TWI751020B - Electronic device and manufacturing method of electronic device - Google Patents

Abstract

An electronic device including a substrate, an edge wire, a first protection layer and a second protection layer is provided. The substrate has a first surface, a second surface and a side surface connecting between the first surface and the second surface. A normal vector of the side surface is different from the first surface and the second surface. The edge wire is disposed on the substrate extending from the first surface, passing through the side surface to the second surface. The first protection layer is disposed on the edge wire. The edge wire is sandwiched between the substrate and the first protection layer. An undercut structure is formed by the edge wire and the first protection layer. The second protection layer is disposed on the substrate, filling the undercut structure. A manufacturing method of an electronic device is also provided herein.

Description

Electronic device and manufacturing method of electronic device

The present invention relates to an electronic device and a manufacturing method of the electronic device.

In response to the diversified applications of electronic devices, various manufacturing technologies and product designs are constantly being introduced. In order to provide more diverse applications, products with narrow or no borders have been proposed one after another. For example, in addition to providing larger functional areas (such as display areas, touch areas, etc.), products with narrow or no bezels can also be used in spliced products (such as splicing display panels).

The invention provides an electronic device, which utilizes the design of edge wires to reduce the frame.

The present invention provides a manufacturing method of an electronic device, which can produce stable side wires to improve the yield of the side wires.

The electronic device of the present invention includes a substrate, edge wires, a first protective layer and a second protective layer. The substrate has a first surface, a second surface and is connected to the first surface the side surface between the face and the second surface. The normal vector of the side surface is different from that of the first surface and also different from that of the second surface. The edge wires are arranged on the substrate and extend from the first surface to the second surface through the side surface. The first protective layer is disposed on the edge wires. The edge wires are sandwiched between the substrate and the first protective layer, and the edge wires and the first protective layer form an undercut structure. The second protective layer is disposed on the substrate and fills the undercut structure.

In an embodiment of the present invention, the above-mentioned edge wires are retracted relative to the second protective layer.

In an embodiment of the present invention, the above-mentioned second protective layer surrounds the first protective layer.

In an embodiment of the present invention, the above-mentioned undercut structures are distributed along the periphery of the edge wire.

In an embodiment of the present invention, the above-mentioned first protective layer has a thickness that gradually decreases outward.

In an embodiment of the present invention, the above-mentioned electronic device further includes a driving circuit structure. The driving circuit structure is disposed on the substrate, and the driving circuit structure is electrically connected to the edge wires.

In an embodiment of the present invention, the above-mentioned electronic device further includes a light-emitting element. The light-emitting element is arranged on the substrate and is electrically connected to the driving circuit structure.

In an embodiment of the present invention, the above-mentioned driving circuit structure includes a first pad disposed on the first surface and a second pad disposed on the second surface, and the edge wires are connected to the first pad and the second pad pad.

The electronic device of the present invention includes a substrate, an edge wire and a protection structure. base The plate has a first surface, a second surface, and a side surface connected between the first surface and the second surface. The normal vector of the side surface is different from that of the first surface and also different from that of the second surface. The edge wires are arranged on the substrate and extend from the first surface to the second surface through the side surface. The protection structure is disposed on the substrate. The protective structure wraps the edge wire, and there is a gap between the protective structure and the edge wire.

In an embodiment of the present invention, the above-mentioned gap is a closed gap.

In an embodiment of the present invention, the above-mentioned gaps are distributed along the periphery of the edge wire.

In an embodiment of the present invention, the above-mentioned electronic device further includes a driving circuit structure. The driving circuit structure is disposed on the substrate, and the driving circuit structure is electrically connected to the edge wires.

The manufacturing method of the electronic device of the present invention includes the following steps, but is not limited thereto. A conductor material layer is formed on the substrate. The conductor material layer extends continuously from the first surface of the substrate through the side surface to the second surface, wherein the side surface is connected between the first surface and the second surface. A first protective layer is formed on the conductor material layer, and the first protective layer is used as a mask to pattern the conductor material layer to form edge wires, wherein the edge wires are retracted relative to the first protective layer to form an undercut structure. A second protective layer is formed on the substrate, and the second protective layer fills the undercut structure.

In an embodiment of the present invention, the above-mentioned first protective layer is formed on the conductor material layer by transfer.

In an embodiment of the present invention, before the conductor material layer is formed, a driving circuit structure is formed on the substrate, and a release protective layer is used to cover the driving circuit structure. at least part of it.

In an embodiment of the present invention, the release protective layer is removed after the second protective layer is formed.

In an embodiment of the present invention, the second protective layer is formed on the substrate by means of soaking, spraying, coating or transfer printing.

In an embodiment of the present invention, the method for forming the second protective layer includes performing multiple printing steps, and the printing patterns of the multiple printing steps at least partially overlap.

