 134B of the second protective layer 134 , and the gap segments 134B can contact the substrate 110 without the wires being sandwiched between the substrate 110 and the substrate 110 . between gap segments 134B. The gap protection portion 130B has a fourth thickness T4 on the side surface 114, a fifth thickness T5 on the first main surface 112A, and a first thickness T5 on the first turning surface 116A1. Six thicknesses T6, the fourth thickness T4 is greater than the fifth thickness T5, and the fifth thickness T5 is greater than the sixth thickness T6. Referring to FIG. 5 and FIG. 6 simultaneously, in some embodiments, the second thickness T2 may be greater than the fifth thickness T5. In other embodiments, the second thickness T2 may be greater than the fourth thickness T4. In yet other embodiments, the third thickness T3 is greater than the sixth thickness T6.

FIG. 8 is a schematic partial cross-sectional view of a substrate according to an embodiment of the present invention, wherein FIG. 8 is a partially enlarged schematic view of the first multi-turn surface 116A of the substrate 110 . The normal direction of the first main surface 112A of the substrate 110 is, for example, the parallel direction Z, and the normal direction of the side surface 114 is, for example, the parallel direction X. The first multiple inflection surfaces 116A may include two first inflection surfaces 116A1 and 116A2. In this embodiment, the normal directions of the first inflection surface 116A1 and the first inflection surface 116A2 may both be between the direction Z and the direction X. Specifically, the normal direction of the first turning surface 116A1 is between the normal direction of the first main surface 112A and the normal direction of the first turning surface 116A2, and the normal direction of the first turning surface 116A2 is between the normal direction of the first turning surface 116A2. Between the normal direction of a turning surface 116A1 and the normal direction of the side surface 114 . The intersection angle between the normal direction of the first main surface 112A and the normal direction of the first turning surface 116A1, the intersection angle between the normal direction of the first turning surface 116A1 and the normal direction of the first turning surface 116A2, and the intersection angle of the first turning surface 116A2 The intersection angles of the normal direction and the normal direction of the side surface 114 may be equal to or similar to each other.

In some embodiments, the intersection X1 of the first multi-turn surface 116A and the first main surface 112A is a first lateral distance D1 away from the side surface 114 , and the intersection X2 of the first multiple-turn surface 116A and the side surface 114 is at a distance from the first side surface 114 . Main surface 112A first vertical The distance D2, and the first vertical distance D2 may be approximately 0.5 times to 2 times the first lateral distance D1. In some embodiments, the first vertical distance D2 may be substantially equal to the first lateral distance D1. The so-called lateral distance refers to the distance measured parallel to the direction X, and the so-called vertical distance refers to the distance measured parallel to the direction Z. The relationship between the first lateral distance D1 and the first vertical distance D2 described here can be applied to all embodiments herein, and is not particularly limited.

FIG. 9 is a schematic partial cross-sectional view of a substrate according to another embodiment of the present invention, wherein FIG. 9 shows a partial structure of the first multi-turn surface 116A of the substrate 110 . The normal direction of the first main surface 112A of the substrate 110 is, for example, the parallel direction Z, and the normal direction of the side surface 114 is, for example, the parallel direction X. The first multiple inflection surfaces 116A may include three first inflection surfaces 116A1 , 116A2 and 116A3 . In this embodiment, the normal directions of the first inflection surface 116A1 , the first inflection surface 116A2 and the first inflection surface 116A3 may all be between the direction Z and the direction X. The intersection angle R1 between the normal direction of the first main surface 112A and the normal direction of the first turning surface 116A1, the intersection angle R2 between the normal direction of the first turning surface 116A1 and the normal direction of the first turning surface 116A2, the first turning surface The intersection angle R3 between the normal direction of 116A2 and the normal direction of the first turning surface 116A3 and the intersection angle R4 between the normal direction of the first turning surface 116A3 and the normal direction of the side surface 114 may be equal to or similar to each other.

