CN114927056B

CN114927056B - display device

Info

Publication number: CN114927056B
Application number: CN202210580162.1A
Authority: CN
Inventors: 郑财; 黄沅江
Original assignee: Kunshan Govisionox Optoelectronics Co Ltd
Current assignee: Kunshan Govisionox Optoelectronics Co Ltd
Priority date: 2022-05-26
Filing date: 2022-05-26
Publication date: 2023-11-10
Anticipated expiration: 2042-05-26
Also published as: CN114927056A

Abstract

The application discloses a display device, which comprises a display module, a display module and a display module, wherein the display module comprises a flexible display substrate; the flexible circuit board is arranged on one side away from the light-emitting surface of the display module; the bending part is connected to the flexible display substrate and the flexible circuit board, and comprises a bearing layer and a signal wire arranged on one side of the bearing layer, wherein the signal wire comprises at least two mutually insulated sub-wire parts in the width direction of the signal wire, and at least part of the sub-wire parts have a height difference in the direction perpendicular to the plane where the bearing layer is arranged. The display device provided by the embodiment of the application can improve the flexibility and bending resistance of the bending part, so that the bending radius of the bending part is further reduced, and the frame width of the display device is reduced.

Description

Display device

Technical Field

The application belongs to the technical field of electronic products, and particularly relates to a display device.

Background

With the improvement of the user experience of the display device, the comprehensive screen, the high screen duty ratio and the narrow frame become the main development direction of the display device. Advanced electronic products, particularly portable electronic products, are increasingly moving toward narrow bezel designs.

In order to realize the narrow frame design of a small-size display device and realize the larger screen occupation ratio of the display device, the industry tries to reduce the lower frame area, and aiming at reducing the lower frame, the most effective method is a bending technology, namely, a part of the screen is fanned out, a wiring area, a driving IC and a flexible circuit board FPC are bent to the back of the screen together for binding, so that the length of the lower frame area can be effectively reduced.

The bending radius of the signal wiring of the bending area is too large, so that the frame width of the display device is too large, and the narrow frame of the display device is not facilitated to be realized.

Therefore, a new display device is needed.

Disclosure of Invention

The embodiment of the application provides a display device, which can improve the flexibility and bending resistance of a bending part, so that the bending radius of the bending part is further reduced, and the frame width of the display device is reduced.

In one aspect, an embodiment of the present application provides a display device, including: the display module comprises a flexible display substrate; the flexible circuit board is arranged on one side away from the light-emitting surface of the display module; the flexible display device comprises a flexible display substrate and a flexible circuit board, wherein the flexible display substrate is arranged on the flexible display substrate, the flexible display substrate is connected with the flexible circuit board, the flexible display substrate comprises a bearing layer and signal wiring arranged on one side of the bearing layer, the signal wiring comprises at least two mutually insulated sub-wiring parts in the width direction of the signal wiring, and in the direction perpendicular to the plane where the bearing layer is arranged, at least part of the sub-wiring parts are provided with height differences.

According to one aspect of the application, the bearing layer further comprises a cover plate, the bearing layer comprises a step-shaped groove body, the groove body comprises a side face and a step face which are connected, and each sub-wiring is respectively arranged on different step faces.

According to one aspect of the present application, in a direction perpendicular to a plane in which the carrying layer is located, the groove body includes a step surface symmetrically distributed about a center line of the groove body, and each of the sub-routing portions is symmetrically disposed on the step surface.

According to one aspect of the application, two signal wires are arranged on one groove body, and each sub-wire of the two signal wires is respectively arranged on the step surfaces symmetrically distributed about the central line of the groove body; or, the bearing layer is provided with a plurality of groove bodies, and the signals transmitted by the signal wires in different groove bodies are different.

According to one aspect of the application, the groove body has at least three step surfaces in a direction perpendicular to a plane in which the bearing layer is located, and a height difference between the step surfaces is equal.

According to one aspect of the application, the bearing layer comprises a top surface formed between adjacent groove bodies and a bottom surface positioned at the bottom of the groove body, at least two sub-wiring parts are arranged on the top surface and the bottom surface, and the distance between the adjacent sub-wiring parts is larger than or equal to a preset distance on the top surface and the bottom surface.