In one embodiment of the present invention, the method of patterning the layer of conductor material includes an isotropic etching method.

In an embodiment of the present invention, the etchant for patterning the conductor material layer is selective to the conductor material layer and the first protective layer.

Based on the above, the electronic device according to the embodiment of the present invention includes edge wires disposed on the edge of the substrate, so that the frame width of the electronic device can be reduced to achieve a narrow frame design. In addition, the edge wires are protected from damage by the protective structure. In some embodiments, the protective structure may include two protective layers, one of which is a protective layer for defining the outline of the edge conductors, and the other is a protective layer that wraps the sidewalls of the edge conductors to seal the edge conductors. In this way, the stability of the edge wire can be improved.

100: Electronics

110: Substrate

112: First Surface

114: Second Surface

116: side surface

118: Corner

120: Drive circuit structure

122: first pad

122': 2nd pad

124: Pixel pads

130: release protective layer

140: Conductor material layer

142: Edge Wire

142A: First line segment

142B: Second line segment

142C: Third line segment

150: The first protective layer

162: Second protective layer

162A: First printing pattern

162B: Second printing pattern

170: Protection Structure

180: Light-emitting element

B130: Boundary

B150: Bottom

E, F, G, H: Area

E142, E150: Sidewall

G1, G2, G142: Interval

I-I', II-II', III-III', IV-IV', V-V', VI-VI', VII-VII', VIII-VIII': line

P150, P160: Spacing

S160, S160': outer surface

T122, T150: end

UC: Undercut Structure

VD: void

W100: border width

X, Y, Z: direction

1 to 4 present some steps of manufacturing an electronic device according to some embodiments of the present invention.

FIG. 5 is a schematic cross-sectional view of the structure of FIG. 4 along line I-I.

FIG. 6 is a partial enlarged schematic view of the area E of FIG. 4 .

FIG. 7 is a schematic cross-sectional structure diagram of the line II-II of FIG. 6 .

FIG. 8 is a partially enlarged schematic view of the region F of FIG. 4 .

FIG. 9 is a schematic cross-sectional structure diagram of the line III-III of FIG. 8 .

FIG. 10 presents some of the steps in manufacturing an electronic device according to some embodiments of the present invention.

Fig. 11 is a schematic cross-sectional view taken along the line IV-IV' of Fig. 10 .

FIG. 12 is a partially enlarged schematic view of the region G of FIG. 10 .

Fig. 13 is a schematic cross-sectional view taken along line V-V' of Fig. 12 .

FIG. 14 is a partially enlarged schematic view of the region H of FIG. 10 .

Fig. 15 is a schematic cross-sectional view taken along line VI-VI' of Fig. 14 .

FIG. 16 is a schematic diagram of an electronic device according to some embodiments disclosed.

FIG. 17 is a schematic cross-sectional view taken along the line VII-VII' of FIG. 16 according to some embodiments of the disclosure.

Fig. 18 is a schematic cross-sectional view taken along line VIII-VIII' of Fig. 16 .

19 is a schematic cross-sectional view of the electronic device of FIG. 16 along an extension line of line VII-VII' according to some embodiments.

20 is a schematic cross-sectional view of the electronic device of FIG. 16 along an extension line of line VII-VII' according to some embodiments.

21 is a schematic cross-sectional view of the electronic device of FIG. 16 along an extension line of line VII-VII' according to some embodiments.

22 is a view of the electronic device of FIG. 16 along line VII-VII' according to some embodiments Schematic cross-section of the extension line.

1 to 4 present some steps of manufacturing an electronic device according to some embodiments of the present invention. In FIG. 1 , the driving circuit structure 120 is pre-formed on the substrate 110 . The substrate 110 is a plate-like object with a certain mechanical strength that can support objects, for multiple film layers and/or multiple objects to be arranged thereon. In some embodiments, the material of the substrate 110 includes glass, polymer materials, ceramics, and the like. In other embodiments, the substrate 110 may be a multi-layer substrate, which is formed by stacking multiple sub-layers. The substrate 110 has a first surface 112 , a second surface 114 , and a side surface 116 connected between the first surface 112 and the second surface 114 . Here, the normal direction of the side surface 116 is different from that of the first surface 112 and also different from that of the second surface 114 . In some embodiments, the normal vectors of the first surface 112 and the second surface 114 may be parallel to each other, but not limited thereto. For example, the first surface 112 and the second surface 114 are respectively a plane parallel to the X direction-Y direction, and the side surface 116 is a plane parallel to the Y direction-Z direction. In other embodiments, the components provided on the side surface 116 may be applied to other side surfaces, for example, the side surfaces parallel to the plane of the X direction-Z direction.