10 is a partial cross-sectional schematic diagram of an electronic device according to another embodiment of the present invention. The electronic device 200 of FIG. 10 includes a substrate 110 , edge wires 120 , a protection structure 230 , a light-emitting element 140 and an encapsulation layer 150 , wherein the protection structure 230 is formed by stacking a first protection layer 132 and a second protection layer 234 , for example. described in this example The substrate 110 , the edge wires 120 and the first protective layer 132 are substantially the same as the corresponding components in the previous embodiments, so the descriptions of the substrate 110 , the edge wires 120 and the first protective layer 132 in the previous embodiments can be incorporated into this embodiment , will not be repeated. In addition, the light-emitting element 140 and the sealing layer 150 shown in FIG. 10 can be applied to other embodiments herein.

In this embodiment, the light emitting element 140 may be disposed on the first main surface 112A of the substrate 110 and spaced apart from the protective structure 230 . That is, the light emitting element 140 does not contact the protection structure 230 . In some embodiments, the light emitting element 140 includes a light emitting diode element, but is not limited thereto. For example, the number of light-emitting elements 140 is multiple, and different light-emitting elements 140 can emit light of different colors. The light emitting element 140 can be electrically connected to the corresponding first conductive pad P1 through the circuit structure fabricated on the substrate 110 . Here, the edge wires 120 , the first conductive pads P1 and the second conductive pads P2 can all be used to transmit electrical signals required by the light-emitting element 140 .

The encapsulation layer 150 may be disposed on the first main surface 112A of the substrate 110 to cover the light-emitting element 140 . In addition, the second protective layer 234 of this embodiment is substantially similar to the second protective layer 134 of the previous embodiment, and the material and configuration of the second protective layer 134 can be referred to the description of the above-mentioned second protective layer 134 . However, the second protective layer 234 in this embodiment exposes the portion of the first protective layer 132 on the first main surface 112A. That is, the portion of the first protective layer 132 on the first main surface 112A is not completely covered by the second protective layer 234 . In addition, the encapsulation layer 150 may further overlap a portion of the protective structure 230 on the first main surface 112A, and even cover a portion of the second protective layer 234 . In this way, the first protective layer 132 can completely seal the second protective layer 234 and the encapsulation layer 150 .

11 is a partial cross-sectional schematic diagram of an electronic device according to still another embodiment of the present invention. The electronic device 300 in FIG. 11 includes the substrate 110 , the edge wires 120 and the protective structure 130 , wherein the relative arrangement and fabrication of the substrate 110 , the edge wires 120 and the protective structure 130 can be referred to the descriptions of the foregoing embodiments. The components shown in FIG. 11 are substantially similar to the components shown in FIG. 4 , so the following description is mainly based on the differences between the two embodiments. The components in Figures 4 and 11 denoted with the same element numbers may be arranged in the same manner.

In FIG. 11 , the first main surface 112A and the second main surface 112B are, for example, opposite surfaces of the substrate 110 . A first multiple inflection surface 116A' is disposed between the first main surface 112A and the side surface 114 of the substrate 110 , and a second multiple inflection surface 116B' is disposed between the second main surface 112B and the side surface 114 of the substrate 110 . One of the differences between the present embodiment and the embodiment of FIG. 4 lies in the extension lengths of the first multiple inflection surfaces 116A' and the second multiple inflection surfaces 116B'. Specifically, the intersection X1 ′ of the first multiple turning surface 116A′ and the first main surface 112A is a first lateral distance D1 ′ from the side surface 114 , and the intersection X2 of the first multiple turning surface 116A′ and the side surface 114 'the first vertical distance D2' from the first main surface 112A. The intersection X3' of the second multi-turn surface 116B' and the second main surface 112B is a second lateral distance D3' from the side surface 114, and the intersection X4' of the second multiple-turn surface 116B' and the side surface 114 is a second distance away The main surface 112B is a second vertical distance D4'. In this embodiment, the first lateral distance D1' may be smaller than the second lateral distance D3', and the first vertical distance D2' may be smaller than the second vertical distance D4'. In some embodiments, a design in which the first lateral distance D1' is smaller than the second lateral distance D3' and the first vertical distance D2' is equal to the second vertical distance D4', or the first lateral distance can be adopted A design in which D1' is equal to the second lateral distance D3' and the first vertical distance D2' is less than the second vertical distance D4'. That is, the first multiple inflection surface 116A' and the second multiple inflection surface 116B' may have different extension lengths.