According to one aspect of the application, the preset distance is 0.1 μm to 1 μm.

According to one aspect of the present application, the semiconductor device further includes an insulating protection layer, wherein the insulating protection layer covers a portion of the carrier layer exposed by a surface of each of the sub-trace portions facing away from the carrier layer and a space between the sub-trace portions.

According to one aspect of the application, the insulating protection layer is filled in the groove body so that a flat plane is formed on one side of the insulating protection layer, which is away from the bearing layer.

According to one aspect of the present application, the insulating protective layer comprises at least one of silicon nitride, silicon oxide, silicon oxynitride.

Compared with the prior art, the display device provided by the embodiment of the application comprises the flexible display substrate, the flexible circuit board and the bending part, wherein the bending part is connected with the flexible display substrate and the flexible circuit board and comprises the bearing layer and the signal wiring arranged on one side of the bearing layer, the signal wiring comprises at least two mutually insulated sub-wiring parts in the width direction of the signal wiring, the signal wiring is divided into the mutually insulated sub-wiring parts, in the direction perpendicular to the plane of the bearing layer, at least part of the sub-wiring parts are provided with height differences, the sub-wiring parts cannot interfere or contact with each other, the interaction of the sub-wiring parts during bending can be avoided, the bending stress of the sub-wiring parts during bending is reduced, the difficulty of bending the signal wiring is reduced, the flexibility and the bending resistance of the bending part are improved, the bending radius of the bending part can be reduced, and the frame width of the display device is reduced.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are needed in the embodiments of the present application will be briefly described below, and it is obvious that the drawings described below are only some embodiments of the present application, and other drawings may be obtained according to these drawings without inventive effort to a person of ordinary skill in the art.

Fig. 1 is a schematic structural diagram of a display device according to an embodiment of the present application;

FIG. 2 is a schematic illustration of bending a bending portion according to an embodiment of the present application;

FIG. 3 is a cross-sectional view of a bend provided by one embodiment at C-C in FIG. 1;

FIG. 4 is a cross-sectional view of a bend provided by another embodiment at C-C in FIG. 1;

FIG. 5 is a flowchart of a manufacturing process of a bending portion according to an embodiment of the present application;

fig. 6a-6c are schematic structural diagrams illustrating steps in a manufacturing process of a bending portion according to an embodiment of the present application.

In the accompanying drawings:

100-a display device; 1-a flexible display substrate; 2-a flexible circuit board; 3-bending part; 31-a carrier layer; 311-side; 312-step surface; 32-signal wiring; 321-a sub-wiring part; 33-an insulating protective layer;

k-groove body; x-width direction; y-thickness direction.

Detailed Description

Features and exemplary embodiments of various aspects of the present application will be described in detail below, and in order to make the objects, technical solutions and advantages of the present application more apparent, the present application will be described in further detail below with reference to the accompanying drawings and the detailed embodiments. It should be understood that the specific embodiments described herein are merely configured to illustrate the application and are not configured to limit the application. It will be apparent to one skilled in the art that the present application may be practiced without some of these specific details. The following description of the embodiments is merely intended to provide a better understanding of the application by showing examples of the application.

It is noted that relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising … …" does not exclude the presence of other like elements in a process, method, article or apparatus that comprises the element.

It will be understood that when a layer, an area, or a structure is described as being "on" or "over" another layer, another area, it can be referred to as being directly on the other layer, another area, or another layer or area can be included between the layer and the other layer, another area. And if the component is turned over, that layer, one region, will be "under" or "beneath" the other layer, another region.

It will be apparent to those skilled in the art that various modifications and variations can be made in the present application without departing from the spirit or scope of the application. Accordingly, it is intended that the present application covers the modifications and variations of this application provided they come within the scope of the appended claims (the claims) and their equivalents. The embodiments provided by the embodiments of the present application may be combined with each other without contradiction.

Embodiments of the present application provide a display device, and embodiments of the display device 100 will be described below with reference to fig. 1 to 6.