The driving circuit structure 120 may include a first pad 122 and a pixel pad 124 , and both the first pad 122 and the pixel pad 124 are disposed on the first surface 112 of the substrate 110 . In some embodiments, the driving circuit structure 120 may further include a pixel circuit (not shown in FIG. 1 ) electrically connected to the first pad 122 and the pixel pad 124 . For example, the pixel circuit (not shown in FIG. 1 ) may include signal lines, active elements, and passive elements etc., wherein the active element is, for example, a transistor and the passive element is, for example, a capacitor structure, but not limited thereto. In some embodiments, the pixel circuit (not shown in FIG. 1 ) may be fabricated on the first surface 112 of the substrate 110 by means of film deposition and lithography or printing. Therefore, the above-mentioned transistor can be a thin film transistor, and the capacitor structure can be formed by stacking a conductive layer and a dielectric layer. In addition, in some embodiments, the driving circuit structure 120 may further include second pads (not shown in FIG. 1 ) and/or corresponding wires disposed on the second surface 114 of the substrate 110 .

In FIG. 1 , the number of the first pads 122 is multiple, and the multiple first pads 122 can be arranged in a row along the Y direction. The first pads 122 are located on the first surface 112 , and the arrangement positions of the first pads 122 are closer to the side surface 116 than the pixel pads 124 . In some embodiments, the end T122 of the first pad 122 may extend to the corner 118 of the side surface 116 and the first surface 112 , or even be flush with the side surface 118 . A release protection layer 130 is further formed on the substrate 110 , wherein the release protection layer 130 covers the pixel pads 124 and exposes the first pads 122 . The release protective layer 130 may be a film that is not damaged in subsequent manufacturing steps and may be removed in a manner that does not damage the pixel pads 124 . The boundary B130 of the release protective layer 130 and the side surface 116 are separated by a gap G1 in the X direction, and the first pad 122 is located in the gap G1.

In some embodiments, the release protective layer 130 may be a thermal curing material. The manner of forming the release protective layer 130 on the substrate 110 may include coating a curable colloidal material on the substrate 110 and curing it by heating. In other embodiments, the release protective layer 130 may be a photocurable material or a photo-thermal curing material. The release protective layer 130 is a material that can be peeled off from the substrate 110 . In some embodiments, the base A release protective layer 130 may also be formed on the second surface 114 of the board 110 to cover films or components on the second surface 114 that are not intended to be damaged, such as wirings or similar components, but not limited thereto.

In FIG. 2 , a conductor material layer 140 is formed on the substrate 110 . The conductor material layer 140 may cover a portion of the first surface 112 of the substrate 110 that is not covered by the release protective layer 130 . The conductor material layer 140 may partially cover the release protection layer 130 . The layer of conductor material 140 may extend continuously from the first surface 112 through the side surface 116 to the second surface 114 . The conductor material layer 140 may be formed on the substrate 110 by edge sputtering. The material of the conductor material layer 140 includes copper, aluminum, molybdenum, silver, gold, nickel, titanium ITO, IGZO and the like. The conductor material layer 140 may contact and directly cover the first pad 122 . When pads (eg, second pads, not shown) are provided on the second surface 114 , the conductor material layer 140 may contact and directly cover the second pads on the second surface 114 .

In FIG. 3 , a first protective layer 150 is formed on the substrate 110 . The first protective layer 150 may be fabricated on the substrate 110 by transfer printing. The first protective layer 150 may have a stripe pattern, and the first protective layer 150 may continuously extend from the first surface 112 to the second surface 114 through the side surface 116 . As shown in FIG. 3 , the plurality of strip-shaped first protective layers 150 may be arranged along the Y direction, and the plurality of strip-shaped first protective layers 150 may be disposed corresponding to the first pads 122 . In some embodiments, the orthographic projection of the first protective layer 150 on the first surface 112 in the Z direction may overlap the positive projection of the first pads 122 (and the corresponding second pads) on the first surface 112 in the Z direction projection. Even, the orthographic projection of the first pad 122 (and the corresponding second pad) on the first surface 112 in the Z direction may be It is completely within the orthographic projection of the first protective layer 150 on the first surface 112 in the Z direction. The plurality of strip-shaped first protective layers 150 are disposed corresponding to the first pads 122 in a one-to-one manner, so each of the first protective layers 150 only overlaps one first pad 122 . In some embodiments, the strip-shaped first protective layer 150 has an end T150 and the end T150 is separated from the boundary B130 of the release protective layer 130 by a gap G2 . Therefore, the first protective layer 150 and the release protective layer 130 do not overlap each other in the thickness direction (eg, the Z direction).