In some embodiments, the first multi-inflection surface 116A' and the second multi-inflection surface 116B' may have different extension lengths, but the lengths of the first multi-inflection surface 116A' in the direction Z and the direction X may be are equal, and the lengths of the second multi-turn surface 116B' in the direction Z and the direction X may be equal. For example, the first vertical distance D2' may be substantially equal to the first lateral distance D1', and the second vertical distance D4' may be substantially equal to the second lateral distance D3'. In some embodiments, the first vertical distance D2' may be approximately 0.5 to 2 times the first lateral distance D1', and similarly, the second vertical distance D4' may be approximately the second lateral distance D3' 0.5 times to 2 times. In addition, the first multi-inflection surface 116A' and the second multi-inflection surface 116B' are described here by taking as an example that each has two inflection surfaces, but the first multi-inflection surface 116A' and the second multi-inflection surface 116B 'The number of turning surfaces each has can be adjusted according to different designs.

In some embodiments, a first conductive pad P1' and a second conductive pad P2' may be disposed on the substrate 110, and the edge wires 120 contact the first conductive pad P1' and the second conductive pad P2' to connect the The first conductive pad P1' and the second conductive pad P2' are electrically connected to each other. The first conductive pads P1' are disposed on the first main surface 112A of the substrate 110, and the second conductive pads P2' are disposed on the second main surface 112B of the substrate 110, and the second conductive pads P2' are comparable to The first conductive pad P1 ′ is further away from the side surface 114 in the direction X. As shown in FIG. The length L1' of the first conductive pad P1' in the direction X may be smaller than the length L2 of the second conductive pad P2' in the direction X.

In addition, in the electronic device 300 , the protection structure 130 covering the edge wires 120 may be formed by stacking the first protection layer 132 and the second protection layer 134 . In the embodiment in which the first protective layer 132 and the second protective layer 134 are made of different materials, there may be a clear boundary between the first protective layer 132 and the second protective layer 134 . In the embodiment in which the first protective layer 132 and the second protective layer 134 are made of the same material, there is no obvious boundary between the first protective layer 132 and the second protective layer 134 , so that the protective structure 130 can be seen as a substantially integrated structure .

In some embodiments, the first protective layer 132 may have a varying thickness. The thickness described below refers to a dimension of the first protective layer 132 measured in the direction normal to the surface on which it is located. For example, the first protective layer 132 has a thickness T132a on the first main surface 112A, a thickness T132b and T132c on the first multi-turn surface 116A', and a thickness T132d on the side surface 114. Thickness T132a, thickness T132b, thickness T132c and thickness T132d may not be exactly the same. In some embodiments, the thickness T132d may be greater than each of the thicknesses T132a, T132b, and T132c, so the first protective layer 132 has the largest thickness at the side surface 114, but not limited thereto. In addition, the thickness T132a, the thickness T132b and the thickness T132c can be decreased in sequence, for example, the thickness T132a is greater than the thickness T132b, and the thickness T132b is greater than the thickness T132c, but not limited thereto. In some embodiments, the thickness of the first protective layer 132 on the second main surface 112B may be substantially similar to the thickness T132a, and the thickness of the second multi-turn surface 116B' may be substantially similar to the thicknesses T132b and T132c.

To sum up, the electronic device of the present invention has corners with multiple turns, so the edge wires distributed along the corners can have ideal continuity. In addition, electronic equipment The design with edge wires can have a very narrow frame, which helps to improve the application flexibility of the electronic device. In this way, the electronic device of the embodiment of the present invention can be applied to products that require extremely narrow bezels or even no bezels, such as spliced products.