Referring to fig. 1 to 3, a display device 100 provided in an embodiment of the application includes a display module, a flexible circuit board 2 and a bending portion 3, wherein the display module includes a flexible display substrate 1, the flexible circuit board 2 is disposed on a side facing away from a light emitting surface of the display module, the bending portion 3 is connected to the flexible display substrate 1 and the flexible circuit board 2, the bending portion 3 includes a carrier layer 31 and a signal trace 32 disposed on a side of the carrier layer 31, the signal trace 32 includes at least two mutually insulated sub-trace portions 321 along a width direction X of the signal trace 32, and at least a portion of the sub-trace portions 321 have a height difference along a direction perpendicular to a plane on which the carrier layer 31 is disposed.

The display device 100 provided by the embodiment of the application comprises a flexible display substrate 1, a flexible circuit board 2 and a bending part 3, wherein the bending part 3 is connected with the flexible display substrate 1 and the flexible circuit board 2, the bending part 3 comprises a bearing layer 31 and a signal wire 32 arranged on one side of the bearing layer 31, the signal wire 32 comprises at least two mutually insulated sub-wire parts 321 along the width direction X of the signal wire 32, the signal wire 32 is divided into a plurality of mutually insulated sub-wire parts 321, and at least part of the sub-wire parts 321 have a height difference along the direction perpendicular to the plane of the bearing layer 31, namely, the thickness direction Y, so that the sub-wire parts 321 can not interfere with or contact with each other, the interaction of the sub-wire parts 321 during bending can be avoided, the bending stress of the sub-wire parts 321 during bending can be reduced, the bending stress of the signal wire 32 can be reduced, the flexibility and bending resistance of the bending part 3 can be improved, and the radius of the bending part 3 can be reduced, and the frame width of the display device 100 can be reduced.

Alternatively, the bending portion 3 may be integrally formed with the flexible display substrate 1, and the flexible display substrate 1 may be made of a bending-resistant material such as PI (Polyimide), PA (Polyamide), PET (Polyethylene terephthalate ), PVA (polyvinyl alcohol, polyvinyl alcohol), PEEK (Poly ether ether ketone ), or PC (Polycarbonate) so as to form the bending portion 3. In addition, the flexible circuit board 2 is a highly reliable flexible printed circuit board made of polyimide or polyester film as a base material, and the flexible circuit board 2 is bent at the side of the flexible display substrate 1 facing away from the light emitting surface through the bending portion 3 to bind.

It is understood that, by providing a height difference between at least some of the sub-trace portions 321, at least some of the adjacent sub-trace portions 321 may be disposed at intervals along the thickness direction Y to achieve insulation, i.e., the projections of the sub-trace portions 321 in the plane of the carrier layer 31 may be disposed adjacently, or even partially overlap. Thus, under the condition that the projection of the signal trace 32 in the plane of the carrier layer 31 has the same size along the width direction X, the size of each sub-trace 321 along the width direction X is increased, so that the bending resistance of the bending portion 3 is further improved.

Referring to fig. 3, in some alternative embodiments, to achieve a height difference between at least part of the sub-routing portions 321, the carrier layer 31 includes a step-shaped slot K, the slot K includes a side 311 and a step surface 312 connected to each other, and each of the sub-routing portions 321 is disposed on a different step surface 312. By providing the groove body K on the bearing layer 31, the thickness of the bearing layer 31 is reduced, and the flexibility of the bending part 3 is further improved. In order to facilitate the interval arrangement of the sub-wiring portions 321, the groove K is arranged to be stepped and has the side 311 and the step surface 312 connected with each other, and by respectively arranging the sub-wiring portions 321 on different step surfaces 312, the interval arrangement of the sub-wiring portions 321 and the height difference can be ensured.

Optionally, the plane of the side surface 311 is perpendicular to the plane of the step surface 312, and when the signal trace 32 is evaporated on one side of the carrier layer 31 through the mask, each sub-trace portion 321 can be respectively evaporated on different step surfaces 312, so as to form a plurality of sub-trace portions 321 with height differences, and simplify the preparation process of the signal trace 32. It should be noted that, when the plane of the side surface 311 is perpendicular to the plane of the step surface 312, the distance between the adjacent step surfaces 312 along the thickness direction Y needs to be greater than the dimension of the sub-trace portions 321 along the thickness direction Y, so as to ensure that the sub-trace portions 321 are mutually insulated.