In some embodiments, the first protective layer 150 may be fabricated on the substrate 110 by printing. For example, in some manufacturing processes, the protective layer material may be coated or applied on the printing tool first, and then the printing tool is pressed against the side surface 116 of the substrate 110, so that the protective layer material on the printing tool is attached to the conductor on the material layer 140 . Next, after removing the printing tool, the first protective layer 150 may be formed by curing the protective layer material attached to the conductor material layer 140 . In other words, the first protective layer 150 can be fabricated on the substrate 110 by means of embossing. In some embodiments, the printing tool may have a printing pattern distributed in stripes, so that the strip-shaped first protective layer 150 may be formed on the conductor material layer 140 . In addition, the printed pattern can be made of elastic material, such as rubber. When the printing tool is pressed against the side surface 116 of the substrate 110 , a part of the printing pattern can be pressed against the conductor material layer 140 on the first surface 112 and the second surface 114 , and the protective layer material is imprinted on the first surface 112 with the conductor material layer 140 on the second surface 114 . For example, the printing tool may move toward the substrate 110 along the X direction to transfer the protective layer material onto the conductor material layer 140 on the side surface 116 , the first surface 112 and the second surface 114 during the printing process. in other real In the embodiment, the printing tool can also be moved along the X direction toward the substrate 110 to the pressing side surface 116, and further rotated around the Y direction to transfer the corresponding protective layer material to the first surface 112 and the second surface. On conductor material layer 140 on 114 .

After the first protective layer 150 in FIG. 3 is fabricated, a patterning step may be performed to remove the conductor material layer 140 not covered by the first protective layer 150 to form the edge wires 142 shown in FIG. 4 . The method of patterning the conductor material layer 140 includes an isotropic etching method. For example, the patterning step is to make the conductor material layer 140 not covered by the first protective layer 150 contact the etchant. Here, the etchant for patterning the conductor material layer 140 has selectivity to the conductor material layer 140 and the first protective layer 150 . That is, the etchant used in the patterning step has, for example, a composition that does not react with the first protective layer 150, so the first protective layer 150 is not substantially damaged during the etching step.

In FIG. 4 , the edge wires 142 are disposed on the substrate 110 and correspond to the first protective layer 150 . The number of the edge wires 142 may be the same as the number of the first protective layers 150 . Each edge wire 142 is sandwiched between one of the strip-shaped first protective layers 150 and the substrate 110 , and extends from the first surface 112 of the substrate 110 to the second surface 114 of the substrate 110 through the side surface 116 of the substrate 110 .

FIG. 5 is a schematic cross-sectional view of the structure of FIG. 4 along the line I-I, which is used to illustrate the specific structure of one of the edge wires, but the present disclosure is not limited thereto. As can be seen from FIG. 5 , the first pads 122 may be provided on the first surface 112 of the substrate 110 , the second pads 122 ′ may be provided on the second surface 114 of the substrate 110 , and the edge wires 142 are formed by the first surface of the substrate 110 . 112 extends to the second surface 114 of the substrate 110 through the side surface 116 of the substrate 110 , and the first protective layer 150 is disposed far from the edge wires 142 away from the side of the substrate 110 .

The edge wire 142 may include a first line segment 142A, a second line segment 142B and a third line segment 142C. The first line segment 142A is disposed on the first surface 112 and extends from the corner 118 between the first surface 112 and the side surface 116 along the X direction toward the first pad 122 , or even beyond the first pad 122 . The second line segment 142B is disposed on the second surface 114 and extends from the corner 118 ′ between the second surface 114 and the side surface 116 along the X direction toward the second pad 122 ′, or even beyond the second pad 122 ′. . The third line segment 142C is disposed on the side surface 116 and extends along the Z direction to be connected to the first line segment 142A and the second line segment 142B. Therefore, the edge wire 142 is a three-dimensional wire having a three-dimensional U-shaped structure surrounding the edge of the substrate 110 .

In the etching step of patterning the conductor material layer 140 of FIG. 3 into the edge conductors 142, the conductor material layer 140 may be over-etched to ensure that adjacent edge conductors 142 are disconnected from each other. For example, due to over-etching, the outline of the edge wire 142 may be shrunk relative to the outline of the first protective layer 150 to form an undercut structure UC. In FIG. 5 , the end T150 of the first protective layer 150 may protrude toward the release protective layer 130 relative to the end T142 of the edge wire 142 , or the end T142 of the edge wire 142 may be retracted relative to the end T150 of the first protective layer 150 An undercut structure UC is formed. In addition, the thickness of the first protective layer 150 may be non-uniform. For example, the thickness of the first protective layer 150 may be thinner toward the contour edge.

FIG. 6 is a partial enlarged schematic view of the area E of FIG. 4 , wherein the enlarged view of FIG. 6 presents a top view of the structure of FIG. 4 viewed along the Z direction. In FIG. 6 , the edge leads 142 may protrude outwardly in the X direction from the side surface 116 of the substrate 110 , wherein the edge The portion of the wire 142 located on the substrate 110 is the aforementioned first line segment 142A, and the portion protruding outward from the side surface 116 of the substrate 110 along the X direction is the aforementioned third line segment 142C. The first protective layer 150 completely shields the edge wires 142 . Therefore, the portion of the first protective layer 150 covering the third line segment 142C is also protruded outward along the X direction from the side surface 116 of the substrate 110 .