110: Substrate 112A: First major surface 114: Side Surface 116A: First Multiple Turning Surface 116A1, 116A2: The first turning surface D1: first lateral distance D2: The first vertical distance X, Z: direction X1, X2: intersection point

Claims (18)

An electronic device, comprising: a substrate having a first main surface, a side surface, and a first multiple inflection surface connected between the first main surface and the side surface, wherein the first multi-inflection surface includes a plurality of first turning surfaces with different normal directions; a plurality of edge wires arranged on the substrate, the plurality of edge wires respectively extending from the first main surface through the first multiple turning faces to the side surface; and a protection structure, disposed on the substrate, and comprising a wire protection portion covering the plurality of edge wires, wherein the wire protection portion has a first thickness on the side surface, and a wire protection portion on the side surface A major surface has a second thickness, and at least one of the plurality of first turning surfaces has a third thickness, the first thickness is greater than the second thickness, and the second thickness is greater than the third thickness thickness, wherein the substrate further includes a second main surface and a second multiple inflection surface between the second main surface and the side surface, the second multi-inflection surface includes a plurality of different normal directions a second inflection surface, and wherein the plurality of edge conductors each extend from the first main surface, the first multiple inflection surface, the side surface, the second multi-inflection surface to the second main surface The surface extends continuously. The electronic device of claim 1, wherein the protection structure further comprises a gap protection part extending between the plurality of edge wires, the gap protection part has a fourth thickness on the side surface, and the gap protection part has a fourth thickness on the side surface. The first major surface has a fifth thick and having a sixth thickness on at least one of the plurality of first turning surfaces, the fourth thickness is greater than the fifth thickness, and the fifth thickness is greater than the sixth thickness. The electronic device of claim 2, wherein the second thickness is greater than the fifth thickness. The electronic device of claim 2, wherein the second thickness is greater than the fourth thickness. The electronic device of claim 1, wherein the protection structure is formed by stacking a first protection layer and a second protection layer, and the first protection layer is located between the plurality of edge wires and the second protection layer between. The electronic device of claim 5, wherein the first protective layer covers the plurality of edge wires, and the outlines of the plurality of edge wires conform to the outline of the first protective layer. The electronic device according to claim 5, wherein the second protective layer includes an overlapping section and a gap section, and the overlapping section is stacked on the first protective layer to form the wire with the first protective layer a protection part, and the gap segment is located in the gap between the plurality of edge wires and contacts the substrate. The electronic device of claim 5, wherein the second protective layer exposes a portion of the first protective layer on the first main surface. The electronic device according to claim 1, wherein the intersection of the first multiple turning surface and the first main surface is a first lateral distance from the side surface, and the second multiple turning surface and the The intersection of the second major surfaces is a second lateral distance from the side surface, and the first lateral distance is less than the second lateral distance. The electronic device according to claim 1, further comprising a first conductive pad and a second conductive pad, respectively disposed on the first main surface and the second main surface, and the plurality of edge wires are One of them electrically connects the first conductive pad and the second conductive pad. The electronic device of claim 10, wherein the second conductive pad is further away from the side surface than the first conductive pad. The electronic device of claim 10, wherein the length of the first conductive pad is smaller than the length of the second conductive pad. The electronic device of claim 1, further comprising a light-emitting element disposed on the first main surface and spaced apart from the protection structure. The electronic device of claim 13, further comprising an encapsulation layer to cover the light-emitting element. The electronic device of claim 14, wherein the encapsulation layer further overlaps a portion of the protective structure on the first major surface. The electronic device of claim 1, wherein the normal direction of the plurality of first turning surfaces is between the normal direction of the first main surface and the normal direction of the side surface. The electronic device of claim 1, wherein the intersection of the first multiple turning surface and the first main surface is a first lateral distance from the side surface, and the first multiple turning surface and the The intersection of the side surfaces is a first vertical distance from the first main surface, and the first vertical distance is 0.5 times to 2 times the first lateral distance. The electronic device of claim 17, wherein the first vertical distance is equal to the first lateral distance.

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