It can be understood that when the slot depth of the slot K is limited, so that the number of the step surfaces 312 is smaller than that of the sub-wiring portions 321, the sub-wiring portions 321 may be disposed on the same step surface 312, which can satisfy the requirement that the sub-wiring portions 321 are mutually insulated.

Referring to fig. 3, in some alternative embodiments, in a direction perpendicular to the plane of the carrier layer 31, the slot K includes a step surface 312 symmetrically distributed about a center line of the slot K, and each sub-trace 321 is symmetrically disposed on the step surface 312. When the step-shaped groove body K is formed on the bearing layer 31, the groove body K is symmetrically distributed along the center line of the groove body K, and a plurality of sub-wiring portions 321 are symmetrically arranged in the groove body K, so that the bending stability of the bending portion 3 is ensured.

A plurality of signal traces 32 are disposed at intervals along the width direction X of the carrier layer 31, and each signal trace 32 transmits a different signal. In order to equalize the bending radius of each signal trace 32, the sub-trace portions 321 of each signal trace 32 may be correspondingly disposed at the same height, so as to ensure the bending resistance of the whole signal trace 32.

Referring to fig. 3, in some alternative embodiments, two signal traces 32 are disposed in one slot K, and each sub-trace portion 321 of the two signal traces 32 is disposed on a step surface 312 symmetrically distributed about a center line of the slot K. Through set up two signal wires 32 in a cell body K symmetry, can guarantee that the sub-wire portion 321 that each signal wire 32 corresponds all translates or the symmetry sets up to guaranteed that the sub-wire portion 321 of each signal wire 32 corresponds to set up in same high department, in order to guarantee the holistic bending resistance of signal wire 32.

In alternative embodiments, the carrier layer 31 is provided with a plurality of slots K, and the signal traces 32 located in different slots K transmit different signals. When the depth of the groove body K is limited, so that the number of the step surfaces 312 on one side of the groove body K is smaller than the number of the sub-wiring portions 321, one signal wiring 32 can be arranged on one groove body K, and the sub-wiring portions 321 corresponding to the signal wiring 32 can be ensured to be horizontally arranged by making the structures of the groove bodies K identical, so that the sub-wiring portions 321 of the signal wiring 32 are ensured to be correspondingly arranged at the same height, and the integral bending resistance of the signal wiring 32 is ensured.

It can be understood that the signals transmitted by the sub-wire sections 321 of the same signal wire 32 are the same, so that when any sub-wire section 321 of the signal wire 32 on one side in the slot K breaks, the other sub-wire sections 321 can normally switch on signals, thereby ensuring the normal signal transmission of the signal wire 32.

In some alternative embodiments, the channel K has at least three step surfaces 312 in a direction perpendicular to the plane of the carrier layer 31, the height difference between the step surfaces 312 being equal. It can be appreciated that by increasing the number of step surfaces 312, the number of sub-trace portions 321 to which the single signal trace 32 can be divided can be increased, thereby improving the flexibility and bending resistance of the bending portion 3. In addition, the height difference between the step surfaces 312 can be reduced on the premise of meeting the requirement that the sub-routing portions 321 arranged on the step surfaces 312 are mutually insulated, so that the number of the step surfaces 312 is increased under the condition that the opening depth of the groove body K is fixed, and the number of the sub-routing portions 321 which can be separately arranged on the single signal routing 32 is further increased, so that the flexibility and bending resistance of the bending portion 3 are improved.

Referring to fig. 3, in some alternative embodiments, the carrier layer 31 includes a top surface formed between adjacent grooves K and a bottom surface at the bottom of the grooves K, at least two sub-routing portions 321 are disposed on the top surface and the bottom surface, and a distance between the adjacent sub-routing portions 321 is greater than or equal to a predetermined distance on the top surface and the bottom surface. When the adjacent sub-wiring portions 321 are all disposed on the top surface between the adjacent grooves K, or the adjacent sub-wiring portions 321 are all disposed on the bottom surface of the bottom of the grooves K, in order to ensure that the sub-wiring portions 321 are mutually insulated, the distance between the adjacent sub-wiring portions 321 on the top surface and the bottom surface is greater than or equal to the preset distance, so as to prevent short circuits between the signal wirings 32.