FIG. 7 is a schematic cross-sectional structure diagram of the line II-II of FIG. 6 . In FIGS. 6 and 7 , the first line segment 142A of the edge wire 142 contacts the first pad 122 on the substrate 110 and can completely cover the first pad 122 . The sidewall E142 of the edge wire 142 can be retracted relative to the sidewall E150 of the first protective layer 150 to form an undercut structure UC along the sidewall E142. 6 and 7 mainly show the configuration design of the first line segment 142A of the edge wire 142, and the design of FIGS. 6 and 7 can also be applied to the second line segment 142B, so the configuration design of the second line segment 142B will not be repeated. .

8 is a partial enlarged schematic view of the area F of FIG. 4 , wherein the enlarged view of FIG. 8 shows a side view of the structure of FIG. 4 viewed along the X direction, and FIG. FIG. 9 is a schematic cross-sectional structure diagram of the line III-III of FIG. 8 . In FIGS. 8 and 9 , the third segment 142C of the edge wire 142 contacts the side surface 116 of the substrate 110 and extends between the first surface 112 and the second surface 114 along the Z direction. The sidewall E142 of the edge wire 142 can be retracted relative to the sidewall E150 of the first protective layer 150 to form an undercut structure UC along the sidewall E142. The undercut structure UC along the end T142 of the edge wire 142 in FIG. 5 , the undercut structure UC along the edge E142 in FIG. 6 , and the undercut structure UC along the edge E142 in FIG. 8 may be a continuous body. Therefore, the undercut structure UC is essentially along the edge The structure of the contour distribution of the edge wire 142 . In addition, as can be seen from FIG. 5 , FIG. 7 and FIG. 9 , the first protective layer 150 has a thickness that gradually decreases outward.

FIG. 10 shows some steps of manufacturing an electronic device according to some embodiments of the present invention, and FIG. 11 is a schematic cross-sectional view taken along line IV-IV' of FIG. 10 . The step shown in FIG. 10 is mainly to further form a second protective layer 160 on the structure of FIG. 4 . The second protective layer 160 is disposed on the substrate 110 and covers the first protective layer 150 . In FIGS. 10 and 11 , the second protective layer 160 not only covers the first protective layer 150 , but also fills the undercut structure UC, so that the second protective layer 160 can contact the end T142 of the edge wire 142 . In other words, the second protective layer 160 may surround the first protective layer 150 such that the first protective layer 150 is sealed in the first protective layer 160 . The second protective layer 160 may be formed on the substrate 110 by soaking, spraying, coating or transfer printing.

FIG. 12 is a partial enlarged schematic diagram of the region G of FIG. 10 , wherein the enlarged view of FIG. 12 presents a top view of the structure of FIG. 10 viewed along the Z direction. Fig. 13 is a schematic cross-sectional view taken along line V-V' of Fig. 12 . 14 is a partial enlarged schematic view of the region H of FIG. 10 , wherein the enlarged view of FIG. 14 presents a side view of the structure of FIG. 10 viewed along the X direction. Fig. 15 is a schematic cross-sectional view taken along line VI-VI' of Fig. 14 . 12 to 16 , the second protective layer 160 not only covers the first protective layer 150 , but also fills the undercut structure UC, so the second protective layer 160 can contact the end T142 of the edge wire 142 . In some embodiments, the second protective layer 160 may be fabricated by printing (eg, transfer printing) or by dipping. For example, the second protective layer 160 can be fabricated by dipping the substrate 110 in a solution of protective material to make the protective material adhere to the substrate 110, and then the second protective layer 160 can be formed after the protective material is cured. .

The materials of the first protective layer 150 and the second protective layer 160 may include polyester resins, phenolic resins, alkyd resins, polycarbonate resins, and polyphenolic resins. Amine resins (polyamide resins), polyurethane resins (polyurethane resins), silicone resins (silicone resins), epoxy resins (epoxy resins), polyethylene resins (polyethylene resins), acrylic resins (acrylic resins), polystyrene resins ( polystyrene resins), polypropylene resins, or other materials with waterproof protection. In some embodiments, the first protective layer 150 and the second protective layer 160 may be formed of different materials or the same material.

FIG. 16 is a schematic diagram of an electronic device according to some embodiments disclosed. The electronic device 100 of FIG. 16 includes a substrate 110 , an edge wire 142 , a protective structure 170 and a light emitting element 180 . In some embodiments, the electronic device 100 may be a device formed by removing the release protective layer 130 (marked in FIG. 10 ) from the structure shown in FIG. 10 , and then bonding the light-emitting element 180 to the pixel pads 124 . Here, the protection structure 170 may include a first protection layer 150 and a second protection layer 160 . Specifically, the structural design and configuration relationship of the substrate 110 , the edge wires 142 , the first protective layer 150 and the second protective layer 160 can be referred to the descriptions in the preceding paragraphs, and will not be repeated.

