TWI812124B - Electronic module and carrier structure thereof and manufacturing method thereof - Google Patents

Abstract

An electronic module is provided, in which a carrier structure is electrically connected with conductors on opposite sides of the carrier structure by means of wire bonding, so that ends of the wires in the wire bonding process are in contact with the conductors. Therefore, junction of the wires and the conductors is so small to effectively reduce the contact resistance.

Description

Electronic module and its load-bearing structure and manufacturing method

The present invention relates to an electronic module, and in particular to an electronic module related to a light-emitting diode and its carrying structure and manufacturing method.

In recent years, due to the properties of light-emitting diodes (LEDs) such as long service life, low power consumption, no need for warm-up time, and fast response time, the number of related products has increased day by day.

As shown in Figure 1A, the existing LED display panel is composed of multiple LED modules 1a spliced together to form a display panel 1.

FIG. 1B is a schematic diagram of a conventional LED module 1a and its supporting member 1b. As shown in FIG. 1B, the carrier 1b includes a glass plate 10, which has an opposite front surface 10a and a back surface 10b, and a side surface 10c adjacent to the front surface 10a and the back surface 10b, and between the glass plate 10 A first metal layer 11a is provided on the front surface 10a, and a second metal layer 11b is provided on the back surface 10b of the glass plate 10. Further, a patterned plating process is performed on the side 10c of the glass plate 10 to adhere and form the copper circuit 12 on the side 10c and extend to the front 10a and the back. 10b, and contacts the first metal layer 11a and the second metal layer 11b, so that the copper circuit 12 is electrically connected to the first metal layer 11a and the second metal layer 11b.

In subsequent packaging applications, a plurality of LED chips 14 can be placed on the front 10a of the glass plate 10 of the carrier 1b, so that the front 10a of the glass plate 10 is covered with the LED chips 14 to form the LED module 1a. Multiple LED modules 1a are then spliced into the display panel 1, in which the wiring area of the carrier 1b is wound from the edge of the front 10a of the glass plate 10 through the side 10c to the back 10b of the glass plate 10, so as to The back surface 10b of the glass plate 10 is connected to electronic components such as flexible printed circuit (FPC), integrated circuit chip (IC) or other circuits through the second metal layer 11b.

However, the conventional carrier 1b is subjected to a pattern plating process on the side 10c of the glass plate 10, so the following problems will occur:

First, since the wiring process requires three metal plating processes, as shown in Figure 1C, to form the first metal layer 11a, the second metal layer 11b and the copper lines 12, the film formation is discontinuous, resulting in the intersection A of each metal layer. The area is too large (as shown in FIG. 1C and FIG. 1D , the area of the junction A is equal to the area of the contact 110 of each metal layer), resulting in a large contact resistance.

Second, when making the copper circuit 12 on the side 10c of the glass plate 10, the glass plate 10 needs to be placed upright (as shown in Figure 1D, the side 10c is facing up and the front 10a and the back 10b are facing left and right) , therefore, during the yellow light exposure process, it is difficult to coat the photoresist uniformly or cannot coat the photoresist at all, resulting in the inability to carry out the yellow light exposure process, and thus the fine line specifications required for the copper circuit 12 cannot be produced.

Third, since the glass plate 10 needs to be upright to make the copper circuit 12 on the side 10c of the glass plate 10, it is impossible to accurately align and adjust the exposure height during the yellow light exposure process.

Therefore, how to overcome the various problems of the above-mentioned conventional technologies has become an urgent issue to be solved.

In view of the various shortcomings of the above-mentioned conventional technologies, the present invention provides a load-bearing structure, which includes: a plate body with opposite first and second surfaces and side surfaces adjacent to the first and second surfaces; A conductor is provided on the first surface of the plate; a second conductor is provided on the second surface of the plate; and at least one conductor is connected with one end of the first conductor and spans the side The other end is connected to the second conductor, so that the conductor is electrically connected to the first conductor and the second conductor, and the conductor is separated from the side surface of the plate.

The present invention further provides a method for manufacturing a load-bearing structure, which includes: providing a plate body with first and second opposite surfaces and side surfaces adjacent to the first and second surfaces, and on the third side of the plate body There is a first conductor on one surface, and a second conductor on the second surface of the board; and a wiring process is performed so that at least one conductor connects one end of the conductor to the first conductor and crosses the side. The other end is connected to the second conductor, so that the conductor is electrically connected to the first conductor and the second conductor, and the conductor is separated from the side surface of the plate body.

As in the aforementioned load-bearing structure and its manufacturing method, the plate system is a glass plate.

As in the aforementioned load-bearing structure and its manufacturing method, the side surface of the plate body has a recess corresponding to the conductor.

As in the aforementioned load-bearing structure and its manufacturing method, the conductor is a wire made of conductive materials such as gold, silver, copper, aluminum, or alloys of the above materials.