Optionally, the preset distance is 0.1 μm to 1 μm, so as to shorten the dimension of the carrier layer 31 along the width direction X and improve the flexibility of the bending portion 3 on the premise of preventing short circuits between the signal traces 32.

In some alternative embodiments, the display device 100 further includes an insulating protection layer 33, where the insulating protection layer 33 covers a surface of a side of each sub-trace portion 321 facing away from the carrier layer 31 and a portion of the carrier layer 31 exposed by a space between each sub-trace portion 321. By arranging the insulating protection layer 33 on the side of the signal trace 32 away from the carrier layer 31, the sub-trace portions 321 are prevented from being exposed to the external environment, so as to protect the signal trace 32.

Referring to fig. 3, in some alternative embodiments, the insulating protection layer 33 is filled in the trench K so that a flat surface is formed on a side of the insulating protection layer 33 facing away from the carrier layer 31. By setting the insulating protection layer 33 to a flat surface, the preparation of the insulating protection layer 33 is facilitated, and the flatness of the whole of the bent portion 3 is ensured.

Referring to fig. 4, in alternative embodiments, the insulating protection layer 33 at least partially fills the trench K and forms an arc surface. By setting the position of the insulating protection layer 33 corresponding to the groove body K as an arc-shaped surface, it reduces the thickness of at least a part of the area of the insulating protection layer 33, so as to facilitate the bending of the bending portion 3 while protecting the signal wiring 33 by the insulating protection layer 33, thereby further improving the flexibility of the bending portion 3.

Optionally, the insulating protection layer 33 includes at least one of silicon nitride, silicon oxide, silicon oxynitride.

Referring to fig. 5 and 6, an embodiment of the present application further provides a method for manufacturing the bending portion 3, including:

s110, providing a bearing layer 31, and forming a plurality of step-shaped grooves K on one side surface of the bearing layer 31.

Referring to fig. 6a, a photoresist may be coated on one side surface of the carrier layer 31 in a layered manner, and etched layer by layer to form a stepped groove K, or etched region by region to form stepped grooves K with different depths, and the specific preparation method is not limited herein.

S120, a plurality of sub-routing portions 321 are formed on the top surface between adjacent grooves K, the step surface 312 of the groove K, and the bottom surface of the groove K.

Referring to fig. 6b, the signal traces 32 may be formed by vapor deposition on the surface of the side of the carrier layer 31 where the grooves K are disposed through a mask plate, so that the sub-trace portions 321 of each signal trace 32 are formed on the top surface between adjacent grooves K, on each step surface 312 of the groove K, and on the bottom surface of the groove K. The distance between adjacent sub-routing portions 321 may be greater than or equal to a predetermined distance by adjusting the opening distance of the mask plate so that the distance between adjacent sub-routing portions 321 is greater than or equal to the predetermined distance on the top surface between adjacent slot bodies K and on the bottom surface of the slot body K.

At least, the insulating protection layer 33 is formed on the side surface of the sub-trace portions 321 facing away from the carrier layer 31 and the exposed portion of the carrier layer 31 at intervals between the sub-trace portions 321.

Referring to fig. 6c, an insulating protection layer 33 is applied on the entire surface of the signal trace 32 facing away from the carrier layer 31, and the insulating protection layer 33 at least covers a portion of the carrier layer 31 exposed by the space between the side surface of the sub-trace portions 321 facing away from the carrier layer 31 and the side surface of the sub-trace portions 321 to protect the signal trace 32.