The substrate 110 has a first surface 112 , a second surface 114 and a side surface 116 connected between the first surface 112 and the second surface 114 , wherein the substrate 110 may further be provided with the driving circuit structure 120 shown in FIG. 1 , and The driving circuit structure 120 may include a first pad 122 , a second pad 122 ′ and a pixel pad 124 (refer to FIG. 1 , FIG. 5 , and FIG. 11 ). The light-emitting element 180 is bonded to the pixel pads 124 . in some In embodiments, the light emitting element 180 may comprise a light emitting diode, such as a micron light emitting diode, a millimeter light emitting diode, or the like. In other embodiments, the substrate 110 may be further provided with other functional elements such as touch elements, sensing elements, and the like.

In this embodiment, the edge wires 142 extend from the first surface 112 to the second surface 114 through the side surface 116 . The edge wires 142 can electrically connect the first pads 122 on the first surface 112 to the second pads on the second surface 114 (the second pads 122' shown in FIGS. 5 and 11 ). In addition, the circuit board or other external circuit structures intended to be bonded to the electronic device 100 can be bonded to the lines or pads on the second surface 114 without being bonded to the first surface 112 . Therefore, the periphery of the first surface 112 does not need to reserve a bonding area for bonding the external circuit structure. In other words, a larger area can be left on the first surface 112 for the arrangement of the light-emitting element 180 , so as to achieve a narrow frame design. In some embodiments, the extension length of the edge wire 142 along the X direction on the first surface 112 is smaller than the bonding width reserved for bonding the circuit board. For example, the frame width W100 of the electronic device 100 on the first surface 112 is, for example, 5 millimeters (5 mm). Compared with the design of bonding the circuit board on the first surface 112 , the electronic device 100 can have a smaller frame width, even a frame width that cannot be easily recognized by a user. Therefore, the electronic device 100 can be applied to a spliced display, and when the electronic device 100 is spliced together with other electronic devices 100 , the user cannot easily perceive the existence of the edge. In addition, the electronic device 100 can be applied to other designs that require a very small frame width or even no frame.

The protective structure 170 wraps the edge wire 142 . As mentioned above, the protection structure 170 includes the first protection layer 150 and the second protection layer 160 . The first protective layer 150 shields The edge wires 142 , and the outlines of the edge wires 142 are shrunk compared to the first protective layer 150 . The second protection layer 160 covers the first protection layer 150 and fills the undercut structure formed by the first protection layer 150 , the edge wires 142 and the substrate 110 (the undercut structure UC described in FIGS. 4 to 14 ).

17 is a schematic cross-sectional view along the line VII-VII' of FIG. 16 according to some embodiments of the disclosure, and FIG. 18 is a schematic cross-sectional view along the line VIII-VIII' of FIG. 16 . In FIGS. 17 and 18 , the first protective layer 150 and the second protective layer 160 of the protective structure 170 are made of, for example, the same material. As shown in FIG. 17 and FIG. 18 , when the first protective layer 150 and the second protective layer 160 are made of the same material, the boundary between the first protective layer 150 and the second protective layer 160 is not obvious, as shown by the dotted line. At this time, the protection structure 170 may be substantially an integrally formed structure. When fabricating the second protective layer 160 , based on the size of the undercut structure UC and the properties of the protective material, the second protective layer 160 may not be able to completely fill the undercut structure UC formed by the first protective layer 150 , the edge wires 142 and the substrate 110 . , while a void VD is formed at the undercut structure UC.

The voids VD may be scattered along the contour of the edge conductor 142 and exist between the protective structure 170 and the edge conductor 142 . The void VD may be located between the partial bottom surface B150 of the first protective layer 150 protruding from the edge wire 142 and the side wall E142 of the edge wire 142 . The void VD may be located between the first surface 112 of the substrate 110 and the sidewall E142 of the edge wire 142 . The void VD may be a closed void and sealed between the substrate 110 , the edge wires 142 and the protection structure 170 . In some embodiments, when the first protective layer 150 and the second protective layer 160 are made of different materials, a gap VD may also exist between the substrate 110 , the edge wires 142 and the protective structure 170 . At this time, empty The gaps VD may be roughly distributed among the substrate 110 , the edge wires 142 , the first protection layer 150 and the second protection layer 160 .