The present invention also provides an electronic module, which includes: the above-mentioned load-bearing structure; and electronic components, which are disposed on the first surface of the board and electrically connected to the first conductor.

In the aforementioned electronic module, the electronic component is a light-emitting chip.

It can be seen from the above that in the electronic module and its load-bearing structure and manufacturing method of the present invention, the conventional patterned plating process is mainly replaced by a wire bonding process to avoid the problems caused by the yellow light exposure process, and the ends of the wires are The partial contact combination of the first conductor and the second conductor can reduce the area of the intersection between the conductor and each conductor, thereby effectively reducing the contact resistance.

1:Display panel

1a:LED module

1b: Bearing part

10:Glass plate

10a: Front

10b: reverse

10c,20c: side

11a: First metal layer

11b: Second metal layer

110,210: Contact

12:Copper line

14:LED chip

2: Load-bearing structure

20:Plate body

20a: First surface

20b: Second surface

21a: First conductor

21b: Second conductor

22:Wire

22a,22b: end

22c: line segment

300: concave part

4: Electronic module

40: Electronic components

A, B: handover point

FIG. 1A is a schematic top plan view of a conventional display panel.

FIG. 1B is a partial side cross-sectional view of the LED module of FIG. 1A .

Figure 1C is a partially enlarged cross-sectional schematic view of Figure 1B.

Figure 1D is a schematic diagram of the three-dimensional appearance of Figure 1C.

2A to 2B are partial cross-sectional schematic diagrams of the manufacturing method of the load-bearing structure of the present invention.

Figure 3A is a schematic three-dimensional appearance diagram of Figure 2B.

FIG. 3B is a schematic three-dimensional view of another embodiment of FIG. 3A .

Figure 4 is a schematic cross-sectional view of the electronic module of the present invention.

The following describes the implementation of the present invention through specific embodiments. Those familiar with the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification.

It should be noted that the structures, proportions, sizes, etc. shown in the drawings attached to this specification are only used to coordinate with the content disclosed in the specification for the understanding and reading of those familiar with the art, and are not used to limit the implementation of the present invention. restrictive conditions, so it has no technical substantive significance, and any conclusion Modifications of the structure, changes in proportions, or adjustments in size should still fall within the scope of the technical content disclosed in the present invention, as long as they do not affect the effects that the present invention can produce and the purposes that can be achieved. At the same time, terms such as "above", "first", "second" and "a" cited in this specification are only for convenience of description and are not used to limit the scope of the present invention. Changes or adjustments in their relative relationships, provided there is no substantial change in the technical content, shall also be deemed to be within the scope of the present invention.

2A to 2B are partial cross-sectional schematic diagrams of the manufacturing method of the load-bearing structure 2 of the present invention.

As shown in Figure 2A, a plate body 20 is provided first, which has a first surface 20a and a second surface 20b that are opposite to each other and a side surface 20c adjacent to the first surface 20a and the second surface 20b. The first conductor 21a is provided on the first surface 20a, and the second conductor 21b is provided on the second surface 20b of the plate body 20.

As shown in FIG. 2B , a wiring process is then performed to connect at least one conductor 22 with one end 22 a of the first conductor 21 a and across the side 20 c and with the other end 22 b of the conductor 22 connected to the second conductor 21 b . The wire 22 is electrically connected to the first conductor 21a and the second conductor 21b.

In this embodiment, the plate body 20 is a glass plate, and spans a plurality of mutually separated wires 22 on a single side 20c, as shown in FIG. 3A. Furthermore, a recess 300 corresponding to the conductor 22 can be formed on the side 20c of the plate body 20 as required, in the shape of a linear groove connecting the first surface 20a and the second surface 20b as shown in FIG. 3B, and then through The wires 22 are accommodated in the recess 300 by bonding to avoid the problem of short circuit caused by the wires 22 on the same side 20c contacting each other.

Furthermore, the conductor 22 is made of conductive materials such as gold (Au), silver (Ag), copper (Cu), aluminum (Al), or alloys of the above materials as the wire body material, and is formed by wire bonding. The line segment 22c of the conductor 22 at the side 20c is generally suspended and does not contact the side 20c of the plate 20, as shown in Figures 2B and 3A, nor does it contact the wall of the recess 300, as shown in Figure 3B. For example, during the bonding process, the ends 22a and 22b of the wire 22 are bonded to the first conductor 21a and the second conductor 21b using heat, pressure, ultrasonic waves, thermosonic waves, or the above-mentioned mixed methods.

In addition, the first conductor 21a is a patterned metal conductive layer, which has a plurality of contacts 210, as shown in FIG. 3A, for fixing the end 22a of the conductor 22. It should be understood that the second conductor 21b can also be a patterned metal conductive layer, which also has a plurality of contacts 210 that can be fixedly connected to the end 22b of the conductor 22.