It can be appreciated that in the bending portion 3 formed by the above-mentioned manufacturing method, since the signal trace 32 is divided into the plurality of sub-trace portions 321 insulated from each other, the difficulty of bending the signal trace 32 can be reduced, and the flexibility of the bending portion 3 can be improved. Meanwhile, in the direction along the plane perpendicular to the carrying layer 31, at least part of the sub-wire parts 321 have a height difference, so that the bending radius of at least part of the sub-wire parts 321 is increased, and as the signals transmitted by the sub-wire parts 321 of the signal wire 32 are the same, when the sub-wire parts 321 with smaller bending radius are broken, other sub-wire parts 321 with larger bending radius can normally transmit signals, so that the bending resistance of the bending part 3 is improved, the limit bending radius which can be born by the bending part 3 is further reduced, and the frame width of the display device 100 is reduced.

The display device 100 provided by the embodiment of the application can be applied to a mobile phone, and can also be any electronic product with a display function, including but not limited to the following categories: television, notebook computer, desktop display, tablet computer, digital camera, smart bracelet, smart glasses, vehicle-mounted display, medical equipment, industrial control equipment, touch interactive terminal, etc., which are not particularly limited in this embodiment of the application.

In the foregoing, only the specific embodiments of the present application are described, and it will be clearly understood by those skilled in the art that, for convenience and brevity of description, the specific working processes of the systems, modules and units described above may refer to the corresponding processes in the foregoing method embodiments, which are not repeated herein. It should be understood that the scope of the present application is not limited thereto, and any equivalent modifications or substitutions can be easily made by those skilled in the art within the technical scope of the present application, and they should be included in the scope of the present application.

It should also be noted that the exemplary embodiments mentioned in this disclosure describe some methods or systems based on a series of steps or devices. However, the present application is not limited to the order of the above-described steps, that is, the steps may be performed in the order mentioned in the embodiments, or may be performed in a different order from the order in the embodiments, or several steps may be performed simultaneously.

Claims

1. A display device, comprising:

the display module comprises a flexible display substrate;

the flexible circuit board is arranged on one side away from the light-emitting surface of the display module;

the bending part is connected to the flexible display substrate and the flexible circuit board, the bending part comprises a bearing layer and a signal wiring arranged on one side of the bearing layer, the signal wiring comprises at least two mutually insulated sub-wiring parts in the width direction of the signal wiring, at least part of the sub-wiring parts are provided with height differences in the direction perpendicular to the plane where the bearing layer is arranged, the bearing layer comprises a groove body with a step shape, the groove body comprises a side face and a step face, which are connected, and each sub-wiring part is respectively arranged on different step faces.

2. The display device according to claim 1, wherein the groove body includes a step surface symmetrically distributed about a center line of the groove body in a direction perpendicular to a plane in which the carrying layer is located, and each of the sub-wiring portions is symmetrically disposed on the step surface.

3. The display device according to claim 1, wherein two signal wires are provided in one of the groove bodies, and each of the sub wires of the two signal wires is provided on the step surface symmetrically distributed with respect to a center line of the groove body; or alternatively, the first and second heat exchangers may be,

the bearing layer is provided with a plurality of groove bodies, and signals transmitted by the signal wiring lines in different groove bodies are different.

4. The display device according to claim 1, wherein the groove body has at least three step surfaces in a direction perpendicular to a plane in which the carrying layer is located, and a height difference between the step surfaces is equal.

5. The display device according to claim 4, wherein the carrier layer includes a top surface formed between adjacent ones of the grooves and a bottom surface located at a bottom of the groove, at least two of the sub-wiring portions are provided on each of the top surface and the bottom surface, and a distance between the adjacent sub-wiring portions is greater than or equal to a preset distance on the top surface and the bottom surface.

6. The display device according to claim 5, wherein the preset distance is 0.1 μm to 1 μm.

7. The display device according to claim 1, further comprising an insulating protection layer covering a portion of the carrier layer exposed by a side surface of each of the sub-wiring portions facing away from the carrier layer and a space between each of the sub-wiring portions.

8. The display device of claim 7, wherein the insulating protective layer is filled in the groove body so that a side of the insulating protective layer facing away from the carrier layer forms a flat plane.

9. The display device according to claim 7, wherein the insulating protective layer comprises at least one of silicon nitride, silicon oxide, and silicon oxynitride.