19 is a schematic cross-sectional view of the electronic device of FIG. 16 along an extension line of line VII-VII' according to some embodiments. In FIG. 19 , the electronic device 100 includes a substrate 110 , a first pad 122 , a second pad 122 ′, an edge wire 142 , a first protective layer 150 and a second protective layer 170 , wherein the first protective layer 150 and the second protective layer 170 The protective layer 160 may constitute the protective structure 170 . As shown in the embodiment of FIG. 19 , the second protective layer 160 may be a flat layer having flat outer surfaces S160 and S160'. The outer surface S160 of the second protective layer 160 is the surface away from the substrate 110 of the part of the second protective layer 160 disposed on the first surface 112 . The outer surface S160' of the second protective layer 160 is a surface away from the substrate 110 of the part of the second protective layer 160 disposed on the second surface 114. The outer surfaces S160 and S160' may be substantially parallel to the first surface 112 and the second surface 114, that is, the outer surfaces S160 and S160' may extend substantially along a plane in the X direction and the Y direction.

20 is a schematic cross-sectional view of the electronic device of FIG. 16 along an extension line of line VII-VII' according to some embodiments. In FIG. 20 , the electronic device 100 includes a substrate 110 , a first pad 122 , a second pad 122 ′, an edge wire 142 , a first protective layer 150 and a second protective layer 160 , wherein the first protective layer 150 and the second protective layer 160 The protective layer 160 may constitute the protective structure 170 . As shown in the embodiment of FIG. 20 , the second protective layer 160 may have wavy outer surfaces S160 and S160'. The outer surface S160 and the outer surface S160', for example, fluctuate with the distribution of the edge wires 142. That is, the outer surface S160 is farther from the substrate 110 at the position corresponding to the edge wires 142 , and closer to the substrate 110 at the interval G142 of the edge wires 142 . In some embodiments, the second protective layer 160 may be printed method is fabricated on the substrate 110 .

For example, the second protective layer 160 may include a plurality of first printing patterns 162A and a plurality of second printing patterns 162B. The first printing patterns 162A may be produced on the substrate 110 by the same printing tool and in the same printing step; the same, the second printing patterns 162B are also produced on the substrate 110 by the same printing tool and in the same printing step of. The first printing pattern 162A and the second printing pattern 162B may be fabricated on the substrate 110 using the same printing tool but in different printing steps. That is, the method for forming the second protective layer 160 includes performing multiple printing steps, but the present disclosure is not limited thereto. The first printed patterns 162A are spaced apart from each other, and the second printed patterns 162B are also spaced apart from each other. The first printing pattern 162A and the second printing pattern 162B at least partially overlap. The first printing patterns 162A and the second printing patterns 162B may be alternately distributed to form the second protective layer 160 continuously distributed along the Y direction.

21 is a schematic cross-sectional view of the electronic device of FIG. 16 along an extension line of line VII-VII' according to some embodiments. In FIG. 21 , the electronic device 100 includes a substrate 110 , a first pad 122 , a second pad 122 ′, an edge wire 142 , a first protection layer 150 and a second protection layer 160 , wherein the first protection layer 150 and the second protection layer 160 The protective layer 160 may constitute the protective structure 170 . As shown in the embodiment of FIG. 20 , the second protective layer 160 may have wavy outer surfaces S160 and S160'. The undulation frequencies of outer surfaces S160 and S160' alternate with the distribution of edge conductors 142. That is, the outer surface S160 is closer to the substrate 110 at locations corresponding to the edge wires 142 , and further away from the substrate 110 at the interval G142 of the edge wires 142 . The manufacturing method of the second protective layer 160 of FIG. 21 can be roughly the same The manufacturing method of the second protective layer 160 is the same as that of FIG. 20 , so it will not be repeated. In other words, the second protective layer 160 can be fabricated on the substrate 110 by multiple printing methods. The manner of printing multiple times can make the printing pattern and the printing pattern partially overlap each other, which helps to determine the continuity of the second protective layer 160 . Therefore, the second protection layer 160 can reliably cover the edge wires 142 to achieve an ideal protection and blocking effect. For example, the second protective layer 160 can ensure that the edge wires 142 are not affected by external moisture and are not deteriorated or oxidized.

22 is a schematic cross-sectional view of the electronic device of FIG. 16 along an extension line of line VII-VII' according to some embodiments. In FIG. 22 , the electronic device 100 includes a substrate 110 , a first pad 122 , a second pad 122 ′, an edge wire 142 , a first protective layer 150 and a second protective layer 160 , wherein the first protective layer 150 and the second protective layer 160 The protective layer 160 may constitute the protective structure 170 . The second protective layer 160 may include a plurality of first printing patterns 162A and a plurality of second printing patterns 162B, and the distance P160 between the first printing patterns 162A and the second printing patterns 162B may be greater than the distance P150 of the first protective layer 150 . For example, the pitch P160 in FIG. 22 may be twice the pitch P150, but not limited thereto. The fabrication method of the second protective layer 160 in FIG. 22 may be substantially the same as the fabrication method of the second protective layer 160 in FIG. 20 , and therefore will not be repeated. In other words, the second protective layer 160 can be fabricated on the substrate 110 by multiple printing methods. The manner of printing multiple times can make the printing pattern and the printing pattern partially overlap each other, which helps to determine the continuity of the second protective layer 160 . Therefore, the second protection layer 160 can reliably cover the edge wires 142 to achieve an ideal protection and blocking effect. For example, the second protective layer 160 can ensure that the edge wires 142 are not affected by external moisture and are not deteriorated or oxidized.