In addition, in subsequent applications, as shown in FIG. 4 , at least one electronic component 40 can be disposed on the first surface 20 a of the board 20 and electrically connected to the first conductor 21 a to form the electronic module 4 . For example, the electronic component 40 is a light-emitting chip such as a light-emitting diode (LED).

Therefore, the manufacturing method of the present invention uses a wire bonding process to replace the conventional patterned plating process to avoid the problems caused by the yellow light exposure process, and the ends 22a, 22b of the wire 22 are contact-bonded to the first conductor 21a With the second conductor 21b, the area of the intersection B between the conductor 22 and each conductor can be reduced (as shown in FIG. 2B or FIG. 3A, the area of the intersection B is much smaller than the area of the contact 210), thus effectively reducing the Contact resistance.

Furthermore, the wire body parameters of the wire bonding process can be adjusted according to needs to facilitate the production of the required thin circuit specifications of the conductor 22 .

In addition, through the design of the recess 300, the conductors 22 can be aligned during the wiring process, so that the conductors 22 can be arranged according to the predetermined position without being offset, so that the conductors 22 can be effectively connected to each other. They are separated without contacting each other, thereby effectively avoiding the problem of short circuit between the conductors 22 .

The invention further provides an electronic module 4, which includes: a load-bearing structure 2 and at least one electronic component 40, wherein the load-bearing structure 2 includes a plate body 20, a first conductor 21a, a second conductor 21b and at least one wire. twenty two.

The plate body 20 is a glass plate, which has a first surface 20a and a second surface 20b that are opposite to each other and a side surface 20c adjacent to the first surface 20a and the second surface 20b.

In one embodiment, the side surface 20c of the board 20 has a recess 300 corresponding to the wire 22.

The first conductor 21a is provided on the first surface 20a of the plate body 20.

The second conductor 21b is provided on the second surface 20b of the plate body 20.

The conductor 22 is a metal wire, and its one end 22a is connected to the first conductor 21a and crosses the side 21c, and its other end 22b is connected to the second conductor 21b, so that the conductor 22 is electrically connected to the second conductor 21b. The first conductor 21a and the second conductor 21b, wherein the conductor 22 is separated from the side surface 20c of the plate body 20.

The electronic component 40 is a light-emitting chip, which is disposed on the first surface 20a of the board 20 and is electrically connected to the first conductor 21a.

To sum up, the electronic module and its load-bearing structure and manufacturing method of the present invention use a wire bonding process to replace the conventional patterned plating process to avoid the problems caused by the yellow light exposure process, and the ends of the wires are The partial contact combination of the first conductor and the second conductor can reduce the area of the intersection between the conductor and each conductor, thereby effectively reducing the contact resistance.

The above embodiments are used to illustrate the principles and effects of the present invention, but are not intended to limit the present invention. Anyone skilled in the art can make modifications to the above embodiments without departing from the spirit and scope of the invention. Therefore, the scope of rights protection of the present invention should be as listed in the patent application scope described below.

2: Load-bearing structure

20:Plate body

20a: First surface

20b: Second surface

20c: side

21a: First conductor

21b: Second conductor

210:Contact

22:Wire

22a,22b: end

22c: line segment

B: handover

Claims (10)

A load-bearing structure includes: a plate body having opposite first and second surfaces and side surfaces adjacent to the first and second surfaces; a first conductor is provided on the first surface of the plate body ; The second conductor is provided on the second surface of the plate; and at least one conductor is connected to the first conductor at one end and across the side, and is connected to the second conductor at the other end, so that The wire is electrically connected to the first conductor and the second conductor, and the line segment of the wire at the side of the board is suspended, so that the wire is separated from the side of the board without contact. The load-bearing structure as claimed in claim 1, wherein the plate system is a glass plate. The load-bearing structure as claimed in claim 1, wherein the side surface of the plate body has a recess corresponding to the conductor. The load-bearing structure of claim 1, wherein the conductor is a wire made of gold, silver, copper, aluminum, or an alloy of the above materials. A method for manufacturing a load-bearing structure includes: providing a plate body with opposite first and second surfaces and side surfaces adjacent to the first and second surfaces, and having on the first surface of the plate body a first conductor having a second conductor on the second surface of the board; and performing a wiring process so that at least one conductor is connected to the first conductor with one end and across the side to be connected with the other end The second conductor enables the conductor to electrically connect the first conductor and the second conductor, and separates the conductor from the side surface of the plate body. The method for manufacturing a load-bearing structure as described in claim 5, wherein the plate system is a glass plate. The method for manufacturing a load-bearing structure as claimed in claim 5, wherein the side surface of the plate body has a recess corresponding to the conductor. The method of manufacturing a load-bearing structure as described in claim 5, wherein the conductor is a wire made of gold, silver, copper, aluminum, or an alloy of the above materials. An electronic module includes: a load-bearing structure as described in any one of claims 1 to 4; and an electronic component, which is provided on the first surface of the board and electrically connected to the first conductor. The electronic module according to claim 9, wherein the electronic component is a light-emitting chip.

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