To sum up, the electronic device according to the embodiment of the present invention is provided with edge wires extending from the first surface of the substrate to the second surface through the side surface at the edge of the substrate. A circuit structure intended to be bonded to the electronic device, such as a circuit board or the like, may be bonded to the second surface of the electronic device. In this way, the periphery of the first surface of the electronic device does not need to retain the bonding area intended to be connected to the external circuit structure, so as to achieve a narrow frame width or even a frameless design. In addition, the edge conductors are covered by a protective structure to ensure the reliability of the edge conductors. The protective structure can seal the edge wire to prevent the external moisture from oxidizing or deteriorating the edge wire. Therefore, the electronic device has good quality.

110: Substrate

112: First Surface

114: Second Surface

116: side surface

120: Drive circuit structure

122: first pad

124: Pixel pads

142: Edge Wire

130: release protective layer

150: The first protective layer

160: Second protective layer

G, H: area

IV-IV': line

X, Y, Z: direction

Claims (20)

An electronic device, comprising: a substrate having a first surface, a second surface and a side surface connected between the first surface and the second surface, the normal vector of the side surface being different from the first surface Also different from the second surface; edge wires are arranged on the substrate and extend from the first surface to the second surface through the side surfaces; a first protective layer is arranged on the edge guides On the line, the edge wires are sandwiched between the substrate and the first protective layer, and the edge wires and the first protective layer form an undercut structure; and a second protective layer is disposed on the substrate , filling the undercut structure. The electronic device of claim 1, wherein the edge wires are retracted relative to the second protective layer. The electronic device of claim 1, wherein the second protective layer surrounds the first protective layer. The electronic device of claim 1, wherein the undercut structures are distributed along the periphery of the edge wire. The electronic device of claim 1, wherein the first protective layer has a thickness that gradually decreases outward. The electronic device of claim 1, further comprising a drive circuit structure disposed on the substrate, and the drive circuit structure is electrically connected to the edge wires. The electronic device of claim 6, further comprising a light-emitting element disposed on the substrate and electrically connected to the driving circuit structure. The electronic device of claim 6, wherein the driving circuit structure comprises a first pad disposed on the first surface and a second pad disposed on the second surface, and the edge wires are connected to the first pad and the second pad. An electronic device, comprising: a substrate having a first surface, a second surface and a side surface connected between the first surface and the second surface, the normal vector of the side surface being different from the first surface Also different from the second surface; edge wires, disposed on the substrate, extend from the first surface to the second surface through the side surface; and a protection structure, disposed on the substrate, The protection structure covers the edge wires, and there is a gap between the protection structure and the edge wires. The electronic device of claim 9, wherein the void is a closed void. The electronic device of claim 9, wherein the voids are distributed along a perimeter of the edge wire. The electronic device of claim 9, further comprising a driving circuit structure disposed on the substrate, and the driving circuit structure is electrically connected to the edge wires. A method of manufacturing an electronic device, comprising: A conductor material layer is formed on the substrate, the conductor material layer extends continuously from the first surface of the substrate through the side surface to the second surface, wherein the side surface is connected between the first surface and the second surface between; forming a first protection layer on the conductor material layer, and patterning the conductor material layer with the first protection layer as a mask to form edge wires, wherein the edge wires are opposite to the first protection layer The layer is retracted to form an undercut structure; and a second protective layer is formed on the substrate, and the second protective layer fills the undercut structure. The method for manufacturing an electronic device according to claim 13, wherein the first protective layer is formed on the conductor material layer by transfer. The method for manufacturing an electronic device according to claim 13, further comprising, before forming the conductor material layer, forming a driving circuit structure on the substrate and covering at least a part of the driving circuit structure with a release protective layer . The manufacturing method of an electronic device according to claim 15, further comprising removing the release protective layer after forming the second protective layer. The method for manufacturing an electronic device according to claim 13, wherein the second protective layer is formed on the substrate by means of soaking, spraying, coating or transfer printing. The method for manufacturing an electronic device according to claim 13, wherein the method for forming the second protective layer includes performing a plurality of printing steps, and the transfer patterns of the plurality of printing steps at least partially overlap. The method of manufacturing an electronic device according to claim 13, wherein the method of patterning the conductor material layer includes an isotropic etching method. The method for manufacturing an electronic device according to claim 13, wherein the etchant for patterning the conductor material layer is selective to the conductor material layer and the first protective layer.

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